CN116622189A - Inductor packaging material formula - Google Patents
Inductor packaging material formula Download PDFInfo
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- CN116622189A CN116622189A CN202310354823.3A CN202310354823A CN116622189A CN 116622189 A CN116622189 A CN 116622189A CN 202310354823 A CN202310354823 A CN 202310354823A CN 116622189 A CN116622189 A CN 116622189A
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- epoxy resin
- inductor
- temperature
- encapsulating material
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- 239000005022 packaging material Substances 0.000 title description 2
- 239000003822 epoxy resin Substances 0.000 claims abstract description 45
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 32
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 30
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000000843 powder Substances 0.000 claims abstract description 19
- 239000010453 quartz Substances 0.000 claims abstract description 18
- 239000006229 carbon black Substances 0.000 claims abstract description 16
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 15
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 239000002994 raw material Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 14
- 238000009472 formulation Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 3
- 239000008096 xylene Substances 0.000 claims description 3
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000012360 testing method Methods 0.000 abstract description 26
- 150000003839 salts Chemical class 0.000 abstract description 8
- 238000003860 storage Methods 0.000 abstract description 8
- 238000009413 insulation Methods 0.000 abstract description 5
- 239000003990 capacitor Substances 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 description 16
- 230000035882 stress Effects 0.000 description 7
- 238000009863 impact test Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000012905 visible particle Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/26—Silicon- containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
Abstract
The invention relates to an epoxy resin composition with a wide use temperature range and application thereof, in particular to an inductor encapsulating material formula. The invention comprises the following raw materials in parts by weight: 8 to 12 parts of E-51 epoxy resin, 15 to 17 parts of quartz powder, 1.5 to 2.1 parts of titanium dioxide, 0.3 to 0.5 part of white carbon black, 1.8 to 2.2 parts of dimethylbenzene, 2.2 to 2.6 parts of 590 epoxy resin curing agent and 0.08 to 0.12 part of triethanolamine. The invention has the advantages that the inductor encapsulating material prepared by the formula has small stress and small shrinkage ratio when being cured, and improves the tensile strength and flexibility of the epoxy resin; the used temperature has wide impact range, can bear harsh environment and mechanical tests such as moisture resistance, vibration, impact, mold, salt fog, low-temperature storage test, high-temperature storage test and the like, and has very beneficial comprehensive performance. It is well suited for the outer insulation envelope of inductors, capacitors and resistors in military systems.
Description
Technical Field
The invention relates to an epoxy resin composition with a wide use temperature range and application thereof, in particular to an inductor encapsulating material formula.
Background
The epoxy resin is used as the base material for proportioning and curing of a plurality of organic matters in the market, and is widely applied to encapsulation of electronic devices, and the formulas of the two-component epoxy resin encapsulating material and the powder encapsulating material are also available. The epoxy resin forms a three-dimensional network structure network three-dimensional polymer in the curing process, the molecular chains lack sliding, the C-C bond and the C-O bond can be smaller, the surface energy is higher, the curing internal stress of the resin is larger, the brittleness is large, cracks are easy to generate, the epoxy resin is mainly applied to an industrial environment of minus 40 ℃ to plus 70 ℃, the epoxy resin is the most basic temperature range of minus 55 ℃ to plus 85 ℃ for the existing military products, the epoxy resin gradually extends to the use range of minus 60 ℃ along with the improvement of the system reliability index, the high temperature extends to +130 ℃ or even higher, the storage of devices or materials at the limit temperature is not problematic according to the increasingly severe application and use conditions of the military system, the epoxy resin can be required to normally work in the full temperature range, the epoxy resin can not lose efficacy in 2000 hours continuously at the high temperature, the appearance is not abnormal, and the environment tests such as salt fog and mould are not required to bear the vibration impact mechanical stress of the external environment, and the moisture resistance requirements of the market are not met through multiple tests.
Disclosure of Invention
The invention aims to provide an inductor encapsulating material formula which has the advantages of wide use temperature range, good toughness, high tensile strength, small stress after solidification, high reliability, moisture resistance, water resistance, corrosion resistance, mildew resistance, salt fog resistance, vibration impact resistance and temperature impact resistance.
The invention comprises the following raw materials in parts by weight: 8 to 12 parts of E-51 epoxy resin, 15 to 17 parts of quartz powder, 1.5 to 2.1 parts of titanium dioxide, 0.3 to 0.5 part of white carbon black, 1.8 to 2.2 parts of dimethylbenzene, 2.2 to 2.6 parts of 590 epoxy resin curing agent and 0.08 to 0.12 part of triethanolamine.
White carbon black is produced by a gas phase method.
The number of quartz powder is 250-300 mesh.
The purity of titanium dioxide, xylene and triethanolamine is analytically pure.
The invention has the advantages that the encapsulating material can bear the use temperature range of minus 60 ℃ to plus 130 ℃ and has no influence on the performance of the inductor at the limit temperature. Storing at the low temperature of minus 60 ℃ for 96 hours for testing, wherein the appearance is free from abnormality; the product is stored for 96 hours at the high temperature of 130 ℃ for testing, and has no abnormal appearance; impact at the temperature of minus 60 ℃ to plus 130 ℃ for 50 times, and preserving the heat for 30 minutes at the limit temperature, wherein the appearance is free from abnormality; the flame retardant grade is 94-V0 grade; the mildew-proof grade reaches grade 0. After continuous operation for 2000 hours at a high temperature of 130 ℃, the appearance is free from abnormality. The encapsulating material has very good effects on insulation protection of the inductor, vibration impact resistance, salt fog resistance, moisture resistance and mildew resistance, and improves the reliability of products. It is well suited for the outer insulation envelope of inductors, capacitors and resistors in military systems.
Detailed Description
The present invention will now be described in further detail with reference to the following examples, which are given by way of illustration only and are not intended to be limiting.
Description of the raw materials in preferred embodiment 1:
the epoxy resin adopts the epoxy resin with the model of E-51 manufactured by Nantong star synthetic material Co., ltd, and the epoxy equivalent is 184-195 g/mol.
The quartz powder is made of RDG-270 quartz powder manufactured by Lianyong Botai silicon micropowder Co.Ltd, and has a mesh number of 270.
Titanium dioxide, which is produced by Tianjin, north fine chemical industry Co., ltd, has a molecular weight of 79.87, and is TiO 2 The content is not less than 99 percent, and the purity is as follows: analytically pure.
White carbon black is made of a material produced by a chemical industry Co.Ltd without tin and gold tripod Long Hua, has a molecular weight of 60.08 and SiO 2 The content is not less than 99.5%, and the product is produced by gas phase method.
Xylene: the red rock reagent factory in the eastern region of Tianjin city is adopted for production, the molecular weight is 106.17, the content is not less than 99 percent, and the purity is: analytically pure.
The epoxy resin curing agent adopts the epoxy resin curing agent with the model 590 of Shanghai resin factory Co., ltd, and has the molecular weight of 253.1.
Triethanolamine: the material produced by Tianjin Kaiki chemical industry Co., ltd is adopted, the molecular weight is 149.19, the content of triethanolamine is not less than 85 percent, and the purity is high: analytically pure.
Example 1
An inductor encapsulating material (parts by weight): 10 parts of E-51 epoxy resin, 16 parts of quartz powder, 1.8 parts of titanium dioxide, 0.4 part of white carbon black, 2 parts of dimethylbenzene, 2.4 parts of 590 epoxy resin curing agent and 0.1 part of triethanolamine. The white carbon black in the formula is produced by a gas phase method, the mesh number of quartz powder is 270 meshes, and the purity of titanium dioxide, dimethylbenzene and triethanolamine is analytically pure.
A method for preparing an inductor encapsulating material: the batching tool is scrubbed by alcohol, and the electronic scale is zeroed before batching. Putting quartz powder and titanium dioxide into a stainless steel plate, putting into an oven, heating to (100+/-3) DEG C, preserving heat for 1h, turning off the power supply, cooling to below 50 ℃ and taking out for later use. The weight portions are as follows: 10 parts of E-51 epoxy resin, 16 parts of quartz powder, 1.8 parts of titanium dioxide, 0.4 part of white carbon black and 2 parts of dimethylbenzene, wherein the weight error of each raw material cannot exceed +/-2%. Sequentially adding E-51 epoxy resin, dimethylbenzene and white carbon black into a batching vessel, stirring by using a ceramic rod to enable the white carbon black to be immersed into other materials, and then sequentially and gradually adding the weighed quartz powder and titanium dioxide into the batching vessel while stirring, wherein the quartz powder and the titanium dioxide are the weight after drying. The batching vessel is fixed on a stirrer, the switch of the stirrer is turned on to stir for 3 hours at 300 revolutions/min until the encapsulated large materials are uniformly stirred and no visible particles exist, the power of the stirrer is turned off, the container is taken down, and the cover is covered for standby. When the adhesive is required to be used, the adhesive is prepared from the following components in parts by weight: 2.4 parts of 590 epoxy resin curing agent and 0.1 part of triethanolamine are added into the prepared bulk material, and the mixture is stirred for 5min at 120 r/min by a ceramic rod and then uniformly stirred.
Before the inductor is encapsulated, the prepared inductor encapsulating material of the embodiment 1 is placed into a vacuum box, the vacuum degree is 10kPa, and the inductor encapsulating material is vacuumized for 20 minutes, so that the inductor can be encapsulated, and the thickness of the encapsulating material is 1mm. After the inductor is encapsulated, the inductor is required to be placed for more than 3 days in a shading way, then baked in an oven according to the baking temperature of 60 ℃ to 85 ℃ to 60 ℃ to 125 ℃ per 2 hours and the heat preservation time, and cooled to the room temperature.
Example 2
Substantially the same as in example 1, the only difference is that: the particle size of the quartz powder was 250 mesh, and the other materials were the same as in example 1.
Example 3
Substantially the same as in example 1, the only difference is that: the particle size of the quartz powder was 300 mesh, and the other materials were the same as in example 1.
Example 4
Substantially the same as in example 1, the only difference is that: the weight part of the white carbon black is 0.3 part, and the other parts are the same as in example 1.
Example 5
Substantially the same as in example 1, the only difference is that: the weight part of the white carbon black is 0.5 part, and the other parts are the same as in example 1.
Test example 1
The inductors prepared in examples 1 to 5 were subjected to a low-temperature storage test, respectively, and were subjected to a low-temperature storage according to 4.5.14.2 clause in GJB5025-2003 general Specification for fixed and variable inductors, and stored at-60℃for 96 hours; the high-temperature life test is carried out according to 108 methods in GJB360B-2009 "test method for electronic and electric elements", the test temperature is +130 ℃, and the test time is 2000h; high and low temperature impact test is carried out according to 107 methods in GJB360B-2009, the cycle is carried out for 50 times at minus 60 ℃ to plus 130 ℃, and the test time is 30min at the limit temperature. The specific results are shown in Table 1.
TABLE 1 Low temperature storage, high temperature Life, temperature impact test results Table
Comparing example 1 with examples 2 to 5, the results of the low temperature storage, high temperature life and temperature impact test of example 1 are significantly better than those of examples 2 to 5 in terms of the influence on the inductance variation ratio of the inductor from the results of the appearance of the inductor after the test.
Test example 2
The test methods for the inductors prepared in examples 1 to 5 were as follows: high-frequency vibration is carried out according to method 204 in GJB360B-2009, and test condition D; impact test was performed according to method 213 in GJB360B-2009, test condition J. The specific results are shown in Table 2.
Table 2 vibration and impact test results table
Comparing example 1 with examples 2-5, the vibration and impact test results of example 1 are significantly better than those of examples 2-5, as compared with the appearance results of the inductor after the test.
Test example 3
The test methods for the inductors prepared in examples 1 to 5 were as follows: salt spray tests are carried out according to 101 methods in GJB360B-2009, and test conditions A; moisture resistance tests were performed according to method 106 in GJB 360B-2009. The specific results are shown in Table 3.
TABLE 3 salt fog, moisture resistance test results Table
Comparing example 1 with examples 2 to 5, the salt spray and moisture resistance test results of example 1 are obviously better than those of examples 2 to 5 in terms of the influence of the insulation performance and the inductance variation ratio of the inductor in comparison with the appearance results of the inductor after the test.
Formulation mechanism
The epoxy resin has strong cohesive force and compact molecular structure, and contains active unsaturated groups in the molecular structure, so that the epoxy resin can be subjected to crosslinking reaction with various curing agents to form a high polymer with a three-dimensional grid structure, and after the pure E-51 epoxy resin and 590 epoxy resin curing agents are proportioned, the material is large in brittleness, large in shrinkage stress, not resistant to temperature impact, unsatisfactory in ageing resistance and large in fluidity after being cured, and products are not easy to encapsulate, so that the application range of the epoxy resin material is influenced. The encapsulating material is a mixture of 7 components such as E-51 epoxy resin, quartz powder, titanium dioxide, white carbon black, dimethylbenzene, 590 epoxy resin curing agent, triethanolamine and the like according to a proportion, and under the action of various accelerators, the E-51 epoxy resin, the quartz powder, the titanium dioxide, the white carbon black, the dimethylbenzene, the triethanolamine and the like and the 590 epoxy resin curing agent undergo a crosslinking curing reaction, and the curing is performed to obtain thermosetting plastic, so that the epoxy resin has low curing shrinkage, enhanced intermolecular bonding force, good toughness, wide application temperature range, good adhesion, electrical insulation, aging resistance and outstanding chemical resistance.
Wherein the white carbon black produced by the gas phase method is also called nano-scale silicon dioxide, and has huge surface area of 100-400 m 2 According to the preparation method, the particle diameter is 10-40 nm, the high-temperature resistance, the non-combustion, the electrical insulation property and the stability are good, and when the high-temperature resistance, the electrical insulation and the stability are added into E-51 epoxy resin, the high-temperature resistance, the toughness, the tearing resistance, the breaking elongation and the ductility are greatly improved, the surface of the material is more compact and fine, the friction coefficient is smaller, the high strength of nano particles is added, and the wear resistance of the material is greatly enhanced; the addition of the analytically pure nanoscale titanium dioxide fills the molecular gaps of the epoxy resin, so that the stress concentration of the matrix is changed, the impact energy is absorbed, the extensibility of the epoxy resin is enhanced and toughened, the weather resistance of the epoxy resin is improved, the bearable temperature range of the epoxy resin is improved, and the vibration impact strength is improved; the addition of 270 mesh quartz powder has the advantages of moderate reaction and solidification of the epoxy resin base material, low exothermic peak value, improvement of volume shrinkage of the epoxy resin in the solidification process, reduction or elimination of stress cracking caused by volume shrinkage, high and low temperature resistance, small thermal expansion coefficient, high insulation and corrosion resistance due to the addition of the intrinsic molecular chain structure, crystal shape and lattice change rule; analytically pure triethanolamine as epoxyThe thickener and the neutralizer of the resin ensure that the encapsulating material does not fall down after the product is encapsulated after being added, and the appearance of the encapsulating material does not form cone shape or accumulation; the addition of the analytically pure dimethylbenzene improves the mechanical property of the epoxy resin base material, so that the epoxy resin has strong cohesive force, compact molecular structure and improved wrapping and bonding properties.
The invention is verified by multiple times of internal filling raw material trial production and raw material proportion adjustment, multiple times of temperature impact, high-low temperature storage, vibration impact, moisture resistance, salt fog, mould and other tests, and finally the determined raw material and proportion enable the inductor encapsulating material to have low heat dissipation, small shrinkage ratio, small stress, complete molecular chain reaction, excellent tensile strength, good toughness, tear resistance, good elongation at break, good ductility, low temperature resistance and high temperature resistance, and small thermal expansion coefficient when being cured, and is suitable for being used for a long time in the temperature range of minus 60 ℃ to plus 130 ℃, and flame retardant, dampproof, mildew resistant and vibration impact resistant.
Claims (4)
1. An inductor encapsulant formulation, characterized by: the weight portions of the raw materials are as follows: 8 to 12 parts of E-51 epoxy resin, 15 to 17 parts of quartz powder, 1.5 to 2.1 parts of titanium dioxide, 0.3 to 0.5 part of white carbon black, 1.8 to 2.2 parts of dimethylbenzene, 2.2 to 2.6 parts of 590 epoxy resin curing agent and 0.08 to 0.12 part of triethanolamine.
2. The inductor packaging formulation of claim 1, wherein the white carbon black is produced by a gas phase process.
3. An inductor encapsulating material formulation according to claim 1, wherein the quartz powder has a mesh size of 250-300 mesh.
4. An inductor package formulation of claim 1 wherein said titanium dioxide, xylene, triethanolamine are of analytical purity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310354823.3A CN116622189A (en) | 2023-03-22 | 2023-03-22 | Inductor packaging material formula |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310354823.3A CN116622189A (en) | 2023-03-22 | 2023-03-22 | Inductor packaging material formula |
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| Publication Number | Publication Date |
|---|---|
| CN116622189A true CN116622189A (en) | 2023-08-22 |
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| CN202310354823.3A Pending CN116622189A (en) | 2023-03-22 | 2023-03-22 | Inductor packaging material formula |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117309060A (en) * | 2023-10-20 | 2023-12-29 | 广东省装饰有限公司 | Building curtain wall structure performance monitoring system based on cloud computing |
| CN117309060B (en) * | 2023-10-20 | 2024-05-17 | 广东省装饰有限公司 | Building curtain wall structure performance monitoring system based on cloud computing |
-
2023
- 2023-03-22 CN CN202310354823.3A patent/CN116622189A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117309060A (en) * | 2023-10-20 | 2023-12-29 | 广东省装饰有限公司 | Building curtain wall structure performance monitoring system based on cloud computing |
| CN117309060B (en) * | 2023-10-20 | 2024-05-17 | 广东省装饰有限公司 | Building curtain wall structure performance monitoring system based on cloud computing |
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