CN116632586A - Interface module and electronic equipment - Google Patents
Interface module and electronic equipment Download PDFInfo
- Publication number
- CN116632586A CN116632586A CN202310508253.9A CN202310508253A CN116632586A CN 116632586 A CN116632586 A CN 116632586A CN 202310508253 A CN202310508253 A CN 202310508253A CN 116632586 A CN116632586 A CN 116632586A
- Authority
- CN
- China
- Prior art keywords
- interface
- interface module
- pcb
- waterproof structure
- dust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000428 dust Substances 0.000 claims description 31
- 239000004973 liquid crystal related substance Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 5
- 230000009977 dual effect Effects 0.000 abstract description 2
- BWWVXHRLMPBDCK-UHFFFAOYSA-N 1,2,4-trichloro-5-(2,6-dichlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC(Cl)=C1C1=C(Cl)C=CC=C1Cl BWWVXHRLMPBDCK-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000010365 information processing Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/521—Sealing between contact members and housing, e.g. sealing insert
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses an interface module and electronic equipment. The interface module comprises: the interface bracket, the interface device, the Printed Circuit Board (PCB), the first waterproof structure and the second waterproof structure; the interface device is inserted on the PCB and used for communicating with a host of the electronic equipment through the PCB; the PCB is fixed on the interface bracket through a first fastener; the first waterproof structure is arranged at one end of the interface bracket, which is close to the interface device, and the second waterproof structure is filled between the interface bracket and the PCB and corresponds to the area of the interface device; the first waterproof structure and the second waterproof structure are used for preventing water from entering the interface device. The interface module provided by the invention has the advantages of simple structure, low cost, high applicability and high cost performance; meanwhile, the dual waterproof design is adopted, so that the waterproof performance of the interface module is improved, and the reliability of data transmission is ensured.
Description
Technical Field
The present invention relates to the field of electronic manufacturing technologies, and in particular, to an interface module and an electronic device.
Background
The universal serial bus (Universal Serial Bus, USB) is a serial bus standard, and is also a technical specification of an input/output interface, and is widely applied to information communication products such as personal computers and mobile devices, and is extended to other related fields such as photographic equipment, digital televisions, global navigation satellite systems (Global Navigation Satellite System, GNSS), and the like.
The USB interface is generally divided into a type A (type-A), a type B (type-B) and a type C (type-C), wherein the type-C interface integrates functions of charging, displaying, data transmission and the like, supports insertion in positive and negative 2 directions, and becomes a current main stream interface.
Existing type-C interfaces fall into two categories: one is carried by a printed circuit board (Printed Circuit Board, PCB) and adopts an independent type-C device patch or is spliced on the PCB for data communication; the other TYPE is an integrated TYPE-C device, which is provided with a fixing structure and a positioning screw hole, and is fixed on a carrier in an assembling mode, so that the TYPE-C device is adopted by most of electronic equipment at present. However, the integrated TYPE-C devices are often monopolized by fixed manufacturers, and are expensive, and the TYPE-C devices independently developed by other manufacturers cannot meet engineering expectations, so that phenomena such as water leakage and poor contact exist.
Disclosure of Invention
The invention provides an interface module and electronic equipment, which have simple structure, low cost and higher applicability and cost performance; meanwhile, the dual waterproof design is adopted, so that the waterproof performance of the interface module is improved, and the reliability of data transmission is ensured.
According to an aspect of the present invention, there is provided an interface module, including: the interface bracket, the interface device, the Printed Circuit Board (PCB), the first waterproof structure and the second waterproof structure; wherein, the liquid crystal display device comprises a liquid crystal display device,
the interface device is inserted on the PCB and used for communicating with a host of the electronic equipment through the PCB;
the PCB is fixed on the interface bracket through a first fastener;
the first waterproof structure is arranged at one end of the interface bracket, which is close to the interface device, and the second waterproof structure is filled between the interface bracket and the PCB and corresponds to the area of the interface device; the first waterproof structure and the second waterproof structure are used for preventing water from entering the interface device.
Optionally, the interface bracket is provided with a first threaded hole, and the first fastener is a first fixing screw;
the first fixing screw is matched with the first threaded hole to lock the PCB.
Optionally, the first set screw is coated with an adhesive material.
Optionally, the first waterproof structure is a silica gel pad; the second waterproof structure is waterproof glue.
Optionally, the method further comprises: a dust-proof structure;
the dustproof structure is used for preventing dust from entering the interface module.
Optionally, the dustproof structure includes: the dust plug and the dust plug fixing piece are provided with a protruding structure, and the dust plug is provided with a buckling groove; wherein, the liquid crystal display device comprises a liquid crystal display device,
when the interface module is installed to the shell of electronic equipment, the dust plug stationary blade is held in the mounting groove of shell, and protruding structure passes the buckle trench to make dust plug and dust plug stationary blade carry out screens cooperation, dust plug and shell interference fit.
Optionally, the interface module is mounted to the housing by a second fastener; wherein, the liquid crystal display device comprises a liquid crystal display device,
the interface bracket is provided with a second threaded hole, and the second fastener is a second fixing screw;
the second fixing screw is matched with the second threaded hole to lock the interface module.
Optionally, the dust-proof structure further includes: a shielding film;
the shielding film is attached to one side of the dust plug fixing piece, which is close to the shell.
Optionally, the interface module is a C-type universal serial bus USB type-C interface module.
According to another aspect of the present invention, there is provided an electronic device including a housing, a main body, and an interface module according to any of the above embodiments.
According to the technical scheme, the interface module is redesigned, so that the interface module comprises an interface bracket, an interface device, a Printed Circuit Board (PCB), a first waterproof structure and a second waterproof structure; the interface device is inserted on the PCB and used for communicating with a host of the electronic equipment through the PCB; the PCB is fixed on the interface bracket through a first fastener; the first waterproof structure is arranged at one end of the interface bracket, which is close to the interface device, and the second waterproof structure is filled between the interface bracket and the PCB and corresponds to the area of the interface device; the first waterproof structure and the second waterproof structure are used for preventing water from entering the interface device. The interface module has the advantages of simple structure, low cost, high applicability and high cost performance; meanwhile, the design of the first waterproof structure and the second waterproof structure can improve the waterproof performance of the interface module, and the reliability of data transmission is guaranteed.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the invention or to delineate the scope of the invention. Other features of the present invention will become apparent from the description that follows.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of an interface module according to a first embodiment of the present invention;
fig. 2 is a schematic diagram of an internal structure of an interface module according to a first embodiment of the present invention;
FIG. 3 is a plan view of an interface module according to a first embodiment of the present invention in different orientations;
fig. 4 is a schematic structural diagram of an interface module according to an embodiment of the present invention when the interface module is mounted to a housing of an electronic device;
fig. 5 is a schematic perspective view of a dust plug according to a first embodiment of the present invention;
fig. 6 is a flowchart of an interface module according to an embodiment of the invention.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Example 1
Fig. 1 is a schematic perspective view of an interface module according to an embodiment of the present invention, where fig. 1 (a) is a schematic perspective view of a front surface of the interface module, and fig. 1 (b) is a schematic perspective view of a back surface of the interface module; fig. 2 is a schematic diagram of an internal structure of an interface module according to an embodiment of the invention. As shown in fig. 1 and 2, the interface module 10 includes: an interface bracket 101, an interface device (not shown in fig. 1 and 2), a PCB 102, a first waterproof structure 103, and a second waterproof structure 104.
The interface device is plugged on the PCB 102, a connector is arranged on the PCB 102, and communication with a host of the electronic equipment can be performed through the PCB 102. The PCB in the invention can be PCBA (Printed Circuit Board Assembly), namely, the PCB blank is subjected to the whole manufacturing process of SMT (surface mount technology) loading or DIP (digital information processing) plug-in. The interface device may be a waterproof device.
The PCB 102 is fixed to the interface bracket 101 by a first fastener.
The first waterproof structure 103 is arranged at one end of the interface bracket 101 close to the interface device, and the second waterproof structure 104 is filled in the area between the interface bracket 101 and the PCB 102 and corresponding to the interface device; the first waterproof structure 103 and the second waterproof structure 104 are each for preventing water from entering the interface device.
Fig. 3 is a plan view of an interface module according to an embodiment of the present invention in different orientations, where fig. 3 (a) is a plan view of a front surface of the interface module, fig. 3 (b) is a right side view of the interface module, fig. 3 (c) is a plan view of a back surface of the interface module, and fig. 3 (d) is a left side view of the interface module. As shown in fig. 3, the interface bracket 101 is provided with a first threaded hole A1, the first fastener is a first fixing screw A2, and the first fixing screw A2 and the first threaded hole A1 are matched to lock the PCB 102. Specifically, the number of the first threaded holes A1 is at least two, so as to ensure the locking strength of the first fixing screw A2 and the first threaded holes A1.
In an embodiment, the first fixing screw A2 may be coated with an adhesive material to enhance the locking strength of the first fixing screw A2 and the first threaded hole A1.
Alternatively, the adhesive material may be a falling-resistant adhesive.
In an embodiment, the first waterproof structure 103 is a silica gel pad, and when the interface module 10 is mounted to the housing of the electronic device, the first waterproof structure 103 may be in interference fit with the housing. The second waterproof structure 104 is waterproof glue.
In an embodiment, the interface module further comprises: a dust-proof structure 105. The dustproof structure 105 is used for preventing dust from entering the interface module 10.
Fig. 4 is a schematic structural diagram of an interface module according to an embodiment of the invention when the interface module is mounted to a housing of an electronic device. As shown in fig. 4, the dust-proof structure 105 includes: a dust plug 105a and a dust plug fixing piece 105b. Optionally, the dust-proof structure 105 further includes: and a shielding film 105c, wherein the shielding film 105c is attached to a side of the dust plug fixing piece 105b close to the housing 20.
Fig. 5 is a schematic perspective view of a dust plug according to a first embodiment of the present invention; fig. 6 is a flowchart of an interface module according to an embodiment of the invention. Referring to fig. 5 and 6, the dust plug fixing piece 105b has a protruding structure D, and the dust plug 105a is provided with a fastening slot C.
When the interface module 10 is mounted to the housing 20 of the electronic device, the interface module 10 is first aligned with the housing 20, the dust plug fixing piece 105b is accommodated in the mounting groove of the housing 20, and the protrusion structure D passes through the fastening groove C, and then the interface module 10 is mounted to the housing 20 by the second fastener.
Specifically, a second threaded hole B1 is formed in the interface bracket 101, and the second fastener is a second fixing screw B2; the second fixing screw B2 is matched with the second threaded hole B1 to lock the interface module 10. Specifically, the number of the second threaded holes B1 is at least two, so as to ensure the locking strength of the second fixing screws B2 and the second threaded holes B1.
In an embodiment, the second fixing screw B2 may also be coated with an adhesive material to enhance the locking strength of the second fixing screw B2 and the second threaded hole B1.
Alternatively, the adhesive material may be a falling-resistant adhesive.
After the interface module 10 is mounted to the housing 20 by the second fastener, the shielding film 105c may be attached to the side of the dust plug fixing piece 105b near the housing 20, and finally the dust plug 105a is fastened. The shielding film 105c is in a matching relationship with the housing 20, and the dust plug 105a and the dust plug fixing piece 105b are in clamping fit, so that the dust plug 105a is ensured not to be separated, and the dust plug 105a and the housing 20 are in interference fit, so that dust is prevented from entering the interface module 10.
In one embodiment, the interface module 10 is a USB type-C interface module.
The embodiment of the invention provides an interface module, which comprises: the interface bracket, the interface device, the Printed Circuit Board (PCB), the first waterproof structure and the second waterproof structure; the interface device is inserted on the PCB and used for communicating with a host of the electronic equipment through the PCB; the PCB is fixed on the interface bracket through a first fastener; the first waterproof structure is arranged at one end of the interface bracket, which is close to the interface device, and the second waterproof structure is filled between the interface bracket and the PCB and corresponds to the area of the interface device; the first waterproof structure and the second waterproof structure are used for preventing water from entering the interface device. The interface module comprises an interface bracket, an interface device, a Printed Circuit Board (PCB), a first waterproof structure and a second waterproof structure; the interface device is inserted on the PCB and used for communicating with a host of the electronic equipment through the PCB; the PCB is fixed on the interface bracket through a first fastener; the first waterproof structure is arranged at one end of the interface bracket, which is close to the interface device, and the second waterproof structure is filled between the interface bracket and the PCB and corresponds to the area of the interface device; the first waterproof structure and the second waterproof structure are used for preventing water from entering the interface device. The interface module has the advantages of simple structure, low cost, high applicability and high cost performance; meanwhile, the design of the first waterproof structure and the second waterproof structure can improve the waterproof performance of the interface module, and the reliability of data transmission is guaranteed.
Example two
The embodiment of the invention also provides electronic equipment. The electronic device comprises a shell, a main body and the interface module in the embodiment.
The electronic device provided by the embodiment of the invention can be any device with an interface module, such as GNSS device, positioning device and the like.
The above embodiments do not limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of the present invention.
Claims (10)
1. An interface module, comprising: the interface bracket, the interface device, the Printed Circuit Board (PCB), the first waterproof structure and the second waterproof structure; wherein, the liquid crystal display device comprises a liquid crystal display device,
the interface device is inserted on the PCB and used for communicating with a host of the electronic equipment through the PCB;
the PCB is fixed on the interface bracket through a first fastener;
the first waterproof structure is arranged at one end of the interface bracket, which is close to the interface device, and the second waterproof structure is filled in a region between the interface bracket and the PCB and corresponding to the interface device; the first waterproof structure and the second waterproof structure are used for preventing water from entering the interface device.
2. The interface module of claim 1, wherein the interface bracket is provided with a first threaded hole, and the first fastener is a first set screw;
the first fixing screw is matched with the first threaded hole to lock the PCB.
3. The interface module of claim 2, wherein the first set screw is coated with an adhesive material.
4. The interface module of claim 1, wherein the first waterproof structure is a silicone pad; the second waterproof structure is waterproof glue.
5. The interface module of claim 1, further comprising: a dust-proof structure;
the dustproof structure is used for preventing dust from entering the interface module.
6. The interface module of claim 5, wherein the dust-proof structure comprises: the dustproof plug comprises a dustproof plug and a dustproof plug fixing piece, wherein the dustproof plug fixing piece is provided with a protruding structure, and a clamping groove is formed in the dustproof plug; wherein, the liquid crystal display device comprises a liquid crystal display device,
when the interface module is mounted to the shell of the electronic device, the dust plug fixing piece is accommodated in the mounting groove of the shell, and the protruding structure penetrates through the buckling groove, so that the dust plug and the dust plug fixing piece are in clamping fit, and the dust plug and the shell are in interference fit.
7. The interface module of claim 6, wherein the interface module is mounted to the housing by a second fastener; wherein, the liquid crystal display device comprises a liquid crystal display device,
the interface bracket is provided with a second threaded hole, and the second fastener is a second fixing screw;
the second fixing screw is matched with the second threaded hole to lock the interface module.
8. The interface module of claim 6, wherein the dust-proof structure further comprises: a shielding film;
the shielding film is attached to one side of the dust plug fixing piece, which is close to the shell.
9. The interface module according to any one of claims 1-8, wherein the interface module is a C-type universal serial bus USB type-C interface module.
10. An electronic device comprising a housing, a body, and an interface module according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310508253.9A CN116632586A (en) | 2023-05-08 | 2023-05-08 | Interface module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310508253.9A CN116632586A (en) | 2023-05-08 | 2023-05-08 | Interface module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116632586A true CN116632586A (en) | 2023-08-22 |
Family
ID=87616290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310508253.9A Pending CN116632586A (en) | 2023-05-08 | 2023-05-08 | Interface module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116632586A (en) |
-
2023
- 2023-05-08 CN CN202310508253.9A patent/CN116632586A/en active Pending
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