CN116705890A - Self-powered broad-spectrum weak light signal detection photoelectric detection device and preparation method thereof - Google Patents
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- 238000001514 detection method Methods 0.000 title claims abstract description 40
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 12
- 238000005516 engineering process Methods 0.000 claims abstract description 11
- 238000000151 deposition Methods 0.000 claims abstract description 7
- 239000002073 nanorod Substances 0.000 claims abstract description 7
- 238000004528 spin coating Methods 0.000 claims abstract description 5
- 239000013078 crystal Substances 0.000 claims description 29
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 20
- 238000001228 spectrum Methods 0.000 claims description 17
- 239000010408 film Substances 0.000 claims description 16
- 239000010409 thin film Substances 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 229910052786 argon Inorganic materials 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 150000002500 ions Chemical class 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000013077 target material Substances 0.000 claims description 3
- VVTSZOCINPYFDP-UHFFFAOYSA-N [O].[Ar] Chemical compound [O].[Ar] VVTSZOCINPYFDP-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000004044 response Effects 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 12
- 239000004065 semiconductor Substances 0.000 abstract description 11
- 238000009776 industrial production Methods 0.000 abstract description 4
- 230000004298 light response Effects 0.000 abstract description 2
- 230000001808 coupling effect Effects 0.000 abstract 1
- 231100000252 nontoxic Toxicity 0.000 abstract 1
- 230000003000 nontoxic effect Effects 0.000 abstract 1
- 229910008313 Si—In Inorganic materials 0.000 description 14
- 230000000694 effects Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011896 sensitive detection Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
Description
技术领域technical field
本发明涉及一种自供电型宽光谱微弱光信号检测光电探测器件及其制备方法,尤其涉及一种Si/ZnO异质结结构光电探测器件及其制备方法,属于半导体光电子器件领域。The invention relates to a self-powered wide-spectrum weak light signal detection photodetection device and a preparation method thereof, in particular to a Si/ZnO heterojunction structure photodetection device and a preparation method thereof, belonging to the field of semiconductor optoelectronic devices.
背景技术Background technique
近年来对于自供电型宽光谱微弱光信号检测光电探测器件已经引起了国内外人们的广泛关注,因为这种微弱光信号检测要求器件具备更高的灵敏度和探测率,使得探测器件可以在低功率密度光源下工作。自供电型光电探测器件降低了能源成本和电路设计的复杂性,实现节能环保,减少对环境的污染。另外宽光谱检测实现多个波段光信号的检测,提高了器件对于光传输与接收的选择性。In recent years, the self-powered wide-spectrum weak light signal detection photodetection device has attracted widespread attention at home and abroad, because this kind of weak light signal detection requires the device to have higher sensitivity and detection rate, so that the detection device can operate at low power. Work under dense light sources. The self-powered photodetection device reduces energy cost and complexity of circuit design, realizes energy saving and environmental protection, and reduces environmental pollution. In addition, wide-spectrum detection realizes the detection of optical signals in multiple bands, which improves the selectivity of the device for optical transmission and reception.
但目前,现有的半导体光电探测器,背景载流子密度过高,暗电流较大,探测率较低,限制了微弱光信号的检测,而且,由于材料本身带隙宽度的影响,响应范围比较单一,响应速度比较慢,降低了光电转换效率,使器件的使用范围受到限制。But at present, the existing semiconductor photodetectors have too high background carrier density, large dark current, and low detection rate, which limit the detection of weak light signals. Moreover, due to the influence of the bandgap width of the material itself, the response range Relatively single, the response speed is relatively slow, which reduces the photoelectric conversion efficiency and limits the application range of the device.
例如:For example:
中国专利申请CN114671626A公开了一种ZnO量子点/磁控溅射ZnO同质结紫外光电探测器及制备方法。Chinese patent application CN114671626A discloses a ZnO quantum dot/magnetron sputtering ZnO homojunction ultraviolet photodetector and its preparation method.
中国专利申请CN113299537B公开了一种一体式的窄边框光电探测器及其制作方法,该方法采用CVD法,提高器件探测效率和响应速率。Chinese patent application CN113299537B discloses an integrated narrow-frame photodetector and a manufacturing method thereof. The method adopts a CVD method to improve detection efficiency and response rate of the device.
中国专利申请CN115332385A公开了一种基于宏观组装石墨烯/外延硅肖特基结的红外雪崩光电探测器及其制备方法,该方法实现微弱光信号的灵敏探测。Chinese patent application CN115332385A discloses an infrared avalanche photodetector based on a macro-assembled graphene/epitaxial silicon Schottky junction and its preparation method, which realizes sensitive detection of weak light signals.
但是,上述公开的ZnO基光电探测器件,大都对紫外光具有光响应功能,无法实现紫外-可见-近红外宽波段范围的光电探测,且对微弱光信号探测较弱。However, most of the ZnO-based photodetection devices disclosed above have a photoresponse function to ultraviolet light, cannot realize photodetection in a wide range of ultraviolet-visible-near-infrared bands, and are weak in detecting weak light signals.
如何研发出具有宽波段光响应的半导体材料,进而在此基础上,进一步地,研制出自供电类型的并且对微弱光信号检测的光电探测器,已经成为当前半导体材料与器件领域技术人员的一个亟待解决的技术问题。How to develop a semiconductor material with a wide-band photoresponse, and on this basis, further develop a self-powered photodetector that detects weak light signals has become an urgent need for technicians in the field of semiconductor materials and devices. Solved technical problems.
发明内容Contents of the invention
本发明的目的之一是,提供一种用于微弱光信号检测的自供电宽带Si/ZnO异质结光电探测器件。One of the objectives of the present invention is to provide a self-powered broadband Si/ZnO heterojunction photodetection device for weak optical signal detection.
本发明为实现上述目的所需要解决的技术问题是,如何改进光探测器件所用材料内部结构,突破半导体材料带隙的限制,拓宽紫外到近红外光响应波段;即通过制备ZnO纳米棒阵列形成ITO-ZnO/Si-In器件结构,利用纳米棒阵列机构,来实现器件的高光吸收;利用ZnO材料独特的热释电效应形成光-热-电-多物理场耦合的高效转换,在器件产生温度差变化,使器件中电流发生相应的变化,实现器件对光的检测;利用与Si耦合的势垒界面抑制异质结的暗电流,实现器件对微弱光信号的检测。The technical problem that the present invention needs to solve in order to achieve the above object is how to improve the internal structure of the material used in the photodetector device, break through the limitation of the band gap of the semiconductor material, and broaden the photoresponse band from ultraviolet to near infrared; that is, by preparing ZnO nanorod arrays to form ITO -ZnO/Si-In device structure, using the nanorod array mechanism to achieve high light absorption of the device; using the unique pyroelectric effect of ZnO material to form a high-efficiency conversion of light-heat-electricity-multi-physics field coupling, generating temperature in the device The difference changes, so that the current in the device changes accordingly, and the device detects light; the dark current of the heterojunction is suppressed by using the barrier interface coupled with Si, and the device detects the weak light signal.
本发明为实现上述目的所采用的技术方案是,一种自供电型宽光谱微弱光信号检测光电探测器件,其特征在于,由下至上依次包括In底电极层、Si单晶基片、ZnO薄膜层和ITO上电极层;其中:The technical solution adopted by the present invention to achieve the above object is a self-powered wide-spectrum weak light signal detection photodetection device, which is characterized in that it includes an In bottom electrode layer, a Si single crystal substrate, and a ZnO thin film from bottom to top. layer and ITO upper electrode layer; where:
所述Si单晶基片为基底,其厚度为0.2mm;The Si single crystal substrate is the base, and its thickness is 0.2mm;
所述ZnO薄膜层通过直流磁控溅射技术沉积于所述基底表面上,其具有纳米棒结构,厚度为400-450nm;The ZnO thin film layer is deposited on the surface of the substrate by DC magnetron sputtering technology, which has a nanorod structure and a thickness of 400-450nm;
所述ITO上电极层通过直流磁控溅射技术沉积于上述ZnO薄膜层的表面,其厚度为50-100nm;The ITO upper electrode layer is deposited on the surface of the above-mentioned ZnO thin film layer by DC magnetron sputtering technology, and its thickness is 50-100nm;
所述In底电极层通过热熔旋涂在所述Si基底背面,其厚度为0.1-0.5mm;The In bottom electrode layer is hot-melt spin-coated on the back of the Si substrate, and its thickness is 0.1-0.5mm;
上述技术方案直接带来的技术效果是,从制备材料和结构两方面着手,即通过在ZnO薄膜中形成独特的不同于传统半导体的热释电效应,实现光-热-电多物理场耦合转换,这种效应不依赖半导体材料的带隙范围,使得光电探测器在紫外至近红外不同波长范围方面取得突破性的提升;The technical effect directly brought by the above technical solution is to start from the two aspects of preparation materials and structure, that is, by forming a unique pyroelectric effect in the ZnO film that is different from traditional semiconductors, and realize the coupled conversion of light-heat-electricity multi-physics field , this effect does not depend on the bandgap range of semiconductor materials, making breakthroughs in photodetectors in different wavelength ranges from ultraviolet to near infrared;
经检测,上述技术方案的ITO-ZnO/Si-In光电探测器件,在405nm-1550nm超宽波长范围内具有较强的光探测能力,λ=405nm、P=500nW/cm2时,响应度为550.6mA/W,响应速度为0.13ms;After testing, the ITO-ZnO/Si-In photodetector device of the above-mentioned technical scheme has a strong light detection capability in the ultra-wide wavelength range of 405nm-1550nm, and when λ=405nm and P=500nW/ cm2 , the responsivity is 550.6mA/W, the response speed is 0.13ms;
并且,与传统半导体光电探测器件不同该器件的光探测过程不需要任何外部偏置电压来驱动操作,在零偏压下,具有自供电效应。很大程度上降低能源成本,增强电路设计的简并化,提高器件的集成度;Moreover, unlike traditional semiconductor photodetection devices, the photodetection process of this device does not require any external bias voltage to drive the operation, and it has a self-powered effect under zero bias voltage. Reduce energy costs to a great extent, enhance the simplification of circuit design, and improve the integration of devices;
另外,该光电探测器件具有7.7×1012Jones较高的探测率实现了对405nm可见光与980nm近红外光的1μW/cm2微弱光信号的检测。In addition, the photodetector device has a relatively high detectivity of 7.7×10 12 Jones and realizes the detection of 1 μW/cm 2 weak light signals of 405nm visible light and 980nm near-infrared light.
为更好地理解上述技术方案,现从原理上进行详细说明:In order to better understand the above technical solution, the principle is explained in detail:
1、ZnO半导体薄膜层的使用达到的技术效果有三个方面:(1)具有比表面积的结构特征,增强了光与物质的相互作用;(2)具有独特的热释电效应,能够增强光电探测器件光-热-电的转换;(3)纳米棒之间的大量晶界抑制了平面内的热扩散,增加了瞬态温度梯度,增强ZnO膜中的热释电效应;(4)界面势垒的形成有效地减少了暗电流,提高了器件对低激光功率的检测能力;(5)作为氧化物半导体器件,能够在空气环境中长期有效的工作,耐用,稳定性强。1. The technical effect achieved by the use of ZnO semiconductor thin film layer has three aspects: (1) has the structural characteristics of specific surface area, which enhances the interaction between light and matter; (2) has a unique pyroelectric effect, which can enhance photoelectric detection Light-heat-electric conversion of the device; (3) a large number of grain boundaries between nanorods suppress the thermal diffusion in the plane, increase the transient temperature gradient, and enhance the pyroelectric effect in the ZnO film; (4) the interface potential The formation of the barrier effectively reduces the dark current and improves the device's ability to detect low laser power; (5) as an oxide semiconductor device, it can work effectively in the air environment for a long time, and is durable and stable.
2、上述技术方案中,采用50-100nm的ITO导电玻璃作为上电极的主要原因:(1)ITO导电玻璃具有较强的导电导热性质与超高的透过率,能够在空气环境中保持较好的电子收集能力且透光与热输导能力强;(2)ITO导电玻璃与薄膜之间形成欧姆接触,促进光生载流子的运输。2. In the above technical solution, the main reasons for using 50-100nm ITO conductive glass as the upper electrode are: (1) ITO conductive glass has strong electrical and thermal conductivity and ultra-high transmittance, and can maintain a relatively high temperature in the air environment. Good electron collection ability and strong light transmission and thermal conductivity; (2) The ohmic contact is formed between the ITO conductive glass and the film to promote the transportation of photogenerated carriers.
实验证明,上述技术方案的自供电型宽光谱微弱光信号检测光电探测器件,具有自驱动、光响应波段广、响应度高、响应速度快、微光信号探测率高、稳定性高等优点。Experiments have proved that the self-powered wide-spectrum weak light signal detection photodetector device of the above technical scheme has the advantages of self-driving, wide light response band, high responsivity, fast response speed, high low-light signal detection rate, and high stability.
本发明的目的之二是,提供一种上述的自供电型宽光谱微弱光信号检测光电探测器件的制备方法,其工艺简单、成品率高、节能环保,满足宽光谱微弱光信号检测的需求,适于规模化工业生产。The second object of the present invention is to provide a method for preparing the above-mentioned self-powered wide-spectrum weak light signal detection photodetector device, which has a simple process, high yield, energy saving and environmental protection, and meets the needs of wide-spectrum weak light signal detection. Suitable for large-scale industrial production.
本发明为实现上述目的所采用的技术方案是,一种自供电型宽光谱微弱光信号检测光电探测器件的制备方法,其特征在于,包括以下步骤:The technical solution adopted by the present invention to achieve the above object is a preparation method of a self-powered wide-spectrum weak light signal detection photodetector device, which is characterized in that it includes the following steps:
第一步,Si单晶基片的预处理步骤:The first step, pretreatment steps of Si single crystal substrate:
将Si单晶基片,依次置于酒精、丙酮和酒精中超声清洗3min;取出后,用高纯氮气吹干。The Si single crystal substrate was ultrasonically cleaned in alcohol, acetone and alcohol for 3 minutes in sequence; after taking it out, it was blown dry with high-purity nitrogen.
第二步,ZnO薄膜层的沉积步骤:The second step, the deposition step of ZnO thin film layer:
将上述预处理后的Si单晶基片装入托盘,并放入真空腔室,将真空腔室抽为第一高真空,氩气与氧气混合气压调至第一压力为0.1-1.0Pa,氩氧比为20:5,将Si单晶基片调至第一温度500-550℃,采用射频磁控溅射技术,利用电离出的粒子轰击ZnO靶材,在所述Si单晶基片的表面上,沉积一层ZnO薄膜层。Put the above-mentioned pretreated Si single crystal substrate into the tray, and put it into the vacuum chamber, pump the vacuum chamber to the first high vacuum, adjust the mixed pressure of argon and oxygen to the first pressure of 0.1-1.0Pa, The ratio of argon to oxygen is 20:5, the Si single crystal substrate is adjusted to the first temperature of 500-550°C, and the radio frequency magnetron sputtering technology is used to bombard the ZnO target with ionized particles, and the Si single crystal substrate A thin layer of ZnO is deposited on the surface.
第三步,ITO上电极的沉积步骤:The third step, the deposition step of the electrode on the ITO:
从真空腔室中取出样品后,在表面覆盖具有圆孔结构的掩模片,圆孔直径为50μm-0.5mm。然后将样品放置于托盘,并放入真空腔室,将真空腔室抽为第二高真空;将上述已经覆盖有掩模片的样品的温度调至第二温度200-250℃,氩气气压调至第二压力0.1-1.0Pa,采用直流磁控溅射技术,在恒定的20W溅射功率条件下,利用电离出的离子轰击ITO靶材,在上述ZnO薄膜层的表面上,沉积一层ITO电极层。After the sample is taken out from the vacuum chamber, the surface is covered with a mask sheet having a circular hole structure, and the diameter of the circular hole is 50 μm-0.5 mm. Then place the sample on the tray and put it into the vacuum chamber, and pump the vacuum chamber to the second high vacuum; adjust the temperature of the above-mentioned sample covered with the mask sheet to the second temperature of 200-250 °C, and argon pressure Adjust to the second pressure of 0.1-1.0Pa, adopt DC magnetron sputtering technology, under the condition of constant 20W sputtering power, use ionized ions to bombard the ITO target, and deposit a layer on the surface of the above-mentioned ZnO thin film layer ITO electrode layer.
第四步,In底电极的旋涂步骤:The fourth step, the spin-coating step of the In bottom electrode:
利用电烙铁加热到150-200℃,融化金属铟丝,将其均匀旋涂在上述Si单晶基片的背面,即得。Heating to 150-200°C with an electric soldering iron, melting metal indium wire, and evenly spin-coating it on the back side of the above-mentioned Si single crystal substrate.
3、根据权利要求2所述的自供电型宽光谱微弱光信号检测光电探测器件的制备方法,其特征在于,所述氩气的纯度在99.999%以上;3. The preparation method of self-powered wide-spectrum weak light signal detection photodetection device according to claim 2, characterized in that the purity of the argon gas is above 99.999%;
所述薄膜生长基底为(100)晶面取向的Si单晶基片;The film growth substrate is a Si single crystal substrate with (100) crystal plane orientation;
所述ZnO靶材的纯度为99.9%;The purity of the ZnO target is 99.9%;
所述ITO靶材的纯度为99.99%;The purity of the ITO target material is 99.99%;
所述的ZnO靶材和所述的ITO靶材的靶基距均为35mm。The target base distance of the ZnO target and the ITO target are both 35 mm.
4、根据权利要求2所述的自供电型宽光谱微弱光信号检测光电探测器件的制备方法,其特征在于,所述第一温度为500-550℃,所述第一高真空为1×10-4-5×10-4Pa,所述第一压力为0.1-1.0Pa。4. The preparation method of self-powered wide-spectrum weak light signal detection photodetection device according to claim 2, characterized in that, the first temperature is 500-550°C, and the first high vacuum is 1×10 -4 -5×10 -4 Pa, the first pressure is 0.1-1.0 Pa.
5、根据权利要求2所述的自供电型宽光谱微弱光信号检测光电探测器件的制备方法,其特征在于,所述的第二温度为200-250℃,所述的第二高真空为1×10-4-5×10-4Pa,所述第二压力为0.1-1.0Pa。5. The preparation method of self-powered wide-spectrum weak light signal detection photodetection device according to claim 2, characterized in that, the second temperature is 200-250°C, and the second high vacuum is 1 ×10 -4 -5×10 -4 Pa, the second pressure is 0.1-1.0Pa.
优选为,所述氩气的纯度在99.999%以上;Preferably, the purity of the argon is above 99.999%;
所述薄膜生长基底为(100)晶面取向的Si单晶基片;The film growth substrate is a Si single crystal substrate with (100) crystal plane orientation;
所述ZnO靶材的纯度为99.9%;The purity of the ZnO target is 99.9%;
所述ITO靶材的纯度为99.99%;The purity of the ITO target material is 99.99%;
所述的ZnO靶材和所述的ITO靶材的靶基距均为35mm;The target base distance of the ZnO target and the ITO target is 35mm;
该技术方案直接带来的技术效果是,该距离既能满足离子在运动过程中与工作气体充分碰撞降低动能,又能保证离子在成膜过程中具有足够的附着力;The technical effect directly brought by this technical solution is that the distance can not only meet the sufficient collision between the ions and the working gas to reduce the kinetic energy during the movement, but also ensure that the ions have sufficient adhesion during the film formation process;
进一步优选,所述第一温度为550℃,所述的第一高真空为5×10-4Pa,所述第一压力为0.6Pa。Further preferably, the first temperature is 550°C, the first high vacuum is 5×10 -4 Pa, and the first pressure is 0.6 Pa.
该技术方案直接带来的技术效果是,既能使ZnO薄膜的晶体质量和纯度提高,又能满足离子在成膜过程中具有足够的附着力,生长高质量纳米棒结构;The technical effect directly brought by this technical solution is that it can not only improve the crystal quality and purity of the ZnO thin film, but also satisfy the sufficient adhesion of ions in the film formation process and grow high-quality nanorod structures;
进一步优选,所述的第二温度为200℃,所述的第二高真空为5×10-4Pa,第二压力为1.0Pa;Further preferably, the second temperature is 200°C, the second high vacuum is 5×10 -4 Pa, and the second pressure is 1.0 Pa;
该技术方案直接带来的技术效果是,进一步提高ITO电极的成膜质量,提高薄膜的结晶度,保证ITO在成膜过程中有足够的附着力。The technical effect directly brought by this technical solution is to further improve the film-forming quality of the ITO electrode, increase the crystallinity of the film, and ensure that the ITO has sufficient adhesion during the film-forming process.
上述技术方案直接带来的技术效果是,工艺简单、成品率高,适于大规模的工业生产,并且上述制备方法无有毒有害原料使用、无有毒有害废物产生或废气排放,整个工艺流程绿色节能环保、无污染。The technical effect directly brought by the above technical solution is that the process is simple, the yield is high, and it is suitable for large-scale industrial production, and the above preparation method does not use toxic and harmful raw materials, does not generate toxic and harmful waste or exhaust gas, and the entire process is green and energy-saving. Environmental protection, no pollution.
综上所述,本发明相对于现有技术,具有以下有益效果:In summary, compared with the prior art, the present invention has the following beneficial effects:
1、本发明的ITO-ZnO/Si-In结构的光电探测器件,具有自驱动、光响应波段广、响应度高、响应速度快、微光信号探测率高、稳定性高等优点,可用于宽光谱微弱光信号检测。1. The photodetector device with ITO-ZnO/Si-In structure of the present invention has the advantages of self-driving, wide optical response band, high responsivity, fast response speed, high low-light signal detection rate, high stability, etc., and can be used in wide Spectrum weak light signal detection.
本发明的ITO-ZnO/Si-In光电探测器件,在施加零偏压下,在405nm-1550nm波长范围内有明显的光响应特征:其中,在λ=405nm、P=500nW/cm2时,响应度为550.6mA/W,探测率高达7.7×1012Jones,响应速度为0.13ms。The ITO-ZnO/Si-In photodetector device of the present invention has obvious photoresponse characteristics in the 405nm-1550nm wavelength range under the application of zero bias voltage: wherein, when λ=405nm, P=500nW/ cm , The responsivity is 550.6mA/W, the detection rate is as high as 7.7×10 12 Jones, and the response speed is 0.13ms.
2、光探测器件的制备方法具有工艺简单、参数控制简便,成品率高,适于规模化工业生产,以及制造成本低、节能绿色环保、产品质量稳定等特点。2. The preparation method of the photodetector device has the characteristics of simple process, convenient parameter control, high yield, suitable for large-scale industrial production, low manufacturing cost, energy saving, green environmental protection, and stable product quality.
附图说明Description of drawings
图1为所制得ITO-ZnO/Si-In光电探测器件结构示意图;Fig. 1 is the schematic diagram of the structure of the ITO-ZnO/Si-In photodetector device made;
图2为实施例中所制得ZnO薄膜的X射线衍射图谱;Fig. 2 is the X-ray diffraction pattern of ZnO film made in the embodiment;
图3为实施例中所制得ITO-ZnO/Si-In光电探测器件在405nm可见光照射下与黑暗条件下的I–V曲线;Fig. 3 is the IV curve of the ITO-ZnO/Si-In photodetector device made in the embodiment under 405nm visible light irradiation and dark condition;
图4为实施例中所制得ITO-ZnO/Si-In光电探测器件在无偏置电压下,405nm激光1.0μm/cm2微弱光信号照射下,动态响应曲线;Fig. 4 is the dynamic response curve of the ITO-ZnO/Si-In photodetector device made in the embodiment under no bias voltage, 405nm laser 1.0 μm/ cm weak light signal irradiation;
图5为实施例中所制得ITO-ZnO/Si-In光电探测器件在无偏置电压下,980nm激光1.0μm/cm2微弱光信号照射下,动态响应曲线;Fig. 5 is the dynamic response curve of the ITO-ZnO/Si-In photodetector device made in the embodiment under no bias voltage, 980nm laser 1.0 μm/ cm weak light signal irradiation;
图6为实施例中所制得ITO-ZnO/Si-In光电探测器件在无偏置电压下,355nm,1550nm激光照射下,动态响应曲线。Fig. 6 is the dynamic response curve of the ITO-ZnO/Si-In photodetector device prepared in the embodiment under no bias voltage, 355nm, 1550nm laser irradiation.
具体实施方式Detailed ways
下面结合实施例和附图,对本发明进行详细说明。The present invention will be described in detail below in conjunction with the embodiments and accompanying drawings.
制备方法如下:The preparation method is as follows:
(1)Si基底的预处理步骤:(1) Pretreatment steps of Si substrate:
将Si单晶基片,依次置于酒精、丙酮和酒精中超声清洗3min;取出后,用高纯氮气吹干。The Si single crystal substrate was ultrasonically cleaned in alcohol, acetone and alcohol for 3 minutes in sequence; after taking it out, it was blown dry with high-purity nitrogen.
(2)ZnO薄膜层的制备步骤:(2) The preparation steps of ZnO film layer:
将上述清洗干净并经高纯氮气吹干后的Si单晶基片装入托盘,并放入真空腔室,将真空腔室抽到5×10-4Pa,氩气与氧气混合气压调至压力为0.6Pa,氩氧比为20:5,将Si单晶基片调至温度550℃,采用射频磁控溅射技术,利用电离出的粒子轰击ZnO靶材,在所述Si单晶基片的表面上,沉积一层ZnO薄膜层。Put the above-mentioned Si single crystal substrate cleaned and dried by high-purity nitrogen into the tray, and put it into the vacuum chamber, pump the vacuum chamber to 5×10 -4 Pa, and adjust the mixed pressure of argon and oxygen to The pressure is 0.6Pa, the argon-oxygen ratio is 20:5, the Si single crystal substrate is adjusted to a temperature of 550°C, and the radio frequency magnetron sputtering technology is used to bombard the ZnO target with ionized particles. On the surface of the sheet, a thin layer of ZnO was deposited.
(3)ITO上电极的沉积步骤:(3) Deposition steps of the ITO upper electrode:
从真空腔室中取出样品后,在表面覆盖具有圆孔结构的掩模片,圆孔直径为50μm-0.5mm。然后将样品放置于托盘,并放入真空腔室,将真空腔室抽到5×10-4Pa;将上述已经覆盖有掩模片的样品的温度调至200℃,氩气气压调至压力1.0Pa,采用直流磁控溅射技术,在恒定的20W溅射功率条件下,利用电离出的离子轰击ITO靶材,在上述ZnO薄膜层的表面上,沉积一层ITO电极层。After the sample is taken out from the vacuum chamber, the surface is covered with a mask sheet having a circular hole structure, and the diameter of the circular hole is 50 μm-0.5 mm. Then place the sample on a tray and put it into a vacuum chamber, and pump the vacuum chamber to 5×10 -4 Pa; adjust the temperature of the above-mentioned sample covered with a mask sheet to 200°C, and adjust the argon gas pressure to 1.0 Pa, using DC magnetron sputtering technology, under constant 20W sputtering power conditions, using ionized ions to bombard the ITO target, and deposit an ITO electrode layer on the surface of the above ZnO thin film layer.
(4)In底电极的旋涂步骤:(4) Spin coating steps of In bottom electrode:
利用电烙铁加热到150-200℃,融化金属铟丝,将其均匀涂抹在上述样品Si单晶基片的背面,作为下电极,即得。Heat it to 150-200°C with an electric soldering iron, melt the metal indium wire, apply it evenly on the back of the Si single crystal substrate of the above sample, and use it as the lower electrode.
经检测,所制得的ITO-ZnO/Si-In光电探测器件,在施加零偏压下,在405nm-1550nm波长范围内有明显的光响应特征:其中,在λ=405nm、P=500nW/cm2时,响应度为550.6mA/W,探测率高达7.7×1012Jones,响应速度为0.13ms。After testing, the prepared ITO-ZnO/Si-In photodetector device has obvious photoresponse characteristics in the wavelength range of 405nm-1550nm under the application of zero bias voltage: where, at λ=405nm, P=500nW/ At cm 2 , the responsivity is 550.6mA/W, the detection rate is as high as 7.7×10 12 Jones, and the response speed is 0.13ms.
下面结合附图,对检测结果详细说明如下:Below in conjunction with the accompanying drawings, the test results are described in detail as follows:
图1为所制得ITO-ZnO/Si-In光电探测器件结构示意图;Fig. 1 is the schematic diagram of the structure of the ITO-ZnO/Si-In photodetector device made;
如图所示,以Si作基底,ZnO薄膜层置于基底表面,ITO作为上电极置于ZnO薄膜层表面。In作为底电极置于Si基底下表面。As shown in the figure, Si is used as a substrate, a ZnO film layer is placed on the surface of the substrate, and ITO is placed on the surface of the ZnO film layer as an upper electrode. In is placed on the lower surface of the Si substrate as a bottom electrode.
图2为实施例中所制得ZnO薄膜的X射线衍射图谱;Fig. 2 is the X-ray diffraction pattern of ZnO film made in the embodiment;
如图所示,图中只有一个衍射峰为34.32°的ZnO(002)晶面。因此,我们制备的ZnO具有C轴择优取向的单一晶体结构。As shown in the figure, there is only one ZnO(002) crystal plane with a diffraction peak of 34.32°. Therefore, our prepared ZnO has a single crystal structure with a preferred orientation of the C-axis.
图3为实施例中所制得ITO-ZnO/Si-In光电探测器件在405nm可见光照射下与黑暗条件下的I–V曲线;Fig. 3 is the IV curve of the ITO-ZnO/Si-In photodetector device made in the embodiment under 405nm visible light irradiation and dark condition;
如图所示,该器件表面出明显的整流性,具有自供电特性。As shown in the figure, the device has obvious rectification on the surface and has self-powered characteristics.
图4为实施例中所制得ITO-ZnO/Si-In光电探测器件在无偏置电压下,405nm激光1.0μm/cm2微弱光信号照射下,动态响应曲线;Fig. 4 is the dynamic response curve of the ITO-ZnO/Si-In photodetector device made in the embodiment under no bias voltage, 405nm laser 1.0 μm/ cm weak light signal irradiation;
如图所示,在无外加电压下,光响应具有ZnO独特的四阶段热释电特性;且响应周期稳定,实现自驱动的快速光响应;对于可见光范围内的微弱光信号仍有明显的响应特征。As shown in the figure, under no external voltage, the photoresponse has the unique four-stage pyroelectric characteristics of ZnO; and the response period is stable, realizing a self-driven fast photoresponse; there is still an obvious response to weak light signals in the visible range feature.
图5为实施例中所制得ITO-ZnO/Si-In光电探测器件在无偏置电压下,980nm激光1.0μm/cm2微弱光信号照射下,动态响应曲线;Fig. 5 is the dynamic response curve of the ITO-ZnO/Si-In photodetector device made in the embodiment under no bias voltage, 980nm laser 1.0 μm/ cm weak light signal irradiation;
如图所示,在无外加电压下,对于近红外范围内的微弱光信号仍有明显的响应特征。As shown in the figure, there are still obvious response characteristics to weak light signals in the near-infrared range without an external voltage.
图6为实施例中所制得ITO-ZnO/Si-In光电探测器件在无偏置电压下,355nm,1550nm激光照射下,动态响应曲线。Fig. 6 is the dynamic response curve of the ITO-ZnO/Si-In photodetector device prepared in the embodiment under no bias voltage, 355nm, 1550nm laser irradiation.
如图所示,器件对于紫外355nm以及近红外1500nm的入射光都有明显的四阶段快速稳定的光响应特征。As shown in the figure, the device has obvious four-stage rapid and stable photoresponse characteristics for incident light of ultraviolet 355nm and near-infrared 1500nm.
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