CN116639647A - Method for transferring nano forest structure - Google Patents
Method for transferring nano forest structure Download PDFInfo
- Publication number
- CN116639647A CN116639647A CN202210143474.6A CN202210143474A CN116639647A CN 116639647 A CN116639647 A CN 116639647A CN 202210143474 A CN202210143474 A CN 202210143474A CN 116639647 A CN116639647 A CN 116639647A
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- nano
- forest structure
- substrate
- target substrate
- metal layer
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 135
- 239000002390 adhesive tape Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- 239000007788 liquid Substances 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 239000002061 nanopillar Substances 0.000 claims description 11
- 229920002120 photoresistant polymer Polymers 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims description 2
- 238000001179 sorption measurement Methods 0.000 abstract description 6
- 238000005530 etching Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B3/0061—Methods for manipulating nanostructures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B3/0061—Methods for manipulating nanostructures
- B82B3/0066—Orienting nanostructures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
The invention relates to a method for transferring a nano forest structure, which successfully transfers the nano forest structure from an original substrate to a target substrate by utilizing the principles of controllable adhesiveness and magnetic field adsorption of a releasable adhesive tape, and expands the application scene of the nano forest structure and improves the reliability of the nano forest structure in application due to the variety of the target substrate.
Description
Technical Field
The invention relates to the technical field of functionalized nano materials, in particular to a method for transferring a nano forest structure.
Background
The existing nano forest structure is generally formed by a relatively complex growth process or etching process, so that the requirement on the substrate is relatively high, the nano forest structure can only be prepared on a limited number of substrates at present, the requirement of preparing the nano forest structure on certain substrates (such as metal material substrates) in practical application can not be met, and the application scene of the nano forest structure is greatly limited. In addition, in the process of preparing the nano forest structure, certain damage can be brought to the substrate, and then the risk of reliability reduction is brought to the subsequent application of the nano forest structure.
Therefore, there is a need to develop a method capable of transferring nano-forest structures from an original substrate to a new substrate in order to achieve the purpose of forming nano-forest structures on the new substrate while improving the reliability of the nano-forest structures in application.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a method for transferring a nano forest structure, which successfully transfers the nano forest structure from an original substrate to a target substrate by utilizing the principles of controllable adhesiveness and magnetic field adsorption of a releasable adhesive tape.
In order to achieve the above object, the present invention provides the following technical solutions.
A method of transferring a nano forest structure comprising the steps of:
providing an original substrate, wherein a nano forest structure is arranged on the upper surface of the original substrate, and the nano forest structure is formed by photoresist;
forming a magnetic metal layer on the upper surface of the nano forest structure;
adhering a releasable adhesive tape to the upper surface of the magnetic metal layer, and separating the nano-forest structure from the original substrate, thereby obtaining a nano-forest structure adhered to the releasable adhesive tape;
treating the releasable tape to release the nano-forest structure having the magnetic metal layer on an upper surface thereof;
providing a target substrate; and
a magnetic field is applied to the first surface of the target substrate, thereby adsorbing the nano-forest structure with the magnetic metal layer on the upper surface to the second surface of the target substrate to complete the transfer.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention provides a method for transferring a nano forest structure, which successfully transfers the nano forest structure from an original substrate to a target substrate by utilizing the principles of controllable adhesiveness and magnetic field adsorption of a releasable adhesive tape, and expands the application scene of the nano forest structure and improves the reliability of the nano forest structure in application due to the variety of the target substrate.
2. The adsorption process is carried out in liquid such as water, and the nano forest structure can be obliquely arranged on the target substrate according to a specific angle under the actions of magnetic force, gravity, water resistance and torque by adjusting the included angle alpha between the target substrate and the horizontal plane, so that the application field of the nano forest structure is greatly expanded. In the prior art, the nano forest structure prepared by an etching method or a chemical synthesis growth method is generally vertical to the substrate, and the inclination angle between the nano forest structure and the substrate cannot be adjusted.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
FIGS. 1 to 10 are schematic views of structures obtained at each step in the transfer method according to the embodiment of the present invention.
Description of the reference numerals
100 is an original substrate, 200 is a nano forest structure, 201 is a nano column, 300 is a magnetic metal layer, 400 is a heat release tape, 500 is water, 600 is a target substrate, 700 is a magnetic substrate, and 800 is a flexible tape.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is only exemplary and is not intended to limit the scope of the present disclosure. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the concepts of the present disclosure.
Various structural schematic diagrams according to embodiments of the present disclosure are shown in the drawings. The figures are not drawn to scale, wherein certain details are exaggerated for clarity of presentation and may have been omitted. The shapes of the various regions, layers and relative sizes, positional relationships between them shown in the drawings are merely exemplary, may in practice deviate due to manufacturing tolerances or technical limitations, and one skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present therebetween. In addition, if one layer/element is located "on" another layer/element in one orientation, that layer/element may be located "under" the other layer/element when the orientation is turned.
Because the existing nano forest structure is generally formed by a relatively complex growth process or etching process, the requirement on the substrate is relatively high, and the nano forest structure can only be prepared on a limited number of substrates at present. In order to be able to form nano-forest structures on a larger variety of substrates, the invention proposes a method of transferring nano-forest structures comprising the following steps.
First, a raw substrate is provided, an upper surface of which is provided with nano-forest structures formed of photoresist.
The starting substrate of the present invention may be a silicon-based starting substrate, such as monocrystalline silicon, polycrystalline silicon, or amorphous silicon; glass; quartz or sapphire. The present invention is not particularly limited to the original substrate, and conventional original substrates suitable for the micro-process can be used.
Preferably, the nano forest structure comprises a plurality of nano pillars. The height of the nanopillars may be 1-5 μm, preferably 1.5-3.5 μm; the diameter may be 50-300nm, preferably 100-200nm; the spacing may be 50-300nm, preferably 100-200nm.
The method for preparing the original substrate with the nano forest structure on the upper surface comprises the following steps: providing a primary substrate; forming a photoresist layer on the upper surface of the original substrate; and etching the photoresist layer to obtain the nano forest structure. The etching is preferably plasma etching. Preferably, the photoresist layer has a thickness of 4-6 μm.
Then, a magnetic metal layer is formed on the upper surface of the nano forest structure.
Preferably, the magnetic metal layer is formed by sputtering. Preferably, the magnetic metal layer is a magnetic material, such as nickel, iron, cobalt, manganese, or the like. The material of the magnetic metal layer is not particularly limited, and any metal with magnetism can be used in the invention.
Preferably, the thickness of the magnetic metal layer may be 20nm to 50nm, and it is difficult to provide sufficient magnetic attraction force with an excessively thin metal layer, and it is easy to form a continuous film on top of the nano forest.
And then, adhering a releasable adhesive tape to the upper surface of the magnetic metal layer, and separating the nano forest structure from the original substrate, thereby obtaining the nano forest structure adhered to the releasable adhesive tape.
The releasable adhesive tape of the present invention may lose adhesion under certain conditions or may be degraded under certain conditions. Preferably, the releasable adhesive tape is a heat release adhesive tape. The heat release tape is made of a temperature sensitive material, and may lose adhesiveness at a certain temperature. The nano forest structure presents a densely fallen state on the releasable adhesive tape.
Next, the releasable tape is treated to release the nano forest structure having the magnetic metal layer on an upper surface.
In some embodiments, the releasable adhesive tape is a heat release adhesive tape that is treated by heating. The heating temperature is determined by the characteristic temperature of the heat release tape. Preferably, the heating is performed in a liquid. Preferably, the liquid is water. The nano-forest structure may be dispersed in a liquid such as water after being detached from the original substrate. In some embodiments, the nano-forest structure adhered to the heat release tape may be placed in a liquid and the liquid heated, causing the heat release tape to be heated and lose adhesion, thereby releasing the nano-forest structure having the magnetic metal layer on the upper surface.
In other embodiments, the nano-forest structure adhered to the heat release tape may be placed in a heated liquid to cause the heat release tape to be heated and lose adhesion, thereby releasing the nano-forest structure having the magnetic metal layer on the upper surface.
Then, a target substrate is provided.
The target substrate of the present invention may be any substrate, for example, a silicon substrate, an organic polymer substrate, or a metal material substrate. In the present invention, the first surface and the second surface of the target substrate refer to two opposite surfaces of the target substrate having the largest area, i.e., surfaces generally processed in the art, and the first surface of the target substrate refers to a surface directly contacting the magnetic field, and the second surface of the target substrate refers to a surface opposite to the first surface. In some embodiments, the first surface of the target substrate is referred to as its upper surface and the second surface of the target substrate is referred to as its lower surface.
Preferably, the second surface of the target substrate is provided with a flexible tape. The thickness of the flexible adhesive tape is in the micron level. The upper and lower surfaces of the flexible tape are both adhesive. When the second surface of the target substrate is provided with a flexible tape, the method further comprises: after the transfer is completed, the magnetic field is withdrawn. This embodiment is suitable for application scenarios requiring further process preparation at the first surface of the target substrate. Since the nano-forest structure is adhered to the target substrate by the flexible tape, the nano-forest structure is still fixed to the target substrate even if the magnetic field is withdrawn.
In the case that the second surface of the target substrate is not provided with the flexible adhesive tape, the magnetic field always acts on the first surface of the target substrate after the transfer is completed, so that the nano forest structure is continuously adsorbed on the second surface of the target substrate. This embodiment is suitable for application scenarios where no further process preparation is required on the first surface of the target substrate.
In some embodiments, the releasable adhesive tape is a heat release adhesive tape; treating the heat release tape by heating; the released nano forest structure having the magnetic metal layer on the upper surface is placed in a liquid, and the target substrate is placed in the liquid in such a manner that the second surface thereof is parallel to the horizontal plane, thereby providing the target substrate. Preferably, the target substrate is placed on top of the liquid.
In other embodiments, the second surface of the target substrate is provided with a flexible tape, the releasable tape being a heat release tape; treating the heat release tape by heating; the released nano forest structure having the magnetic metal layer on the upper surface is put into a liquid, and the target substrate is put into the liquid with its second surface inclined at an angle alpha to the horizontal plane, thereby providing the target substrate. Preferably, the target substrate is placed on top of the liquid. Preferably, the angle α may be in the range of 0 ° -45 °.
Finally, a magnetic field is applied to the first surface of the target substrate, so that the nano forest structure with the magnetic metal layer on the upper surface is adsorbed to the second surface of the target substrate, and transfer is completed.
In some embodiments, the second surface of the target substrate is provided with a flexible tape, and the nano-forest structure having the magnetic metal layer on the upper surface is adsorbed onto the flexible tape after the magnetic field is applied, thereby completing the transfer.
Preferably, the adsorption is performed in a liquid. The liquid may be water. Preferably, the magnetic field may be applied by providing a magnetic substrate on the first surface of the target substrate. Preferably, the magnetic substrate is a magnet. When the nano-forest structure is adsorbed in water using the magnetic substrate, only the magnetic metal layer on top of the nano-forest structure is adsorbed by the magnetic field due to the resistance and torque of water, and thus the nano-forest structure may tend to be adsorbed on the second surface of the target substrate vertically upward.
Preferably, the upper surface area of the original substrate, the second surface area of the target substrate, and the lower surface area of the magnetic substrate are all the same.
In theory, in the case where the heat release tape is heated in a liquid and the target substrate is placed in the liquid with its second surface parallel to the horizontal plane, after the nano forest structure is transferred to the target substrate, the arrangement pitch of the nano pillars on the target substrate is close to or identical to the arrangement pitch on the original substrate, because macroscopically, since the upper surface area of the original substrate, the second surface area of the target substrate, and the lower surface area of the magnetic substrate are all the same, the total number of nano pillars in the nano forest structure is also the same, and the magnetic field is uniformly distributed on the first surface of the target substrate, and thus, under the effect of these factors, the nano pillars can be uniformly distributed on the second surface of the target substrate, so that the pitch of the nano pillars is the same before and after transfer.
In theory, in the case where the adsorption process is performed in a liquid and the target substrate is obliquely put into the liquid in such a manner that the second surface thereof is at an angle α to the horizontal plane, the nano-forest structure can be obliquely arranged on the target substrate at a specific angle θ after the nano-forest structure is transferred to the target substrate due to the combined action of magnetic force, gravity, and resistance of water and torque, and the nano-pillars therein are uniformly distributed on the second surface of the target substrate. In the present invention, the sum of the angle θ and the angle α is 90 °. The method effectively solves the problem that the nano forest structure cannot form a certain inclination angle, and greatly expands the application field of the nano forest structure.
The invention will be further described with reference to specific examples and figures.
Example 1
First, a raw substrate 100, which is a single crystal silicon raw substrate, is provided. Then, a photoresist layer is formed on the upper surface of the original substrate 100. Then, the photoresist layer is plasma etched, thereby obtaining a nano forest structure 200, wherein the height of the nano pillars 201 is 3 μm, the diameter of each nano pillar 201 is 100nm, and the spacing between the nano pillars 201 is 100nm. The resulting structure is shown in fig. 1.
Then, a magnetic metal layer 300 having a thickness of 30nm is formed on the upper surface of the nano forest structure 200 by sputtering, wherein the magnetic metal layer 300 is nickel. The resulting structure is shown in figure 2.
Thereafter, a heat release tape 400 (available from Shanghai meganano technology Co., ltd.) was adhered to the upper surface of the magnetic metal layer 300, and a tensile force was applied to separate the nano-forest structure 200 from the original substrate 100, thereby obtaining a nano-forest structure adhered to the releasable tape, the resulting structure being shown in FIG. 3.
Next, the nano forest structure 200 adhered to the heat release tape 400 is heated to 90-100 ℃, the heat release tape 400 is heated and loses adhesion, and the released nano forest structure 200 having the magnetic metal layer 300 on the upper surface is dropped into water 500, and the resulting structure is shown in fig. 4.
Then, the target substrate 600 (silicon substrate) is placed on top of the water 500 in such a manner that its lower surface is parallel to the horizontal plane, wherein the lower surface area of the target substrate 600 is the same as the upper surface area of the original substrate 100.
Thereafter, a magnetic substrate 700 is disposed on the upper surface of the target substrate 600 to apply a magnetic field, thereby adsorbing the nano-forest structure 200 having the magnetic metal layer 300 on the upper surface to the lower surface of the target substrate 600 to complete transfer, wherein the lower surface area of the magnetic substrate 700 is the same as the lower surface area of the target substrate 600. The resulting structure is shown in FIG. 5.
Finally, the magnetic substrate 700 is kept always disposed on the target substrate 600, and the target substrate 600 having the nano forest structure 200 adsorbed thereon is taken out of the water 500 together with the magnetic substrate 700, and the resulting structure is shown in fig. 6.
Example 2
Example 2 was performed according to the method described in example 1, except that the flexible adhesive tape 800 was provided on the lower surface of the target substrate 600 before the target substrate 600 was put into the water 500; after a magnetic field is applied through the magnetic substrate 700, the nano forest structure 200 having the magnetic metal layer 300 on the upper surface is adsorbed to the flexible adhesive tape 800, and the resulting structure is shown in fig. 7; after the transfer is completed, the target substrate 600 having the nano forest structure 200 adsorbed thereon is taken out of the water 500, and the magnetic substrate 700 is removed, and the resulting structure is shown in fig. 8.
Example 3
Example 3 was performed according to the method described in example 2, except that the target substrate 600 having the flexible tape 800 disposed on the lower surface thereof was put obliquely into the top of the water 500 in such a manner that the lower surface thereof was at an angle of 45 ° to the horizontal plane. After the transfer in water is completed, the resulting structure is shown in FIG. 9. The target substrate 600 having the nano-forest structure 200 adsorbed thereon is removed from the water 500, and the resulting structure is shown in fig. 10.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A method of transferring a nano forest structure, comprising the steps of:
providing an original substrate, wherein a nano forest structure is arranged on the upper surface of the original substrate, and the nano forest structure is formed by photoresist;
forming a magnetic metal layer on the upper surface of the nano forest structure;
adhering a releasable adhesive tape to the upper surface of the magnetic metal layer, and separating the nano-forest structure from the original substrate, thereby obtaining a nano-forest structure adhered to the releasable adhesive tape;
treating the releasable tape to release the nano-forest structure having the magnetic metal layer on an upper surface thereof;
providing a target substrate; and
a magnetic field is applied to the first surface of the target substrate, thereby adsorbing the nano-forest structure with the magnetic metal layer on the upper surface to the second surface of the target substrate to complete the transfer.
2. The method of claim 1, wherein the second surface of the target substrate is provided with a flexible tape; after the magnetic field is applied, the nano forest structure with the magnetic metal layer on the upper surface is adsorbed onto the flexible adhesive tape.
3. The method as recited in claim 2, further comprising: after the transfer is completed, the magnetic field is withdrawn.
4. A method according to claim 1 or 2, characterized in that,
the releasable adhesive tape is a heat release adhesive tape;
treating the heat release tape by heating;
the released nano forest structure having the magnetic metal layer on the upper surface is placed in a liquid, and the target substrate is placed in the liquid in such a manner that the second surface thereof is parallel to the horizontal plane, thereby providing the target substrate.
5. The method of claim 2, wherein the step of determining the position of the substrate comprises,
the releasable adhesive tape is a heat release adhesive tape;
treating the heat release tape by heating;
the released nano forest structure having the magnetic metal layer on the upper surface is put into a liquid, and the target substrate is put into the liquid with its second surface inclined at an angle alpha to the horizontal plane, thereby providing the target substrate.
6. A method according to claim 1 or 2, characterized in that the magnetic field is applied by providing a magnetic substrate on the first surface of the target substrate.
7. The method of claim 6, wherein the top surface area of the original substrate, the second surface area of the target substrate, and the bottom surface area of the magnetic substrate are all the same.
8. The method of claim 4 or 5, wherein the liquid is water.
9. The method according to claim 1 or 2, wherein the magnetic metal layer is formed by sputtering; the magnetic metal layer is made of magnetic materials.
10. The method of claim 1 or 2, wherein the nano forest structure comprises a plurality of nano pillars having a height of 1-5 μm, a diameter of 50-300nm, and a pitch of 50-300nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210143474.6A CN116639647A (en) | 2022-02-16 | 2022-02-16 | Method for transferring nano forest structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210143474.6A CN116639647A (en) | 2022-02-16 | 2022-02-16 | Method for transferring nano forest structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116639647A true CN116639647A (en) | 2023-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210143474.6A Pending CN116639647A (en) | 2022-02-16 | 2022-02-16 | Method for transferring nano forest structure |
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| Country | Link |
|---|---|
| CN (1) | CN116639647A (en) |
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- 2022-02-16 CN CN202210143474.6A patent/CN116639647A/en active Pending
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