CN116699453A - Power module aging test method and test system - Google Patents
Power module aging test method and test system Download PDFInfo
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- CN116699453A CN116699453A CN202310770599.6A CN202310770599A CN116699453A CN 116699453 A CN116699453 A CN 116699453A CN 202310770599 A CN202310770599 A CN 202310770599A CN 116699453 A CN116699453 A CN 116699453A
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- 238000012360 testing method Methods 0.000 title claims abstract description 74
- 230000032683 aging Effects 0.000 title claims abstract description 51
- 238000010998 test method Methods 0.000 title abstract description 14
- 238000012544 monitoring process Methods 0.000 claims abstract description 99
- 238000012545 processing Methods 0.000 claims description 35
- 238000005070 sampling Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 17
- 230000007613 environmental effect Effects 0.000 claims description 15
- 239000003570 air Substances 0.000 claims description 14
- 239000011159 matrix material Substances 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 8
- 239000012080 ambient air Substances 0.000 claims description 6
- 238000009529 body temperature measurement Methods 0.000 claims description 3
- 230000002159 abnormal effect Effects 0.000 description 3
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- 230000008859 change Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
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- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- 238000013461 design Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/40—Testing power supplies
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The application provides a power module aging test method and a test system, wherein the aging test method comprises the following steps: setting an input voltage and sending the input voltage to a power module to be tested; transmitting an enabling signal to a power module to be tested; monitoring the output voltage, the output current and the self-body temperature value of the power module to be tested when in work; and when the output voltage is larger than a preset voltage value and/or the output current is larger than a preset current value and/or the self-temperature value is larger than a preset value, turning off an enabling signal and alarming, and simultaneously analyzing, recording and storing the output voltage, the output current and the temperature value. The problem that the aging test data of the power module in the prior art cannot be monitored and recorded in real time is solved.
Description
Technical Field
The application relates to the field of power module aging tests, in particular to a power module aging test method and a power module aging test system.
Background
The power module is used as a necessary part of various electronic products, and plays a very important role in the whole machine. The good module can ensure that the whole machine works safely and stably for a long time, and the bad module can lead the whole machine to be paralyzed and not work. The aging test is a means for screening the quality verification reliability of the power module products in the early stage of delivery, and can effectively improve the yield and find out the potential problems of the products. With industrialized integration, power supply aging test data become necessary parameters for power supply manufacturers.
Power module testing is a power consuming process, and how to improve efficiency and reduce energy consumption is a necessary consideration. The change of the environment often causes the change of the test result, and the relation between the recording environment and the power supply characteristic can better improve the test quality. Some manufacturers customize a test frame for a certain model of power module, and the test frame is limited by the fixed values of input, output and load resistance and cannot be changed according to design parameters. The single test rack occupies a larger space for testing one module, and a larger ageing workshop is needed, so that the input cost is increased; some power module testing manufacturers do not pay attention to environment monitoring, and when problems occur, the environment parameters cannot be restored, and the power module aging test under different environments is not achieved; some modules are abnormal in the testing process, so that a testing instrument can be damaged, and necessary protection measures are required.
The power supply aging test requires monitoring and recording the output characteristics of a power supply module in the aging process, setting pass/fail judgment conditions, and screening out unqualified products. At present, most manufacturers adopt manual testing, and test power states such as a meter-head voltmeter and an ammeter are used, so that the output characteristics of the power module cannot be recorded in real time, and the running state of the power module cannot be analyzed continuously. Common power supply aging tests pay attention to the tests, test data and processes are not recorded, and hidden danger is left for later searching of problems.
As a ring of industrial production, the aging test of the power supply module is accelerated to automation under the promotion of automatic wave tide.
Disclosure of Invention
The application mainly aims to provide a power module aging test method and a test system, which at least solve the problem that the aging test data of the power module in the prior art cannot be monitored and recorded in real time.
In order to achieve the above purpose, the application provides a power module aging test method and a test system.
In order to achieve the above object, according to one aspect of the present application, there is provided a power module burn-in test method comprising:
setting an input voltage and sending the input voltage to a power module to be tested;
transmitting an enabling signal to a power module to be tested;
monitoring the output voltage, the output current and the self-body temperature value of the power module to be tested when in work;
and when the output voltage is larger than a preset voltage value and/or the output current is larger than a preset current value and/or the self-temperature value is larger than a preset value, turning off an enabling signal and alarming, and simultaneously analyzing, recording and storing the output voltage, the output current and the temperature value.
Further, setting the input voltage and sending the input voltage to the power module to be tested includes:
generating an input voltage vector according to the input voltage;
and sending the input voltage vector to the power module to be tested.
Further, the power module to be tested is arranged on the aging test board, and monitoring the output voltage, the output current and the self-body temperature value of the power module to be tested when working comprises:
the output voltage of the power module to be tested is monitored through the voltage monitoring circuit, the output current of the power module to be tested is monitored through the current collecting circuit, and the module temperature values of all the power modules to be tested arranged on the aging test board are monitored through the MEMS non-contact temperature sensor.
Further, monitoring the output voltage by the voltage monitoring circuit includes connecting the voltage monitoring circuit in parallel with the VOUT pin and the GND pin of the power module to be tested to monitor the output voltage of the power module to be tested; monitoring the output current of the power module to be tested through the current acquisition circuit comprises connecting a sampling resistor and a load resistor in series between a VOUT pin and a GND pin of the power module to be tested, and connecting the current acquisition circuit and the sampling resistor in parallel to monitor the output current of the power module to be tested.
Further, the load resistor adopts one of a resistive load, an electronic load and an energy-saving load.
Further, the power module to be tested is a plurality of, and MEMS non-contact temperature sensor has the temperature measurement pixel that is the matrix arrangement, and the module temperature value that the monitoring of passing through MEMS non-contact temperature sensor set up all power module to be tested on the ageing test board includes:
arranging a plurality of power modules to be tested on an aging test board according to a matrix;
the MEMS non-contact temperature sensor is divided into a plurality of groups of temperature measuring pixel points which are arranged in a matrix mode, and the temperature measuring pixel points of the groups are in one-to-one correspondence with the power modules to be detected so as to monitor the self-body temperature values of the power modules to be detected.
Further, after monitoring the output voltage, the output current and the self-body temperature value of the power module to be tested during operation, the aging test method further comprises the following steps:
collecting an ambient temperature value, an ambient humidity value and an ambient air pressure value when the power module to be tested works;
and analyzing, recording and storing the environmental temperature value, the environmental humidity value and the environmental air pressure value.
According to another aspect of the present application, there is provided a power module aging test system including a setting unit, a main control unit, a monitoring unit, a data processing unit, a storage unit, and an alarm unit; the setting unit is used for setting the input voltage; the main control unit is connected with the setting unit and the power module to be tested, and is used for generating an input voltage vector according to the input voltage and sending the input voltage vector to the power module to be tested; the control unit is connected with the power module to be tested and is used for sending an enabling signal to the power module to be tested; the monitoring unit is connected with the power module to be tested and is used for monitoring the output voltage, the output current and the self-body temperature value generated by the work of the power module to be tested; the data processing unit is connected with the monitoring unit and the control unit and is used for carrying out aging test result analysis according to the output voltage, the output current and the self-body temperature value; the storage unit is connected with the data processing unit and is used for storing output voltage, output current, temperature values and recording aging test result analysis; the alarm unit is connected with the data processing unit and is used for sending out an alarm signal; and the data processing unit turns off the enabling signal through the control unit and sends an alarm signal through the alarm unit when the output voltage is larger than a preset voltage value and/or the output current is larger than a preset current value and/or the self-temperature value is larger than a preset value.
Further, the power module to be tested is provided with an output pin and a grounding pin, a sampling resistor and a load resistor are connected in series between the output pin and the grounding pin, and the monitoring unit comprises a voltage monitoring module, a current acquisition module and a temperature monitoring module; the voltage monitoring module is connected in parallel between an output pin and a grounding pin of the power module to be tested and is connected with the data processing unit, and the voltage monitoring module is used for monitoring the working output voltage of the power module to be tested; the current acquisition module is connected with the sampling resistor in parallel and is connected with the data processing unit, and the current acquisition module is used for monitoring an output power supply of the work of the power supply module to be tested; the temperature monitoring module is arranged above the temperature module to be detected and connected with the data processing unit, and is used for monitoring the self-temperature value of the work of the power module to be detected.
Further, the monitoring unit also comprises an ambient temperature sensor, a humidity sensor and an air pressure sensor; the environment temperature sensor is arranged beside the temperature module to be detected and connected with the data processing unit, and the environment data monitoring sensor is used for monitoring an environment temperature value of the power module to be detected when the power module to be detected works; the humidity sensor is arranged beside the temperature module to be detected and connected with the data processing unit, and is used for monitoring the environmental humidity value of the power module to be detected when working; the air pressure sensor is arranged beside the temperature module to be detected and is connected with the data processing unit, and the air pressure sensor is used for monitoring the ambient air pressure value of the power module to be detected when the power module to be detected works.
The power module aging test method of the technical scheme of the application comprises the following steps: setting an input voltage and sending the input voltage to a power module to be tested; transmitting an enabling signal to a power module to be tested; monitoring the output voltage, the output current and the self-body temperature value of the power module to be tested when in work; and when the output voltage is larger than a preset voltage value and/or the output current is larger than a preset current value and/or the self-temperature value is larger than a preset value, turning off an enabling signal and alarming, and simultaneously analyzing, recording and storing the output voltage, the output current and the temperature value. The problem that the aging test data of the power module in the prior art cannot be monitored and recorded in real time is solved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:
FIG. 1 is a flow chart of an alternative power module burn-in method according to an embodiment of the application;
FIG. 2 is a flowchart of an optional power module burn-in method step S102 according to an embodiment of the application;
FIG. 3 is a flowchart of an optional power module burn-in method step S104 according to an embodiment of the application;
FIG. 4 is a flowchart of an optional power module burn-in method step S1041 according to an embodiment of the application;
FIG. 5 is a schematic diagram of an alternative power module burn-in system according to an embodiment of the application;
fig. 6 is a schematic structural diagram of a monitoring unit of an alternative power module burn-in system according to an embodiment of the present application.
Wherein the above figures include the following reference numerals:
10. a setting unit; 20. a main control unit; 30. a control unit; 40. a monitoring unit; 41. a voltage monitoring module; 42. a current collection module; 43. a temperature monitoring module; 44. an ambient temperature sensor; 45. a humidity sensor; 46. an air pressure sensor; 50. a data processing unit; 60. a storage unit; 70. and an alarm unit.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.
According to one embodiment of the application, a power module aging test method, as shown in fig. 1, includes:
s102: setting an input voltage and sending the input voltage to a power module to be tested;
s104: transmitting an enabling signal to a power module to be tested;
s106: monitoring the output voltage, the output current and the self-body temperature value of the power module to be tested when in work;
s108: and when the output voltage is larger than a preset voltage value and/or the output current is larger than a preset current value and/or the self-temperature value is larger than a preset value, turning off an enabling signal and alarming, and simultaneously analyzing, recording and storing the output voltage, the output current and the temperature value.
In particular, as shown in fig. 2, in step S102, setting the input voltage and sending the input voltage to the power module to be tested includes:
s1021: generating an input voltage vector according to the input voltage;
s1022: and sending the input voltage vector to the power module to be tested.
Further, as shown in fig. 3, in step S104, the power module to be tested is disposed on the burn-in board, and monitoring the output voltage, the output current and the self-body temperature value of the power module to be tested during operation includes:
s1041: the output voltage of the power module to be tested is monitored through the voltage monitoring circuit, the output current of the power module to be tested is monitored through the current collecting circuit, and the module temperature values of all the power modules to be tested arranged on the aging test board are monitored through the MEMS non-contact temperature sensor.
Further, in step S1041, monitoring the output voltage by the voltage monitoring circuit includes connecting the voltage monitoring circuit in parallel with the VOUT pin and the GND pin of the power module to be tested to monitor the output voltage of the power module to be tested; the monitoring of the output current of the power module to be tested through the current acquisition circuit comprises connecting a sampling resistor and a load resistor in series between the VOUT pin and the GND pin of the power module to be tested, and connecting the current acquisition circuit and the sampling resistor in parallel to monitor the output current of the power module to be tested, wherein the sampling resistor is a low-resistance resistor with high precision and low temperature drift.
Further, in step S1041, the load resistor is one of a resistive load, an electronic load, and an energy-saving load. Optionally, the load resistor of the embodiment adopts a novel energy recovery load resistor, and the load resistor can be used for forming an alternating current power supply by isolating, inverting and converting the voltage output by the tested module to supply power to other devices in a power grid or a system of the system so as to achieve the purpose of reducing power consumption.
Further, as shown in fig. 4, in step S1041, the number of power modules to be tested is plural, the MEMS non-contact temperature sensor has temperature measurement pixels arranged in a matrix, and monitoring module temperature values of all the power modules to be tested disposed on the burn-in board by the MEMS non-contact temperature sensor includes:
s10411: arranging a plurality of power modules to be tested on an aging test board according to a matrix;
s10422: the MEMS non-contact temperature sensor is divided into a plurality of groups of temperature measuring pixel points which are arranged in a matrix mode, and the temperature measuring pixel points of the groups are in one-to-one correspondence with the power modules to be detected so as to monitor the self-body temperature values of the power modules to be detected. The MEMS non-contact temperature sensor is provided with 32 x 32=1024 pixel points, when the 4*4 =16 tested power modules are monitored, each module is provided with 8 x 8=64 pixel points for monitoring, and the heating condition of each part of the tested module during operation can be accurately recorded.
Further, after step S1041, the aging test method further includes, after monitoring the output voltage, the output current and the self-temperature value of the power module to be tested during operation:
s1042: collecting an ambient temperature value, an ambient humidity value and an ambient air pressure value when the power module to be tested works;
s1043: and analyzing, recording and storing the environmental temperature value, the environmental humidity value and the environmental air pressure value.
A power module aging test system according to another embodiment of the present application, as shown in fig. 5, includes a setting unit 10, a main control unit 20, a control unit 30, a monitoring unit 40, a data processing unit 50, a storage unit 60, and an alarm unit 70; the setting unit 10 is used for setting an input voltage; the main control unit 20 is connected with the setting unit 10 and the power module to be tested, and the main control unit 20 is used for generating an input voltage vector according to the input voltage and sending the input voltage vector to the power module to be tested; the control unit 30 is connected with the power module to be tested, and the control unit 30 is used for sending an enabling signal to the power module to be tested; the monitoring unit 40 is connected with the power module to be tested, and the monitoring unit 40 is used for monitoring the output voltage, the output current and the self-body temperature value generated by the work of the power module to be tested; the data processing unit 50 is connected with the monitoring unit 40 and the control unit 30, and the data processing unit 50 is used for performing aging test result analysis according to the output voltage, the output current and the self-body temperature value; the storage unit 60 is connected with the data processing unit 50, and the storage unit 60 is used for storing output voltage, output current, temperature value and recording aging test result analysis; the alarm unit 70 is connected with the data processing unit 50, and the alarm unit 70 is used for sending out an alarm signal; wherein, the data processing unit 50 turns off the enable signal by the control unit 30 and sends out the alarm signal by the alarm unit 70 when the output voltage is greater than the preset voltage value and/or the output current is greater than the preset current value and/or the self-temperature value is greater than the preset value.
In specific implementation, the power module to be tested has an output pin and a ground pin, and a sampling resistor and a load resistor are connected in series between the output pin and the ground pin, as shown in fig. 6, the monitoring unit 40 includes a voltage monitoring module 41, a current collecting module 42 and a temperature monitoring module 43; the voltage monitoring module 41 is connected in parallel between an output pin and a grounding pin of the power module to be tested and is connected with the data processing unit 50, the voltage monitoring module 41 is used for monitoring the working output voltage of the power module to be tested, the voltage monitoring module 41 is connected in parallel with a group of voltage dividing resistors between VOUT and GND according to the output voltage of the power module to be tested, the voltage is controlled within the withstand voltage range of the singlechip, external interference is reduced through the filter circuit, and data is transmitted to the singlechip through ADC sampling; the current acquisition module 42 is connected with the sampling resistor in parallel and is connected with the data processing unit 50, the current acquisition module 42 is used for monitoring an output power supply of the power supply module to be tested, the current acquisition module 42 is connected with a sampling resistor in series between VOUT and the load resistor according to the load current of the module to be tested, current signals are converted into voltage signals, two ends of the sampling resistor are connected to a front stage of an amplifying circuit, small signals are amplified to an acquisition interval through the amplifying circuit, external interference is reduced through a filter circuit, and data are transmitted to the singlechip through ADC sampling; the load resistor adopts a novel energy recovery load, redundant electric energy is input to the power module to be tested again, circulation is formed, and test power consumption is reduced; the temperature monitoring module 43 adopts a MEMS non-contact temperature sensor, and is disposed above the temperature module to be measured and connected to the data processing unit 50, and the temperature monitoring module 43 is used for monitoring the self-temperature value of the power module to be measured. Optionally, the voltage-current ADC sampling circuit of this embodiment uses two CD4067 model 16 channel analog multiplexers, as shown in the figure, pins 2-9 and 16-23 of U1 are connected to the voltage monitoring sampling circuits of 16 power modules, and pin 1 is connected to one ADC pin of the single-chip microcomputer; the pins 2-9 and 16-23 of U2 are connected with the current monitoring sampling circuits of 16 power modules, and the pin 1 is connected with the other ADC pin of the singlechip. 12. The 15 pins are grounded; 10. the pins 11, 14 and 13 are connected with the common I/O port of the singlechip and are used for switching sampling interfaces; the 24 pins are connected with DC3.3V.
Further, the monitoring unit 40 further includes an ambient temperature sensor 44, a humidity sensor 45, and an air pressure sensor 46; the environmental temperature sensor 44 is disposed beside the temperature module to be measured and connected to the data processing unit 50, and the environmental data monitoring sensor is used for monitoring an environmental temperature value of the power module to be measured; the humidity sensor 45 is arranged beside the temperature module to be detected and connected with the data processing unit 50, and the humidity sensor 45 is used for monitoring an environmental humidity value of the power module to be detected; the air pressure sensor 46 is arranged beside the temperature module to be detected and connected with the data processing unit 50, and the air pressure sensor 46 is used for monitoring the ambient air pressure value of the power module to be detected; alternatively, the temperature monitoring module 43 and the ambient temperature sensor 44 may be collected by other sensors, such as a thermistor, infrared sensor, etc.; the communication method of the various sensors used is not limited to IIC, and may be another mainstream communication method.
When the power module aging test method of the embodiment of the application is concretely implemented, the power module aging test method comprises an aging test board and a test machine upper computer, wherein the power module is arranged on the aging test board, and the aging test board is connected with the test machine upper computer; according to the electrical parameters of the power supply module to be tested, setting input voltage on the upper test computer by a tester, generating an input voltage vector and an enabling signal by the upper test computer, sending the input voltage vector and the enabling signal to the power supply module to be tested, and starting to work to generate output voltage after the enabling signal is received by the power supply module to be tested; the test upper computer station monitors the output voltage and the output current generated after the power supply module to be tested works through the voltage monitoring module 41 and the current collecting module 42, monitors the temperature of all the power supply modules to be tested in the area through MEMS non-contact temperature sensors arranged right above the aging test board, and monitors the test environment through an environment temperature sensor 44, a humidity sensor 45 and an air pressure sensor 46 arranged beside the temperature sensors; the test upper computer platform can analyze, record and store the operation state of the aging test on the collected data in real time, and when any one of overvoltage, overcurrent and overheat conditions occurs, the abnormal module can be immediately turned off, and an alarm signal is sent out. Each power module to be tested corresponds to a group of test circuits comprising a voltage monitoring module 41 and a current acquisition module 42, and in order to improve the working efficiency, 16 groups of single test circuits pass through a control circuit to form a power module aging test system. When an abnormal condition occurs to a certain power module to be tested, the system only cuts off one-way input and does not influence the testing of other modules. The upper computer of the detection machine is provided with a singlechip, the singlechip number is not fixed, and the singlechip number can be a plurality of signals with serial port functions in the mainstream, and can also be processing units such as a DSP (digital signal processor), an FPGA (field programmable gate array) and the like; in order to save the resources of the singlechip, two blocks of 74HC573PW type tri-state output eight paths of D-type latches are adopted; the 1, 10 pins of the two chips are grounded, the 2-9 pins are connected with the D0-D7 of the singlechip in parallel, the 11 pins are respectively connected with two control pins of the singlechip, 16 ports of the 12-19 pins of the two chips respectively control the enabling pins of 16 power modules, and 20 pins are connected with DC3.3V; high level or low level enabling can be selected according to chip parameters; enabling control is not limited to using a 74HC573PW chip, and optocoupler protection may also be added. The problem that the aging test data of the power module in the prior art cannot be monitored and recorded in real time is solved.
The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A power module burn-in method, comprising:
setting an input voltage and sending the input voltage to a power module to be tested;
transmitting an enabling signal to the power module to be tested;
monitoring the output voltage, the output current and the self-body temperature value of the power module to be tested when in work;
and when the output voltage is larger than a preset voltage value and/or the output current is larger than a preset current value and/or the self-temperature value is larger than a preset value, closing the enabling signal and alarming, and analyzing, recording and storing the output voltage, the output current and the temperature value.
2. The power module burn-in method of claim 1, wherein said setting an input voltage and sending to a power module under test comprises:
generating an input voltage vector from the input voltage;
and sending the input voltage vector to the power module to be tested.
3. The power module burn-in method of claim 1, wherein said power module under test is disposed on a burn-in board, and said monitoring output voltage, output current and self-body temperature values of said power module under test when in operation comprises:
the output voltage of the power module to be tested is monitored through a voltage monitoring circuit, the output current of the power module to be tested is monitored through a current collecting circuit, and the module temperature values of all the power modules to be tested, which are arranged on the aging test board, are monitored through MEMS non-contact temperature sensors.
4. The method of claim 3, wherein monitoring the output voltage by a voltage monitoring circuit comprises connecting the voltage monitoring circuit in parallel with VOUT pin and GND pin of the power module under test to monitor the output voltage of the power module under test; the monitoring of the output current of the power module to be tested through the current collection circuit comprises connecting a sampling resistor and a load resistor in series between a VOUT pin and a GND pin of the power module to be tested, and connecting the current collection circuit and the sampling resistor in parallel to monitor the output current of the power module to be tested.
5. The method of claim 4, wherein the load resistor is one of a resistive load, an electronic load, and an energy-saving load.
6. The power module burn-in method of claim 3, wherein said power module under test is a plurality of said MEMS non-contact temperature sensors having temperature measurement pixels arranged in a matrix, said monitoring module temperature values of all said power modules under test disposed on said burn-in board by said MEMS non-contact temperature sensors comprising:
arranging a plurality of power modules to be tested on the aging test board according to a matrix;
dividing a plurality of temperature measuring pixel points of the MEMS non-contact temperature sensor which are arranged in a matrix into a plurality of groups, and enabling the temperature measuring pixel points of the plurality of groups to correspond to the power modules to be detected one by one so as to monitor the self-temperature values of the power modules to be detected.
7. The method for testing the aging of the power module according to claim 1, wherein after the monitoring of the output voltage, the output current and the self-body temperature value of the power module to be tested during operation, the method for testing the aging further comprises:
collecting an ambient temperature value, an ambient humidity value and an ambient air pressure value when the power module to be tested works;
and analyzing, recording and storing the environmental temperature value, the environmental humidity value and the environmental air pressure value.
8. A power module burn-in system, comprising:
a setting unit (10), the setting unit (10) being configured to set an input voltage;
the main control unit (20), the main control unit (20) is connected with the setting unit (10) and the power module to be tested, and the main control unit (20) is used for generating an input voltage vector according to the input voltage and sending the input voltage vector to the power module to be tested;
the control unit (30), the said control unit (30) is connected with said power module to be measured, the said control unit (30) is used for sending the enabling signal to the said power module to be measured;
the monitoring unit (40), the said monitoring unit (40) is connected with said power module to be measured, the said monitoring unit (40) is used for monitoring the output voltage, output current and autologous temperature value that the said power module to be measured works and produces;
the data processing unit (50) is connected with the monitoring unit (40) and the control unit (30), and the data processing unit (50) is used for performing aging test result analysis according to the output voltage, the output current and the self temperature value;
the storage unit (60) is connected with the data processing unit (50), and the storage unit (60) is used for storing the output voltage, the output current, the temperature value and recording the aging test result analysis;
the alarm unit (70), the said alarm unit (70) is connected with said data handling unit (50), the said alarm unit (70) is used for sending the alarm signal;
wherein the data processing unit (50) turns off the enabling signal through the control unit (30) and sends an alarm signal through the alarm unit (70) according to the output voltage being larger than a preset voltage value and/or the output current being larger than a preset current value and/or the self-temperature value being larger than a preset value.
9. The power module burn-in system of claim 8, wherein the power module under test has an output pin and a ground pin, and a sampling resistor and a load resistor are connected in series between the output pin and the ground pin, the monitoring unit (40) comprising:
the voltage monitoring module (41) is connected between an output pin and a grounding pin of the power module to be tested in parallel and is connected with the data processing unit (50), and the voltage monitoring module (41) is used for monitoring the working output voltage of the power module to be tested;
the current acquisition module (42) is connected with the sampling resistor in parallel and is connected with the data processing unit (50), and the current acquisition module (42) is used for monitoring an output power supply of the power supply module to be tested;
the temperature monitoring module (43), temperature monitoring module (43) set up be in temperature module top that awaits measuring and with data processing unit (50) are connected, temperature monitoring module (43) are used for monitoring the autologous temperature value of awaiting measuring power module work.
10. The power module burn-in system of claim 9, wherein said monitoring unit (40) further comprises:
the environment temperature sensor (44) is arranged beside the temperature module to be detected and is connected with the data processing unit (50), and the environment data monitoring sensor is used for monitoring an environment temperature value of the power module to be detected where the power module to be detected works;
the humidity sensor (45) is arranged beside the temperature module to be detected and is connected with the data processing unit (50), and the humidity sensor (45) is used for monitoring an environmental humidity value of the power module to be detected;
the air pressure sensor (46), the air pressure sensor (46) is arranged beside the temperature module to be detected and is connected with the data processing unit (50), and the air pressure sensor (46) is used for monitoring the ambient air pressure value of the power module to be detected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310770599.6A CN116699453A (en) | 2023-06-28 | 2023-06-28 | Power module aging test method and test system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310770599.6A CN116699453A (en) | 2023-06-28 | 2023-06-28 | Power module aging test method and test system |
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| CN116699453A true CN116699453A (en) | 2023-09-05 |
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| CN202310770599.6A Pending CN116699453A (en) | 2023-06-28 | 2023-06-28 | Power module aging test method and test system |
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| Country | Link |
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| CN (1) | CN116699453A (en) |
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