CN116673268B - Cleaning method and cleaning equipment for semiconductor silicon wafer - Google Patents
Cleaning method and cleaning equipment for semiconductor silicon wafer Download PDFInfo
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- CN116673268B CN116673268B CN202310962869.3A CN202310962869A CN116673268B CN 116673268 B CN116673268 B CN 116673268B CN 202310962869 A CN202310962869 A CN 202310962869A CN 116673268 B CN116673268 B CN 116673268B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 263
- 239000004065 semiconductor Substances 0.000 title claims abstract description 197
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 193
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 193
- 239000010703 silicon Substances 0.000 title claims abstract description 193
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000004033 plastic Substances 0.000 claims abstract description 15
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 7
- 238000005507 spraying Methods 0.000 claims abstract description 6
- 238000005406 washing Methods 0.000 claims abstract description 4
- 235000012431 wafers Nutrition 0.000 claims description 182
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 32
- 239000007921 spray Substances 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 239000008187 granular material Substances 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 6
- 230000010355 oscillation Effects 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 239000007788 liquid Substances 0.000 abstract description 42
- 230000000694 effects Effects 0.000 abstract description 19
- 238000002156 mixing Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000029058 respiratory gaseous exchange Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a cleaning method and cleaning equipment for a semiconductor silicon wafer, which relate to the technical field of semiconductor silicon wafer cleaning, and the cleaning method for the semiconductor silicon wafer comprises the following steps: s1: positioning control, namely placing the semiconductor silicon wafer into a cleaning machine for limiting and fixing so as to keep the semiconductor silicon wafer in a fixed vertical state; s2: washing, namely spraying cleaning liquid on the semiconductor silicon wafer for preliminary cleaning through a spraying structure on the cleaning machine; s3: the ultrasonic cleaning device comprises a ultrasonic vibration generator, a semiconductor silicon wafer, a flexible cleaning block, a cleaning device and a cleaning device, wherein the ultrasonic vibration generator is opened for generating ultrasonic waves, the surface of the semiconductor silicon wafer is cleaned by the ultrasonic waves, the semiconductor silicon wafer moves forwards and rotates by the ultrasonic waves, and when the semiconductor silicon wafer moves to the flexible cleaning block on a hard plastic plate, the flexible cleaning block can clean the side wall of the semiconductor silicon wafer in contact with the flexible cleaning block so as to wipe off softened pollution on the upper surface of the semiconductor silicon wafer, so that the cleaning effect of the semiconductor silicon wafer is improved, and the cleaning efficiency of the semiconductor silicon wafer can be improved.
Description
Technical Field
The invention relates to the technical field of semiconductor silicon wafer cleaning, in particular to a cleaning method and cleaning equipment for a semiconductor silicon wafer.
Background
Silicon wafers are also called silicon wafers, are important materials for manufacturing integrated circuits, and can be manufactured into integrated circuits and various semiconductor devices by means of photoetching, ion implantation and the like, wherein the silicon wafers are sheet-shaped objects manufactured by taking silicon as a material; in the production of semiconductor devices, silicon wafers need to be strictly cleaned, and trace pollution can lead to device failure; the cleaning aim is to remove surface pollution impurities, when cleaning the semiconductor silicon wafer, the semiconductor silicon wafer is placed on a placed device such as a storage rack, and then a plurality of semiconductor silicon wafers are placed in a cleaning machine with cleaning liquid for cleaning, however, when cleaning, the plurality of semiconductor silicon wafers are cleaned at the same time, dirt on the semiconductor silicon wafers can be left in the cleaning liquid of the cleaning machine, and the cleaning liquid with the dirt cleans the semiconductor silicon wafers, so that the cleaning quality of the semiconductor silicon wafers is affected; after cleaning the cleaning liquid for a period of time, the cleaning liquid needs to be replaced with new cleaning liquid, namely when the semiconductor silicon wafers in multiple batches are continuously cleaned, the cleaning liquid needs to be continuously replaced, the working efficiency is affected, and the waste of the cleaning liquid is easily caused.
For this purpose, a method and a device for cleaning a semiconductor wafer are proposed.
Disclosure of Invention
The invention aims to provide a cleaning method and cleaning equipment for a semiconductor silicon wafer, which are used for solving the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: the method for cleaning the semiconductor silicon wafer comprises the following steps: s1: positioning control, namely placing the semiconductor silicon wafer into a cleaning machine for limiting and fixing so as to keep the semiconductor silicon wafer in a fixed vertical state; s2: washing, namely spraying cleaning liquid on the semiconductor silicon wafer for preliminary cleaning through a spraying structure on the cleaning machine; s3: the ultrasonic cleaning method comprises the steps of starting an ultrasonic oscillation generator to generate ultrasonic waves, and cleaning the surface of a semiconductor silicon wafer by the ultrasonic waves; s4: after the post-softening cleaning, after the cleaning by S2 and S3, the dirt portion on the semiconductor silicon wafer is softened, and then the cleaning machine removes and cleans the softened dirt: s5: repeating the cleaning process for 8-10 times, repeating the processes of S2, S3 and S4, and storing the cleaned semiconductor silicon wafer
A cleaning device for semiconductor silicon wafers comprises a cleaning machine and the semiconductor silicon wafers in the cleaning machine;
the cleaning cavity is arranged in the cleaning machine, and a plurality of ultrasonic vibration generators for cleaning the semiconductor silicon wafers are arranged in the cleaning cavity;
the side wall plate is arranged on one side of the cleaning machine, one side of the side wall plate is fixedly connected with a cylinder, an air rod is arranged on the cylinder, and the air rod is connected with the control unit.
Preferably, the control unit comprises a control board, control board sliding connection is in the cleaning chamber, a plurality of arc boards down of control board one side lower extreme fixedly connected with, every arc board top down is provided with an upper arc board correspondingly, lower arc board and upper arc board opposite side all offer one with semiconductor silicon chip assorted arc mouth.
Preferably, the control panel top fixedly connected with roof, run through in the roof and stretch out and sliding connection have a plurality of spliced poles, spliced pole bottom and last arc board fixed connection, go up the arc board and run through the one end fixedly connected with connection diaphragm that stretches into the roof, be provided with compression spring on the connection diaphragm, connection diaphragm upper end fixedly connected with pull rod, the pull rod runs through and stretches out roof and sliding connection.
Preferably, a plurality of empty slots are formed in the control panel, each empty slot penetrates through and extends out, and is connected with a corner plate in a sliding mode, an air port is formed in the corner plate, a protection slot is formed in one side of the air port in a communicating mode, a clamping column is movably connected in the protection slot, a rectangular plate is fixedly connected to one side of the clamping column, one end of the rectangular plate is connected with an air rod in a contact mode, and a supporting spring is sleeved on the clamping column and corresponds to the air port.
Preferably, the guide groove is formed in the bottom of the cleaning cavity, the lower arc plate bottom is connected with a rotating roller in an embedded rotating mode, a rubber ring is detachably connected to the outer side of the rotating roller, and the lower end of the rotating roller stretches into the guide groove and is in sliding connection with the guide groove.
Preferably, a water pump is arranged in the cleaning cavity, a plurality of spray heads are fixedly communicated with the bottom of the top plate, and the spray heads are connected to the water pump through guide pipes.
Preferably, a vertical rod is fixedly connected to one end of the bottom of the top plate, a filter cartridge is rotatably connected to the lower end of the vertical rod, two hard plastic plates are correspondingly arranged on two sides of each filter cartridge, the hard plastic plates are fixedly connected in the cleaning cavity, a flexible cleaning block is detachably connected to each of two opposite sides of each hard plastic plate, and the filter cartridge penetrates through and extends out of the two flexible cleaning blocks and is movably connected with the two flexible cleaning blocks in an extrusion mode.
Preferably, the filter cartridge lower extreme runs through and stretches into and rotate and be connected with the purifying cylinder, the active carbon granule has been placed in the purifying cylinder, just offered the internal diameter on the purifying cylinder lateral wall and be less than the pore of active carbon granule, the entry that is used for putting into the active carbon granule has been offered to the purifying cylinder up end, the stopper has been filled in on the entry, rectangular channel has been offered to the stereoplasm plastic sheet bottom correspondence stopper, stopper one end stretches into rectangular channel and sliding connection, stopper upper end stretches into rectangular channel and sliding connection, purifying cylinder bottom center department runs through and stretches out and rotates and be connected with the main shaft, the one end fixedly connected with puddler of main shaft stretching into the purifying cylinder, the one end fixedly connected with gear of main shaft stretching out the purifying cylinder, the gear sets up in the guide way, just the transverse slot of perpendicular to guide way lateral wall has been offered to one side of guide way inside, fixedly connected with tooth in the transverse slot, tooth and gear engagement connection.
Preferably, the vertical rod penetrates through and extends out and is fixedly connected with a circulating cylinder, one side of the circulating cylinder penetrates through and extends out and is fixedly connected with an inclined guide cylinder, one spray head is located on a top plate above the circulating cylinder and points to one end of the guide cylinder, and a plurality of spray heads are located on the top plate above the semiconductor silicon wafer and all point to the side face of the semiconductor silicon wafer.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, a sufficient amount of cleaning liquid is injected into a cleaning cavity of the cleaning machine, a pull rod is pulled and moves upwards, a connecting transverse plate fixedly connected with the bottom of the pull rod moves upwards, an upper arc plate fixedly connected with the bottom of the connecting transverse plate moves upwards, so that a space for placing a semiconductor silicon wafer is reserved for placing the semiconductor silicon wafer, then the semiconductor silicon wafer is placed on a lower arc plate, one end of the semiconductor silicon wafer extends into an arc opening on the lower arc plate, the connecting transverse plate is loosened, the connecting transverse plate moves downwards under the action force of self gravity and a pressure spring, the arc opening on the upper arc plate below the connecting transverse plate moves downwards and is just clamped on the semiconductor silicon wafer, and the upper arc plate and the lower arc plate limit the semiconductor silicon wafer together, so that the semiconductor silicon wafer lies in the cleaning cavity when the semiconductor silicon wafer is placed for cleaning, and the cleaning effect of the semiconductor silicon wafer is promoted;
according to the invention, the soft liners are arranged in the arc openings of the upper arc plate and the lower arc plate, so that the narrow wall of the semiconductor silicon wafer extending into the arc opening can be protected, and the semiconductor silicon wafer is prevented from being damaged in the cleaning process;
according to the invention, the ultrasonic oscillation generator is started to work to perform ultrasonic cleaning on the semiconductor silicon wafer, so that dirt on the surface of the semiconductor silicon wafer can be softened, the water pump is started to spray the cleaning liquid in the cleaning cavity out of the spray heads through the water pipe, and the cleaning liquid is sprayed onto the semiconductor silicon wafer by facing the plurality of spray heads on the semiconductor silicon wafer, so that the semiconductor silicon wafer is primarily cleaned, and dirt which is not flushed on the semiconductor silicon wafer can be softened;
according to the invention, the cylinder is started to work, the air rod moves, the air rod drives the rectangular plate contacted with the air rod to move, the clamping column on the rectangular plate moves, the clamping column moves and stretches into the air port, the angle plate where the air port is positioned is fixed, the connecting transverse plate fixedly connected with the angle plate and the upper arc plate below the connecting transverse plate are fixed, the upper arc plate cannot move up and down at the moment, and the lower arc plate cannot move up and down, so that the semiconductor silicon wafer between the upper arc plate and the lower arc plate is fixed, the semiconductor silicon wafer is prevented from longitudinally moving when horizontally moving to lie in the cleaning cavity, the cleaning effect of the semiconductor silicon wafer is influenced, and the tight contact between the semiconductor silicon wafer and a rubber ring outside the rotating roller can be ensured;
when the rectangular plate moves in the protective groove to be difficult to move, the gas rod continuously moves to push the control plate, the semiconductor silicon wafer and the like to move, the lower arc plate moves, and the moving direction of the semiconductor silicon wafer on the lower arc plate is not deviated due to the design of the rotating roller and the guide groove at the bottom of the lower arc plate;
according to the invention, when the lower arc plate moves, the rotating roller at the bottom of the lower arc plate moves in the guide groove, the friction force of the rotating roller in the guide groove enables the rotating roller to roll when moving, the semiconductor silicon wafers closely contacted by the rotating roller synchronously rotate reversely, the cleaning liquid sprayed by the spray head above the rotating roller washes and cleans different positions of the semiconductor silicon wafers, the cleaning effect is better, the outer wall of the rubber ring at the outer side of the rotating roller is designed to be rough, the friction force between the rotating roller and the semiconductor silicon wafers can be increased, so that the semiconductor silicon wafers can be ensured to synchronously rotate, the cleaning effect of the semiconductor silicon wafers is ensured, and the damage of the rubber ring on the outer wall of the semiconductor silicon wafers is smaller relative to the hard lower arc plate, so that the semiconductor silicon wafers are protected;
according to the invention, the semiconductor silicon wafer moves forwards and rotates, when the semiconductor silicon wafer moves to the flexible cleaning block on the hard plastic plate, the flexible cleaning block can clean the side wall of the semiconductor silicon wafer contacted with the flexible cleaning block so as to wipe off softened pollution on the upper surface of the semiconductor silicon wafer, so that the cleaning effect of the semiconductor silicon wafer is improved, and the cleaning efficiency of the semiconductor silicon wafer can be improved;
according to the invention, after the softened dirt on the side wall of the semiconductor silicon wafer is erased by the flexible cleaning block, the softened dirt is attached to the side wall of the flexible cleaning block, the control board moves forward, the top plate fixedly connected with the control board moves forward, the vertical rod fixedly connected with one side of the top plate moves forward, the filter cylinder rotationally connected with the bottom of the vertical rod moves forward, the flexible cleaning block is extruded when the filter cylinder moves, and the dirt adhered on the flexible cleaning block and the cleaning liquid enter the filter cylinder through the filter holes in the filter cylinder, so that the flexible cleaning block can also clean the semiconductor silicon wafer when the flexible cleaning block cleans the semiconductor silicon wafer, and the cleaning effect of the flexible cleaning block on the semiconductor silicon wafer is ensured;
according to the invention, the cleaning liquid sprayed from the spray head is sprayed onto the semiconductor silicon wafer, part of dirt on the semiconductor silicon wafer is blown down into high-purity plasma water in the cleaning cavity below the semiconductor silicon wafer, the cleaning liquid is sprayed towards the spray head on the circulating cylinder, the high-purity ion water and the dirt therein are sprayed onto the upper end surface of the flexible cleaning block, the flexible cleaning block is moved and forced to deform greatly when the filter cylinder moves, and the dirt and the high-purity ion water on the upper end surface of the flexible cleaning block enter the filter cylinder through the filter holes of the filter cylinder, so that cleaning of the cleaning liquid in the cleaning cavity is realized, and the cleaning liquid can be recycled;
according to the invention, dirt on the flexible cleaning block falls down after entering the filter cylinder and finally falls into the purification cylinder below, activated carbon is placed in the purification cylinder, the dirt in the cleaning liquid is adsorbed on the activated carbon, and the cleaning liquid flows out through the fine holes on the side wall of the purification cylinder, so that the dirt cleaned by the cleaning machine is concentrated and collected, and the cleaning liquid in the cleaning cavity can be recycled;
according to the invention, the filter cylinder is moved to drive the purifying cylinder to move, the main shaft at the bottom of the purifying cylinder and the gear fixedly connected with the bottom of the main shaft synchronously move, the gear is meshed and connected with the meshing teeth when moving to the meshing teeth area, the gear continuously moves and is meshed by the meshing teeth to rotate, so that the main shaft is driven to rotate, the main shaft rotates to drive the mixing rod fixedly connected with the main shaft to rotate, the activated carbon in the purifying cylinder is stirred, and the activated carbon can be enabled to better adsorb dirt and promote the cleaning liquid to flow out from the pores on the side wall of the purifying cylinder.
Drawings
FIG. 1 is a workflow diagram of the present invention;
FIG. 2 is an overall structural view of the welded pipe of the present invention;
FIG. 3 is a front view of a welded tube of the present invention;
FIG. 4 is a partial view of the present invention;
FIG. 5 is an interior view of the top plate of the present invention;
FIG. 6 is an oblique cross-sectional view of the present invention;
FIG. 7 is a combined view of the circulation barrel and guide barrel of the present invention;
FIG. 8 is a combined view of the upper arc plate and the breathing orifice of the present invention;
FIG. 9 is an enlarged view of A of FIG. 6 in accordance with the present invention;
FIG. 10 is an enlarged view of B of FIG. 6 in accordance with the present invention;
FIG. 11 is an enlarged view of C of FIG. 3 in accordance with the present invention;
fig. 12 is an enlarged view of D of fig. 3 in accordance with the present invention.
In the figure:
1. a cleaning machine; 11. cleaning the cavity; 12. an ultrasonic oscillation generator; 13. a side wall plate; 14. a cylinder; 15. an air bar; 16. a semiconductor silicon wafer; 2. a control unit; 21. a control board; 22. a lower arc plate; 23. an upper arc plate; 24. an arc-shaped opening; 3. a top plate; 31. a connecting column; 32. a connecting transverse plate; 33. a pressure spring; 34. a pull rod; 4. a corner plate; 41. an air port; 42. a protective groove; 43. a rectangular plate; 44. a support spring; 45. a clamping column; 5. a guide groove; 51. a rotating roller; 52. a rubber ring; 6. a water pump; 61. a spray head; 7. a vertical rod; 71. a filter cartridge; 72. a hard plastic plate; 73. a flexible cleaning block; 8. a purifying cylinder; 81. a pipe plug; 82. a main shaft; 83. a mixing rod; 84. a gear; 85. a transverse groove; 86. tooth engagement; 9. a circulation cylinder; 91. a guide cylinder.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 12, the present invention provides a technical solution:
the method for cleaning the semiconductor silicon wafer comprises the following steps: s1: positioning control, namely placing the semiconductor silicon wafer 16 into the cleaning machine 1 for limiting and fixing so as to keep the semiconductor silicon wafer in a fixed vertical state; s2: washing, namely jetting a cleaning liquid on the semiconductor silicon wafer 16 for preliminary cleaning through a spraying structure on the cleaning machine 1; s3: the ultrasonic cleaning is carried out, the ultrasonic vibration generator 12 is turned on, ultrasonic waves are generated, and the surfaces of the semiconductor silicon wafers 16 are cleaned by the ultrasonic waves; s4: after the post-softening cleaning, after the cleaning by S2 and S3, the dirt portion on the semiconductor silicon wafer 16 is softened, and then the cleaning machine 1 removes and cleans the softened dirt: s5: the cleaning is repeated, the processes of S2, S3 and S4 are repeated 8-10 times, and then the cleaned semiconductor silicon wafer 16 is stored.
A cleaning device for semiconductor silicon wafers comprises a cleaning machine 1 and a semiconductor silicon wafer 16 positioned in the cleaning machine 1;
a cleaning cavity 11 arranged in the cleaning machine 1, wherein a plurality of ultrasonic vibration generators 12 for cleaning the semiconductor silicon wafer 16 are arranged in the cleaning cavity 11;
the side wall plate 13 is arranged on one side of the cleaning machine 1, one side of the side wall plate 13 is fixedly connected with a cylinder 14, an air rod 15 is arranged on the cylinder 14, and the air rod 15 is connected with the control unit 2.
As an embodiment of the present invention, the control unit 2 includes a control board 21, the control board 21 is slidably connected in the cleaning chamber 11, a plurality of lower arc plates 22 are fixedly connected to a lower end of one side of the control board 21, an upper arc plate 23 is correspondingly disposed above each lower arc plate 22, and an arc opening 24 matched with the semiconductor silicon wafer 16 is formed on opposite sides of each lower arc plate 22 and each upper arc plate 23.
The top fixedly connected with roof 3 of control panel 21, run through in the roof 3 and stretch out and sliding connection have a plurality of spliced pole 31, spliced pole 31 bottom and last arc board 23 fixed connection, the one end fixedly connected with connection diaphragm 32 that goes up arc board 23 and run through and stretch into roof 3, be provided with compression spring 33 on the connection diaphragm 32, connection diaphragm 32 upper end fixedly connected with pull rod 34, pull rod 34 runs through and stretches out roof 3 and sliding connection.
During operation, a sufficient amount of cleaning liquid is injected into the cleaning chamber 11 of the cleaning machine 1, the pull rod 34 is pulled and moved upwards, the connecting transverse plate 32 fixedly connected with the bottom of the pull rod 34 is moved upwards, the upper arc plate 23 fixedly connected with the bottom of the connecting transverse plate 32 is moved upwards, so that a space for placing the semiconductor silicon wafer 16 is reserved, then the semiconductor silicon wafer 16 is placed on the lower arc plate 22, one end of the semiconductor silicon wafer 16 extends into the arc opening 24 on the lower arc plate 22, the connecting transverse plate 32 is loosened, the connecting transverse plate 32 moves downwards under the action of self gravity and the pressure spring 33, the arc opening 24 on the upper arc plate 23 below the connecting transverse plate 32 is moved downwards and is just clamped on the semiconductor silicon wafer 16, and the upper arc plate 23 and the lower arc plate 22 are limited together to place the semiconductor silicon wafer 16 in the cleaning chamber 11, so that the cleaning effect of the semiconductor silicon wafer 16 is promoted.
As an embodiment of the present invention, a plurality of empty slots are formed in the control board 21, each empty slot is penetrated and extended and is slidably connected with a corner board 4, an air port 41 is formed on the corner board 4, a protection slot 42 is formed in one side of the air port 41 in a communicating manner, a clamping column 45 is movably connected in the protection slot 42, a rectangular plate 43 is fixedly connected to one side of the clamping column 45, one end of the rectangular plate 43 is in contact connection with the air rod 15, the clamping column 45 corresponds to the air port 41, and a supporting spring 44 is sleeved on the clamping column 45.
When the device works, the cylinder 14 is started, the cylinder 14 works to enable the air rod 15 to move firstly, the air rod 15 drives the rectangular plate 43 contacted with the air rod to move, the clamping column 45 on the rectangular plate 43 moves, the clamping column 45 moves to extend into the air port 41, the angle plate 4 where the air port 41 is positioned is fixed, the connecting transverse plate 32 fixedly connected with the angle plate 4 and the upper arc plate 23 below the connecting transverse plate are fixed, the upper arc plate 23 cannot move up and down at the moment, and the lower arc plate 22 cannot move up and down, so that the semiconductor silicon wafer 16 between the upper arc plate 23 and the lower arc plate 22 is fixed, the semiconductor silicon wafer 16 is prevented from being longitudinally displaced when horizontally moved to enable the semiconductor silicon wafer 16 to lie in the cleaning cavity 11, the cleaning effect of the semiconductor silicon wafer 16 is affected, and the tight contact between the semiconductor silicon wafer 16 and the rubber ring 52 outside the rotating roller 51 can be ensured.
As an embodiment of the invention, the bottom of the cleaning chamber 11 is provided with a guide groove 5, the bottom of the lower arc plate 22 is connected with a rotating roller 51 in an embedded rotating manner, the outer side of the rotating roller 51 is detachably connected with a rubber ring 52, and the lower end of the rotating roller 51 extends into the guide groove 5 and is connected in a sliding manner.
When the rectangular plate 43 moves in the protective groove 42 to be difficult to move, the gas rod 15 moves continuously to push the control plate 21, the semiconductor silicon wafer 16 and the like to move, the lower arc plate 22 moves, and the rotating roller 51 at the bottom of the lower arc plate 22 and the guide groove 5 are designed so that the moving direction of the semiconductor silicon wafer 16 on the lower arc plate 22 is not deviated.
As an embodiment of the present invention, the water pump 6 is disposed in the cleaning chamber 11, and a plurality of nozzles 61 are fixedly connected to the bottom of the top plate 3, and the nozzles 61 are connected to the water pump 6 through a conduit.
When the ultrasonic vibration generator 12 is started in operation, the ultrasonic vibration generator 12 works to perform ultrasonic cleaning on the semiconductor silicon wafer 16, dirt on the surface of the semiconductor silicon wafer 16 can be softened, the water pump 6 is started, the water pump 6 finally ejects cleaning liquid in the cleaning cavity 11 through the water pipe by the nozzle 61, and the cleaning liquid is ejected to the semiconductor silicon wafer 16 by facing the plurality of nozzles 61 on the semiconductor silicon wafer 16, so that the semiconductor silicon wafer 16 is primarily cleaned, and dirt which is not flushed on the semiconductor silicon wafer 16 can be softened;
when the lower arc plate 22 moves, the roller 51 at the bottom of the lower arc plate 22 moves in the guide groove 5, the friction force of the roller 51 in the guide groove 5 enables the roller 51 to roll during movement, the semiconductor silicon wafer 16 closely contacted by the roller 51 also synchronously rotates reversely, the cleaning liquid sprayed by the spray head 61 above washes and cleans different positions of the semiconductor silicon wafer 16, the cleaning effect is better, the outer wall of the rubber ring 52 outside the roller 51 is designed to be rough, the friction force between the roller 51 and the semiconductor silicon wafer 16 can be increased, so that the semiconductor silicon wafer 16 can be ensured to synchronously rotate, the cleaning effect of the semiconductor silicon wafer 16 is ensured, and the damage of the rubber ring 52 on the outer wall of the semiconductor silicon wafer 16 is smaller relative to the hard lower arc plate 22, so that the semiconductor silicon wafer 16 is protected.
As an embodiment of the present invention, one end of the bottom of the top plate 3 is fixedly connected with a vertical rod 7, the lower end of the vertical rod 7 is rotatably connected with a filter cylinder 71, two hard plastic plates 72 are correspondingly disposed at two sides of each filter cylinder 71, the hard plastic plates 72 are fixedly connected in the cleaning cavity 11, one flexible cleaning block 73 is detachably connected to each of the opposite sides of each of the two hard plastic plates 72, and the filter cylinder 71 extends through the two flexible cleaning blocks 73 and is movably connected with the two flexible cleaning blocks 73 in an extrusion manner.
When the semiconductor silicon wafer 16 moves forwards and rotates, the flexible cleaning block 73 can clean the side wall of the semiconductor silicon wafer 16 contacted with the flexible cleaning block 73 when the semiconductor silicon wafer 16 moves to the flexible cleaning block 73 on the hard plastic plate 72, so that softened pollution on the upper surface of the semiconductor silicon wafer 16 is wiped off, the cleaning effect of the semiconductor silicon wafer 16 is improved, and the cleaning efficiency of the semiconductor silicon wafer 16 can be improved;
after the soft dirt on the side wall of the semiconductor silicon wafer 16 is erased by the soft cleaning block 73, the soft dirt is attached to the side wall of the soft cleaning block 73, the control board 21 moves forward, the top board 3 fixedly connected with the control board 21 moves forward, the vertical rod 7 fixedly connected with one side of the top board 3 moves forward, the filter cylinder 71 rotatably connected with the bottom of the vertical rod 7 moves forward, the soft cleaning block 73 is extruded when the filter cylinder 71 moves, and dirt and cleaning liquid attached to the soft cleaning block 73 enter the filter cylinder 71 through the filter holes in the filter cylinder 71, so that the soft cleaning block 73 can also clean the semiconductor silicon wafer 16, and the cleaning effect of the soft cleaning block 73 on the semiconductor silicon wafer 16 is ensured.
As an embodiment of the present invention, the lower end of the filter cylinder 71 extends into and is rotationally connected with the purifying cylinder 8, activated carbon particles are placed in the purifying cylinder 8, a pore with an inner diameter smaller than that of the activated carbon particles is formed on the side wall of the purifying cylinder 8, an inlet for placing the activated carbon particles is formed on the upper end surface of the purifying cylinder 8, a pipe plug 81 is plugged on the inlet, a rectangular groove is formed at the bottom of the hard plastic plate 72 corresponding to the pipe plug 81, one end of the pipe plug 81 extends into the rectangular groove and is slidingly connected with the pipe plug, the upper end of the pipe plug 81 extends into the rectangular groove and is slidingly connected with the rectangular groove, a main shaft 82 extends out of and is rotationally connected with the center of the bottom of the purifying cylinder 8, one end of the main shaft 82 extending into the purifying cylinder 8 is fixedly connected with a plurality of mixing rods 83, one end of the main shaft 82 extending out of the purifying cylinder 8 is fixedly connected with a gear 84, the gear 84 is arranged in the guiding groove 5, one side of the guiding groove 5 is internally provided with a transverse groove 85 perpendicular to the side wall of the guiding groove 5, a meshing tooth 86 is fixedly connected with the meshing tooth 86 and the meshing tooth 84 is meshed with the gear 84.
When the cleaning machine works, dirt on the flexible cleaning block 73 falls down after entering the filter cylinder 71 and finally falls into the lower purifying cylinder 8, activated carbon is placed in the purifying cylinder 8, the dirt in the cleaning liquid is adsorbed on the activated carbon, and the cleaning liquid flows out through the fine holes on the side wall of the purifying cylinder 8, so that the dirt cleaned by the cleaning machine 1 is concentrated and collected, and the cleaning liquid in the cleaning cavity 11 can be recycled;
the filter cylinder 71 moves to drive the purifying cylinder 8 to move, the main shaft 82 at the bottom of the purifying cylinder 8 and the gear 84 fixedly connected with the bottom of the main shaft 82 synchronously move, when the gear 84 moves to the area of the meshing teeth 86, the gear 84 is meshed with the meshing teeth 86, the gear 84 continues to move and is meshed by the meshing action of the meshing teeth 86 to rotate, so that the main shaft 82 is driven to rotate, the main shaft 82 rotates to drive the mixing rod 83 fixedly connected with the main shaft 82 to rotate, active carbon in the purifying cylinder 8 is stirred, and the active carbon can be enabled to better adsorb dirt and promote cleaning liquid to flow out from the pores on the side wall of the purifying cylinder 8.
As an embodiment of the invention, the vertical rod 7 extends through and is fixedly connected with a circulation cylinder 9, one side of the circulation cylinder 9 extends through and is fixedly connected with an inclined guide cylinder 91, one spray head 61 is positioned on the top plate 3 above the circulation cylinder 9 and is directed to one end of the guide cylinder 91, and a plurality of spray heads 61 are positioned on the top plate 3 above the semiconductor silicon wafer 16 and are all directed to the side surface of the semiconductor silicon wafer 16
During operation, the cleaning solution sprayed from the spray head 61 is sprayed onto the semiconductor silicon wafer 16, and part of dirt on the semiconductor silicon wafer 16 is blown down into high-purity plasma water in the cleaning cavity 11 below, the cleaning solution is sprayed against the spray head 61 on the circulation cylinder 9, the high-purity ion water and the dirt therein are sprayed onto the upper end surface of the flexible cleaning block 73, the flexible cleaning block 73 is moved and forced to deform greatly when the filter cylinder 71 moves, and the dirt and the high-purity ion water on the upper end surface of the flexible cleaning block 73 enter the filter cylinder 71 through the filter holes of the filter cylinder 71, so that cleaning of the cleaning solution in the cleaning cavity 11 is realized, and the cleaning solution can be recycled.
Working principle: injecting sufficient cleaning liquid into the cleaning chamber 11 of the cleaning machine 1, pulling the pull rod 34 and enabling the pull rod 34 to move upwards, enabling the connecting transverse plate 32 fixedly connected with the bottom of the pull rod 34 to move upwards, enabling the upper arc plate 23 fixedly connected with the bottom of the connecting transverse plate 32 to move upwards, thus reserving a space for placing the semiconductor silicon wafer 16, placing the semiconductor silicon wafer 16 on the lower arc plate 22 and enabling one end of the semiconductor silicon wafer 16 to extend into the arc opening 24 on the lower arc plate 22, loosening the connecting transverse plate 32, enabling the connecting transverse plate 32 to move downwards under the action of self gravity and the pressure spring 33, enabling the arc opening 24 on the upper arc plate 23 below the connecting transverse plate 32 to move downwards and be just clamped on the semiconductor silicon wafer 16, enabling the upper arc plate 23 and the lower arc plate 22 to limit the semiconductor silicon wafer 16 together, and enabling the semiconductor silicon wafer 16 to lie in the cleaning chamber 11 when the semiconductor silicon wafer 16 is cleaned, and therefore promoting the cleaning effect of the semiconductor silicon wafer 16;
soft liners can be arranged in the arc openings 24 of the upper arc plate 23 and the lower arc plate 22, so that the narrow wall of the semiconductor silicon wafer 16 extending into the arc opening 24 can be protected from damage in the cleaning process;
the ultrasonic vibration generator 12 is started, the ultrasonic vibration generator 12 works to perform ultrasonic cleaning on the semiconductor silicon wafer 16, dirt on the surface of the semiconductor silicon wafer 16 can be softened, the water pump 6 is started, the water pump 6 sprays cleaning liquid in the cleaning cavity 11 through the water pipe and finally through the spray heads 61, and the cleaning liquid is sprayed onto the semiconductor silicon wafer 16 by facing the plurality of spray heads 61 on the semiconductor silicon wafer 16, so that the semiconductor silicon wafer 16 is primarily cleaned, and dirt which is not flushed on the semiconductor silicon wafer 16 can be softened;
starting the cylinder 14, wherein the cylinder 14 firstly moves the air rod 15, the air rod 15 drives the rectangular plate 43 contacted with the air rod to move, the clamping column 45 on the rectangular plate 43 moves, the clamping column 45 moves to extend into the air port 41, the angle plate 4 where the air port 41 is positioned is fixed, the connecting transverse plate 32 fixedly connected with the angle plate 4 and the upper arc plate 23 below the connecting transverse plate are fixed, the upper arc plate 23 cannot move up and down at the moment, and the lower arc plate 22 cannot move up and down, so that the semiconductor silicon wafer 16 between the upper arc plate 23 and the lower arc plate 22 is fixed, the semiconductor silicon wafer 16 is prevented from being longitudinally displaced when horizontally moved to lie in the cleaning cavity 11, the cleaning effect of the semiconductor silicon wafer 16 is influenced, and the tight contact between the semiconductor silicon wafer 16 and the rubber ring 52 outside the rotating roller 51 can be ensured;
when the rectangular plate 43 moves in the protective groove 42 to be difficult to move, the gas rod 15 continues to move to push the control plate 21, the semiconductor silicon wafer 16 and the like to move, the lower arc plate 22 moves, and the rotating roller 51 at the bottom of the lower arc plate 22 and the design of the guide groove 5 prevent the movement direction of the semiconductor silicon wafer 16 on the lower arc plate 22 from being deviated;
when the lower arc plate 22 moves, the rotating roller 51 at the bottom of the lower arc plate 22 moves in the guide groove 5, the friction force of the rotating roller 51 in the guide groove 5 enables the rotating roller 51 to roll when moving, the semiconductor silicon wafer 16 closely contacted by the rotating roller 51 synchronously rotates reversely, the cleaning liquid sprayed by the spray head 61 above washes and cleans different positions of the semiconductor silicon wafer 16, the cleaning effect is better, the outer wall of the rubber ring 52 at the outer side of the rotating roller 51 is designed to be rough, the friction force between the rotating roller 51 and the semiconductor silicon wafer 16 can be increased, so that the semiconductor silicon wafer 16 can be ensured to synchronously rotate, the cleaning effect of the semiconductor silicon wafer 16 is ensured, and the damage of the rubber ring 52 on the outer wall of the semiconductor silicon wafer 16 is smaller relative to the hard lower arc plate 22, so that the semiconductor silicon wafer 16 is protected;
when the semiconductor silicon wafer 16 moves forward and rotates, and the semiconductor silicon wafer 16 moves to the flexible cleaning block 73 on the hard plastic plate 72, the flexible cleaning block 73 can clean the side wall of the semiconductor silicon wafer 16 contacted with the flexible cleaning block to wipe off softened pollution on the upper surface of the semiconductor silicon wafer 16, so that the cleaning effect of the semiconductor silicon wafer 16 is improved, and the cleaning efficiency of the semiconductor silicon wafer 16 can be improved;
after the softened dirt on the side wall of the semiconductor silicon wafer 16 is erased by the flexible cleaning block 73, the softened dirt is attached to the side wall of the flexible cleaning block 73, the control board 21 moves forward, the top board 3 fixedly connected with the control board 21 moves forward, the vertical rod 7 fixedly connected with one side of the top board 3 moves forward, the filter cylinder 71 rotatably connected with the bottom of the vertical rod 7 moves forward, the flexible cleaning block 73 is extruded when the filter cylinder 71 moves, and the dirt and cleaning liquid attached to the flexible cleaning block 73 enter the filter cylinder 71 through the filtering holes in the filter cylinder 71, so that the flexible cleaning block 73 can also clean the semiconductor silicon wafer 16 when the flexible cleaning block 73 cleans the semiconductor silicon wafer 16, and the cleaning effect of the flexible cleaning block 73 on the semiconductor silicon wafer 16 is ensured;
the cleaning solution sprayed from the spray head 61 is sprayed onto the semiconductor silicon wafer 16, and part of dirt on the semiconductor silicon wafer 16 is blown into high-purity plasma water in the lower cleaning cavity 11, the cleaning solution is sprayed against the spray head 61 on the circulating cylinder 9, the high-purity ion water and the dirt therein are sprayed onto the upper end surface of the flexible cleaning block 73, the flexible cleaning block 73 is moved and forced to deform greatly when the filter cylinder 71 moves, and the dirt and the high-purity ion water on the upper end surface of the flexible cleaning block 73 enter the filter cylinder 71 through the filter holes of the filter cylinder 71, so that the cleaning of the cleaning solution in the cleaning cavity 11 is realized, and the cleaning solution can be recycled.
Dirt on the flexible cleaning block 73 falls down after entering the filter cylinder 71 and finally falls into the lower purifying cylinder 8, activated carbon is placed in the purifying cylinder 8, the dirt in the cleaning liquid is adsorbed on the activated carbon, and the cleaning liquid flows out through the fine holes on the side wall of the purifying cylinder 8, so that the dirt cleaned by the cleaner 1 is concentrated and collected, and the cleaning liquid in the cleaning cavity 11 can be recycled;
the filter cylinder 71 moves to drive the purifying cylinder 8 to move, the main shaft 82 at the bottom of the purifying cylinder 8 and the gear 84 fixedly connected with the bottom of the main shaft 82 synchronously move, when the gear 84 moves to the area of the meshing teeth 86, the gear 84 is meshed with the meshing teeth 86, the gear 84 continues to move and is meshed by the meshing action of the meshing teeth 86 to rotate, so that the main shaft 82 is driven to rotate, the main shaft 82 rotates to drive the mixing rod 83 fixedly connected with the main shaft 82 to rotate, active carbon in the purifying cylinder 8 is stirred, and the active carbon can be enabled to better adsorb dirt and promote cleaning liquid to flow out from the pores on the side wall of the purifying cylinder 8.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The cleaning equipment for the semiconductor silicon wafer is characterized by comprising the following components:
a cleaning machine (1) and a semiconductor silicon wafer (16) positioned in the cleaning machine (1);
a cleaning cavity (11) arranged in the cleaning machine (1), wherein a plurality of ultrasonic vibration generators (12) for cleaning the semiconductor silicon wafer (16) are arranged in the cleaning cavity (11);
the cleaning machine comprises a side wall plate (13) arranged on one side of the cleaning machine (1), wherein an air cylinder (14) is fixedly connected to one side of the side wall plate (13), an air rod (15) is arranged on the air cylinder (14), and the air rod (15) is connected with a control unit (2);
the control unit (2) comprises a control board (21), the control board (21) is slidably connected in the cleaning cavity (11), a plurality of lower arc plates (22) are fixedly connected to the lower end of one side of the control board (21), an upper arc plate (23) is correspondingly arranged above each lower arc plate (22), and an arc opening (24) matched with the semiconductor silicon chip (16) is formed in the opposite sides of each lower arc plate (22) and each upper arc plate (23);
the top of the control panel (21) is fixedly connected with a top plate (3), a plurality of connecting columns (31) penetrate through and extend out of the top plate (3) in a penetrating manner and are connected with a plurality of connecting columns (31) in a sliding manner, the bottom of each connecting column (31) is fixedly connected with an upper arc plate (23), one end of each upper arc plate (23) penetrating through and extending into the top plate (3) is fixedly connected with a connecting transverse plate (32), a pressure spring (33) is arranged on each connecting transverse plate (32), a pull rod (34) is fixedly connected with the upper end of each connecting transverse plate (32), and each pull rod (34) penetrates through and extends out of the top plate (3) in a sliding manner;
a plurality of empty slots are formed in the control panel (21), each empty slot is internally penetrated and extends out and is connected with a corner plate (4) in a sliding mode, an air port (41) is formed in the corner plate (4), a protection slot (42) is formed in one side of the air port (41) in a communicating mode, a clamping column (45) is movably connected in the protection slot (42), a rectangular plate (43) is fixedly connected to one side of the clamping column (45), one end of the rectangular plate (43) is in contact connection with an air rod (15), and a supporting spring (44) is sleeved on the clamping column (45) corresponding to the air port (41).
2. The cleaning apparatus for semiconductor wafers as set forth in claim 1, wherein: the cleaning device is characterized in that a guide groove (5) is formed in the bottom of the cleaning cavity (11), a rotating roller (51) is connected to the bottom of the lower arc plate (22) in an embedded rotating mode, a rubber ring (52) is detachably connected to the outer side of the rotating roller (51), and the lower end of the rotating roller (51) stretches into the guide groove (5) and is connected in a sliding mode.
3. The cleaning apparatus for semiconductor wafers as set forth in claim 2, wherein: a water pump (6) is arranged in the cleaning cavity (11), a plurality of spray heads (61) are fixedly communicated with the bottom of the top plate (3), and the spray heads (61) are connected to the water pump (6) through guide pipes.
4. A cleaning apparatus for semiconductor wafers as set forth in claim 3, wherein: the novel cleaning device is characterized in that a vertical rod (7) is fixedly connected to one end of the bottom of the top plate (3), a filter cylinder (71) is rotatably connected to the lower end of the vertical rod (7), two hard plastic plates (72) are correspondingly arranged on two sides of each filter cylinder (71), the hard plastic plates (72) are fixedly connected in the cleaning cavity (11), one flexible cleaning block (73) is detachably connected to each of two opposite sides of each hard plastic plate (72), and the filter cylinders (71) penetrate through and extend out of the two flexible cleaning blocks (73) and are movably connected with the two flexible cleaning blocks (73) in an extrusion mode.
5. The cleaning apparatus for semiconductor wafers as set forth in claim 4, wherein: the utility model discloses a filter cartridge (71) lower extreme runs through and stretches into and rotate and be connected with purifying cylinder (8), the active carbon granule has been placed in purifying cylinder (8), just the pore that the internal diameter is less than the active carbon granule has been seted up on purifying cylinder (8) lateral wall, purifying cylinder (8) up end has been seted up and is used for putting into the entry of active carbon granule, it has stopcock (81) to fill in the entry, rectangular channel has been seted up to stereoplasm plastic sheet (72) bottom correspondence stopcock (81), rectangular channel and sliding connection have been stretched into to stopcock (81) one end, rectangular channel and sliding connection have been stretched into to stopcock (81) upper end, purifying cylinder (8) bottom center department runs through and stretches out and rotates and be connected with main shaft (82), main shaft (82) stretch into purifying cylinder (8) one end fixedly connected with a plurality of hybrid pole (83), main shaft (82) stretch out purifying cylinder (8) one end fixedly connected with gear (84), gear (84) set up in guide slot (5), just guide slot (5) one side inside (86) have, tooth (85) are connected with transverse tooth (85) in the guide slot (85).
6. The cleaning apparatus for semiconductor wafers as set forth in claim 5, wherein: the vertical rod (7) penetrates through and extends out of the circulating cylinder (9) and is fixedly connected with the circulating cylinder (9), one side of the circulating cylinder (9) penetrates through and extends out of the circulating cylinder and is fixedly connected with the inclined guide cylinder (91), one spray head (61) is located on the top plate (3) above the circulating cylinder (9) and points to one end of the guide cylinder (91), and a plurality of spray heads (61) are located on the top plate (3) above the semiconductor silicon wafer (16) and all point to the side face of the semiconductor silicon wafer (16).
7. A cleaning method of a semiconductor silicon wafer, applied to a cleaning apparatus of a semiconductor silicon wafer according to claim 6, characterized in that the cleaning method of a semiconductor silicon wafer comprises the steps of:
s1: positioning control, namely placing the semiconductor silicon wafer (16) into a cleaning machine (1) for limiting and fixing so as to keep the semiconductor silicon wafer in a fixed vertical state;
s2: washing, namely jetting a cleaning solution on the semiconductor silicon wafer (16) for preliminary cleaning through a spraying structure on the cleaning machine (1);
s3: the ultrasonic cleaning method comprises the steps of starting an ultrasonic oscillation generator (12), generating ultrasonic waves, and cleaning the surface of a semiconductor silicon wafer (16) by the ultrasonic waves;
s4: after softening and cleaning, after cleaning by S2 and S3, the dirt portion on the semiconductor wafer (16) is softened, and then the cleaning machine (1) removes and cleans the softened dirt:
s5: repeating the cleaning process for 8-10 times, repeating the processes of S2, S3 and S4, and then storing the cleaned semiconductor silicon wafer (16).
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| CN202310962869.3A CN116673268B (en) | 2023-08-02 | 2023-08-02 | Cleaning method and cleaning equipment for semiconductor silicon wafer |
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| JP2002353183A (en) * | 2001-05-28 | 2002-12-06 | Nisso Engineering Co Ltd | Wafer-cleaning device |
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