CN116690867A - Forming tool for semiconductor processing - Google Patents
Forming tool for semiconductor processing Download PDFInfo
- Publication number
- CN116690867A CN116690867A CN202310972991.9A CN202310972991A CN116690867A CN 116690867 A CN116690867 A CN 116690867A CN 202310972991 A CN202310972991 A CN 202310972991A CN 116690867 A CN116690867 A CN 116690867A
- Authority
- CN
- China
- Prior art keywords
- plates
- welded
- grooves
- upper die
- lower die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 238000005266 casting Methods 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 230000005855 radiation Effects 0.000 claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 claims description 33
- 238000009423 ventilation Methods 0.000 claims description 28
- 238000000465 moulding Methods 0.000 claims description 20
- 210000001503 joint Anatomy 0.000 claims description 17
- 230000000149 penetrating effect Effects 0.000 claims description 11
- 230000001680 brushing effect Effects 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 4
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 11
- 239000000428 dust Substances 0.000 abstract description 10
- 230000000903 blocking effect Effects 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 239000004033 plastic Substances 0.000 description 19
- 239000000463 material Substances 0.000 description 9
- 239000005022 packaging material Substances 0.000 description 7
- 238000007664 blowing Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/26—Moulds or cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/38—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention provides a forming tool for semiconductor processing, which relates to the technical field of semiconductor forming and comprises a lower die and an upper die, wherein two expansion plates with enlarged areas are welded at the top end of the upper die and the bottom of the lower die, and two contact supporting frames are symmetrically welded at the bottoms of the left end and the right end of the bottom expansion plate; the lower die and the upper die are symmetrically provided with casting grooves with two prescription structures, the blocking plates of the two casting grooves are respectively penetrated and embedded with a metal heat radiation plate, the positions of the lower die and the upper die corresponding to the two casting grooves are respectively symmetrically provided with mounting grooves with two prescription structures, and the brush assembly can be driven to slide forwards and backwards to carry out friction cleaning on dust attached to a row of hidden built-in heat radiation grating plates through the power transmission of the pull rod by directly pulling the sliding handle forwards and backwards.
Description
Technical Field
The invention relates to the technical field of semiconductor molding, in particular to a molding tool for semiconductor processing.
Background
The chip manufacturing process comprises a plastic packaging process, wherein the plastic packaging process comprises the steps of placing a chip and a lead frame which are subjected to lead bonding in a die cavity, injecting plastic packaging compound epoxy resin, and cooling and forming the epoxy resin to wrap a wafer and gold wires on the lead frame, so as to protect elements from damage, prevent gas from oxidizing the internal chip, and ensure the safety and stability of the product, wherein a forming tool is needed for cooling and forming the epoxy resin.
The existing forming tool is provided with a plurality of heat dissipation components, particularly metal heat dissipation grille sheets, the metal heat dissipation grille sheets are arranged in the inner space of the forming tool and are positioned in the air duct which is beneficial to heat dissipation, so that the heat dissipation grille sheets need to be taken out for implementation when being cleaned, and the forming tool or the heat dissipation air duct must be detached and opened in such a way, so that the cleaning operation is more troublesome and inconvenient, and the rapid and efficient cleaning of the heat dissipation components is not facilitated.
Disclosure of Invention
In view of this, the present invention provides a forming tool for semiconductor processing, so as to solve the problem that when the metal heat dissipation grille is cleaned, the heat dissipation grille needs to be taken out to be implemented, and the forming tool or the heat dissipation air duct must be disassembled and opened, so that the cleaning operation is troublesome and inconvenient, and the quick and efficient cleaning of the heat dissipation component is not facilitated.
The invention provides a molding tool for semiconductor processing, which specifically comprises: the upper die and the lower die are the same in integral structure, two expansion plates with enlarged areas are welded at the top end of the upper die and the bottom of the lower die, and two touch support frames are symmetrically welded at the bottoms of the left end and the right end of the bottom expansion plate; casting grooves with two prescription structures are symmetrically formed in the lower die and the upper die, a metal heat radiation plate is embedded in the plugging plates of the two casting grooves in a penetrating mode, mounting grooves with two prescription structures are symmetrically formed in the positions, corresponding to the two casting grooves, of the lower die and the upper die, a row of heat radiation grating plates are welded on one side, facing the mounting grooves, of the metal heat radiation plate at equal intervals, and the row of heat radiation grating plates are inserted in the mounting grooves; four ventilation grooves are symmetrically formed in the positions, corresponding to the front and rear positions of the two mounting grooves, of the lower die and the upper die, two handle bars are symmetrically and slidably arranged on the openings of the front end and the rear end of each ventilation groove, filter frames with rectangular structures are welded at the left end and the right end of each handle bar, and the filter frames are in plug-in fit with the openings of the ventilation grooves; the mounting groove is communicated with the expansion plate, a fan is mounted on the opening of the mounting groove in a locking manner through screws, a rectangular cover plate is welded at the position of the air suction opening of the fan, and the rectangular cover plate is in plug-in fit with the opening of the mounting groove; two pull rods are symmetrically welded backwards at the middle positions of the top ends of the two filter frames at the front side, the two pull rods penetrate through two ventilation grooves at the front side, two brushing assemblies are welded at the head ends of the two pull rods, a metal radiating plate is in direct contact with plastic packaging materials in the casting grooves, heat transfer and discharge can be carried out on the plastic packaging materials, a row of radiating grid plates are welded and fixed on the metal radiating plate, the metal radiating plate can directly conduct heat on a row of radiating grid plates, a flowing wind field is formed in the front ventilation groove, the rear ventilation groove and the inside of the mounting groove under the suction of a fan, the flowing wind field can carry out continuous blowing and radiating on the row of radiating grid plates, the plastic packaging materials in the casting grooves can be cooled rapidly and efficiently, in addition, the filter frames are blocked and covered on the ventilation grooves, dust blocking and filtering can be carried out on air entering the wind fields, the filter frames and the handle bars are pushed and positioned through a longitudinal sliding shaft and a spring on the filter frames, the repeated pulling and loosening handle bars can drive the filter frames to intermittently contact with the ventilation grooves, and the intermittent dust blocking and cleaning and vibration of the filter frames are carried out; the brush assembly is integrally formed by a row of upright plates which are arranged at equal intervals and a transverse support connecting plate welded at the bottom of the row of upright plates, wherein the row of upright plates are arranged in a group of two, each group of upright plates is provided with two sponge strips which are fixed in a left-right corresponding manner, and the two sponge strips are in brush contact with the left side and the right side of the heat dissipation grating plate.
Further, the inside of filter frame covers and is provided with the metal filter screen, and the intermediate position welding of filter frame has a department mouth font braced frame, and mouth font braced frame and the left end or the right-hand member welded fastening of barre together.
Further, two rectangular hole grooves are symmetrically formed in the middle positions of the lower die and the upper die in a penetrating mode, the sections of the two rectangular hole grooves are of square structures, two locating plates are welded in the two rectangular hole grooves in a front-back corresponding mode, and the two locating plates are close to the front end opening and the rear end opening of the two rectangular hole grooves respectively.
Furthermore, two longitudinal sliding shafts are correspondingly welded on the middle section of the front handle bar and the rear handle bar at left-right intervals, and the two longitudinal sliding shafts are correspondingly in penetrating sliding fit with the two positioning plates through spring pushing.
Further, two hydraulic rods are symmetrically and vertically arranged at the middle positions of the two ground contact supporting frames, and the top ends of piston rods of the two hydraulic rods are fixedly connected with the left end and the right end of the upper expansion plate.
Further, a diversion trench arranged by a cross brace is arranged between two casting trenches on the lower die and the upper die, a grouting pipe is welded at the middle position of the top end of the upper die, and the bottom section of the grouting pipe is communicated with the diversion trench.
Furthermore, four positioning columns are symmetrically welded on the peripheral part of the bottom side of the upper die, four positioning holes are symmetrically formed on the peripheral part of the top end of the upper die, and the four positioning columns and the four positioning holes are in penetrating and inserting fit.
Further, the brush assembly slides forward in normal state and is separated from the mounting groove and is positioned in the front side space of the mounting groove, and the pull rod penetrates through the head end section of the interval space between the two middle heat dissipation grating plates and is welded and fixed with the top ends of the two middle vertical plates.
Further, one row of the standing plates slides through the spacing spaces between one row of the heat radiation grating plates.
Further, when the upper die and the lower die are in butt joint with the lower die, the upper mounting groove and the lower mounting groove are in butt joint combination, and the upper diversion groove and the lower diversion groove are in butt joint combination.
The beneficial effects are that: 1. the metal heat radiation plate is directly contacted with the plastic package material in the casting groove, heat conduction can be carried out on the plastic package material, a row of heat radiation grating plates are welded and fixed on the metal heat radiation plate, the metal heat radiation plate can directly conduct heat on the row of heat radiation grating plates, a flowing wind field is formed in the front and rear ventilation grooves and the mounting groove under the suction of the fan, specifically, outside wind is sucked into the mounting groove through the front and rear ventilation grooves and is discharged from the air outlet of the fan, and the flowing wind field can carry out wind blowing heat radiation on the row of heat radiation grating plates, so that the effect of rapidly cooling the plastic package material in the casting groove is achieved.
2. According to the invention, the filter frame is covered on the ventilation groove to filter air entering the wind field, the filter frame and the handle bar are pushed and slipped through the longitudinal sliding shaft and the spring on the filter frame, the filter frame and the opening of the ventilation groove can be driven to intermittently collide and vibrate by repeatedly pulling and loosening the handle bar, vibration cleaning is carried out on accumulated dust intercepted on the filter frame, friction cleaning is carried out on dust attached to a row of hidden heat dissipation grating plates by directly pulling and sliding the handle bar back and forth to drive the brush assembly to slide back and forth through power transmission of the pull rod, and the cleaned dust can be directly sucked and discharged by the fan, so that the cleaning of the heat dissipation grating plates can be completed under the condition of not detaching the mould and the heat dissipation air duct.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings of the embodiments will be briefly described below.
The drawings described below are only for illustration of some embodiments of the invention and are not intended to limit the invention.
In the drawings:
FIG. 1 is a schematic view of the overall front side structure of a molding tool for semiconductor processing according to the present invention;
FIG. 2 is a schematic view of the overall backside structure of a molding tool for semiconductor processing according to the present invention;
FIG. 3 is a schematic view of the overall bottom side structure of a molding tool for semiconductor processing according to the present invention;
FIG. 4 is a schematic view of the lower die structure of the molding tool for semiconductor processing according to the present invention;
FIG. 5 is a schematic view of a metal heat sink plate of a molding tool for semiconductor processing according to the present invention;
FIG. 6 is a schematic view of the semi-sectioned inside structure of the mounting slot of the molding tool for semiconductor processing according to the present invention;
FIG. 7 is a schematic view of the structure of a handle bar of a molding tool for semiconductor processing according to the present invention;
fig. 8 is a schematic view of the brush assembly of the molding tool for semiconductor processing according to the present invention.
List of reference numerals
1. A lower die; 2. an upper die; 201. grouting pipe; 3. a hydraulic rod; 4. a blower; 5. a handle bar; 501. a filter frame; 502. a pull rod; 503. a brushing assembly; 504. a longitudinal slide shaft; 505. a sponge strip; 6. a metal heat dissipation plate; 601. a heat-dissipating grating plate; 7. a diversion trench; 8. a slot; 801. a positioning plate; 9. and a mounting groove.
Detailed Description
In order to make the objects, aspects and advantages of the technical solution of the present invention more clear, the technical solution of the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings of the specific embodiment of the present invention.
Please refer to fig. 1 to 8:
embodiment one: the invention provides a forming tool for semiconductor processing, which comprises a lower die 1 and an upper die 2, wherein the lower die 1 and the upper die 2 have the same integral structure, two expansion plates with enlarged areas are welded at the top end of the upper die 2 and the bottom of the lower die 1, and two contact support frames are symmetrically welded at the bottoms of the left end and the right end of the bottom expansion plate; the lower die 1 and the upper die 2 are symmetrically provided with casting grooves with two prescription structures, the blocking plates of the two casting grooves are respectively penetrated and internally provided with a metal heat radiation plate 6, the metal heat radiation plate 6 is in direct contact with plastic packaging materials in the casting grooves, the plastic packaging materials can be subjected to heat conduction, a row of heat radiation grating plates 601 are welded and fixed on the metal heat radiation plate 6, the metal heat radiation plate 6 can directly conduct heat on a row of heat radiation grating plates 601, under the suction of a fan 4, a flowing wind field is formed in the front and rear ventilation grooves and the mounting groove 9, specifically, outside wind is sucked into the mounting groove 9 through the front and rear ventilation grooves and is discharged through the air outlet of the fan 4, the flowing wind field can be used for implementing wind blowing and heat radiation on the row of heat radiation grating plates 601, the mounting groove 9 with two prescription structures are symmetrically arranged at positions on the lower die 1 and the upper die 2 corresponding to the two casting grooves, a row of heat radiation grating plates 601 are welded at intervals on one side of the metal 6 facing the mounting groove 9, and the heat radiation grating plates 9 are arranged in the mounting groove 9 in an equidistant manner; four ventilation grooves are symmetrically formed in the positions, corresponding to the front and rear positions, of the two mounting grooves 9 on the lower die 1 and the upper die 2, two handle bars 5 are symmetrically and slidably arranged on the openings of the front end and the rear end of each ventilation groove, a filter frame 501 with a rectangular structure is welded at the left end and the right end of each handle bar 5, the filter frame 501 is in plug fit with the opening part of each ventilation groove, the filter frame 501 is covered on the ventilation grooves in a blocking manner, air entering a wind field can be filtered, the filter frame 501 and the handle bars 5 are slidably mounted through the longitudinal sliding shafts 504 and the springs on the filter frame 501, the filter frame 501 and the openings of the ventilation grooves are repeatedly pulled and loosened to perform vibration cleaning on the filter frame 501, the brush assembly 503 is directly and slidably moved back and forth to perform friction cleaning on a row of hidden heat dissipation grid plates 601 through the power transmission of the pull rod 502, and the cleaned dust can be directly sucked and discharged by the fan 4, and further the heat dissipation assembly can be conveniently cleaned on the heat dissipation grids of the invention, and the heat dissipation plate can be conveniently and rapidly cleaned by the conventional heat dissipation technology; the mounting groove 9 is communicated with the expansion plate, a fan 4 is mounted on the opening of the mounting groove 9 through screw locking, a rectangular cover plate is welded at the position of the air suction opening of the fan 4, and the rectangular cover plate is in plug-in fit with the opening of the mounting groove 9; two pull rods 502 are symmetrically welded backwards at the middle positions of the top ends of the two filter frames 501 at the front side, the two pull rods 502 penetrate through two ventilation grooves at the front side, and two brushing assemblies 503 are welded at the head ends of the two pull rods 502; the brush assembly 503 is integrally formed by a row of upright plates arranged at equal intervals and a transverse support connecting plate welded at the bottom of the row of upright plates, the row of upright plates are arranged in pairs, two sponge strips 505 are fixed on each group of upright plates in a left-right corresponding manner, and the two sponge strips 505 are in brush contact with the left side and the right side of the heat dissipation grating plate 601 correspondingly.
Wherein, the filter frame 501 is covered with a metal filter screen, and a square support frame is welded in the middle of the filter frame 501, and the square support frame is welded and fixed with the left end or the right end of the handle 5.
Wherein, two rectangular hole grooves 8 have all been run through to the intermediate position symmetry of lower mould 1 and last mould 2, and the cross-section of two rectangular hole grooves 8 is square structure, and is the front and back corresponding welding in two rectangular hole grooves 8 and has two locating plates 801, and two locating plates 801 are close to the front and back both ends opening of two rectangular hole grooves 8 respectively.
Wherein, two longitudinal sliding shafts 504 are correspondingly welded on the middle section of the front and rear handle bars 5 at left and right intervals, and the two longitudinal sliding shafts 504 are correspondingly in penetrating sliding fit with two positioning plates 801 through spring pushing.
Embodiment two: the invention provides a forming tool for semiconductor processing, which further comprises two hydraulic rods 3 symmetrically and vertically supported at the middle positions of two ground contact supporting frames, wherein the top ends of piston rods of the two hydraulic rods 3 are fixedly connected with the left end and the right end of an upper expansion plate.
The two casting grooves on the lower die 1 and the upper die 2 are respectively provided with a guide groove 7, wherein a cross brace is arranged at one position between the two casting grooves, a grouting pipe 201 is welded at the middle position of the top end of the upper die 2, the bottom section of the grouting pipe 201 is communicated with the guide grooves 7, and the grouting pipe 201 is connected with an external plastic package material supply system.
Four positioning columns are symmetrically welded on the peripheral part of the bottom side of the upper die 2, four positioning holes are symmetrically formed on the peripheral part of the top end of the upper die 2, and the four positioning columns and the four positioning holes are in penetrating and inserting fit.
The brushing component 503 slides forward to be separated from the mounting groove 9 and is located in the front side space of the mounting groove 9, and the pull rod 502 passes through the head end section of the interval space between the two middle heat dissipation grating plates 601 and is welded and fixed with the top ends of the two middle vertical plates.
Wherein a row of upstanding plates is slipped through the spacing spaces between a row of heat dissipating grid plates 601.
When the upper die 2 and the lower die 1 are in sliding butt joint, the upper mounting groove 9 and the lower mounting groove 9 are in butt joint and are combined together, the upper guide groove 7 and the lower guide groove 7 are in butt joint and are combined together, the two hydraulic rods 3 are used for controlling the lifting of the upper die 2, the upper die 2 and the lower die 1 are driven to open and close, when the upper die 2 and the lower die 1 are in sliding butt joint, plastic package materials flow into the upper casting groove and the lower casting groove which are in butt joint through the grouting pipe 201 and the two guide grooves 7 which are in butt joint in sequence, and the plastic package materials are cooled and molded in the upper casting groove and the lower casting groove which are in butt joint and finish solidifying and wrapping of gold wires on a wafer and a lead frame.
Specific use and action of the embodiment: in the invention, a grouting pipe 201 is connected with an external plastic package material supply system, two hydraulic rods 3 are used for controlling the lifting of an upper die 2, opening and closing driving is carried out on the upper die 2 and a lower die 1, when the upper die 2 and the lower die are in sliding butt joint with the lower die 1, four positioning columns are in penetrating and inserting fit with four positioning holes, the plastic package material flows into an upper casting groove and a lower casting groove which are in butt joint together sequentially through the grouting pipe 201 and two guide grooves 7 which are in butt joint together, and the plastic package material is cooled and molded in the upper casting groove and the lower casting groove which are in butt joint together, and solidification and wrapping of a wafer and gold wires on a lead frame are completed;
the metal heat dissipation plate 6 is in direct contact with the plastic packaging material in the casting tank, heat conduction can be carried out on the plastic packaging material, a row of heat dissipation grating plates 601 are welded and fixed on the metal heat dissipation plate 6, the metal heat dissipation plate 6 can directly conduct heat on the row of heat dissipation grating plates 601, under the suction of the fan 4, outside wind is sucked into the mounting groove 9 through the front ventilation groove and the rear ventilation groove and is discharged from the air outlet of the fan 4, and the flowing wind field can carry out wind blowing heat dissipation on the row of heat dissipation grating plates 601;
the filter frame 501 is covered on the ventilation groove to filter the air entering the wind field, the filter frame 501 and the handle 5 are installed by pushing and sliding through the longitudinal sliding shaft 504 and the spring thereon, repeated pulling and loosening of the handle 5 can drive the filter frame 501 to intermittently collide with the opening of the ventilation groove to clean the dust intercepted and accumulated on the filter frame 501, and the direct front and back sliding of the handle 5 can drive the brushing assembly 503 to slide front and back to clean the dust adhered on the hidden built-in heat dissipation grating plate 601 by the power transmission of the pull rod 502, and the cleaned dust can be directly sucked and discharged by the fan 4.
Claims (10)
1. The forming tool for semiconductor processing is characterized by comprising a lower die (1) and an upper die (2), wherein the lower die (1) and the upper die (2) have the same integral structure, two expansion plates with enlarged areas are welded at the top end of the upper die (2) and the bottom of the lower die (1), and two contact support frames are symmetrically welded at the bottoms of the left end and the right end of the bottom expansion plate; casting grooves with two prescription structures are symmetrically formed in the lower die (1) and the upper die (2), a metal radiating plate (6) is embedded in the plugging plates of the two casting grooves in a penetrating mode, mounting grooves (9) with two prescription structures are symmetrically formed in the positions, corresponding to the two casting grooves, of the lower die (1) and the upper die (2), one side, facing the mounting grooves (9), of the metal radiating plate (6) is welded with a row of radiating grid plates (601) at equal intervals, and the row of radiating grid plates (601) are inserted into the mounting grooves (9); four ventilation grooves are symmetrically formed in the positions, corresponding to the front and rear positions of the two mounting grooves (9), of the lower die (1) and the upper die (2), two handle bars (5) are symmetrically and slidably arranged on the openings of the front end and the rear end of each ventilation groove, filter frames (501) with rectangular structures are welded at the left end and the right end of each handle bar (5), and the filter frames (501) are in plug-in fit with the openings of the ventilation grooves; the mounting groove (9) is communicated with the expansion plate, a fan (4) is mounted on the opening of the mounting groove (9) through screw locking, a rectangular cover plate is welded at the position of the air suction opening of the fan (4), and the rectangular cover plate is in plug-in fit with the opening of the mounting groove (9); two pull rods (502) are symmetrically welded backwards at the middle positions of the top ends of the two filter frames (501) on the front side, the two pull rods (502) penetrate through two ventilation grooves on the front side, and two brushing assemblies (503) are welded at the head ends of the two pull rods (502); the brush assembly (503) is integrally formed by a row of upright plates which are arranged at equal intervals and a transverse support connecting plate welded at the bottom of the row of upright plates, the row of upright plates are arranged in pairs, each group of upright plates is provided with two sponge strips (505) which are fixed on the left side and the right side of each group of upright plates in a corresponding manner, and the two sponge strips (505) are in brush contact with the left side and the right side of the heat dissipation grating plate (601).
2. A semiconductor processing molding tool according to claim 1, wherein: the inside of filter frame (501) covers and is provided with the metal filter screen, and the intermediate position welding of filter frame (501) has a mouthful font braced frame, and mouthful font braced frame is in the same place with the left end or the right-hand member welding of barre (5).
3. A semiconductor processing molding tool according to claim 1, wherein: two long-strip hole grooves (8) are symmetrically formed in the middle of the lower die (1) and the middle of the upper die (2) in a penetrating mode, the sections of the two long-strip hole grooves (8) are of square structures, two locating plates (801) are welded in the two long-strip hole grooves (8) in a front-back corresponding mode, and the two locating plates (801) are respectively close to the front end opening and the rear end opening of the two long-strip hole grooves (8).
4. A semiconductor processing molding tool according to claim 3, wherein: two longitudinal sliding shafts (504) are correspondingly welded on the middle section of the handle rod (5) at left and right intervals in front and back, and the two longitudinal sliding shafts (504) are correspondingly in penetrating sliding fit with two positioning plates (801) through spring pushing.
5. A semiconductor processing molding tool according to claim 1, wherein: two hydraulic rods (3) are symmetrically and vertically supported at the middle positions of the two ground contact supporting frames, and the top ends of piston rods of the two hydraulic rods (3) are fixedly connected with the left end and the right end of the upper expansion plate.
6. A semiconductor processing molding tool according to claim 1, wherein: the casting mould is characterized in that a diversion trench (7) which is arranged by a cross brace is arranged between two casting trenches on the lower mould (1) and the upper mould (2), a grouting pipe (201) is welded at the middle position of the top end of the upper mould (2), and the bottom section of the grouting pipe (201) is communicated with the diversion trench (7).
7. A semiconductor processing molding tool according to claim 1, wherein: four positioning columns are symmetrically welded on the periphery of the bottom side of the upper die (2), four positioning holes are symmetrically formed on the periphery of the top end of the upper die (2), and the four positioning columns and the four positioning holes penetrate and are matched in a penetrating and inserting mode.
8. A semiconductor processing molding tool according to claim 1, wherein: the brushing component (503) slides forwards in normal state, is separated from the mounting groove (9) and is positioned in the front side space of the mounting groove (9), and the pull rod (502) passes through the head end section of the interval space between the two middle radiating grating plates (601) and is welded and fixed with the top ends of the two middle vertical plates.
9. A semiconductor processing molding tool according to claim 1, wherein: one row of the standing plates is slipped through the spacing spaces between one row of the heat radiation grating plates (601).
10. A semiconductor processing molding tool according to claim 6, wherein: when the upper die (2) and the lower die are in butt joint with the lower die (1), the upper mounting groove (9) and the lower mounting groove (9) are in butt joint combination, and the upper diversion groove (7) and the lower diversion groove (7) are in butt joint combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310972991.9A CN116690867A (en) | 2023-08-04 | 2023-08-04 | Forming tool for semiconductor processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310972991.9A CN116690867A (en) | 2023-08-04 | 2023-08-04 | Forming tool for semiconductor processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116690867A true CN116690867A (en) | 2023-09-05 |
Family
ID=87832514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310972991.9A Pending CN116690867A (en) | 2023-08-04 | 2023-08-04 | Forming tool for semiconductor processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116690867A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002299870A (en) * | 2001-04-03 | 2002-10-11 | Sumitomo Heavy Ind Ltd | Heat sink with fan |
| CN209401449U (en) * | 2019-04-17 | 2019-09-17 | 扬州市江都华宇高压电气有限公司 | A kind of oil-immersed and high-voltage experimental transformer |
| CN210805461U (en) * | 2019-12-27 | 2020-06-19 | 漳州东盛达电子科技有限公司 | Transformer convenient to clean dust |
| DE102019107319A1 (en) * | 2019-03-21 | 2020-09-24 | Engel Austria Gmbh | Melting unit for a shaping machine, shaping machine and method for operating such |
| CN111941779A (en) * | 2020-08-14 | 2020-11-17 | 郭宣妤 | Plastic injection molding machine with efficient cooling mechanism |
| CN112631407A (en) * | 2021-02-22 | 2021-04-09 | 诸暨市泰源供暖设备有限公司 | Novel radiator structure |
| CN216897593U (en) * | 2021-11-25 | 2022-07-05 | 宁波德业环境电器有限公司 | Dehumidifier with dustproof effect |
| CN217834523U (en) * | 2022-05-18 | 2022-11-18 | 深圳市扬帆精密模具有限公司 | Injection mold easy to radiate heat |
-
2023
- 2023-08-04 CN CN202310972991.9A patent/CN116690867A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002299870A (en) * | 2001-04-03 | 2002-10-11 | Sumitomo Heavy Ind Ltd | Heat sink with fan |
| DE102019107319A1 (en) * | 2019-03-21 | 2020-09-24 | Engel Austria Gmbh | Melting unit for a shaping machine, shaping machine and method for operating such |
| CN209401449U (en) * | 2019-04-17 | 2019-09-17 | 扬州市江都华宇高压电气有限公司 | A kind of oil-immersed and high-voltage experimental transformer |
| CN210805461U (en) * | 2019-12-27 | 2020-06-19 | 漳州东盛达电子科技有限公司 | Transformer convenient to clean dust |
| CN111941779A (en) * | 2020-08-14 | 2020-11-17 | 郭宣妤 | Plastic injection molding machine with efficient cooling mechanism |
| CN112631407A (en) * | 2021-02-22 | 2021-04-09 | 诸暨市泰源供暖设备有限公司 | Novel radiator structure |
| CN216897593U (en) * | 2021-11-25 | 2022-07-05 | 宁波德业环境电器有限公司 | Dehumidifier with dustproof effect |
| CN217834523U (en) * | 2022-05-18 | 2022-11-18 | 深圳市扬帆精密模具有限公司 | Injection mold easy to radiate heat |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210406009U (en) | Heat dissipation dust keeper for electric power communication box | |
| CN112517879A (en) | Die casting equipment for 5G intensifier | |
| CN116690867A (en) | Forming tool for semiconductor processing | |
| JP7043318B2 (en) | Injection molding machine | |
| CN213559331U (en) | Flexible edge rolling workstation structure | |
| CN213426789U (en) | Power management device with good heat dissipation performance | |
| CN211152114U (en) | Highly integrated router chip | |
| CN212992142U (en) | Heat radiator for energy-saving motor | |
| CN210718337U (en) | Cooling device used after mold is used | |
| CN209928366U (en) | Computer fan heat dissipation dust keeper | |
| CN215528801U (en) | Cooling device of motor | |
| CN220853269U (en) | Novel radiator frame structure | |
| CN214926214U (en) | Mould for automobile front bumper | |
| CN112283793A (en) | Cabinet air conditioner | |
| CN212588623U (en) | Dustproof heat dissipation wire cut electrical discharge machining bed switch board | |
| CN210911036U (en) | Cooling device of injection mold | |
| CN218675965U (en) | Air-cooled radiator for host computer | |
| CN220773483U (en) | Main board dust cover for system integration | |
| CN218315077U (en) | Material pushing device of injection molding machine | |
| CN218615294U (en) | Injection mold for dehumidifier shell | |
| CN221055161U (en) | Cooling device between elasticizer locomotives | |
| CN210007631U (en) | solar inverter heat dissipation structure | |
| CN215151869U (en) | Integrated machine tool for three-dimensional printing | |
| CN220733287U (en) | Assembled heat radiation structure of electromechanical device | |
| CN220162285U (en) | Assembly machine with cooling structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |