CN116766641A - Ultrasonic transducer acoustic matching layer and ultrasonic transducer manufacturing method - Google Patents
Ultrasonic transducer acoustic matching layer and ultrasonic transducer manufacturing method Download PDFInfo
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- CN116766641A CN116766641A CN202310900895.3A CN202310900895A CN116766641A CN 116766641 A CN116766641 A CN 116766641A CN 202310900895 A CN202310900895 A CN 202310900895A CN 116766641 A CN116766641 A CN 116766641A
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- matching layer
- acoustic matching
- ultrasonic transducer
- phenolic resin
- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000004005 microsphere Substances 0.000 claims description 73
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 50
- 239000005011 phenolic resin Substances 0.000 claims description 50
- 229920001568 phenolic resin Polymers 0.000 claims description 50
- 239000000463 material Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 19
- 229920006335 epoxy glue Polymers 0.000 claims description 17
- 238000003756 stirring Methods 0.000 claims description 14
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 238000012360 testing method Methods 0.000 claims description 13
- 239000011159 matrix material Substances 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000012634 fragment Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 238000004458 analytical method Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000012153 distilled water Substances 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 230000004927 fusion Effects 0.000 claims description 3
- 238000004626 scanning electron microscopy Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000002244 precipitate Substances 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000005007 epoxy-phenolic resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2061/00—Use of condensation polymers of aldehydes or ketones or derivatives thereof, as moulding material
- B29K2061/04—Phenoplasts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
Abstract
The application relates to the technical field of ultrasonic transducers, in particular to an ultrasonic transducer acoustic matching layer and an ultrasonic transducer manufacturing method.
Description
Technical Field
The application relates to the technical field of ultrasonic transducers, in particular to an ultrasonic transducer acoustic matching layer and an ultrasonic transducer manufacturing method.
Background
The ultrasonic gas meter is a new gas flow measuring tool, the gas meter module is a core element for executing flow measuring function, and mainly comprises a runner, a pair of ultrasonic transducers and related test circuits. The ultrasonic transducer is an important component for receiving and transmitting sound waves of an ultrasonic gas meter, under the natural gas environment, the sound waves have scattering attenuation and transmission attenuation in a flow channel, and if the receiving and transmitting sensitivity of the transducer is low, the problem of excessively low amplitude or waveform distortion of received sound signals exists. In addition, the bandwidth characteristics of the transducer also affect the tail length of the received signal, with the wider the bandwidth, the smaller the tail of the signal.
Disclosure of Invention
Aiming at the defects existing in the prior art, the application aims to provide an ultrasonic transducer acoustic matching layer and a manufacturing method of an ultrasonic transducer, which can effectively improve the receiving and transmitting sensitivity of a pair of transducers and increase the bandwidth of the transducers.
In order to achieve the above purpose, the present application provides the following technical solutions: a method for manufacturing an acoustic matching layer of an ultrasonic transducer comprises the following steps:
(1) Taking a proper amount of phenolic resin microsphere material and carrying out pretreatment: removing broken phenolic resin microsphere fragments;
(2) Preparing epoxy glue solution: the prepared epoxy glue solution should be kept in a diluted state at normal temperature;
(3) Premixing materials: heating the epoxy glue solution, mixing phenolic resin microspheres into the heated epoxy glue solution, and stirring;
(4) Mixing and defoaming: putting the premixed material into a vacuum stirrer, and carrying out vacuumizing treatment while stirring:
(5) And (3) material curing: placing the mixed and defoamed material into a baking oven, adjusting the temperature of the baking oven, and carrying out temperature sectional solidification;
(6) Cutting the solidified material into slices with preset thickness, and testing the density and sound velocity;
(7) And carrying out electron microscope scanning SEM analysis on the sliced material, and obtaining a slice with uniform microsphere distribution and good microsphere particle integrity and epoxy resin matrix fusion from the section analysis of the matching layer as a qualified acoustic matching layer.
In some embodiments, according to step (1), the phenolic resin microspheres are immersed in distilled water, stirred uniformly, allowed to stand sufficiently, broken phenolic resin microsphere fragments are precipitated, and then the complete phenolic resin microspheres are fished out by a filter screen and dried.
In which it is arrangedIn some embodiments, according to step (3), the phenolic resin microspheres have a bulk density of 0.08 to 0.09g/cm 3 The true density is 0.28-0.30g/cm 3 。
In some of these embodiments, the volume ratio of phenolic resin microspheres to epoxy glue solution is 1.5: 1-2: 1.
In some of these embodiments, according to step (4), the stirring speed of the vacuum stirrer is set to less than 650r/min.
In some embodiments, the stirring speed of the vacuum stirrer is set to be between 450 and 500r/min
In some of these embodiments, according to step (6), the cut thickness of the lamina is 1mm;
in some of these embodiments, the flakes have a test density of 0.77g/cm 3 The test sound speed is between 1820 and 1880 m/s.
In some of these embodiments, the acoustic impedance of the selected acceptable acoustic matching layer is 1.5Mrayl according to step (7).
In order to achieve the above purpose, the present application further provides the following technical solutions: the ultrasonic transducer is composed of an acoustic matching layer, a piezoelectric element and a shell, wherein the acoustic matching layer is the acoustic matching layer in any one of claims 1-5, and the acoustic matching layer is adhered to the outer side of the shell through an adhesive.
Compared with the prior art, the application has the beneficial effects that: impedance matching is carried out by adopting an acoustic matching layer structure, and the acoustic matching layer plays a role in improving the transmittance of sound waves;
the phenolic resin hollow microspheres are added into the composite material matching layer formed in the epoxy resin matrix, so that the receiving and transmitting sensitivity of the transducer can be remarkably improved, and the bandwidth of the transducer can be effectively increased.
According to the application, phenolic resin microspheres are added into an epoxy resin matrix to develop an acoustic matching layer with low density and low sound velocity, and the developed acoustic matching layer is used in an ultrasonic transducer to develop the ultrasonic transducer with high sensitivity and wider frequency band characteristics.
The details of one or more embodiments of the application are set forth in the accompanying drawings and the description below to provide a more thorough understanding of the other features, objects, and advantages of the application, and to provide a thorough description and understanding of the application in terms of the embodiments of the application.
Drawings
FIG. 1 is a scanning electron microscope SEM photograph of a hollow phenolic resin microsphere matching layer;
FIG. 2 is a waveform diagram of an ultrasonic transducer receive characteristic test;
FIG. 3 is a comparison of bandwidth of a prior art matching layer transducer and a phenolic resin microsphere transducer;
FIG. 4 is a flow chart of pretreatment of hollow microspheres of phenolic resin;
fig. 5 is a flow chart of the fabrication of an acoustic matching layer and an ultrasonic transducer.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The acoustic impedance of the piezoelectric ceramic is about 35Mrayl, while the acoustic impedance of air is about 0.0004Mrayl, which is approximately 5 orders of magnitude different, and if sound waves are emitted into the air through the piezoelectric ceramic, the sound waves are almost totally reflected on the surface of the piezoelectric ceramic due to the overlarge acoustic impedance difference. Therefore, impedance matching is generally performed by using an acoustic matching layer structure, and the acoustic matching layer plays a role of improving the transmittance of sound waves.
The phenolic resin hollow microspheres are added into the composite material matching layer formed in the epoxy resin matrix, so that the receiving and transmitting sensitivity of the transducer can be remarkably improved, and the bandwidth of the transducer can be effectively increased.
Interpretation of related terms:
acoustic impedance of material: the product of the speed of sound in the material and the density of the material.
Reception sensitivity: the lowest signal strength that the receiving transducer can receive and can function properly.
If the acoustic impedance difference between the two media is too large as the sound waves propagate from one medium to the other, this results in near total reflection of the sound waves at the interface. If the third medium is inserted into the two media, the acoustic impedance z of the third medium 3 The method meets the following conditions:
wherein z is 1 Is the acoustic impedance, z, of the first material 2 Is the acoustic impedance of the second material. The total transmission of sound waves can be realized.
If the sound wave is transmitted into the air after passing through the sound matching layer, the sound wave energy transmittance T is as follows:
wherein z is 1 Z is the acoustic impedance of the transducer 2 Is the acoustic impedance of air, z 3 Is the acoustic impedance of the acoustic matching layer, D is the thickness of the acoustic matching layer, k 3 Is the number of acoustic matching layers. Acoustic matching layer z 3 Is 1.2Mrayl, and the acoustic impedance product z of the transducer and air 1 z 2 0.014Mrayl. Thus, there isWhen the thickness of the matching layer satisfies λ/4, equation 2 can be simplified as:
in the development of the actual acoustic matching layer, it is difficult to find the acoustic matching layer material conforming to the acoustic total transmission theory, so it can be seen from equation 3 that the ultrasonic energy transmittance T and the acoustic impedance z of the acoustic matching layer 3 In inverse proportion, the lower the acoustic impedance of the acoustic matching layer, the higher the acoustic transmissivity, suggesting that we acoustic on the premise of meeting the material strengthThe lower the acoustic impedance of the matching layer, the better.
At present, the density of the material can be remarkably reduced by adding a low-density hollow microsphere material into an epoxy resin matrix, and as the filler is a hollow microsphere, sound waves are scattered when entering the hollow microsphere, so that the propagation time of the sound waves on a certain path is prolonged, and the sound velocity is reduced.
The application provides a technical scheme that: a method for manufacturing an acoustic matching layer of an ultrasonic transducer comprises the following steps:
(1) Taking a proper amount of phenolic resin microsphere material and carrying out pretreatment: removing broken phenolic resin microsphere fragments;
(2) Preparing epoxy glue solution: the prepared epoxy glue solution should be kept in a diluted state at normal temperature;
(3) Premixing materials: heating the epoxy glue solution, mixing phenolic resin microspheres into the heated epoxy glue solution, and stirring;
(4) Mixing and defoaming: placing the premixed material into a vacuum stirrer, and vacuumizing while stirring;
(5) And (3) material curing: placing the mixed and defoamed material into a baking oven, adjusting the temperature of the baking oven, and carrying out temperature sectional solidification;
(6) Cutting the solidified material into slices with preset thickness, and testing the density and sound velocity;
(7) And carrying out electron microscope scanning SEM analysis on the sliced material, and obtaining a slice with uniform microsphere distribution and good microsphere particle integrity and epoxy resin matrix fusion from the section analysis of the matching layer as a qualified acoustic matching layer.
According to the step (1), the phenolic resin microspheres have the problems of complete breakage or surface rupture of partial microspheres in the production and transportation processes, and if the microspheres are directly mixed into an epoxy-based material without treatment, the density of the composite material is easily increased, and in addition, the density and sound velocity difference of mixtures in different batches are easily caused. If the cracking proportion of the microspheres is large, the performance of the acoustic matching layer is seriously affected, so that pretreatment is needed;
according to fig. 4, the pretreatment method is as follows:
step 1: the hollow phenolic resin microspheres are put into deionized water (distilled water), and are fully stirred and then are left stand for a period of time, the density of broken microspheres is higher than that of water, the broken microspheres gradually precipitate at the bottom of a container, and the hollow phenolic resin microspheres float on the surface of the deionized water at the moment.
Step 2: the phenolic resin hollow microspheres floating on the surface of deionized water are fished out by a mesh screen, and the mesh diameter of the mesh screen is required to be smaller than the minimum particle size of the phenolic resin hollow microspheres.
And step 3: and (3) placing the phenolic resin hollow microspheres in the mesh screen into a drying box or a drying oven for drying so as to remove redundant moisture on the surfaces of the microspheres.
According to the step (2), the epoxy glue solution is kept in a thinner state at normal temperature, so that more hollow phenolic resin microsphere materials can be mixed in, and the subsequent stirring and defoaming procedures can be smoothly carried out, thereby playing a role in reducing the density of the mixed materials.
According to the step (3), the epoxy glue solution is subjected to heat treatment, so that the glue solution is kept in a thinner state. The bulk density of the phenolic resin microsphere is 0.08-0.09g/cm 3 The true density is 0.28-0.30g/cm 3 The volume ratio of the phenolic resin to the epoxy glue solution is 1.5: 1-2: 1, mixing phenolic resin microspheres into the glue solution and slowly stirring, wherein the step is premixing of materials.
According to the step (4), the spherical wall of the phenolic resin glass microsphere is thinner, so that the stirring rotation speed of the vacuum stirrer is less than 650r/min, and preferably the stirring rotation speed of the vacuum stirrer is 450-500 r/min.
According to the step (5), heating and curing are carried out on the material, in order to increase the strength of the phenolic resin glass microspheres, the temperature of an oven needs to be adjusted in a sectional mode, the temperature is cured in a sectional mode, the first section is 70 ℃ and 3h of curing, the second section is 100 ℃ and 3h of curing, and the third section is 120 ℃ and 1h of curing.
According to step (6), the cut thickness of the sheet was 1mm, and the test density of the sheet was 0.77g/cm 3 Test sound speed of 1820-1880 m/s.
According to step (7), the acoustic impedance of the selected qualified acoustic matching layer is 1.5Mrayl.
The application provides a method for manufacturing an acoustic matching layer,
1) The matching layer is developed by mixing the hollow phenolic resin microspheres with the epoxy resin matrix, so that the sensitivity of the transducer can be effectively increased, the bandwidth of the transducer can be improved, and the tailing phenomenon of the transducer can be reduced.
2) The hollow phenolic resin microsphere is used as a filler, so that the combination rate of the epoxy resin matrix and the microsphere surface can be effectively increased, and the microsphere and the epoxy resin matrix can be fused and contacted well without special treatment on the microsphere surface.
3) The phenolic resin hollow microspheres are pretreated, so that the breakage rate of the microspheres is reduced, and the uniformity and consistency of the epoxy phenolic resin microsphere material are improved.
According to the method, as shown in fig. 5, based on the acoustic matching layer, an ultrasonic transducer is developed, wherein the ultrasonic transducer is composed of the acoustic matching layer, a piezoelectric element and a shell, the acoustic matching layer is the acoustic matching layer according to any one of claims 1-5, and the acoustic matching layer is adhered to the outer side of the shell through an adhesive, so that the development of the transducer is completed.
The specific procedures are as follows:
step 1: the epoxy resin matrix and the phenolic resin hollow microspheres are premixed, the phenolic resin hollow microspheres are light in weight, and the phenolic resin hollow microspheres can be better mixed with the epoxy resin matrix after being premixed.
Step 2: and (3) putting the premixed materials into a vacuum stirrer for uniform mixing and deaeration, wherein the rotation speed of equipment in the uniform mixing process is set to be 500r/min, and the maximum rotation speed is not more than 650r/min.
And step 3: and (3) putting the mixed materials into an oven for heating and curing, and curing by adopting a temperature sectional curing mode to strengthen the strength of the structure.
And 4, step 4: slicing the solidified material.
And step 5: the components of the acoustic matching layer, the piezoelectric ceramic, the shell and the like are bonded by using an adhesive to develop the complete ultrasonic transducer.
Under the same test conditions, the performance of the transducer is compared with that of a transducer adopting a glass microsphere acoustic matching layer, the test results are shown in fig. 2 and 3, the ultrasonic transducer of the prior art receives waveforms, the ultrasonic transducer of the hollow phenolic resin microsphere matching layer receives waveforms, the red curve of the ultrasonic transducer adopting phenolic resin microspheres in fig. 3, the blue curve of the ultrasonic transducer adopting phenolic resin microspheres has the advantages of shorter tailing and wider bandwidth.
By the technical proposal of the application,
1. the acoustic matching layer is developed by using phenolic resin hollow microspheres, and the epoxy phenolic resin microsphere material is prepared by adopting a method of mixing the phenolic resin hollow microspheres with epoxy resin glue solution, so that the acoustic impedance of the material is reduced.
2. The phenolic resin hollow microspheres are pretreated, so that the breakage rate of the microspheres is reduced, and the uniformity and consistency of the epoxy phenolic resin microsphere material are improved.
3. The acoustic matching layer is developed by adopting the phenolic resin hollow microspheres and is used in an ultrasonic transducer, so that the receiving sensitivity of the transducer can be effectively improved, the bandwidth of the transducer is improved, and the tailing phenomenon of a received signal is reduced.
The foregoing examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the application, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The method for manufacturing the acoustic matching layer of the ultrasonic transducer is characterized by comprising the following steps of: the method comprises the following steps:
(1) Taking a proper amount of phenolic resin microsphere material and carrying out pretreatment: removing broken phenolic resin microsphere fragments;
(2) Preparing epoxy glue solution: the prepared epoxy glue solution should be kept in a diluted state at normal temperature;
(3) Premixing materials: heating the epoxy glue solution, mixing phenolic resin microspheres into the heated epoxy glue solution, and stirring;
(4) Mixing and defoaming: placing the premixed material into a vacuum stirrer, and vacuumizing while stirring;
(5) And (3) material curing: placing the mixed and defoamed material into a baking oven, adjusting the temperature of the baking oven, and carrying out temperature sectional solidification;
(6) Cutting the solidified material into slices with preset thickness, and testing the density and sound velocity;
(7) And carrying out electron microscope scanning SEM analysis on the sliced material, and obtaining a slice with uniform microsphere distribution and good microsphere particle integrity and epoxy resin matrix fusion from the section analysis of the matching layer as a qualified acoustic matching layer.
2. The method for manufacturing an acoustic matching layer of an ultrasonic transducer according to claim 1, wherein: according to the step (1), the phenolic resin microspheres are immersed in distilled water and stirred uniformly, then fully stand, broken phenolic resin microsphere fragments precipitate, and then the complete phenolic resin microspheres are fished out by a filter screen and dried.
3. The method for manufacturing an acoustic matching layer of an ultrasonic transducer according to claim 1, wherein: according to the step (3), the bulk density of the phenolic resin microspheres is 0.08-0.09g/cm 3 The true density is 0.28-0.30g/cm 3 。
4. A method of fabricating an acoustic matching layer for an ultrasonic transducer according to claim 3, wherein: the volume ratio of the phenolic resin microspheres to the epoxy glue solution is 1.5:1-2:1.
5. The method for manufacturing an acoustic matching layer of an ultrasonic transducer according to claim 1, wherein: according to the step (4), the stirring rotation speed of the vacuum stirrer is set to be less than 650r/min.
6. The method for manufacturing an acoustic matching layer of an ultrasonic transducer according to claim 5, wherein: the stirring rotation speed of the vacuum stirrer is set to be 450-500 r/min.
7. The method for manufacturing an acoustic matching layer of an ultrasonic transducer according to claim 1, wherein: according to step (6), the cut thickness of the sheet was 1mm.
8. The method for manufacturing an acoustic matching layer of an ultrasonic transducer according to claim 7, wherein: the test density of the sheet is 0.77g/cm 3 The test sound speed is between 1820 and 1880 m/s.
9. The method for manufacturing an acoustic matching layer of an ultrasonic transducer according to claim 8, wherein: according to step (7), the acoustic impedance of the selected qualified acoustic matching layer is 1.5Mrayl.
10. The ultrasonic transducer is composed of an acoustic matching layer, a piezoelectric element and a shell, and is characterized in that: the acoustic matching layer is the acoustic matching layer according to any one of claims 1 to 5, and the acoustic matching layer is adhered to the outer side of the housing through an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310900895.3A CN116766641A (en) | 2023-07-21 | 2023-07-21 | Ultrasonic transducer acoustic matching layer and ultrasonic transducer manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310900895.3A CN116766641A (en) | 2023-07-21 | 2023-07-21 | Ultrasonic transducer acoustic matching layer and ultrasonic transducer manufacturing method |
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| Publication Number | Publication Date |
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| CN116766641A true CN116766641A (en) | 2023-09-19 |
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| CN202310900895.3A Pending CN116766641A (en) | 2023-07-21 | 2023-07-21 | Ultrasonic transducer acoustic matching layer and ultrasonic transducer manufacturing method |
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| Country | Link |
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| CN (1) | CN116766641A (en) |
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- 2023-07-21 CN CN202310900895.3A patent/CN116766641A/en active Pending
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