CN116734722A - Building member surface deformation monitoring device and monitoring method - Google Patents
Building member surface deformation monitoring device and monitoring method Download PDFInfo
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- CN116734722A CN116734722A CN202310812744.2A CN202310812744A CN116734722A CN 116734722 A CN116734722 A CN 116734722A CN 202310812744 A CN202310812744 A CN 202310812744A CN 116734722 A CN116734722 A CN 116734722A
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- 238000001514 detection method Methods 0.000 claims description 20
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
- G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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Abstract
The invention discloses a building member surface deformation monitoring device and a monitoring method, wherein the device comprises a multichannel signal conversion monitor and a resistance type strain gauge, the resistance type strain gauge is inserted and connected onto the multichannel signal conversion monitor, a display screen, a status indicator lamp, a key, a camera and an ultrasonic ranging module are fixed on a shell of the multichannel signal conversion monitor, a plurality of deformation acquisition interfaces are arranged on the side face of the shell, a DC charging interface and a USB charging interface are arranged on the left side face of the shell, a USB driving interface and a louver type vent are arranged on the right side face of the shell, and a control circuit board is fixed in the shell, wherein the display screen, the status indicator lamp, the key, the camera, the ultrasonic ranging module, the deformation acquisition port, the DC charging interface, the USB charging interface and the USB driving interface are all connected with the control circuit board. According to the temperature and humidity sensor, the temperature and humidity sensor is added, and the singlechip calculates the actual deformation value under the current temperature and humidity condition on the basis of the reference temperature and humidity, so that the purpose of correcting deviation is achieved.
Description
Technical Field
The invention relates to the technical field of building component monitoring, in particular to a device and a method for monitoring surface deformation of a building component.
Background
Building elements, including beams, plates, columns, etc. of building bodies and bridges, deform under the action of various factors, including self-load of the building and external earthquake. The bearing column of the building can generate axial deformation and bending deformation under the action of axial force and eccentric load, and the bearing beams and plates generate shearing deformation and bending deformation under the action of shearing force and bending moment. The deformation of the building components is within the allowable range, the normal use of the building components is not affected, once the continuous development of the deformation exceeds the allowable value, the normal use of the building components is affected, the building components are required to be reinforced at the moment, the building is evacuated in time after the deformation seriously exceeds the allowable value and the normal use condition is still not reached after the reinforcement treatment, and the safety accident caused by the damage of the building is prevented.
In order to monitor the deformation of building elements, it is currently common practice to attach strain gauges to the surface of the building elements for continuous monitoring. The strain gauge is an element for measuring strain, and is composed of a sensitive grid and the like, when in use, the strain gauge is firmly adhered to a measuring point of a component, after the component is stressed, the measuring point is strained, the sensitive grid is deformed along with the strain gauge to change the resistance, and then the resistance change is measured by a special instrument and is converted into a strain value of a monitoring point.
Because the strain gauge is a sensor for converting deformation of a building member into an analog electric signal, the strain gauge can be influenced by temperature and humidity drift in the process of transmitting the analog electric signal to signal processing equipment to cause deformation measurement distortion, and particularly the strain gauge arranged on an outdoor bridge, the influence of outdoor temperature difference and humidity change on the measurement result of the strain gauge is larger. However, current devices for monitoring deformations of building elements using strain gauges lack correction of the corresponding temperature and humidity drift, resulting in the problem of serious distortion of the measurement results of strain gauges applied to bridges. Since deformation of the building element tends to occur at a plurality of locations, such as beams, shear deformation thereof tends to occur at both sides of the beams, and bending deformation thereof mainly occurs at the middle and in the vicinity of both sides of the middle, monitoring whether the deformation of the building element exceeds an allowable value or not tends to require attaching a plurality of strain gauges to the building element to complete or the whole deformation state of the building element. However, the current signal conversion device can only process the analog electric signal of one strain gauge, only one data transmission interface is arranged on the signal conversion device, and when facing a plurality of strain gauge monitoring units, a large number of signal conversion devices are often needed, so that resource waste and data mixing are caused; meanwhile, the current signal conversion equipment cannot perform wireless transmission of data, and also cannot remotely control the opening of certain data transmission interfaces according to monitoring requirements to acquire deformation values of certain monitoring points or close the monitoring points so as to save power consumption of the equipment and prolong the working time of the equipment.
Disclosure of Invention
In order to solve the technical problems, the invention provides a building member surface deformation monitoring device, which is additionally provided with a temperature and humidity sensor, wherein the temperature and humidity sensor is used for monitoring the temperature and humidity of the working environment of a strain gauge and uploading the temperature and humidity to a singlechip, and the singlechip calculates the actual deformation value under the current temperature and humidity condition on the basis of the reference temperature and humidity, so that the purpose of correcting deviation is achieved; meanwhile, the device is provided with a plurality of data transmission interfaces which can be remotely controlled to be opened to acquire the deformation value of a certain monitoring point or closed to save the power consumption of the equipment to prolong the working time of the equipment, and a plurality of USB data interfaces are arranged and can be used for expanding functions according to the field requirements; in addition, the device can also blow when the singlechip calorific capacity is too big or ambient humidity is too big, blow out the heat outside the equipment and utilize the air drying equipment internal environment of flow, prevent electronic component temperature, humidity too high and damage.
In order to achieve the technical effects, the invention is realized by the following technical scheme:
the utility model provides a building element surface deformation monitoring devices, includes multichannel signal conversion monitor and resistance strain gauge, the one end of resistance strain gauge is pegged graft on multichannel signal conversion monitor, multichannel signal conversion monitor includes the casing, be fixed with the display screen on the control panel of casing, the below of display screen is provided with the status indicator lamp, and the below of status indicator lamp is provided with the button, and the top of display screen is fixed with camera and ultrasonic ranging module, be provided with a plurality of deformation volume collection interface on one side of casing, be provided with DC interface and USB interface that charges on the left surface of casing, be provided with USB drive interface and tripe formula vent on the right flank of casing, the casing internal fixation has control circuit board, display screen, status indicator lamp, button, camera, ultrasonic ranging module, deformation volume collection port, DC interface, USB interface and USB drive interface all are connected with control circuit board.
Further, the casing includes control panel and enclosure box, and control panel is fixed in the enclosure box top, has packaged battery and control circuit board in the enclosure box, the battery is connected with control circuit board, and bottom one side of enclosure box is fixed with the fan, the fan is connected with control circuit board.
Further, be fixed with MCU singlechip, electric quantity detection module, power module, automatic cutout module that charges, relay, USB module, DC module, a plurality of group deformation data acquisition unit, a plurality of USB drive unit, temperature and humidity detection module, status indicator lamp, image processing module, buzzer and communication module charge on the control circuit board, electric quantity detection module, power module, automatic cutout module, relay, a plurality of group deformation data acquisition unit, a plurality of USB drive unit, temperature and humidity detection module, status indicator lamp, image processing module, buzzer, communication module, display screen, button and ultrasonic ranging module all are connected with the MCU singlechip, DC module and USB module that charges all are connected with automatic cutout module that charges, the camera is connected with image processing module, the fan is connected with the relay, the battery is connected with electric quantity detection module and power module respectively.
Further, the deformation data acquisition unit comprises a first switch module, an analog-to-digital conversion module, a signal amplification module and a wiring terminal, wherein the wiring terminal is fixed in the deformation acquisition port, the wiring terminal is connected with the signal amplification module, the signal amplification module is connected with the analog-to-digital conversion module, the analog-to-digital conversion module is connected with the first switch module, the first switch module is connected with the MCU singlechip, the USB driving unit comprises a second switch module and a USB connector, the USB connector is fixed in the USB driving interface, and the USB driving connector is connected with the MCU singlechip through the second switch module.
Further, the communication module supports one communication protocol of 2G/3G/4G/5G/ZigBee/Wifi/Bluetooth/LoRa.
Meanwhile, the invention also discloses a monitoring method of the building member surface deformation monitoring device, which comprises the following steps:
s1, acquiring initial analog electric signals of deformation;
s2, amplifying an initial analog electric signal by a circuit;
s3, performing analog-to-digital conversion on the amplified analog electric signal to obtain a digital signal;
s4, carrying out temperature and humidity drift correction on the digital signal by the MCU singlechip, wherein a correction formula is as follows:
wherein L is the deformation amount of the building element, alpha 1 And alpha 2 A temperature influence factor and a humidity influence factor, respectively;
s5, the MCU compares the corrected deformation quantity with a set value, when the difference percentage between the deformation quantity and the set value exceeds an allowable value, the MCU singlechip outputs an acoustic and optical early warning instruction, the red indicator lights up and the buzzer gives out alarm, the MCU singlechip outputs a camera calling instruction to acquire a working state picture of the building component, and the MCU singlechip wirelessly transmits early warning information and the picture to a control center together after acquiring the picture;
s6, the ultrasonic ranging module sends out ranging ultrasonic waves and receives reflected ultrasonic waves, and outputs a new ranging signal to the MCU singlechip when the mobile object is shielded, the MCU singlechip outputs an output sound and light early warning instruction, the red indicator lights up and the buzzer gives out alarm sound, the MCU singlechip outputs a camera calling instruction to acquire a working state picture of the building component, and the MCU singlechip wirelessly transmits early warning information and the picture to the control center.
The beneficial effects of the invention are as follows: the temperature and humidity sensor is added, the temperature and humidity sensor is used for monitoring the temperature and humidity of the working environment of the strain gauge and uploading the temperature and humidity to the singlechip, and the singlechip calculates the actual deformation value under the current temperature and humidity condition on the basis of the reference temperature and humidity, so that the purpose of correcting deviation is achieved; meanwhile, the device is provided with a plurality of data transmission interfaces which can be remotely controlled to be opened to acquire the deformation value of a certain monitoring point or closed to save the power consumption of equipment to prolong the working time of the equipment, and when the deformation of a building component exceeds a set value, an acoustic and optical alarm is sent out and early warning information is sent out to a control center, and a plurality of USB data interfaces are arranged and can be used for expanding functions according to field requirements; in addition, the device can also blow air when the heat productivity of the singlechip is overlarge or the ambient humidity is overlarge, blow the heat out of the equipment and utilize the flowing air to dry the internal environment of the equipment, thereby preventing the damage caused by the overhigh temperature and humidity of the electronic element; the device still has the image acquisition function concurrently, can be with the image remote transmission to control center that building or wall beam bottom was shot to control center masters building element's operating condition in real time, and it can also report to the police to the superelevation vehicle that the bridge passed under simultaneously, prevents that the top of superelevation vehicle from striking the bridge bottom and causing building element's destruction.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of a device for monitoring deformation of a surface of a building element;
FIG. 2 is a schematic diagram of the composition of a device for monitoring the deformation of the surface of a building element;
FIG. 3 is a schematic diagram of the structure of a control circuit board;
fig. 4 is a block diagram of the structure of the control circuit board.
In the drawings, the list of components represented by the various numbers is as follows:
the intelligent electronic control device comprises a 1-multichannel signal conversion monitor, a 2-deformation acquisition interface, a 3-resistance type strain gauge, a 4-USB drive interface, a 5-blind type ventilation opening, a 6-display screen, 7-keys, 8-state indicator lamps, 9-cameras, a 10-ultrasonic ranging module, an 11-packaging box, a 12-control panel, a 13-control circuit board, a 14-storage battery, a 15-fan, a 16-MCU (micro control unit) singlechip, a 17-electric quantity detection module, an 18-power module, a 19-USB charging module, a 20-DC charging module, a 21-charging automatic cutting module, a 22-first switch module, a 23-analog-to-digital conversion module, a 24-signal amplification module, a 25-wiring terminal, a 26-second switch module, a 27-USB connector, a 28-relay, a 29-temperature and humidity detection module, a 30-image processing module, a 31-red indicator lamp, a 32-green indicator lamp, a 33-buzzer and a 34-communication module.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1, the building element surface deformation monitoring device comprises a multichannel signal conversion monitor 1 and a resistance type strain gauge 3, one end of the resistance type strain gauge is inserted into the multichannel signal conversion monitor, the multichannel signal conversion monitor comprises a shell, a display screen 6 is fixed on a control panel of the shell, a status indicator lamp 8 is arranged below the display screen, a key 7 is arranged below the status indicator lamp, a camera 9 and an ultrasonic ranging module 10 are fixed above the display screen, a plurality of deformation acquisition interfaces 2 are arranged on one side surface of the shell, a DC charging interface and a USB charging interface are arranged on the left side surface of the shell, a USB driving interface 4 and a louver type ventilation opening 5 are arranged on the right side surface of the shell, a control circuit board 13 is fixed in the shell, and the display screen, the status indicator lamp, the key, the camera, the ultrasonic ranging module, the deformation acquisition port, the DC charging interface, the USB charging interface and the USB driving interface are all connected with the control circuit board.
As shown in fig. 2, the casing 1 includes a control panel 12 and a packaging box 11, the control panel 12 is fixed on the top of the packaging box 11, a storage battery 14 and a control circuit board 13 are packaged in the packaging box, the storage battery is connected with the control circuit board, a fan 15 is fixed on one side of the bottom of the packaging box, and the fan 15 is connected with the control circuit board 13.
3-4, the control circuit board 13 is fixed with an MCU singlechip 16, an electric quantity detection module 17, a power supply module 18, a charging automatic cutting-off module 21, a relay 28, a USB charging module 19, a DC charging module 20, a plurality of groups of deformation data acquisition units, a plurality of groups of USB driving units, a temperature and humidity detection module 29, a status indicator lamp 8, an image processing module 30, a buzzer 33 and a communication module 34, the electric quantity detection module, the power supply module, the charging automatic cutting-off module, the relay, a plurality of groups of deformation data acquisition units, a plurality of groups of USB driving units, the temperature and humidity detection module, a status indicator lamp, the image processing module, the buzzer, the communication module, a display screen, keys and an ultrasonic ranging module are all connected with the MCU singlechip, the DC charging module and the USB charging module are connected with the charging automatic cutting-off module, the device can charge the storage battery through the DC charging module and the USB charging module, after full charge, the charging automatic cutting-off module will automatically cut off the charging circuit, prevent the storage battery from being oversaturated and damaged, and various charging modes can meet charging requirements under different installation environments; the camera is connected with the image processing module, the fan is connected with the relay, and the storage battery is respectively connected with the electric quantity detection module and the power module.
The deformation data acquisition unit comprises a first switch module 22, an analog-to-digital conversion module 23, a signal amplification module 24 and a wiring terminal 25, wherein the wiring terminal is fixed in a deformation acquisition port, the wiring terminal is connected with the signal amplification module, the signal amplification module is connected with the analog-to-digital conversion module, the analog-to-digital conversion module is connected with the first switch module, the first switch module is connected with the MCU singlechip, the USB drive unit comprises a second switch module 26 and a USB connector 27, the USB connector is fixed in a USB drive interface, and the USB drive connector is connected with the MCU singlechip through the second switch module.
In this embodiment, the communication module is a Lora wireless communication module.
Meanwhile, the invention also discloses a monitoring method of the building member surface deformation monitoring device, which comprises the following steps:
s1, acquiring initial analog electric signals of deformation;
s2, amplifying an initial analog electric signal by a circuit;
s3, performing analog-to-digital conversion on the amplified analog electric signal to obtain a digital signal;
s4, carrying out temperature and humidity drift correction on the digital signal by the MCU singlechip, wherein a correction formula is as follows:
wherein L is the deformation amount of the building element, alpha 1 And alpha 2 A temperature influence factor and a humidity influence factor, respectively;
s5, the MCU compares the corrected deformation quantity with a set value, when the difference percentage between the deformation quantity and the set value exceeds an allowable value, the MCU singlechip outputs an acoustic and optical early warning instruction, the red indicator lights up and the buzzer gives out alarm, the MCU singlechip outputs a camera calling instruction to acquire a working state picture of the building component, and the MCU singlechip wirelessly transmits early warning information and the picture to a control center together after acquiring the picture;
s6, the ultrasonic ranging module sends out ranging ultrasonic waves and receives reflected ultrasonic waves, and outputs a new ranging signal to the MCU singlechip when the mobile object is shielded, the MCU singlechip outputs an output sound and light early warning instruction, the red indicator lights up and the buzzer gives out alarm sound, the MCU singlechip outputs a camera calling instruction to acquire a working state picture of the building component, and the MCU singlechip wirelessly transmits early warning information and the picture to the control center.
In the embodiment, the MCU singlechip 16 selects STM32 series singlechips; the electric quantity detection module selects an LTC2943 chip; the power supply module adopts AMS1117-3.3V power supply chips; the automatic charging cut-off module selects a QF5333 type storage battery charging and discharging control chip; the relay is a G5V-1 type miniature relay; the first switch module and the second switch module are respectively AO3401 type 5V switch circuit chips; the temperature and humidity detection module is an HTU20D type temperature and humidity detection module; the image processing module selects MDIN241 type image processing chip.
One specific application of the device is: the resistance type strain gauge 3 is stuck to a monitoring point of a building member, then the other end of the resistance type strain gauge 3 is spliced to a wiring terminal of the multichannel signal conversion monitor, a power switch key is pressed, a set value of deformation of the building member is set through the key, the multichannel signal conversion monitor is fixed on a wall body on one side of the bottom surface of the bridge body, and at the moment, the multichannel signal conversion monitor enters a working mode.
When the resistance strain gauge 3 deforms on the bottom surface of the bridge body, the resistance value of the resistance strain gauge changes, and the voltage output by the resistance strain gauge changes, so that deformation is converted into an analog electric signal, and the analog electric signal is required to be amplified by the signal amplifying module 24 because the signal strength of the analog electric signal is weak at the moment, the analog electric signal after gain is subjected to analog-digital conversion by the analog-digital conversion module to be converted into a digital signal, and the digital signal is transmitted to the MCU singlechip; the temperature and humidity monitoring module monitors the temperature and humidity of the current working environment, as the deformation data acquired by the electronic strain gauge can be affected by the temperature and humidity, the temperature and humidity drift is required to be corrected to acquire real deformation data, and the formula for correcting the acquired deformation by the MCU singlechip is as follows:
wherein L is the deformation amount of the building element, L 1 For the acquired deformation value, alpha 1 And alpha 2 The temperature influence factor and the humidity influence factor are respectively 0.9 and 0.1, T and H are respectively the temperature and the humidity of the current environment, and M 1 M is the deformation of the first temperature datum point 2 The deformation of the second temperature datum point is N 1 Is the deformation of the first humidity reference point, N 2 The deformation amount of the second humidity reference point.
The MCU singlechip compares the deformation quantity acquired after temperature and humidity correction with the set deformation quantity, when the difference percentage between the deformation quantity and the set value exceeds the allowable value, the MCU singlechip outputs an output sound and light early warning instruction, the status indicator lamp displays red and the buzzer gives out alarm sound, the MCU singlechip outputs a camera calling instruction to acquire a working state picture of a building component, and the MCU singlechip wirelessly transmits early warning information and the picture to a control center after acquiring the picture so as to facilitate timely maintenance and reinforcement of a building by staff. Meanwhile, the ultrasonic ranging module sends out ranging ultrasonic waves and receives reflected ultrasonic waves, and outputs a new ranging signal to the MCU singlechip when a mobile object is shielded, the MCU singlechip outputs an output sound and light early warning instruction, the red indicator lamp displays red and the buzzer gives out alarm sound, the MCU singlechip outputs a camera calling instruction to acquire a working state picture of a building member, and the MCU singlechip wirelessly transmits early warning information and the picture to the control center after acquiring the picture, so that workers can maintain and strengthen the work conveniently.
When the working environment of multichannel signal conversion monitor's temperature and humidity are too high, in order to prevent the damage of control circuit board, MCU will output the cooling and will damp the instruction to the relay, and the relay will switch on the power supply loop of fan, and fan 15 will rotate and blow this moment, and at the in-process of blowing, the inside high temperature of casing, high humidity air will be blown out the casing outside, can cool down the MCU singlechip and to the in-process of cooling down the casing at wind-force flow, prevent that electronic component from taking place to damage.
In addition, the control center can also send out a wireless instruction to control the opening and closing of a deformation data acquisition unit and a USB driving unit in a plurality of groups of deformation data acquisition units and a plurality of groups of USB driving units, the deformation data of a certain monitoring point can be obtained through the opened deformation data acquisition unit, and the opened USB driving unit is used for driving external expansion equipment connected with the deformation data acquisition unit; the device can also achieve the purpose of saving the electric energy and prolonging the working time of the equipment by closing a certain deformation data acquisition unit and a certain USB driving unit; after the control center sends out a wireless instruction for opening a certain deformation data acquisition unit and a USB driving unit, the communication module receives the instruction and transmits the instruction to the MCU singlechip, the MCU singlechip respectively opens the certain deformation data acquisition unit and the USB driving unit through the first switch module and the second switch module, and similarly, the certain deformation data acquisition unit and the USB driving unit can be closed through the first switch module and the second switch module.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Claims (6)
1. The utility model provides a building element surface deformation monitoring devices, includes multichannel signal conversion monitor and resistance strain gauge, the one end grafting of resistance strain gauge is on multichannel signal conversion monitor, multichannel signal conversion monitor includes the casing, be fixed with the display screen on the control panel of casing, the below of display screen is provided with the status indicator lamp, and the below of status indicator lamp is provided with the button, and the top of display screen is fixed with camera and ultrasonic ranging module, its characterized in that is provided with a plurality of deformation volume collection interface on one side of casing, is provided with DC interface and USB interface that charges on the left surface of casing, is provided with USB drive interface and tripe formula vent on the right flank of casing, be fixed with control circuit board in the casing, display screen, status indicator lamp, button, camera, ultrasonic ranging module, deformation volume collection port, DC interface, USB interface and USB drive interface all are connected with control circuit board.
2. The building element surface deformation monitoring device according to claim 1, wherein the housing comprises a control panel and a packaging box, the control panel is fixed at the top of the packaging box, a storage battery and a control circuit board are packaged in the packaging box, the storage battery is connected with the control circuit board, a fan is fixed at one side of the bottom of the packaging box, and the fan is connected with the control circuit board.
3. The building element surface deformation monitoring device according to claim 2, wherein the control circuit board is fixedly provided with an MCU singlechip, an electric quantity detection module, a power module, an automatic charging cut-off module, a relay, a USB charging module, a DC charging module, a plurality of groups of deformation data acquisition units, a plurality of groups of USB driving units, a temperature and humidity detection module, a status indicator lamp, an image processing module, a buzzer and a communication module, the electric quantity detection module, the power module, the automatic charging cut-off module, the relay, the plurality of groups of deformation data acquisition units, the plurality of groups of USB driving units, the temperature and humidity detection module, the status indicator lamp, the image processing module, the buzzer, the communication module, a display screen, a key and an ultrasonic ranging module are all connected with the MCU singlechip, the DC charging module and the USB charging module are all connected with the automatic charging cut-off module, the camera is connected with the image processing module, the fan is connected with the relay, and the storage battery is respectively connected with the electric quantity detection module and the power module.
4. The building element surface deformation monitoring device according to claim 3, wherein the deformation data acquisition unit comprises a first switch module, an analog-to-digital conversion module, a signal amplification module and a wiring terminal, the wiring terminal is fixed in the deformation acquisition port, the wiring terminal is connected with the signal amplification module, the signal amplification module is connected with the analog-to-digital conversion module, the analog-to-digital conversion module is connected with the first switch module, the first switch module is connected with the MCU singlechip, the USB driving unit comprises a second switch module and a USB connector, the USB connector is fixed in the USB driving interface, and the USB driving connector is connected with the MCU singlechip through the second switch module.
5. A building element surface deformation monitoring device according to claim 3, wherein the communication module supports one of the communication protocols 2G/3G/4G/5G/ZigBee/Wifi/bluetooth/LoRa.
6. A method of monitoring a surface deformation monitoring device for a building element according to claim 1, comprising the steps of:
s1, acquiring initial analog electric signals of deformation;
s2, amplifying an initial analog electric signal by a circuit;
s3, performing analog-to-digital conversion on the amplified analog electric signal to obtain a digital signal;
s4, carrying out temperature and humidity drift correction on the digital signal by the MCU singlechip, wherein a correction formula is as follows:
wherein L is the deformation amount of the building element, alpha 1 And alpha 2 A temperature influence factor and a humidity influence factor, respectively;
s5, the MCU compares the corrected deformation quantity with a set value, when the difference percentage between the deformation quantity and the set value exceeds an allowable value, the MCU singlechip outputs an acoustic and optical early warning instruction, the red indicator lights up and the buzzer gives out alarm, the MCU singlechip outputs a camera calling instruction to acquire a working state picture of the building component, and the MCU singlechip wirelessly transmits early warning information and the picture to a control center together after acquiring the picture;
s6, the ultrasonic ranging module sends out ranging ultrasonic waves and receives reflected ultrasonic waves, and outputs a new ranging signal to the MCU singlechip when the mobile object is shielded, the MCU singlechip outputs an output sound and light early warning instruction, the red indicator lights up and the buzzer gives out alarm sound, the MCU singlechip outputs a camera calling instruction to acquire a working state picture of the building component, and the MCU singlechip wirelessly transmits early warning information and the picture to the control center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310812744.2A CN116734722A (en) | 2023-07-04 | 2023-07-04 | Building member surface deformation monitoring device and monitoring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310812744.2A CN116734722A (en) | 2023-07-04 | 2023-07-04 | Building member surface deformation monitoring device and monitoring method |
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| Publication Number | Publication Date |
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| CN116734722A true CN116734722A (en) | 2023-09-12 |
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| CN202310812744.2A Pending CN116734722A (en) | 2023-07-04 | 2023-07-04 | Building member surface deformation monitoring device and monitoring method |
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| CN (1) | CN116734722A (en) |
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2023
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