CN116711215A

CN116711215A - Acoustic wave filter packaging structure, manufacturing method thereof and electronic equipment

Info

Publication number: CN116711215A
Application number: CN202180088167.6A
Authority: CN
Inventors: 陈建桦; 林来存; 张珊; 刘国文
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-05-24
Filing date: 2021-05-24
Publication date: 2023-09-05
Also published as: WO2022246601A1

Abstract

The application relates to an acoustic wave filter packaging structure, a manufacturing method thereof and electronic equipment. The package structure includes: the sound wave filter encapsulation module, sound wave filter encapsulation module includes: the first plastic layer, a plurality of acoustic wave filters, a first protective layer and a rewiring layer; the first plastic layer at least partially wraps each acoustic wave filter, and a plurality of first bumps on the first surface of each acoustic wave filter are exposed out of the first plastic layer; the first protection layer covers the first surface of the first plastic sealing layer, and first through holes are respectively arranged in the first protection layer at positions corresponding to each first bump; the rewiring layer is arranged on one surface, far away from the first plastic sealing layer, of the first protection layer, and the rewiring layer is electrically connected with each first bump through a plurality of first through holes. The acoustic wave filter in the packaging structure has high film pressure resistance and good structural stability, the yield and efficiency controllability of the packaging structure are improved, the thickness and the size are reduced, and the integration requirement of electronic equipment with smaller size can be met.

Description

Acoustic wave filter packaging structure, manufacturing method thereof and electronic equipment

Technical Field

The present application relates to the field of acoustic wave filtering technologies, and in particular, to an acoustic wave filter packaging structure, a manufacturing method thereof, and an electronic device.

Background

Acoustic wave filters (e.g., surface acoustic wave filter (surface acoustic wave filter), bulk acoustic wave filter (bulk acoustic wave filter), etc.) are commonly used in electronic devices such as smartphones. In the related art, a plurality of acoustic wave filters required by an electronic device are firstly mounted on a substrate, then are encapsulated into an acoustic wave filter packaging structure, and finally the acoustic wave filter packaging structure is mounted in the electronic device. An acoustic wave filter package structure 1 in the related art, for example, shown in fig. 1, includes a plurality of acoustic wave filters 100, an auxiliary device 20, a molding layer 41, a substrate 31, and a plurality of third bumps 50. The substrate 31 has a first face and a second face disposed opposite to each other. The plurality of acoustic wave filters 100 and the auxiliary device 20 are mounted on the first surface of the substrate 31, and the plurality of third bumps 50 are disposed on the second surface of the substrate 31. A plastic layer 41 encapsulates at least the plurality of acoustic wave filters 100 and the auxiliary device 20 (e.g., passive device, etc.). Wherein the substrate 31 is a multi-layer board. The substrate 31 includes a wiring layer 31-1, a core board 31-2, and a dielectric protective layer 31-3. The opposite first and second sides of the core board 31-2 are each provided with a re-wiring layer, each including at least one wiring layer 31-1, and a dielectric protective layer 31-3 for insulation surrounding the wiring layer 31-1. In order to realize high-density interconnection between a plurality of acoustic wave filters and each device in the auxiliary devices in the acoustic wave filter packaging structure 1, a rewiring process is required to be performed in the substrate 31 by utilizing a rewiring layer (Redistribution Layer, RDL) process, which results in that at least 7 layers of wiring layers 31-1 are arranged in the whole substrate 31, so that the thickness and the size of the acoustic wave filter packaging structure 1 are large, a large space is required to be provided in electronic equipment to realize the installation of the acoustic wave filter packaging structure 1, the installation and integration requirements of small-size electronic equipment cannot be met, and the performance controllability of the acoustic wave filter packaging structure 1 is also adversely affected. In addition, because the acoustic wave filters 100 have the acoustic wave filters with cavities formed by using dry films, the surface of the acoustic wave filters is relatively fragile, and the plastic package pressure of the plastic package layer 41 is limited, so that the film pressure resistance and the structural stability of the acoustic wave filters in the manufactured acoustic wave filter package structure 1 are poor. In addition, in the manufacturing process of the acoustic wave filter packaging structure 1, each acoustic wave filter and each auxiliary device are required to be respectively mounted on a substrate, so that the yield and the efficiency controllability of the device are adversely affected. How to solve the problems of the acoustic wave filter packaging structure in the related art is currently in need of solving.

Disclosure of Invention

In view of the above, an acoustic wave filter package structure, a method for manufacturing the same, and an electronic device are provided to solve the above problems.

In a first aspect, an embodiment of the present application provides an acoustic wave filter package structure, including an acoustic wave filter package module, the acoustic wave filter package module including: the first plastic layer, a plurality of acoustic wave filters, a first protective layer and a rewiring layer;

the first plastic sealing layer at least partially wraps each acoustic wave filter, and a plurality of first bumps on the first surface of each acoustic wave filter are exposed out of the first plastic sealing layer;

the first protection layer covers the first surface of the first plastic sealing layer, and first through holes are respectively formed in the first protection layer at positions corresponding to the first bumps;

the rewiring layer is arranged on one surface, far away from the first plastic sealing layer, of the first protection layer, and the rewiring layer is electrically connected with each first bump through the plurality of first through holes.

In one possible implementation, the acoustic wave filter package structure further includes: the device comprises a passive device, a second plastic sealing layer and a substrate;

The acoustic wave filter packaging module and the passive device are welded and fixed on the substrate, and the acoustic wave filter module and the passive device are electrically connected with the substrate;

the second plastic layer at least partially wraps the acoustic wave filter packaging module and the passive device, and part of the surfaces of the pins of the passive device and the second bumps of the acoustic wave filter packaging module are exposed out of the second plastic layer.

In this way, in the acoustic wave filter packaging structure, the plurality of acoustic wave filters are integrated together to form the acoustic wave filter packaging module, and each acoustic wave filter is packaged in the acoustic wave filter packaging module by the first plastic sealing layer, so that the acoustic wave filter packaging module comprising the plurality of acoustic wave filters can be fixedly mounted on the substrate at one time when the acoustic wave filter packaging structure is manufactured, and compared with the prior art, the acoustic wave filter packaging structure has the advantages that each acoustic wave filter is respectively mounted and fixed on the substrate, and the yield and efficiency controllability of the acoustic wave filter packaging structure can be improved. And because the high-density interconnection among a plurality of acoustic wave filters is realized through the rewiring layer in the acoustic wave filter packaging module, the number of layers of the wiring layer in the substrate of the acoustic wave filter packaging structure can be reduced, the thickness and the size of the substrate are reduced, the thickness and the size of the acoustic wave filter packaging structure are reduced, the installation and integration requirements of electronic equipment with smaller size can be met, and the application range of the acoustic wave filter packaging structure is enlarged.

And, because install the acoustic wave filter encapsulation module on the base plate and carry out plastic packaging again and form final acoustic wave filter packaging structure, the plastic packaging pressure that each acoustic wave filter that has been wrapped up by first plastic envelope can be improved by showing, can high pressure plastic packaging form acoustic wave filter packaging structure for the membrane pressure resistance of acoustic wave filter in the acoustic wave filter packaging structure can be improved, structural stability also makes the efficiency controllability of acoustic wave filter packaging structure obtain further promotion.

In one possible implementation, the rewiring layer includes: each dielectric protection layer is used for at least partially wrapping a corresponding layer of wiring layer, one surface, close to the acoustic wave filters, of each wiring layer is exposed out of the dielectric protection layer, and a plurality of second through holes electrically connected with the wrapped wiring layer are formed in each dielectric protection layer.

Therefore, the number of wiring layers of the rewiring layer in the acoustic wave filter packaging module can be set according to the number of acoustic wave filters in the acoustic wave filter packaging structure and the interconnection requirement between the acoustic wave filters, the higher the number of the acoustic wave filters and the interconnection requirement, the more the number of the wiring layers of the rewiring layer can be set, the high-density interconnection among a plurality of acoustic wave filters is guaranteed, so that the number of the wiring layers in a substrate of the acoustic wave filter packaging structure is reduced, the thickness and the size of the substrate can be reduced, and the thickness and the size of the acoustic wave filter packaging structure are further reduced. And one side of each wiring layer close to the plurality of acoustic wave filters is exposed with a dielectric protection layer, and the exposed wiring can be used for directly conducting electric connection between the wiring layers, so that the thickness and the size of the acoustic wave filter packaging module are reduced.

In one possible implementation, the re-wiring layer includes a first wiring layer and a first dielectric protection layer;

the first wiring layer covers one surface of the first protection layer, which is far away from the first plastic sealing layer, and wiring in the first wiring layer is respectively and electrically connected with each first bump through the plurality of first through holes;

the first dielectric protection layer is used for at least partially wrapping the first wiring layer, one surface of the first wiring layer, which is close to the first protection layer, is exposed out of the first dielectric protection layer, and the first dielectric protection layer is provided with a plurality of second through holes which are electrically connected with the wirings in the first wiring layer.

In one possible implementation, the re-wiring layer further includes a second wiring layer and a second dielectric protection layer;

the second wiring layer covers one surface of the first dielectric protection layer, which is far away from the first wiring layer, and the wiring in the second wiring layer is electrically connected with the wiring in the first wiring layer through a plurality of second through holes in the first dielectric protection layer;

the second dielectric protection layer is used for at least partially wrapping the second wiring layer, one surface of the second wiring layer, which is close to the first dielectric protection layer, is exposed out of the second dielectric protection layer, and a plurality of second through holes electrically connected with the wirings in the second wiring layer are arranged in the second dielectric protection layer.

Thus, high-density interconnection between a plurality of acoustic wave filters can be achieved with reference to the above-described structural arrangement of the acoustic wave filter package module including the number of different wiring layers.

In one possible implementation, the acoustic wave filter package structure further includes an inductor, and the wiring in the rewiring layer is further used to form the inductor. Since the acoustic wave filter package structure 1 (see fig. 1) in the related art includes a plurality of acoustic wave filters and a plurality of auxiliary devices, there is a difference in operating voltage, current, etc. of different devices, electromagnetic interference will exist between the devices, and the device itself will be affected by external electromagnetic interference, noise, etc., so that it is necessary to refer to the difference between different devices, the electromagnetic interference between the devices, the adverse effect of external influence, etc. on the circuit of the acoustic wave filter package structure 1, and the setting of the inductance is achieved by setting the inductance to reduce or avoid these adverse effects, but the thickness and size of the substrate will be increased in this way. In the application, at least one rewiring layer in the acoustic wave filter packaging module is utilized to form the whole acoustic wave filter packaging structure or the inductance required by the acoustic wave filter packaging module, so that the size and the thickness of the first substrate in the acoustic wave filter packaging structure with the acoustic wave filter packaging module can be reduced instead of the scheme of arranging the inductance in the substrate in the prior art, and the thickness and the size of the whole acoustic wave filter packaging structure are further reduced.

In one possible implementation, a second surface of at least one of the acoustic wave filters, disposed opposite the first surface, is exposed to the first plastic layer. Therefore, the thickness of the first plastic sealing layer is reduced, and the thickness and the size of the acoustic wave filter packaging module can be reduced.

In a second aspect, an embodiment of the present application provides an electronic device, including:

an acoustic wave filter package structure as in the first aspect and any one of its possible implementations; and

and the Printed Circuit Board (PCB) is electrically connected with the sound wave filter packaging structure.

The thickness and the size of the electronic equipment can be reduced due to the small thickness and the small size of the packaging structure of the acoustic wave filter. And the film pressure resistance and the structural stability of the acoustic wave filter in the acoustic wave filter packaging structure are improved due to the good film pressure resistance and the good structural stability of the acoustic wave filter.

In a third aspect, an embodiment of the present application provides a method for manufacturing an acoustic wave filter package structure including an acoustic wave filter package module, the method including:

Temporarily bonding a plurality of acoustic wave filters to a carrier wafer;

molding the plurality of acoustic wave filters to form a first molding layer for at least partially wrapping each of the acoustic wave filters, so that a plurality of first bumps on a first surface of each of the acoustic wave filters are exposed out of the first molding layer;

peeling the plurality of acoustic wave filters and the first plastic layer from the carrier wafer;

forming a first protection layer on the first surface of the first plastic sealing layer, which is exposed out of each acoustic wave filter, and forming a first via hole in the first protection layer at a position corresponding to each first bump;

and forming a rewiring layer on one surface of the first protective layer, which is far away from the first plastic sealing layer, and enabling wiring in the rewiring layer to be respectively and electrically connected with each first bump through the plurality of first through holes to obtain the acoustic wave filter packaging module.

In one possible implementation, the method further includes:

welding and fixing the acoustic wave filter packaging module and the passive device on a pre-prepared substrate so as to electrically connect the acoustic wave filter packaging module and the passive device with the substrate;

And at least carrying out plastic packaging on the acoustic wave filter packaging module and the passive device to form a second plastic packaging layer for at least partially packaging the acoustic wave filter packaging module and the exposed surface of the passive device, thereby obtaining the acoustic wave filter packaging structure.

The manufacturing method of the acoustic wave filter packaging structure provided by the application can manufacture the acoustic wave filter packaging structure by utilizing a simple and easy-to-realize process flow. And after the plurality of acoustic wave filters are temporarily bonded to the carrier wafer, the thickness and the size of the acoustic wave filter packaging module can be further reduced by plastic packaging, and after the plurality of acoustic wave filters are plastic packaged, the first protective layer and the rewiring layer are directly formed on the first plastic packaging layer in sequence, so that the direct preparation of each layer in the acoustic wave filter packaging module is realized, and the thickness and the size of the acoustic wave filter packaging module can be reduced.

In addition, the acoustic wave filter packaging module comprising a plurality of acoustic wave filters can be fixedly arranged on the substrate at one time, and compared with the prior art that each acoustic wave filter is respectively arranged and fixed on the substrate, the yield and the efficiency controllability of the acoustic wave filter packaging structure can be improved. The final acoustic wave filter packaging structure is formed by mounting the acoustic wave filter packaging module on the substrate and then performing plastic packaging, so that the plastic packaging pressure born by each acoustic wave filter wrapped by the first plastic packaging layer is obviously improved, the acoustic wave filter packaging structure can be formed by high-pressure plastic packaging, the film pressure resistance and the structural stability of the acoustic wave filter in the acoustic wave filter packaging structure are improved, and the efficiency controllability of the acoustic wave filter packaging structure is further improved.

wherein, the one side that is kept away from at first protective layer forms the rewiring layer, and makes wiring in the rewiring layer pass through a plurality of first via holes and every first lug is electric connection respectively, includes:

forming a first wiring layer on one surface of the first protection layer, which is far away from the first plastic sealing layer, and enabling wiring in the first wiring layer to be electrically connected to each first bump through the first through holes;

and forming a first dielectric protection layer used for wrapping the exposed surface of the first wiring layer on one surface of the first protection layer, which is far away from the first plastic sealing layer, and forming a plurality of second through holes in the first dielectric protection layer, wherein the second through holes are electrically connected with the wiring in the first wiring layer.

wherein, the one side that is kept away from at first protective layer forms the rewiring layer, and makes wiring in the rewiring layer pass through a plurality of first via holes and every first lug is electric connection respectively still includes:

forming a second wiring layer on one surface of the first dielectric protection layer away from the first wiring layer, and enabling the wiring in the second wiring layer to be electrically connected with the wiring in the first wiring layer through a plurality of second through holes in the first dielectric protection layer;

forming a second dielectric protection layer on one surface of the first dielectric protection layer away from the first wiring layer for wrapping the exposed surface of the second wiring layer, and forming a plurality of second through holes in the second dielectric layer, wherein the second through holes are electrically connected with the wirings in the second wiring layer.

Therefore, after the number of the wiring layers is determined based on the number of the acoustic wave filters in the acoustic wave filter packaging structure and the interconnection requirement among the acoustic wave filters, the manufacturing process of the acoustic wave filter packaging module comprising the first wiring layer and the second wiring layer can be referred to for manufacturing the acoustic wave filter packaging module comprising the wiring layers with different numbers of layers, so that the manufacturing of the acoustic wave filter packaging structure is realized.

In one possible implementation, the method further includes: and thinning the first plastic sealing layer and/or the second plastic sealing layer. Therefore, the thickness of the first plastic sealing layer can be reduced, and the thickness and the size of the acoustic wave filter packaging structure can be further reduced. The thickness and the size of the packaging structure of the acoustic wave filter can be reduced by thinning the second plastic sealing layer

In one possible implementation manner, forming a redistribution layer on a side of the first protection layer away from the first molding layer, and electrically connecting wires in the redistribution layer with each of the first bumps through the plurality of first vias, respectively, including:

and forming a re-wiring layer on one surface of the first protective layer, which is far away from the first plastic sealing layer, enabling wiring in the re-wiring layer to be respectively and electrically connected with each first bump through the plurality of first through holes, and forming the inductance of the acoustic wave filter packaging structure by utilizing the wiring in the re-wiring layer. Thus, after determining the required inductance based on the acoustic wave filter package structure, the inductance can be formed while providing a rewiring layer to achieve high-density interconnection between a plurality of acoustic wave filters. The size and thickness of the substrate in the acoustic wave filter packaging structure can be reduced, and the thickness and size of the whole acoustic wave filter packaging structure can be further reduced.

Other features and aspects of the present application will become apparent from the following detailed description of exemplary embodiments, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate exemplary embodiments, features and aspects of the application and together with the description, serve to explain the principles of the application.

Fig. 1 shows a schematic structural diagram of an acoustic wave filter package structure in the related art.

Fig. 2 and 3 are schematic structural diagrams of an acoustic wave filter package module according to an embodiment of the application.

Fig. 4 shows a schematic structural diagram of an acoustic wave filter package structure according to an embodiment of the present application.

Fig. 5 is a flow chart illustrating a method for manufacturing an acoustic wave filter package according to an embodiment of the present application.

Fig. 6 shows a schematic structural diagram of an electronic device according to an embodiment of the present application.

Reference numerals illustrate:

1 an acoustic wave filter packaging structure in the related art;

2 the acoustic wave filter packaging structure in the application; 10. 10' an acoustic wave filter packaging module;

a 100 acoustic wave filter; 101 a first bump; 102 die; 103 structural members; 104 sealing the cavity;

20 passive devices; 21 pins;

41 plastic sealing layer; 300 a first plastic sealing layer; 40 a second plastic sealing layer;

31. A 30 substrate; 31-1, 30-1 wiring layers in the substrate; 30-2, 31-2 core plates; 30-3, 31-3 dielectric protective layers in the substrate;

400 a first protective layer; k1 first via;

500 rewiring layers; 511 a first dielectric protective layer; 512 a first wiring layer; 521 a second dielectric protective layer; 522 a second wiring layer; k2 second via holes;

600 second bumps; and 50 third bump.

Detailed Description

Various exemplary embodiments, features and aspects of the application will be described in detail below with reference to the drawings. In the drawings, like reference numbers indicate identical or functionally similar elements. Although various aspects of the embodiments are illustrated in the accompanying drawings, the drawings are not necessarily drawn to scale unless specifically indicated.

The word "exemplary" is used herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.

In addition, numerous specific details are set forth in the following description in order to provide a better illustration of the application. It will be understood by those skilled in the art that the present application may be practiced without some of these specific details. In some instances, well known methods, procedures, components, and circuits have not been described in detail so as not to obscure the present application.

In order to solve the problems of the acoustic wave filter packaging structure in the related art, the application provides an acoustic wave filter packaging structure, a manufacturing method thereof and electronic equipment. Fig. 2 and 3 are schematic structural diagrams of an acoustic wave filter package module according to an embodiment of the application. Fig. 4 shows a schematic structural diagram of an acoustic wave filter package structure according to an embodiment of the present application. The acoustic wave filter package modules 10, 10 'shown in fig. 2 and 3 are different in that the redistribution layer 500 in the acoustic wave filter package modules 10, 10' has a different structure. The acoustic wave filter package structure 2 shown in fig. 4 is provided with the acoustic wave filter package module 10' shown in fig. 3 (or the acoustic wave filter package module 10 shown in fig. 2).

As shown in fig. 2 and 3, each of the acoustic wave filter package modules 10 and 10' includes a first molding layer 300, a plurality of acoustic wave filters 100, a first protection layer 400, and a redistribution layer 500.

As shown in fig. 2 and 3, each acoustic wave filter 100 includes: the die 102, a structural member 103 disposed on one surface of the die 102, and a plurality of first bumps 101 disposed on a first surface S1 of the acoustic wave filter 100, wherein a sealed cavity 104 is formed inside the structural member 103, and the first surface S1 of the acoustic wave filter 100 is a surface of the structural member 103 away from the die 102. The acoustic wave filters may be surface acoustic wave filters, bulk acoustic wave filters, or the like for realizing acoustic wave filtering. The thickness and the dimensions of the plurality of acoustic wave filters may be the same, may not be the same, or may be different, and the present application is not limited thereto.

As shown in fig. 2 and 3, the first molding layer 300 at least partially encapsulates each acoustic wave filter 100, and the plurality of first bumps 101 on the first surface S1 of each acoustic wave filter 100 are exposed out of the first molding layer 300. The first protection layer 400 covers the first surface of the first plastic layer 300, and the first protection layer 400 is provided with first vias K1 corresponding to the positions of each first bump 101. The redistribution layer is disposed on a surface of the first protection layer 400 away from the first plastic sealing layer 300, and the plurality of first vias K1 of the redistribution layer are electrically connected to each of the first bumps 101.

As shown in fig. 2 and 3, the acoustic wave filter package modules 10 and 10' further include a plurality of second bumps 600. The second bumps 600 are disposed on a surface of the redistribution layer away from the first protection layer 400, and are electrically connected to the wirings in the second redistribution layer. The second bump 600 may be a copper pillar, a solder ball, or the like, so that the acoustic wave filter package module 10, 10' may be electrically connected to the substrate 30 through the plurality of second bumps 600.

In one possible implementation, as shown in fig. 4, the acoustic wave filter package structure 2 includes the above-described acoustic wave filter package module 10' (or acoustic wave filter package module 10), the passive device 20, the second molding layer 40, and the substrate 30.

The acoustic wave filter package module 10 'and the passive device 20 are soldered on the substrate 30, and the acoustic wave filter package module 10' and the passive device 20 are electrically connected to the substrate 30. The second molding layer 40 at least partially encapsulates the acoustic wave filter package module 10 'and the passive device 20, and a portion of the surface of the plurality of pins 21 of the passive device 20, and the plurality of second bumps 600 of the acoustic wave filter package module 10' are exposed to the second molding layer 40.

The passive device 20 may be a passive device such as a resistor, a capacitor, or the like, and the passive devices may be integrated together by a low temperature co-fired Ceramic (LTCC) technology. The acoustic wave filter package 2 may further include a power amplifier, a low noise amplifier, etc. as active devices for performing the functions of the acoustic wave filter package 2, the active devices also being electrically connected to the substrate 30.

As shown in fig. 4, the substrate 30 includes a wiring layer 30-1, a core board 30-2, and a dielectric protection layer 30-3. The opposite first and/or second sides of the core 31-2 may also be provided with re-wiring layers, each comprising at least one wiring layer 30-1 and a dielectric protective layer 30-3 for insulation surrounding the wiring layer 30-1. The substrate 30 is further provided with a plurality of third bumps 50. Each third bump 50 is electrically connected to a wiring in the wiring layer 30-1 in the substrate 30.

According to the acoustic wave filter packaging structure 2 provided by the application, the plurality of acoustic wave filters 100 are integrated in one acoustic wave filter packaging module, and each acoustic wave filter 100 is wrapped by the first plastic layer 300 in the acoustic wave filter packaging module, so that the acoustic wave filter packaging structure 2 can be fixedly arranged on the substrate 30 at one time when the acoustic wave filter packaging structure 2 is manufactured, and compared with the prior art that each acoustic wave filter is respectively arranged and fixed on the substrate, the yield and efficiency controllability of the acoustic wave filter packaging structure 2 can be improved.

And because the high-density interconnection among a plurality of acoustic wave filters 100 is realized through the rewiring layer in the acoustic wave filter packaging module, the interconnection between the acoustic wave filter packaging module and the passive device 20 is only required to be realized in the substrate for manufacturing the acoustic wave filter packaging structure 2, the number of layers of the wiring layer 30-1 in the substrate 30 can be reduced, the thickness and the size of the substrate 30 are reduced, the thickness and the size of the acoustic wave filter packaging structure 2 are reduced, the installation and integration requirements of smaller-size electronic equipment can be met, and the application range of the acoustic wave filter packaging structure 2 is enlarged. The acoustic wave filter package structure 1 in the related art in fig. 1 requires at least 7 layers of the substrate 31, and has a thickness h2 of at least 350 μm, in order to meet the device arrangement requirements. The thickness h1 of the substrate 30 of the acoustic wave filter package structure 2 of the present application as shown in fig. 4 may be 175 μm to 225 μm, and thus the thickness and size of the acoustic wave filter package structure 2 of the present application as shown in fig. 4 can be reduced.

In addition, as the plastic package pressure born by each acoustic wave filter 100 wrapped by the first plastic package layer 300 is obviously improved, the acoustic wave filter package module is mounted on the substrate 30, and the second plastic package layer 40 can be formed by high-pressure plastic package, so that the acoustic wave filter package structure 2 is finally obtained, the film pressure resistance and the structural stability of the acoustic wave filter 100 in the acoustic wave filter package structure 2 are improved, and the performance controllability of the acoustic wave filter package structure 2 is further improved.

In one possible implementation, a second surface S2 of at least one acoustic wave filter 100 of the plurality of acoustic wave filters 100, which is disposed opposite to the first surface S1, is exposed to the first molding layer 300. If the second surface S2 of each acoustic wave filter 100 is at the same level, the second surface S2 of each acoustic wave filter 100 may be exposed to the first molding layer 300, i.e., the surface of the first molding layer 300 away from the first protection layer 400 may be parallel to the second surface S2 of each acoustic wave filter 100. If the second surface S2 of each acoustic wave filter 100 is not exactly the same level, the first molding layer 300 may at least expose the second surface S2 of the acoustic wave filter 100 that is relatively protruded from the second surface S2 of the plurality of acoustic wave filters 100, and a surface of the first molding layer 300 away from the first protection layer 400 may be parallel to the second surface S2 of the acoustic wave filter 100 that is exposed by the second surface S2. Therefore, the thickness of the first plastic sealing layer is reduced, and the thickness and the size of the acoustic wave filter packaging module can be reduced.

When the acoustic wave filter package structure is manufactured based on the acoustic wave filter package module, the plastic package pressure born by the acoustic wave filter is obviously improved, and the acoustic wave filter package structure can be formed by high-pressure plastic package, so that the film pressure resistance and the structural stability of the acoustic wave filter in the acoustic wave filter package structure are improved, and the efficiency controllability of the acoustic wave filter package structure is further improved.

The first Via and the second Via in the present application may be manufactured by using a Through-Silicon-Via (TSV) technique or the like. Each via may be a uniform diameter hole at a different location, i.e., a hole shaped like a "cylinder". Alternatively, the vias may be holes of non-uniform diameter at different locations, e.g., holes shaped as "lands" (as shown in fig. 2, 3), holes shaped as "cylinders" combined with "lands", etc. The shape of the via may be set according to the electrical connection requirements, which is not limited by the present application.

In one possible implementation, the redistribution layer 500 includes at least one wiring layer and at least one dielectric protective layer. Each dielectric protection layer is used for at least partially wrapping a corresponding layer of the wiring layers, one surface, close to the acoustic wave filters 100, of each wiring layer is exposed out of the dielectric protection layer, and a plurality of second through holes K2 electrically connected with the wrapped wiring layers are arranged in each dielectric protection layer. The number of the wiring layers of the rewiring layer 500 in the acoustic wave filter packaging module can be set according to the number of the acoustic wave filters in the acoustic wave filter packaging structure and the interconnection requirement between the acoustic wave filters, the higher the number of the acoustic wave filters and the interconnection requirement, the more the number of the wiring layers of the rewiring layer 500 can be set, the high-density interconnection between the acoustic wave filters 100 is ensured to be realized, so that the number of the wiring layers in the substrate 30 of the acoustic wave filter packaging structure 2 is reduced, the thickness and the size of the substrate 30 can be reduced, and the thickness and the size of the acoustic wave filter packaging structure 2 are further reduced. And one surface of each wiring layer close to the plurality of acoustic wave filters 100 is exposed with a dielectric protection layer, and the exposed wiring can be used for directly electrically connecting the wiring layers, so that the thickness and the size of the acoustic wave filter packaging module are reduced. The following description will be made with reference to fig. 2 and 3, which include a structural arrangement of two acoustic wave filter package modules 10, 10' having different redistribution layer numbers.

As shown in fig. 2, the redistribution layer 500 in the acoustic wave filter package module 10 includes a first wiring layer 512 and a first dielectric protection layer 511. The first wiring layer 512 covers a surface of the first protection layer 511 away from the first plastic sealing layer 300, and the wirings in the first wiring layer 512 exposed out of the first dielectric protection layer 511 are electrically connected to each of the first bumps 101 through the plurality of first vias K1. The first dielectric protection layer 511 is configured to at least partially encapsulate the first wiring layer 512, and a surface of the first wiring layer 512 adjacent to the first protection layer 400 (i.e. a bare wiring connected to each of the first bumps 101) is exposed to the first dielectric protection layer 511, and a plurality of second vias K2 are disposed in the first dielectric protection layer 511. The plurality of second bumps 600 are disposed at positions corresponding to the second vias K2 in the first dielectric protection layer 511 on a surface of the first dielectric protection layer 511 away from the first wiring layer 512, and each second bump 600 covers the corresponding second via K2 and is electrically connected to the covered second via K2.

As shown in fig. 3, the redistribution layer 500 in the acoustic wave filter package module 10' may further include a second wiring layer 522 and a second dielectric protective layer 521 in addition to the first wiring layer 512 and the first dielectric protective layer 511.

The first wiring layer 512 covers a surface of the first protection layer 511 away from the first plastic sealing layer 300, and the wires in the first wiring layer 512 exposed out of the first dielectric protection layer 511 are electrically connected to each of the first bumps 101 through the plurality of first vias K1. The first dielectric protection layer 511 is configured to at least partially encapsulate the first wiring layer 512, and a surface of the first wiring layer 512 adjacent to the first protection layer 400 (i.e. a bare wiring connected to each of the first bumps 101) is exposed to the first dielectric protection layer 511, and a plurality of second vias K2 are disposed in the first dielectric protection layer 511. The second wiring layer 522 covers a side of the first dielectric protection layer 511 away from the first wiring layer 512, and the wirings in the second wiring layer 522 are electrically connected to the wirings in the first wiring layer 512 through the plurality of second vias K2 in the first dielectric protection layer 511. The second dielectric protection layer 521 is used for at least partially wrapping the second wiring layer 522, and a surface of the second wiring layer 522, which is close to the first dielectric protection layer 511, is exposed out of the second dielectric protection layer 521, and a plurality of second vias K2 electrically connected to the wirings in the second wiring layer 522 are disposed in the second dielectric protection layer 521. The plurality of second bumps 600 are disposed on the surface of the second dielectric protection layer 521, which is far away from the second wiring layer 522, at positions corresponding to each of the second vias K2 in the second dielectric protection layer 521, and each of the second bumps 600 covers the corresponding second via K2 and is electrically connected to the covered second via K2.

The number of wiring layers in the rewiring layers in the acoustic wave filter packaging module is different, so that the structure of the acoustic wave filter packaging module comprising the rewiring layers with more than 2 wiring layers can be different by referring to the structural arrangement of the acoustic wave filter packaging modules 10 and 10' comprising the wiring layers with different numbers of wiring layers and dielectric protection layers, high-density interconnection among a plurality of acoustic wave filters is realized, and different acoustic wave filter packaging modules are manufactured.

In one possible implementation, the acoustic wave filter package module 10 or 10' further includes an inductor, and the wiring in the redistribution layer 500 is further used to form the inductor. I.e. at least one of the redistribution layers 500 is used to form the inductor. The inductance is used to adjust the electrical characteristics of the acoustic wave filter package structure 2. Since the acoustic wave filter package structure 1 (see fig. 1) of the related art includes a plurality of acoustic wave filters and a plurality of auxiliary devices, there is a difference in operating voltage, current, etc. of the different devices, electromagnetic interference may exist between the devices, the apparatus itself may also be affected by external electromagnetic interference, noise, etc., and thus it is necessary to refer to the difference between the different devices, the electromagnetic interference between the devices, the adverse effect of external influence, etc. on the circuit of the acoustic wave filter package structure 1, and the setting of the inductance is achieved by setting the inductance to reduce or avoid these adverse effects, but the thickness and size of the substrate may be increased in this way. In the present application, the redistribution layer 500 in the acoustic wave filter packaging module is used to form the inductance required by the whole acoustic wave filter packaging structure 2, instead of the scheme of arranging the inductance in the substrate in the prior art, the size and thickness of the substrate 30 in the acoustic wave filter packaging structure 2 can be reduced, and then the thickness and size of the whole acoustic wave filter packaging structure 2 can be reduced.

The number of wiring layers of the rewiring layer in the acoustic wave filter packaging module can be one layer (shown in fig. 2), two layers (shown in fig. 3) or more than two layers. The inductance in the acoustic wave filter package module may be implemented using wiring in the same wiring layer in the rewiring layer, or using wiring in a different wiring layer.

In the present application, the material of the first protective layer and each dielectric protective layer may be a material capable of realizing insulation protection such as Polyimide (PI), benzocyclobutene BCB, silicon nitride (SiN), or the like. The up to the wires in each wiring layer may be a metal such as copper. The material of the first plastic layer 300 may be PI or the like capable of achieving plastic packaging for the acoustic wave filter by a plastic packaging manner.

Fig. 5 is a flow chart illustrating a method for manufacturing an acoustic wave filter package according to an embodiment of the present application. As shown in fig. 5, the method includes steps S11 to S17. By this method, the above-mentioned acoustic wave filter package structure 2 having a small size and thickness can be manufactured by means of a simple and easy-to-implement process flow. And after the plurality of acoustic wave filters are temporarily bonded to the carrier wafer, the thickness and the size of the acoustic wave filter packaging module can be further reduced by plastic packaging, and after the plurality of acoustic wave filters are plastic packaged, the first protective layer and the rewiring layer are directly formed on the first plastic packaging layer in sequence, so that the direct preparation of each layer in the acoustic wave filter packaging module is realized, and the thickness and the size of the acoustic wave filter packaging module can be reduced. In fig. 5, a manufacturing process of the acoustic wave filter package structure including the acoustic wave filter package module 10' is taken as an example to describe a manufacturing method of the acoustic wave filter package structure according to an embodiment of the present application.

In step S11, a plurality of acoustic wave filters 100 are temporarily bonded to a carrier wafer 200 to form a first molding layer 300, each acoustic wave filter 100 having a first surface S1 and a second surface S2 disposed opposite to each other, and the first bump 101 of each acoustic wave filter 100 is located on the first surface S1, and the first surface S1 of each acoustic wave filter 100 is in contact with the carrier wafer 200. After temporarily bonding the plurality of acoustic wave filters 100 to the carrier wafer 200, performing the step S12 for plastic packaging may further reduce the thickness and size of the acoustic wave filter package module.

The material of the carrier wafer 200 may be semiconductor (e.g., silicon, germanium, gallium arsenide, silicon-on-insulator, etc.), glass, quartz, silicon carbide, aluminum oxide, epoxy, polyurethane, etc. Each acoustic wave filter 100 can be temporarily bonded to the carrier wafer 200 by applying a bonding glue, attaching a bonding film, depositing a laser release layer on the carrier wafer 200, and the like. For example, as shown in fig. 5, each acoustic wave filter 100 may be temporarily bonded to a carrier wafer 200 by bonding glue 201. The position of each acoustic wave filter on the carrier wafer 200 may be set according to the connection relationship between each acoustic wave filter 100 in the acoustic wave filter package module to be manufactured, etc., so as to simplify the layout design of the wiring in the subsequent re-wiring layer.

The size of the carrier wafer 200 is larger than or even much larger than the area occupied by the acoustic wave filters 100 in the acoustic wave filter package. The temporary bonding of the acoustic wave filters 100 in the plurality of acoustic wave filter package modules may be performed simultaneously on the same carrier wafer 200, and dicing is performed after step S16, so as to obtain a plurality of acoustic wave filter package modules.

In step S12, the plurality of acoustic wave filters 100 are encapsulated, a first encapsulation layer 300 is formed to at least partially encapsulate each of the acoustic wave filters 100, and the plurality of first bumps 101 on the first surface S1 of each of the acoustic wave filters 100 are exposed out of the first encapsulation layer 300.

In step S13, the entire plurality of acoustic wave filters 100 and the first plastic layer 300 are peeled off from the carrier wafer 200. The peeling method of peeling the carrier wafer 200 may be determined according to the temporary bonding method, and the peeling method may be thermal sliding peeling, mechanical peeling, laser peeling, or the like.

In step S14, a first protection layer 400 is formed on the first surface of the first molding layer 300 where each acoustic wave filter 100 is exposed, and a first via K1 is formed in the first protection layer 400 at a position corresponding to each first bump 101.

In step S15, a redistribution layer is formed on a surface of the first protection layer 400 away from the first molding layer 300, and the wires in the redistribution layer 500 are electrically connected to each of the first bumps 101 through the plurality of first vias K1, so as to obtain the acoustic wave filter package module 10'. Step S15 may include step S15-1, step S15-2, and step S15-3, among others.

In step S15-1, a first wiring layer 512 is formed on a surface of the first protection layer 400 away from the first molding layer 300, and the wirings in the first wiring layer 512 are electrically connected to each of the first bumps 101 through the plurality of first vias K1. And then forming a first dielectric protection layer 511 on a surface of the first wiring layer 512 away from the first protection layer 400 for wrapping a surface of the first wiring layer 512 that is exposed currently, and forming a plurality of second vias K2 in the first dielectric protection layer 511.

In step S15-2, a second wiring layer 522 is formed on a surface of the first dielectric protection layer 511 away from the first molding layer 300, and the wiring in the second wiring layer 522 is electrically connected to the wiring in the first wiring layer 512 through a plurality of second vias K2 in the first dielectric protection layer 511. And a second dielectric protective layer 521 is formed on a surface of the first dielectric protective layer 511 away from the first wiring layer 512 to encapsulate the exposed surface of the second wiring layer 522, and a plurality of second vias K2 electrically connected to the wirings in the second wiring layer 522 are formed in the second dielectric protective layer 521.

In step S15-3, a second bump 600 electrically connected to each second via K2 in the second dielectric protective layer 521 is fabricated on a surface of the second dielectric protective layer 521 away from the first protective layer 400, and each second bump 600 covers the corresponding second via K2 to be electrically connected to the wiring in the second wiring layer 522 through the second via K2, so as to obtain the acoustic wave filter package module 10'.

In the above-mentioned manufacturing process of the acoustic wave filter package module 10', the acoustic wave filter package module 10' may be manufactured by using a fan-out process and a rewiring layer process.

When the number of wiring layers in the rewiring layer 500 is not 2 with reference to the process of manufacturing the rewiring layer in step S15, the manufacture of the rewiring layer 500 having the number of wiring layers not 2 may be performed with reference to step S15.

In step S16, the acoustic wave filter package module 10 'and the passive device 20 are respectively soldered to the pre-prepared substrate 30 such that the acoustic wave filter package module 10' and the passive device 20 are respectively electrically connected to the substrate 30.

At step S17, at least the acoustic wave filter package module 10 'and the passive device 20 are molded to form a second molding layer 40 for at least partially encapsulating the exposed surfaces of the acoustic wave filter package module 10' and the passive device 20. And then, manufacturing a plurality of third bumps 50 on the surface of the substrate 30 away from the acoustic wave filter packaging module 10', thereby obtaining the acoustic wave filter packaging structure 2.

In one possible implementation, the acoustic wave filter package module further includes an inductor, and after determining a parameter (such as an inductance value) of the required inductor based on the acoustic wave filter package structure 3, the layout design is performed on the wiring layer in the redistribution layer based on the parameter of the inductor, and in step S15, the manufacture of the redistribution layer 500 is performed based on the layout design considering the parameter of the inductor, so as to form the inductor, which is used to adjust the electrical characteristics of the acoustic wave filter package structure 2. In this way, the inductance can be formed while the redistribution layer is provided to realize high-density interconnection between the plurality of acoustic wave filters, and the size and thickness of the substrate 30 in the acoustic wave filter package structure can be reduced, thereby reducing the thickness and size of the entire acoustic wave filter package structure.

In one possible implementation, the method may further include: the first plastic sealing layer 300 and/or the second plastic sealing layer 40 of the acoustic wave filter packaging module are thinned.

Therefore, the thickness of the first plastic sealing layer can be reduced, and the thickness and the size of the acoustic wave filter packaging structure can be further reduced. The first plastic layer 300 may be thinned by grinding or the like, which is not limited in the present application. After the first plastic sealing layer 300 of the acoustic wave filter package module is thinned, the thickness of the first plastic sealing layer 300 covered on the second surface S2 of each acoustic wave filter 100 can be reduced. Alternatively, the thickness of the first plastic sealing layer 300 may be reduced until the second surface S2 of the at least one acoustic wave filter 100 is exposed, that is: if the second surfaces S2 of the acoustic wave filters 100 are at the same level, the thickness may be reduced so that the surface of the first molding layer 300 away from the first protection layer 400 is parallel to the second surfaces S2 of the acoustic wave filters 100, exposing the second surfaces S2 of the acoustic wave filters 100; if the second surfaces S2 of the acoustic wave filters 100 are not at the same level, the first molding layer 300 may be thinned so that the surface of the first molding layer 300 away from the first protection layer 400 is parallel to the second surfaces S2 of the acoustic wave filters 100 where the second surfaces S2 are relatively protruded.

The second plastic sealing layer may be thinned continuously, and the thinning manner and the thinning degree are similar to those of the first plastic sealing layer, which are not repeated herein. In this way, the thickness and size of the acoustic wave filter package structure can also be reduced.

It should be understood that the above method for manufacturing the acoustic wave filter package module and the acoustic wave filter package structure is only one exemplary implementation manner for manufacturing the acoustic wave filter package module and the acoustic wave filter package structure provided by the present application, and those skilled in the art may set the method for manufacturing the acoustic wave filter package module and the acoustic wave filter package structure according to actual needs, which is not limited by the present application.

The present application also provides an electronic device including:

the acoustic wave filter package structure 2; and

and the sound wave filter packaging structure 2 is electrically connected with the PCB.

Fig. 6 shows a schematic structural diagram of an electronic device according to an embodiment of the present application. As shown in fig. 6, the electronic device may include at least one of a cellular phone, a foldable electronic device, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a cellular phone, a personal digital assistant (personal digital assistant, PDA), an augmented reality (augmented reality, AR) device, a Virtual Reality (VR) device, an artificial intelligence (artificial intelligence, AI) device, a wearable device, a vehicle-mounted device, a smart home device, or a smart city device. The embodiment of the application does not limit the specific type of the electronic equipment.

The electronic device may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (universal serial bus, USB) connector 130, a charge management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, a sensor module 180, keys 190, a motor 191, an indicator 192, a camera 193, a display 194, and a subscriber identity module (subscriber identification module, SIM) card interface 195. The sensor module 180 may include a pressure sensor 180A, a gyro sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, and the like.

The electronic device further includes a PCB (not shown in the drawing), and part or all of the processor 110, the external memory interface 120, the internal memory 121, the universal serial bus connector 130, the charge management module 140, the power management module 141, the battery 142, the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, the audio module 170, the speaker 170A, the receiver 170B, the microphone 170C, the earphone interface 170D, the sensor module 180, the key 190, the motor 191, the indicator 192, the camera 193, the display 194, and the user identification module card interface 195 in the electronic device are respectively electrically connected to the PCB directly or indirectly.

The mobile communication module 150 may provide a solution for wireless communication including 2G/3G/4G/5G, etc., applied to the electronic device 100. The mobile communication module 150 may include at least one filter, switch, power amplifier, low noise amplifier (low noise amplifier, LNA), etc. The mobile communication module 150 may receive electromagnetic waves from the antenna 1, perform processes such as filtering, amplifying, and the like on the received electromagnetic waves, and transmit the processed electromagnetic waves to the modem processor for demodulation. The mobile communication module 150 can amplify the signal modulated by the modem processor, and convert the signal into electromagnetic waves through the antenna 1 to radiate. In some embodiments, at least some of the functional modules of the mobile communication module 150 may be disposed in the processor 110. In some embodiments, at least some of the functional modules of the mobile communication module 150 may be provided in the same device as at least some of the modules of the processor 110.

The modem processor may include a modulator and a demodulator. The modulator is used for modulating the low-frequency baseband signal to be transmitted into a medium-high frequency signal. The demodulator is used for demodulating the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low frequency baseband signal to the baseband processor for processing. The low frequency baseband signal is processed by the baseband processor and then transferred to the application processor. The application processor outputs sound signals through an audio device (not limited to the speaker 170A, the receiver 170B, etc.), or displays images or video through the display screen 194. In some embodiments, the modem processor may be a stand-alone device. In other embodiments, the modem processor may be provided in the same device as the mobile communication module 150 or other functional module, independent of the processor 110.

The mobile communication module 150 may further include an acoustic wave filter packaging structure provided by the present application, and the plurality of acoustic wave filters in the acoustic wave filter packaging structure are all or part of the plurality of filters of the mobile communication module 150.

The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.

It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by hardware (e.g., circuits or ASICs (Application Specific Integrated Circuit, application specific integrated circuits)) which perform the corresponding functions or acts, or combinations of hardware and software, such as firmware, etc.

Although the application is described herein in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed application, from a study of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

The foregoing description of embodiments of the application has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the improvement of technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

The utility model provides an acoustic wave filter packaging structure, its characterized in that, acoustic wave filter packaging structure includes acoustic wave filter encapsulation module, acoustic wave filter encapsulation module includes: the first plastic layer, a plurality of acoustic wave filters, a first protective layer and a rewiring layer;

the first plastic sealing layer at least partially wraps each acoustic wave filter, and a plurality of first bumps on the first surface of each acoustic wave filter are exposed out of the first plastic sealing layer;

the first protection layer covers the first surface of the first plastic sealing layer, and first through holes are respectively formed in the first protection layer at positions corresponding to the first bumps;

the rewiring layer is arranged on one surface, far away from the first plastic sealing layer, of the first protection layer, and the rewiring layer is electrically connected with each first bump through the plurality of first through holes.
The acoustic wave filter package structure of claim 1, further comprising: the device comprises a passive device, a second plastic sealing layer and a substrate;

the acoustic wave filter packaging module and the passive device are welded and fixed on the substrate, and the acoustic wave filter packaging module and the passive device are electrically connected with the substrate;

The second plastic layer at least partially wraps the acoustic wave filter packaging module and the passive device, and part of the surfaces of the pins of the passive device and the second bumps of the acoustic wave filter packaging module are exposed out of the second plastic layer.
The acoustic wave filter package structure according to claim 1 or 2, wherein the rewiring layer includes: each dielectric protection layer is used for at least partially wrapping a corresponding layer of wiring layer, one surface, close to the acoustic wave filters, of each wiring layer is exposed out of the dielectric protection layer, and a plurality of second through holes electrically connected with the wrapped wiring layer are formed in each dielectric protection layer.
The acoustic wave filter package structure of claim 3 wherein the rewiring layer comprises a first wiring layer and a first dielectric protective layer;

the first wiring layer covers one surface of the first protection layer, which is far away from the first plastic sealing layer, and wiring in the first wiring layer is respectively and electrically connected with each first bump through the plurality of first through holes;

The first dielectric protection layer is used for at least partially wrapping the first wiring layer, one surface of the first wiring layer, which is close to the first protection layer, is exposed out of the first dielectric protection layer, and the first dielectric protection layer is provided with a plurality of second through holes which are electrically connected with the wirings in the first wiring layer.
The acoustic wave filter package structure of claim 4, wherein the rewiring layer further comprises a second wiring layer and a second dielectric protective layer;

the second wiring layer covers one surface of the first dielectric protection layer, which is far away from the first wiring layer, and the wiring in the second wiring layer is electrically connected with the wiring in the first wiring layer through a plurality of second through holes in the first dielectric protection layer;

the second dielectric protection layer is used for at least partially wrapping the second wiring layer, one surface of the second wiring layer, which is close to the first dielectric protection layer, is exposed out of the second dielectric protection layer, and a plurality of second through holes electrically connected with the wirings in the second wiring layer are arranged in the second dielectric protection layer.
The acoustic wave filter package structure of any of claims 1-5, wherein the acoustic wave filter package module further comprises an inductor, and the wiring in the rewiring layer is further used to form the inductor.
The acoustic wave filter package structure of any of claims 1-6, wherein a second surface of at least one of the acoustic wave filters disposed opposite the first surface is exposed to the first molding layer.
An electronic device, comprising:

the acoustic wave filter package structure of any one of claims 1-7; and

and the Printed Circuit Board (PCB) is electrically connected with the sound wave filter packaging structure.
A method of manufacturing an acoustic wave filter package structure, the acoustic wave filter package structure comprising an acoustic wave filter package module, the method comprising:

temporarily bonding a plurality of acoustic wave filters to a carrier wafer;

molding the plurality of acoustic wave filters to form a first molding layer for at least partially wrapping each of the acoustic wave filters, so that a plurality of first bumps on a first surface of each of the acoustic wave filters are exposed out of the first molding layer;

peeling the plurality of acoustic wave filters and the first plastic layer from the carrier wafer;

forming a first protection layer on the first surface of the first plastic sealing layer, which is exposed out of each acoustic wave filter, and forming a first via hole in the first protection layer at a position corresponding to each first bump;

And forming a rewiring layer on one surface of the first protective layer, which is far away from the first plastic sealing layer, and enabling wiring in the rewiring layer to be respectively and electrically connected with each first bump through the plurality of first through holes to obtain the acoustic wave filter packaging module.
The method according to claim 9, wherein the method further comprises:

welding and fixing the acoustic wave filter packaging module and the passive device on a pre-prepared substrate so as to electrically connect the acoustic wave filter packaging module and the passive device with the substrate respectively;

and at least carrying out plastic packaging on the acoustic wave filter packaging module and the passive device to form a second plastic packaging layer for at least partially packaging the acoustic wave filter packaging module and the exposed surface of the passive device, thereby obtaining the acoustic wave filter packaging structure.
The method according to claim 9 or 10, wherein the rewiring layer comprises: each dielectric protection layer is used for at least partially wrapping a corresponding layer of wiring layer, one surface, close to the acoustic wave filters, of each wiring layer is exposed out of the dielectric protection layer, and a plurality of second through holes electrically connected with the wrapped wiring layer are formed in each dielectric protection layer.
The method of claim 11, wherein the re-wiring layer comprises a first wiring layer and a first dielectric protective layer;

wherein, the one side that is kept away from at first protective layer forms the rewiring layer, and makes wiring in the rewiring layer pass through a plurality of first via holes and every first lug is electric connection respectively, includes:

forming a first wiring layer on one surface of the first protection layer, which is far away from the first plastic sealing layer, and enabling wiring in the first wiring layer to be electrically connected to each first bump through the first through holes;

and forming a first dielectric protection layer used for wrapping the exposed surface of the first wiring layer on one surface of the first protection layer, which is far away from the first plastic sealing layer, and forming a plurality of second through holes in the first dielectric protection layer, wherein the second through holes are electrically connected with the wiring in the first wiring layer.
The method of claim 12, wherein the re-wiring layer further comprises a second wiring layer and a second dielectric protective layer;

wherein, the one side that is kept away from at first protective layer forms the rewiring layer, and makes wiring in the rewiring layer pass through a plurality of first via holes and every first lug is electric connection respectively still includes:

Forming a second wiring layer on one surface of the first dielectric protection layer away from the first wiring layer, and enabling the wiring in the second wiring layer to be electrically connected with the wiring in the first wiring layer through a plurality of second through holes in the first dielectric protection layer;

forming a second dielectric protection layer on one surface of the first dielectric protection layer away from the first wiring layer for wrapping the exposed surface of the second wiring layer, and forming a plurality of second through holes in the second dielectric layer, wherein the second through holes are electrically connected with the wirings in the second wiring layer.
The method according to any one of claims 9-13, wherein the method further comprises:

and thinning the first plastic sealing layer and/or the second plastic sealing layer.
The method of any of claims 9-14, wherein forming a redistribution layer on a side of the first protective layer away from the first molding layer, and electrically connecting a wire in the redistribution layer to each of the first bumps through the plurality of first vias, respectively, comprises:

and forming a re-wiring layer on one surface of the first protective layer, which is far away from the first plastic sealing layer, enabling wiring in the re-wiring layer to be respectively and electrically connected with each first bump through the plurality of first through holes, and forming the inductance of the acoustic wave filter packaging structure by utilizing the wiring in the re-wiring layer.