CN116647106A

CN116647106A - surge suppression device

Info

Publication number: CN116647106A
Application number: CN202310150451.2A
Authority: CN
Inventors: 近藤司; 驹野晴保
Original assignee: Bomeilicheng Co ltd
Current assignee: Bomeilicheng Co ltd
Priority date: 2022-02-22
Filing date: 2023-02-22
Publication date: 2023-08-25

Abstract

The invention provides a surge suppression device capable of suppressing temperature rise of a capacitor. A surge suppression device (1) is provided with: a resistor (21); a capacitor (22) electrically connected to the resistor (21); a terminal part (3) electrically connected to the opposite side of the resistor (21) to the side connected to the capacitor (22); a fixing fitting (4) which is fixed to a fixed object (111); and a molding resin (5) that molds the resistor (21), the terminal portion (3), and the fixing fitting (4). The capacitor (22) is disposed at a position separated from the molding resin (5).

Description

Surge suppression device

Technical Field

The present invention relates to a surge suppression device.

Background

Patent document 1 discloses a surge suppression unit for suppressing generation of a surge voltage in a wiring for supplying a three-phase alternating current from an inverter to a motor. The surge suppressing unit described in patent document 1 has three series circuits of resistors and capacitors, and capacitor-side ends of the three series circuits are connected to each other.

Prior art literature

Patent literature

Patent document 1: japanese patent application laid-open No. 2014-132811

Disclosure of Invention

Problems to be solved by the invention

Here, if no special investigation is made in the series circuit in which the resistor and the capacitor are connected, the capacitor receives heat from the resistor and the temperature excessively rises, which may reduce the lifetime of the capacitor. However, patent document 1 does not describe in detail the structure of a series circuit in which a resistor and a capacitor are connected.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a surge suppression device capable of suppressing a temperature rise of a capacitor.

Means for solving the problems

In order to achieve the above object, the present invention provides a surge suppression device including: a resistor; a capacitor electrically connected to the resistor; a terminal portion electrically connected to a side of the resistor opposite to the side connected to the capacitor; a fixing fitting fixed to a fixing object; and a molding resin for molding the resistor, the terminal portion, and the fixing member, wherein the capacitor is disposed at a position separated from the molding resin.

The effects of the invention are as follows.

According to the present invention, a surge suppression device capable of suppressing a temperature rise of a capacitor can be provided.

Drawings

Fig. 1 is a circuit diagram showing a use state of the surge suppressing device in the first embodiment.

Fig. 2 is a perspective view of the surge suppressing device in the first embodiment.

Fig. 3 is a front view of the surge suppressing device in the first embodiment.

Fig. 4 is a cross-sectional view of the IV-IV line of fig. 3.

Fig. 5 is an enlarged cross-sectional view of the molding resin in the first embodiment.

Fig. 6 is a perspective view of the surge suppressing device in the second embodiment.

Fig. 7 is a front view of the surge suppressing device in the second embodiment.

Fig. 8 is a cross-sectional view taken along line VII-VII of fig. 6.

Fig. 9 is a perspective view of a surge suppression device in the third embodiment.

Fig. 10 is a front view of the surge suppressing device in the third embodiment.

Fig. 11 is a sectional view taken along line XI-XI of fig. 10.

Fig. 12 is a perspective view of a surge suppression device in the fourth embodiment.

Fig. 13 is a plan view of a surge suppression device in the fourth embodiment.

Fig. 14 is a front view of a surge suppression device in the fourth embodiment.

Fig. 15 is a cross-sectional view taken along line XV-XV of fig. 14.

Fig. 16 is a perspective view showing a state in which three resistors are arranged in a primary forming unit in the fourth embodiment.

Fig. 17 is a perspective view showing a state in which three resistors are provided in a primary forming unit in the fourth embodiment.

Fig. 18 is a perspective view showing a completed state of the molded resin in the fourth embodiment.

Symbol description

1-surge suppressing device, 111-fixation target, 2-series circuit portion, 21-resistor body, 213a, 213 b-resistor terminal, 22-capacitor, 221-capacitor body, 222-capacitor terminal, 23-connection portion, 3-terminal portion, 4-fixation fitting, 41-base portion, 42-extension set portion, 5-molding resin, 501-base resin, 502-filler, 51-first recess, 52-second recess, 53-recess, 7-second fixation fitting, 8-second molding resin (capacitor embedding resin), 82-opening portion, 10-potting resin (capacitor embedding resin).

Detailed Description

First embodiment

A first embodiment of the present invention will be described with reference to fig. 1 to 5. The embodiments described below are also specifically exemplified as a part of various technical matters preferable in terms of implementation of the present invention, but the technical scope of the present invention is not limited to the specific embodiments.

Fig. 1 is a circuit diagram showing a use state of the surge suppressing device 1. The surge suppression device 1 of the present embodiment is used by being connected to, for example, the U-phase wiring 13U, the V-phase wiring 13V, and the W-phase wiring 13W between the motor 11 and the inverter 12. In this case, the surge suppression device 1 suppresses the application of the surge voltage to the motor 11. The surge suppression device 1 has three series circuit units 2 each having a resistor 21 and a capacitor 22 connected in series. The resistor 21 side of each of the three series circuit sections 2 is connected to the U-phase wiring 13U, the V-phase wiring 13V, or the W-phase wiring 13W. The capacitors 22 of the three series circuit units 2 are connected to each other to form a star connection. Hereinafter, the surge suppression device 1 of the present embodiment will be described in detail.

Fig. 2 is a perspective view of the surge suppressing device 1. Fig. 3 is a front view of the surge suppressing device 1. Fig. 3 also shows a motor case 111 and a bolt B, which are targets of fixation of the surge suppression device 1, in addition to the surge suppression device 1. Fig. 4 is a cross-sectional view of the IV-IV line of fig. 3.

The surge suppressing device 1 includes three series circuit portions 2, three terminal portions 3, a fixing fitting 4, a mold resin 5, an interconnecting portion 6, a second fixing fitting 7, a second mold resin 8, and a flat plate portion 9. The series circuit section 2 is formed by connecting a resistor 21 and a capacitor 22 in series via a connection section 23. The three terminal portions 3 are connected to the three resistor bodies 21 on the opposite sides of the connection portions 23. As shown in fig. 3, the fixing fitting 4 is attached to, for example, a motor housing 111 as a fixing target. The molding resin 5 is formed by molding three resistor bodies 21, three terminal portions 3, and a fixing fitting 4. The interconnecting portion 6 electrically connects the opposite sides of the three capacitors 22 from the connecting portion 23 to each other. The second fixing fitting 7 is attached to a fixing object such as the motor case 111. The second molding resin 8 molds the three capacitors 22, the interconnecting portions 6, the connecting portions 23, and the second fixing fittings 7. The second mold resin 8 is an example of a capacitor embedding resin embedding the capacitor 22. The flat plate portion 9 is provided overlapping the second fixing fitting 7.

The resistor 21 is formed in a long strip in one direction. The three resistors 21 are arranged in parallel with each other. Hereinafter, the long side direction of the resistor 21 is referred to as the X direction. The direction in which the three resistors 21 are arranged orthogonal to the X direction is referred to as the Y direction. The direction perpendicular to both the X direction and the Y direction is referred to as the Z direction.

The resistor 21 includes a resistor element 211 elongated in the X direction and two cap electrodes 212 fitted to both ends of the resistor element 211. The resistor 211 is not particularly limited, and may be, for example, a winding resistor or a ceramic resistor. The cap electrode 212 is formed by forming a conductive metal into a cap shape. As shown in fig. 4, the cap electrode 212 includes a disk-shaped bottom 212a facing the resistor 211 in the X direction, and a cylindrical side 212b extending from the periphery of the bottom 212a toward the resistor 211 in the X direction. The resistor 21 has two resistor terminals 213 connected to the cap electrodes 212. The resistor terminal 213 is formed in a plate shape facing the bottom 212a, and is bonded to the bottom 212 a. The two resistor terminals 213 of the resistor 21 are formed so as to protrude from the cap electrode 212 after bonding to the same side. The terminal portion 3 is connected to the resistor terminal 213 on one side of each of the three resistors 21, and the connection portion 23 is connected to the resistor terminal 213 on the other side. Hereinafter, the side of the resistor 21 from which the two resistor terminals 213 protrude is sometimes referred to as a lower side, and the opposite side is referred to as an upper side, but the vertical expression is for convenience, for example, the posture of the surge suppression device 1 in the vertical direction in the use state is not limited.

The terminal portion 3 has a plate shape having a thickness in the Z direction and a long shape in the X direction. The terminal portion 3 is made of a metal such as pure copper, for example. As shown in fig. 4, a through hole 31 into which the resistor terminal 213 is inserted is formed in the terminal portion 3. The resistor terminal 213 may be joined to the terminal portion 3 not only by being inserted into the through hole 31 but also by using solder or the like. The end portion on the X direction side of the terminal portion 3 is opposed to the resistor 21 in the Z direction via the molded resin 5. Specifically, the terminal portion 3 is opposed to a portion between the cap electrode 212 on the terminal portion 3 side in the resistor 21 and the two cap electrodes 212 in the resistor 211 in the Z direction via the molded resin 5. Further, a bolt insertion hole 32 is formed in an end portion of the terminal portion 3 opposite to the resistor 21. The end of the terminal 3 is electrically connected to a U-phase wiring (see reference numeral 13U in fig. 1), a V-phase wiring (see reference numeral 13V in fig. 1), or a W-phase wiring (see reference numeral 13W in fig. 1).

The connection portion 23 has a shape formed by bending a long plate-like metal member into a U shape. In the present embodiment, the connection portion 23 is made of a metal material having a lower thermal conductivity than the thermal conductivity of the terminal portion 3. Specifically, the connection portion 23 is made of phosphor bronze having a lower thermal conductivity than pure copper, which is a metal material constituting the terminal portion 3. This increases the thermal resistance in the thermal path from the resistor 21 to the capacitor 22 after passing through the connection portion 23, and can reduce the heat transferred to the capacitor 22. The connecting portion 23 has a first portion 231, a second portion 232, and a third portion 233. The first portion 231 is connected to the resistor terminal 213 on the opposite side of the resistor 21 from the terminal portion 3, and extends in the X direction. The X-direction end of the first portion 231 is joined to the resistor terminal 213 by solder or the like. The second portion 232 extends downward from an end of the first portion 231 opposite to the resistor terminal 213. The third portion 233 extends from the lower end of the second portion 232 in the X direction and is connected to the capacitor 22. The cross-sectional area of the connection portion 23 is smaller than the area of the cross-section of the terminal portion 3 orthogonal to the X direction. The cross-sectional area of the connection portion 23 is an area of a cross-section orthogonal to a heat path from the resistor 21 to the capacitor 22 via the connection portion 23. That is, when heat of the resistor 21 is conducted to the capacitor 22 by advancing along the first portion 231 in the X direction, advancing along the second portion 232 in the Z direction, and advancing along the third portion 233 in the X direction, the cross-sectional area of the connection portion 23 refers to the area of the cross-section orthogonal to the X direction of the first portion 231, the area of the cross-section orthogonal to the Z direction of the second portion 232, or the area of the cross-section orthogonal to the X direction of the third portion 233. The width of the connection portion 23 is smaller than the width of the terminal portion 3. The width of the connection portion 23 may be smaller than the diameter of the cap electrode 212 of the resistor 21. The thickness of the connection portion 23 is smaller than the thickness of the terminal portion 3. This makes the thermal resistance of the connection portion 23 larger than that of the terminal portion 3, and can reduce the heat transferred from the resistor 21 to the capacitor 22 through the connection portion 23.

As shown in fig. 3, the fixing fitting 4 is formed by forming a metal having thermal conductivity such as aluminum into a crank shape. The fixing fitting 4 has a base 41 extending in the Y direction and two extending portions 42 extending downward from both ends of the base 41 in the Y direction. As shown in fig. 3 and 4, the base 41 is opposed to the three resistors 21 and the three connecting portions 23 in the Z direction via the molded resin 5. Specifically, the base 41 faces the two cap electrodes 212 in the resistor 21, the cap electrode 212 on the connection portion 23 side, and the first portion 231 of the connection portion 23 in the Z direction via the molded resin 5.

As shown in fig. 3, the extending portion 42 includes a longitudinal extending portion 421 extending downward from both ends of the base 41, and a lateral extending portion 422 extending outward in the Y direction from the lower end of the longitudinal extending portion 421. The laterally extending portion 422 is formed with a bolt insertion hole 422a penetrating in the Z direction. A bolt B for fixing the fixing fitting 4 to the motor case 111 to be fixed is inserted through the bolt insertion hole 422a. Further, three resistor bodies 21, three terminal portions 3, three connection portions 23, and the fixing fittings 4 are molded by the molding resin 5.

As shown in fig. 2, the mold resin 5 has a rectangular parallelepiped shape having a thickness in the Z direction. The molding resin 5 is formed by disposing three terminal portions 3, three resistor bodies 21, three connection portions 23, and a fixing metal fitting 4 in a mold, injecting resin into the mold, and curing the resin. The molding resin 5 integrally molds the three resistor bodies 21. The molded resin 5 covers a part of each of the terminal portion 3, the connection portion 23, and the fixing fitting 4. The bolt insertion hole 32 side of the terminal portion 3 is exposed from the mold resin 5, and a portion opposite to the bolt insertion hole 32 side is covered with the mold resin 5. The portion of the connecting portion 23 other than the end portion on the second portion 232 side of the first portion 231 is covered with the mold resin 5. The upper end portions of the base 41 and the two extension portions 42 of the fixing fitting 4 are covered with the mold resin 5, respectively.

As shown in fig. 3, the length of the base 41 in the Y direction substantially coincides with the length of the molding resin 5 in the Y direction. Further, as shown in fig. 2, the main surface 40 of the fixing fitting 4 as viewed from the Y direction is exposed from the molding resin 5, and is formed coplanar with the surface of the molding resin 5. As shown in fig. 3 and 4, the lower surface 411 of the base 41 is located above the lower surface 5a of the mold resin 5, and is covered with the mold resin 5.

Fig. 5 is a schematic diagram in which a part of a cross section of the molding resin 5 is enlarged. The molding resin 5 is formed by adding a filler 502 having a higher thermal conductivity than the thermal conductivity of the base resin 501 to the base resin 501 having electrical insulation properties. The base resin 501 is made of, for example, PPS (polyphenylene sulfide) resin, epoxy resin, or other resin having electrical insulation properties. The filler 502 may be made of, for example, metal powder or ceramic powder, and specifically may be powder of aluminum oxide, boron nitride, aluminum nitride, or the like. In fig. 5, the filler 502 is represented by a circle for convenience, but the shape of the filler 502 is not limited thereto. The thermal conductivity of the molding resin 5 is preferably 3W/(mK) or more. The thermal conductivity of the molding resin 5 may be 10W/(m·k) or less. As shown in fig. 2 to 4, three capacitors 22 are arranged on the lower side of the mold resin 5.

For example, the capacitor 22 may be a ceramic capacitor, and includes: the capacitor body 221 of the capacitor element and the two capacitor terminals 222 protruding from the capacitor body 221 are covered with resin. One capacitor terminal 222 is connected to the third portion 233 of the connecting portion 23. The ends of the three capacitors 22 on the opposite side from the connection portion 23 are connected to each other by the interconnecting portion 6. The interconnect 6 is a bus bar having a long shape in the Y direction and a thickness in the Z direction.

As shown in fig. 3, the second fixing fitting 7 is formed by forming a metal having thermal conductivity such as aluminum into a crank shape. The second fixing fitting 7 has a second base portion 71 elongated in the Y direction and two second extension portions 72 extending downward from both ends of the second base portion 71 in the Y direction. The second extending portion 72 has a second longitudinally extending portion 721 extending in the Z direction from the second base portion 71, and a second laterally extending portion 722 extending outward in the Y direction from a lower end portion of the second longitudinally extending portion 721. Further, three capacitors 22 and the interconnecting portion 6 are disposed in the recess 70 formed by the second base 71 and the second longitudinally extending portion 721. The second laterally extending portion 722 is located on the lower side of the laterally extending portion 422 of the fixing fitting 4, and overlaps with the laterally extending portion 422 in the Z direction. Further, a bolt insertion hole 722a communicating with the bolt insertion hole 422a of the laterally extending portion 422 is formed in the second laterally extending portion 722. As shown in fig. 4, the width of the second fixing fitting 7 in the X direction is equal to the width of the fixing fitting 4 in the X direction, and the second fixing fitting 7 is formed in the same region as the fixing fitting 4 in the X direction. The three capacitors 22, the interconnecting portion 6, and the second fixing fitting 7 are molded by the second molding resin 8.

The second molding resin 8 is formed to fill the concave portion 70 of the second fixing fitting 7. The second molding resin 8 is formed by disposing three capacitors 22, the interconnection portion 6, the connection portion 23, and the second fixing member 7 in a mold, and injecting and curing the resin into the mold. The second mold resin 8 covers the entire three capacitors 22 and the entire interconnecting portion 6, and covers the third portion 233 of the connecting portion 23. And, the second molding resin 8 covers the inner surface of the recess 70 in the second fixing fitting 7.

The second molding resin 8 is formed at a position separated from the molding resin 5. Further, there is a space between the molding resin 5 and the second molding resin 8. The second molding resin 8 is entirely incorporated into the formation region of the molding resin 5 when viewed from the Z direction. The second molding resin 8 is disposed between the two extended portions 42 of the fixing fitting 4.

In the present embodiment, the second molding resin 8 is composed of the same material as the molding resin 5. That is, the second molding resin 8 is formed by adding a filler having a higher thermal conductivity than that of the base resin to the base resin having electrical insulation properties. The thermal conductivity of the second molding resin 8 is preferably 3W/(m·k) or more. The thermal conductivity of the second molding resin 8 may be 10W/(m·k) or less. A flat plate portion 9 is disposed below the second molding resin 8.

The flat plate portion 9 is formed in a plate shape having a thickness in the Z direction and a long shape in the Y direction. The flat plate portion 9 is made of a metal having thermal conductivity such as aluminum. The flat plate portion 9 overlaps with the lower surface of the laterally extending portion 422 in the second fixing fitting 7 and the lower surface of the second molding resin 8. The flat plate portion 9 is not molded by the second molding resin 8. As shown in fig. 3, a bolt insertion hole 91 that communicates with the bolt insertion hole 422a of the fixing fitting 4 and the bolt insertion hole 722a of the second fixing fitting 7 is formed in the flat plate portion 9. The fixing fitting 4, the second fixing fitting 7, and the flat plate portion 9 are screwed to the motor case 111 by inserting the bolts B through the bolt insertion holes 422a, 722a, and 91, and fastening them together with the motor case 111. Further portions of the surface of the second mold resin 8 can be covered with the metal member (i.e., the second fixing fitting 7 and the flat plate portion 9) by the flat plate portion 9, so that heat dissipation from the second mold resin 8 to the metal member can be promoted. In addition, the flat plate portion 9 can be omitted.

(operation and Effect of the first embodiment)

The surge suppression device 1 of the present embodiment includes a molding resin 5 that molds the resistor 21, the terminal portion 3, and the fixing fitting 4. Therefore, the heat generated by the resistor 21 is transferred to the terminal portion 3 and the fixing fitting 4 via the mold resin 5, and is released to the counterpart member connected to the terminal portion 3 and the fixing object of the fixing fitting 4. This can suppress heat generated by the resistor 21 from being transferred to the capacitor 22, and the capacitor 22 becomes high temperature. Further, since the capacitor 22 is disposed at a position separated from the mold resin 5, heat transfer from the mold resin 5 to the capacitor 22 is suppressed, and a high temperature of the capacitor 22 is suppressed. Further, as a result of suppressing the temperature rise of the capacitor 22, the lifetime of the capacitor 22 can be increased.

The fixing fitting 4 is opposed to the resistor 21 through the molded resin 5. Therefore, heat transfer from the resistor 21 to the fixing fitting 4 via the mold resin 5 can be promoted, and heat dissipation of the resistor 21 can be improved. As a result, heat transfer from the resistor 21 to the capacitor 22 is suppressed.

The terminal portion 3 is opposed to the resistor portion 21 through the mold resin 5. Therefore, heat transfer from the resistor 21 to the terminal portion 3 via the mold resin 5 can be promoted, and as a result, heat transfer from the resistor 21 to the capacitor 22 can be suppressed.

The connection portion 23 is molded with the molding resin 5, and the connection portion 23 faces the fixing fitting 4 via the molding resin 5. Therefore, heat of the connection portion 23 is easily transmitted to the fixing fitting 4 via the mold resin 5, and thus, a high temperature of the connection portion 23 can be suppressed. As a result, the capacitor 22 connected to the connection portion 23 is suppressed from being heated.

The cross-sectional area of the connection portion 23 is smaller than the cross-sectional area of the terminal portion 3. That is, the thermal resistance of the connection portion 23 is larger than that of the terminal portion 3. Therefore, heat generated by the resistor 21 is more easily transferred to the terminal portion 3 than to the connection portion 23, and heat transfer to the connection portion 23 connected to the capacitor 22 is suppressed. The connection portion 23 is made of a metal material having a lower thermal conductivity than the thermal conductivity of the terminal portion 3. Specifically, the connection portion 23 is made of phosphor bronze having a lower thermal conductivity than pure copper, which is a metal material constituting the terminal portion 3. Therefore, the thermal resistance in the thermal path from the resistor 21 to the capacitor 22 after passing through the connection portion 23 can be increased. Thereby, the heat transferred from the resistor 21 to the capacitor 22 through the connection portion 23 is reduced, and the heat directly released from the resistor 21 to the terminal portion 3 and the heat released from the resistor 21 to the terminal portion 3 and the fixing fitting 4 through the mold resin 5 are increased. As a result, the capacitor 22 is further suppressed from being heated.

The surge suppressing device 1 further includes a second molding resin 8 for molding the connection portion 23, the capacitor 22, and the second fixing fitting 7. Therefore, a part of the heat emitted from the resistor 21 flows to the capacitor 22 through the connection portion 23, but the heat of the connection portion 23 is diffused by the second mold resin 8 before reaching the capacitor 22. Therefore, heat transferred from the resistor 21 to the capacitor 22 via the connection portion 23 can be reduced. Then, heat generated in the capacitor 22 by energizing the capacitor 22 or the like is diffused to the second mold resin 8. Then, the heat diffused to the second mold resin 8 is released to the fixation object of the second fixation fitting 7 via the second fixation fitting 7. The second molding resin 8 is disposed at a position separated from the molding resin 5. Therefore, heat transfer from the mold resin 5 covering the resistor 21 to the second mold resin 8 can be suppressed, and as a result, the temperature rise of the capacitor 22 in the second mold resin 8 can be suppressed.

The base 41 of the fixing fitting 4 is molded with the molding resin 5, and the second molding resin 8 is disposed between the two extending portions 42. Therefore, the space between the two extension portions 42 can be effectively utilized, and the overall size of the surge suppressing device 1 can be reduced.

The molding resin 5 molds the plurality of resistors 21. Therefore, heat of the plurality of resistors 21 can be transmitted to the fixing fitting 4 and the terminal portion 3 via one mold resin 5, and the overall size of the surge suppressing device 1 and the number of components can be reduced.

The molding resin 5 includes a base resin 501 and a filler 502 having a higher thermal conductivity than the base resin 501. Therefore, the thermal conductivity of the mold resin 5 can be increased, and the heat transferred from the resistor 21 to the terminal portion 3 and the fixing fitting 4 through the mold resin 5 can be increased, thereby reducing the heat transferred from the resistor 21 to the capacitor 22.

The thermal conductivity of the molding resin 5 is 3W/(mK) to 10W/(mK). By setting the thermal conductivity of the mold resin 5 to 3W/(m·k) or more, the heat transferred from the resistor 21 to the terminal portion 3 and the fixing fitting 4 through the mold resin 5 can be increased, and the heat transferred from the resistor 21 to the capacitor 22 can be reduced. Further, by setting the thermal conductivity of the molding resin 5 to 10W/(m·k) or less, the cost of the molding resin 5 can be reduced and the moldability can be improved. In order to increase the thermal conductivity of the molding resin 5, it is necessary to contain a large amount of filler 502, but as the filler 502 is increased, the cost of the molding resin 5 increases, and as the fluidity of the raw material in a molten state of the molding resin 5 is poor, the moldability of the molding resin 5 is more likely to deteriorate. Therefore, the thermal conductivity of the molding resin 5 is set to 10W/(m·k) or less, and the cost of the molding resin 5 and the moldability can be reduced.

As described above, according to the present embodiment, a surge suppression device capable of suppressing a temperature rise of a capacitor can be provided.

Second embodiment

Fig. 6 is a perspective view of the surge suppression device 1 in the present embodiment. Fig. 7 is a front view of the surge suppressing device 1. Fig. 8 is a sectional view taken along line VII-VII of fig. 7.

The present embodiment is a mode in which the position of the fixing fitting 4, the shape of the second fixing fitting 7, and the like are changed as compared with the first embodiment.

As shown in fig. 8, the base 41 of the fixing fitting 4 is opposed to a portion between the two cap electrodes 212 in the resistive element 211 via the molded resin 5 in the Z direction, instead of being opposed to the two cap electrodes 212 in the Z direction. A part of the base 41 faces the central region of the resistor 21 in the X direction in the Z direction. Here, the central region of the resistor 21 in the X direction may be, for example, a central portion of the resistor 21 divided into five equal parts in the X direction.

The three capacitors 22, the interconnecting portion 6, and the second fixing member 7 molded with the second molding resin 8 are disposed on the opposite side of the terminal portion 3 in the X direction with the fixing member 4 interposed therebetween. The three capacitors 22, the interconnecting portion 6, and the second fixing member 7 molded by the second molding resin 8 are disposed at positions separated from the fixing member 4.

The second fixing fitting 7 has a box-like portion 73 that opens to the opposite side of the terminal portion 3 in the X direction, and flange portions 74 that extend from the lower end of the box-like portion 73 to both outer sides in the Y direction. The box-like portion 73 has a rectangular plate-like bottom plate portion 731 having a thickness in the X direction and being elongated in the Y direction, and a rectangular cylindrical side plate portion 732 extending in the X direction from the peripheral edge of the bottom plate portion 731, and is open on the opposite side to the bottom plate portion 731. The flange portion 74 is formed with a bolt insertion hole 741, and the second fixing member 7 is fastened to the motor case by bolts at the flange portion 74. In the present embodiment, the fixation target of the second fixation fixture 7 is the same motor housing as the fixation target of the fixation fixture 4, but may be a member different from the fixation target of the fixation fixture 4. Three capacitors 22 and the interconnecting portion 6 are housed inside the box-like portion 73 of the second fixing fitting 7, and filled with the second molding resin 8. In addition, the second molding resin 8 may be replaced by filling resin in the inside of the box-like portion 73 by potting. In this case, the load applied to the joint portions between the three capacitors 22 and the interconnecting portions 6 and 23 is easily reduced.

As shown in fig. 8, the end face 5b of the mold resin 5 on the side from which the connecting portion 23 protrudes is located in the vicinity of the end face 81 of the second mold resin 8 on the side from which the connecting portion 23 protrudes. The length L1 in the X direction from the end face 5b of the mold resin 5 to the resistor 21 is 3 times or more the length L2 in the X direction from the end face 5c of the mold resin 5 on the side from which the terminal portion 3 protrudes. The length (i.e., L1) of the connecting portion 23 in the X direction of the portion disposed in the mold resin 5 is 3 times or more the length L2 in the X direction from the end surface 5c of the mold resin 5 to the resistor 21. In this embodiment, a flat plate portion is not disposed below the second fixing fitting 7 (see reference numeral 9 in fig. 2 to 4).

The other structures of this embodiment are the same as those of the first embodiment.

Note that, in the second embodiment and symbols used after the second embodiment, unless otherwise indicated, symbols identical to those used in the present embodiment indicate components identical to those in the present embodiment, and the like.

(operation and Effect of the second embodiment)

In this embodiment, the base 41 of the fixing fitting 4 is opposed to the central region of the resistor 21 in the Z direction via the molded resin 5. Since heat of the resistor 21 is easily radiated to the terminal portion 3 and the connection portion 23, which are metal members in contact with the resistor 21, the heat is easily stagnated in the central region of the resistor 21 as compared with both end portions of the resistor 21. Therefore, the fixing metal fitting 4 is opposed to the central region of the resistor 21 via the mold resin 5, and heat in the central region of the resistor 21 can be dissipated to the fixing metal fitting 4 via the mold resin 5. As a result, the temperature rise of the resistor 21 can be suppressed, and the heat transferred from the resistor 21 to the capacitor 22 can be reduced.

The second molding resin 8 is filled inside the box-shaped portion 73 of the second fixing fitting 7. Thereby, a wider range of the second molding resin 8 can be surrounded with the second fixing fittings 7. As a result, heat of the capacitor 22 is easily dissipated to the second fixing member 7 via the second mold resin 8.

The length L1 in the X direction of the portion of the connecting portion 23 disposed in the mold resin 5 is 3 times or more the length L2 in the X direction of the resistor 21 from the end surface of the mold resin 5 on the side from which the terminal portion 3 protrudes. This facilitates diffusion of heat transferred from the resistor 21 to the connection portion 23 into the mold resin 5, and suppresses a rise in temperature of the connection portion 23. Therefore, heat transfer from the connection portion 23 to the capacitor 22 can be suppressed.

Otherwise, the same actions and effects as those of the first embodiment are provided.

Third embodiment

Fig. 9 is a perspective view of the surge suppressing device 1. Fig. 10 is a front view of the surge suppressing device 1. Fig. 11 is a sectional view taken along line XI-XI of fig. 10.

The present embodiment is a mode in which the shape of the mold resin 5, the position of the fixing fitting 4, the position of the capacitor 22 with respect to the second mold resin 8, and the like are changed as compared with the first embodiment.

In order to reduce the amount of resin used, reduce the size and weight, the shape of the molded resin 5 has been studied. Four first concave portions 51 concave in the surface on the opposite side of the second molding resin 8 in the Z direction and two second concave portions 52 concave in the surface on the side on which the terminal portion 3 protrudes in the X direction are formed in the molding resin 5. The four first concave portions 51 have two first concave portions 51 formed in a range between the resistors 21 adjacent in the Y direction and two first concave portions 51 formed outside the three resistors 21 located at both ends in the Y direction. The first concave portion 51 is formed over one end to the other end of the molding resin 5 in the X direction, and both sides in the X direction are opened. As shown in fig. 10, the formation range of the first concave portion 51 in the Z direction is formed in a range overlapping with the formation range of the resistor 21 in the Z direction. The second concave portion 52 is formed in a range between the resistors 21 adjacent to each other in the Y direction. The second recess 52 communicates with the first recess 51. As shown in fig. 11, the end surface of the second concave portion 52 in the X direction is located between the terminal portion 3 in the X direction and the base portion 41 of the fixing fitting 4.

The base 41 of the fixing fitting 4 is opposed to the two cap electrodes 212 in the resistive element 211 in the Z direction via the molded resin 5, instead of being opposed to the two cap electrodes 212 in the Z direction. A part of the base 41 faces the central region of the resistor 21 in the X direction in the Z direction. In this embodiment, a part of the base 41 is opposed to the center of the resistor 21 in the X direction in the Z direction. The lower surface 411 of the base 41 is exposed from the molding resin 5, and is formed coplanar with the lower surface 5a of the molding resin 5.

The capacitor 22 is arranged eccentrically in the X direction with respect to the second mold resin 8. Here, the end portion of the connecting portion 23 on the capacitor 22 side (i.e., the third portion 233) is located on the side of the third portion 233 on the side of the capacitor 22 side with respect to the X direction, which is the extending direction. At this time, as shown in fig. 11, the center position C1 in the X direction of the capacitor main body 221 is located on the front end side than the center position C2 in the X direction of the second mold resin 8. The entire capacitor body 221 may be located on the front end side with respect to the center position C2 of the second mold resin 8 in the X direction.

The other is the same as the first embodiment.

(action and Effect of the third embodiment)

In this embodiment, the center position C1 in the X direction of the capacitor body 221 is located on the front end side than the center position C2 in the X direction of the second mold resin 8. Therefore, the length of the connection portion 23 covered by the second molding resin 8 can be increased. A part of the heat of the resistor 21 is directed to the capacitor 22 via the connection portion 23, but in this embodiment, the length of the connection portion 23 covered with the second mold resin 8 increases, so that the heat is easily diffused to the second mold resin 8. Therefore, heat transfer from the resistor 21 to the capacitor 22 can be suppressed.

Further, recesses (i.e., first recesses 51 and second recesses 52) are formed in the molded resin 5 in the range between the resistors 21 adjacent in the Y direction. Therefore, the reduction in the amount of the molding resin 5 used, miniaturization, and weight reduction can be achieved. Further, since the molding resin 5 is provided with the concave portion to form the surface of the molding resin 5 in the uneven shape, the surface area of the molding resin 5 can be ensured, and the heat radiation property from the molding resin 5 to the surrounding space can be improved.

Fourth embodiment

Fig. 12 is a perspective view of the surge suppression device 1 in the present embodiment. Fig. 13 is a plan view of the surge suppression device 1. Fig. 14 is a front view of the surge suppressing device 1. Fig. 15 is a cross-sectional view taken along line XV-XV of fig. 14.

The present embodiment is a mode in which the shape of the molding resin 5, the shape of the connecting portion 23, and the sealing structure of the capacitor 22 are mainly changed as compared with the first embodiment.

As shown in fig. 12 and 13, a concave portion 53 is formed in the range between the resistors 21 adjacent to each other in the Y direction in the molded resin 5. The concave portion 53 is formed such that a surface of the mold resin 5 on the side of the terminal portion 3 in the X direction is concave in the X direction in the entire Z direction. The concave portion 53 has functions of reducing the resin usage amount of the molding resin 5, reducing the weight, ensuring the creepage distance between the adjacent resistors 21, and the like.

The molded resin 5 is formed with a first exposure concave portion 54 for exposing the resistance terminals 213a of the three resistors 21 connected to the three terminal portions 3 and a second exposure concave portion 55 for exposing the resistance terminals 213b of the three resistors 21 connected to the three connection portions 23.

In this embodiment, the first exposure concave portions 54 are formed at three portions of the mold resin 5 so as to expose the three resistor terminals 213a, respectively. The first exposure concave portion 54 is formed at an end portion of the mold resin 5 on the side of the terminal portion 3 in the X direction and on the opposite side to the second mold resin 8 in the Z direction. In this embodiment, the entire resistor terminal 213a and a part of the cap electrode 212 connected to the resistor terminal 213a are exposed from the first exposure concave portion 54. Since the resistance terminal 213a is exposed from the mold resin 5, the injection pressure at the time of molding the mold resin 5 can be suppressed from being applied to the joint portion between the resistance terminal 213a and the terminal portion 3, and the connectivity between the resistance terminal 213a and the terminal portion 3 can be ensured.

The second exposure concave portions 55 are formed at three portions of the mold resin 5 so as to expose the three resistor terminals 213b, respectively. The second exposure concave portion 55 is formed at an end portion of the molding resin 5 on the side of the connecting portion 23 in the X direction and on the side of the second molding resin 8 in the Z direction. In this embodiment, the entire resistor terminal 213b and a part of the cap electrode 212 connected to the resistor terminal 213b are exposed from the second exposure concave portion 55. Since the resistance terminal 213b is exposed from the molding resin 5, the injection pressure at the time of molding the molding resin 5 can be suppressed from being applied to the joint portion between the resistance terminal 213b and the connection portion 23, and the connectivity between the resistance terminal 213b and the connection portion 23 can be ensured.

The second exposure concave portions 55 are concave portions closed on both sides in the Y direction, and a part of the molding resin 5 is present between adjacent second exposure concave portions 55. This makes it easy to secure the insulation distance between adjacent resistors 21 and to suppress a decrease in volume of the molding resin 5, and as a result, a decrease in heat dissipation performance of the resistors 21 through the molding resin 5 is suppressed. In addition, three resistor terminals 213b may be exposed in, for example, one wide second exposure concave portion. This structure is effective especially when reduction in the amount of the molding resin 5 used, weight saving, and the like are to be achieved.

The pair of resistor terminals 213a and 213b of the resistor 21 are formed of wires having a circular cross section. In particular, in the case where the pair of resistor terminals 213a and 213b of the resistor 21 are formed of wires, unlike the present embodiment, when the resistor terminals 213a and 213b are embedded in the molding resin 5, injection pressure acts on the resistor terminals 213a and 213b during molding of the molding resin 5, and there is a concern that the load on the resistor terminals 213a and 213b increases. Therefore, in this embodiment, the resistor terminals 213a and 213b are exposed from the first exposure concave portion 54 and the second exposure concave portion 55.

The connection portion 23 connecting the resistor 21 and the capacitor 22 is formed of a wire having a circular cross section. By forming the connection portion 23 from the wire in this way, the cross-sectional area of the wire forming the connection portion 23 can be easily made smaller than the cross-sectional area of the terminal portion 3, and heat transfer from the resistor 21 to the capacitor 22 via the connection portion 23 can be suppressed. In this embodiment, the cross-sectional area of the wire constituting the connection portion 23 is smaller than the cross-sectional area of the terminal portion 3 and the cross-sectional areas of the resistor terminals 213a and 213b, respectively. The connection portion 23 may be a single wire or a twisted wire, and an insulating coating portion may be provided on the surface of the connection portion 23.

As shown in fig. 12 and 15, the connection portion 23 is formed by bending a wire, and includes a first portion 231, a second portion 232, and a third portion 233. The first portion 231 is connected to the resistor terminal 213b of the resistor 21 and extends in the X direction. The second portion 232 extends in the Z direction from an end of the first portion 231 on the opposite side from the resistor terminal 213 b. The third portion 233 extends from an end of the second portion 232 opposite to the first portion 231 toward the same side as the first portion 231 in the X direction, and is connected to the capacitor 22.

As shown in fig. 14 and 15, the sealing structure of the capacitor 22 includes a box-shaped second molding resin 8 that molds the second fixing member 7 and has an opening 82, and a potting resin 10 that seals the capacitor 22 in the second molding resin 8. In this embodiment, the potting resin 10 is an example of a capacitor embedding resin that embeds the capacitor 22.

The second molding resin 8 is formed in a rectangular box shape having an opening 82 opening on the opposite side of the X direction from the terminal portion 3, embedding the second base portion 71 and the second longitudinally extending portion 721 of the second fixing fitting 7. Three capacitors 22 and the interconnecting portions 6 are arranged in the second molding resin 8, and the above-mentioned components are sealed with the potting resin 10.

The potting resin 10 is made of, for example, a thermosetting resin. From the viewpoint of improving the heat dissipation of the capacitor 22, the potting resin 10 is preferably composed of a resin having high thermal conductivity. For example, the potting resin 10 is formed by adding a filler having a higher thermal conductivity than that of the base resin to the base resin having electrical insulation properties. In this embodiment, the flat plate portion (see reference numeral 9 in fig. 2 to 4) in the first embodiment is not disposed, but may be disposed.

Next, an example of a method of molding the mold resin 5 so as to expose the pair of resistor terminals 213a and 213b will be described with reference to fig. 16 to 18. Fig. 16 is a perspective view showing a state in which three resistors 21 are arranged in the primary forming unit 100. Fig. 17 is a perspective view showing a state after three resistors 21 are provided in the primary forming unit 100. Fig. 18 is a perspective view showing a completed state of the molding resin 5.

The molding resin 5 is composed of a primary molding portion 56 and a secondary molding portion 57, the primary molding portion 56 molds the fixing fitting 4 and the three terminal portions 3, and the secondary molding portion 57 molds the integrated fixing fitting 4, three terminal portions, and the primary molding portion 56 and the three resistors 21, which will be described in detail below. That is, the molding resin 5 of the present embodiment is formed by resin molding in a plurality of stages. The primary molding portion 56 and the secondary molding portion 57 may be made of the same resin or may be made of different resins.

In molding the molding resin 5, a primary molding step of forming the primary molded portion 56, a resistance arrangement step of arranging the three resistors 21 in the primary molded portion 56, and a secondary molding step of forming the secondary molded portion 57 are sequentially performed.

In the primary molding step, the three terminal portions 3 and the fixing fittings 4 are placed in a mold, and resin is injected into the mold and cured, thereby molding the primary molded portion 56 as shown in fig. 16. At this time, the shape of the mold was studied so that three placement recesses 561 capable of placing three resistors 21 were formed on the surface of the primary molded portion 56 after molding. In this embodiment, the arrangement recess 561 is formed so that a part of each of the resistor element 211 and the pair of cap electrodes 212 can be inserted, and the pair of resistor terminals 213a and 213b are arranged outside the arrangement recess 561 in a state where the resistor 21 is arranged in the arrangement recess 561.

After the primary molding step, a resistor arrangement step is performed as shown in fig. 16 and 17. In this embodiment, the bonding operation between the resistor terminal 213a and the terminal portion 3 is performed in the resistor arrangement step. In addition, the bonding operation may be performed after the molding resin 5 is entirely completed.

Then, a secondary molding step is performed. In the secondary molding step, the primary molding unit 100 including the primary molding portion 56, the three resistors 21, and the fixing metal fitting 4 is placed in a mold, and resin is injected into the mold and cured, thereby molding the secondary molding portion 57 as shown in fig. 18. At this time, the entire pair of resistor terminals 213a and 213b of the resistor 21 is disposed outside the cavity of the mold, and the pair of resistor terminals 213a and 213b are exposed outside the mold resin 5.

By the above method, the molded resin 5 in which the primary molded part 56 and the secondary molded part 57 are integrated is molded.

(action and Effect of the fourth embodiment)

In the present embodiment, the second molding resin 8 is formed in a box shape having an opening 82. The surge suppressing device 1 further includes a potting resin 10 for sealing the capacitor 22 in the second molding resin 8. Since it is relatively difficult to generate pressure in the resin when the potting resin 10 is formed, that is, when the capacitor 22 is sealed, it is possible to suppress a large pressure from being applied to the capacitor 22. This suppresses, for example, a load applied to the joint portion between the capacitor 22 and the components connected thereto (for example, the connection portion 23 and the interconnecting portion 6) and reduces the connectivity of the components.

The entire pair of resistor terminals 213a and 213b is exposed from the mold resin 5. Therefore, the injection pressure at the time of molding the molding resin 5 is not applied to the resistor terminals 213a and 213b, and the load applied to the joint portion between the resistor terminals 213a and 213b and the members connected thereto (for example, the terminal portion 3 and the connection portion 23) can be suppressed, so that the connectivity of the members can be reduced.

The connection portion 23 is formed of a wire. Therefore, heat transfer from the resistor 21 to the capacitor 22 via the connection portion 23 is suppressed.

(summary of embodiments)

Next, the technical ideas grasped from the above-described embodiments will be described with reference to the symbols and the like in the embodiments. Note that the symbols and the like in the following description do not limit the constituent elements in the claims to the components and the like specifically shown in the embodiments.

[1] A surge suppression device 1 is provided with: a resistor 21; a capacitor 22 electrically connected to the resistor 21; a terminal portion 3 electrically connected to a side of the resistor 21 opposite to the side connected to the capacitor 22; a fixing fitting 4 fixed to the fixing object 111; and a molding resin 5 for molding the resistor 21, the terminal portion 3, and the fixing member 4, wherein the capacitor 22 is disposed at a position separated from the molding resin 5.

[2] The surge suppressing device 1 according to [1], wherein the fixing member 4 faces the resistor 21 through the mold resin 5.

[3] The surge suppressing device 1 according to [1] or [2], wherein the terminal portion 3 faces the resistor 21 through the mold resin 5.

[4] The surge suppressing device 1 according to any one of [1] to [3], wherein a connecting portion 23 connecting the resistor 21 and the capacitor 22 is molded by the molding resin 5, and the connecting portion 23 faces the fixing fitting 4 via the molding resin 5.

[5] The surge suppressing device 1 according to [4], wherein a cross-sectional area of the connecting portion 23 is smaller than a cross-sectional area of the terminal portion 3.

[6] The surge suppressing device 1 according to any one of [1] to [5], further comprising capacitor-embedded resins 8 and 10 in which the capacitor 22 is embedded, wherein the capacitor-embedded resins 8 and 10 are disposed at positions separated from the mold resin 5.

[7] The surge suppressing device 1 according to [6], wherein the fixing fitting 4 has a base portion 41 extending in one direction Y and two extension portions 42 extending from both ends of the base portion 41 to the same side, the base portion 41 is molded with the molding resin 5, and the capacitor embedding resins 8, 10 are disposed between the two extension portions 42.

[8] The surge suppressing device 1 according to [6] or [7], wherein the capacitor 22 has a capacitor body 221 and a capacitor terminal 222 protruding from the capacitor body 221, and when an extending direction of an end 233 of the capacitor 22 side in a connecting portion 23 connecting the resistor 21 and the capacitor 22 is defined as an extending direction X and a side of the extending direction X with respect to the end 233 and a side of the capacitor 22 is defined as a tip side, a center position C1 of the capacitor body 221 in the extending direction X is located on the tip side than a center position C2 of the capacitor embedded resin 8, 10 in the extending direction X.

[9] The surge suppressing device 1 according to any one of [6] to [8], further comprising a second fixing member 7 fixed to a fixing object 111, wherein the capacitor-embedded resins 8 and 10 are second molding resins 8 for molding a connection portion 23 connecting the resistor 21 and the capacitor 22, and the second fixing member 7.

[10] The surge suppression device 1 according to any one of [6] to [8], further comprising: a second fixing fitting 7 fixed to the fixing object 111; and a second molding resin 8 for molding the second fixing member 7, wherein the second molding resin 8 is formed in a box shape having an opening 82, and the capacitor embedding resins 8 and 10 are potting resins 10 for sealing the capacitor 22 in the second molding resin 8.

[11] The surge suppressing device 1 according to any one of [1] to [10], wherein the surge suppressing device has a plurality of series circuit portions 2 connecting the resistor 21 and the capacitor 22 in series, and the molding resin 5 molds the plurality of resistors 21.

[12] The surge suppressing device 1 according to [11], wherein the plurality of resistors 21 are arranged in parallel, and recesses 51, 52, 53 are formed in the molded resin 5 in a range between the adjacent resistors 21 in the arrangement direction of the plurality of resistors 21.

[13] The surge suppressing device 1 according to any one of [1] to [12], wherein the molding resin 5 has a base resin 501 and a filler 502 having a higher thermal conductivity than the base resin 501.

[14] The surge suppressing device 1 according to [13], wherein the thermal conductivity of the molding resin 5 is 3W/(mK) or more and 10W/(mK) or less.

[15] The surge suppressing device 1 according to any one of [1] to [14], wherein the resistor 21 has a pair of resistor terminals 213a, 213b, and the entirety of the pair of resistor terminals 213a, 213b is exposed from the mold resin 5.

[16] The surge suppressing device 1 according to any one of [1] to [15], wherein a connection portion 23 connecting the resistor 21 and the capacitor 22 is constituted by a wire.

(additionally remembered)

The embodiments of the present invention have been described above, but the above embodiments do not limit the invention of the claims. Note that a combination of all the features described in the embodiments is not essential to the solution of the problem of the invention. The present invention can be implemented by appropriately modifying the present invention within a range not departing from the gist thereof.

For example, in each of the above embodiments, the fixing fitting is embedded in the molding resin, but the fixing fitting is not limited to this, and a part of the surface may be in close contact with the molding resin. For example, the second fixing fitting is not in the form of embedding the second molding resin, but the fixing fitting and the molding resin may be configured in the form of the second fixing fitting and the second molding resin. Conversely, the second fixing fitting may also be constructed in a form of being buried in the second molding resin.

In the above embodiments, the terminal portion has been shown as a straight plate-like example, but the shape of the terminal portion can be changed appropriately according to the position of the connection object of the terminal portion. For example, the terminal portion may be formed by bending a metal plate in an L-shape.

Claims

1. A surge suppression device is characterized by comprising:

a resistor;

a capacitor electrically connected to the resistor;

a terminal portion electrically connected to a side of the resistor opposite to the side connected to the capacitor;

a fixing fitting fixed to a fixing object; and

a molding resin for molding the resistor, the terminal portion, and the fixing fitting,

the capacitor is disposed at a position separated from the molding resin.

2. The surge suppression device of claim 1, wherein,

the fixing member faces the resistor through the molding resin.

3. The surge suppression device according to claim 1 or 2, wherein,

the terminal portion faces the resistor through the mold resin.

4. The surge suppression device according to claim 1 or 2, wherein,

a connection portion connecting the resistor and the capacitor is molded by the molding resin,

the connecting portion faces the fixing fitting via the molding resin.

5. The surge suppression device of claim 4, wherein,

the cross-sectional area of the connection portion is smaller than the cross-sectional area of the terminal portion.

6. The surge suppression device according to claim 1 or 2, wherein,

further comprises a capacitor embedding resin for embedding the capacitor,

the capacitor embedding resin is disposed at a position separated from the molding resin.

7. The surge suppression device of claim 6, wherein,

the fixing fitting has a base portion extending in one direction and two extending portions extending from both ends of the base portion to the same side,

the base is molded from the molding resin,

the capacitor embedding resin is disposed between the two extension portions.

8. The surge suppression device of claim 6, wherein,

the capacitor has a capacitor body and a capacitor terminal protruding from the capacitor body,

when the direction in which the capacitor-side end portion of the connection portion connecting the resistor and the capacitor extends is the extending direction and the side in which the capacitor is located with respect to the end portion is the tip end side, the center position in the extending direction of the capacitor main body is located on the tip end side with respect to the center position in the extending direction of the capacitor-embedded resin.

9. The surge suppression device of claim 6, wherein,

and a second fixing fitting fixed to the fixing object,

the capacitor-embedding resin is a second molding resin that molds a connection portion connecting the resistor and the capacitor, and the second fixing component.

10. The surge suppression device of claim 6, wherein,

the device further comprises: a second fixing fitting fixed to the fixing object; and a second molding resin for molding the second fixing fitting,

the second molding resin is formed in a box shape having an opening portion,

the capacitor embedding resin is a potting resin for sealing the capacitor in the second molding resin.

11. The surge suppression device according to claim 1 or 2, wherein,

a plurality of series circuit parts for connecting the resistor and the capacitor in series,

the molding resin molds the plurality of resistors.

12. The surge suppression device of claim 11, wherein,

the plurality of resistors are arranged in parallel,

recesses are formed in the molded resin in a range between the resistors adjacent to each other in the arrangement direction of the plurality of resistors.

13. The surge suppression device according to claim 1 or 2, wherein,

the molding resin includes a base resin and a filler having a higher thermal conductivity than the base resin.

14. The surge suppression device of claim 13, wherein,

the thermal conductivity of the molding resin is 3W/(m.K) or more and 10W/(m.K) or less.

15. The surge suppression device according to claim 1 or 2, wherein,

the resistor body has a pair of resistor terminals,

the entire pair of resistor terminals is exposed from the molding resin.

16. The surge suppression device according to claim 1 or 2, wherein,

the connection part connecting the resistor and the capacitor is formed by a wire.