CN116619604A - Cutting roller suitable for 12 inch diamond wire cutting and diamond wire winding mode - Google Patents
Cutting roller suitable for 12 inch diamond wire cutting and diamond wire winding mode Download PDFInfo
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- CN116619604A CN116619604A CN202310740408.1A CN202310740408A CN116619604A CN 116619604 A CN116619604 A CN 116619604A CN 202310740408 A CN202310740408 A CN 202310740408A CN 116619604 A CN116619604 A CN 116619604A
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- cutting
- roller
- groove
- wound
- diamond wire
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- 238000005520 cutting process Methods 0.000 title claims abstract description 170
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 63
- 239000010432 diamond Substances 0.000 title claims abstract description 63
- 238000004804 winding Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 claims description 16
- 229910000831 Steel Inorganic materials 0.000 abstract description 28
- 239000010959 steel Substances 0.000 abstract description 28
- 238000005452 bending Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 15
- 239000010703 silicon Substances 0.000 description 15
- 239000013078 crystal Substances 0.000 description 14
- 239000004570 mortar (masonry) Substances 0.000 description 11
- 230000001133 acceleration Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 239000004576 sand Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H54/00—Winding, coiling, or depositing filamentary material
- B65H54/02—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers
- B65H54/40—Arrangements for rotating packages
- B65H54/46—Package drive drums
- B65H54/48—Grooved drums
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a cutting roller suitable for 12 inch diamond wire cutting, which comprises a right cutting roller and a left cutting roller which are arranged on the same horizontal plane, wherein a cutting main roller is arranged at the center position below the right cutting roller and the left cutting roller; the cutting roller body is provided with a plurality of notch grooves, the upper parts of the notch grooves are V-shaped grooves, the lower parts of the notch grooves are round grooves, the round grooves are communicated with the V-shaped grooves, and the bottom diameter of the V-shaped grooves is smaller than the diameter of the round grooves. The winding mode is as follows: the diamond wire is sequentially and one-to-one correspondingly grooved and wound or grooved and wound through the right cutting roller, the right driven roller, the cutting main roller, the left driven roller and the grooves of the left cutting roller, so that the situation that the groove body is damaged and the bending and warping TTV exceeds standard due to the lateral deviation of the steel wire is avoided, and the cutting situation is effectively improved.
Description
Technical Field
The invention belongs to the technical field of 12-inch diamond wire cutting, and particularly relates to a cutting roller and a diamond wire winding mode suitable for 12-inch diamond wire cutting.
Background
Semiconductor wafers are the substrate material for chip fabrication, and especially 12 inch semiconductor wafers are the main material for high-end chips, and the fabrication process is as follows: melting polycrystalline silicon and drawing the melted polycrystalline silicon into a high-quality monocrystalline silicon rod through a monocrystalline furnace; cutting off and barreling the monocrystalline silicon rod to obtain a crystal rod with the diameter of 12 inches; the crystal bar is divided into silicon wafers through linear cutting, and the silicon wafers are subjected to chamfering, grinding, polishing and other steps, so that the surface flatness of the silicon wafers is improved.
Currently, a 12-inch semiconductor crystal bar is usually cut by a mortar wire or a diamond wire, wherein the mortar wire is widely used for cutting the 12-inch crystal bar, and 6-inch and below 6-inch crystal bars are successfully developed, but the 12-inch crystal bar is in the initial stage of development. The diamond wire cutting mainly uses diamond powder on a diamond wire to strike a crystal bar at a high speed to cut the crystal bar into silicon wafers, and compared with the mortar wire cutting, the 12 inch semiconductor crystal bar diamond wire cutting has the following advantages: 1) Because the waste mortar generated by the mortar wire cutting is more and more difficult to treat and does not meet the environmental protection requirement, the cooling liquid used in the diamond wire cutting process is mixed with pure water and a small amount of diamond wire cutting liquid, and the large trend of environmental protection is complied with; 2) The cutting cost is reduced by more than 40%; 3) The cutting efficiency is high, and the cutting time is shortened by more than 30%; 4) The line loss is small, and the slicing yield is improved by more than 6%.
However, the wire saw of 12 inch semiconductor wafers has the following problems: unlike 8 inch and below 8 inch silicon wafers, the 12 inch semiconductor crystal bar is applied to a high-end chip, so that the surface morphology of the cut silicon wafer is very high in requirements, such as parameters of crystal orientation, thickness uniformity, bending, warping and the like, and the stability of a diamond wire in the cutting process is required to be good;
the existing diamond wire cutting generally adopts a structure of 3 main rolls, as shown in fig. 1, the notch groove of the main roll and the end face of the main roll are completely parallel, so that each circle of grooves are independent, a first steel wire of a wire inlet wheel is wound into a first groove of a No. 1 main roll, then wound into a first groove of a No. 3 main roll from the first groove of the No. 1 main roll, then wound into a second groove of a No. 2 main roll from the first groove of the No. 3 main roll, then wound into a second groove of the No. 1 main roll from the 2 nd groove of the No. 2 main roll, then wound into a second groove of the No. 3 main roll, and the winding is repeated until the whole main roll is wound.
The main roller is coated with polyurethane, and the surface is grooved after coating. The distance between the first groove of the upper 2 main rollers of the 3 main rollers and the end face of the coating layer is controlled to be 5+/-0.01 mm (in order to ensure the perpendicularity of the upper layer of wire net and the workpiece plate and further ensure the cutting crystal orientation of the crystal bar), the grooving mode of the lower main roller in the industry is generally adopted as the grooving mode of the upper 2 main rollers, that is to say, the distance between the first groove and the end face of the coating layer is controlled to be 5+/-0.01 mm, the grooving method is always applied on a mortar line, and has been used for more than ten years, the problems do not occur, and two reasons are that:
firstly, the surface of the mortar line is stainless steel alloy light, the surface is smooth and not sharp, the cutting force of the steel wire is very weak, and the mortar is driven by the steel wire to grind so as to achieve the slicing effect. The surface of the sand line is made of silicon carbide, the surface is rough, the cutting force is strong, and the silicon wafer is cut by the surface of the silicon carbide. Although the main roller drives the wire net to rotate, the steel wire and the main roller are relatively static, the sand wire and the diamond wire are cut back and forth, when the main roller rotates and changes direction, an acceleration and deceleration time exists, the acceleration and deceleration time is 2 seconds, the acceleration and deceleration time is reduced to 0 from 1500-1800m/min (diamond wire) or 600-900m/min (mortar wire) in 2 seconds, and the acceleration is carried out to 1500-1800m/min (diamond wire) or 600-900m/min (mortar wire) in 2 seconds from 0 back to 2 seconds, so that the main roller is worn. This results in a main roll life of the mortar wire of typically around 1200 hours and a main roll life of the diamond wire of around 300 hours.
And secondly, the cutting force is enhanced when the linear speed of the diamond wire is high, but the stability is poorer when the linear speed is higher, so that the sand wire has no problem, but the problem can occur on the diamond wire. The larger the size of the silicon wafer to be cut is, the larger the resistance to cutting is, so that the higher the linear speed is, the stronger the cutting force can be, the higher the linear speed is, and the poorer the stability is, so that the problem is remarkable for a 12 inch diamond wire. Because the interval between every two grooves is about 1mm, so from the first groove of the No. 3 main roller to the second groove of the No. 2 main roller, the steel wire is inclined relative to the end surface of the main roller, so that the steel wire is biased towards one side of the groove to cause stress on one side of the groove body, the schematic diagram is shown as 2, in practical application, the groove body is obviously biased seriously, as shown in fig. 3, the main roller picture is actually detected, the detection method is a projection detection method, the black shadow part is in the shape of the groove body, the service life of the main roller is reduced, the groove body is stressed unidirectionally, the stability of the steel wire is deteriorated when the groove body is severely deformed, and further the cut silicon wafer is warped and TTV is high.
Disclosure of Invention
The invention provides a cutting roller and a diamond wire winding mode suitable for 12-inch diamond wire cutting, which are used for avoiding the situation that a groove body is damaged and a bent TTV exceeds standard due to the lateral deviation of a steel wire, and effectively improving the cutting situation.
The invention is realized by the following technical scheme:
the cutting roller comprises a right cutting roller and a left cutting roller which are arranged on the same horizontal plane, and a cutting main roller is arranged at the center position below the right cutting roller and the left cutting roller;
the cutting roller is characterized in that a plurality of notch grooves are formed in the cutting roller body, the upper portions of the notch grooves are V-shaped grooves, the lower portions of the notch grooves are round grooves, the round grooves are communicated with the bottoms of the V-shaped grooves, and the diameter of a gap at the bottom of each V-shaped groove is smaller than that of each round groove.
Further, the groove type angle of the V-shaped groove is 80 ℃.
Further, the diameter of the circular groove is consistent with the diameter of the diamond wire.
Further, a left driven roller and a right driven roller are respectively arranged on two sides of the cutting main roller.
Further, the diameters of the two driven wheels are 1/2 of that of the cutting main roller, and one ends of the two driven wheels, which are far away from the cutting main roller, are respectively positioned on the same vertical surface with the outer sides of the right cutting roller and the left cutting roller on the same side.
Further, the grooving structures of the two driven wheels are consistent with the grooving structure of the cutting main roller.
Further, the groove distance between each notch groove is 0.45-0.55 mm.
The diamond wire winding mode suitable for 12 inch diamond wire cutting is characterized in that diamond wires are sequentially wound through grooves of a right cutting roller, a right driven roller, a cutting main roller, a left driven roller and a left cutting roller;
the diamond wires are wound from the right cutting roller to the right driven roller to form one-to-one grooved windings or spaced-groove windings;
the diamond wire is wound from a right driven roller, a cutting main roller and a left driven roller into one-to-one corresponding notch winding;
the diamond wire is wound from the left driven roller to the left cutting roller to form a groove winding;
the diamond wires are wound from the left cutting roller to the right cutting roller in a one-to-one correspondence with the notch winding.
Further, specifically, the method comprises the following steps: the diamond wire passes through the first groove of the right cutting roller and then sequentially winds to the second groove of the right driven roller, the cutting main roller and the left driven roller, then winds to the third groove of the left cutting roller, then winds to the third groove of the right cutting roller and then sequentially winds to the fourth groove of the right driven roller, the cutting main roller and the left driven roller, then winds to the fifth groove … … of the left cutting roller, and so on.
Further, specifically, the method comprises the following steps: the diamond wire passes through the first groove of the right cutting roller and then sequentially winds to the first groove of the right driven roller, the cutting main roller and the left driven roller, then winds to the second groove of the left cutting roller, then winds to the second groove of the right cutting roller and then sequentially winds to the third groove of the right driven roller 4, the cutting main roller and the left driven roller, then winds to the fourth groove … … of the left cutting roller, and so on.
The invention has the beneficial effects that:
1. the target value of the groove angle of the present invention increases from 40 deg. to 80 deg.. The problem of fluctuation of steel wires in the acceleration and deceleration process cannot be thoroughly solved by modifying one side groove type in the prior art, so that the angle of 80 degrees is more favorable for recognizing wires and wiring nets, the groove type structure is characterized in that the bottom of the groove type structure is round, the diameters of the steel wires are consistent, the steel wires enter the V-shaped groove after being tensioned, the steel wires enter the round groove at the bottom, a part of the steel wires are arranged in a silicon wafer in the cutting process, the speed difference is formed between the part of the steel wires in the silicon wafer and the part of the steel wires in the groove body in the acceleration and deceleration process, the part of the steel wires wound on a main roller is loosened, the steel wires are laterally deviated, the groove body is damaged, the warping TTV exceeds standard, and the like. However, by using the invention, the steel wire is fixed in the round groove at the bottom, so that the occurrence of the situation is avoided, and the cutting situation is effectively improved;
2. the invention adds the left driven roller and the right driven roller which are arranged at the two sides of the cutting main roller, the two driven rollers are not driven by a motor and are driven by the wire net, the groove shape and the groove distance are kept consistent with the cutting main roller, the diameter is 1/2 of that of the driving roller, and after the two driven rollers are added, the pressure damage area of the wire net to the main roller is effectively shared, thereby achieving the purposes of stabilizing the wire net and prolonging the service life of the main roller;
3. the invention adopts the slot winding, which has the advantages that the single-side stress of the slot body is changed into double-side stress, and the two driven wheels and the slot of the cutting main roller effectively share the pressure.
Drawings
Fig. 1 is a prior art diamond wire cutting roll structure;
FIG. 2 is a groove structure of a wire cutting roll of a related art;
FIG. 3 is a photograph of a prior art diamond wire cutting roll after use;
FIG. 4 is a view showing a structure of a wire cutting roll of the present invention;
FIG. 5 is a groove structure of the diamond wire cutting roll of the present invention;
FIG. 6 shows a diamond wire winding method according to the present invention;
reference numerals: 1. right cutting roller, 2, left cutting roller, 3, cutting main roller, 4, right driven wheel, 5, left driven roller, 6, notch groove, 601, V-shaped groove, 602, circular groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the present invention.
Example 1
The cutting roll comprises a right cutting roll 1 and a left cutting roll 2 which are arranged on the same horizontal plane, and a cutting main roll 3 is arranged at the center position below the right cutting roll 1 and the left cutting roll 2;
the cutting roller is characterized in that a plurality of notch grooves 6 are formed in the cutting roller body, the upper parts of the notch grooves 6 are V-shaped grooves 601, the groove type angle of the V-shaped grooves 601 is 80 ℃, the target value of the groove type angle is increased from 40 degrees to 80 degrees, the angle 80 degrees is more beneficial to line recognition and wire distribution net, the lower parts of the notch grooves 6 are round grooves 602, the round grooves 602 are communicated with the bottoms of the V-shaped grooves 601, the diameter of a gap at the bottoms of the V-shaped grooves 601 is smaller than that of the round grooves 602, and the diameter of the round grooves 602 is consistent with the diameter of diamond wires;
the groove type structure is characterized in that the diameter of the bottom of the groove type structure is identical to that of a steel wire, after the steel wire enters the V-shaped groove 601, the steel wire enters a circular groove 602 at the bottom after tension is tensioned, a part of the steel wire is arranged in a silicon wafer in the cutting process, the part of the steel wire in the silicon wafer and the part of the steel wire in the groove body in the acceleration and deceleration process form a speed difference, so that the part of the steel wire wound on a main roller is loosened, the steel wire is laterally deviated, the groove body is damaged, and the bending and warping TTV exceeds standard. However, with the present invention, the steel wire is fixed in the bottom circular groove 602, which avoids this situation and effectively improves the cutting situation.
Further, a left driven roller 5 and a right driven roller 4 are respectively arranged on two sides of the cutting main roller 3, the two driven rollers are not driven by a motor and are driven by a wire net, the diameters of the two driven rollers are 1/2 of that of the cutting main roller 3, one ends of the two driven rollers far away from the cutting main roller 3 are respectively positioned on the same vertical surface with the outer sides of the right cutting roller 1 and the left cutting roller 2 on the same side, and the grooving structures and the groove distances of the two driven rollers are consistent with those of the cutting roller; after the two driven rollers are added, the pressure damage area of the wire net to the main roller is effectively shared, and the purposes of stabilizing the wire net and prolonging the service life of the main roller are achieved.
The invention is 5 rollers, the first groove positions of the 5 rollers are consistent, each groove interval is engraved according to the existing 0.5-time groove distance requirement, the number of the grooves of the whole main roller is 2 times that of the grooves of the whole main roller, the previous groove distance is about 1mm (0.9-1.1 mm), and the groove distance between each grooves is about 0.5mm (0.45-0.55 mm).
Where "11" represents the right cutting roll 1 st slot, "12" represents the right cutting roll 2 nd slot, "13" represents the right cutting roll 3 rd slot ….
"21" represents the left cutting roll 1 st slot, "22" represents the left cutting roll 2 nd slot, and "23" represents the left cutting roll 3 rd slot ….
"31" represents the 1 st groove of the cutting main roller, "32" represents the 2 nd groove of the cutting main roller, and "33" represents the 3 rd groove … of the cutting main roller.
"41" represents the 1 st slot of the right driven wheel, "42" represents the 2 nd slot of the right driven wheel, "43" represents the 3 rd slot … of the right driven wheel.
"51" represents the 1 st slot of the left driven wheel, "52" represents the 2 nd slot of the left driven wheel, "53" represents the 3 rd slot … of the left driven wheel.
The method during actual processing is as follows (the winding principle is that the wire mesh between the right cutting roller 1 and the left cutting roller 2 which are the uppermost ones involved in cutting is on a groove position, otherwise, the crystal orientation deviation is caused);
the diamond wire winding mode suitable for 12 inch diamond wire cutting is specifically as follows:
first case: the diamond wire sequentially bypasses 11-42-32-52-23-13-44-34-54-25-15-46-36-56-27-17- …; the main roller is used for 300 hours; as shown by the black dashed line in fig. 6.
Second case: the diamond wire sequentially bypasses 11-41-31-51-22-12-43-33-53-24-14-45-35-55-26-16- …; the main roller is used for 300 hours; as shown by the wavy line in fig. 6.
The prior art winding method is shown by a solid line in fig. 6, the service life of the main roller is 300h, and then the service life of the main roller winding method of the invention can reach 600h in total after recoating and grooving.
In conclusion, through experiments, the service life of the improved main roller is prolonged from 300 hours to 600 hours, and is doubled, so that the processing cost of the main roller is reduced. The warp average value is increased from 12 mu m to 8 mu m, and the warp value of the silicon wafer is more concentrated, so that CPK capability is improved. The TTV average value is improved from 7 mu m to 4 mu m, the TTV value of the silicon wafer is more concentrated, and the CPK capability is improved.
While the basic principles, principal features and advantages of the present invention have been shown and described, it will be understood by those skilled in the art that the present invention is not limited by the foregoing embodiments, which are described in the foregoing description merely illustrate the principles of the invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined in the appended claims and their equivalents.
Claims (10)
1. A cutting roll suitable for 12 inch diamond wire cutting, characterized in that: the cutting rollers comprise a right cutting roller (1) and a left cutting roller (2) which are arranged on the same horizontal plane, and a cutting main roller (3) is arranged at the center position below the right cutting roller (1) and the left cutting roller (2);
the cutting roller is characterized in that a plurality of notch grooves (6) are formed in the cutting roller body, the upper portions of the notch grooves (6) are V-shaped grooves (601), the lower portions of the notch grooves (6) are round grooves (602), the round grooves (602) are communicated with the bottoms of the V-shaped grooves (601), and the bottom gap diameter of the V-shaped grooves (601) is smaller than the diameter of the round grooves (602).
2. A cutting roll suitable for 12 inch diamond wire cutting according to claim 1, wherein: the groove type angle of the V-shaped groove (601) is 80 ℃.
3. A cutting roll suitable for 12 inch diamond wire cutting according to claim 1, wherein: the diameter of the circular groove (602) is consistent with the diameter of the diamond wire.
4. A cutting roll suitable for 12 inch diamond wire cutting according to claim 1, wherein: the left driven roller (5) and the right driven roller (4) are respectively arranged at the two sides of the cutting main roller (3).
5. A cutting roll suitable for 12 inch diamond wire cutting according to claim 4, wherein: the diameters of the two driven wheels are 1/2 of that of the cutting main roller (3), and one ends of the two driven wheels, which are far away from the cutting main roller (3), are respectively positioned on the same vertical surface with the outer sides of the right cutting roller (1) and the left cutting roller (2) on the same side.
6. A cutting roll suitable for 12 inch diamond wire cutting according to claim 4 or 5, wherein: the grooving structures of the two driven wheels are consistent with the grooving structures of the cutting main roller (3).
7. A cutting roll suitable for 12 inch diamond wire cutting according to claim 1, wherein: the groove distance between each two grooves is 0.45-0.55 mm.
8. The wire winding method suitable for 12-inch wire cutting according to any one of claims 1 to 7, wherein: the diamond wire is sequentially wound through grooves of a right cutting roller (1), a right driven roller (4), a cutting main roller (3), a left driven roller (5) and a left cutting roller (2);
wherein the diamond wires are wound from the right cutting roller (1) to the right driven roller (4) in a one-to-one correspondence grooved winding or spaced-groove winding;
the diamond wires are wound from the right driven roller (4), the cutting main roller (3) and the left driven roller (5) into one-to-one grooved windings;
the diamond wire is wound from the left driven roller (5) to the left cutting roller (2) to form a groove winding;
the diamond wires are wound from the left cutting roller (2) to the right cutting roller (1) in a one-to-one correspondence with the notch grooves.
9. The wire winding method for 12-inch diamond wire cutting according to claim 8, wherein: the method comprises the following steps: the diamond wire is wound to a first groove of the right cutting roller (1), then sequentially wound to a second groove of the right driven roller (4), the cutting main roller (3) and the left driven roller (5), then wound to a third groove of the left cutting roller (2), then sequentially wound to a fourth groove of the right driven roller (4), the cutting main roller (3) and the left driven roller (5) after being wound to a third groove of the right cutting roller (1), then wound to a fifth groove … … of the left cutting roller (2) and so on.
10. The wire winding method for 12-inch diamond wire cutting according to claim 8, wherein: the method comprises the following steps: the diamond wire is wound to a first groove of the right cutting roller (1), then sequentially wound to a first groove of the right driven roller (4), the cutting main roller (3) and the left driven roller (5), then wound to a second groove of the left cutting roller (2), then wound to a second groove of the right cutting roller (1), then sequentially wound to a third groove of the right driven roller (4), the cutting main roller (3) and the left driven roller (5), then wound to a fourth groove … … of the left cutting roller (2), and so on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310740408.1A CN116619604A (en) | 2023-06-21 | 2023-06-21 | Cutting roller suitable for 12 inch diamond wire cutting and diamond wire winding mode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310740408.1A CN116619604A (en) | 2023-06-21 | 2023-06-21 | Cutting roller suitable for 12 inch diamond wire cutting and diamond wire winding mode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116619604A true CN116619604A (en) | 2023-08-22 |
Family
ID=87609960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310740408.1A Pending CN116619604A (en) | 2023-06-21 | 2023-06-21 | Cutting roller suitable for 12 inch diamond wire cutting and diamond wire winding mode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116619604A (en) |
-
2023
- 2023-06-21 CN CN202310740408.1A patent/CN116619604A/en active Pending
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