CN106271062B - Laser spray welding nozzle, spray welding device and method - Google Patents
Laser spray welding nozzle, spray welding device and method Download PDFInfo
- Publication number
- CN106271062B CN106271062B CN201610872417.6A CN201610872417A CN106271062B CN 106271062 B CN106271062 B CN 106271062B CN 201610872417 A CN201610872417 A CN 201610872417A CN 106271062 B CN106271062 B CN 106271062B
- Authority
- CN
- China
- Prior art keywords
- nozzle
- laser
- solder ball
- spray welding
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
Abstract
The invention discloses laser spray welding nozzle and spray welding device, wherein the laser spray welding nozzle comprises a spray welding nozzle body with a cavity, the spray welding nozzle body is provided with a gas supply port, a tin delivery hole and a nozzle which are communicated with the cavity, and the solder ball is in clearance fit with the nozzle to enable the solder ball to automatically fall to the ground.
Description
Technical Field
The invention relates to the technical field of laser spray welding, in particular to laser spray welding nozzles, a spray welding device and a spray welding method.
Background
The existing laser spray welding device automatically places a solder ball into a nozzle before spray welding, the solder ball just blocks a nozzle opening, then protective gas is injected into a sealing cavity formed by the solder ball and the nozzle, when the air pressure in the sealing cavity reaches a set value, a laser is controlled to emit laser to irradiate the solder ball, when the solder ball is molten, the pressure generated by the protective gas enables the molten high-temperature solder to be instantly sprayed to a position needing welding, so that welding is realized.
Disclosure of Invention
The invention mainly solves the technical problem of providing laser spray welding nozzles, spray welding devices and methods, which can avoid nozzle blockage caused by residual molten soldering tin on the nozzle during laser spray welding and improve laser spray welding efficiency.
In order to solve the technical problems, the invention provides laser spray welding nozzles, which comprise a spray welding nozzle body provided with a cavity, wherein the spray welding nozzle body is provided with an air supply port, a tin delivery hole and a nozzle which are communicated with the cavity, and a soldering tin ball is in clearance fit with the nozzle so as to automatically fall to the ground.
, the gap between the solder ball and the nozzle is 0.1-0.5 MM.
, the length of the nozzle is the free fall distance of the solder ball from the time of heating to melting.
, the supply port is located in the nozzle.
The invention also provides laser spray welding devices, which comprises a laser, a spray welding nozzle, a pressure supply mechanism, a tin delivery mechanism connected with the spray welding nozzle, and a spray welding controller coordinating the tin delivery mechanism, the pressure supply mechanism and the laser to work, wherein the spray welding nozzle comprises a nozzle body provided with a cavity, the nozzle body is provided with an air supply port, a tin delivery hole and a nozzle which are communicated with the cavity, the air supply port is connected with the pressure supply mechanism, the tin delivery mechanism is connected with the tin delivery hole, and the solder ball and the nozzle are in clearance fit, so that the solder ball automatically falls to the ground.
, the gap between the solder ball and the nozzle is 0.1-0.5 MM.
, the length of the nozzle is the free fall distance of the solder ball from the time of heating to melting.
, the supply port is located in the nozzle.
, the laser spray welding device further comprises a temperature collector in signal connection with the spray welding controller.
, the temperature collector includes an infrared temperature sensor.
, the pressure gas is an inert gas.
, the laser spray soldering device further includes a position sensor in signal communication with the spray soldering controller for detecting solder balls, the position sensor being located at the entrance of the nozzle.
The invention also provides laser spray welding methods, which comprises placing solder ball in the spray welding nozzle, heating the solder ball by laser when the solder ball is at the inlet of the nozzle, and spraying pressure gas to the melted solder ball A when the solder ball A is heated and melted, so that the melted solder ball is sprayed to the welding point from the outlet of the nozzle.
The invention relates to a laser spray welding nozzle, which comprises a spray welding nozzle body with a cavity, wherein the spray welding nozzle body is provided with a gas supply port, a tin delivery hole and a nozzle which are communicated with the cavity, and the solder ball and the nozzle are in clearance fit to enable the solder ball to automatically fall to the ground for movement.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the description are embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of an embodiment of a laser welding nozzle.
Fig. 2 is a schematic cross-sectional structure diagram of an embodiment of a laser welding device.
FIG. 3 is a schematic sectional view of the laser welding apparatus for supplying pressure gas.
The objectives, features, and advantages of the present invention will be further explained with reference to the drawings, wherein is illustrated in the following.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and more complete description of the technical solutions in the embodiments of the present invention will be given below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the invention , but not all embodiments.
As shown in fig. 1, the present invention provides embodiments of laser spray welding tips.
This laser spray welding nozzle includes: the nozzle body 1 is provided with a cavity 10, the nozzle body 1 is provided with an air supply port 13, a tin feeding hole 11 and a nozzle 12 which are communicated with the cavity 10, and the solder balls are in clearance fit with the nozzle so as to automatically fall to the ground for movement.
Specifically, the diameter of the solder ball for soldering is smaller than that of the nozzle 12, the solder ball can move in a free fall mode in the nozzle 12, and in order to ensure that the solder ball can be powered when pressure gas is applied to the nozzle 12 or the cavity 10, the solder ball and the nozzle 12 are in clearance fit, and the clearance is 0.1-0.5 MM. The pressure of the pressurized gas and the length of the nozzle, which is at least ensured to be melted by the laser when the solder ball is free-falling, can be determined by limited experiments and calculations, and thus the length of the nozzle can be set to the free-falling movement distance of the solder ball in the time from heating to melting.
When in use, the solder ball can freely fall in the nozzle and can not contact with the nozzle 11, and when the solder ball is in a melting state, the solder ball is prevented from remaining on the nozzle, thereby reducing the blockage phenomenon of the nozzle and improving the laser spray welding efficiency.
In this embodiment, the air supply port 13 is located in the nozzle, and in order to ensure the accuracy of controlling the time for heating the solder ball by the laser, the air supply port 13 is preferably located at a position where the laser can just melt the solder ball.
As shown in fig. 2, the present invention also provides embodiments of the laser welding device.
This laser spray welding device includes: laser instrument 2, spray welding mouth 1, supply to press mechanism 4 and send tin mechanism 3 with being connected to the spray welding mouth to and the cooperation send tin mechanism 3, supply to press the spray welding controller (the attached drawing of mechanism 4 and the work of laser instrument 2, spray welding mouth 1 is including the nozzle body that is equipped with cavity 10, and this nozzle body is equipped with the air supply port 13 with cavity 10 intercommunication, send tin hole 11 and nozzle 12, air supply port 13 with supply to press mechanism 4 to be connected, send tin mechanism 3 and send tin hole 11 to be connected, solder ball A is clearance fit with the nozzle, makes the automatic motion that falls to the ground of solder ball.
Specifically, the pressure supply mechanism 4 is a gas capable of providing constant pressure to provide power for the solder ball A melted by light to be sprayed to a welding position, the gas can adopt inert gas to protect the melted solder ball, and the gap between the solder ball A and the nozzle is 0.1-0.5MM, so that constant power can be provided for the solder ball A when the pressure gas is applied, and the pressure gas is released in a small amount through the gap to form a protective gas film formed by the pressure gas between the solder and the nozzle, so that the contact between the melted solder ball A and the nozzle can be avoided, and the phenomenon that the solder ball melted by the solder remains on the nozzle in the spray welding process can be avoided.
The soldering tin mechanism 3 is used for sending the soldering tin balls A into the cavity 10 by , the cavity is funnel-shaped, the soldering tin balls A can enter the nozzle 12, the spray welding controller is used for coordinating the laser 2, the pressure supply mechanism 4 and the soldering tin mechanism 3 to work, namely after the soldering tin mechanism 3 sends the soldering tin balls A into the cavity, the spray welding controller controls the laser 2 to work, laser is emitted to heat the soldering tin balls A, when the soldering tin balls A are heated and melted, the pressure supply mechanism 4 is controlled to release gas with fixed pressure, the melted soldering tin balls A are accelerated to be sprayed to a welding point, the size of the gas pressure provided by the pressure supply mechanism 4 is not limited, and the gas pressure can be determined according to the spray welding requirements.
The length of the nozzle 12 can be determined by limited experiments and calculations, the pressure of the pressure gas and the length of the nozzle 12 can be determined, and the length of the nozzle can be at least ensured to be melted by the laser when the solder ball falls freely, so that the length of the nozzle can be set as the free falling movement distance of the solder ball in the time from heating to melting.
The laser spray welding device of the spray welding nozzle is adopted, constant pressure gas generated by a pressure supply mechanism provides power for the soldering tin when the soldering tin balls are molten, the pressure gas is inert gas and can protect the soldering tin, meanwhile, because the soldering tin balls can freely fall in the nozzle, a gap exists between the soldering tin balls and the nozzle wall, when the pressure gas applies pressure to the soldering tin balls, partial gas is discharged from the gap, so that the soldering tin balls and the nozzle wall form a protective gas film, and the soldering tin can be prevented from remaining on the nozzle.
In this embodiment, the gas supply port 13 is located in the nozzle, and in order to ensure the control accuracy of the time for heating the solder ball by the laser, the gas supply port 13 is preferably located at a position where the laser can just melt the solder ball, so that the gas consumption of the pressure gas can be reduced.
In order to guarantee, avoid damaging welding material to the real time monitoring of laser welding temperature, laser spray welding device still includes the temperature collector with spray welding controller signal connection, and this temperature collector includes infrared temperature sensor.
In order to control the laser heating more precisely, the laser spray welding device further comprises a position sensor connected with the spray welding controller by signals for detecting the solder balls, and the position sensor is positioned at the inlet of the nozzle 12. When the position sensor detects the solder ball A in operation, the spray welding controller controls the laser 2 to emit laser, so that energy consumption can be saved, and the heating accuracy of the solder ball A can be improved.
The invention also provides laser spray welding methods, which comprises, firstly, placing solder ball A in the spray welding nozzle, when solder ball A is at the entrance of nozzle 12, laser starts to heat solder ball A, when solder ball A is heated and melted, pressure gas is sprayed to melted solder ball A, so that melted solder ball is sprayed from the exit of nozzle to welding point.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: it is to be understood that modifications may be made to the above-described arrangements in the embodiments or equivalents may be substituted for some of the features of the embodiments without departing from the spirit or scope of the present invention.
Claims (10)
1. The laser spray welding nozzle comprises a spray welding nozzle body provided with a cavity, wherein the spray welding nozzle body is provided with a nozzle communicated with the cavity and a tin feeding hole, and is characterized in that the nozzle is provided with a gas supply port, the gas supply port is positioned at a position where a soldering tin ball is melted by laser, the soldering tin ball is in clearance fit with the nozzle, the soldering tin ball automatically falls to the ground and moves, and the clearance fit provides power for the soldering tin ball when pressure inert gas is applied to the gas supply port on the nozzle.
2. The laser welding tip according to claim 1, characterized in that: the gap between the solder ball and the nozzle is 0.1-0.5 MM.
3. The laser welding tip according to claim 1 or 2, characterized in that: the length of the nozzle is the free falling movement distance of the solder ball in the time from heating to melting.
4. Laser spray welding device, including laser instrument, spout welding nozzle, supply press the mechanism and send tin mechanism with being connected of spout welding nozzle to and the regulation send tin mechanism, supply to press the spray welding controller of mechanism and laser instrument work, the spray welding nozzle is including the welding nozzle body that is equipped with the cavity, and this welding nozzle body is equipped with the nozzle that communicates with the cavity and send the tin hole, is equipped with the air supply mouth on this nozzle, and this air supply mouth is located laser and enables soldering tin ball melting position just, the air supply mouth is connected with supplying press the mechanism, send tin mechanism and send the tin hole to be connected, its characterized in that: the solder ball is in clearance fit with the nozzle to enable the solder ball to automatically fall to the ground, and the clearance fit provides power for the solder ball when pressure inert gas is applied.
5. The laser spray welding apparatus of claim 4, wherein: the gap between the solder ball and the nozzle is 0.1-0.5 MM.
6. The laser spray welding apparatus according to claim 4 or 5, characterized in that: the length of the nozzle is the free falling movement distance of the solder ball in the time from heating to melting.
7. The laser spray welding apparatus of claim 4, wherein: the air supply port is located in the nozzle.
8. The laser spray welding apparatus of claim 4, wherein: the laser spray welding device further comprises a temperature collector in signal connection with the spray welding controller.
9. The laser spray welding apparatus of claim 4, wherein: the laser spray welding device also comprises a position sensor which is in signal connection with the spray welding controller and is used for detecting the welding tin balls, and the position sensor is positioned at the inlet of the nozzle.
10. The laser spray welding method includes setting solder ball inside the spray welding nozzle, heating the solder ball with laser in the inlet of the nozzle, spraying pressure gas to the molten solder ball from the outlet of the nozzle when the solder ball is heated and molten in the gas supply port to spray the molten solder ball, and applying pressure inert gas to the solder ball to provide power to the solder ball.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610872417.6A CN106271062B (en) | 2016-09-29 | 2016-09-29 | Laser spray welding nozzle, spray welding device and method |
| PCT/CN2017/078816 WO2018058925A1 (en) | 2016-09-29 | 2017-03-30 | Laser spray soldering nozzle, and spray soldering device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610872417.6A CN106271062B (en) | 2016-09-29 | 2016-09-29 | Laser spray welding nozzle, spray welding device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106271062A CN106271062A (en) | 2017-01-04 |
| CN106271062B true CN106271062B (en) | 2020-01-31 |
Family
ID=57716580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610872417.6A Active CN106271062B (en) | 2016-09-29 | 2016-09-29 | Laser spray welding nozzle, spray welding device and method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106271062B (en) |
| WO (1) | WO2018058925A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106271062B (en) * | 2016-09-29 | 2020-01-31 | 深圳市艾贝特电子科技有限公司 | Laser spray welding nozzle, spray welding device and method |
| CN107570829A (en) * | 2017-10-20 | 2018-01-12 | 东莞市卓安精机自动化设备有限公司 | A kind of tin ball bonding structure and method for accurate fine solder region |
| JP7038004B2 (en) * | 2018-05-24 | 2022-03-17 | 本田技研工業株式会社 | Cleaning method and cleaning equipment for optical components |
| CN109365937B (en) * | 2018-12-10 | 2023-01-20 | 深圳市艾贝特电子科技有限公司 | Laser welding device and method for motor commutator and piezoresistor |
| CN109396585B (en) * | 2018-12-10 | 2022-12-23 | 深圳市艾贝特电子科技有限公司 | Motor commutator laser welding device and method |
| DE102020109226A1 (en) * | 2020-04-02 | 2021-10-07 | Tdk Electronics Ag | Electrical solder connection, sensor with a solder connection and method of manufacture |
| CN112091346B (en) * | 2020-09-07 | 2022-08-19 | 昆山联滔电子有限公司 | Welding method of laser spraying welding ball |
| CN112620861A (en) * | 2020-12-17 | 2021-04-09 | 珠海冠宇电池股份有限公司 | Method and device for welding battery liquid injection hole |
| CN115178906B (en) * | 2022-09-14 | 2022-12-30 | 深圳市艾贝特电子科技有限公司 | Laser welding machine and feeding mechanism thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1767727A (en) * | 2004-09-24 | 2006-05-03 | Tdk株式会社 | Conductive ball bonding method and conductive ball bonding apparatus |
| CN1846919A (en) * | 2005-03-30 | 2006-10-18 | Tdk株式会社 | Soldering method, soldering device, bonding method, bonding device, and nozzle unit |
| CN101722343A (en) * | 2008-10-10 | 2010-06-09 | 日立环球储存科技荷兰有限公司 | Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assembly |
| CN105108264A (en) * | 2015-09-23 | 2015-12-02 | 武汉凌云光电科技有限责任公司 | Solder ball pump head for laser soldering |
| CN206084135U (en) * | 2016-09-29 | 2017-04-12 | 深圳市艾贝特电子科技有限公司 | Laser surfacing mouth and surfacing device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10132567B4 (en) * | 2001-07-10 | 2005-03-31 | Pac Tech - Packaging Technologies Gmbh | Method and apparatus for applying a solder to a substrate |
| JP2004288350A (en) * | 2003-03-03 | 2004-10-14 | Shinka Jitsugyo Kk | Method and device for manufacturing magnetic head device, and the magnetic head device |
| JP4042914B2 (en) * | 2005-04-22 | 2008-02-06 | Ｔｄｋ株式会社 | Soldering apparatus and solder distribution apparatus |
| JP2007026478A (en) * | 2005-07-12 | 2007-02-01 | Alps Electric Co Ltd | Metal ball bonding method for magnetic head assembly |
| US20070075056A1 (en) * | 2005-09-30 | 2007-04-05 | Sae Magnetics (H.K.) Ltd. | Soldering device and method for forming electrical solder connections in a disk drive unit |
| JP2007245189A (en) * | 2006-03-16 | 2007-09-27 | Tdk Corp | Joining apparatus, and its nozzle unit |
| US20130256281A1 (en) * | 2012-03-30 | 2013-10-03 | Tatsumi Tsuchiya | Solder-jet nozzle, laser-soldering tool, and method, for lasersoldering head-connection pads of a head-stack assembly for a hard-disk drive |
| CN103817438B (en) * | 2014-03-07 | 2017-01-18 | 大族激光科技产业集团股份有限公司 | Solder ball welding device and method |
| CN106271062B (en) * | 2016-09-29 | 2020-01-31 | 深圳市艾贝特电子科技有限公司 | Laser spray welding nozzle, spray welding device and method |
-
2016
- 2016-09-29 CN CN201610872417.6A patent/CN106271062B/en active Active
-
2017
- 2017-03-30 WO PCT/CN2017/078816 patent/WO2018058925A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1767727A (en) * | 2004-09-24 | 2006-05-03 | Tdk株式会社 | Conductive ball bonding method and conductive ball bonding apparatus |
| CN1846919A (en) * | 2005-03-30 | 2006-10-18 | Tdk株式会社 | Soldering method, soldering device, bonding method, bonding device, and nozzle unit |
| CN101722343A (en) * | 2008-10-10 | 2010-06-09 | 日立环球储存科技荷兰有限公司 | Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assembly |
| CN105108264A (en) * | 2015-09-23 | 2015-12-02 | 武汉凌云光电科技有限责任公司 | Solder ball pump head for laser soldering |
| CN206084135U (en) * | 2016-09-29 | 2017-04-12 | 深圳市艾贝特电子科技有限公司 | Laser surfacing mouth and surfacing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106271062A (en) | 2017-01-04 |
| WO2018058925A1 (en) | 2018-04-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106271062B (en) | Laser spray welding nozzle, spray welding device and method | |
| US7717316B2 (en) | Method and device for applying a solder to a substrate | |
| CN206122840U (en) | Welding set is welded in leak protection | |
| CN106825819B (en) | Contactless tin ball bonding connection device and its welding procedure | |
| WO2019137198A1 (en) | Cold firework apparatus | |
| CN113084202A (en) | Melt flow control device and method for melt coating forming process | |
| CN107775150B (en) | A kind of consumable electrode gas shielded welding terminates the control method of process | |
| US20140291384A1 (en) | Solder wire dispenser, a portable hand-held device to apply solder accuratel and without touching the solder wire. | |
| EP2770528A8 (en) | Solder bump formation method and device | |
| JP2018163873A5 (en) | ||
| CN103551715B (en) | A kind of CO 2gas protecting welding gun nozzle anti-blocking treatment system | |
| CN116618779A (en) | Solder jetting method and solder jetting device | |
| CN102925891B (en) | Plasma cladding system | |
| CN107083550A (en) | A kind of temperature, powder sending quantity can debug Intelligent Laser cladding head automatically | |
| CN219092581U (en) | Dispensing machine | |
| JP6438235B2 (en) | Coating apparatus and coating method | |
| JP6411473B2 (en) | Composition and method for reproducibly applying small amounts of liquid | |
| CN206084135U (en) | Laser surfacing mouth and surfacing device | |
| KR101112449B1 (en) | Automatic Soldering Device | |
| CN112846510B (en) | Semiconductor welding head and solder spraying method | |
| CN104567340A (en) | Ceramic drying kiln water cooling device | |
| JPH10314640A (en) | Coating method for adhesive and apparatus therefor | |
| CN220144950U (en) | Soldering tin spraying device | |
| CN103406542A (en) | Device for controlling flow of molten metal | |
| WO2015015830A1 (en) | Soldering apparatus and soldering method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Haiying Inventor after: Tan Zhengdong Inventor after: Zhou Xuan Inventor after: Wang Haiming Inventor after: Cai Yunfeng Inventor before: Tan Zhengdong Inventor before: Wang Haiying Inventor before: Zhou Xuan |
|
| CB03 | Change of inventor or designer information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |