CN116702301A - Method and device for generating multistage simulation layout of integrated circuit production line - Google Patents

Method and device for generating multistage simulation layout of integrated circuit production line Download PDF

Info

Publication number
CN116702301A
CN116702301A CN202310974734.9A CN202310974734A CN116702301A CN 116702301 A CN116702301 A CN 116702301A CN 202310974734 A CN202310974734 A CN 202310974734A CN 116702301 A CN116702301 A CN 116702301A
Authority
CN
China
Prior art keywords
equipment
layout
laid out
length
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202310974734.9A
Other languages
Chinese (zh)
Other versions
CN116702301B (en
Inventor
李强
程孟璇
杨光明
程星华
蒋星波
潘劲咏
李维哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China Electronics Engineering Design Institute Co Ltd
SY Technology Engineering and Construction Co Ltd
Original Assignee
China Electronics Engineering Design Institute Co Ltd
SY Technology Engineering and Construction Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China Electronics Engineering Design Institute Co Ltd, SY Technology Engineering and Construction Co Ltd filed Critical China Electronics Engineering Design Institute Co Ltd
Priority to CN202310974734.9A priority Critical patent/CN116702301B/en
Publication of CN116702301A publication Critical patent/CN116702301A/en
Application granted granted Critical
Publication of CN116702301B publication Critical patent/CN116702301B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/10Geometric CAD
    • G06F30/13Architectural design, e.g. computer-aided architectural design [CAAD] related to design of buildings, bridges, landscapes, production plants or roads
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/10Geometric CAD
    • G06F30/18Network design, e.g. design based on topological or interconnect aspects of utility systems, piping, heating ventilation air conditioning [HVAC] or cabling
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation

Abstract

The invention discloses a method and a device for generating a multistage simulation layout of an integrated circuit production line, wherein the method comprises the following steps: acquiring the required equipment of the integrated circuit production line layout, and forming an equipment list to be laid out; according to the process area, the production unit and the module level of the equipment, labeling the equipment to be laid out in the equipment list to be laid out to obtain an integrated circuit production line layout data list containing module level information; based on the integrated circuit production line layout data list, combining with a multi-stage layout strategy, the multi-stage simulation layout of the integrated circuit production line is completed. The invention combines the intelligent multi-module level method and realizes the rapid and accurate production line layout aiming at the ultra-large scale integrated circuit production line.

Description

Method and device for generating multistage simulation layout of integrated circuit production line
Technical Field
The invention belongs to the technical field of semiconductor equipment layout, and particularly relates to a method and a device for generating multistage simulation layout of an integrated circuit production line.
Background
Currently, in the field of semiconductor manufacturing lines, the layout of engineering equipment and plants often depends on the experience of traditional solutions set up and project staff. In the current situation, the actual layout situation of each semiconductor production line is different, the manual experience is relatively fuzzy, and standardized layout operation is difficult to perform.
In the medical industry layout, researchers have studied the automatic layout of related process equipment and plants. As shown in patent CN115577439a, a method and a device for generating a multi-level layout of a pharmaceutical process are provided, the method comprises the following steps: collecting production procedures of products in the medical industry to obtain equipment requirements; classifying the required equipment to form an equipment set to be laid out, and acquiring the minimum space requirements of the equipment to be laid out of different categories; reading a pre-stored room capable of carrying out equipment layout, matching the pre-stored room with a to-be-laid equipment set to obtain a list of the to-be-laid rooms, and arranging the to-be-laid equipment in the corresponding to-be-laid room; and folding and laying out the rooms to be laid out by taking the main logistics path as an axis according to the product production procedure and the list of the rooms to be laid out, and finishing the layout of workshops according to a preset workshop layout strategy. The complex layout logic is converted into a parameterized mode through a hierarchical layout logic architecture of equipment level-room level-workshop level, so that the rapid design modeling, quantitative analysis and optimization of the pharmaceutical industry are realized.
However, in the production line of the ultra-large scale integrated circuit, the number of required machine stations is huge and various, the list of the machine stations can be greatly changed when the product process is not fixed, the manual arrangement is slower, and the quick adjustment cannot be realized; the layout consideration factors are large, the variation factors are large, the number of machines is large, all schemes cannot be traversed and quantitative evaluation cannot be performed, and the optimal solution of the layout scheme cannot be determined.
Therefore, how to overcome the problems of unstable process, large change of machine list, slow manual arrangement, and incapability of quickly adjusting the difficulty and pain points of the prior product, so as to realize the layout of 'quick', 'full', 'precise' aiming at the ultra-large scale integrated circuit production line is a problem to be solved by the technicians in the field.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a method and a device for generating multistage simulation layout of an integrated circuit production line, which are combined with an intelligent multi-module level method to realize rapid and accurate production line layout for a very large scale integrated circuit production line.
In a first aspect, the present invention provides a method for generating a multi-stage simulation layout of an integrated circuit production line, including the steps of:
acquiring the required equipment of the integrated circuit production line layout, and forming an equipment list to be laid out;
according to the process area, the production unit and the module level of the equipment, labeling the equipment to be laid out in the equipment list to be laid out to obtain an integrated circuit production line layout data list containing module level information;
based on the integrated circuit production line layout data list, combining with a multi-stage layout strategy to complete the multi-stage simulation layout of the integrated circuit production line;
The multi-level layout strategy specifically comprises the following steps:
determining basic information for carrying out integrated circuit production line layout;
acquiring each production unit and completing the layout of the corresponding equipment to be laid out;
and combining preset production unit intervals to complete the arrangement of the production units in each process area, and combining all the process areas.
Further, the method for obtaining the demand equipment of the integrated circuit production line layout forms a to-be-laid out equipment list, and specifically comprises the following steps:
determining the required equipment of the integrated circuit production line layout, and giving attribute information of each required equipment, wherein the attribute information of the required equipment comprises equipment names, equipment shapes, equipment sizes and layout orientations;
constructing an initial block corresponding to the demand equipment according to the attribute information of the demand equipment;
carrying out standardization processing on the initial image block to form an image block of equipment to be laid out;
and assembling the blocks of each device to be laid out to form a list of devices to be laid out.
Further, the labeling processing of the equipment to be laid out in the equipment list to be laid out specifically includes:
determining each process area required by the layout of the integrated circuit production line, giving out each production unit contained in each process area, and determining each equipment to be laid out corresponding to each production unit;
Traversing each device to be laid out in the list of devices to be laid out, and setting a label containing production unit and process area information;
and arranging the equipment to be laid out according to the module level sequence.
Further, the basic information for carrying out the layout of the integrated circuit production line comprises an origin position, the number and the position of corridor, a layout depth and a layout direction;
the layout direction comprises a direction for respectively carrying out layout on each process area, each production unit and equipment to be laid out, each corridor is parallel to each other and parallel to the horizontal direction of the origin, and the layout depth is the vertical distance between the origin and the adjacent corridor or between each adjacent corridor.
Further, each production unit is obtained, and the layout of the corresponding equipment to be laid out is completed, specifically comprising the following steps:
determining a numerical value of a layout depth of the production unit;
acquiring a block of equipment to be laid out corresponding to a production unit, wherein the block of equipment to be laid out comprises a physical outline and an overhaul outline, and the overhaul outline is arranged on the periphery of the physical outline and wraps the physical outline;
adjusting the orientation of the blocks of the equipment to be laid out to be parallel to the corridor;
according to the arrangement sequence of equipment to be laid corresponding to the production unit, analyzing a first interference condition, and finishing arrangement of the equipment to be laid according to a fishbone shape around the dividing blocks, wherein the dividing blocks are perpendicular to the corridor, the width of the dividing blocks is equal to the arrangement depth, and the length value of the dividing blocks is equal to a preset value;
Repeating the steps to finish the layout of the corresponding equipment to be laid out in all the production units;
the method for analyzing the first interference condition comprises the steps of completing arrangement of equipment to be laid out according to a fishbone shape around a dividing block, and specifically comprises the following steps:
starting from the left side of the dividing block, using the lower edge of the physical outline of the first equipment to be laid out as the initial position of the layout, arranging the equipment to be laid out in sequence from bottom to top along the width direction of the dividing block, wherein the equipment to be laid out is parallel to each other, and the right edge of the physical outline corresponds to the length position of the dividing block;
the width interval of the entity outlines of two adjacent equipment to be laid out is not smaller than the maximum interval of the overhaul outlines;
judging that the width of the upper edge position and the initial position of the physical outline of the equipment to be laid out is larger than the layout depth, and moving the equipment to be laid out to the right side of the dividing block for layout;
on the right side of the dividing block, starting from the position which is in the same horizontal direction as the left side starting position of the dividing block and takes the space as the dividing block length value, arranging the equipment to be laid out in sequence from bottom to top along the width direction of the dividing block, wherein the equipment to be laid out are mutually parallel and the length positions of the dividing block corresponding to the left edge of the solid outline are consistent;
The width interval of the solid outlines of two adjacent equipment to be laid out is not smaller than the maximum interval of the overhaul outlines, wherein the maximum interval of the overhaul outlines is the width interval of the largest overhaul outline in the two adjacent overhaul outlines in the two adjacent equipment to be laid out;
the arrangement of the fishbone-shaped device to be laid out around the segment is completed.
Further, the production unit is placed in a first quadrant of a coordinate system, and coordinates of a right end point of a lower edge of an entity outline of equipment to be laid out on the left side of the partition block are specifically expressed as follows:
the width of the upper edge and the initial position of the physical outline of the equipment to be laid out is judged to be larger than the layout depth, and the specific formula is as follows:
wherein ,XA For the abscissa of the right end point of the lower edge of the physical outline of the equipment to be laid out on the left side of the segmentation block, Y A An ordinate of the right end point of the lower edge of the physical outline of the equipment to be laid out on the left side of the segmentation block is A Length 1 For the physical outline length of the first equipment to be laid out on the left side of the partition block, A Side 1 For the overhaul contour length of the first equipment to be laid out on the left side of the partition block, A Length 2 For the physical outline length of the second equipment to be laid out on the left side of the partition block, A 2 side For the overhaul contour length of the second equipment to be laid out on the left side of the partition block, A n length For the physical outline length of the nth equipment to be laid out on the left side of the partition block, A n side For the overhaul contour length of the nth equipment to be laid out on the left side of the dividing block, A i width For the physical outline width of the ith equipment to be laid out on the left side of the partition block, A i is on For the upper maintenance outline width of the ith equipment to be laid out on the left side of the dividing block, A Under i+1 The lower overhaul contour width of the (i+1) th equipment to be laid out on the left side of the partition block is given, n is the total number of the equipment to be laid out on the left side of the partition block, and W Pre-preparation Is the layout depth of the production unit.
Further, by combining the preset production unit spacing, the arrangement of each production unit in each process area is completed, which specifically includes:
acquiring a spacing threshold value and a spacing threshold value of adjacent production units in each process area, wherein the spacing threshold value is the maximum length of an overhaul profile in each adjacent equipment group to be laid out of the adjacent production units back to back, and the spacing threshold value is a preset minimum spacing value between each adjacent equipment to be laid out of the adjacent production units back to back;
analyzing the second interference condition according to the layout sequence of the production units in the process areas to finish the arrangement of the production units in each process area;
wherein, analysis of the second interference condition specifically includes:
Determining the length interval of adjacent production units;
and determining the layout position of the subsequent production units based on the length spacing, wherein the length spacing of the adjacent production units is not smaller than the spacing threshold value and the spacing threshold value of the adjacent production units.
Further, the production unit is placed in the first quadrant of the coordinate system, and the coordinates of the right end point of the lower edge of the physical outline of the first equipment to be laid out on the left side of the partition block in the subsequent production units are specifically expressed as:
wherein ,for the abscissa of the right end point of the lower edge of the physical outline of the first device to be laid out on the left side of the segment in the subsequent production unit +.>For the ordinate of the right end point of the lower edge of the physical outline of the first equipment to be laid out on the left side of the dividing block in the subsequent production unit +.>The left end point of the equipment to be laid out on the right side of the partition block for the previous production unit has the abscissa value of a Length 1 Physical outline length, a, of the first device to be laid out on the right side of the segmentation block for the previous production cell Length 2 Physical outline length, a, of the second device to be laid out on the right side of the segmentation block for the previous production cell N length Physical outline length of N-th equipment to be laid out on right side of previous production unit partition block, B Length 1 For the first left part of the dividing block in the subsequent production unit to be laid Physical outline length of office equipment, B Length 2 For the physical outline length of the second equipment to be laid out on the left side of the dividing block in the subsequent production unit, B Length M For the physical contour length of the M-th equipment to be laid out on the left side of the dividing block in the subsequent production unit, R is the distance threshold value between the subsequent production unit and the previous production unit, R is the distance threshold value, N is the number of the equipment to be laid out on the right side of the dividing block of the previous production unit, and M is the number of the equipment to be laid out on the left side of the dividing block of the subsequent production unit.
Further, combining all process regions specifically includes:
the layout direction of the process area is arranged from left to right and from bottom to top by taking the original point position as a reference;
analyzing the layout position of each process area;
judging whether the process area needs to be subjected to mirror image processing, and if not, specifically representing the layout position as follows:
if the process area needs to be mirrored, judging whether the process area is an initial area, and if the process area is the initial area, specifically representing the layout position as follows:
if not, the layout position is specifically expressed as:
wherein ,for the processed abscissa of the process area which does not need to be mirrored +. >For the process area passing without mirror image treatmentOrdinate after treatment,/->For the original abscissa before the process area without mirror image treatment is treated, +.>K is the original ordinate before the process area is processed, which is not needed to be mirrored For the number of all production units on the left in the process area where no mirror image processing is required, +.>To the left of the process region where mirror image processing is not required Length of individual production units->For the abscissa of the processed process area which is to be mirrored and is the starting area, +.>For the ordinate of the processed process area which is to be mirrored and is the starting area, +.>For the original abscissa before the process area which is to be mirrored and is the starting area is treated,/->For the original ordinate before the process field which is to be mirrored and which is the starting field is treated,/->S < th > of the lower side of the process region which is required to be subjected to mirror image processing and is the initial region Layout depth of individual production units, W Ⅱ1 For the layout depth of the 1 st production unit under the process area which needs to be mirrored and is the starting area, W is the corridor width, +. >S < th > of the lower side of the process region which is required to be subjected to mirror image processing and is the initial region -layout depth of 1 production cell, S For the numbering of the process areas which require mirror image processing and are the starting areas, +.>For the abscissa of the processed process area which is to be mirrored and is not the starting area +.>For the ordinate of the processed process area which is to be mirrored and is not the starting area +.>For the original abscissa before the process zone, which is to be mirrored and is not the starting zone, is treated +.>To the original ordinate before the process zone, which is to be mirrored and is not the starting zone, K For the number of all production units on the left in the process area which needs to be mirrored and is not the starting area, +.>To the left of the process region where mirror image processing is required and which is not the start region Length of individual production units->S-th underside of process region which is required to be mirror-image processed and is not the start region Layout depth of individual production units, W Ⅲ1 To the layout depth of 1 st production cell under the process area which needs to be mirror image processed and is not the initial area, +.>S-th underside of process region which is required to be mirror-image processed and is not the start region -1 production sheetLayout depth of element S Numbering of process areas that require mirror image processing and are not the starting areas.
In a second aspect, the present invention further provides a device for generating a multi-stage simulation layout of an integrated circuit production line, where the method for generating a multi-stage simulation layout of an integrated circuit production line specifically includes:
the acquisition unit acquires the required equipment of the integrated circuit production line layout;
the processing unit is used for forming a to-be-laid-out equipment list, and carrying out labeling processing on to-be-laid-out equipment in the to-be-laid-out equipment list according to the process area, the production unit and the module level of the equipment to obtain an integrated circuit production line layout data list containing module level information;
and the construction unit is used for completing the multi-stage simulation layout of the integrated circuit production line based on the integrated circuit production line layout data list and combining with a multi-stage layout strategy.
The invention provides a method and a device for generating a multi-stage simulation layout of an integrated circuit production line, which at least comprise the following beneficial effects:
(1) The invention combines the intelligent multi-module level method, and realizes the quick and accurate layout of the production line aiming at the ultra-large scale integrated circuit production line.
(2) According to the invention, typical fishbone type production line equipment layout forms can be rapidly generated by arrangement in the production units and among the production units in the process area, and meanwhile, the principle of sharing the overhaul area is combined, so that the equipment of the scheme layout is compact, the space utilization rate is high, and the rapidly generated scheme accords with the layout requirement of the ultra-large-scale relay circuit production line through presetting equipment blocks and parameters of the production line system and equipment.
(3) The process area combining mode can quickly generate a fishbone type arrangement scheme with a central corridor, the scheme has high space utilization rate, is easy for an automatic carrying system to work, meets the economic requirement of later production operation, meets the arrangement requirement of a very large scale integrated circuit production line, and can reach the design level of industry deep engineers by the system and the device through preset parameters and rules, and the system and the device are convenient to correct and adjust at any time.
Drawings
FIG. 1 is a schematic flow diagram of a method for generating a multi-level simulation layout of an integrated circuit production line according to the present invention;
FIG. 2 is a schematic flow chart of forming a device list to be laid out according to the present invention;
FIG. 3 is a schematic layout view of a device to be laid out in a production unit according to the present invention;
FIG. 4 is a schematic layout of a production unit in a process area provided by the present invention;
FIG. 5 is a schematic layout of a merging process region according to the present invention;
FIG. 6 is a block diagram of a generating device for a multi-stage simulation layout of an integrated circuit production line.
Detailed Description
In order to better understand the above technical solutions, the following detailed description will be given with reference to the accompanying drawings and specific embodiments. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" generally includes at least two.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a product or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such product or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a commodity or device comprising such element.
In factories of integrated circuits, the automatic production line has continuously expanded and huge scale, and has higher difficulty for layout and optimization adjustment of production line equipment. The number of the machine stations is huge, the variety is various, the process is not fixed in the early stage of layout, and the problems of change of the machine station list, quick adjustment and the like can exist in the follow-up process.
As shown in FIG. 1, the invention provides a method for generating a multi-stage simulation layout of an integrated circuit production line, which comprises the following steps:
acquiring the required equipment of the integrated circuit production line layout, and forming an equipment list to be laid out;
according to the process area, the production unit and the module level of the equipment, labeling the equipment to be laid out in the equipment list to be laid out to obtain an integrated circuit production line layout data list containing module level information;
based on the integrated circuit production line layout data list, combining with a multi-stage layout strategy to complete the multi-stage simulation layout of the integrated circuit production line;
the multi-level layout strategy specifically comprises the following steps:
determining basic information for carrying out integrated circuit production line layout;
acquiring each production unit and completing the layout of the corresponding equipment to be laid out;
and combining preset production unit intervals to complete the arrangement of the production units in each process area, and combining all the process areas.
The invention combines the intelligent multi-module level method, and realizes the intelligent layout of 'fast', 'full', 'fine' aiming at the ultra-large scale integrated circuit.
As shown in fig. 2, the method for obtaining the required equipment of the integrated circuit production line layout to form a to-be-laid-out equipment list specifically includes the following steps:
Determining the required equipment of the integrated circuit production line layout, and giving attribute information of each required equipment, wherein the attribute information of the required equipment comprises equipment names, equipment shapes, equipment sizes and layout orientations;
constructing an initial block corresponding to the demand equipment according to the attribute information of the demand equipment;
carrying out standardization processing on the initial image block to form an image block of equipment to be laid out;
and assembling the blocks of each device to be laid out to form a list of devices to be laid out.
The image blocks representing the equipment to be laid out are obtained to form an equipment list to be laid out, so that the internal operation is convenient, the purpose of simplification is realized, and key parameter data related to the layout process are reserved.
The labeling processing of the equipment to be laid out in the equipment list to be laid out specifically comprises the following steps:
determining each process area required by the layout of the integrated circuit production line, giving out each production unit contained in each process area, and determining each equipment to be laid out corresponding to each production unit;
traversing each device to be laid out in the list of devices to be laid out, and setting a label containing production unit and process area information;
and arranging the equipment to be laid out according to the module level sequence.
Basic information for carrying out integrated circuit production line layout comprises an origin position, the number and the positions of corridor, layout depth and layout direction;
the layout direction comprises a direction for respectively carrying out layout on each process area, each production unit and equipment to be laid out, each corridor is parallel to each other and parallel to the horizontal direction of the origin, and the layout depth is the vertical distance between the origin and the adjacent corridor or between each adjacent corridor.
The multi-module level layout is positioned through the original point position, and hierarchical layout is performed according to the number and the positions of the corridor in the layout, the layout depth and the layout direction. Wherein the arrangement of the equipment to be laid out in each production unit, the arrangement of the production units in each process area, and the arrangement between the process areas are as shown in fig. 3-5.
Each production unit is obtained, and the layout of the corresponding equipment to be laid out is completed, specifically comprising the following steps:
determining a numerical value of a layout depth of the production unit;
acquiring a block of equipment to be laid out corresponding to a production unit, wherein the block of equipment to be laid out comprises a physical outline and an overhaul outline, and the overhaul outline is arranged on the periphery of the physical outline and wraps the physical outline;
Adjusting the orientation of the blocks of the equipment to be laid out to be parallel to the corridor;
according to the arrangement sequence of equipment to be laid corresponding to the production unit, analyzing a first interference condition, and finishing arrangement of the equipment to be laid according to a fishbone shape around the dividing blocks, wherein the dividing blocks are perpendicular to the corridor, the width of the dividing blocks is equal to the arrangement depth, and the length value of the dividing blocks is equal to a preset value;
repeating the steps to finish the layout of the corresponding equipment to be laid out in all the production units;
the method for analyzing the first interference condition comprises the steps of completing arrangement of equipment to be laid out according to a fishbone shape around a dividing block, and specifically comprises the following steps:
starting from the left side of the dividing block, using the lower edge of the physical outline of the first equipment to be laid out as the initial position of the layout, arranging the equipment to be laid out in sequence from bottom to top along the width direction of the dividing block, wherein the equipment to be laid out is parallel to each other, and the right edge of the physical outline corresponds to the length position of the dividing block;
the width interval of the entity outlines of two adjacent equipment to be laid out is not smaller than the maximum interval of the overhaul outlines;
judging that the width of the upper edge position and the initial position of the physical outline of the equipment to be laid out is larger than the layout depth, and moving the equipment to be laid out to the right side of the dividing block for layout;
On the right side of the dividing block, starting from the position which is in the same horizontal direction as the left side starting position of the dividing block and takes the space as the dividing block length value, arranging the equipment to be laid out in sequence from bottom to top along the width direction of the dividing block, wherein the equipment to be laid out are mutually parallel and the length positions of the dividing block corresponding to the left edge of the solid outline are consistent;
the width interval of the solid outlines of two adjacent equipment to be laid out is not smaller than the maximum interval of the overhaul outlines, wherein the maximum interval of the overhaul outlines is the width interval of the largest overhaul outline in the two adjacent overhaul outlines in the two adjacent equipment to be laid out;
the arrangement of the fishbone-shaped device to be laid out around the segment is completed.
The production unit is placed in a first quadrant of a coordinate system, and coordinates of a right end point of the lower edge of the physical outline of equipment to be laid out on the left side of the dividing block are specifically expressed as follows:
in order to determine the number of devices to be laid out on the left side of the partition block, the width between the position of the upper edge of the physical outline of the device to be laid out and the starting position is larger than the layout depth, and the specific formula is as follows:
wherein ,XA For the abscissa of the right end point of the lower edge of the physical outline of the equipment to be laid out on the left side of the segmentation block, Y A An ordinate of the right end point of the lower edge of the physical outline of the equipment to be laid out on the left side of the segmentation block is A Length 1 For the physical outline length of the first equipment to be laid out on the left side of the partition block, A Side 1 For the overhaul contour length of the first equipment to be laid out on the left side of the partition block, A Length 2 For the physical outline length of the second equipment to be laid out on the left side of the partition block, A 2 side For the overhaul contour length of the second equipment to be laid out on the left side of the partition block, A n length For the physical outline length of the nth equipment to be laid out on the left side of the partition block, A n side For the overhaul contour length of the nth equipment to be laid out on the left side of the dividing block, A i width For the physical outline width of the ith equipment to be laid out on the left side of the partition block, A i is on For the upper maintenance outline width of the ith equipment to be laid out on the left side of the dividing block, A Under i+1 The lower overhaul contour width of the (i+1) th equipment to be laid out on the left side of the partition block is given, n is the total number of the equipment to be laid out on the left side of the partition block, and W Pre-preparation Is the layout depth of the production unit.
In this production unit, as shown in FIG. 3, the layout depth is W Pre-preparation The number of the layout depth, at which all the devices in the production unit can be guaranteed to be laid out, varies according to the different locations and the different production units.
The segments are gray shaded portions and the device assumes a fishbone shape around both sides of the segments. The tiles of each device include a solid outline (shown in solid lines) and a service outline (shown in broken lines), such as device A 1 In A of Length 1 Representing the physical outline length, A Side 1 Representing the length of the service profile, apparatus A 1 Setting maintenance contours only on one side, and on the left side of the solid contour, A 1 width of Representing the width of the physical outline, A 1 on Representing the upper service profile width, A Under 1 Representing the lower service profile width. The arrangement of the devices on the left side of the dividing block is performed in a bottom-up sequence until the upper edge position of the devices contacts the corridor, and then the devices are moved to the right side of the dividing block for arrangement (n-1 devices are arranged on the left side of the dividing block). Device A 2 And device A 1 Adjacent, device a 2 And device A 1 Is set by considering the equipment A 2 Lower service profile width and apparatus A 1 The width of the upper maintenance outline is not smaller than A 2 under Nor is less than A 1 on . Of course, device A 2 Lower service profile and apparatus a 1 The upper service profile may overlap.
The devices on the right side of the dividing block are also arranged in the order from bottom to top, the first device a on the right side of the dividing block 1 And device A 1 On the same horizontal line, a 1 Left end point of lower edge of solid outline and A 1 The numerical difference of the horizontal axis coordinates of the right end point of the lower edge of the solid outline is the length L of the dividing block 1 Device a 1 The service profile is also provided on only one side, to the right of the solid profile.
The arrangement of each production unit in each process area is completed by combining the preset production unit spacing, and the method specifically comprises the following steps:
acquiring a spacing threshold value and a spacing threshold value of adjacent production units in each process area, wherein the spacing threshold value is the maximum length of an overhaul profile in each adjacent equipment group to be laid out of the adjacent production units back to back, and the spacing threshold value is a preset minimum spacing value between each adjacent equipment to be laid out of the adjacent production units back to back;
analyzing the second interference condition according to the layout sequence of the production units in the process areas to finish the arrangement of the production units in each process area;
wherein, analysis of the second interference condition specifically includes:
determining the length interval of adjacent production units;
and determining the layout position of the subsequent production units based on the length spacing, wherein the length spacing of the adjacent production units is not smaller than the spacing threshold value and the spacing threshold value of the adjacent production units.
Placing the production units in a first quadrant of a coordinate system, and specifically expressing coordinates of a right end point of a lower edge of a physical outline of first equipment to be laid out on the left side of a dividing block in subsequent production units as follows:
wherein ,for the abscissa of the right end point of the lower edge of the physical outline of the first device to be laid out on the left side of the segment in the subsequent production unit +. >For the ordinate of the right end point of the lower edge of the physical outline of the first equipment to be laid out on the left side of the dividing block in the subsequent production unit +.>The left end point of the equipment to be laid out on the right side of the partition block for the previous production unit has the abscissa value of a Length 1 Physical outline length, a, of the first device to be laid out on the right side of the segmentation block for the previous production cell Length 2 Physical outline length, a, of the second device to be laid out on the right side of the segmentation block for the previous production cell N length N-th to-be-laid cloth on right side of dividing block for previous production unitPhysical outline length of office equipment, B Length 1 For the physical outline length of the first equipment to be laid out on the left side of the dividing block in the subsequent production unit, B Length 2 For the physical outline length of the second equipment to be laid out on the left side of the dividing block in the subsequent production unit, B Length M For the physical contour length of the M-th equipment to be laid out on the left side of the dividing block in the subsequent production unit, R is the distance threshold value between the subsequent production unit and the previous production unit, R is the distance threshold value, N is the number of the equipment to be laid out on the right side of the dividing block of the previous production unit, and M is the number of the equipment to be laid out on the left side of the dividing block of the subsequent production unit.
As shown in fig. 4, in this process area, two adjacent production units are arranged. The production cell spacing mainly takes into account the lengthwise spacing between the right side of the production cell (1) and the left side of the production cell (2). R is a set spacing threshold value, and the spacing between adjacent production units cannot be smaller than the spacing threshold value. In addition to R, consideration needs to be given to (1) the service profile of the right-hand device and (2) the service profile of the left-hand device. Because the equipment on the right side and the equipment on the left side are arranged in parallel, the adjacent degree of the back-to-back adjacent equipment groups is different, the lengths of the adjacent overhaul profiles are also different, each adjacent equipment group needs to be analyzed, and the length of the maximum overhaul profile of any adjacent equipment group cannot be smaller than that of the maximum overhaul profile of any adjacent equipment group. The service profile length of each adjacent equipment group is based on the service profile length of the larger of the groups. Such as device a 2 And device B 2 Back-to-back adjacent forming equipment groups, taking into account a 2 side and B2 side And other groups of devices are considered. The spacing threshold r cannot be less than all service profile lengths of the equipment group.
Combining all process areas, specifically including:
the layout direction of the process area is arranged from left to right and from bottom to top by taking the original point position as a reference;
analyzing the layout position of each process area;
judging whether the process area needs to be subjected to mirror image processing, and if not, specifically representing the layout position as follows:
if the process area needs to be mirrored, judging whether the process area is an initial area, and if the process area is the initial area, specifically representing the layout position as follows:
if not, the layout position is specifically expressed as:
wherein ,for the processed abscissa of the process area which does not need to be mirrored +.>For the processed ordinate of the process area which does not need to be mirrored,/for>For the original abscissa before the process area without mirror image treatment is treated, +.>K is the original ordinate before the process area is processed, which is not needed to be mirrored For the number of all production units on the left in the process area where no mirror image processing is required, +. >To the left of the process region where mirror image processing is not required Length of individual production units->For the abscissa of the processed process area which is to be mirrored and is the starting area, +.>For the ordinate of the processed process area which is to be mirrored and is the starting area, +.>For the original abscissa before the process area which is to be mirrored and is the starting area is treated,/->For the original ordinate before the process field which is to be mirrored and which is the starting field is treated,/->S < th > of the lower side of the process region which is required to be subjected to mirror image processing and is the initial region Layout depth of individual production units, W Ⅱ1 For the layout depth of the 1 st production unit under the process area which needs to be mirrored and is the starting area, W is the corridor width, +.>S < th > of the lower side of the process region which is required to be subjected to mirror image processing and is the initial region -layout depth of 1 production cell, S For the numbering of the process areas which require mirror image processing and are the starting areas, +.>For the abscissa of the processed process area which is to be mirrored and is not the starting area +.>For the ordinate of the processed process area which is to be mirrored and is not the starting area +. >For the original abscissa before the process zone, which is to be mirrored and is not the starting zone, is treated +.>To the original ordinate before the process zone, which is to be mirrored and is not the starting zone, K For the number of all production units on the left in the process area which needs to be mirrored and is not the starting area, +.>To the left of the process region where mirror image processing is required and which is not the start region Length of individual production units->S-th underside of process region which is required to be mirror-image processed and is not the start region Layout depth of individual production units, W Ⅲ1 To the layout depth of 1 st production cell under the process area which needs to be mirror image processed and is not the initial area, +.>S-th underside of process region which is required to be mirror-image processed and is not the start region -layout depth of 1 production cell, S Numbering of process areas that require mirror image processing and are not the starting areas.
When all process areas are combined, it is necessary to determine whether the process areas need mirroring or not, and then adjust layout coordinates with reference to the production unit. In fig. 5, the process area on the underside of the corridor does not require a mirror image treatment (2), and the process area on the upper side of the corridor does. The upper left direction is an initial area (3) which needs mirror image processing and is laid out; the upper right direction is the initial area (4) where the mirror image processing is required and is not laid out.
As shown in fig. 6, the present invention further provides a device for generating a multi-stage simulation layout of an integrated circuit production line, which adopts the method for generating a multi-stage simulation layout of an integrated circuit production line, and specifically includes:
the acquisition unit acquires the required equipment of the integrated circuit production line layout;
the processing unit is used for forming a to-be-laid-out equipment list, and carrying out labeling processing on to-be-laid-out equipment in the to-be-laid-out equipment list according to the process area, the production unit and the module level of the equipment to obtain an integrated circuit production line layout data list containing module level information;
and the construction unit is used for completing the multi-stage simulation layout of the integrated circuit production line based on the integrated circuit production line layout data list and combining with a multi-stage layout strategy.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention. It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims (10)

1. The method for generating the integrated circuit production line multi-stage simulation layout is characterized by comprising the following steps of:
acquiring the required equipment of the integrated circuit production line layout, and forming an equipment list to be laid out;
according to the process area, the production unit and the module level of the equipment, labeling the equipment to be laid out in the equipment list to be laid out to obtain an integrated circuit production line layout data list containing module level information;
based on the integrated circuit production line layout data list, combining with a multi-stage layout strategy to complete the multi-stage simulation layout of the integrated circuit production line;
the multi-level layout strategy specifically comprises the following steps:
determining basic information for carrying out integrated circuit production line layout;
acquiring each production unit and completing the layout of the corresponding equipment to be laid out;
and combining preset production unit intervals to complete the arrangement of the production units in each process area, and combining all the process areas.
2. The method for generating the multi-level simulation layout of the integrated circuit production line according to claim 1, wherein the method for generating the multi-level simulation layout of the integrated circuit production line comprises the steps of:
determining the required equipment of the integrated circuit production line layout, and giving attribute information of each required equipment, wherein the attribute information of the required equipment comprises equipment names, equipment shapes, equipment sizes and layout orientations;
Constructing an initial block corresponding to the demand equipment according to the attribute information of the demand equipment;
carrying out standardization processing on the initial image block to form an image block of equipment to be laid out;
and assembling the blocks of each device to be laid out to form a list of devices to be laid out.
3. The method for generating the multi-stage simulation layout of the integrated circuit production line according to claim 1 or 2, wherein the labeling process is performed on the devices to be laid out in the device list to be laid out, specifically comprising:
determining each process area required by the layout of the integrated circuit production line, giving out each production unit contained in each process area, and determining each equipment to be laid out corresponding to each production unit;
traversing each device to be laid out in the list of devices to be laid out, and setting a label containing production unit and process area information;
and arranging the equipment to be laid out according to the module level sequence.
4. The method of generating a multi-level simulation layout of an integrated circuit production line of claim 2, wherein the basic information for performing the layout of the integrated circuit production line includes an origin position, the number and positions of hallways, a layout depth, and a layout direction;
the layout direction comprises a direction for respectively carrying out layout on each process area, each production unit and equipment to be laid out, each corridor is parallel to each other and parallel to the horizontal direction of the origin, and the layout depth is the vertical distance between the origin and the adjacent corridor or between each adjacent corridor.
5. The method for generating a multi-level simulation layout of an integrated circuit production line according to claim 4, wherein each production unit is acquired and the layout of the corresponding equipment to be laid out is completed, specifically comprising the steps of:
determining a numerical value of a layout depth of the production unit;
acquiring a block of equipment to be laid out corresponding to a production unit, wherein the block of equipment to be laid out comprises a physical outline and an overhaul outline, and the overhaul outline is arranged on the periphery of the physical outline and wraps the physical outline;
adjusting the orientation of the blocks of the equipment to be laid out to be parallel to the corridor;
according to the arrangement sequence of equipment to be laid corresponding to the production unit, analyzing a first interference condition, and finishing arrangement of the equipment to be laid according to a fishbone shape around the dividing blocks, wherein the dividing blocks are perpendicular to the corridor, the width of the dividing blocks is equal to the arrangement depth, and the length value of the dividing blocks is equal to a preset value;
repeating the steps to finish the layout of the corresponding equipment to be laid out in all the production units;
the method for analyzing the first interference condition comprises the steps of completing arrangement of equipment to be laid out according to a fishbone shape around a dividing block, and specifically comprises the following steps:
starting from the left side of the dividing block, using the lower edge of the physical outline of the first equipment to be laid out as the initial position of the layout, arranging the equipment to be laid out in sequence from bottom to top along the width direction of the dividing block, wherein the equipment to be laid out is parallel to each other, and the right edge of the physical outline corresponds to the length position of the dividing block;
The width interval of the entity outlines of two adjacent equipment to be laid out is not smaller than the maximum interval of the overhaul outlines;
judging that the width of the upper edge position and the initial position of the physical outline of the equipment to be laid out is larger than the layout depth, and moving the equipment to be laid out to the right side of the dividing block for layout;
on the right side of the dividing block, starting from the position which is in the same horizontal direction as the left side starting position of the dividing block and takes the space as the dividing block length value, arranging the equipment to be laid out in sequence from bottom to top along the width direction of the dividing block, wherein the equipment to be laid out are mutually parallel and the length positions of the dividing block corresponding to the left edge of the solid outline are consistent;
the width interval of the solid outlines of two adjacent equipment to be laid out is not smaller than the maximum interval of the overhaul outlines, wherein the maximum interval of the overhaul outlines is the width interval of the largest overhaul outline in the two adjacent overhaul outlines in the two adjacent equipment to be laid out;
the arrangement of the fishbone-shaped device to be laid out around the segment is completed.
6. The method for generating the multi-stage simulation layout of the integrated circuit production line according to claim 5, wherein the production unit is placed in a first quadrant of a coordinate system, and coordinates of a right end point of a lower edge of a physical outline of equipment to be laid out on the left side of the dividing block are specifically expressed as:
The width of the upper edge and the initial position of the physical outline of the equipment to be laid out is judged to be larger than the layout depth, and the specific formula is as follows:
wherein ,XA For the abscissa of the right end point of the lower edge of the physical outline of the equipment to be laid out on the left side of the segmentation block, Y A An ordinate of the right end point of the lower edge of the physical outline of the equipment to be laid out on the left side of the segmentation block is A Length 1 For the physical outline length of the first equipment to be laid out on the left side of the partition block, A Side 1 For the overhaul contour length of the first equipment to be laid out on the left side of the partition block, A Length 2 For the physical outline length of the second equipment to be laid out on the left side of the partition block, A 2 side For the overhaul contour length of the second equipment to be laid out on the left side of the partition block, A n length For the physical outline length of the nth equipment to be laid out on the left side of the partition block, A n side For the overhaul contour length of the nth equipment to be laid out on the left side of the dividing block, A i width For the physical outline width of the ith equipment to be laid out on the left side of the partition block, A i is on For the upper maintenance outline width of the ith equipment to be laid out on the left side of the dividing block, A Under i+1 The lower overhaul contour width of the (i+1) th equipment to be laid out on the left side of the partition block is given, n is the total number of the equipment to be laid out on the left side of the partition block, and W Pre-preparation Is the layout depth of the production unit.
7. The method for generating a multi-level simulation layout of an integrated circuit production line according to claim 4, wherein the arranging of the production units in each process area is completed by combining a preset production unit interval, and the method specifically comprises the steps of:
acquiring a spacing threshold value and a spacing threshold value of adjacent production units in each process area, wherein the spacing threshold value is the maximum length of an overhaul profile in each adjacent equipment group to be laid out of the adjacent production units back to back, and the spacing threshold value is a preset minimum spacing value between each adjacent equipment to be laid out of the adjacent production units back to back;
analyzing the second interference condition according to the layout sequence of the production units in the process areas to finish the arrangement of the production units in each process area;
wherein, analysis of the second interference condition specifically includes:
determining the length interval of adjacent production units;
and determining the layout position of the subsequent production units based on the length spacing, wherein the length spacing of the adjacent production units is not smaller than the spacing threshold value and the spacing threshold value of the adjacent production units.
8. The method for generating a multi-level simulation layout of an integrated circuit production line according to claim 7, wherein the production unit is placed in a first quadrant of a coordinate system, and coordinates of a right end point of a lower edge of a physical outline of a first device to be laid out on a left side of a split block in a subsequent production unit are specifically expressed as:
wherein ,for the abscissa of the right end point of the lower edge of the physical outline of the first device to be laid out on the left side of the segment in the subsequent production unit +.>For the ordinate of the right end point of the lower edge of the physical outline of the first equipment to be laid out on the left side of the dividing block in the subsequent production unit +.>The left end point of the equipment to be laid out on the right side of the partition block for the previous production unit has the abscissa value of a Length 1 Physical outline length, a, of the first device to be laid out on the right side of the segmentation block for the previous production cell Length 2 Physical outline length, a, of the second device to be laid out on the right side of the segmentation block for the previous production cell N length Physical outline length of N-th equipment to be laid out on right side of previous production unit partition block, B Length 1 For the physical outline length of the first equipment to be laid out on the left side of the dividing block in the subsequent production unit, B Length 2 For the physical outline length of the second equipment to be laid out on the left side of the dividing block in the subsequent production unit, B Length M For the physical contour length of the M-th equipment to be laid out on the left side of the dividing block in the subsequent production unit, R is the distance threshold value between the subsequent production unit and the previous production unit, R is the distance threshold value, N is the number of the equipment to be laid out on the right side of the dividing block of the previous production unit, and M is the number of the equipment to be laid out on the left side of the dividing block of the subsequent production unit.
9. The method for generating a multi-level simulation layout of an integrated circuit production line of claim 4, wherein merging all process areas comprises:
the layout direction of the process area is arranged from left to right and from bottom to top by taking the original point position as a reference;
analyzing the layout position of each process area;
judging whether the process area needs to be subjected to mirror image processing, and if not, specifically representing the layout position as follows:
if the process area needs to be mirrored, judging whether the process area is an initial area, and if the process area is the initial area, specifically representing the layout position as follows:
if not, the layout position is specifically expressed as:
wherein ,for the processed abscissa of the process area which does not need to be mirrored +.>For the processed ordinate of the process area which does not need to be mirrored,/for>For the original abscissa before the process area without mirror image treatment is treated, +.>K is the original ordinate before the process area is processed, which is not needed to be mirrored To the extent that the number of all production units on the left in the process area where mirror image processing is not required,/>to the left of the process region where mirror image processing is not required Length of individual production units->For the abscissa of the processed process area which is to be mirrored and is the starting area, +.>For the ordinate of the processed process area which is to be mirrored and is the starting area, +.>For the original abscissa before the process area which is to be mirrored and is the starting area is treated,/->For the original ordinate before the process field which is to be mirrored and which is the starting field is treated,/->S < th > of the lower side of the process region which is required to be subjected to mirror image processing and is the initial region Layout depth of individual production units, W Ⅱ1 For the layout depth of the 1 st production unit under the process area which needs to be mirrored and is the starting area, W is the corridor width, +.>S < th > of the lower side of the process region which is required to be subjected to mirror image processing and is the initial region -layout depth of 1 production cell, S For the numbering of the process areas which require mirror image processing and are the starting areas, +.>To be mirrored and notThe processed abscissa of the process field of the starting field, +.>For the ordinate of the processed process area which is to be mirrored and is not the starting area +.>For the original abscissa before the process zone, which is to be mirrored and is not the starting zone, is treated +. >To the original ordinate before the process zone, which is to be mirrored and is not the starting zone, K For the number of all production units on the left in the process area which needs to be mirrored and is not the starting area, +.>To the left of the process region where mirror image processing is required and which is not the start region Length of individual production units->S-th underside of process region which is required to be mirror-image processed and is not the start region Layout depth of individual production units, W Ⅲ1 To the layout depth of 1 st production cell under the process area which needs to be mirror image processed and is not the initial area, +.>S-th underside of process region which is required to be mirror-image processed and is not the start region -layout depth of 1 production cell, S Numbering of process areas that require mirror image processing and are not the starting areas.
10. The device for generating the multistage simulation layout of the integrated circuit production line is characterized by adopting the method for generating the multistage simulation layout of the integrated circuit production line according to any one of claims 1-9, and specifically comprising the following steps:
the acquisition unit acquires the required equipment of the integrated circuit production line layout;
the processing unit is used for forming a to-be-laid-out equipment list, and carrying out labeling processing on to-be-laid-out equipment in the to-be-laid-out equipment list according to the process area, the production unit and the module level of the equipment to obtain an integrated circuit production line layout data list containing module level information;
And the construction unit is used for completing the multi-stage simulation layout of the integrated circuit production line based on the integrated circuit production line layout data list and combining with a multi-stage layout strategy.
CN202310974734.9A 2023-08-04 2023-08-04 Method and device for generating multistage simulation layout of integrated circuit production line Active CN116702301B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310974734.9A CN116702301B (en) 2023-08-04 2023-08-04 Method and device for generating multistage simulation layout of integrated circuit production line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310974734.9A CN116702301B (en) 2023-08-04 2023-08-04 Method and device for generating multistage simulation layout of integrated circuit production line

Publications (2)

Publication Number Publication Date
CN116702301A true CN116702301A (en) 2023-09-05
CN116702301B CN116702301B (en) 2023-10-10

Family

ID=87829699

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310974734.9A Active CN116702301B (en) 2023-08-04 2023-08-04 Method and device for generating multistage simulation layout of integrated circuit production line

Country Status (1)

Country Link
CN (1) CN116702301B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113627120A (en) * 2021-09-17 2021-11-09 中国科学院上海微系统与信息技术研究所 Layout optimization method and apparatus for superconducting integrated circuit, storage medium, and terminal
DE102021106202A1 (en) * 2020-05-18 2021-11-18 Taiwan Semiconductor Manufacturing Co., Ltd. SYSTEMS AND PROCEDURES FOR INTEGRATED CIRCUIT LAYOUT
CN115688668A (en) * 2022-11-07 2023-02-03 广东工业大学 Integrated circuit global layout optimization method and related equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021106202A1 (en) * 2020-05-18 2021-11-18 Taiwan Semiconductor Manufacturing Co., Ltd. SYSTEMS AND PROCEDURES FOR INTEGRATED CIRCUIT LAYOUT
CN113627120A (en) * 2021-09-17 2021-11-09 中国科学院上海微系统与信息技术研究所 Layout optimization method and apparatus for superconducting integrated circuit, storage medium, and terminal
CN115688668A (en) * 2022-11-07 2023-02-03 广东工业大学 Integrated circuit global layout optimization method and related equipment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
徐正;吉村猛: "用于大规模集成电路的多级布局规划设计", 电子测量技术, no. 05 *

Also Published As

Publication number Publication date
CN116702301B (en) 2023-10-10

Similar Documents

Publication Publication Date Title
CN116702302B (en) Layout optimizing method and device for semiconductor production line
CN104808627A (en) Workshop layout method of discrete manufacturing system
CN108919760A (en) A kind of intelligent workshop autonomy production process dynamic linkage control method twin based on number
CN107784380A (en) The optimization method and optimization system of a kind of inspection shortest path
CN111798447B (en) Deep learning plasticized material defect detection method based on fast RCNN
CN102096819A (en) Method for segmenting images by utilizing sparse representation and dictionary learning
CN104778458B (en) A kind of textile pattern search method based on textural characteristics
CN110232682B (en) Image-based track foreign matter detection method
CN112449722A (en) Dimension measuring device, dimension measuring program, and semiconductor manufacturing system
CN114066820A (en) Fabric defect detection method based on Swin-transducer and NAS-FPN
CN110287456A (en) Bulk lots volume rolled surface defect analysis method based on data mining
CN116702301B (en) Method and device for generating multistage simulation layout of integrated circuit production line
CN112435095A (en) Carton workshop order production management device
CN109934096B (en) Automatic driving visual perception optimization method based on characteristic time sequence correlation
CN115272002A (en) Building energy prediction method, device, storage medium and program product
CN101425178B (en) Method for repairing edge contour image of columnar injection deposition blank
CN115577865B (en) Production room layout optimization method and device for preparation process
CN102541032A (en) Bottleneck device forecasting method for re-entrant manufacturing system
CN104827111A (en) Die surface processing method and die surface processing device
CN115830302A (en) Multi-scale feature extraction and fusion power distribution network equipment positioning identification method
CN114781013A (en) Method for realizing avoidance and arrangement of labeled characters in design drawing
CN107038721B (en) Linear detection method based on LAPJV algorithm
CN109032097A (en) A kind of cold-strip steel galvanized wire course control method for use
DE112010005581T5 (en) A method of generating a numerical control program, apparatus therefor, and program to cause a computer to execute the method
CN116030274A (en) Green pricklyash fruit sequence detection method based on self-adaptive density clustering

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address

Address after: 317, Zone 2, 3rd Floor, No. 160 West Fourth Ring North Road, Haidian District, Beijing, 100097

Patentee after: China Electronics Engineering Design Institute Co.,Ltd.

Country or region after: China

Patentee after: S.Y. TECHNOLOGY ENGINEERING & CONSTRUCTION Co.,Ltd.

Address before: 317, Zone 2, 3rd Floor, No. 160 West Fourth Ring North Road, Haidian District, Beijing, 100097

Patentee before: CHINA ELECTRONICS ENGINEERING DESIGN INSTITUTE Co.,Ltd.

Country or region before: China

Patentee before: S.Y. TECHNOLOGY ENGINEERING & CONSTRUCTION Co.,Ltd.