CN116716639A - Electroplating solution and electroplating method for gallium-nickel alloy - Google Patents
Electroplating solution and electroplating method for gallium-nickel alloy Download PDFInfo
- Publication number
- CN116716639A CN116716639A CN202310675191.0A CN202310675191A CN116716639A CN 116716639 A CN116716639 A CN 116716639A CN 202310675191 A CN202310675191 A CN 202310675191A CN 116716639 A CN116716639 A CN 116716639A
- Authority
- CN
- China
- Prior art keywords
- electroplating
- gallium
- nickel alloy
- nickel
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 174
- 229910000990 Ni alloy Inorganic materials 0.000 title claims abstract description 100
- AZCFACRUWNEBDG-UHFFFAOYSA-N gallium nickel Chemical compound [Ni].[Ga] AZCFACRUWNEBDG-UHFFFAOYSA-N 0.000 title claims abstract description 97
- 238000000034 method Methods 0.000 title claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000008367 deionised water Substances 0.000 claims abstract description 25
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 25
- 150000002258 gallium Chemical class 0.000 claims abstract description 16
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 16
- 150000002815 nickel Chemical class 0.000 claims abstract description 16
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims abstract description 12
- -1 gallium ions Chemical class 0.000 claims abstract description 12
- 229910001453 nickel ion Inorganic materials 0.000 claims abstract description 12
- 238000007747 plating Methods 0.000 claims description 94
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 229910000373 gallium sulfate Inorganic materials 0.000 claims description 7
- SBDRYJMIQMDXRH-UHFFFAOYSA-N gallium;sulfuric acid Chemical compound [Ga].OS(O)(=O)=O SBDRYJMIQMDXRH-UHFFFAOYSA-N 0.000 claims description 7
- 238000004090 dissolution Methods 0.000 claims description 6
- UPWPDUACHOATKO-UHFFFAOYSA-K gallium trichloride Chemical compound Cl[Ga](Cl)Cl UPWPDUACHOATKO-UHFFFAOYSA-K 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 4
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 239000010955 niobium Substances 0.000 claims description 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- HGGYAQHDNDUIIQ-UHFFFAOYSA-L dichloronickel;hydrate Chemical compound O.Cl[Ni]Cl HGGYAQHDNDUIIQ-UHFFFAOYSA-L 0.000 claims description 3
- CMNGAUGWXGMLDK-UHFFFAOYSA-H digallium;trisulfate;hydrate Chemical compound O.[Ga+3].[Ga+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O CMNGAUGWXGMLDK-UHFFFAOYSA-H 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 3
- LKNLEKUNTUVOML-UHFFFAOYSA-L nickel(2+);sulfate;hydrate Chemical compound O.[Ni+2].[O-]S([O-])(=O)=O LKNLEKUNTUVOML-UHFFFAOYSA-L 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- 238000003756 stirring Methods 0.000 description 17
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000008961 swelling Effects 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- CKHJYUSOUQDYEN-UHFFFAOYSA-N gallium(3+) Chemical compound [Ga+3] CKHJYUSOUQDYEN-UHFFFAOYSA-N 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000002932 luster Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229940053662 nickel sulfate Drugs 0.000 description 3
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 3
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000003002 pH adjusting agent Substances 0.000 description 2
- 238000004876 x-ray fluorescence Methods 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000004846 x-ray emission Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a gallium-nickel alloy electroplating solution and an electroplating method, wherein the gallium-nickel alloy electroplating solution at least comprises the following components: deionized water; gallium salt, wherein the concentration of gallium ions in the electroplating solution is 20g/L-25g/L; and nickel salt, wherein the concentration of nickel ions in the electroplating solution is 6g/L-10g/L; wherein the pH value of the electroplating solution is 1-2. The gallium-nickel alloy electroplating solution and the electroplating method provided by the invention can improve the quality of a gallium-nickel alloy electroplated layer.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to a gallium-nickel alloy electroplating solution and an electroplating method.
Background
The gallium nickel alloy is used as a solid target of the cyclotron, and has the advantages of stable structure, economy and easy preparation. At present, a gallium-nickel alloy solid target is prepared by adopting an electrochemical deposition method, and the plating solution is usually chloride system plating solution or sulfate system plating solution. However, when the gallium-nickel alloy is prepared by using the existing electroplating solution system, the obtained gallium-nickel alloy coating has poor quality, and the gallium-nickel alloy layer which is suitable for the irradiation requirement of the accelerator is difficult to obtain. Namely, the gallium-nickel alloy plating method can not obtain a gallium-nickel alloy plating layer with larger thickness and higher surface quality in a short time, or the formula of the plating solution is complex, and the preparation cost is high.
Disclosure of Invention
In view of the above-described drawbacks of the prior art, an object of the present invention is to provide a gallium-nickel alloy plating solution and a plating method, which can obtain a gallium-nickel alloy plating layer with high gallium ion content and good surface quality, and reduce production cost.
The invention provides a gallium nickel alloy electroplating solution, which at least comprises the following components:
deionized water;
gallium salt, wherein the concentration of gallium ions in the electroplating solution is 20g/L-25g/L; and
nickel salt, wherein the concentration of nickel ions in the electroplating solution is 6g/L-10g/L;
wherein the pH value of the electroplating solution is 1-2.
In some embodiments of the invention, the gallium salt comprises one of gallium sulfate, gallium sulfate hydrate, gallium chloride, or gallium chloride hydrate.
In some embodiments of the invention, the nickel salt comprises one of nickel sulfate, nickel sulfate hydrate, nickel chloride, or nickel chloride hydrate.
The invention also provides a gallium-nickel alloy electroplating method, which adopts the gallium-nickel alloy electroplating solution and at least comprises the following steps:
dissolving gallium salt and nickel salt in deionized water at a dissolution temperature according to a proportion to obtain electroplating solution of the gallium-nickel alloy;
and injecting the electroplating liquid into an electroplating device, controlling the electroplating current to be constant, and obtaining the gallium-nickel alloy at the electroplating temperature.
In some embodiments of the invention, the electroplating device comprises an electroplating anode selected from one of a gold sheet, a platinum sheet, a niobium sheet, or a tantalum sheet.
In some embodiments of the invention, the electroplating device comprises an electroplating cathode selected from one of a copper sheet, a silver sheet, a gold sheet, or a gold-plated copper sheet.
In some embodiments of the invention, the distance between the electroplating anode and the electroplating cathode is 1cm to 6cm.
In some embodiments of the invention, the dissolution temperature is from 40 ℃ to 60 ℃ and the conductivity of the deionized water is less than 0.5us/cm.
In some embodiments of the invention, the plating temperature is from 20 ℃ to 80 ℃.
In some embodiments of the invention, the plating current is constant and the current density of the plating cathode is controlled to be 10mA/cm 2 -40mA/cm 2 。
In summary, the invention provides a gallium-nickel alloy plating solution and a plating method, which can obtain a gallium-nickel alloy plating layer with high gallium ion content and matching with the irradiation requirement of an accelerator, and the gallium-nickel alloy obtained by plating has the advantages of large surface area, high thickness and compact surface, and the surface of the plating layer has no flaws such as cracking and swelling, and has good metallic luster. Meanwhile, the prepared electroplating solution has the advantages of simple formula, no need of electroplating under high temperature, simple preparation method and low preparation cost.
Drawings
FIG. 1 is a schematic diagram of an apparatus for electroplating GaN alloy according to one embodiment.
FIG. 2 is a flow chart of preparing a GaN-Ni alloy electroplated coating according to one embodiment.
FIG. 3 is a view of the surface microscopic morphology of a gallium nickel alloy electroplated layer obtained in one example after 130 x magnification under an optical microscope.
FIG. 4 is a physical view of a GaN-Ni alloy electroplated coating obtained in one embodiment.
Fig. 5 is a surface micro-topography of a gallium-nickel alloy electroplated layer obtained in another example after 130 x magnification under an optical microscope.
Fig. 6 is a physical view of a gallium-nickel alloy electroplated layer obtained in one embodiment.
Description of the reference numerals:
10. an electroplating unit; 20. plating bath; 30. a clamping groove; 40. electroplating an anode; 50. electroplating a cathode; 60. and a stirring unit.
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
It should be understood that the present invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Unless otherwise specified, "%" and "parts" shown in the following examples refer to "% by mass" and "parts by mass", respectively.
The invention provides a gallium-nickel alloy electroplating solution, which comprises deionized water, gallium salt, nickel salt and the like. The electroplating solution and the electroplating method provided by the invention can avoid a great deal of hydrogen evolution of the electroplating cathode in the electroplating process, improve the surface quality of the prepared gallium-nickel alloy electroplated layer, do not limit the temperature of preparing the gallium-nickel alloy electroplated layer by electroplating, can obtain the gallium-nickel alloy electroplated layer with good quality by electroplating at lower temperature or higher temperature, and can be used for preparing gallium-nickel alloys with different gallium contents.
In one embodiment of the present invention, in the plating solution of the gallium-nickel alloy, the gallium salt is selected from one of gallium sulfate, gallium sulfate hydrate, gallium chloride or gallium chloride hydrate, for example, and the gallium salt is dissolved in the plating solution, and the concentration of gallium ions in the plating solution is 20g/L to 25g/L, for example. The nickel salt is selected from, for example, one of nickel sulfate, nickel sulfate hydrate, nickel chloride, or nickel chloride hydrate, and the nickel salt is dissolved in the plating solution, and the concentration of nickel ions in the plating solution is, for example, 6g/L to 10g/L. Meanwhile, the mass ratio of gallium ions to nickel ions in the plating solution is, for example, (2-4.2): 1. The content of gallium ions and nickel ions in the electroplating solution is set to ensure that the content of gallium elements in the gallium-nickel alloy prepared by electroplating is 60% -80%, so as to meet the irradiation requirement of a solid target of the cyclotron.
In one embodiment of the present invention, in the gallium-nickel alloy plating solution, gallium salt, nickel salt, etc. are dissolved in deionized water, for example, to obtain a gallium-nickel alloy plating solution. Wherein the conductivity of deionized water is less than 0.5us/cm, and the pH value of the prepared electroplating solution of the gallium-nickel alloy is 1-2. The obtained plating solution is adjusted in pH by adding a pH adjuster such as sulfuric acid solution, hydrochloric acid solution and concentrated ammonia water, for example, and in this embodiment, the pH adjuster is selected as sulfuric acid solution or hydrochloric acid solution, for example, and the concentrations of the sulfuric acid solution and hydrochloric acid solution are 6mol/L, respectively, for example. The electroplating solution provided by the invention can be used for electroplating, so that a great amount of hydrogen evolution of a cathode in the subsequent electroplating process can be effectively avoided, the defects of cracking, swelling and the like of the surface of the gallium-nickel alloy plating layer are reduced, and the surface quality of the gallium-nickel alloy plating layer is improved. After the pH value is adjusted, deionized water is added for constant volume, for example, so that gallium ions and nickel ions in the electroplating solution are ensured to be within a set range, and the electroplating solution completely submerges the surface of the electrode to be electroplated.
Referring to fig. 1 and 2, the present invention further provides a method for electroplating a gallium-nickel alloy, for example, by using the above-mentioned gallium-nickel alloy electroplating solution, and the gallium-nickel alloy electroplated layer is prepared, for example, by steps S10-S20.
And S10, dissolving gallium salt and nickel salt in deionized water according to a proportion at a dissolution temperature, adjusting the ph value of the solution, and then carrying out constant volume to obtain the electroplating solution of the gallium-nickel alloy.
And step S20, injecting the electroplating solution obtained in the step S10 into an electroplating device, controlling the constant electroplating current, and electroplating for a preset time at the electroplating temperature to prepare the gallium-nickel alloy.
Referring to fig. 1 and 2, in step S10, the gallium salt and the nickel salt are weighed according to the ratio, and dissolved in deionized water with a set volume, and the deionized water with the set volume is, for example, at least 90% of the preset volume of the finally obtained plating solution, so as to avoid excessive pH fluctuation of the plating solution after the subsequent volume fixing. And the gallium salt and the nickel salt are stirred and dissolved, for example, under the condition of water bath or oil bath, so as to ensure that the dissolution temperature of the gallium salt and the nickel salt is 40 ℃ to 60 ℃ for example, and a clear and transparent solution is obtained. And adding a pH regulator, regulating the pH value of the solution to be 1-2, and adding deionized water to fix the volume to obtain the electroplating solution of the gallium-nickel alloy with preset capacity. In this example, the volume of the plating solution of the gallium nickel alloy obtained after the constant volume was 300ml, and the mass ratio of gallium ions to nickel ions in the plating solution was 3.1:1, for example. And in this example, a gallium salt such as anhydrous gallium sulfate is selected, and a nickel salt such as nickel sulfate hexahydrate is selected.
Referring to fig. 1 and 2, in step S20, the electroplating apparatus includes, for example, a plating unit 10, a plating tank 20, a plating cathode 50, a plating anode 40, and a stirring unit 60. The plating tank 20 is, for example, a square tank such as a square or rectangular parallelepiped, and the clamping tank 30 is provided in the plating tank 20, and the distance between adjacent clamping tanks 30 is not limited, and the plating anode 40 and the plating cathode 50 are placed such that the distance between the plating anode 40 and the plating cathode 50 is, for example, 1cm to 6cm. The plating anode 40 and the plating cathode 50 are disposed in the clamping groove 30 of the plating tank 20, for example, and the plating cathode 50 is an electrode to be plated. The shape of the plating anode 40 and the plating cathode 50 is, for example, rectangular, square or other irregular sheet shape, in this embodiment the plating anode 40 and the plating cathode 50 are rectangular, and the area of the electrode to be plated is, for example, 8cm 2 -20cm 2 . In other embodiments, the shape and area of the plating anode 40 and the plating cathode 50 are set, for example, according to actual production conditions. The plating anode 40 is, for example, one of a gold sheet, a platinum sheet, a niobium sheet, a tantalum sheet, or the like, and the plating cathode 50 is, for example, one of a copper sheet, a silver sheet, a gold-plated copper sheet, or the like.
Referring to fig. 1 and 2, in step S20, the stirring unit 60 is configured with a stirring function, such as a stirrer, and the stirring unit 60 is disposed at a middle position of the two clamping tanks 30 in the plating tank 20, and the stirring speed is 300rpm-500rpm, for exampleThe concentration of the electroplating solution is kept uniform everywhere, and the uniform production of the electroplated layer on the electrode to be electroplated and the stable electroplating rate are ensured. The plating unit 10 is disposed outside the plating tank 20, and is connected to the plating anode 40 and the plating cathode 50, for example, and the positive electrode of the plating unit 10 is connected to the plating anode 40, for example, and the negative electrode of the plating unit 10 is connected to the plating cathode 50, for example, for electrolyzing the plating solution. The electroplating unit 10 is one of a DC power supply electroplating platform or an AC power supply electroplating platform, and the current output by the electroplating unit 10 is constant, the range of the electroplating current output by the electroplating unit 10 is controlled to be 380mA-420mA, and the current density of the electroplating cathode 50 is controlled to be 10mA/cm 2 -40mA/cm 2 Thereby ensuring that the thickness of the gallium-nickel alloy electroplated layer prepared by electroplating is uniform and the electroplating rate is stable.
Referring to fig. 1 and 2, in step S20, the plating anode 40 and the plating cathode 50 are installed in the card slot 30 of the plating tank 20, and the plating anode 40 is degreased, and the plating cathode 50 is degreased and surface treated, for example, before plating. After the treatment, for example, deionized water is used for washing and dust-free paper is used for wiping clean the electroplating anode 40 and the electroplating cathode 50, and then the electroplating anode and the electroplating cathode are connected with the positive electrode and the negative electrode of a power supply of the electroplating unit 10, so that the electroplating effect is prevented from being influenced by impurities, and the quality of an electroplated layer is reduced. The gallium nickel alloy plating solution obtained in step S10 is then injected into the electrolytic bath, and the plating solution, for example, completely submerges the electrode surface to be plated, and the stirring unit 60 is installed, for example, at a position intermediate the plating anode 40 and the plating cathode 50. The stirring unit 60 and the electroplating unit 10 are turned on, the preparation of the gallium-nickel alloy electroplated layer is completed at the electroplating temperature and within the electroplating time, and the electroplating bath 20 is placed in a water bath or an oil bath, for example, to ensure that the electroplating temperature is within a set range. In this embodiment, the electrolytic tank is disposed in a water bath, for example, to ensure that the electroplating temperature of the electroplating solution is maintained at 20-80 ℃ and the electroplating time is 2-3 hours, for example, during the electroplating process, so as to complete the preparation of the gallium-nickel alloy electroplated layer. By controlling the electroplating current density and the electroplating liquid formula, the gallium-nickel alloy electroplated layer can be obtained in a shorter time at a lower or higher electroplating temperature, the appearance of the obtained gallium-nickel alloy electroplated layer is optimized, and the thickness and uniformity of the electroplated layer are improved.
Referring to fig. 1 and 2, after plating is completed, the plating cathode 50 is removed, rinsed with deionized water, for example, and wiped clean with dust-free paper, for example, to obtain a plating layer of a gan-ni alloy. The surface area of the obtained gallium-nickel alloy electroplated layer is 8cm 2 -20cm 2 The thickness is, for example, 40 μm to 60. Mu.m. Meanwhile, the components of the gallium-nickel alloy electroplated layer are tested, for example, the components of the gallium-nickel alloy electroplated layer are analyzed through an X-ray fluorescence spectrum, the appearance of the gallium-nickel alloy electroplated layer is observed, and particularly, for example, the appearance of a gallium-nickel alloy electroplated layer is observed, and the surface microscopic appearance is amplified by 130 times under an optical microscope.
The invention will be described in more detail below by introducing specific examples.
Example 1
Step S10, 22.53g of anhydrous gallium sulfate and 10.59g of hydrated nickel sulfate are weighed in a beaker by using an electronic day divider, 280ml of deionized water is added, and the mixture is magnetically stirred until the mixture is completely dissolved in a water bath environment at 40 ℃ to obtain a clear and transparent solution. And regulating the pH value of the solution to 2.0 by using a sulfuric acid solution with the concentration of 6mol/L, and then fixing the volume of the solution to 300ml by using deionized water to obtain the electroplating solution of the gallium-nickel alloy, wherein the concentration of gallium ions in the electroplating solution is 24.49g/L, the concentration of nickel ions is 7.89g/L, and the mass ratio of the gallium ions to the nickel ions is 3.1:1.
Step S20, selecting a platinum sheet as an electroplating anode, selecting a red copper sheet as an electroplating cathode, deoiling the electroplating anode, deoiling and surface treating the electroplating cathode, washing the electroplating anode and the electroplating cathode with deionized water, and wiping the electroplating anode and the electroplating cathode with dust-free test paper. The electroplating anode and the electroplating cathode are arranged in a clamping groove of the electroplating bath, the distance between the two electrodes is 4cm, and the electroplating anode is connected with the anode of the electroplating unit and the electroplating cathode is connected with the cathode of the electroplating unit. And then the electroplating solution of the gallium-nickel alloy obtained in the step S10 is injected into the electrolytic bath, and a stirring unit is arranged in the electrolytic bath. Placing the electrolytic tank in a water area stirring pot, starting an electroplating unit, a water bath pot and a stirring unit, adjusting the stirring rotation speed to 400rpm, keeping the temperature of the water bath pot to be 50 ℃, and electroplating by adopting a constant current electroplating method to obtain a gallium-nickel alloy electroplated layer, wherein the current output of a direct current power supply is 390mA, and the electroplating time is 3 hours. And taking down the electroplating cathode after the electroplating is finished, flushing with deionized water, and wiping cleanly by using dust-free paper to obtain the gallium-nickel alloy coating.
Example 2
And S10, respectively weighing 21.72g of anhydrous gallium sulfate and 10.29g of nickel sulfate hexahydrate in a beaker by using an electronic day, adding 280ml of deionized water, magnetically stirring under a water bath environment of 50 ℃ until the anhydrous gallium sulfate and the nickel sulfate hexahydrate are completely dissolved to obtain a clear and transparent solution, regulating the pH value of the solution to 1.5 by using a sulfuric acid solution with the concentration of 6mol/L, and fixing the volume of the solution to 300ml by using deionized water to obtain the electroplating solution of the gallium-nickel alloy, wherein the concentration of gallium ions in the electroplating solution is 23.61g/L, the concentration of nickel ions is 7.66g/L, and the mass ratio of the gallium ions to the nickel ions is 3.1:1.
Step S20, selecting a niobium sheet as an electroplating anode, selecting a gold-plated copper sheet as an electroplating cathode, and selecting the surface area of the electroplating cathode to be 13cm 2 And (3) degreasing the electroplating anode, degreasing and surface-treating the electroplating cathode, washing the electroplating anode and the electroplating cathode with deionized water, and wiping the electroplating anode and the electroplating cathode with dust-free test paper. The electroplating anode and the electroplating cathode are arranged in a clamping groove of the electroplating bath, the distance between the two electrodes is 6cm, and the electroplating anode is connected with the anode of the electroplating unit and the electroplating cathode is connected with the cathode of the electroplating unit. And then the electroplating solution of the gallium-nickel alloy obtained in the step S10 is injected into the electrolytic bath, and a stirring unit is arranged in the electrolytic bath. Placing the electrolytic tank in a water area stirring pot, starting an electroplating unit, a water bath pot and a stirring unit, regulating the stirring rotation speed to 400rpm, and keeping the temperature of the water bath pot to be 50 ℃. And (3) electroplating by adopting a constant current electroplating method to obtain a gallium-nickel alloy electroplated layer, wherein the current output of a direct current power supply is 400mA, the electroplating time is 3h, the electroplating cathode is taken down after the electroplating is completed, and the gallium-nickel alloy electroplated layer is obtained by flushing with deionized water and wiping clean with dust-free paper.
Examples 1 and 2 an electroplated layer of gallium-nickel alloy was prepared by using the gallium-nickel alloy electroplating solution and the electroplating method provided by the invention, and the components were subjected to an X-ray fluorescence spectrum analysis test, and the test results are shown in table 1. And observing the morphology of the gallium nickel alloy plating layers obtained in example 1 and example 2, fig. 3 and 5 are surface microscopic morphologies of the gallium nickel alloy plating layers obtained in example 1 and example 2, respectively, after 130 times magnification under an optical microscope, and fig. 4 and 6 are physical photographs of the gallium nickel alloy plating layers obtained in example 1 and example 2, respectively.
As shown in table 1, the composition of the gallium-nickel alloy plating layer in example 1 prepared by X-ray fluorescence spectroscopy was 67% in gallium element, 27.29% in nickel element, 5.64% in copper element, 0.05% in aluminum element, and 0.02% in silicon element. The gallium-nickel alloy electroplated layer prepared by the method has the gallium content of 65% -75%, can be used for a solid target of a cyclotron, has low impurity element content, and improves the quality of the electroplated layer.
Referring to fig. 3 to 6, fig. 3 and 4 are surface micro-morphology and physical photographs of the gallium-nickel alloy plating layer obtained in example 1 after 130 times magnification under an optical microscope, and fig. 5 and 6 are surface micro-morphology and physical photographs of the gallium-nickel alloy plating layer obtained in example 2 after 130 times magnification under an optical microscope. Wherein the areas and thicknesses of the gallium-nickel alloy plating layers obtained in examples 1 and 2 were measured, and the area of the gallium-nickel alloy plating layer obtained in example 1 was 15cm 2 And a thickness of 50 μm, the area of the gallium nickel alloy plating layer obtained in example 2 was 15cm 2 And a thickness of 55 μm. The obtained electroplated layer is observed, and the observed electroplated layer has no obvious flaws on the surface and has good metallic luster. The gallium-nickel alloy electroplated layer obtained by the method can be obtained in a short time, has a large area and a large thickness, has compact and smooth surface, has no flaws such as cracking and swelling, improves the quality of the gallium-nickel alloy electroplated layer, and reduces the electroplating cost.
In summary, the invention provides a gallium-nickel alloy plating solution and a plating method, and the gallium-nickel alloy plating layer with the gallium ion content of about 70% and the impurity content of less and matching the irradiation requirement of an accelerator can be obtained by adjusting the proportion of the gallium-nickel alloy plating solution. By matching with the constant current electroplating device, the electroplating current, the electroplating temperature and the electroplating time are controlled, flaws such as cracking and swelling of the surface of the electroplated layer can be avoided, the surface density and the metallic luster of the obtained gallium-nickel alloy electroplated layer are improved, and the preparation cost of the gallium-nickel alloy is reduced.
The preferred embodiments of the invention disclosed above are intended only to assist in the explanation of the invention. The preferred embodiments are not exhaustive or to limit the invention to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The invention is limited only by the claims and the full scope and equivalents thereof.
Claims (10)
1. A plating solution for a gallium nickel alloy, comprising at least:
deionized water;
gallium salt, wherein the concentration of gallium ions in the electroplating solution is 20g/L-25g/L; and
nickel salt, wherein the concentration of nickel ions in the electroplating solution is 6g/L-10g/L;
wherein the pH value of the electroplating solution is 1-2.
2. The plating solution of a gallium nickel alloy according to claim 1, wherein the gallium salt comprises one of gallium sulfate, gallium sulfate hydrate, gallium chloride, or gallium chloride hydrate.
3. The plating solution of a gallium nickel alloy according to claim 1, wherein the nickel salt comprises one of nickel sulfate, nickel sulfate hydrate, nickel chloride, or nickel chloride hydrate.
4. A method for electroplating a gallium-nickel alloy, characterized in that the gallium-nickel alloy electroplating solution according to any one of claims 1-3 is used, comprising at least the following steps:
dissolving gallium salt and nickel salt in deionized water at a dissolution temperature according to a proportion to obtain electroplating solution of the gallium-nickel alloy;
and injecting the electroplating liquid into an electroplating device, controlling the electroplating current to be constant, and obtaining the gallium-nickel alloy at the electroplating temperature.
5. The method of electroplating a gallium nickel alloy according to claim 4, wherein the electroplating device comprises an electroplating anode selected from one of a gold sheet, a platinum sheet, a niobium sheet, or a tantalum sheet.
6. The method of electroplating a gallium nickel alloy according to claim 5, wherein the electroplating device comprises an electroplating cathode selected from one of a copper sheet, a silver sheet, a gold sheet, or a gold-plated copper sheet.
7. The method of electroplating a gallium nickel alloy according to claim 6, wherein the distance between the electroplating anode and the electroplating cathode is 1cm to 6cm.
8. The method of electroplating of a gallium nickel alloy according to claim 4, wherein the dissolution temperature is 40 ℃ to 60 ℃ and the electrical conductivity of the deionized water is less than 0.5us/cm.
9. The method of electroplating of a gallium nickel alloy according to claim 4, wherein the electroplating temperature is 20 ℃ to 80 ℃.
10. The method for electroplating a gallium-nickel alloy according to claim 6, wherein the electroplating current is constant and the current density of the electroplating cathode is controlled to be 10mA/cm 2 -40mA/cm 2 。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310675191.0A CN116716639A (en) | 2023-06-08 | 2023-06-08 | Electroplating solution and electroplating method for gallium-nickel alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310675191.0A CN116716639A (en) | 2023-06-08 | 2023-06-08 | Electroplating solution and electroplating method for gallium-nickel alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116716639A true CN116716639A (en) | 2023-09-08 |
Family
ID=87864099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310675191.0A Pending CN116716639A (en) | 2023-06-08 | 2023-06-08 | Electroplating solution and electroplating method for gallium-nickel alloy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116716639A (en) |
-
2023
- 2023-06-08 CN CN202310675191.0A patent/CN116716639A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009545669A (en) | Method of depositing chromium layer as hard chromium plating, electroplating bath, and hard chromium surface layer | |
| Peng et al. | Effects of electrodeposited Zn nuclei on tunnel etching behavior of aluminum foil | |
| CN112981474A (en) | High-strength copper foil and preparation method thereof | |
| Vaghefinazari et al. | Exploring the effect of sodium salt of Ethylenediaminetetraacetic acid as an electrolyte additive on electrochemical behavior of a commercially pure Mg in primary Mg-air batteries | |
| Sandnes et al. | Equi-axed grain formation in electrodeposited Sn-Bi | |
| CN116716639A (en) | Electroplating solution and electroplating method for gallium-nickel alloy | |
| CN104928735A (en) | Steel part cyanide-free electroplating tin bronze electroplating liquid and preparation method thereof | |
| CN112176366A (en) | Electrolyte of high-ductility electrolytic copper foil and application | |
| WO2009044266A2 (en) | System and method of plating metal alloys by using galvanic technology | |
| US4734175A (en) | Process for regenerating an electroless copper plating bath | |
| Török et al. | Direct cathodic deposition of copper on steel wires from pyrophosphate baths | |
| TWI451003B (en) | Nickel ph adjustment method and apparatus | |
| CN104264195A (en) | Mercaptoiminazole cyanide-free gold-electroplating solution and electroplating method thereof | |
| CN105274588A (en) | Succinimide cyanogen-free monovalent copper plating electroplating liquid and electroplating method thereof | |
| RU2549037C2 (en) | Method of surface preparation of stainless steel items prior to galvanic copperplating | |
| Ni et al. | Effect of sodium citrate on electrochemical behaviour of copper in acid bath | |
| Delplancke et al. | Growth of electrodeposited copper on anodized titanium | |
| Mamyrbekova et al. | Production of copper powders from water dimethylsulphoxide electrolytes | |
| Zemanová et al. | Pulse nickel electrolytic colouring process of anodised aluminium | |
| Abdelillah et al. | Tin Electrodeposition from Sulfuric Acid Solution Containing Nigella Sativa Essential Oil Added. | |
| CN109321955A (en) | A kind of electrodeposition of Fe-Zn alloy electroplating bath | |
| CN105316719A (en) | Electroplate liquid and electroplate method for cyanide-free gold plating of thallium-contained sulfite | |
| US6103088A (en) | Process for preparing bismuth compounds | |
| White | The electrolytic corrosion of some metals | |
| RU2813428C1 (en) | Method of processing titanium and its alloys |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |