CN116618779A - Solder jetting method and solder jetting device - Google Patents
Solder jetting method and solder jetting device Download PDFInfo
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- CN116618779A CN116618779A CN202310802681.2A CN202310802681A CN116618779A CN 116618779 A CN116618779 A CN 116618779A CN 202310802681 A CN202310802681 A CN 202310802681A CN 116618779 A CN116618779 A CN 116618779A
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- molten
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 51
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 257
- 239000000463 material Substances 0.000 claims abstract description 82
- 238000005507 spraying Methods 0.000 claims abstract description 42
- 238000010304 firing Methods 0.000 claims abstract description 25
- 239000011261 inert gas Substances 0.000 claims description 59
- 238000010438 heat treatment Methods 0.000 claims description 29
- 239000007788 liquid Substances 0.000 claims description 19
- 238000002844 melting Methods 0.000 claims description 17
- 230000008018 melting Effects 0.000 claims description 17
- 239000007921 spray Substances 0.000 claims description 15
- 238000005476 soldering Methods 0.000 abstract description 36
- 238000007599 discharging Methods 0.000 abstract description 18
- 230000004907 flux Effects 0.000 abstract description 17
- 238000003466 welding Methods 0.000 abstract description 13
- 238000004140 cleaning Methods 0.000 abstract description 7
- 239000000155 melt Substances 0.000 abstract 1
- 230000008569 process Effects 0.000 description 15
- 238000002955 isolation Methods 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 6
- 238000005485 electric heating Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005493 welding type Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Abstract
The application relates to the technical field of welding processing, in particular to a soldering tin spraying method and a soldering tin spraying device, wherein the method comprises the following steps: the tin material to be treated is melted to form molten tin, the molten tin is led into a nozzle, and the molten tin is extruded and ejected from the nozzle to form solder droplets by driving a firing pin to be close to or far away from the nozzle orifice. The application directly heats and melts the tin material to obtain molten tin, the tin material in a high-temperature molten state has good flowing property, smooth flowing can be realized in the stage of conveying in a welding device or tin discharging and spraying, so that the application can improve the flowing property of the tin material without adding soldering flux, thereby needing not to carry out reflow soldering and plasma cleaning after welding, and further having higher welding efficiency.
Description
Technical Field
The application relates to the technical field of welding processing, in particular to a soldering tin spraying method and a soldering tin spraying device.
Background
The existing solder paste valve needs to add soldering flux into the solder paste, the soldering flux can protect the surface quality of the solder paste, prevent the solder paste from oxidizing, and improve the flow property of the solder paste, so that the solder paste is easy to move in the valve body, the tin is discharged smoothly, and once the soldering flux is added into the solder paste, two processes of reflow soldering (evaporating the soldering flux) and plasma cleaning (cleaning the soldering flux) are needed to be carried out in the subsequent processes so as to remove the soldering flux. Therefore, the solder paste valve is adopted for soldering and spraying, and the operation is simple and the use is convenient, but the subsequent process of removing the soldering flux is needed, and the whole processing process is not simple.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, the application provides a soldering tin spraying method which has higher welding efficiency without the processes of reflow soldering and plasma cleaning after welding.
The application also provides a device adopting the soldering tin spraying method.
According to an embodiment of the first aspect of the present application, a solder jetting method includes the steps of:
s100, melting a tin material to be treated to form molten tin;
s200, introducing molten tin into a nozzle;
s300, spraying heated inert gas on the periphery of the nozzle and forming an inert gas curtain so as to isolate sprayed solder droplets from the outside air;
s400, driving the firing pin to be close to or far from the spray hole of the nozzle so as to squeeze molten tin out of the spray hole to form solder drops.
The method according to the embodiment of the application has at least the following beneficial effects:
according to the method, the molten tin is obtained by directly heating and melting the tin material in a high-temperature environment, the tin material in a high-temperature molten state has good flowing performance, smooth flowing can be realized in the conveying stage and the tin discharging spraying stage of the welding device, so that the flowing performance of the tin material can be improved without adding soldering flux, and therefore, reflow soldering and plasma cleaning are not required after welding, and further, the welding efficiency is higher; the method has low requirements on the shape, specification, components and the like of the tin material, can process and utilize various tin materials, and can process raw materials such as tin paste, tin balls, tin wires and the like, so that the method has wider application range; besides, according to the method, according to the characteristic of good fluidity of molten tin, the continuous impact of the firing pin is utilized to continuously spray out solder, so that various operation modes such as spot welding, continuous welding and the like can be realized; the method of the application also forms an inert gas curtain which is subjected to heating treatment on the peripheral side of the nozzle, and the extruded molten tin is isolated from the outside air by utilizing the inert gas curtain, so that a low-oxygen environment can be formed at the spraying position, the oxidation reaction of the molten tin can be effectively prevented, the heated inert gas curtain can prevent the molten tin from being re-solidified in the spraying stage, and the smoothness of tin discharge is better maintained.
According to some embodiments of the application, step S100 includes the steps of: s110, guiding a tin material to be treated into a tin barrel; and S120, heating the tin barrel to heat and melt the tin material to form molten tin.
According to some embodiments of the application, the step S100 further comprises the steps of: and S130, introducing inert gas from the upper part of the tin barrel, introducing a part of the inert gas into the upper part of the tin barrel to prevent molten tin in the tin barrel from being oxidized by contact with air, and heating a part of the inert gas flowing through the periphery of the tin barrel to obtain heated inert gas.
According to some embodiments of the application, step S110 includes the steps of: s111, placing a tin material in a tin material feeding module; s112, the tin material to be treated is guided into the tin barrel through the tin material feeding module.
According to some embodiments of the application, the step S100 further comprises the steps of: s140, detecting whether the liquid level of the molten tin in the tin barrel reaches a set height, and stopping introducing the tin material into the tin barrel through the tin material feeding module if the liquid level reaches the set height.
According to some embodiments of the application, in step S120, the heating temperature of the tin can is 240-300 ℃.
According to some embodiments of the application, step S200 includes the steps of: s210, introducing molten tin into the nozzle through a runner pushing module communicated with the tin barrel and the nozzle.
According to some embodiments of the application, the step S200 further comprises the steps of: s220, heating the molten tin in the runner pushing module at a constant temperature so that the molten tin in the runner pushing module can keep a molten state.
According to some embodiments of the application, the solder jetting method further comprises the steps of: s500, adjusting the moving stroke of the firing pin and/or replacing the nozzle so as to adjust the single-time ejection amount of the molten tin.
According to a second aspect of the application, the device adopting the solder spraying method comprises a nozzle, a solder melting module and a driving module, and the solder spraying device works according to the solder spraying method.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The application is further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a flow chart of a solder spraying method according to an embodiment of the application;
FIG. 2 is a flow chart of step S100 of a solder spraying method according to an embodiment of the application;
FIG. 3 is a flow chart of step S200 of a solder spraying method according to an embodiment of the application;
fig. 4 is a schematic structural view of a solder spraying device according to an embodiment of the application.
Reference numerals:
a tin material supply module 10; a valve body 20; a runner pushing module 30; a feed channel 31; a screw 32; a discharge chamber 40; a nozzle 50; a nozzle hole 51; a tin melting module 60; a tin barrel 61; a heating element 62; an inert gas introduction module 70; an idler air pump 71; an inert gas conduit 72; an air curtain isolation protection module 80; a gas supply mechanism 81; a gas supply flow passage 82; an air tap 83; a constant temperature heating module 90; a driving module 100; a piezoelectric stack 101; a lever amplification mechanism 102; a return spring 103; a striker 110; a liquid level sensor 120; a control module 130.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
In the description of the present application, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present application and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.
In the description of the present application, the meaning of a number is one or more, the meaning of a number is two or more, and greater than, less than, exceeding, etc. are understood to exclude the present number, and the meaning of a number is understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present application, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present application can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
In the description of the present application, the descriptions of the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
Fig. 1 is a schematic flow chart of a solder spraying method according to an embodiment of the application. In the embodiment of fig. 1, the feeding control method may include, but is not limited to, steps S100, S200, and S300.
S100, melting a tin material to be treated to form molten tin;
s200, introducing molten tin into a nozzle;
s300, spraying heated inert gas on the periphery of the nozzle and forming an inert gas curtain so as to isolate sprayed solder droplets from the outside air;
s400, driving the firing pin to be close to or far from the spray hole of the nozzle so as to squeeze molten tin out of the spray hole to form solder drops.
The soldering flux is used in solder paste for the device for soldering by using solder paste as solder, such as a solder paste valve, and the soldering flux has the functions of helping and promoting the soldering process in the soldering process, protecting and preventing oxidation, and simultaneously enabling the solder to move in the soldering device and lead out tin smoothly. In a practical soldering process, if flux is added to the solder, two processes of reflow soldering (to evaporate the flux) and plasma cleaning (to clean the flux) must be performed in the subsequent process to remove the flux. However, the method directly heats the tin material to obtain molten tin, and the tin material in a high-temperature molten state has good flowing property, so that the method does not need to additionally add soldering flux to the tin material to promote the fluidity of the tin material, and the soldering work piece subjected to soldering by the method does not need to carry out procedures such as reflow soldering, plasma cleaning and the like after the soldering is finished so as to remove the soldering flux.
According to the method, the tin material is directly heated and melted, and according to the improvement, the method can be suitable for tin materials with various shapes, specifications and components, can realize the utilization of various tin materials, has low requirements on the tin materials, can process and utilize various tin materials, and has more remarkable popularization and application values.
The method not only obtains molten tin which flows smoothly in a heating mode, but also forms a heated inert gas curtain at the periphery of the nozzle, so that a low-oxygen environment can be formed at the spraying position, the smooth tin discharge is promoted, and the oxidation of tin materials is prevented; more importantly, the method also utilizes a heated curtain of inert gas to create a thermal environment around the perimeter of the nozzle, thereby preventing the risk of solidification of the molten tin due to contact with normal temperature gases.
The reason why the inert gas curtain is heated is that in some practical cases, the single injection amount of the nozzle is small, if the nozzle is surrounded by the inert gas at normal temperature, molten tin sprayed from the nozzle is easy to solidify again due to cold, and the tin outlet effect is affected.
Therefore, some embodiments set up inert gas curtain on the basis of heating melting and prevent tin liquid drop oxidation, can make more comprehensive protection to the tin material, can further optimize the quality of use of soldering.
Referring to fig. 2, in some embodiments, step S100 includes the following steps: s110, guiding a tin material to be treated into a tin barrel; and S120, heating the tin barrel to heat and melt the tin material to form molten tin. The method directly heats the tin barrel to heat and melt the tin material in the tin barrel, and the method can process and utilize various tin materials by setting the size of the tin barrel, wherein the tin material raw material can be one or two of tin balls and tin wires, so that the method has low requirements on the shape, specification, components and the like of the tin material.
In some embodiments, step S100 includes the steps of: and S130, introducing inert gas from the upper part of the tin barrel 61, wherein a part of the inert gas is introduced into the upper part of the tin barrel 61 to prevent molten tin in the tin barrel 61 from being oxidized by contact with air, and a part of the inert gas flows through the periphery of the tin barrel 61 and is subjected to heat treatment to obtain heated inert gas. In the process, inert gas is introduced into the tin barrel to prevent the molten tin in the tin barrel from being oxidized by contact with air. The inert gas can adopt a high-pressure gas form, compressed inert gas is pumped into the tin barrel through external power, and the compressed inert gas not only can extrude the original air in the tin barrel, thereby forming a low-oxygen environment in the tin barrel, but also provides pressure to promote molten tin to flow to the nozzle more quickly, so that the feeding efficiency of the device is improved.
In some embodiments, the heated inert gas reaches the peripheral side of the nozzle 50 via the outer periphery of the flow channel pushing module 30, the outer periphery of the discharge chamber 40, thereby forming a warmed environment around the nozzle 50.
In some embodiments, a tin material feeding module is connected to the tin barrel, and the tin material to be treated is guided into the tin barrel by the tin material feeding module. Step S100 includes the following steps: s111, placing a tin material in a tin material feeding module; s112, the tin material to be treated is guided into the tin barrel through the tin material feeding module.
In some embodiments, step S100 includes the steps of: s140, detecting whether the liquid level of the molten tin in the tin barrel reaches a set height, and stopping introducing the tin material into the tin barrel through the tin material feeding module if the liquid level reaches the set height.
In some embodiments, the tin barrel is heated to a temperature of 240-300 ℃. Since the melting point of tin is 230 ℃, it is recommended to set the heating temperature to 240-300 ℃ which is higher than the melting point of tin and to set a certain redundancy amount to cope with the energy consumption of the practical environment, thereby effectively heating and melting the tin material
Referring to fig. 3, in some embodiments, step S200 includes the following steps: s210, introducing molten tin into the nozzle through a runner pushing module communicated with the tin barrel and the nozzle. The nozzle can be installed in the discharge chamber bottom of the valve body, and the discharge chamber is communicated with the tin barrel through the flow channel pushing module, under the action of gravity, tin materials flow to the flow channel pushing module from the tin barrel after being heated and melted, and enter the discharge chamber under the pushing of the flow channel pushing module, and finally are extruded outwards through the nozzle.
In some embodiments, step S200 further includes the steps of: s220, heating the molten tin in the runner pushing module at a constant temperature so that the molten tin in the runner pushing module can keep a molten state.
In some embodiments, the solder jetting method of the present application further includes the steps of: s500, adjusting the moving stroke of the firing pin to adjust the single ejection amount of the molten tin.
In some embodiments, a driving module is arranged above the discharging chamber, the driving module is connected with the top end of a firing pin, the firing pin penetrates through the top wall of the discharging chamber, and the lower end of the firing pin is positioned in the nozzle; the soldering tin spraying method utilizes the driving module to drive the firing pin to be close to or far from the spray hole. The driving module can adopt a piezoelectric form and is connected with the control module, and the driving module drives the firing pin to vibrate up and down at high frequency according to the instruction of the control module.
In order to facilitate understanding of the present application, a solder jetting device for implementing the above solder jetting method is provided below.
Referring to fig. 4, the solder spraying apparatus includes, but is not limited to, a solder melting module 60 for participating in performing the above step S100, a nozzle 50 for participating in performing the above step S200, and a firing pin 110 and a driving module 100 for participating in performing the above step S300. Wherein the nozzle 50 is provided with a spray hole 51 for spraying molten tin outward from the spray hole 51; the tin melting module 60 is communicated with the nozzle 50 and is used for melting tin materials and supplying molten tin for the nozzle 50; a striker 110 is provided on one side of the nozzle 50, and a drive module 100 is coupled to the striker 110 and is configured to drive the striker 110 toward or away from the nozzle 51 such that the striker 110 extrudes molten tin within the nozzle 50 from the nozzle 51.
In some embodiments, the solder spraying apparatus further includes an air curtain isolation protection module 80 for executing the step S400, where the air curtain isolation protection module 80 is disposed on the outer peripheral side of the nozzle 50, and the air curtain isolation protection module 80 uses inert gas as a gas source to form an inert gas curtain on the peripheral side of the nozzle 50, and the inert gas curtain is used to isolate the tin droplets sprayed from the nozzle 50 from the external air. Specifically, the air curtain isolation protection module 80 may include an air supply mechanism 81, an air supply flow channel 82, and an air tap 83 that are sequentially connected, where the air tap 83 is disposed on the outer side of the nozzle 50, and the air tap 83 is disposed around the nozzle 50 and aligned with the extrusion area of the nozzle 51, and after the air supply mechanism 81 is opened, the air tap 83 sprays inert gas toward the spraying direction of the nozzle 51. In some embodiments, the air tap 83 is in a bowl-shaped structure with an opening at the bottom, the top of the air tap 83 is communicated with the air supply flow channel 82, and after air injection, air surrounds the air tap 83 to cover the tin liquid drops, so that the tin liquid drops are prevented from being directly contacted with the outside air, and oxidation of the tin liquid drops is prevented.
In some embodiments, the tin melting module 60 comprises a tin barrel 61 and a heating element 62, wherein the heating element 62 is arranged on the wall of the tin barrel 61; thus, in the above step S100, it is first necessary to introduce the tin material to be treated into the tin barrel 61, and then heat the tin barrel 61 by the heating element 62, thereby heating and melting the tin material in the tin barrel 61 to form molten tin.
To facilitate the introduction of tin into the tin barrel 61, in some embodiments, the tin spraying device further comprises a tin material supply module 10, wherein the top of the tin barrel 61 is communicated with the tin material supply module 10; in step S110, the tin material is first placed in the tin material feeding module 10, and then the tin material to be processed is guided into the tin barrel 61 by the tin material feeding module 10;
in some of these embodiments, in particular, the tin material feed module 10 takes the form of a hopper to enable tin material to fall directly from the tin material feed module 10 down into the tin barrel 61. According to the structural characteristics of the tin material feeding module 10 and the tin barrel 61, the requirements on the shape, specification, composition and the like of the tin material are not high, and the method can be suitable for utilizing various tin materials.
In some embodiments, in order to facilitate the execution of the step S140, the tin barrel 61 is internally provided with the liquid level sensor 120, and the liquid level sensor 120 is set at a set height according to design requirements, so that the molten tin capacity in the tin barrel 61 can be monitored in real time by the liquid level sensor 120, and when the detected molten tin level reaches the set height, the tin material feeding module 10 can be controlled to stop working so as to stop introducing tin material into the tin barrel 61, or an alarm is controlled so as to alert an operator to stop introducing tin material into the tin barrel 61 through the tin material feeding module 10, so as to prevent the excessive molten tin from overflowing from the tin barrel 61.
In some embodiments, in order to facilitate the execution of the above step S130, the inert gas introduction module 70 is connected to the upper portion of the tin can 61, and the inert gas introduction module 70 is used to introduce inert gas into the tin can 61 to discharge air in the tin can 61, thereby reducing the oxygen concentration in the tin can 61. The tin melting module 60 is combined with the inert gas introduction module 70, so that the tin material in the tin barrel 61 can be heated and melted under the low oxygen concentration, and the oxidation of the tin material is prevented. In one embodiment, the inert gas introducing module 70 includes an inert gas pump 71 and an inert gas conduit 72, the inert gas pump 71 is connected with the tin barrel 61 through the inert gas conduit 72, the inert gas pump 71 introduces compressed inert gas and pumps the compressed inert gas into the tin barrel 61 through power, and the compressed inert gas not only can discharge the original air in the tin barrel 61, thereby forming a low-oxygen environment in the tin barrel 61 to prevent oxidation of molten tin, but also can provide pressure to promote the molten tin to flow to the nozzle 50 more quickly, and improve the feeding efficiency of the solder spraying device.
In some embodiments, the solder spraying device further comprises a valve body 20, a discharging chamber 40 is arranged on the valve body 20, the discharging chamber 40 is communicated with the tin barrel 61, and the discharging chamber 40 is used for containing molten tin to be extruded. Regarding the discharging action of tin liquid drops, the nozzle 50 is arranged at the bottom end of the discharging chamber 40, the driving module 100 is arranged above the discharging chamber 40, the driving module 100 is abutted with the firing pin 110 and used for driving the firing pin 110 to move up and down, the firing pin 110 penetrates through the top wall of the discharging chamber 40 and extends into the nozzle 50, the lower end of the firing pin 110 is positioned in the discharging chamber 40, the axis of the firing pin 110 and the axis of the spray hole 51 of the nozzle 50 are positioned on the same straight line, the diameter of the firing pin 110 is smaller than the aperture of the spray hole 51, and molten tin in the discharging chamber 40 is extruded outwards from the nozzle 50 under the impact action of the firing pin 110.
In some embodiments, the driving module 100 is externally connected with the control module 130, the driving module 100 can adopt a piezoelectric mode, the driving module 100 can drive the striker 110 to vibrate up and down at high frequency according to the instruction of the control module 130, trace tin liquid drops are continuously sprayed out of the nozzle 50, high-efficiency spraying is realized, and as tin liquid drops can be continuously sprayed out of the nozzle 50, the device can realize various working modes such as dotting, line drawing and the like, and is suitable for different working scenes.
The driving module 100 may use the piezoelectric stack 101 as a driving source, a lever amplifying mechanism 102 is disposed between the piezoelectric stack 101 and the top end of the firing pin 110, a return spring 103 is disposed between the top end of the firing pin 110 and the discharge chamber 40, and under the command signal of the control module 130, the piezoelectric stack 101 presses down the lever amplifying mechanism 102 to drive the firing pin 110 to approach the nozzle 51, so as to extrude the molten tin outwards, and after the piezoelectric stack 101 stops outputting, the return spring 103 drives the firing pin 110 to return to be far away from the nozzle 51.
In some embodiments, in order to facilitate the implementation of the step S210, the solder spraying apparatus further includes a flow channel pushing module 30, where the flow channel pushing module 30 may take the form of pushing a screw 32, and specifically includes a feeding channel 31 and a screw 32 disposed in the feeding channel 31, where the feeding channel 31 communicates with the bottom of the tin barrel 61 and the discharge chamber 40, the screw 32 is provided with a driving element, and the screw 32 pushes the molten tin material to the inside of the discharge chamber 40 and the nozzle 50 under the action of the driving element.
In some embodiments, in order to facilitate the execution of the step S220, the flow channel pushing module 30 and the outer side of the valve body 20 are provided with the constant temperature heating module 90, and the purpose of the constant temperature heating module 90 is to heat the flow channel pushing module 30 and the discharging chamber 40 by using heat, so as to prevent the molten tin from cooling and hardening after leaving the tin barrel 61, and ensure that the molten tin keeps a molten state, thereby moving well in the device and discharging the tin smoothly.
In some of these embodiments, the heating element 62 and the constant temperature heating module 90 may take the form of electric heating wires, which are commonly used in the market, by winding the electric heating wires around the tin drum 61 and the outer sidewall of the feed channel 31, the electric heating wires are energized to raise the temperature and maintain the temperature within a preset range for the energization time to achieve constant temperature. On the basis, the constant temperature heating module 90 is coated with heat insulation materials such as foam cotton on the outer sides of the corresponding electric heating wires, so that heat insulation treatment is carried out on the feeding channel 31 and the discharging chamber 40, and because the feeding channel 31 is a feeding area of molten tin, the discharging chamber 40 is a temporary area before the molten tin is extruded, the inner space of the feeding channel 31 and the discharging chamber 40 is larger, so that the heat demand is larger, the heat can be kept at a heated position more permanently and in a larger range by adding the heat insulation materials, the electricity consumption of the electric heating wires is reduced to a certain extent, and the effect of more energy conservation and environmental protection is achieved.
In some embodiments, an anti-drop connector comprises a main body, wherein an inserting part is arranged below the main body, the inserting part comprises an air curtain isolation protection module 80 and an inert gas introduction module 70 for simplifying the structure and reducing the manufacturing cost, the air supply mechanism 81 is an inert gas pump 71, the air outlet end of the inert gas pump 71 is respectively connected with an inert gas conduit 72 and an air supply runner 82, and one path of compressed inert gas enters a tin barrel 61 through the inert gas conduit 72 to provide a low-oxygen environment for heating molten tin materials and promote the molten tin to flow outwards; the other path of the compressed inert gas is sprayed from the air tap 83 through the air supply flow channel 82, specifically, the air tap 83 is aligned to the extrusion area of the spray hole 51, and the air curtain isolation and protection module 80 is arranged around the nozzle 50 according to the air tap 83, so as to form an inert gas curtain (such as a nitrogen gas curtain) around the extrusion area of the nozzle 50, thereby isolating the tin liquid drops extruded from the nozzle 50 from the external air by using the inert gas, and preventing the tin liquid drops from being oxidized when encountering the air.
In some embodiments, in order to facilitate the execution of the above step S500, the driving module 100 is electrically connected to a stroke adjustment knob (not shown), and when welding of different types of welding plates is required, the stroke adjustment knob is adjusted to control the vibration amplitude of the driving module 100, so as to adjust the movable stroke of the striker 110, thereby adjusting the single ejection amount of molten tin.
In some embodiments, in order to facilitate the execution of the step S500, the nozzle 50 may be detachably mounted on the end of the valve body 20, for example, by using a screw, etc., and the caliber of the nozzle 50 may be adjusted by replacing the nozzles 50 with different specifications, so as to achieve the purpose of adjusting the single discharge amount of molten tin.
It is understood that the solder spraying device of the present application is a device corresponding to the solder spraying method of the present application, and the solder spraying device of the present application performs control work through the solder spraying method of the present application, so specific implementation details and working procedures of the solder spraying device correspond to the solder spraying method, which are not described herein, and the solder spraying device can achieve all the beneficial effects corresponding to the solder spraying method.
The embodiments of the present application have been described in detail with reference to the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present application. Furthermore, embodiments of the application and features of the embodiments may be combined with each other without conflict.
Claims (10)
1. The solder spraying method is characterized by comprising the following steps:
s100, melting a tin material to be treated to form molten tin;
s200, introducing the molten tin into a nozzle;
s300, spraying heated inert gas on the periphery of the nozzle and forming an inert gas curtain so as to isolate the sprayed solder droplets from the outside air;
s400, driving a firing pin to be close to or far from a spray hole of the nozzle so as to squeeze and spray the molten tin from the spray hole to form solder drops.
2. The solder jetting method according to claim 1, wherein the step S100 comprises the steps of:
s110, guiding a tin material to be treated into a tin barrel;
and S120, heating the tin barrel to heat and melt the tin material to form molten tin.
3. The solder jetting method according to claim 2, wherein the step S100 further comprises the steps of:
and S130, introducing inert gas from the upper part of the tin barrel, wherein a part of the inert gas is introduced into the upper part of the tin barrel so as to prevent the molten tin in the tin barrel from being oxidized by contact with air, and a part of the inert gas flows through the periphery of the tin barrel and is subjected to heating treatment so as to obtain heated inert gas.
4. The solder jetting method according to claim 2, wherein the step S110 comprises the steps of:
s111, placing a tin material in a tin material feeding module;
s112, guiding the tin material to be treated into the tin barrel through the tin material feeding module.
5. A solder jetting method according to claim 3, wherein the step S100 further comprises the steps of:
and S140, detecting whether the liquid level of the molten tin in the tin barrel reaches a set height, and stopping introducing tin material into the tin barrel through the tin material feeding module if the liquid level reaches the set height.
6. The solder jetting method according to claim 2, wherein in the step S120, the heating temperature of the tin barrel is 240-300 ℃.
7. The solder jetting method according to claim 1, wherein the step S200 comprises the steps of:
s210, introducing the molten tin into the nozzle through a runner pushing module communicated with the tin barrel and the nozzle.
8. The solder jetting method according to claim 7, wherein the step S200 further comprises the steps of:
and S220, heating the molten tin in the runner pushing module at a constant temperature so that the molten tin in the runner pushing module can be kept in a molten state.
9. The solder jetting method according to claim 1, further comprising the steps of:
s500, adjusting the moving stroke of the firing pin and/or replacing the nozzle so as to adjust the single-time ejection amount of the molten tin.
10. A solder jetting device comprising a nozzle, a solder melting module and a driving module, characterized in that the solder jetting device operates according to the solder jetting method according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202310802681.2A CN116618779A (en) | 2023-06-30 | 2023-06-30 | Solder jetting method and solder jetting device |
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| CN202310802681.2A CN116618779A (en) | 2023-06-30 | 2023-06-30 | Solder jetting method and solder jetting device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117206622A (en) * | 2023-11-06 | 2023-12-12 | 深圳市耀亮科技有限公司 | Automatic welding device and welding method for light-emitting diode |
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- 2023-06-30 CN CN202310802681.2A patent/CN116618779A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117206622A (en) * | 2023-11-06 | 2023-12-12 | 深圳市耀亮科技有限公司 | Automatic welding device and welding method for light-emitting diode |
| CN117206622B (en) * | 2023-11-06 | 2024-01-05 | 深圳市耀亮科技有限公司 | Automatic welding device and welding method for light-emitting diode |
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