CN116691126A - Solder resist wire seal device for PCB circuit board production - Google Patents

Solder resist wire seal device for PCB circuit board production Download PDF

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Publication number
CN116691126A
CN116691126A CN202310909503.XA CN202310909503A CN116691126A CN 116691126 A CN116691126 A CN 116691126A CN 202310909503 A CN202310909503 A CN 202310909503A CN 116691126 A CN116691126 A CN 116691126A
Authority
CN
China
Prior art keywords
horizontally
rod
plate
circuit board
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310909503.XA
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Chinese (zh)
Inventor
樊龙华
刘华
杨凤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Electronics Co ltd
Original Assignee
Shenzhen China Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Electronics Co ltd filed Critical Shenzhen China Electronics Co ltd
Priority to CN202310909503.XA priority Critical patent/CN116691126A/en
Publication of CN116691126A publication Critical patent/CN116691126A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/08Machines
    • B41F15/12Machines with auxiliary equipment, e.g. for drying printed articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/44Squeegees or doctors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets

Abstract

The invention discloses a solder mask printing device for producing a PCB (printed Circuit Board), which comprises two supports in a supporting device, wherein the bottom ends of the supports are fixedly arranged, two lifting pieces are symmetrically arranged, the two lifting pieces are respectively arranged on the top surfaces of the two supports, a conveying piece is arranged on the lower end surfaces of the two supports, and the conveying piece is used for feeding and discharging the PCB; four vertical plates are symmetrically arranged in the printing device, two first movable plates are horizontally and movably arranged between the two groups of supports, two scraping pieces are arranged, and the two scraping pieces are vertically and slidably arranged on the two first movable plates respectively. The invention solves the problems that in the existing PCB screen printing equipment, the specifications of a screen and a scraping plate are the same, the screen and the scraping plate cannot be adjusted according to the actual size of the printed PCB, the manual addition of the solder resist ink is adopted, the operation of the equipment is suspended when the solder resist ink is insufficient, then the manual addition is carried out, and the production efficiency is very affected in the process of adding the solder resist ink.

Description

Solder resist wire seal device for PCB circuit board production
Technical Field
The invention relates to the technical field of circuit board production equipment, in particular to a solder mask printing device for PCB circuit board production.
Background
In the production of PCB circuit boards, a circuit diagram is required to be silk-screened on a circuit board substrate, the silk-screening process of the PCB circuit board refers to the process of smearing a layer of solder resist ink after finishing a wiring diagram of the PCB circuit board, at present, silk-screening is mostly carried out by adopting a silk-screening machine, when silk-screening is carried out on the PCB circuit board, the silk-screening machine uses a scraper to linearly move on a silk-screen plate, then the solder resist ink penetrates the silk-screen plate and then is attached to the PCB circuit board when the silk-screen plate uses a pre-processed silk-screen pattern, and the solder resist ink is directly poured on the silk-screen plate when silk-screen is carried out, and then scraping is carried out by using the scraper.
The invention discloses a circuit board solder mask printer, which is structurally composed of a machine body, a transmission device, a motor, an electromagnetic clutch, a speed reducer, a speed regulating mechanism, a screen printing frame and the like, wherein the screen printing frame comprises a screen mounting opening, a frame body, a pressing opening, a pressing plate and flattening sliding blocks, the upper side and the lower side of the frame body are provided with pressing openings which are symmetrical to each other, the pressing openings are provided with the pressing plate and the flattening sliding blocks which are matched with the pressing opening, a space in the middle of the frame body is the screen mounting opening, the flattening sliding blocks matched with the pressing opening are arranged in the pressing openings, a rope is pulled between the two flattening sliding blocks, the rope is tightly attached to a screen arranged in the screen mounting opening, and tiny strands caused by pulling, adjusting and fixing the middle are removed, so that the tension between the middle of the screen and the edge of the screen is consistent, and further improvement of the solder mask position accuracy of the circuit board is realized.
However, in the screen printing device for the PCB, the specifications of the screen and the scraping plate are the same, the screen and the scraping plate cannot be adjusted according to the actual size of the PCB, meanwhile, the manual addition of the solder resist ink is adopted, namely, an operator observes the ink quantity on the screen at any time in the screen printing process, when the solder resist ink is insufficient, the device is suspended, then the manual addition is carried out, the production efficiency is very affected in the process of adding the solder resist ink, and if the operator does not add the solder resist ink in time, the quality of the PCB is poor due to the lack of the solder resist ink in the screen.
Disclosure of Invention
The invention aims to provide a solder mask printing device for producing a PCB (printed Circuit Board), which aims to improve the problems that in the traditional PCB screen printing equipment, the specifications of a screen and a scraping plate are the same and cannot be adjusted according to the actual size of the printed PCB, meanwhile, the solder mask ink is manually added, namely, an operator observes the ink quantity on a screen at any time in the screen printing process, when the solder mask ink is insufficient, the equipment is stopped to operate, then the manual addition is carried out, the production efficiency is very influenced in the process of adding the solder mask ink, and if the operator does not timely add the solder mask ink, the quality of the PCB is poor due to the lack of the solder mask ink in the screen.
The invention is realized in the following way: a solder resist printing device for PCB circuit board production comprises:
the supporting device comprises two brackets, lifting pieces and conveying pieces, wherein the two brackets are symmetrically arranged, the bottom ends of the brackets are fixedly arranged, the two lifting pieces are symmetrically arranged, the two lifting pieces are respectively arranged on the top surfaces of the two brackets, the conveying pieces are arranged on the lower end surfaces of the two brackets, and the conveying pieces are used for feeding and discharging the PCB;
the printing device comprises four vertical plates and scraping pieces, wherein the two vertical plates are symmetrically arranged at two ends of the top surfaces of the two supports respectively, two first moving plates are horizontally and movably arranged between the two supports, the two scraping pieces are arranged, and the two scraping pieces are vertically and slidably arranged on the two first moving plates respectively.
Further, the lifting piece comprises a supporting frame, first guide rods are horizontally fixed on the vertical end faces of the supporting frame, the first guide rods are horizontally and slidably inserted on the top face of the support, a screw barrel is horizontally fixed in the middle of the top face of the support, horizontal threads in the screw barrel of the support penetrate through the screw barrel to install a first screw rod, and the end portions of the first screw rod are rotatably connected with the supporting frame.
Further, the support frame is provided with the clamp frame, the top surface of the support frame is horizontally fixed with the sliding frame, the vertical section of the clamp frame is of an L-shaped structure, the vertical end face of the clamp frame is fixedly provided with the rubber pad, the horizontal end face of the clamp frame is slidably inserted into the sliding frame, the top of the horizontal end face of the clamp frame is horizontally fixed with the spring, and the other end of the spring is fixed on the top surface of the sliding frame.
Further, the vertical end top surface of the clamping frame is uniformly and horizontally fixed with a supporting frame, the supporting frame is horizontally fixed with a drying box, the upper end face and the lower end face of the drying box are all communicated, the inside of the drying box is horizontally fixed with a heating rod, the upper end face of the drying box is horizontally fixed with a fan plate, and a plurality of fans are communicated and connected on the fan plate.
Further, the transportation piece includes the leading truck, and the leading truck is fixed in lower terminal surface one side of two supports, and the level is fixed with the guide bar on the leading truck, and horizontal slidable mounting has the transportation board on the guide bar of leading truck, and the middle part level of leading truck is fixed with first hydraulic stem, and the output of first hydraulic stem is fixed on the transportation board, and vertical being fixed with the second hydraulic stem on the bottom surface of transportation board, and the level is provided with the support flitch directly over the transportation board, and the output of second hydraulic stem runs through the transportation board and fixes on the bottom surface of support flitch.
Further, a second guide rod is horizontally fixed on the end faces of the two adjacent vertical plates in the two groups of brackets, a second screw rod is horizontally arranged above the second guide rod, two ends of the second screw rod are rotationally connected to the faces of the two adjacent vertical plates, a motor rotationally connected with a second screw rod rotating shaft is fixed on each vertical plate, a second moving plate is horizontally and slidably installed on the second guide rod, and a screw barrel which is in threaded penetrating fit with the second screw rod is horizontally fixed on the second moving plate.
Further, two sliding rods are horizontally fixed on the adjacent end faces of two second movable plates in the two groups of supports, the first movable plate is slidably mounted on the two sliding rods of the second movable plate, a pore plate is horizontally fixed on the bottom face of the first movable plate, a third hydraulic rod is vertically fixed on the bottom face of the pore plate of the first movable plate, a third screw rod is installed in a penetrating mode through the middle horizontal threads of the second movable plate, and the end portion of the third screw rod is rotatably connected to the end face of the second movable plate.
Further, the scraping piece comprises two sliding rod frames, the two sliding rod frames are respectively arranged below the two first moving plates, the sliding rod frames are vertically and slidably inserted into the pore plates of the first moving plates, screw hole plates are vertically fixed on the bottom surfaces of the sliding rod frames, and the top ends of the sliding rod frames are connected with the output ends of the third hydraulic rods.
Further, scrapers are assembled on the screw hole plates of the two sliding rod frames, studs are horizontally fixed at one ends of the scrapers, screw grooves are horizontally formed in the other ends of the scrapers, a plurality of adjacent studs of the scrapers are in threaded assembly connection with the screw grooves, and the screw hole plates are in threaded assembly connection with the studs at the ends of the adjacent scrapers.
Further, the support pore plate is horizontally fixed on one of the two slide bar frames, the plug tube is horizontally fixed on the support pore plate, the plug rod is horizontally inserted in the plug tube, the connecting tube is horizontally fixed in the support pore plate, the feeding end of the connecting tube is communicated with the solder resist ink flow pipeline, the plug tube and the plug rod are horizontally provided with a plurality of spray rings, the outer end faces of the spray rings are horizontally fixed with hole blocks, the hole blocks are slidably inserted on the plug tube or the plug rod, the spray rings are communicated through the corrugated tube, the spray rings are communicated with the connecting tube through the corrugated tube, the bottom ends of the spray rings are vertically communicated with the nozzles, and the check valves are arranged on the nozzles.
Compared with the prior art, the invention has the beneficial effects that:
(1) According to the size of the PCB circuit board in use, first screw rods in screw barrels on the top surfaces of the two brackets are manually adjusted, first guide rods on support frames on the two brackets are horizontally pushed to slide on the brackets, and the distance between the two support frames is adjusted to meet the lifting requirements of circuit boards with different sizes;
(2) When silk screen printing is carried out on a circuit board, the silk screen printing net is prevented from being paved, two ends of the silk screen printing net paved on the circuit board are spliced upwards in the clamping frame, the clamping frame is pulled to be pressed on the vertical end face of the supporting frame under the deformation tension of the spring, so that the silk screen printing net is tensioned, the smoothness of the silk screen printing net during silk screen printing is effectively maintained, the phenomenon that silk screen printing patterns are inclined incompletely due to the fact that the silk screen printing patterns are wrinkled during scraping of the anti-welding ink during silk screen printing is avoided, meanwhile, the requirement of tensioning silk screen printing of circuit boards with different sizes is met, the length of the scraping plates is selected according to the printing length of the circuit board, studs at the adjacent ends of the scraping plates are assembled together with screw grooves in a threaded mode, the length of the anti-welding ink on the surface of the circuit board is lengthened, and meanwhile the assembled studs at the ends of the scraping plates are assembled on the screw plate, and are convenient to follow the vertical or lifting movement of the sliding rod frame, and the anti-welding ink on the surface of the circuit board is scraped;
(3) The feeding end of the connecting pipe is communicated with the solder resist ink circulation pipeline in use, then the inserted rod in the inserted cylinder is slid according to the size of the circuit board, the length of the circuit board is prolonged, then a plurality of spray rings slide on the inserted cylinder and the inserted rod, then the spray nozzles on the spray rings at proper positions are selected according to the size of the circuit board to spray the solder resist ink, the check valve in the spray rings at proper positions is opened during spraying, the solder resist ink is sprayed on the circuit board, then the scraping plate scrapes the solder resist ink on the circuit board through the solder resist ink, so that the solder resist ink does not need to be manually added, the solder resist ink is uniformly sprayed in front of the scraping plate, the operation of equipment does not need to be suspended, then manual addition is performed, the production efficiency is ensured, and the quality of the printed circuit board is maintained.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of a solder mask printing device for PCB production;
FIG. 2 is a schematic diagram of an exploded structure of a solder mask printing device for PCB production;
FIG. 3 is a schematic view of a structure of a supporting device in an exploded state in an embodiment of a solder mask printing device for PCB production;
FIG. 4 is a schematic view of the structure of a lifting member in an exploded state in an embodiment of a solder mask printing apparatus for PCB circuit board production;
FIG. 5 is a schematic view showing a structure of a drying box in an exploded state in an embodiment of a solder mask printing apparatus for PCB production;
FIG. 6 is a schematic view of a transport member in an exploded state in an embodiment of a solder mask printing apparatus for PCB circuit board production;
FIG. 7 is a schematic view showing a structure of a printing apparatus in an exploded state in an embodiment of a solder mask printing apparatus for PCB production;
FIG. 8 is a schematic view of the structure of the scraping element in an exploded state in an embodiment of a solder mask printing apparatus for PCB production;
fig. 9 is a schematic view showing a structure of a spray ring in an exploded state in an embodiment of a solder mask printing apparatus for PCB circuit board production.
In the figure: 1. a support device; 11. a bracket; 12. a lifting member; 121. a support frame; 122. a first guide bar; 123. a first screw; 124. a clamping frame; 125. a spring; 126. a frame is supported; 127. a drying box; 1271. a heating rod; 1272. a fan plate; 128. a sliding frame; 13. a transport member; 131. a guide frame; 132. a first hydraulic lever; 133. a transport plate; 134. a second hydraulic lever; 135. a material supporting plate; 2. a printing device; 21. a riser; 211. a second guide bar; 212. a second screw; 213. a second moving plate; 214. a third screw; 22. a first moving plate; 23. a third hydraulic lever; 24. a scraping piece; 241. a sliding rod frame; 242. a screw plate; 243. a scraper; 244. a screw groove; 245. a stud; 246. a hole supporting plate; 247. a plug cylinder; 248. a rod; 25. a connecting pipe; 26. a bellows; 27. a spray ring; 271. a hole block; 28. a nozzle; 29. a one-way valve.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, based on the embodiments of the invention, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the invention. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, based on the embodiments of the invention, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the invention.
Referring to fig. 1, 2, 3, 4, 5, 6, 7, 8 and 9, a solder mask printing apparatus for PCB production includes:
the supporting device 1, the supporting device 1 comprises two brackets 11, two lifting pieces 12 and a conveying piece 13, wherein the two brackets 11 are symmetrically arranged, the bottom ends of the brackets 11 are fixedly arranged, the two lifting pieces 12 are symmetrically arranged, the two lifting pieces 12 are respectively arranged on the top surfaces of the two brackets 11, the conveying piece 13 is arranged on the lower end surfaces of the two brackets 11, and the conveying piece 13 is used for feeding and discharging a PCB (printed circuit board);
the printing device 2, the printing device 2 includes riser 21 and scraping piece 24, and riser 21 symmetry is provided with four, and two riser 21 symmetries set up to a set of top surface both ends that set up at two supports 11 respectively, and the level is movably between two sets of supports 11 to be provided with two first movable plates 22, scrapes the piece 24 and is provided with two, and two scraping pieces 24 are vertical slidable mounting respectively on two first movable plates 22.
Referring to fig. 2, 3, 4 and 5, the lifting member 12 includes a supporting frame 121, a first guide rod 122 is horizontally fixed on a vertical end surface of the supporting frame 121, the first guide rod 122 is horizontally slidably inserted on a top surface of the support 11, a screw barrel is horizontally fixed in a middle portion of the top surface of the support 11, a first screw 123 is horizontally threaded in the screw barrel of the support 11, and an end portion of the first screw 123 is rotatably connected with the supporting frame 121. The support frame 121 is provided with the clamp frame 124, and the top surface of the support frame 121 is horizontally fixed with the slide frame 128, the vertical cross section of the clamp frame 124 is of an L-shaped structure, and the vertical end surface of the clamp frame 124 is fixedly provided with a rubber pad, the horizontal end surface of the clamp frame 124 is slidably inserted into the slide frame 128, the top of the horizontal end surface of the clamp frame 124 is horizontally fixed with the spring 125, the other end of the spring 125 is fixed on the top surface of the slide frame 128, and meanwhile, when silk screen printing on a circuit board is required to be avoided, two ends of the silk screen printing net paved on the circuit board are upwardly inserted into the clamp frame 124, the clamp frame 124 is pulled to be tightly pressed on the vertical end surface of the support frame 121 under the deformation tension of the spring 125, so that the silk screen printing net is tensioned, flatness of the silk screen printing is effectively maintained, wrinkles are avoided when the silk screen printing is scraped and welding ink is blocked, and the silk screen printing pattern is incomplete is caused. The vertical end top surface of the clamping frame 124 is uniformly and horizontally fixed with the supporting frame 126, the drying box 127 is horizontally fixed in the supporting frame 126, the upper end face and the lower end face of the drying box 127 are all through-arranged, the heating rod 1271 is horizontally fixed in the drying box 127, the fan plate 1272 is horizontally fixed on the upper end face of the drying box 127, the fans are connected with a plurality of fans through the fan plate 1272, the heating rod 1271 is electrically connected with an external power supply circuit, the fans on the fan plate 1272 are started to drive external air to enter the drying box 127, the heating rod 1271 in the air contact drying box 127 carries heat to be discharged from the drying box 127, the air is sprayed on a PCB circuit board, the solder resist ink for silk screen printing on the PCB circuit board is dried and heated, the drying efficiency of silk screen printing is accelerated, the size of the PCB circuit board is manually adjusted according to the PCB circuit board, the first screws 123 in the top surface screw cylinders of the two brackets 11 are horizontally pushed, the first guide rods 122 on the supporting frames 121 on the two brackets 11 slide on the brackets 11, the distance between the supporting frames 121 is adjusted, and the two supporting frames 121 are adjusted to be different in size, and the size is suitable for different circuit board lifting requirements.
Referring to fig. 3 and 6, the transporting member 13 includes a guiding frame 131, the guiding frame 131 is fixed on one side of the lower end surfaces of the two brackets 11, a guiding rod is horizontally fixed on the guiding frame 131, a transporting plate 133 is horizontally slidably mounted on the guiding rod of the guiding frame 131, a first hydraulic rod 132 is horizontally fixed in the middle of the guiding frame 131, the output end of the first hydraulic rod 132 is fixed on the transporting plate 133, a second hydraulic rod 134 is vertically fixed on the bottom surface of the transporting plate 133, a material supporting plate 135 is horizontally arranged right above the transporting plate 133, the output end of the second hydraulic rod 134 penetrates through the transporting plate 133 to be fixed on the bottom surface of the material supporting plate 135, in use, the first hydraulic rod 132 is started to drive the transporting plate 133 to horizontally slide on the guiding rod of the guiding frame 131, the circuit board is placed on the material supporting plate 135, then the first hydraulic rod 132 is started to drive the transporting plate 133 to horizontally slide on the guiding rod of the guiding frame 131, the second hydraulic rod 134 is started to drive the material supporting plate 135 to vertically move, and then the second hydraulic rod 134 is started to horizontally slide on the circuit supporting plate 12 when the circuit supporting plate is required to be lifted by moving the second hydraulic rod 12, and then the circuit supporting plate is lifted up to the circuit board 12 is not lifted, so that the circuit supporting plate is completed.
Referring to fig. 7 and 8, a second guide rod 211 is horizontally fixed on the adjacent end surfaces of two vertical plates 21 in the two sets of brackets 11, a second screw rod 212 is horizontally arranged above the second guide rod 211, two ends of the second screw rod 212 are rotationally connected to the adjacent surfaces of the two vertical plates 21, a motor rotationally connected with a rotating shaft of the second screw rod 212 is fixed on the vertical plates 21, a second moving plate 213 is horizontally and slidably mounted on the second guide rod 211, a screw cylinder in threaded penetrating fit with the second screw rod 212 is horizontally fixed on the second moving plate 213, the motor on the vertical plates 21 in each set of brackets 11 is started in use, the second screw rod 212 is driven to rotate, the second moving plate 213 is horizontally driven to horizontally slide on the second guide rod 211, and the horizontal scraping position is used for horizontally moving to scrape solder resist ink on the surface of the printed circuit board during screen printing. Two sliding rods are horizontally fixed on the adjacent end surfaces of two second moving plates 213 in the two groups of brackets 11, the first moving plate 22 is slidably mounted on the two sliding rods of the second moving plate 213, an orifice plate is horizontally fixed on the bottom surface of the first moving plate 22, a third hydraulic rod 23 is vertically fixed on the bottom surface of the orifice plate of the first moving plate 22, a third screw 214 is installed in a penetrating mode through horizontal threads in the middle of the second moving plate 213, the end portions of the third screw 214 are rotatably connected to the end surfaces of the second moving plate 213, when in use, according to the size and the dimension of a circuit board, the third screw 214 on the second moving plate 213 is manually rotated to push the sliding rods of the first moving plate 22 between the two second moving plates 213 to horizontally slide, and the interval of the solder resist ink on the surface of the circuit board is scraped in use is adjusted.
Referring to fig. 8 and 9, the scraping member 24 includes two sliding rod frames 241, the sliding rod frames 241 are disposed below the two first moving plates 22, the sliding rod frames 241 are vertically slidably inserted into the hole plates of the first moving plates 22, the screw holes 242 are vertically fixed on the bottom surfaces of the sliding rod frames 241, and the top ends of the sliding rod frames 241 are connected with the output ends of the third hydraulic rods 23, and in use, the third hydraulic rods 23 are started to drive the sliding rod frames 241 to vertically lift and slide in the hole plates of the first moving plates 22, so as to adjust the height of the solder resist ink on the surface of the scraping circuit board. The screw plates 242 of the two slide bar frames 241 are respectively assembled with a scraping plate 243, one end of each scraping plate 243 is horizontally fixed with a stud 245, the other end of each scraping plate 243 is horizontally provided with a screw groove 244, adjacent studs 245 of a plurality of scraping plates 243 are in threaded assembling connection with the screw grooves 244, the screw plates 242 are in threaded assembling connection with the studs 245 at the end parts of the adjacent scraping plates 243, the length of each scraping plate 243 is selected according to the printing length of a circuit board, the studs 245 at the adjacent end parts of the plurality of scraping plates 243 are in threaded assembling connection with the screw grooves 244 together, the length of solder resist ink on the surface of the circuit board is lengthened, and meanwhile, the assembled studs 245 at the end parts of the plurality of scraping plates 243 are assembled on the screw plates 242 so as to be convenient to follow the vertical or lifting movement of the sliding bar frames 241, and the solder resist ink on the surface of the circuit board is scraped. A supporting hole plate 246 is horizontally fixed on one of the screw hole plates 242 of the two slide bar frames 241, an inserting cylinder 247 is horizontally fixed on the supporting hole plate 246, an inserting rod 248 is horizontally and movably inserted in the inserting cylinder 247, a connecting pipe 25 is horizontally fixed in the supporting hole plate 246, the feeding end of the connecting pipe 25 is communicated with a welding-resistant ink flowing pipeline, a plurality of spray rings 27 are horizontally arranged on the inserting cylinder 247 and the inserting rod 248, a hole block 271 is horizontally fixed on the outer end surface of the plurality of spray rings 27, the hole block 271 is slidably inserted on the inserting cylinder 247 or the inserting rod 248, the plurality of spray rings 27 are communicated through a corrugated pipe 26, the plurality of spray rings 27 are communicated with the connecting pipe 25 through the corrugated pipe 26, the bottom end of the spray rings 27 is vertically communicated with a nozzle 28, a one-way valve 29 is arranged on the nozzle 28, in use, the feed end of the connecting pipe 25 is communicated with a solder resist ink flow pipeline, then the inserted rod 248 in the inserted cylinder 247 is slid according to the size of the circuit board, the length of the circuit board is prolonged, then a plurality of spray rings 27 slide on the inserted cylinder 247 and the inserted rod 248, then the spray nozzles 28 on the spray rings 27 at proper positions are selected according to the size of the circuit board to spray solder resist ink, the check valve 29 in the spray rings 27 at proper positions is opened during spraying, the solder resist ink is sprayed on the circuit board, then the scraping plate 243 scrapes the solder resist ink on the circuit board, so that the solder resist ink does not need to be manually added, the solder resist ink is uniformly sprayed in front of the scraping plate 243, the operation of equipment is not required to be stopped, then the manual addition is performed, the production efficiency is ensured, and the quality of the printed circuit board is maintained.
Working principle: starting the first hydraulic rod 132 to drive the transport plate 133 to horizontally slide on the guide rods of the guide frame 131, enabling the transport plate 133 to reach the side far away from the guide frame 131, placing the circuit board on the material supporting plate 135, then starting the first hydraulic rod 132 to drive the transport plate 133 to horizontally slide on the guide rods of the guide frame 131 to a feeding position, starting the second hydraulic rod 134 to drive the material supporting plate 135 to move upwards according to the size of the PCB circuit board, manually adjusting the first screw rods 123 in the screw cylinders on the top surfaces of the two brackets 11 according to the size of the PCB circuit board, horizontally pushing the first guide rods 122 on the support frames 121 on the two brackets 11 to slide on the brackets 11, adjusting the distance between the two support frames 121 to lift the circuit board to finish printing feeding, simultaneously, needing to be upwards inserted in the clamp frame 124 when the circuit board is prevented from being laid with silk-screen printing, pulling the clamp frame 124 to be pressed on the vertical end surface of the support frame 121 under the deformation tension of the spring 125, thereby tensioning the silk-screen, manually adjusting the feeding end of the material supporting plate 25 and the ink-blocking pipeline, then horizontally pushing the first guide rods 122 on the support frames 121 to slide on the side of the two brackets 11 according to the size of the ink-blocking pipeline, then horizontally sliding on the side of the second guide rods 248, and then horizontally sliding the spray valve, opening the side of the spray valve, 27, and horizontally sliding on the side of the spray valve, 27, and opening the side of the spray valve, and horizontally, and opening the side of the spray valve, 27, so as to change the size of the ink-blocking plate, and the ink-blocking plate on the side, and the top of the spray valve, when the ink-stop plate, and the ink-jet valve, so as to be suitable for a size, when the printed circuit board is fed, the material supporting plate 135 is moved to reach the position right below the circuit board, the second hydraulic rod 134 is started to drive the material supporting plate 135 to move upwards to lift the circuit board, then the lifting piece 12 is moved to release the circuit board, and the first hydraulic rod 132 is started to drive the conveying plate 133 to horizontally slide on the guide rod of the guide frame 131 to reach the feeding end.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, and various modifications and variations may be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. Solder mask printing device for PCB circuit board production, which is characterized by comprising:
the supporting device (1), the supporting device (1) comprises two brackets (11), lifting pieces (12) and conveying pieces (13), wherein the two brackets (11) are symmetrically arranged, the bottom ends of the brackets (11) are fixedly arranged, the two lifting pieces (12) are symmetrically arranged, the two lifting pieces (12) are respectively arranged on the top surfaces of the two brackets (11), the conveying pieces (13) are arranged on the lower end surfaces of the two brackets (11), and the conveying pieces (13) are used for feeding and discharging a PCB (printed circuit board);
printing device (2), printing device (2) include riser (21) and scrape material spare (24), riser (21) symmetry is provided with four, and two riser (21) symmetry set up to a set of top surface both ends that set up at two supports (11), and the level is movable between two sets of supports (11) is provided with two first movable plates (22), scrape material spare (24) and be provided with two, and two scrape material spare (24) vertical slidable mounting respectively on two first movable plates (22).
2. The solder resist printing device for producing the PCB circuit board according to claim 1, wherein the lifting piece (12) comprises a supporting frame (121), first guide rods (122) are horizontally fixed on vertical end faces of the supporting frame (121), the first guide rods (122) are horizontally and slidably inserted on the top face of the support (11), a screw barrel is horizontally fixed in the middle of the top face of the support (11), a first screw rod (123) is horizontally and spirally installed in the screw barrel of the support (11), and the end portions of the first screw rod (123) are rotatably connected with the supporting frame (121).
3. The solder resist printing device for producing a PCB (printed Circuit Board) according to claim 2, wherein a clamping frame (124) is arranged on the supporting frame (121), a sliding frame (128) is horizontally fixed on the top surface of the supporting frame (121), the vertical section of the clamping frame (124) is of an L-shaped structure, a rubber pad is fixed on the vertical end surface of the clamping frame (124), the horizontal end surface of the clamping frame (124) is slidably inserted into the sliding frame (128), a spring (125) is horizontally fixed on the top of the horizontal end surface of the clamping frame (124), and the other end of the spring (125) is fixed on the top surface of the sliding frame (128).
4. The solder resist printing device for producing a PCB circuit board according to claim 3, wherein a supporting frame (126) is uniformly and horizontally fixed on the top surface of the vertical end of the clamping frame (124), a drying box (127) is horizontally fixed in the supporting frame (126), the upper end surface and the lower end surface of the drying box (127) are all through-arranged, a heating rod (1271) is horizontally fixed in the drying box (127), a fan plate (1272) is horizontally fixed on the upper end surface of the drying box (127), and a plurality of fans are through-connected on the fan plate (1272).
5. The solder resist printing device for producing a PCB circuit board according to claim 1, wherein the transporting member (13) comprises a guiding frame (131), the guiding frame (131) is fixed on one side of the lower end faces of the two brackets (11), a guiding rod is horizontally fixed on the guiding frame (131), a transporting plate (133) is horizontally slidably mounted on the guiding rod of the guiding frame (131), a first hydraulic rod (132) is horizontally fixed on the middle part of the guiding frame (131), the output end of the first hydraulic rod (132) is fixed on the transporting plate (133), a second hydraulic rod (134) is vertically fixed on the bottom face of the transporting plate (133), a material supporting plate (135) is horizontally arranged right above the transporting plate (133), and the output end of the second hydraulic rod (134) penetrates through the transporting plate (133) to be fixed on the bottom face of the material supporting plate (135).
6. The solder resist printing device for producing the PCB circuit board according to claim 1, wherein a second guide rod (211) is horizontally fixed on the adjacent end surfaces of two vertical plates (21) in the two groups of brackets (11), a second screw rod (212) is horizontally arranged above the second guide rod (211), two ends of the second screw rod (212) are rotatably connected on the adjacent surfaces of the two vertical plates (21), a motor rotationally connected with a rotating shaft of the second screw rod (212) is fixed on the vertical plates (21), a second moving plate (213) is horizontally and slidably installed on the second guide rod (211), and a screw cylinder in threaded penetrating fit with the second screw rod (212) is horizontally fixed on the second moving plate (213).
7. The solder resist printing device for producing a PCB circuit board according to claim 6, wherein two slide bars are horizontally fixed on the adjacent end faces of two second moving plates (213) in the two sets of brackets (11), the first moving plate (22) is slidably mounted on the two slide bars of the second moving plate (213), a hole plate is horizontally fixed on the bottom surface of the first moving plate (22), a third hydraulic rod (23) is vertically fixed on the bottom surface of the hole plate of the first moving plate (22), a third screw rod (214) is horizontally threaded and installed in the middle of the second moving plate (213), and the end part of the third screw rod (214) is rotatably connected on the end face of the second moving plate (213).
8. The solder resist printing device for producing a PCB (printed Circuit Board) according to claim 7, wherein the scraping piece (24) comprises two sliding rod frames (241), the two sliding rod frames (241) are respectively arranged below the two first moving plates (22), the sliding rod frames (241) are vertically and slidably inserted into the pore plates of the first moving plates (22), screw hole plates (242) are vertically fixed on the bottom surfaces of the sliding rod frames (241), and the top ends of the sliding rod frames (241) are connected with the output ends of the third hydraulic rods (23).
9. The solder resist printing device for producing a PCB circuit board according to claim 8, wherein a scraper (243) is assembled on screw hole plates (242) of the two slide bar frames (241), a stud (245) is horizontally fixed at one end of the scraper (243), a screw groove (244) is horizontally arranged at the other end of the scraper (243), a plurality of adjacent studs (245) of the scraper (243) are assembled and connected with the screw groove (244) through threads, and the screw hole plates (242) are assembled and connected with the studs (245) at the end parts of the adjacent scrapers (243) through threads.
10. The solder resist printing device for producing a PCB circuit board according to claim 9, wherein a hole supporting plate (246) is horizontally fixed on one of the two slide bar frames (241) and a hole supporting plate (246), a plug tube (247) is horizontally fixed on the hole supporting plate (246), a plug rod (248) is horizontally inserted in the hole supporting plate (246), a connecting pipe (25) is horizontally fixed in the hole supporting plate (246), a feeding end of the connecting pipe (25) is communicated with a solder resist ink flowing pipeline, a plurality of spray rings (27) are horizontally arranged on the plug tube (247) and the plug rod (248), a hole block (271) is horizontally fixed on an outer end face of the spray rings (27), the hole block (271) is slidingly inserted on the plug tube (247) or the plug rod (248), the spray rings (27) are communicated through corrugated pipes (26), the spray rings (27) are communicated with the connecting pipe (25) through the corrugated pipes (26), a plurality of spray nozzles (28) are arranged at the bottom ends of the spray rings (27), and a one-way valve (29) is arranged on the spray nozzles (28).
CN202310909503.XA 2023-07-24 2023-07-24 Solder resist wire seal device for PCB circuit board production Pending CN116691126A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310909503.XA CN116691126A (en) 2023-07-24 2023-07-24 Solder resist wire seal device for PCB circuit board production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310909503.XA CN116691126A (en) 2023-07-24 2023-07-24 Solder resist wire seal device for PCB circuit board production

Publications (1)

Publication Number Publication Date
CN116691126A true CN116691126A (en) 2023-09-05

Family

ID=87835930

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310909503.XA Pending CN116691126A (en) 2023-07-24 2023-07-24 Solder resist wire seal device for PCB circuit board production

Country Status (1)

Country Link
CN (1) CN116691126A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117119703A (en) * 2023-09-25 2023-11-24 深圳市鑫格美科技有限公司 Lossless antenna self-shaping equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117119703A (en) * 2023-09-25 2023-11-24 深圳市鑫格美科技有限公司 Lossless antenna self-shaping equipment

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