CN116735003A - Quick refrigeration large tracts of land infrared detector packaging structure - Google Patents
Quick refrigeration large tracts of land infrared detector packaging structure Download PDFInfo
- Publication number
- CN116735003A CN116735003A CN202310655078.6A CN202310655078A CN116735003A CN 116735003 A CN116735003 A CN 116735003A CN 202310655078 A CN202310655078 A CN 202310655078A CN 116735003 A CN116735003 A CN 116735003A
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- China
- Prior art keywords
- cold plate
- infrared detector
- infrared detection
- infrared
- loading substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 238000005057 refrigeration Methods 0.000 title abstract description 29
- 238000001514 detection method Methods 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 230000003287 optical effect Effects 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 230000007704 transition Effects 0.000 claims description 24
- 238000001816 cooling Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 239000003507 refrigerant Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 3
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- -1 and are made of 4J36 Substances 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003331 infrared imaging Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application relates to a rapid refrigeration large area array infrared detector packaging structure, which comprises: the device comprises an infrared detection chip, a loading substrate, an upper cold plate, a lower cold plate, a connecting pipe, a gas-liquid separator, a compressor, an expansion valve, a micro-channel, a screw, a cooler, a Dewar cold box, a bracket, an optical filter and an inlet pipe, wherein the lower cold plate is fixed in the Dewar cold box, and the upper cold plate is welded at the upper end of the lower cold plate in a sealing way; the loading substrate is arranged on the upper cold plate, and a plurality of infrared detection chips are arranged on the loading substrate; the support is arranged on the loading substrate, the optical filter is arranged on the support and is arranged above the infrared detection chips, the Dewar cold box above the optical filter is provided with an optical window, and infrared light enters the optical filter through the window to be filtered and then is absorbed and converted on the infrared detection chips. The micro-channel is etched or machined on the lower cold plate, the upper cold plate is fixed on the lower cold plate through welding and fastened through screws, and the micro-channel sequentially forms an annular loop with the gas-liquid separator, the compressor, the cooler and the expansion valve through the inlet pipe and the outlet pipe.
Description
Technical Field
The application relates to the field of focal plane infrared detectors, in particular to the field of rapid refrigeration large-area array infrared detector packaging.
Background
Two important performance indexes of infrared remote sensing instruments are field of view and resolution. Two important performance indexes of infrared remote sensing instruments are field of view and resolution. The expansion of the field of view can increase the observation range of the instrument, and the improvement of the resolution can improve the imaging quality of the instrument. In infrared imaging systems, the focal length of the optical system and the size of the detector determine the field of view of the system, and the focal length of the optical system and the size of the pixel determine the resolution efficiency of the system. Under the condition that the target surface of the detector is fixed, a long-focal-length optical system is needed to be adopted in order to improve the overall indexes such as the acting distance and the resolution of the imaging system, so that the system view field is reduced, and under the condition that the scale of the infrared detector and the pixel size are fixed, the infrared system view field and the resolution are mutually restricted.
In addition, in order to reduce noise, the infrared detector usually needs to work at a deep low temperature, and the refrigeration problem of the ultra-large-scale area array infrared focal plane detector becomes an industrial difficulty. The mechanical refrigeration has the advantages of compact structure, small volume, light weight, large refrigeration capacity, short refrigeration time, large controllable refrigeration temperature range and the like, and the mechanical refrigeration mode is mostly adopted in the application of the common refrigeration type infrared detector at present.
In the development of a high-resolution large-view-field optical system, one of the solutions for overcoming the contradiction between view field and resolution is to adopt a high-resolution and ultra-large-scale area array infrared focal plane detector or a multi-chip splicing technology. Such a very large area array implies a higher thermal load and thermal mass. The data shows that the cost of the refrigerator has been approaching the manufacturing cost of the detector itself. Meanwhile, the ultra-large area array has higher and higher requirements on the performance of the refrigerator, the refrigerating time of some ultra-large area arrays is tens of minutes or even hours currently, and the ultra-large area array has limitation on the application of fast refrigeration in the requirements of missile-borne, airborne and the like.
The current ultra-large area array infrared detector also adopts a mechanical refrigerator to refrigerate an infrared detector chip, and adopts Dewar packaging to form an infrared focal plane Dewar assembly. However, the ultra-large scale array chip has extremely high performance requirements on the refrigerator due to the increase of heat load, heat mass and the like, and the quick refrigeration requirement on the detector is difficult to meet in the common refrigerator refrigeration starting time.
Disclosure of Invention
The application aims to provide a packaging structure and a packaging method for a large-area array infrared detector capable of rapidly refrigerating, so that rapid refrigeration of the infrared detector is realized, and the problem that the refrigeration time of the current ultra-large-scale infrared detector is too long is partially solved. The method is particularly suitable for the middle measurement of a large area array detector or certain scenes with higher requirements on the refrigerating starting time.
In order to achieve the aim of the application, the application adopts the following technical scheme:
the application relates to a rapid refrigeration large-area infrared detector packaging structure, which comprises: the device comprises an infrared detection chip, a loading substrate, an upper cold plate, a lower cold plate, a connecting pipe, a gas-liquid separator, a compressor, an expansion valve, a micro-channel, a screw, a cooler, a Dewar cold box, a bracket, an optical filter and an inlet pipe, wherein the infrared detection chip, the loading substrate, the upper cold plate, the lower cold plate, the bracket and the optical filter are arranged in the Dewar cold box, the lower cold plate is fixed in the Dewar cold box, and the upper cold plate is welded at the upper end of the lower cold plate in a sealing way; the loading substrate is arranged on the upper cold plate, and a plurality of infrared detection chips are arranged on the loading substrate; or a plurality of infrared detection chips and a loading substrate are simultaneously arranged on the upper cold plate; the support is installed on loading the base plate, and the light filter is installed on the support to set up in a plurality of infrared detection chips top, open there is a window on the Dewar cold box of light filter top, the window is through brazing there being infrared window piece, and infrared light gets into the light filter through the window and filters the back and reach infrared detector chip and be absorbed and the conversion, wherein: and the micro-channel sequentially forms an annular loop with the gas-liquid separator, the compressor, the cooler and the expansion valve through the inlet pipe and the outlet pipe, the refrigerant circulates in the annular loop, and the infrared detection chip is cooled to a required temperature.
The application relates to a rapid refrigeration large-area infrared detector packaging structure, wherein: the microchannels are arranged in a serpentine fashion on the lower cold plate.
The application relates to a rapid refrigeration large-area infrared detector packaging structure, wherein: the micro-channels are arranged on the lower cold plate in a manner of sleeving rectangular tubes.
The application relates to a rapid refrigeration large-area infrared detector packaging structure, wherein: it also includes: the transition layer is arranged at the upper end of the upper cold plate, and the infrared detection chip and the loading substrate are arranged on the transition layer or the loading substrate is arranged on the transition layer.
The application relates to a rapid refrigeration large-area infrared detector packaging structure, wherein: the transition layer is made of a high heat conduction material, wherein the material is copper diamond, aluminum nitride or silicon carbide, and the thermal expansion coefficient of the material continuously changes along the thickness of the transition layer.
The application relates to a rapid refrigeration large-area infrared detector packaging structure, wherein: the thickness of the transition layer is 0.5-10mm.
The application relates to a rapid refrigeration large-area infrared detector packaging structure, wherein: the inlet and outlet pipe is made of low heat conductivity material and is a quartz glass pipe.
The application relates to a rapid refrigeration large-area infrared detector packaging structure, wherein: the micro-channel is in airtight connection with the access pipe.
The application relates to a rapid refrigeration large-area infrared detector packaging structure, wherein: the upper cold plate and the lower cold plate are made of the same material and are made of 4J36, molybdenum or titanium alloy.
The application relates to a rapid refrigeration large-area infrared detector packaging structure, wherein: the thickness of the upper cold plate 4 and the lower cold plate 5 is 0.5-10mm respectively.
The application provides a packaging structure and a packaging method for a fast refrigerating large-area array infrared detector, which can realize fast refrigeration of the infrared detector and partially solve the problem of overlong refrigeration time of the current ultra-large-scale infrared detector. The method is particularly suitable for the middle measurement of a large area array detector or certain scenes with higher requirements on the refrigerating starting time.
Drawings
FIG. 1 shows a fast refrigerating large area array infrared detector packaging structure of the application;
FIG. 2 is a schematic diagram of another fast cooling large area array infrared detector package structure according to the present application;
FIG. 3 is an arrangement of microchannels on a lower cold plate;
fig. 4 is another arrangement of microchannels on a lower cold plate.
In fig. 1 to 4, reference numeral 1 denotes an infrared detection chip; reference numeral 2 is a loading substrate; reference numeral 3 is a transition layer; reference numeral 4 is an upper cold plate; reference numeral 5 is a lower cold plate; reference numeral 6 is a connecting pipe; reference numeral 7 is a gas-liquid separator; reference numeral 8 denotes a compressor; reference numeral 9 is an expansion valve; reference numeral 10 is a microchannel; reference numeral 11 denotes a screw; reference numeral 12 is a cooler; reference numeral 13 is a Dewar cold box; reference numeral 14 is a window; reference numeral 15 is a bracket; reference numeral 16 denotes a filter; reference numeral 17 denotes an access pipe.
Detailed Description
As shown in fig. 1, the fast cooling large area infrared detector package structure of the present application includes: the infrared detection chip 1, the loading substrate 2, the transition layer 3, the upper cold plate 4, the lower cold plate 5, the connecting pipe 6, the gas-liquid separator 7, the compressor 8, the expansion valve 9, the micro-channel 10, the screw 11, the cooler 12, the Dewar cold box 13, the bracket 15, the optical filter 16 and the inlet and outlet pipe 17, the Dewar cold box 13 is internally provided with the infrared detection chip 1, the loading substrate 2, the transition layer 3, the upper cold plate 4, the lower cold plate 5, the bracket 15 and the optical filter 16, the lower cold plate 5 is adhered in the Dewar cold box 13, and the upper cold plate 4 is welded at the upper end of the lower cold plate 5 in a sealing way; a transition layer 3 is arranged at the upper end of the upper cold plate 4, the loading substrate 2 is arranged on the transition layer 3, and a plurality of infrared detection chips 1 are arranged on the loading substrate 2; the support 15 is supported on the loading substrate 2, the optical filter 16 is placed on the support 15 and is arranged above the infrared detection chips 1, a window 14 is formed in the Dewar cold box 13 above the optical filter 16, infrared window sheets are brazed on the window 14, infrared light enters the optical filter 16 through the window 14 to be filtered and then reaches the infrared detection chips 1 to be absorbed and converted, a micro-channel 10 which is filled with refrigerant is etched or machined on the lower cold plate 5, the upper cold plate 4 is fixed on the lower cold plate 5 through screws 11 and sealing welding, the micro-channel 10 sequentially forms an annular loop with the gas-liquid separator 7, the compressor 8, the cooler 12 and the expansion valve 9 through the inlet pipe 17 and the connecting pipe 6, and the refrigerant circulates in the annular loop to cool the infrared detection chips 1 to a required temperature.
As shown in fig. 2, the fast cooling large area infrared detector package structure of the present application includes: the infrared detection chip 1, the loading substrate 2, the transition layer 3, the upper cold plate 4, the lower cold plate 5, the connecting pipe 6, the gas-liquid separator 7, the compressor 8, the expansion valve 9, the micro-channel 10, the screw 11, the cooler 12, the Dewar cold box 13, the bracket 15, the optical filter 16 and the inlet and outlet pipe 17, the Dewar cold box 13 is internally provided with the infrared detection chip 1, the loading substrate 2, the transition layer 3, the upper cold plate 4, the lower cold plate 5, the bracket 15 and the optical filter 16, the lower cold plate 5 is adhered in the Dewar cold box 13, and the upper cold plate 4 is welded at the upper end of the lower cold plate 5 in a sealing way; a transition layer 3 is arranged at the upper end of the upper cold plate 4, and a plurality of infrared detection chips 1 and a loading substrate 2 are simultaneously arranged on the transition layer 3; the support 15 is supported on the loading substrate 2, the optical filter 16 is placed on the support 15 and is arranged above the infrared detection chips 1, a window 14 is formed in the Dewar cold box 13 above the optical filter 16, infrared window sheets are brazed on the window 14, infrared light enters the optical filter 16 through the window 14 to be filtered and then reaches the infrared detection chips 1 to be absorbed and converted, a micro-channel 10 which is filled with refrigerant is etched or machined on the lower cold plate 5, the upper cold plate 4 is fixed on the lower cold plate 5 through screws 11 and sealing welding, the micro-channel 10 sequentially forms an annular loop with the gas-liquid separator 7, the compressor 8, the cooler 12 and the expansion valve 9 through the inlet pipe 17 and the connecting pipe 6, and the refrigerant circulates in the annular loop to cool the infrared detection chips 1 to a required temperature.
As shown in fig. 3, the micro channels 10 are arranged in a serpentine fashion on the lower cold plate 5; as shown in fig. 4, the micro channels 10 are arranged in a manner of being nested in rectangular tubes on the lower cold plate 5.
The transition layer 3 is made of a high heat conduction material, which is copper diamond, aluminum nitride or silicon carbide, and the thermal expansion coefficient of the material continuously changes along the thickness of the transition layer 3, and the thickness of the material is 0.5-10mm.
The inlet and outlet pipe 17 is made of low heat conductivity material and is a quartz glass pipe; the micro-channel 10 and the access pipe 17 are connected by welding.
The upper cold plate 4 and the lower cold plate 5 are made of the same material, and are made of 4J36, molybdenum or titanium alloy, and the thicknesses of the upper cold plate 4 and the lower cold plate 5 are respectively 0.5-10mm.
As shown in fig. 3 and 4, the micro-channel 10 is designed according to the distribution of the infrared detection chips 1 on the loading substrate 2 and the size of the infrared detection chips 1, so as to reduce the overall stress born by the infrared detection chips 1 when the assembly is cooled, and ensure the reliability.
The implementation method of the application comprises the following steps: when the detector is started, the refrigerator is opened, the connecting pipe 6 and the inlet and outlet pipe 17 are opened, liquid nitrogen or other low-temperature medium is introduced into the flow passage, and under the action of the peripheral compressor 8, the heat of the cold platform is quickly reduced to about 77K, so that the infrared detector is ensured to quickly reach the temperature required by working and kept at the working temperature. The cooling medium in the micro-channel 10 can rapidly take away a large amount of heat, so that the purpose of rapid starting is achieved.
The key point of the application is that the structural design of the cooling platform enables the infrared detection chip 1 to realize rapid refrigeration through the design of the micro-channel 10, the stress on the infrared detection chip 1 is reduced through proper flow channel layout, and the lower heat load of the package body is ensured through the design of the inlet and outlet pipe 17.
It will be evident to those skilled in the art that the application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. A fast refrigerating large-area infrared detector packaging structure comprises: the infrared detection chip (1), the loading substrate (2), the upper cold plate (4), the lower cold plate (5), the connecting pipe (6), the gas-liquid separator (7), the compressor (8), the expansion valve (9), the micro-channel (10), the screw (11), the cooler (12), the Dewar cold box (13), the bracket (15), the optical filter (16) and the access pipe (17), wherein the infrared detection chip (1), the loading substrate (2), the upper cold plate (4), the lower cold plate (5), the bracket (15) and the optical filter (16) are arranged in the Dewar cold box (13), the lower cold plate (5) is fixed in the Dewar cold box (13), and the upper cold plate (4) is welded at the upper end of the lower cold plate (5) in a sealing way; the loading substrate (2) is arranged on the upper cold plate (4), and a plurality of infrared detection chips (1) are arranged on the loading substrate (2); or a plurality of infrared detection chips (1) and a loading substrate (2) are simultaneously arranged on the upper cold plate (4); the support (15) is arranged on the loading substrate (2), the optical filter (16) is arranged on the support (15) and is arranged above a plurality of infrared detection chips (1), a window (14) is formed in a Dewar cold box (13) above the optical filter (16), an infrared window sheet is brazed on the window (14), and infrared light enters the optical filter (16) through the window (14) for filtration and then reaches the infrared detection chips to be absorbed and converted, and the infrared detection device is characterized in that: the micro-channel (10) is etched or machined on the lower cooling plate (5), the upper cooling plate (4) is welded and fixed on the lower cooling plate (5) and fastened by screws (11), the micro-channel (10) sequentially forms an annular loop with the gas-liquid separator (7), the compressor (8), the cooler (12) and the expansion valve (9) through the inlet pipe (17) and the connecting pipe (6), and the refrigerant circulates in the annular loop to cool the infrared detection chip (1) to a required temperature.
2. The rapid cooling large area infrared detector package structure of claim 1, wherein: the microchannels (10) are arranged in a serpentine fashion on the lower cold plate (5).
3. The rapid cooling large area infrared detector package structure of claim 1, wherein: the micro-channels (10) are arranged on the lower cold plate (5) in a manner of sleeving rectangular pipes.
4. A fast cooling large area infrared detector package structure as set forth in claim 2 or 3 wherein: further comprises: the transition layer (3) is arranged in the Dewar cold box (13), the transition layer (3) is arranged at the upper end of the upper cold plate (4), the infrared detection chip (1) and the loading substrate (2) are arranged on the transition layer (3), or the loading substrate (2) is arranged on the transition layer (3).
5. The rapid cooling large area infrared detector package structure as set forth in claim 4, wherein: the transition layer (3) is made of a high heat conduction material, wherein the material is copper diamond, aluminum nitride or silicon carbide, and the thermal expansion coefficient of the material continuously changes along the thickness of the transition layer (3).
6. The rapid cooling large area infrared detector package structure of claim 5, wherein: the thickness of the transition layer (3) is 0.5-10mm.
7. The rapid cooling large area infrared detector package structure as set forth in claim 6, wherein: the inlet and outlet pipe (17) is made of low heat conductivity material and is a quartz glass pipe.
8. The rapid cooling large area infrared detector package structure of claim 7, wherein: the micro-channel (10) and the access pipe (17) form an airtight connection.
9. The rapid cooling large area infrared detector package structure of claim 8, wherein: the upper cold plate (4) and the lower cold plate (5) are made of the same material, and are made of 4J36, molybdenum or titanium alloy.
10. The rapid cooling large area infrared detector package structure of claim 9, wherein: the thickness of the upper cold plate (4) and the lower cold plate (5) is respectively 0.5-10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310655078.6A CN116735003A (en) | 2023-06-02 | 2023-06-02 | Quick refrigeration large tracts of land infrared detector packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310655078.6A CN116735003A (en) | 2023-06-02 | 2023-06-02 | Quick refrigeration large tracts of land infrared detector packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116735003A true CN116735003A (en) | 2023-09-12 |
Family
ID=87900506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310655078.6A Pending CN116735003A (en) | 2023-06-02 | 2023-06-02 | Quick refrigeration large tracts of land infrared detector packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116735003A (en) |
-
2023
- 2023-06-02 CN CN202310655078.6A patent/CN116735003A/en active Pending
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