CN116741760A

CN116741760A - Wiring structure and display device

Info

Publication number: CN116741760A
Application number: CN202310726275.2A
Authority: CN
Inventors: 张鹏
Original assignee: Keruizhe Technology Shenzhen Co ltd
Current assignee: Keruizhe Technology Shenzhen Co ltd
Priority date: 2023-06-19
Filing date: 2023-06-19
Publication date: 2023-09-12
Anticipated expiration: 2043-06-19
Also published as: CN116741760B

Abstract

The application relates to a wiring structure and display equipment, wherein the wiring structure comprises a plurality of light sources, a first transparent conductive layer, a second transparent conductive layer and signal wires, the first transparent conductive layer is used for connecting anodes of the light sources, and a first partition channel is formed in the first transparent conductive layer; the second transparent conductive layer is arranged in an insulating way with the first transparent conductive layer and is used for being connected with a cathode of the light source, and a second partition channel is formed in the second transparent conductive layer; the signal line is electrically connected with the plurality of light sources and is used for connecting the plurality of light sources in series, and the signal line is used for inputting data signals for the plurality of light sources; at least one light source among the plurality of light sources connected in series with the signal line is electrically connected to both the first signal line and the second signal line. The wiring structure in the application can solve the problem of poor overall permeability of the display equipment.

Description

Wiring structure and display device

Technical Field

The application relates to the technical field of display glass, in particular to a wiring structure and display equipment.

Background

The display glass in the related art, such as large display glass applied to markets, can find that the glass is provided with the closely-spaced hemp wires when the display glass is close to the glass, so that the display glass has poor permeability and is not attractive.

Disclosure of Invention

The embodiment of the application provides a wiring structure and display equipment, and the wiring structure in the embodiment can solve the problem of poor overall permeability of the display equipment.

In a first aspect, the present application provides a wiring structure, including a plurality of light sources, a first transparent conductive layer, a second transparent conductive layer, and a signal line, where the first transparent conductive layer is used for connecting an anode of the light sources, and the first transparent conductive layer is provided with a first isolation channel; the second transparent conductive layer is arranged in an insulating way with the first transparent conductive layer, and is used for being connected with the cathode of the light source, and a second partition channel is formed in the second transparent conductive layer; the signal line is electrically connected with the light sources and is used for connecting the light sources in series, and the signal line is used for inputting data signals to the light sources; the signal wire comprises a first signal wire and a second signal wire, the first signal wire is arranged in the first partition channel and is insulated from the first transparent conductive layer, and the first signal wire is electrically connected with one of the signal input end and the signal output end of the light source; the second signal wire is arranged in the second partition channel in an insulating way and is arranged with the first transparent conducting layer in an insulating way, and the second signal wire is electrically connected with the other one of the signal input end and the signal output end of the light source; wherein, in a plurality of light sources that the signal line is established ties, at least one light source is connected with the electricity of first signal line and second signal line simultaneously.

In this embodiment, the signal line is used for inputting data signals to a plurality of the light sources; the first signal wire is arranged in the first partition channel and is in insulation arrangement with the first transparent conductive layer, the first signal wire is electrically connected with one of the signal input end and the signal output end of the light source, the second signal wire is arranged in the second partition channel and is in insulation arrangement with the first transparent conductive layer, and the second conductive structure penetrates through the second through hole to electrically connect the other of the signal input end and the signal output end of the light source with the second signal wire, so that series connection among a plurality of light sources is realized. In addition, since the signal line is connected in series with the plurality of light sources, the first transparent conductive layer and the second transparent conductive layer are separated into the adjacent first area and the adjacent second area by the line formed by connecting the signal line with the plurality of light sources, and since at least one light source is electrically connected with the first signal line and the second signal line at the same time in the plurality of light sources connected in series with the signal line, that is, at the position corresponding to at least one light source, the first transparent conductive layer of the first area and the second area is communicated, and the second transparent conductive layer of the first area and the second area is communicated, so that the first transparent conductive layer is not separated into a plurality of parts insulated from each other, but is a conductive whole, which is equivalent to increasing the width of the first transparent conductive layer, thereby improving the conductive performance of the first transparent conductive layer and the second transparent conductive layer. Thus, the wiring structure in this embodiment can be made larger, such as directly applied to a glass curtain wall, an advertisement display, or a building display glass.

As an embodiment of the first aspect, among the plurality of light sources in which the signal lines are connected in series, at least one of two adjacent light sources is electrically connected to the first signal line and the second signal line at the same time, and one of the first signal line and the second signal line is connected to the two adjacent light sources at the same time. In this embodiment, based on that at least one of the two adjacent light sources is electrically connected to the first signal line and the second signal line at the same time, one of the first signal line and the second signal line is connected to the two adjacent light sources at the same time, so that every other light source of the first transparent conductive layer in the first area and the second area is mutually communicated, so as to improve the integrity of the first transparent conductive layer, and the conductivity of the first transparent conductive layer can be improved, and every other light source of the second transparent conductive layer in the first area and the second area is mutually communicated, so as to improve the integrity of the second transparent conductive layer, and the conductivity of the second transparent conductive layer can be improved, so that the wiring structure in this embodiment can be made larger.

As an embodiment of the first aspect, the first signal line and the first transparent conductive layer are made of the same material, and the second signal line and the second transparent conductive layer are made of the same material. Since the first signal line and the first transparent conductive layer are made of the same material, and the first transparent conductive layer is transparent, the first signal line is also transparent, so that the overall transparency of the wiring structure in the embodiment can be improved. Also, since the second signal line is made of the same material as the second transparent conductive layer, and the second transparent conductive layer is transparent, the second signal line is also transparent, so that the overall transparency of the wiring structure in this embodiment can be improved.

As an embodiment of the first aspect, the plurality of light sources are arranged in a rectangular array, and each row of light sources parallel to the first direction is connected in series through the signal line, and the first direction is a length direction of the rectangular array. In this embodiment, the light sources are arranged in a rectangular array, which is easy to process and manufacture, and also easy to layout the signal lines, so that the structure is more reasonable, and the manufacturing process is simplified.

As an embodiment of the first aspect, the wiring structure further includes a glass substrate, a first conductive structure and a second conductive structure, the glass substrate includes a first side wall and a second side wall opposite to each other, the first transparent conductive layer is disposed on the first side wall, the second transparent conductive layer is disposed on the second side wall, the light source is disposed on the first side wall of the glass substrate, a first through hole and a second through hole are formed in the glass substrate, the first conductive structure passes through the first through hole to electrically connect the cathode of the light source with the second transparent conductive layer, and the second conductive structure passes through the second through hole to electrically connect the second signal line with the signal input end and the signal output end of the light source.

In this embodiment, on the one hand, the first transparent conductive layer and the second transparent conductive layer are transparent, and the glass substrate is also transparent, so that the overall transparency can be improved. In yet another aspect, the first transparent conductive layer is disposed on the first sidewall, the light source is disposed on the first transparent conductive layer, and the anode is electrically connected to the first transparent conductive layer, thereby enabling the light source to be positively charged. The first conductive structure penetrates through the first through hole and the first isolation hole to electrically connect the cathode with the second transparent conductive layer, so that the light source can be electrified negatively, and then the anode and the cathode of the light source can be electrified to enable the light source to work normally. Compared with the method that the first transparent conductive layer and the second transparent conductive layer are directly arranged on the same side of the glass substrate, in the embodiment of the application, the first transparent conductive layer and the second transparent conductive layer are respectively arranged on the first side wall and the second side wall of the glass substrate, and the first side wall and the second side wall are opposite, so that the manufacturing steps, such as the process steps for forming the insulating layer between the first transparent conductive layer and the second transparent conductive layer, can be reduced, a layer of insulating layer is structurally reduced, the overall thickness can be reduced, and the overall transparency of the whole wiring structure can be improved under the condition of reduced thickness.

In yet another aspect, compared to disposing the first transparent conductive layer and the second transparent conductive layer on the same side of the glass substrate, the transparent conductive layer that needs to be close to the glass substrate has a sufficient thickness to support the other transparent conductive layer and the lead structure, and the like. In yet another aspect, compared to the first transparent conductive layer and the second transparent conductive layer disposed on the same side of the glass substrate, the transparent conductive layer near the glass substrate needs to have a sufficient thickness to support and form the lead structure, and the like, and a high temperature is required to form the lead structure, and it is necessary that one lead structure needs to be formed after the first transparent conductive layer or the second transparent conductive layer is formed, so that the chemical properties of the first transparent conductive layer and the second transparent conductive layer are damaged, and in this embodiment, the first transparent conductive layer and the second transparent conductive layer are formed on the first side wall and the second side wall of the glass substrate respectively, and because the glass substrate has a higher strength, the glass substrate has a good high temperature resistance, and the first transparent conductive layer and the second transparent conductive layer can be formed first by forming the lead structure on the first side wall and the second side wall of the glass substrate, so that the first transparent conductive layer and the second transparent conductive layer can be prevented from being damaged by the high temperature, thereby reducing the process difficulty and improving the yield.

In yet another aspect, compared to when the first transparent conductive layer and the second transparent conductive layer are located on the same side, the current penetrating the insulating layer therebetween may cause the first transparent conductive layer and the second transparent conductive layer to be shorted, and in this embodiment, the first transparent conductive layer and the second transparent conductive layer are formed on the first sidewall and the second sidewall of the glass substrate, respectively, so that the first transparent conductive layer and the second transparent conductive layer may be prevented from being shorted.

In still another aspect, the second conductive structure may electrically connect the second signal line with the signal input end and the signal output end of the light source through the second through hole, so as to implement communication between the first signal line and the second signal line, so that the data signal can smoothly flow between the first signal line and the second signal line.

As an embodiment of the first aspect, a projection of the first through hole on the glass substrate is located within a range of a projection of the light source on the glass substrate along a direction perpendicular to the glass substrate, and the first through hole is opposite to a cathode of the light source along the direction perpendicular to the glass substrate. And the projection of the second through hole on the glass substrate is positioned in the projection range of the light source on the glass substrate along the direction perpendicular to the glass substrate, and the second through hole is opposite to the signal input end or the signal output end of the light source along the direction perpendicular to the glass substrate. In this embodiment, the first through hole penetrates through the first side wall and the second side wall, and in a direction perpendicular to the glass substrate, the cathode is opposite to the first through hole, so that the first conductive structure can be shielded by the light source, and the overall transparency of the wiring structure cannot be affected by the first conductive structure. In addition, the second through hole penetrates through the first side wall and the second side wall, and in the direction perpendicular to the glass substrate, the signal input end or the signal output end of the light source is opposite to the second through hole, so that the second conductive structure can be shielded by the light source, and the overall transparency of the wiring structure can not be influenced by the first conductive structure.

As an embodiment of the first aspect, the wiring structure further includes a first lead and a second lead, the first lead is disposed on a side of the glass substrate where the first transparent conductive layer is disposed, the second lead is disposed on a side of the glass substrate where the second transparent conductive layer is disposed, the first lead is electrically connected to the first transparent conductive layer, and the second lead is electrically connected to the second transparent conductive layer. In this embodiment, since the first lead is disposed on the glass substrate on the side on which the first transparent conductive layer is disposed, and the second lead is disposed on the glass substrate on the side on which the second transparent conductive layer is disposed, the glass substrate has higher strength and better high temperature resistance, and the first lead and the second lead can be formed on both sides of the glass substrate, and then the first transparent conductive layer and the second transparent conductive layer can be formed, so that the first transparent conductive layer and the second transparent conductive layer can be prevented from being damaged by high temperature, thereby reducing the process difficulty and improving the yield.

As an embodiment of the first aspect, the wiring structure further includes a metal wire disposed on the first transparent conductive layer and/or the second transparent conductive layer. In this embodiment, the metal wire is added to improve the conductivity of the first transparent conductive layer and/or the second transparent conductive layer, so that the large-scale design of the wiring structure in this embodiment is facilitated.

As an embodiment of the first aspect, the metal wire is in a rectangular annular structure, the first transparent conductive layer and the second transparent conductive layer are in rectangular structures, and the metal wire is disposed at an edge portion on the first transparent conductive layer and/or the second transparent conductive layer. In this embodiment, the metal wires with the rectangular annular structure are disposed at the edge portions on the first transparent conductive layer and/or the second transparent conductive layer, so that the conductive performance of the first transparent conductive layer and/or the second transparent conductive layer can be improved, thereby being beneficial to improving the large-scale design of the wiring structure in this embodiment.

In a second aspect, the present application provides a display panel including the wiring structure described in any one of the embodiments of the first aspect, so that the display panel in this embodiment has better transparency and can be enlarged.

In a third aspect, the present application provides a display device comprising a wiring structure as described in any one of the embodiments of the first aspect, the display device being a glass curtain wall, an advertising display or a building display glass. Thus, the display device in this embodiment has better transparency and can be enlarged.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.

FIG. 1 is a schematic diagram of one possible wiring structure provided by an embodiment of the present application;

FIG. 2 is an enlarged schematic view of a portion of FIG. 1 at A;

fig. 3 is a front view of the wiring structure in fig. 1;

fig. 4 is a rear view of the wiring structure in fig. 1;

FIG. 5 is an enlarged partial schematic view at B in FIG. 4;

FIG. 6 is a simplified schematic diagram of the wiring structure of FIG. 1;

fig. 7 is a cross-sectional view of the wiring structure of fig. 1 at a position corresponding to a cathode of a light source;

fig. 8 is a cross-sectional view of the wiring structure in fig. 1 at a position corresponding to the second via hole;

100. a wiring structure; 10. a light source; 11. a cathode; 12. an anode; 13. a signal input terminal; 14. a signal output terminal; 20. an insulating layer; 201. a first through hole; 202. a second through hole; 21. a first sidewall; 22. a second sidewall; 30. a first transparent conductive layer; 301. a first isolation hole; 302. a first partition passage; 40. a second transparent conductive layer; 401. a second partition passage; 51. a first conductive structure; 52. an insulating medium; 53. a second conductive structure; 60. a signal line; 61. a first signal line; 62. a second signal line; 63. a first region; 64. a second region; 70. a lead structure; 71. a first lead; 72. a second lead; 73. a third lead; 80. and a metal wire.

Detailed Description

In the following, some terms related to the embodiments of the present application will be explained first.

In the description of the embodiments of the present application, it should be understood that the terms "upper," "lower," "front," "rear," "longitudinal," "transverse," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements being referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more unless specifically stated otherwise.

In describing embodiments of the present application, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "coupled" should be construed broadly, for example, such that a fixed connection may be made, or such that a connection may be made between two elements through intermediaries, or such that two elements may communicate internally or such that two elements interact. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to specific circumstances.

The terms first, second, third, fourth and the like in the description and in the claims of embodiments of the application and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the application described herein may be implemented, for example, in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In this specification, terms such as "vertical", "parallel", and the like are explained.

And (3) vertical: the vertical defined in the present application is not limited to an absolute vertical intersection (angle of 90 degrees), and a vertical relationship is understood to be allowed in a range of assembly errors, for example, a range of 80 degrees to 100 degrees, which is allowed to exist in a small angle range due to factors such as assembly tolerance, design tolerance, structural flatness, and the like, which are not an absolute vertical intersection.

Parallel: the parallelism defined in the present application is not limited to absolute parallelism, and the definition of parallelism is understood to be substantially parallel, allowing for cases that are not absolute parallelism due to factors such as assembly tolerances, design tolerances, structural flatness, etc., which would lead to a non-absolute parallelism between the slip fit portion and the first door panel, but the present application is also defined as such cases being parallel.

Embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

The application provides a display device which comprises a wiring structure, wherein the display device can be a glass curtain wall, an advertisement display, market glass or building display glass and the like. By the wiring structure in the present embodiment, the display device in the present embodiment is made to have better transparency and can be enlarged.

FIG. 1 illustrates one possible wiring structure 100 provided by an embodiment of the present application; fig. 2 is an enlarged partial schematic view at a in fig. 1.

Referring to fig. 1 and 2 together, in some embodiments, the wiring structure 100 includes a light source 10, a first transparent conductive layer 30, and a second transparent conductive layer 40.

The light source 10 may be an LED lamp bead, an LCD lamp bead, a light emitting diode, or the like.

The light source 10 includes a cathode 11 and an anode 12, and the light source 10 can be energized by supplying negative and positive electricity to the cathode 11 and the anode 12, respectively, through conductors.

The first transparent layer is made of a transparent conductive material, such as indium tin oxide in some embodiments. In some embodiments, the first transparent layer may be made of conductive polymer PEDOT, metal mesh, carbon nanorods, nano silver wires, graphene, and the like. The second transparent layer is made of a transparent conductive material, such as indium tin oxide in some embodiments. In some embodiments, the second transparent layer may also be made of conductive polymer PEDOT, metal mesh, carbon nanorods, nano silver wires, graphene, and the like.

Fig. 3 is a front view of the wiring structure 100 in fig. 1; fig. 4 is a rear view of the wiring structure 100 in fig. 1; fig. 5 is a partially enlarged schematic view at B in fig. 4.

Referring to fig. 2-5 together, in some embodiments, the wiring structure 100 includes a plurality of light sources 10, the light sources 10 further include a signal input terminal 13 and a signal output terminal 14, the wiring structure 100 further includes a signal line 60, the signal line 60 is electrically connected to the plurality of light sources 10 and connects the plurality of light sources 10 in series, and the signal line 60 is used to input data signals to the plurality of light sources 10.

In some embodiments, the signal line 60 includes a first signal line 61 and a second signal line 62, the first signal line 61 being electrically connected to one of the signal input terminal 13 and the signal output terminal 14 of the light source 10, and the second signal line 62 being electrically connected to the other of the signal input terminal 13 and the signal output terminal 14 of the light source 10. In the present embodiment, based on the first signal line 61 being electrically connected to one of the signal input terminal 13 and the signal output terminal 14 of the light source 10, the second signal line 62 is electrically connected to the other of the signal input terminal 13 and the signal output terminal 14 of the light source 10, thereby realizing the series connection between the plurality of light sources 10.

In a specific embodiment, for a certain light source 10, the first signal line 61 is electrically connected to the signal input terminal 13 of the light source 10, and the second signal line 62 is electrically connected to the signal output terminal 14 of the light source 10. For the light source 10 adjacent to the light source 10, for example, the light source 10 adjacent to the light source 10 is the first light source 10, the first signal line 61 is electrically connected to the signal output terminal 14 of the first light source 10, and the second signal line 62 is electrically connected to the signal input terminal 13 of the first light source 10.

Fig. 6 is a simplified schematic diagram of the wiring structure 100 in fig. 1.

Referring to fig. 2 to 6 together, at least one light source 10 of the plurality of light sources 10 connected in series with the signal line 60 is electrically connected to both the first signal line 61 and the second signal line 62. In this embodiment, the signal line 60 is connected in series with the plurality of light sources 10, so that the line formed by connecting the signal line 60 with the plurality of light sources 10 separates the first transparent conductive layer 30 and the second transparent conductive layer 40 into the adjacent first area 63 and the second area 64, respectively, because, among the plurality of light sources 10 connected in series with the signal line 60, at least one light source 10 is electrically connected with the first signal line 61 and the second signal line 62 at the same time, that is, at the position corresponding to at least one light source 10, the first transparent conductive layer 30 of the first area 63 and the second area 64 is connected, and the second transparent conductive layer 40 of the first area 63 and the second area 64 is connected, so that the first transparent conductive layer 30 is not separated into a plurality of portions insulated from each other, but the first transparent conductive layer 30 is a conductive whole, which is equivalent to increasing the width of the first transparent conductive layer 30, so that the conductive performance of the first transparent conductive layer 30 and the second transparent conductive layer 40 can be improved. Thus, the wiring structure 100 in this embodiment can be made larger, such as directly applied to a glass curtain wall, an advertising display, or a building display glass.

In some embodiments, among the plurality of light sources 10 connected in series with the signal line 60, at least one light source 10 of two adjacent light sources 10 is electrically connected to the first signal line 61 and the second signal line 62 at the same time, and one of the first signal line 61 and the second signal line 62 is connected to two adjacent light sources 10 at the same time. In the present embodiment, based on that at least one of the two adjacent light sources 10 is electrically connected to the first signal line 61 and the second signal line 62 at the same time, one of the first signal line 61 and the second signal line 62 connects the two adjacent light sources 10 at the same time, so that every other light source 10 of the first transparent conductive layer 30 of the first area 63 and the second area 64 is communicated with each other, so as to improve the integrity of the first transparent conductive layer 30, and the conductivity of the first transparent conductive layer 30, and also so that every other light source 10 of the second transparent conductive layer 40 of the first area 63 and the second area 64 is communicated with each other, so as to improve the integrity of the second transparent conductive layer 40, and so as to improve the conductivity of the second transparent conductive layer 40, so that the wiring structure 100 in the present embodiment can be made larger. It will be appreciated that at least one light source 10 of every adjacent three light sources 10 may be electrically connected to the first signal line 61 and the second signal line 62 at the same time.

In some embodiments, the first signal line 61 is made of the same material as the first transparent conductive layer 30, and the second signal line 62 is made of the same material as the second transparent conductive layer 40. Since the first signal line 61 is made of the same material as the first transparent conductive layer 30, and the first transparent conductive layer 30 is transparent, the first signal line 61 is also transparent, so that the overall transparency of the wiring structure 100 in this embodiment can be improved. Also, since the second signal line 62 is made of the same material as the second transparent conductive layer 40, and the second transparent conductive layer 40 is transparent, the second signal line 62 is also transparent, so that the overall transparency of the wiring structure 100 in this embodiment can be improved. In addition, since the first signal line 61 and the first transparent conductive layer 30 are made of the same material, the second signal line 62 and the second transparent conductive layer 40 are made of the same material. Thus, the manufacturing process is also simpler, such as laser etching the first signal line 61 directly on the first transparent conductive layer 30 and laser etching the second signal line 62 on the second transparent conductive layer 40.

In some embodiments, the light sources 10 are arranged in a rectangular array, and each row of light sources 10 parallel to the first direction is connected in series through the signal line 60, and the first direction is the length direction of the rectangular array. In this embodiment, the light sources 10 are arranged in a rectangular array, which is easy to manufacture and layout the signal lines 60, so that the structure is more reasonable and the manufacturing process is simplified. It will be appreciated that in other embodiments, the plurality of light sources 10 may be arranged in a circular array, or may be arranged in other ways.

Fig. 7 is a cross-sectional view of the wiring structure 100 in fig. 1 at a position corresponding to the cathode 11 of the light source 10; fig. 8 is a cross-sectional view of the wiring structure 100 in fig. 1 at a position corresponding to the second via 202.

Referring to fig. 2-8, in some embodiments, the second transparent conductive layer 40 is insulated from the first transparent conductive layer 30, the first transparent conductive layer 30 is provided with a first isolation channel 302, the second transparent conductive layer 40 is provided with a second isolation channel 401, the first signal line 61 is disposed in the first isolation channel 302 and is insulated from the first transparent conductive layer 30, and the second signal line 62 is insulated from the first transparent conductive layer 30 and is disposed in the second isolation channel 401. In the present embodiment, the first signal line 61 is disposed in the first isolation channel 302 and is insulated from the first transparent conductive layer 30, and the second signal line 62 is disposed in the second isolation channel 401 and is insulated from the second transparent conductive layer 40, so that the plurality of light sources 10 are serially connected, and the signal line 60 and the first transparent conductive layer 30 and the second transparent conductive layer 40 do not affect each other.

It is understood that insulating the second transparent conductive layer 40 from the first transparent conductive layer 30 means that the insulating layer 20 is disposed between the first transparent conductive layer 30 and the second transparent conductive layer 40, such as glass in some embodiments, and photoresist in other embodiments, the insulating layer 20 may be a photoresist layer, although other transparent materials are also possible.

In some embodiments, the insulating layer 20 is a glass substrate, and the glass substrate is a transparent glass substrate, and specific materials may be quartz sand, borax, boric acid, barite, barium carbonate, limestone, feldspar, soda ash, and so on. It is understood that the glass substrate in this embodiment may be a substrate made of other non-glass materials similar to the glass materials, such as a transparent material with strength higher than that of quartz glass, which is basically within the scope of the embodiments of the present application. In addition, the glass substrate in the present embodiment may be either flexible glass or hard glass.

The glass substrate is plate-shaped, and the shape of the glass substrate is not particularly limited, for example, in some embodiments, the glass substrate is rectangular plate-shaped, and in some embodiments, the glass substrate is plate-shaped with other shapes such as a circle, a square, a triangle, and the like.

The glass substrate includes a first sidewall 21 and a second sidewall 22, the first sidewall 21 and the second sidewall 22 being opposite in a direction perpendicular to the glass substrate.

A first transparent conductive layer 30 is formed on the first sidewall 21 and a second transparent layer is formed on the second sidewall 22. In this embodiment, both the first transparent conductive layer 30 and the second transparent conductive layer 40 are transparent, and the glass substrate is also transparent, so that the overall transparency can be improved. The first transparent conductive layer 30 is disposed on the first sidewall 21, the light source 10 is disposed on the first transparent conductive layer 30, and the anode 12 is electrically connected to the first transparent conductive layer 30, so that the light source 10 can be positively charged. The cathode 11 is electrically connected to the second transparent conductive layer 40, so that the light source 10 can be negatively charged, and thus both the anode 12 and the cathode 11 of the light source 10 can be electrically charged, so that the light source 10 operates normally.

In the embodiment of the present application, compared to directly disposing the first transparent conductive layer 30 and the second transparent conductive layer 40 on the same side of the glass substrate, since the first transparent conductive layer 30 and the second transparent conductive layer 40 are respectively disposed on the first sidewall 21 and the second sidewall 22 of the glass substrate and the first sidewall 21 and the second sidewall 22 are disposed opposite to each other, not only the process steps in manufacturing, for example, the process steps for forming the insulating structure layer between the first transparent conductive layer 30 and the second transparent conductive layer 40, can be reduced, but also the thickness of the whole insulating structure layer can be reduced, and in the case of the reduced thickness, the whole transparency of the whole wiring structure 100 can be improved.

In addition, compared to the first transparent conductive layer 30 and the second transparent conductive layer 40 disposed on the same side of the glass substrate, the transparent conductive layer near the glass substrate needs to have a sufficient thickness to support the other transparent conductive layer and the lead structure 70, and the like, in this embodiment, the first transparent conductive layer 30 and the second transparent conductive layer 40 are formed on the first sidewall 21 and the second sidewall 22 of the glass substrate respectively, and the glass substrate has a higher strength, thus having a better carrying capacity, and also can reduce the thickness of the first transparent layer and the second transparent layer, and further can facilitate to improve the overall transparency of the entire wiring structure 100 by reducing the thickness of the first transparent layer and the second transparent layer.

In addition, compared to the case where the first transparent conductive layer 30 and the second transparent conductive layer 40 are disposed on the same side of the glass substrate, the transparent conductive layer near the glass substrate needs to have a sufficient thickness to support and form the lead structure 70, and the like, a high temperature is required to form the lead structure 70, and it is necessary that one lead structure 70 is formed after the first transparent conductive layer 30 or the second transparent conductive layer 40 is formed, so that the chemical properties of the first transparent conductive layer 30 and the second transparent conductive layer 40 are damaged, and the first transparent conductive layer 30 and the second transparent conductive layer 40 are prevented from being damaged at a high temperature, so that the process difficulty is reduced and the yield is improved by forming the first transparent conductive layer 30 and the second transparent conductive layer 40 on the first side wall 21 and the second side wall 22 of the glass substrate due to the higher strength of the glass substrate and the high temperature resistance.

In addition, compared to when the first transparent conductive layer 30 and the second transparent conductive layer 40 are located on the same side, the current penetrating the insulating structure layer therebetween may cause the first transparent conductive layer 30 and the second transparent conductive layer 40 to be shorted, and in this embodiment, the first transparent conductive layer 30 and the second transparent conductive layer 40 are formed on the first sidewall 21 and the second sidewall 22 of the glass substrate, respectively, so that the shorting of the first transparent conductive layer 30 and the second transparent conductive layer 40 may be avoided.

Referring to fig. 2-8 together, in some embodiments, the wiring structure 100 further includes a first conductive structure 51, where the first conductive structure 51 passes through the first via 201 to electrically connect the cathode 11 with the second transparent conductive layer 40. The glass substrate is provided with a first through hole 201, and the cathode 11 is opposite to the first through hole 201 in a direction perpendicular to the glass substrate. In a direction perpendicular to the glass substrate, the cathode 11 is opposite to the first through hole 201, so that the first conductive structure 51 can be shielded by the light source 10 so that the first conductive structure 51 does not affect the overall transparency of the wiring structure 100.

In some embodiments, the first transparent conductive layer 30 is provided with the first isolation hole 301, the projection of the first through hole 201 on the glass substrate is located within the range of the projection of the first isolation hole 301 on the glass substrate in the direction perpendicular to the glass substrate, and the projection of the first through hole 201 on the glass substrate is spaced from the projection of the first isolation hole 301 on the glass substrate. Based on the first transparent conductive layer 30, the first isolation hole 301 is formed, in the direction perpendicular to the glass substrate, the projection of the first through hole 201 on the glass substrate is located in the projection range of the first isolation hole 301 on the glass substrate, and the projection of the first through hole 201 on the glass substrate and the projection of the first isolation hole 301 on the glass substrate are arranged at intervals, so that the first conductive structure 51 can be electrically connected with the cathode 11 of the light source 10 and cannot be connected with the first transparent conductive layer 30, and therefore shorting of the light source 10 relative to the first transparent conductive layer 30 and the second transparent conductive layer 40 cannot occur, and the safety of the wiring structure 100 in the embodiment is improved.

In some embodiments, an insulating medium 52 is disposed between the first conductive structure 51 and the first transparent conductive layer 30, so that the first conductive structure 51 is disposed in an insulating manner with respect to the first transparent conductive layer 30. In this embodiment, by providing the insulating medium 52 between the first conductive structure 51 and the first transparent conductive layer 30, the first conductive structure 51 and the first transparent conductive layer 30 are insulated, so that the probability of short-circuiting between the first conductive structure 51 and the first transparent conductive layer 30 is further reduced, and the wiring structure 100 and the security performance in this embodiment are improved.

In some embodiments, the first conductive structure 51 is a copper-deposited structure formed on the inner wall of the first via 201. In this embodiment, the first conductive structure 51 may be formed by depositing copper on the inner wall of the first through hole 201, so as to realize conduction between the cathode 11 of the light source 10 and the second transparent conductive layer 40. It is understood that copper may be deposited only on the inner wall of the first via 201, or the first via 201 may be filled directly with copper. It will be appreciated that copper may be replaced by other materials such as silver, gold, etc.

In some embodiments, the first conductive structure 51 is a wire penetrating the first through hole 201. Of course, in this embodiment, the cathode 11 of the light source 10 may be electrically connected to the second transparent conductive layer 40 by a wire.

Referring to fig. 2-8 together, in some embodiments, the wiring structure 100 further includes a second conductive structure 53, the glass substrate is further provided with a second through hole 202 penetrating the first sidewall 21 and the second sidewall 22, the second through hole 202 is opposite to the signal input end 13 or the signal output end 14 of the light source 10 in a direction perpendicular to the glass substrate, the first transparent conductive layer 30 is provided with a first isolation channel 302, the second transparent conductive layer 40 is provided with a second isolation channel 401, the first signal line 61 is disposed in the first isolation channel 302 and is insulated from the first transparent conductive layer 30, and the second signal line 62 is disposed in the second isolation channel 401 and is insulated from the first transparent conductive layer 30. The second conductive structure 53 electrically connects the other of the signal input terminal 13 and the signal output terminal 14 of the light source 10 with the second signal line 62 through the second through hole 202. The first signal line 61 is arranged in the first isolation channel 302 and is insulated from the first transparent conductive layer 30, and the second signal line 62 is arranged in the second isolation channel 401 and is insulated from the second transparent conductive layer 40, so that the series connection of the plurality of light sources 10 is realized, and the signal line 60 and the first transparent conductive layer 30 and the second transparent conductive layer 40 cannot be mutually influenced.

In some embodiments, the wiring structure 100 includes a lead structure 70 (as above), the lead structure 70 includes a first lead 71 and a second lead 72, the first lead 71 is disposed on a side of the glass substrate where the first transparent conductive layer is disposed, the second lead 72 is disposed on a side of the glass substrate where the second transparent conductive layer is disposed, the first lead 71 is electrically connected to the first transparent conductive layer 30, and the second lead 72 is electrically connected to the second transparent conductive layer 40. In this embodiment, since the first lead 71 is disposed on the side of the glass substrate where the first transparent conductive layer is disposed, and the second lead 72 is disposed on the side of the glass substrate where the second transparent conductive layer is disposed, the glass substrate has higher strength and better high temperature resistance, and the first and second leads 71 and 72 can be formed on both sides of the glass substrate, and then the first and second transparent conductive layers 30 and 40 can be formed, so that the first and second transparent conductive layers 30 and 40 can be prevented from being damaged by high temperature, and the process difficulty and the yield can be reduced.

In some embodiments, the lead structure 70 further includes a third lead 73, the third lead 73 being disposed within the first and/or second isolation channels 302, 401, the third lead 73 being electrically connected to the signal line 60.

In some embodiments, the wiring structure 100 further includes a metal wire 80 having a rectangular ring-shaped structure, and the first transparent conductive layer 30 and the second transparent conductive layer 40 have a rectangular structure, where the metal wire 80 is disposed on an edge portion of the first transparent conductive layer 30 and/or the second transparent conductive layer 40. In this embodiment, the metal wires 80 with rectangular annular structures are disposed at the edge portions of the first transparent conductive layer 30 and/or the second transparent conductive layer 40, so that the conductive performance of the first transparent conductive layer 30 and/or the second transparent conductive layer 40 can be improved, thereby being beneficial to improving the large-scale design of the wiring structure 100 in this embodiment.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present application should be included in the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A wiring structure, characterized by comprising:

a plurality of light sources, a plurality of the light sources;

the first transparent conductive layer is used for connecting the anode of the light source and is provided with a first partition channel;

the second transparent conductive layer is arranged in an insulating way with the first transparent conductive layer and is used for being connected with the cathode of the light source, and a second partition channel is formed in the second transparent conductive layer; and

a signal line electrically connected to the plurality of light sources and connecting the plurality of light sources in series, the signal line being for inputting data signals to the plurality of light sources; the signal line includes:

the first signal wire is arranged in the first partition channel and is insulated from the first transparent conducting layer, and the first signal wire is electrically connected with one of the signal input end and the signal output end of the light source;

the second signal wire is arranged in the second partition channel in an insulating way and is arranged with the first transparent conducting layer in an insulating way, and the second signal wire is electrically connected with the other one of the signal input end and the signal output end of the light source;

wherein, in a plurality of light sources that the signal line is established ties, at least one light source is connected with the electricity of first signal line and second signal line simultaneously.

2. The wiring structure according to claim 1, wherein at least one of two adjacent light sources among the plurality of light sources in which the signal lines are connected in series is electrically connected to the first signal line and the second signal line at the same time, and one of the first signal line and the second signal line is connected to the two adjacent light sources at the same time.

3. The wiring structure according to claim 1, wherein the first signal line is made of the same material as the first transparent conductive layer, and the second signal line is made of the same material as the second transparent conductive layer.

4. The wiring structure as claimed in claim 1, wherein a plurality of said light sources are arranged in a rectangular array, and each row of said light sources parallel to a first direction being a length direction of said rectangular array is connected in series through said signal line.

5. The wiring structure of any one of claims 1-4, further comprising a glass substrate, a first conductive structure and a second conductive structure, wherein the glass substrate comprises a first side wall and a second side wall opposite to each other, the first transparent conductive layer is disposed on the first side wall, the second transparent conductive layer is disposed on the second side wall, the light source is disposed on the first side wall of the glass substrate, a first through hole and a second through hole are formed in the glass substrate, the first conductive structure electrically connects the cathode of the light source with the second transparent conductive layer through the first through hole, and the second conductive structure electrically connects the second signal line with the signal input terminal and the signal output terminal of the light source through the second through hole.

6. The wiring structure according to claim 5, wherein a projection of the first through hole onto the glass substrate is located within a range of a projection of the light source onto the glass substrate in a direction perpendicular to the glass substrate, and the first through hole is opposite to a cathode of the light source in a direction perpendicular to the glass substrate, and a projection of the second through hole onto the glass substrate is located within a range of a projection of the light source onto the glass substrate in a direction perpendicular to the glass substrate, and the second through hole is opposite to a signal input terminal or a signal output terminal of the light source in a direction perpendicular to the glass substrate.

7. The wiring structure according to claim 5, further comprising a first lead provided on a side of the glass substrate where the first transparent conductive layer is provided, and a second lead provided on a side of the glass substrate where the second transparent conductive layer is provided, the first lead being electrically connected to the first transparent conductive layer, the second lead being electrically connected to the second transparent conductive layer.

8. The wiring structure as in any one of claims 1-4, further comprising a metal wire disposed on the first transparent conductive layer and/or the second transparent conductive layer.

9. The wiring structure according to claim 8, wherein the metal wire has a rectangular annular structure, the first transparent conductive layer and the second transparent conductive layer have a rectangular structure, and the metal wire is provided at an edge portion on the first transparent conductive layer and/or the second transparent conductive layer.

10. A display device comprising a wiring structure according to any one of the preceding claims 1-9, the display device being a glass curtain wall, an advertising display or a building display glass.