CN116646264A - Integrated Circuit Packaging Method - Google Patents
Integrated Circuit Packaging Method Download PDFInfo
- Publication number
- CN116646264A CN116646264A CN202310678099.XA CN202310678099A CN116646264A CN 116646264 A CN116646264 A CN 116646264A CN 202310678099 A CN202310678099 A CN 202310678099A CN 116646264 A CN116646264 A CN 116646264A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- rotating shaft
- main body
- board main
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 43
- 238000002347 injection Methods 0.000 claims abstract description 13
- 239000007924 injection Substances 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000000725 suspension Substances 0.000 claims abstract description 8
- 230000000903 blocking effect Effects 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000003638 chemical reducing agent Substances 0.000 claims description 6
- 230000007306 turnover Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000002457 bidirectional effect Effects 0.000 abstract description 6
- 230000009471 action Effects 0.000 abstract description 3
- 238000009517 secondary packaging Methods 0.000 abstract description 3
- 238000005457 optimization Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
The invention discloses an integrated circuit packaging method, which comprises the following steps: the two sides of the circuit board main body to be packaged are placed on a suspension input mechanism, the suspension input mechanism conveys the circuit board main body to be packaged to the bottom of the glue injection module, the glue injection module uniformly coats melted resin on the connection parts of all pins of the circuit, and a baking module in the workbench heats and bakes the resin. The circuit board main body can be overturned for half cycle by the aid of the overturning mechanism, two sides of the circuit board main body can be packaged without manual operation, the right clamping device can loosen the circuit board main body subjected to secondary packaging under the action of the pushing device, the left clamping device clamps and fixes the circuit board main body to be packaged, and meanwhile the clamping device can support the circuit board main body and prevent the circuit board from upwards arching and tilting, so that the bidirectional circuit board packaging operation is more convenient.
Description
Technical Field
The invention belongs to the technical field of integrated circuit packaging, and particularly relates to an integrated circuit packaging method.
Background
Integrated circuits are circuits that integrate a number of commonly used electronic components, such as resistors, capacitors, transistors, etc., and the wiring between these components together by semiconductor processing.
In patent CN202010909946.5, an integrated circuit packaging device is mentioned, two fixing seats are driven by a bidirectional screw rod to move to center and clamp a circuit board, so that the circuit board is prevented from being arched upwards and tilted, but the device can only operate a circuit board packaged on one side, the bidirectional circuit board needs to be manually turned over for use, and the packaging operation of the bidirectional circuit board is very inconvenient.
Disclosure of Invention
Aiming at the problem that the manual turn-over is needed to be applicable to the double-sided circuit board in the prior art, the invention provides the following technical scheme: an integrated circuit packaging method, the packaging method comprising the steps of:
s1: placing the two-sided circuit board main bodies to be packaged on a suspension input mechanism, conveying the circuit board main bodies to be packaged to the bottom of a glue injection module by the suspension input mechanism, uniformly coating melted resin at the joint of all pins of a circuit by the glue injection module, and heating the resin by a baking module in a workbench;
s2: after the resin is solidified, the turnover mechanism turns the circuit board main body 180 degrees so that the other surface to be packaged leaks out, and the glue injection module performs baking treatment after coating the surface;
s3: the suspended output mechanism conveys the packaged circuit board main body away;
s4: cutting the packaged circuit board main body to form a plurality of independent circuit board units.
As the preference of above-mentioned technical scheme, tilting mechanism includes the axis of rotation, and axis of rotation one end is provided with first power unit, and the axis of rotation both sides all are provided with to press from both sides and get the device, press from both sides and get the device and including movable splint and fixed splint, the inside movable groove of having seted up of axis of rotation, movable inslot activity grafting has the movable rod, and movable rod surface fixedly connected with multiunit connecting plate, connecting plate both ends and two movable splint fixed connection are provided with thrust unit between axis of rotation and the movable rod.
As the preference of above-mentioned technical scheme, thrust unit includes two movable blocks, two movable block one end and movable rod fixed connection, and one of them movable block middle part activity is pegged graft and is had the slide bar, and slide bar both ends and movable groove inner wall fixed connection, another movable block middle part rotate and peg graft and have the lead screw, and the lead screw both ends all rotate and run through the movable groove and extend to the axis of rotation outside, and the equal fixed connection drive piece in lead screw both ends, and the drive piece bottom is provided with rotatory piece, and rotatory piece one end is provided with second power unit.
As the optimization of the technical scheme, the first power mechanism and the second power mechanism are both composed of a motor and worm gear reducers, and the two worm gear reducers are fixedly connected with the workbench.
As the optimization of the technical scheme, the surfaces of the movable clamping plate and the fixed clamping plate are respectively provided with an elastic block, and the middle part of the elastic block is hollow.
As the optimization of the technical scheme, the section of the driving block is rectangular, the top of the rotating block is provided with the inserting groove, and the inserting groove is matched with the driving block.
As the optimization of the technical scheme, the two clamping devices are distributed at equal intervals relative to the center of the rotating shaft in an annular mode, and one side of each of the two fixed clamping plates is fixedly connected with the rotating shaft.
As the optimization of the technical scheme, the end part of the fixed clamping plate is provided with a blocking block, and the blocking block and the fixed clamping plate are integrally formed.
As the preference of above-mentioned technical scheme, the supporting shoe has all been cup jointed on two sections surfaces of axis of rotation, and two supporting shoe bottoms all are connected with workstation fixed, and two supporting shoe are inside to be located the axis of rotation grafting department and are provided with the bearing, and axis of rotation single rotation angle is 180 degrees.
As the optimization of the technical scheme, the moving block is in threaded sleeve joint with the screw rod, and the moving distance of the moving block is 4 times of the thickness of the circuit board.
The beneficial effects of the invention are as follows:
1. the circuit board main body can be overturned for half cycle by the aid of the overturning mechanism, two sides of the circuit board main body can be packaged without manual operation, the right clamping device can loosen the circuit board main body subjected to secondary packaging under the action of the pushing device, the left clamping device clamps and fixes the circuit board main body to be packaged, and meanwhile the clamping device can support the circuit board main body and prevent the circuit board from upwards arching and tilting, so that the bidirectional circuit board packaging operation is more convenient.
2. The pushing device can move down the moving rod to enable the two moving clamping plates to finish corresponding work, meanwhile, the position change of internal parts of the pushing device caused by rotation of the rotating shaft can be met, and the pushing device can continuously push down the moving rod.
Drawings
FIG. 1 shows a schematic overall structure of an embodiment of the present invention;
FIG. 2 shows a left side view of the tilting mechanism in an embodiment of the invention;
FIG. 3 shows an internal structural view of the tilting mechanism in the embodiment of the present invention;
FIG. 4 shows an internal structural view of a movable trough in an embodiment of the invention;
in the figure: 1. a work table; 2. a suspended input mechanism; 3. a suspended output mechanism; 4. a glue injection module; 5. a rotating shaft; 6. a first power mechanism; 7. a second power mechanism; 8. a support block; 9. a bearing; 10. moving the clamping plate; 11. a fixed clamping plate; 12. an elastic block; 13. a movable groove; 14. a moving rod; 15. a connecting plate; 16. a moving block; 17. a slide bar; 18. a screw rod; 19. a driving block; 20. a rotating block; 21. a plug-in groove; 22. a circuit board main body; 23. and a blocking piece.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the embodiments.
The invention provides an integrated circuit packaging method, which comprises the following steps:
s1: placing the two-sided circuit board main bodies 22 to be packaged on a suspension input mechanism 2, conveying the circuit board main bodies 22 to be packaged to the bottom of an injection module 4 by the suspension input mechanism 2, uniformly coating melted resin at the joints of pins of a circuit by the injection module 4, and heating the resin by a baking module in the workbench 1;
s2: after the resin is solidified, the turnover mechanism turns the circuit board main body 22 by 180 degrees so that the other surface to be packaged leaks out, and the glue injection module 4 finishes coating the surface and then carries out baking treatment;
s3: the suspended output mechanism 3 conveys the packaged circuit board main body 22 away;
s4: the packaged circuit board body 22 is cut, and the circuit board body 22 forms a plurality of individual circuit board units.
As shown in fig. 1-4, the turnover mechanism comprises a rotating shaft 5, two sections of surfaces of the rotating shaft 5 are sleeved with supporting blocks 8, bottoms of the two supporting blocks 8 are fixedly connected with a workbench 1, a bearing 9 is arranged at a splicing position of the rotating shaft 5 inside the two supporting blocks 8, a single rotation angle of the rotating shaft 5 is 180 degrees, one end of the rotating shaft 5 is provided with a first power mechanism 6, two sides of the rotating shaft 5 are provided with clamping devices, the clamping devices comprise a movable clamping plate 10 and a fixed clamping plate 11, the two clamping devices are distributed at equal intervals relative to the center of the rotating shaft 5 in an annular mode, one side of each fixed clamping plate 11 is fixedly connected with the rotating shaft 5, a blocking block 23 is arranged at the end of each fixed clamping plate 11, the blocking block 23 is integrally formed with the fixed clamping plate 11, a movable groove 13 is formed inside the rotating shaft 5, a movable rod 14 is movably spliced inside the movable groove 13, a plurality of groups of connecting plates 15 are fixedly connected to the surfaces of the movable rod 14, two ends of the connecting plates 15 are fixedly connected with the two movable clamping plates 10, the surfaces of the movable clamping plates 10 and the fixed clamping plates 11 are provided with elastic blocks 12, the middle parts of the elastic blocks 12 are arranged in a hollow mode, and a pushing device is arranged between the rotating shaft 5 and the movable clamping plates 14.
The suspended input mechanism 2 conveys the placed circuit board main body 22 to the top of the fixed clamping plate 11, the blocking block 23 blocks the circuit board main body 22 to stop the circuit board main body 22 at a working position, then the second power mechanism 7 drives the movable rods 14 to move downwards through the pushing device, the movable rods 14 are driven to move downwards through the connecting plates 15 in the moving process of the movable rods 14, the movable clamping plate 10 and the fixed clamping plate 11 on the left side fixedly clamp the circuit board main body 22, the elastic block 12 prevents the movable clamping plate 10 and the fixed clamping plate 11 from being directly contacted with the circuit board main body 22 to be extruded and damaged, after the circuit board main body 22 is coated and dried, the first power mechanism 6 drives the rotating shaft 5 to rotate so that the circuit board main body 22 rotates clockwise for half a period, the bottom of the circuit board main body 22 is overturned to a secondary working position, the glue injection module 4 finishes the surface coating and carries out baking treatment, then the suspended input mechanism 2 conveys the newly placed circuit board main body 22 to the top of the left side fixed clamping plate 11, the pushing device moves downwards the movable rods 14 which are reversed to the top, the left side movable clamping plate 10 moves downwards to place the circuit board main body 22 on the top of the suspended clamping plate 3, the suspended input mechanism is placed on the top of the left side of the circuit board main body 22, the suspended input mechanism is moved by the movable clamping plate 10 directly contacts with the circuit board main body 22 to the left side, the newly moves the movable clamping plate 10 to the movable clamping plate 22, and the suspended main body 22 is moved to the original body is moved to the fixed by the circuit main body 22, and the original body is moved to the fixed by the circuit board main body is moved to the top, and the suspended main body 22 is moved to the front after the circuit main body is moved to be coated and is moved to the front.
The circuit board main body 22 can be overturned for half a cycle by the aid of the overturning mechanism, the two sides of the circuit board main body 22 can be packaged without manual operation, the right clamping device can loosen the circuit board main body 22 subjected to secondary packaging under the action of the pushing device, the left clamping device clamps and fixes the circuit board main body 22 to be packaged, meanwhile, the clamping device can support the circuit board main body 22 and prevent the circuit board from upwards arching and tilting, and therefore the bidirectional circuit board packaging operation is more convenient.
As shown in fig. 2-3, the pushing device comprises two moving blocks 16, one end of each moving block 16 is fixedly connected with a moving rod 14, a sliding rod 17 is movably inserted in the middle of one moving block 16, two ends of each sliding rod 17 are fixedly connected with the inner wall of a moving groove 13, a screw rod 18 is rotatably inserted in the middle of the other moving block 16, the moving block 16 is in threaded sleeve joint with the screw rod 18, the moving distance of the moving block 16 is 4 times of the thickness of a circuit board, two ends of the screw rod 18 are rotatably penetrated through the moving groove 13 to extend to the outside of the rotating shaft 5, two ends of the screw rod 18 are fixedly connected with a driving block 19, a rotating block 20 is arranged at the bottom of the driving block 19, the section of the driving block 19 is rectangular, an inserting groove 21 is formed in the top of the rotating block 20, the inserting groove 21 is matched with the driving block 19, one end of the rotating block 20 is provided with a second power mechanism 7, the first power mechanism 6 and the second power mechanism 7 are composed of a motor and a worm gear reducer, and the two worm gear reducers are fixedly connected with the workbench 1.
When the moving rod 14 is required to move, the second power mechanism 7 drives the rotating block 20 to rotate, the driving block 19 and the inserting groove 21 are inserted and matched, the rotating block 20 drives the driving block 19 at the bottom to rotate so as to enable the screw rod 18 to rotate, the moving block 16 drives the moving rod 14 to move downwards along with the moving block 16 in a threaded sleeve joint mode, the sliding rod 17 limits the other moving block 16 so that the moving rod 14 moves more stably, after the rotating shaft 5 drives the screw rod 18 and the two driving blocks 19 to rotate, the positions of the two driving blocks 19 are exchanged, the driving block 19 at the original bottom leaves the inserting groove 21 and rotates to the top, the driving block 19 at the original top rotates and is inserted into the inserting groove 21, and the rotating block 20 can continuously drive the screw rod 18 to rotate so as to move the moving block 16 upwards.
The pushing device can move down the moving rod 14 to enable the two moving clamping plates 10 to complete corresponding work, and meanwhile, the position change of internal parts of the pushing device caused by the rotation of the rotating shaft 5 can be met, so that the pushing device can continuously push down the moving rod 14.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting.
Claims (10)
1. An integrated circuit packaging method, characterized in that the packaging method comprises the following steps:
s1: placing the two-sided circuit board main bodies (22) to be packaged on a suspension input mechanism (2), conveying the circuit board main bodies (22) to be packaged to the bottom of a glue injection module (4) by the suspension input mechanism (2), uniformly coating melted resin at the joint of each pin of a circuit by the glue injection module (4), and heating the resin by a baking module in a workbench (1);
s2: after the resin is solidified, the turnover mechanism turns the circuit board main body (22) 180 degrees so that the other surface to be packaged leaks out, and the glue injection module (4) finishes coating the surface and then carries out baking treatment;
s3: the suspended output mechanism (3) conveys the packaged circuit board main body (22) away;
s4: the packaged circuit board body (22) is cut, and the circuit board body (22) forms a plurality of individual circuit boards.
2. The integrated circuit packaging method according to claim 1, wherein the turnover mechanism comprises a rotating shaft (5), one end of the rotating shaft (5) is provided with a first power mechanism (6), both sides of the rotating shaft (5) are provided with clamping devices, each clamping device comprises a movable clamping plate (10) and a fixed clamping plate (11), a movable groove (13) is formed in the rotating shaft (5), a movable rod (14) is movably inserted into the movable groove (13), a plurality of groups of connecting plates (15) are fixedly connected to the surface of the movable rod (14), both ends of each connecting plate (15) are fixedly connected with the two movable clamping plates (10), and a pushing device is arranged between the rotating shaft (5) and the movable rod (14).
3. The integrated circuit packaging method according to claim 2, wherein the pushing device comprises two moving blocks (16), one end of each moving block (16) is fixedly connected with the moving rod (14), a sliding rod (17) is movably inserted in the middle of one moving block (16), two ends of the sliding rod (17) are fixedly connected with the inner wall of the movable groove (13), a screw rod (18) is rotatably inserted in the middle of the other moving block (16), two ends of the screw rod (18) penetrate through the movable groove (13) in a rotating mode and extend to the outside of the rotating shaft (5), two ends of the screw rod (18) are fixedly connected with a driving block (19), a rotating block (20) is arranged at the bottom of the driving block (19), and a second power mechanism (7) is arranged at one end of the rotating block (20).
4. A method of packaging an integrated circuit according to claim 3, characterized in that the first power mechanism (6) and the second power mechanism (7) are each composed of a motor and a worm gear reducer, both worm gear reducers being fixedly connected to the table (1).
5. The integrated circuit packaging method according to claim 2, wherein the surfaces of the movable clamping plate (10) and the fixed clamping plate (11) are respectively provided with an elastic block (12), and the middle part of the elastic block (12) is hollow.
6. A method of packaging an integrated circuit according to claim 3, characterized in that the driving block (19) has a rectangular cross section, the top of the rotating block (20) is provided with a socket (21), and the socket (21) is matched with the driving block (19).
7. The integrated circuit packaging method according to claim 2, characterized in that the two clamping devices are annularly and equidistantly arranged relative to the center of the rotating shaft (5), and one side of the two fixing clamping plates (11) is fixedly connected with the rotating shaft (5).
8. The integrated circuit packaging method according to claim 2, characterized in that the end of the fixing clip (11) is provided with a blocking piece (23), the blocking piece (23) being integrally formed with the fixing clip (11).
9. The integrated circuit packaging method according to claim 2, wherein two sections of surfaces of the rotating shaft (5) are sleeved with supporting blocks (8), bottoms of the two supporting blocks (8) are fixedly connected with the workbench (1), bearings (9) are arranged in the two supporting blocks (8) and located at the plugging positions of the rotating shaft (5), and a single rotation angle of the rotating shaft (5) is 180 degrees.
10. A method of packaging an integrated circuit according to claim 3, wherein the moving block (16) is screw-coupled to the screw (18), the moving block (16) being moved a distance of 4 times the thickness of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310678099.XA CN116646264B (en) | 2023-06-08 | 2023-06-08 | Integrated circuit packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310678099.XA CN116646264B (en) | 2023-06-08 | 2023-06-08 | Integrated circuit packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116646264A true CN116646264A (en) | 2023-08-25 |
| CN116646264B CN116646264B (en) | 2024-01-30 |
Family
ID=87643294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310678099.XA Active CN116646264B (en) | 2023-06-08 | 2023-06-08 | Integrated circuit packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116646264B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020024127A1 (en) * | 2000-08-31 | 2002-02-28 | Hitachi, Ltd. | Semiconductor device and manufacture method of that |
| WO2017081883A1 (en) * | 2015-11-09 | 2017-05-18 | Ｔｏｗａ株式会社 | Resin-sealing device and resin-sealing method |
| CN111617943A (en) * | 2020-06-02 | 2020-09-04 | 何金昌 | Working method of circuit board glue printing device capable of automatically overturning |
| CN215872028U (en) * | 2021-08-17 | 2022-02-18 | 滁州碧辰科技有限公司 | PCB printed circuit board production is with cutting mount |
| WO2022048188A1 (en) * | 2020-09-07 | 2022-03-10 | 磐安县嘉辰机械有限公司 | Limiting device for machining injection mold |
| CN218570571U (en) * | 2022-09-09 | 2023-03-03 | 中山市睿科智能电子有限公司 | Clamping device is used in circuit board processing |
-
2023
- 2023-06-08 CN CN202310678099.XA patent/CN116646264B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020024127A1 (en) * | 2000-08-31 | 2002-02-28 | Hitachi, Ltd. | Semiconductor device and manufacture method of that |
| WO2017081883A1 (en) * | 2015-11-09 | 2017-05-18 | Ｔｏｗａ株式会社 | Resin-sealing device and resin-sealing method |
| CN111617943A (en) * | 2020-06-02 | 2020-09-04 | 何金昌 | Working method of circuit board glue printing device capable of automatically overturning |
| WO2022048188A1 (en) * | 2020-09-07 | 2022-03-10 | 磐安县嘉辰机械有限公司 | Limiting device for machining injection mold |
| CN215872028U (en) * | 2021-08-17 | 2022-02-18 | 滁州碧辰科技有限公司 | PCB printed circuit board production is with cutting mount |
| CN218570571U (en) * | 2022-09-09 | 2023-03-03 | 中山市睿科智能电子有限公司 | Clamping device is used in circuit board processing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116646264B (en) | 2024-01-30 |
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