CN116721951A - Air suspension type material receiving device and silicon wafer material receiving system - Google Patents
Air suspension type material receiving device and silicon wafer material receiving system Download PDFInfo
- Publication number
- CN116721951A CN116721951A CN202310595166.1A CN202310595166A CN116721951A CN 116721951 A CN116721951 A CN 116721951A CN 202310595166 A CN202310595166 A CN 202310595166A CN 116721951 A CN116721951 A CN 116721951A
- Authority
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- China
- Prior art keywords
- suspension
- air
- cambered surface
- material receiving
- receiving device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000725 suspension Substances 0.000 title claims abstract description 100
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 42
- 239000010703 silicon Substances 0.000 title claims abstract description 42
- 239000000463 material Substances 0.000 title claims abstract description 28
- 238000001514 detection method Methods 0.000 claims description 17
- 238000009434 installation Methods 0.000 claims description 14
- 238000007667 floating Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 33
- 238000005339 levitation Methods 0.000 description 5
- 230000005484 gravity Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application relates to the technical field of silicon wafer production equipment, in particular to an air suspension type material receiving device and a silicon wafer material receiving system.
Description
Technical Field
The application relates to the technical field of silicon wafer production equipment, in particular to an air suspension type receiving device and a silicon wafer receiving system.
Background
In the sorting process, the silicon wafer moves in a parabolic track in a posture parallel or not parallel to the horizontal plane, the side edge of the silicon wafer is in hard contact with the side edge of the receiving box, and the kinetic energy of the silicon wafer cannot be buffered and converted into internal energy in the process of moving from high speed to static because of larger kinetic energy of the silicon wafer, so that the problems of hidden cracking, edge breakage, silicon falling and the like are generated, and the production yield of the silicon wafer is reduced.
Disclosure of Invention
In order to achieve the above object, the present application provides an air-floating type material receiving device, comprising:
the upper end of the base is provided with a first suspension cambered surface, at least one suspension air hole is formed in the first suspension cambered surface, and the suspension air hole is communicated with an external air inlet pipe;
the bottom of the mounting table is provided with a second suspension cambered surface, the second suspension cambered surface is matched with the first suspension cambered surface, and gas is blown to the second suspension cambered surface from the suspension air hole so as to suspend the mounting table on the base;
the receiving box is arranged on the mounting table and is provided with a baffle plate;
the silicon wafer makes parabolic track movement to contact the striker plate, and pushes the mounting table to swing along with the material receiving box relative to the base.
In some possible implementations, the first suspension cambered surface is a concave cambered surface, and the second suspension cambered surface is correspondingly configured as a convex cambered surface.
In some possible implementations, the suspension air hole has one and is vertically arranged at the bottom of the first suspension cambered surface, and the axial lead of the suspension air hole is coaxially arranged with the circle center of the first suspension cambered surface.
In some possible implementations, the number of the suspension air holes is several, and the axes of the number of the suspension air holes intersect at the center point of the second suspension cambered surface.
In some possible implementations, two opposite sides of the base are respectively formed with an upward protruding limiting portion, the mounting table is located between the two limiting portions, and the limiting portions are provided with guide air holes which are communicated with an external air inlet pipe.
In some possible implementations, two of the guide air holes are coaxially disposed and the axis thereof is disposed horizontally.
In some possible implementations, the base is provided with an air inlet channel, and the suspension air hole and the guide air hole are both communicated with an external air inlet pipe through the air inlet channel.
In some possible implementations, there are two baffles, and the two baffles are disposed at two adjacent ends of the receiving box.
In some possible implementations, the clearance fit tolerance band of the first and second levitation camber ranges from 50 micrometers to 100 micrometers.
The application also provides a silicon wafer receiving system, which comprises the air suspension type receiving device according to the embodiment, and further comprises a control component, a detection component and an air inlet component, wherein the detection component and the air inlet component are in signal connection with the control component, the air inlet component is communicated with the guide air hole, the detection component is used for detecting the blanking position of the silicon wafer and sending detection signals to the control component, and the control component controls the opening and closing of the air inlet component according to the received detection signals so as to adjust the position of the receiving box relative to the silicon wafer.
Compared with the prior art, the application has the beneficial effects that: according to the application, the first suspension cambered surface is arranged on the base, the second suspension cambered surface is correspondingly arranged on the mounting table, the first suspension cambered surface is provided with the suspension air hole, the suspension air hole is used for blowing air to suspend the mounting table on the base, the design ensures that the resistance born by the mounting table during swinging is very small, the receiving box is arranged at the upper end of the mounting table, the receiving box is provided with the baffle plate, and when the silicon wafer moves in a parabolic track and contacts the baffle plate, the receiving box/the mounting table can swing relative to the base so as to absorb most of kinetic energy of the silicon wafer, and when the silicon wafer collides with the baffle plate, the silicon wafer itself only absorbs a small amount of kinetic energy to be converted into internal energy, so that the occurrence rate of abnormal quality problems such as edge breakage, silicon drop and hidden crack of the silicon wafer can be greatly reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is an assembly schematic diagram of an air-floating type material receiving device according to an embodiment of the present application;
FIG. 2 is a top view of an air suspension type material receiving device according to an embodiment of the present application;
FIG. 3 is a schematic cross-sectional view of the direction A in FIG. 2;
fig. 4 is a schematic cross-sectional view of fig. 2 in the direction B.
Reference numerals:
the device comprises a base 100, a first suspension cambered surface 101, a suspension air hole 102, a guide air hole 103, a limiting part 104 and an air inlet channel 105;
a mounting table 200 and a second suspension cambered surface 201;
a receiving box 300 and a baffle 301.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application. The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.
Referring to fig. 1 to 4, an air-floating type material receiving device comprises a base 100, a mounting table 200 and a material receiving box 300, wherein the material receiving box 300 is detachably fixed on the mounting table 200, a material blocking plate 301 protrudes from the upper end of the material receiving box 300, a silicon wafer can move in a parabolic track to fall into the material receiving box 300 and contact the material blocking plate 301 under the driving of an external conveying mechanism, the conveying mechanism can be a horizontally arranged conveyor belt, and the air-floating type material receiving device is positioned at the tail end of the conveyor belt; the application relates to a silicon wafer processing device, which is characterized in that a first suspension cambered surface 101 is formed on the upper end surface of a base 100, at least one suspension air hole 102 is formed on the first suspension cambered surface 101, the suspension air hole 102 is communicated with an external air inlet pipe, one end of the air inlet pipe is also connected with a gas generating device such as an air pump, a second suspension cambered surface 201 matched with the first suspension cambered surface 101 is arranged at the bottom of an installation table 200, the installation table 200 can be arranged on the base 100, at the moment, the second suspension cambered surface 201 can be attached to the first suspension cambered surface 101, the installation table 200 can be lifted up by air blown out from the suspension air hole 102, so that the installation table 200 is suspended on the base 100.
In some possible implementation manners, referring to fig. 1 and 3, the first suspension cambered surface 101 is a concave cambered surface, the second suspension cambered surface 201 is correspondingly provided as a convex cambered surface, the central angle range corresponding to the first suspension cambered surface 101 is 60 ° to 120 °, and the central angle corresponding to the second suspension cambered surface 201 is larger than the central angle of the first suspension cambered surface 101, so that the gas blown out from the suspension air hole 102 can be ensured to stably support and suspend the mounting table 200 in the area between the first suspension cambered surface 101 and the second suspension cambered surface 201.
In some possible implementation manners, referring to fig. 1 and fig. 4, one suspension air hole 102 is provided, the suspension air hole 102 is vertically upwards arranged at the bottom of the first suspension cambered surface 101, the axial line of the suspension air hole 102 is coaxially arranged with the circle center of the first suspension cambered surface 101, further, the axial line of the suspension air hole 102 is vertically arranged, the center of gravity of the mounting table 200 and the center of the second suspension cambered surface 201 are both on the axial line, namely, the center of the first suspension cambered surface 101, the center of the second suspension cambered surface 201 and the center of gravity of the mounting table 200 are both on the axial line of the suspension air hole 102, and by adopting the design, the upper end face of the mounting table 200 can be ensured to be horizontally arranged, and the material receiving box 300/the mounting table 200 can be rotationally reset after being swung by the impact force of a silicon wafer, so that the upper end face of the mounting table 200 is kept horizontal.
In some possible implementation manners, a plurality of suspension air holes 102 are uniformly distributed on the first suspension cambered surface 101, and the axes of all suspension air holes 102 are intersected with the center of the second suspension cambered surface 201, so that the horizontal stability of the mounting table 200 can be increased, after the weight of the mounting table 200 is increased due to the fact that a plurality of silicon wafers are stored on the material receiving box 300, the inertia of the stress swing of the mounting table 200 is also increased, at the moment, the plurality of suspension air holes 102 can properly provide air pressure to ensure that the mounting table 200 is stably suspended on the base 100, and meanwhile, the mounting table 200 can be quickly reset to a horizontal level, namely, after the mounting table 200 slightly swings, the integral center of gravity of the mounting table is deviated from the vertical axis, at the moment, the opening of the corresponding suspension air holes 102 can be controlled to provide a force opposite to the deviation direction for the mounting table 200, so that the inertia of the mounting table 200 is reduced, and the mounting table 200 can be quickly reset to a horizontal position; furthermore, each suspension air hole 102 is independently connected with an external air inlet pipe, and the opening and closing of each suspension air hole 102 can be independently controlled, when the air conditioner is assembled, the air pressure of each suspension air hole 102 can be adjusted so as to finely adjust the position of the mounting table 200 on the base 100, in this way, the problem that the circle center of the second suspension cambered surface 201 and the circle center of the first suspension cambered surface 101 are not coaxial due to machining errors or assembly errors can be eliminated, the mounting table 200 can be ensured to stably suspend on the base 100, and the upper end surface of the mounting table 200 can reach the level.
In some possible implementation manners, referring to fig. 1 and fig. 4, two opposite sides of a base 100 are respectively formed with a limiting part 104 protruding upwards, an installation platform 200 is located between two limiting parts 104, two limiting parts 104 are provided with guide air holes 103, the guide air holes 103 are communicated with an external air inlet pipe, air pressure is applied to the side surfaces of the installation platform 200 through the two guide air holes 103 which are arranged oppositely, so that the relative position of the installation platform 200 on the base 100 is adjusted, in the application, a second suspension cambered surface 201 extends from the bottom surface of the installation platform 200 to two opposite side surfaces, and the other two opposite side surfaces of the installation platform 200 correspond to the two limiting parts 104, so that the installation platform 200 can be completely suspended on the base 100, thereby greatly reducing the resistance of the installation platform 200 when in swinging, and the installation platform 200 can greatly absorb the impact kinetic energy of a silicon wafer through swinging, namely in the process of quick speed reduction, the silicon wafer and a material plate 301 belong to complete inelastic collision, and the kinetic energy conversion of the mode into internal energy can reduce the proportion of the internal energy, and the risk of dropping silicon wafer, silicon wafer quality breakage caused by the absorption of excessive internal energy, and the risk of silicon wafer quality breakage caused by the excessive internal energy absorption is reduced.
In some possible implementations, referring to fig. 4, the two guide air holes 103 are coaxially disposed and have their axes horizontally disposed, in such a way that the guide air holes 103 have only a function of adjusting the horizontal position of the mounting table 200, and are easily adjusted by controlling the output pressure of the guide air holes 103.
In some possible implementation manners, referring to fig. 4, an air inlet channel 105 is provided on the base 100, and the suspension air hole 102 and the guide air hole 103 are both communicated with an external air inlet pipe through the air inlet channel 105, that is, an external gas generating device can meet the air supply requirement of the suspension air hole 102 and the guide air hole 103.
In some possible implementation manners, referring to fig. 1, there are two baffle plates 301, and the baffle plates 301 are separately disposed at two adjacent ends of the receiving box 300, in the present application, the two adjacent baffle plates 301 are used to limit the silicon wafer after it falls into the receiving box 300, so as to reduce the accuracy of the horizontal position of the mounting table 200 relative to the base 100.
In some possible implementations, the clearance fit tolerance zone between the first levitation cambered surface 101 and the second levitation cambered surface 201 is in the range of 50 micrometers to 100 micrometers, so that the center of the first levitation cambered surface 101 and the center of the second levitation cambered surface 201 are ensured to be approximately coaxial within an allowable error range, so as to reduce unnecessary swinging of the mounting table 200 caused by machining errors/assembly errors.
The application also provides a silicon wafer receiving system, which comprises a control component, a detection component, an air inlet component and an air suspension type receiving device as in the embodiment, wherein the control component can adopt a conventional design scheme in the industry, the control component is usually provided with a programmable controller, the detection component can be a photoelectric sensor, the detection component is used for detecting the left and right positions of silicon wafers in a driving belt/parabolic track motion, the air inlet component can be a conventional air pump, the air inlet component is communicated with a guide air hole 103 and applies air pressure to the mounting table 200 through the guide air hole 103 so as to adjust the left and right positions of the mounting table 200/the receiving box 300, the detection component and the air inlet component are in signal connection with the control component, specifically, the detection component detects the left and right positions of the silicon wafers when the silicon wafers are blanked and sends detection signals to the control component, and the control component controls the opening and closing of the air inlet component according to the received detection signals, and the air inlet component applies air pressure to the left side and/or the right side of the mounting table 200 through the guide air hole 103 so as to adjust the left and right positions of the receiving box 300/mounting table 200, and ensure that the silicon wafers fall into the receiving box 300 and/or the silicon wafer receiving box 300 are accurately stacked in the receiving box 300.
The foregoing is merely illustrative of specific embodiments of the present application, and the scope of the present application is not limited thereto, but any changes or substitutions within the technical scope of the present application should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. An air-floating type material receiving device, characterized by comprising:
the base (100) is provided with a first suspension cambered surface (101) at the upper end, at least one suspension air hole (102) is formed in the first suspension cambered surface (101), and the suspension air hole (102) is communicated with an external air inlet pipe;
the bottom of the installation table (200) is provided with a second suspension cambered surface (201), the second suspension cambered surface (201) is matched with the first suspension cambered surface (101), and gas is blown to the second suspension cambered surface (201) from the suspension air hole (102) so that the installation table (200) is suspended on the base (100);
a receiving box (300) arranged on the mounting table (200) and provided with a baffle plate (301);
the silicon wafer makes parabolic track movement to contact the baffle plate (301) and can push the mounting table (200) to swing along with the material receiving box (300) relative to the base (100).
2. An air suspension type material receiving device according to claim 1, wherein the first suspension cambered surface (101) is a concave cambered surface, and the second suspension cambered surface (201) is a convex cambered surface.
3. An air suspension type material receiving device according to claim 2, wherein the suspension air hole (102) is provided with one and is vertically arranged at the bottom of the first suspension cambered surface (101), and the axial lead of the suspension air hole (102) is coaxially arranged with the circle center of the first suspension cambered surface (101).
4. An air suspension type material receiving device according to claim 1, wherein the suspension air holes (102) are several, and the axes of the suspension air holes (102) are intersected at the center point of the second suspension cambered surface (201).
5. An air suspension type material receiving device according to claim 1, wherein two opposite sides of the base (100) are respectively formed with an upward protruding limiting portion (104), the mounting table (200) is located between the two limiting portions (104), the limiting portions (104) are provided with guide air holes (103), and the guide air holes (103) are communicated with an external air inlet pipe.
6. An air-floating stock device according to claim 5, characterized in that two of the pilot holes (103) are coaxially arranged and the axis thereof is arranged horizontally.
7. An air suspension type material receiving device according to claim 5 or 6, wherein an air inlet channel (105) is arranged on the base (100), and the suspension air hole (102) and the guide air hole (103) are both communicated with an external air inlet pipe through the air inlet channel (105).
8. An air-floating type receiving device according to claim 1, wherein there are two baffle plates (301), and two baffle plates (301) are separately arranged at two adjacent ends of the receiving box (300).
9. An air-floating stock attachment according to claim 1, characterized in that the clearance fit tolerance zone of the first (101) and second (201) floating arches is in the range 50 to 100 microns.
10. The silicon wafer receiving system is characterized by comprising the air suspension type receiving device according to any one of claims 5 to 7, and further comprising a control component, a detection component and an air inlet component, wherein the detection component and the air inlet component are in signal connection with the control component, the air inlet component is communicated with the guide air hole (103), the detection component is used for detecting the blanking position of a silicon wafer and sending detection signals to the control component, and the control component controls the opening and closing of the air inlet component according to the received detection signals so as to adjust the position of the receiving box (300) relative to the silicon wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310595166.1A CN116721951B (en) | 2023-05-24 | Air suspension type material receiving device and silicon wafer material receiving system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310595166.1A CN116721951B (en) | 2023-05-24 | Air suspension type material receiving device and silicon wafer material receiving system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116721951A true CN116721951A (en) | 2023-09-08 |
| CN116721951B CN116721951B (en) | 2024-05-03 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009135502A (en) * | 2008-12-03 | 2009-06-18 | Yokogawa Electric Corp | Stage elevating device |
| CN103065995A (en) * | 2011-10-24 | 2013-04-24 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate unloading device and plasma enhanced chemical vapor deposition (PECVD) machine including that |
| CN205211721U (en) * | 2015-12-25 | 2016-05-04 | 安徽银阳光伏科技有限公司 | Carrying box for solar cell wafers |
| CN206532762U (en) * | 2017-03-27 | 2017-09-29 | 徐州中辉光伏科技有限公司 | Solar battery sheet magazine and sintering furnace blanking device |
| CN216054631U (en) * | 2021-06-29 | 2022-03-15 | 东方日升（常州）新能源有限公司 | Silicon wafer suspension carrying platform and silicon wafer transferring mechanism |
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009135502A (en) * | 2008-12-03 | 2009-06-18 | Yokogawa Electric Corp | Stage elevating device |
| CN103065995A (en) * | 2011-10-24 | 2013-04-24 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate unloading device and plasma enhanced chemical vapor deposition (PECVD) machine including that |
| CN205211721U (en) * | 2015-12-25 | 2016-05-04 | 安徽银阳光伏科技有限公司 | Carrying box for solar cell wafers |
| CN206532762U (en) * | 2017-03-27 | 2017-09-29 | 徐州中辉光伏科技有限公司 | Solar battery sheet magazine and sintering furnace blanking device |
| CN216054631U (en) * | 2021-06-29 | 2022-03-15 | 东方日升（常州）新能源有限公司 | Silicon wafer suspension carrying platform and silicon wafer transferring mechanism |
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