CN116759349A - Wafer etching cleaning device - Google Patents
Wafer etching cleaning device Download PDFInfo
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- CN116759349A CN116759349A CN202311054339.5A CN202311054339A CN116759349A CN 116759349 A CN116759349 A CN 116759349A CN 202311054339 A CN202311054339 A CN 202311054339A CN 116759349 A CN116759349 A CN 116759349A
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- 238000005530 etching Methods 0.000 title claims abstract description 41
- 238000004140 cleaning Methods 0.000 title claims abstract description 34
- 230000004308 accommodation Effects 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 52
- 230000000694 effects Effects 0.000 description 15
- 238000005452 bending Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 230000013011 mating Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a wafer etching and cleaning device, which comprises: the shell is provided with a first accommodating cavity and a first opening, and the first opening is communicated with the first accommodating cavity; the transverse sliding component is arranged on the shell; the longitudinal lifting assembly is connected with the transverse sliding assembly; the shielding plate assembly is connected with the longitudinal lifting assembly and is arranged on one side close to the first opening in a sliding manner; the longitudinal lifting assembly drives the shielding plate assembly to slide along the surface of the shell, so that the shielding plate assembly shields the first opening, and the transverse sliding assembly drives the longitudinal lifting assembly to transversely slide towards the first opening, so that the shielding plate assembly is attached to the first opening. The invention improves the air tightness of the device during etching and cleaning of the wafer.
Description
Technical Field
The invention relates to the technical field of wafer etching, in particular to a wafer etching cleaning device.
Background
With the development of science and technology, various new technologies are layered endlessly, and at the present time of informatization, various semiconductor materials are more and more convenient to live, so that the optimization of the production of the semiconductor materials is also increasingly important. In the manufacture of wafers of semiconductor materials, due to the reduction of feature sizes, the influence of the particle number in the air on the quality and reliability of the processed wafers is increased when the wafers are processed, and along with the improvement of cleanliness, new data characteristics appear in the particle number, but in the prior art, the air tightness of devices during processing the wafers is poor, and better assistance cannot be provided for processing the wafers.
Disclosure of Invention
Therefore, the embodiment of the invention provides the wafer etching and cleaning device, which improves the air tightness of the device during wafer etching and cleaning.
In order to solve the above problems, the present invention provides a wafer etching cleaning apparatus, including: the shell is provided with a first accommodating cavity and a first opening, and the first opening is communicated with the first accommodating cavity; the transverse sliding component is arranged on the shell; the longitudinal lifting assembly is connected with the transverse sliding assembly; the shielding plate assembly is connected with the longitudinal lifting assembly and is arranged on one side close to the first opening in a sliding manner; the longitudinal lifting assembly drives the shielding plate assembly to slide along the surface of the shell, so that the shielding plate assembly shields the first opening, and the transverse sliding assembly drives the longitudinal lifting assembly to transversely slide towards the first opening, so that the shielding plate assembly is attached to the first opening.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: through having first opening and first chamber that holds on the setting casing, there is the shielding plate subassembly on the vertical lift subassembly simultaneously, promote the shielding plate subassembly through vertical lift subassembly, and then make the shielding plate subassembly can shelter from first opening, can not be by external influence when first chamber processing that holds, increase the gas tightness simultaneously, the vertical lift subassembly is connected to the rethread horizontal slip subassembly, make horizontal lift subassembly drive vertical lift subassembly towards first opening slip, make vertical lift subassembly be closer to first opening, and then make the shielding plate subassembly of connecting on vertical lift subassembly can be closer to first opening, on the basis of shielding first opening promptly, compress tightly first opening, make the gas tightness in the first chamber that holds obtain better promotion, can not take place the air leak into first chamber that holds when guaranteeing the wafer etching washs, lead to the wafer processing quality to the problem to lead to scrapping, and then improve the problem of cost, and through the cooperation of horizontal slip subassembly and vertical lift subassembly, make wafer etching belt cleaning device's obtain very big promotion, therefore stability guarantee during processing the wafer and gas tightness.
In one example of the present invention, the lateral sliding assembly further comprises: the first fixing piece is arranged at the bottom of the shell and is close to one side where the first opening is; the first power piece is connected with the first fixing piece; the connecting component is connected with the first power piece and the longitudinal lifting component; the first power piece drives the connecting component to transversely slide.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: through setting up first mounting and being close to one side at first opening place in the casing bottom for first mounting can not influence outside device, makes the space utilization around the casing obtain promoting in the casing bottom, and is close to first opening and also makes transverse sliding assembly more convenient and smooth when promoting vertical lifting assembly to slide, has set up first power piece simultaneously and has connected first mounting, and set up coupling assembling on first power piece, connect vertical lifting assembly through coupling assembling, and then can make first power piece drive vertical lifting assembly and slide, makes the gas tightness of wafer etching belt cleaning device promote through simple structure, the cost is reduced.
In one example of the present invention, the connection assembly further comprises: the first connecting part is connected with the first power piece; the second connecting part is connected with the first connecting part and the longitudinal lifting assembly, and is bent relative to the first connecting part.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: through setting up first connecting portion and connecting on first power spare, set up second connecting portion simultaneously and connect first connecting portion and buckle for can be better through buckling the space of utilizing the casing below, buckle simultaneously and also improved coupling assembling's bulk strength, ensure the fixed stability of horizontal slip subassembly and vertical lift subassembly, ensure that it can normally compress tightly first opening, make the gas tightness of wafer etching belt cleaning device promote, and then make the course of working of wafer more accurate.
In one example of the present invention, the longitudinal lifting assembly further comprises: the second power piece is connected with the second connecting part; the first supporting piece is arranged on one side of the second power piece, close to the first opening, and is connected with the shielding plate assembly; the second power piece drives the first supporting piece to lift towards the first opening, and then the shielding plate component lifts towards the first opening.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the second connecting portion is connected through setting up the second power spare to connect first support piece in one side that the second power spare is close to first open-ended, make the second power spare drive first support piece and go up and down, make the shielding plate subassembly of connecting on first support piece simultaneously can shelter from first opening, make the second power spare drive the shielding plate subassembly more stable when going up and down, ensure that the shielding plate subassembly can smoothly and swiftly shelter from first opening, and then ensure the first gas tightness that holds the intracavity, make the course of working of wafer safer and accurate.
In one example of the present invention, the longitudinal lifting assembly further comprises: the second connecting part and the second power piece are connected in a surface-to-surface joint mode.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: through setting up the connection mode of second connecting portion and second power spare two for face and face laminating for second connecting portion is when pulling second power spare lateral sliding, and then more stable when making the pulling, also when making the shielding plate subassembly laminating first opening of connection in second power spare top, the effect of compressing tightly is better, and then makes better to the first gas tightness guarantee that holds the intracavity, makes the wafer processing more accurate.
In one example of the present invention, the longitudinal lifting assembly further comprises: the first limiting piece is arranged on one side, close to the first supporting piece, of the second power piece; at least part of the first supporting piece is positioned right above the first limiting piece.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: through setting up first locating part to set up the at least part of first support piece and lie in first locating part directly over, make the position of shielding plate subassembly when going up and down receive the restriction, can not go up and down to influence other subassemblies, can not lead to shielding plate subassembly to damage, and then can't carry out follow-up work of sheltering from first open-ended, make the processing of wafer problematic.
In one example of the present invention, the shutter assembly further comprises: the second support piece is connected with the longitudinal lifting assembly and is provided with a matching part, and the matching part is used for matching with the first support piece so that the second support piece is fixed on the first support piece; the shielding piece is arranged on one side, close to the first opening, of the first supporting piece, and the shielding piece is also attached to the second supporting piece.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the vertical lifting component is connected through setting up the second support piece to set up cooperation portion and first support piece cooperation, make the second support piece more convenient when the installation, also more stable after the while is fixed, set up the shielding piece simultaneously and locate on the first support piece, and the shielding piece still laminating second support piece, make between shielding piece and the second support piece inseparabler, and then make the second support piece more firm when compressing tightly the shielding piece, the gas tightness is also better simultaneously, it is more stable to compress tightly the effect.
In one example of the invention, the first support is provided with an extension side, which is shielded by the second support, and the shield is provided on the extension side.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: there is the extension side through setting up first support piece, and the extension side is shielded by the second support piece, and the extension side is located to the shielding piece for the whole can be better accepted of shielding piece, also guarantees simultaneously when the shielding piece is gone up and down through first support piece that the shielding piece is more stable, can not rock, makes its first opening of shielding that can be better, and then the guarantee first good gas tightness when holding intracavity wafer processing.
In one example of the invention, the second support is provided with a first slot, the first slot receiving at least part of the first support; the matching part is arranged in the first slot and is bent relative to the second supporting piece.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: through setting up first fluting on second support to hold at least partial first support, make first support more stable when lifting second support, set up the cooperation portion simultaneously and buckle the setting for the second support, make first support more even stable when exerting force to the cooperation portion, stability when guarantee second support and shielding member go up and down, and then ensure to compress tightly good gas tightness when first opening.
In one example of the present invention, the wafer etching cleaning apparatus further includes: the annular groove is arranged around the first opening; the shielding plate assembly can completely shield the annular groove.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the annular groove is arranged in the first opening in a surrounding mode, the shielding plate assembly can completely shield the annular groove, the first opening cannot be in direct contact with the outside, the annular groove can provide the guarantee of second channel air tightness, and the two layers of guarantees enable the air tightness in the first accommodating cavity to be better.
After the technical scheme of the invention is adopted, the following technical effects can be achieved:
(1) Through having first opening and first chamber that holds on setting up the casing, have the shielding plate subassembly on the vertical lift subassembly simultaneously, promote the shielding plate subassembly through vertical lift subassembly, and then make the shielding plate subassembly can shelter from first opening, can not be by external influence when processing in first chamber that holds for the wafer, increase the gas tightness simultaneously, the vertical lift subassembly is connected through horizontal slip subassembly, make horizontal lift subassembly drive vertical lift subassembly slide towards first opening, make vertical lift subassembly be closer to first opening, and then make the shielding plate subassembly of connecting on vertical lift subassembly can be closer to first opening, namely on the basis of sheltering from first opening, compress tightly first opening, make the gas tightness in the first chamber that holds obtain better promotion, can not take place the air leak into first chamber that holds when guaranteeing the wafer etching washs, lead to the wafer processing quality to the problem to lead to the rejection, and then improve the problem of cost, and through the cooperation of horizontal slip subassembly and vertical lift subassembly, make the wafer etching belt device obtain very big promotion, therefore stability and gas tightness when processing the wafer has been ensured;
(2) The first connecting part is connected to the first power piece, and the second connecting part is connected to the first connecting part and bent, so that the space below the shell can be better utilized through bending, the integral strength of the connecting assembly is improved through bending, the fixing stability of the transverse sliding assembly and the longitudinal lifting assembly is ensured, the first opening can be normally pressed, the air tightness of the wafer etching and cleaning device is improved, and the processing process of the wafer is more precise;
(3) The first supporting piece is provided with the extension side, the extension side is shielded by the second supporting piece, and the shielding piece is arranged on the extension side, so that the whole shielding piece can be better received, meanwhile, the shielding piece is ensured to be more stable and not to shake when the shielding piece is lifted through the first supporting piece, the first opening can be better shielded, and good air tightness of the first accommodating cavity during wafer processing is further ensured; through setting up first fluting on second support to hold at least partial first support, make first support more stable when lifting second support, set up the cooperation portion simultaneously and buckle the setting for the second support, make first support more even stable when exerting force to the cooperation portion, stability when guarantee second support and shielding member go up and down, and then ensure to compress tightly good gas tightness when first opening.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings to be used in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art;
fig. 1 is a schematic structural diagram of a wafer etching cleaning device according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a partial structure of a wafer etching cleaning apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a wafer etching apparatus according to a second embodiment of the present invention;
fig. 4 is a third schematic diagram of a partial structure of a wafer etching cleaning apparatus according to an embodiment of the present invention.
Reference numerals illustrate:
100 is a wafer etching cleaning device; 110 is a housing; 111 is a first accommodation chamber; 112 is a first opening; 120 is a lateral sliding assembly; 121 is a first fixing member; 122 is a first power member; 123 is a connection assembly; 124 is a first connection portion; 125 is a second connection; 130 is a longitudinal lifting assembly; 131 is a second power element; 132 is a first support; 133 is a first limiting member; 140 is a shutter assembly; 141 is a second support; 142 is a mating portion; 143 is a shutter; 144 is the extension side; 145 is a first slot; 150 is an annular groove.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments accompanied with present invention are described in detail with embodiments of the present invention including only some but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
[ first embodiment ]
Referring to fig. 1 to 4, a wafer etching cleaning apparatus 100, the wafer etching cleaning apparatus 100 includes: a housing 110, the housing 110 being provided with a first accommodation chamber 111 and a first opening 112, the first opening 112 communicating with the first accommodation chamber 111; the transverse sliding component 120, the transverse sliding component 120 is arranged on the shell 110; a longitudinal lifting assembly 130, the longitudinal lifting assembly 130 being connected to the lateral sliding assembly 120; the shielding plate assembly 140, the shielding plate assembly 140 is connected with the longitudinal lifting assembly 130, and the shielding plate assembly 140 is slidably arranged on one side close to the first opening 112; the longitudinal lifting assembly 130 drives the shielding plate assembly 140 to slide along the surface of the housing 110, so that the shielding plate assembly 140 shields the first opening 112, and the lateral sliding assembly 120 drives the longitudinal lifting assembly 130 to slide laterally toward the first opening 112, so that the shielding plate assembly 140 is attached to the first opening 112.
Specifically, when the wafer etching cleaning device 100 is installed and used, the lateral sliding component 120 is first installed at the bottom of the housing 110, the first fixing component 121 is installed on the housing 110 through the first fixing component 121, the first fixing component 121 can be a right-angle connecting plate and is fixed below one side, close to the housing 110, of the bottom of the housing 110, where the first opening 112 is formed, through bolts, the first power component 122 is installed on the first fixing component 121, the first power component 122 can be configured as a cylinder, the extending direction of the cylinder push rod is set to be parallel to the bottom of the housing 110 and faces the direction of the first accommodating cavity 111, namely, faces the center direction of the housing 110, so that the shielding component 143 in the shielding component 140 installed on the longitudinal lifting component 130 can compress the first opening 112 when the longitudinal lifting component 130 is driven to slide later, and the stroke and path of the cylinder can be set in advance according to requirements. Specifically, the shielding member 143 may be an elastic rubber member, and the deformation of the elastic rubber is used to press the shielding member 143 against the first opening 112, so that the air tightness is improved.
Further, a connecting component 123 is connected to the sliding plate connected to the push rod of the air cylinder, the connecting component 123 can be fixed to the sliding plate of the air cylinder through bolts, the other end of the connecting component 123, namely, the second connecting portion 125 is fixedly connected to the longitudinal lifting component 130, and the second power piece 131 of the longitudinal lifting component 130 is connected to the second connecting portion 125, specifically, can be fixed through bolts.
Further, the second power member 131 may be a cylinder, and the push rod of the cylinder is set to face the first opening 112 and vertically lift. The push rod department connection at the cylinder is equipped with first support piece 132, and first support piece 132 passes through the bolt fastening on the cylinder, promotes through the cylinder push rod and goes up and down, and first support piece 132 sets up in being close to the one side that casing 110 was equipped with first opening 112, also can set up to the laminating one side that is equipped with first opening 112, specifically can set up as required.
Further, on the opposite surface of the mating surface of the first support 132 and the cylinder, a mating portion 142 is installed, the mating portion 142 and the second support 141 are integrally formed, which may be sheet metal parts, and are fixedly connected with the first support 132 by bolts, and the second support 141 shields the extension side 144 of the first support 132, so that an accommodating space is formed behind the first support 132 and the second support 141, i.e. on the side close to the surface of the first opening 112, and is used for installing the shielding member 143, so that the shielding member 143 is protected and not influenced by the outside, and the air tightness can be better ensured.
Specifically, the first power component 122 and the second power component 131 may be connected to a general control panel or a control terminal to perform unified control and input of control codes, and may be controlled through a switch, or may implement automatic control, and may be set as required.
Specifically, when the wafer etching cleaning device 100 needs to be used, the longitudinal lifting assembly 130 is started first, so that the longitudinal lifting assembly 130 drives the shielding plate assembly 140 to lift, the shielding plate assembly 140 moves along the surface of the shell 110, where the first opening 112 is provided, to completely shield the first opening 112, and then the transverse sliding assembly 120 is started, and drives the longitudinal lifting assembly 130 to slide towards the first opening 112, so that the shielding plate assembly 140 compresses the first opening 112, and sealing of the first accommodating cavity 111 can be realized, and the air tightness is improved.
Preferably, there is the first opening 112 and holds the chamber 111 through setting up on the casing 110, there is shielding plate assembly 140 on the vertical lift subassembly 130 simultaneously, promote shielding plate assembly 140 through vertical lift subassembly 130, and then make shielding plate assembly 140 can shelter from first opening 112, make the wafer can not be by external influence when first holding chamber 111 is processed, increase the gas tightness simultaneously, rethread horizontal slip subassembly 120 connects vertical lift subassembly 130, make horizontal lift subassembly drive vertical lift subassembly 130 slide towards first opening 112, make vertical lift subassembly 130 be closer to first opening 112, and then make the shielding plate assembly 140 of connection on vertical lift subassembly 130 be close to first opening 112, namely on the basis of shielding first opening 112, compress tightly first opening 112, make the gas tightness in the first holding chamber 111 obtain better promotion, can not take place the air leak into first holding chamber 111 when the wafer etching washs, lead to the wafer processing quality to the problem to appear and lead to the problem, and then improve the cost, and through horizontal slip subassembly 120 and vertical lift subassembly and the gas tightness of the etching device 100 of vertical lift subassembly 130 are processed in the guarantee that the wafer has greatly improved the stability when having processed.
Specifically, the lateral sliding assembly 120 further includes: the first fixing piece 121, the first fixing piece 121 is arranged at the bottom of the shell 110 and is close to the side where the first opening 112 is located; the first power piece 122, the first power piece 122 connects the first fixed piece 121; a connection assembly 123, the connection assembly 123 connecting the first power member 122 and the longitudinal lifting assembly 130; the first power member 122 drives the connecting assembly 123 to slide laterally.
Preferably, the first fixing member 121 is arranged at the bottom of the casing 110 and is close to the side where the first opening 112 is located, so that the first fixing member 121 does not affect an external device, the space utilization rate around the casing 110 is improved at the bottom of the casing 110, the transverse sliding assembly 120 is more convenient and smooth when the longitudinal lifting assembly 130 is caused to slide near the first opening 112, the first power member 122 is connected with the first fixing member 121, the connecting assembly 123 is arranged on the first power member 122, the longitudinal lifting assembly 130 is connected through the connecting assembly 123, the first power member 122 can drive the longitudinal lifting assembly 130 to slide, the air tightness of the wafer etching cleaning device 100 is improved through a simple structure, and the cost is reduced.
Specifically, the connection assembly 123 further includes: the first connecting portion 124, the first connecting portion 124 is connected to the first power member 122; the second connecting portion 125, the second connecting portion 125 connects the first connecting portion 124 and the longitudinal lifting assembly 130, and the second connecting portion 125 is bent with respect to the first connecting portion 124.
Preferably, the first connecting portion 124 is arranged to be connected to the first power piece 122, and the second connecting portion 125 is arranged to be connected to the first connecting portion 124 and to be bent, so that the space below the shell 110 can be better utilized through bending, the integral strength of the connecting assembly 123 is improved through bending, the stability of fixing the transverse sliding assembly 120 and the longitudinal lifting assembly 130 is guaranteed, the first opening 112 can be normally pressed, the air tightness of the wafer etching cleaning device 100 is improved, and the processing process of a wafer is more precise.
Specifically, the longitudinal lifting assembly 130 further includes: the second power member 131, the second power member 131 is connected to the second connection portion 125; the first supporting piece 132, the first supporting piece 132 is arranged on one side of the second power piece 131 close to the first opening 112, and the first supporting piece 132 is connected with the shielding plate assembly 140; the second power member 131 drives the first supporting member 132 to lift toward the first opening 112, so as to lift the shielding plate assembly 140 toward the first opening 112.
Preferably, the second power piece 131 is arranged to connect the second connecting part 125, and the first supporting piece 132 is connected to one side, close to the first opening 112, of the second power piece 131, so that the second power piece 131 can drive the first supporting piece 132 to lift, meanwhile, the shielding plate assembly 140 connected to the first supporting piece 132 can shield the first opening 112, the second power piece 131 can be more stable when driving the shielding plate assembly 140 to lift, the shielding plate assembly 140 can smoothly and rapidly shield the first opening 112, and further the air tightness in the first accommodating cavity 111 is guaranteed, so that the processing process of a wafer is safer and more precise.
Specifically, the longitudinal lifting assembly 130 further includes: the second connecting portion 125 and the second power member 131 are connected in a face-to-face manner.
Preferably, the connection mode of the second connecting part 125 and the second power part 131 is surface-to-surface lamination, so that the second connecting part 125 has larger stress area when the second power part 131 is pulled to slide transversely, and is more stable when being pulled, and the effect of compaction is better when the shielding plate assembly 140 connected above the second power part 131 is laminated with the first opening 112, and further the air tightness guarantee in the first accommodating cavity 111 is better, so that the wafer processing is more precise.
Specifically, the longitudinal lifting assembly 130 further includes: the first limiting piece 133, the first limiting piece 133 is arranged on one side of the second power piece 131 close to the first supporting piece 132; at least a portion of the first supporting member 132 is located directly above the first limiting member 133.
Preferably, by setting the first limiting member 133 and setting at least a portion of the first supporting member 132 to be located directly above the first limiting member 133, the position of the shielding plate assembly 140 during lifting is limited, other assemblies cannot be affected by lifting, damage to the shielding plate assembly 140 cannot be caused, and further subsequent shielding of the first opening 112 cannot be performed, so that a problem occurs in processing of the wafer.
Specifically, the shutter assembly 140 further includes: the second supporting member 141, the second supporting member 141 is connected with the longitudinal lifting assembly 130, and the second supporting member 141 is provided with a matching portion 142, and the matching portion 142 is used for matching with the first supporting member 132, so that the second supporting member 141 is fixed on the first supporting member 132; the shielding member 143, the shielding member 143 is disposed on a side of the first supporting member 132 near the first opening 112, and the shielding member 143 is further attached to the second supporting member 141.
Preferably, the vertical lifting component 130 is connected through the second supporting piece 141, and the matching part 142 is matched with the first supporting piece 132, so that the second supporting piece 141 is more convenient to install, is more stable after being fixed, is arranged on the first supporting piece 132, and the shielding piece 143 is also attached to the second supporting piece 141, so that the shielding piece 143 is more tightly attached to the second supporting piece 141, the second supporting piece 141 is firmer when the shielding piece 143 is pressed, the air tightness is better, and the pressing effect is more stable.
Specifically, the first support 132 is provided with an extension side 144, the extension side 144 is shielded by the second support 141, and the shielding member 143 is provided on the extension side 144.
Preferably, the first supporting member 132 is provided with the extension side 144, the extension side 144 is shielded by the second supporting member 141, and the shielding member 143 is arranged on the extension side 144, so that the whole shielding member 143 can be better received, meanwhile, the shielding member 143 is ensured to be more stable and not to shake when the shielding member 143 is lifted by the first supporting member 132, the first opening 112 can be better shielded, and good air tightness of the wafer in the first accommodating cavity 111 during processing is further ensured.
Specifically, the second supporting member 141 is provided with a first slot 145, and at least part of the first supporting member 132 is accommodated in the first slot 145; the engaging portion 142 is disposed in the first slot 145, and the engaging portion 142 is bent with respect to the second supporting member 141.
Preferably, the first slot 145 is formed in the second supporting member 141 and at least part of the first supporting member 132 is accommodated, so that the first supporting member 132 is more stable when lifting the second supporting member 141, and meanwhile, the matching portion 142 is bent and arranged relative to the second supporting member 141, so that the first supporting member 132 is more uniform and stable when applying force to the matching portion 142, stability of the second supporting member 141 and the shielding member 143 during lifting is guaranteed, and good air tightness during pressing of the first opening 112 is further guaranteed.
Specifically, the wafer etching cleaning apparatus 100 further includes: annular groove 150, annular groove 150 encloses first opening 112; the shield assembly 140 can completely shield the annular groove 150.
Preferably, the annular groove 150 is arranged around the first opening 112, and the shielding plate assembly 140 can completely shield the annular groove 150, so that the first opening 112 cannot directly contact with the outside, the annular groove 150 can provide the guarantee of the second air tightness, and the two layers of guarantees enable the air tightness in the first accommodating cavity 111 to be better.
[ second embodiment ]
On the basis of the first embodiment, an elastic rubber member can be further disposed on one side of the shielding member 143 close to the first opening 112, so that when the shielding member 143 is driven to slide towards the first opening 112 by the lateral sliding assembly 120, the shielding member 143 can compress the elastic rubber member, so that the elastic rubber member deforms, and the first opening 112 is sealed by the elastic rubber member, thereby improving air tightness.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The wafer etching and cleaning device is characterized by comprising:
a housing (110), the housing (110) being provided with a first accommodation chamber (111) and a first opening (112), the first opening (112) communicating with the first accommodation chamber (111);
a lateral sliding assembly (120), the lateral sliding assembly (120) being provided to the housing (110);
-a longitudinal lifting assembly (130), said longitudinal lifting assembly (130) being connected to said transversal sliding assembly (120);
a shielding plate assembly (140), wherein the shielding plate assembly (140) is connected with the longitudinal lifting assembly (130), and the shielding plate assembly (140) is arranged on one side close to the first opening (112) in a sliding manner;
the vertical lifting assembly (130) drives the shielding plate assembly (140) to slide along the surface of the shell (110), so that the shielding plate assembly (140) shields the first opening (112), and the horizontal sliding assembly (120) drives the vertical lifting assembly (130) to slide horizontally towards the first opening (112), so that the shielding plate assembly (140) is attached to the first opening (112).
2. The wafer etching cleaning apparatus of claim 1, wherein the lateral slide assembly (120) further comprises:
the first fixing piece (121), the said first fixing piece (121) locates at the bottom of the said body (110) and close to the said first opening (112) one side;
a first power member (122), the first power member (122) being connected to the first fixing member (121);
-a connection assembly (123), the connection assembly (123) connecting the first power member (122) and the longitudinal lifting assembly (130);
wherein, the first power piece (122) drives the connecting assembly (123) to transversely slide.
3. The wafer etching cleaning apparatus according to claim 2, wherein the connection assembly (123) further comprises:
a first connection portion (124), the first connection portion (124) being connected to the first power member (122);
and a second connecting part (125), wherein the second connecting part (125) connects the first connecting part (124) and the longitudinal lifting assembly (130), and the second connecting part (125) is bent relative to the first connecting part (124).
4. A wafer etching cleaning apparatus according to claim 3, wherein the longitudinal lifting assembly (130) further comprises:
a second power member (131), the second power member (131) being connected to the second connection portion (125);
a first supporting member (132), wherein the first supporting member (132) is arranged on one side of the second power member (131) close to the first opening (112), and the first supporting member (132) is connected with the shielding plate assembly (140);
the second power piece (131) drives the first supporting piece (132) to lift towards the first opening (112), so that the shielding plate assembly (140) lifts towards the first opening (112).
5. The wafer etching cleaning apparatus of claim 4, wherein the longitudinal lifting assembly (130) further comprises:
the second connecting part (125) and the second power piece (131) are connected in a surface-to-surface fit mode.
6. The wafer etching cleaning apparatus of claim 4, wherein the longitudinal lifting assembly (130) further comprises:
the first limiting piece (133) is arranged on one side, close to the first supporting piece (132), of the second power piece (131);
at least part of the first supporting member (132) is located directly above the first limiting member (133).
7. The wafer etching cleaning apparatus of claim 6, wherein the shutter assembly (140) further comprises:
a second supporting member (141), wherein the second supporting member (141) is connected with the longitudinal lifting assembly (130), the second supporting member (141) is provided with a matching part (142), and the matching part (142) is used for matching with the first supporting member (132) so that the second supporting member (141) is fixed on the first supporting member (132);
and the shielding piece (143) is arranged on one side of the first supporting piece (132) close to the first opening (112), and the shielding piece (143) is also attached to the second supporting piece (141).
8. The wafer etching cleaning apparatus of claim 7, wherein,
the first support (132) is provided with an extension side (144), the extension side (144) is shielded by the second support (141), and the shield (143) is provided on the extension side (144).
9. The wafer etching cleaning apparatus of claim 8, wherein,
the second support (141) is provided with a first slot (145), and the first slot (145) accommodates at least part of the first support (132);
the matching part (142) is arranged in the first slot (145), and the matching part (142) is bent and arranged relative to the second supporting piece (141).
10. The wafer etching cleaning apparatus according to claim 1, further comprising:
an annular groove (150), wherein the annular groove (150) is surrounded on the first opening (112);
the shutter assembly (140) is capable of fully shielding the annular groove (150).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311054339.5A CN116759349B (en) | 2023-08-22 | 2023-08-22 | Wafer etching cleaning device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311054339.5A CN116759349B (en) | 2023-08-22 | 2023-08-22 | Wafer etching cleaning device |
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| CN116759349A true CN116759349A (en) | 2023-09-15 |
| CN116759349B CN116759349B (en) | 2023-12-12 |
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| CN202311054339.5A Active CN116759349B (en) | 2023-08-22 | 2023-08-22 | Wafer etching cleaning device |
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| CN116759349B (en) | 2023-12-12 |
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