CN116615306A - Polishing composition for fluorophosphate glass and polishing method using polishing composition for fluorophosphate glass - Google Patents
Polishing composition for fluorophosphate glass and polishing method using polishing composition for fluorophosphate glass Download PDFInfo
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- CN116615306A CN116615306A CN202180079560.9A CN202180079560A CN116615306A CN 116615306 A CN116615306 A CN 116615306A CN 202180079560 A CN202180079560 A CN 202180079560A CN 116615306 A CN116615306 A CN 116615306A
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- Prior art keywords
- polishing
- acid
- fluorophosphate glass
- salt
- polishing composition
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- 238000005498 polishing Methods 0.000 title claims abstract description 180
- 239000000203 mixture Substances 0.000 title claims abstract description 132
- 239000005303 fluorophosphate glass Substances 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 78
- 150000003839 salts Chemical class 0.000 claims abstract description 50
- 150000001875 compounds Chemical class 0.000 claims abstract description 42
- 239000008119 colloidal silica Substances 0.000 claims abstract description 33
- 229920003169 water-soluble polymer Polymers 0.000 claims abstract description 31
- 239000002245 particle Substances 0.000 claims abstract description 26
- 239000002253 acid Substances 0.000 claims abstract description 22
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229920000642 polymer Polymers 0.000 claims abstract description 12
- 150000001408 amides Chemical class 0.000 claims abstract description 11
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- 150000004676 glycans Chemical class 0.000 claims abstract 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 27
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 11
- 239000002002 slurry Substances 0.000 claims description 10
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 9
- 150000007524 organic acids Chemical class 0.000 claims description 9
- 150000007522 mineralic acids Chemical class 0.000 claims description 7
- 239000002738 chelating agent Substances 0.000 claims description 6
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 125000003703 phosphorus containing inorganic group Chemical group 0.000 claims description 3
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- 239000003795 chemical substances by application Substances 0.000 abstract description 14
- 229910000420 cerium oxide Inorganic materials 0.000 abstract description 6
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 18
- 239000011521 glass Substances 0.000 description 18
- 238000012360 testing method Methods 0.000 description 17
- 238000002360 preparation method Methods 0.000 description 16
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 14
- 239000000178 monomer Substances 0.000 description 13
- -1 phosphorus ion Chemical class 0.000 description 13
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 12
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 8
- 239000002994 raw material Substances 0.000 description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 7
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- 159000000001 potassium salts Chemical class 0.000 description 4
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- GJJSDZSDOYNJSW-UHFFFAOYSA-N lanthanum(3+);borate Chemical compound [La+3].[O-]B([O-])[O-] GJJSDZSDOYNJSW-UHFFFAOYSA-N 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910001425 magnesium ion Inorganic materials 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- CNHRNMLCYGFITG-UHFFFAOYSA-A niobium(5+);pentaphosphate Chemical compound [Nb+5].[Nb+5].[Nb+5].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O CNHRNMLCYGFITG-UHFFFAOYSA-A 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- LCLHHZYHLXDRQG-ZNKJPWOQSA-N pectic acid Chemical compound O[C@@H]1[C@@H](O)[C@@H](O)O[C@H](C(O)=O)[C@@H]1OC1[C@H](O)[C@@H](O)[C@@H](OC2[C@@H]([C@@H](O)[C@@H](O)[C@H](O2)C(O)=O)O)[C@@H](C(O)=O)O1 LCLHHZYHLXDRQG-ZNKJPWOQSA-N 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical class [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000010318 polygalacturonic acid Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 229910001414 potassium ion Inorganic materials 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 239000000770 propane-1,2-diol alginate Substances 0.000 description 1
- 235000010409 propane-1,2-diol alginate Nutrition 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910001427 strontium ion Inorganic materials 0.000 description 1
- PWYYWQHXAPXYMF-UHFFFAOYSA-N strontium(2+) Chemical compound [Sr+2] PWYYWQHXAPXYMF-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- FYZXEMANQYHCFX-UHFFFAOYSA-K tripotassium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxymethyl)amino]acetate Chemical group [K+].[K+].[K+].OC(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O FYZXEMANQYHCFX-UHFFFAOYSA-K 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000000230 xanthan gum Substances 0.000 description 1
- 229920001285 xanthan gum Polymers 0.000 description 1
- 235000010493 xanthan gum Nutrition 0.000 description 1
- 229940082509 xanthan gum Drugs 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
The present application provides a polishing composition for fluorophosphate glass, which has a high polishing rate and can be used as a substitute for a cerium oxide-based polishing agent to polish fluorophosphate glass. The polishing composition for fluorophosphate glass comprises silica, a water-soluble polymer compound, an acid and/or a salt thereof, and water, and has a pH (25 ℃) value in the range of 1.0 to 9.0. The silica is colloidal silica having an average particle diameter (D50) in the range of 10nm to 200nm, and a polysaccharide and/or a polymer having a structural unit derived from an unsaturated amide can be used as the water-soluble polymer compound.
Description
Technical Field
The present application relates to an abrasive composition for fluorophosphate glass and a polishing method using the same. More specifically, the present application relates to a polishing composition for fluorophosphate glass for polishing a lens suitable for a digital camera, a lens of a camera incorporated in a smart phone, or the like, and a polishing method using the polishing composition for fluorophosphate glass.
Background
Conventionally, solid-state imaging devices used in digital cameras, cameras incorporated in smart phones, and the like have spectral sensitivity ranging from the visible region to the near infrared region around 1200 nm. Therefore, in the case of direct use, it is difficult to obtain good color reproducibility, and the visibility is corrected by using near infrared cut filter glass formed by adding a specific substance having infrared absorption characteristics.
As near infrared cut filter glass, an optical glass in which copper oxide is added to fluorophosphate glass has been developed and used in order to have a characteristic of selectively absorbing infrared rays having a wavelength in the near infrared region and to have high weather resistance. The general glass mainly contains a silica component or a silica component/alumina component, and the fluorophosphate glass contains substantially no silica component and is composed of a composition optimized for absorbing infrared rays having a wavelength in the near infrared region.
More specifically, in the case of fluorophosphate glass, as a general constituent, a cation% is expressed, and a phosphorus ion (P 5+ ) Contains aluminum ions (Al) in an amount of 15 to 50% 3+ ) In the range of 5 to 30%, is selected from calcium ions (Ca 2+ ) Magnesium ions (Mg) 2+ ) Strontium ion (Sr) 2+ ) Barium ion (Ba) 2+ ) And zinc ion (Zn) 2+ ) Wherein the total amount of 1 or 2 or more of the components is 10-40%, and is selected from lithium ions (Li + ) Sodium ion (Na) + ) And potassium ion (K) + ) The total amount of 1 or 2 or more of them is in the range of 5 to 30%, and copper ions (Cu 2+ ) Is contained in the range of 0 to 20%; expressed as% anions, fluoride ions (F - ) In the range of 10 to 50%, oxygen ion (O) 2- ) Is contained in the range of 50 to 90%.
Here, "cation%" and "anion%" are defined to mean units shown below. That is, when the total content of all the cationic components contained in the fluorophosphate glass is set to 100 mol% after the constituent components of the fluorophosphate glass are separated into the cationic components and the anionic components, the unit representing the content of each cationic component as a mol% corresponds to "cation%". On the other hand, when the total content of all the anionic components contained in the fluorophosphate glass is set to 100 mol%, the unit indicating the content of each anionic component in terms of mole percent corresponds to "anion%".
The near infrared cut filter glass is produced mainly by the following steps: a melting step in which a glass raw material such as a phosphoric acid raw material, a fluoride raw material, and a copper oxide raw material, such as a tripolyphosphoric acid powder, an orthophosphoric acid, etc., is melted at 600 to 1000 ℃ for 2 to 80 hours; a clarification step of removing foam from the glass; a stirring step of homogenizing the glass; and a molding step of molding the molten glass by flowing out the molten glass. There are known a method of performing the above-described respective steps using one crucible furnace, a method of performing the above-described respective steps using a continuous furnace having a plurality of different tanks for performing the respective steps and connecting the tanks to each other by a transfer pipe, and the like.
The fluorophosphate glass produced by this method exhibits a characteristic that the degree of abrasion is large and the coefficient of thermal expansion is high, as compared with the characteristics of other general optical glasses. Therefore, the polishing process of the fluorophosphate glass becomes difficult.
Such glass materials having a difficult polishing property are called difficult-to-process glass materials, and attention is required to handling during the processing in the glass manufacturing process. That is, glass materials are soft, easily damaged on the surface, or too hard to be processed, and for example, high refractive index high dispersion glass containing niobium phosphate, high refractive index low dispersion glass containing lanthanum borate, or the like are known in addition to the above fluorophosphate glass.
In particular, when the degree of abrasion of the glass material to be polished is large, the processing accuracy tends to be low, and damage generated during polishing tends to remain on the glass surface. Therefore, in the case of polishing a fluorophosphate glass, it is necessary to pay special attention to the selection of polishing agent and the setting of polishing conditions as compared with a general optical glass.
For this reason, in order to polish fluorophosphate glass, a method using a cerium oxide-based polishing agent containing cerium oxide as a main component has been conventionally carried out (see patent documents 1 and 2). However, cerium is a rare metal, and there are unstable supply due to exhaustion of resources, an increase in price of cerium, and the like. Therefore, it is desired to replace the silica-based polishing agent with a silica-based polishing agent which is inexpensive and can be stably supplied.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication No. 2013-141737
Patent document 2: international publication No. 2017/102826
Disclosure of Invention
Technical problem to be solved by the application
However, the silica-based polishing agent has a problem of a low polishing rate as compared with the above-described ceria-based polishing agent, and an improvement in the polishing rate is expected.
In view of the above-described circumstances, an object of the present application is to provide a polishing composition for fluorophosphate glass, which has a high polishing rate and can be used as a substitute for a cerium oxide-based polishing agent to polish fluorophosphate glass, and a polishing method using the polishing composition for fluorophosphate glass.
Technical scheme for solving technical problems
The present inventors have conducted intensive studies to solve the above-mentioned problems, namely, the problem of a silica-based polishing agent, that is, the problem of low polishing rate, and as a result, have found a polishing agent composition for fluorophosphate glass, which can improve the polishing rate of a silica-based polishing agent, and can finish a glass surface having excellent smoothness without causing blurring or damage to the glass surface of the fluorophosphate glass after polishing, and a polishing method using the polishing agent composition for fluorophosphate glass, and have completed the present application as shown below.
[1] An abrasive composition for fluorophosphate glass, which comprises silica, a water-soluble polymer compound, an acid and/or a salt thereof, and water, and has a pH (25 ℃) value in the range of 1.0 to 9.0.
[2] The polishing composition for fluorophosphate glass according to item [1], wherein the silica is colloidal silica and has an average particle diameter (D50) in the range of 10nm to 200 nm.
[3] The polishing composition for fluorophosphate glass according to the above [1] or [2], wherein the water-soluble polymer compound is a polysaccharide and/or a polymer having a structural unit derived from an unsaturated amide.
[4] The polishing composition for fluorophosphate glass according to any one of [1] to [3], wherein the acid and/or salt thereof is an inorganic acid and/or salt thereof.
[5] The polishing composition for fluorophosphate glass according to any one of [1] to [3], wherein the acid and/or salt thereof is an organic acid and/or salt thereof.
[6] The polishing composition for fluorophosphate glass according to the above [3], wherein the polymer having a structural unit derived from an unsaturated amide is a copolymer containing a structural unit derived from (meth) acrylamide and/or N-substituted (meth) acrylamide and a structural unit derived from (meth) acrylic acid and/or a salt thereof.
[7] The polishing composition for fluorophosphate glass according to [4], wherein the inorganic acid and/or salt thereof is a phosphorus-containing inorganic acid and/or salt thereof.
[8] The polishing composition for fluorophosphate glass according to [5], wherein the organic acid and/or salt thereof is a chelating compound.
[9] The polishing composition for fluorophosphate glass according to the above [8], wherein the chelating compound is at least 1 selected from the group consisting of a dicarboxylic acid and/or a salt thereof, a tricarboxylic acid and/or a salt thereof, a polyaminocarboxylic acid-based compound and a phosphonic acid-based compound.
[10] A polishing method using the polishing composition for fluorophosphate glass, wherein the polishing composition for fluorophosphate glass according to any one of the above [1] to [9] is used for polishing fluorophosphate glass.
Effects of the application
The polishing composition for fluorophosphate glass of the present application comprises silica, a water-soluble polymer compound, an acid and/or a salt thereof, and water, and by polishing fluorophosphate glass, it is possible to improve the polishing rate and to obtain a smooth glass surface free from blurring and damage after polishing.
Detailed Description
Hereinafter, embodiments of the present application will be described. The present application is not limited to the following embodiments, and changes, modifications, and improvements may be made without departing from the scope of the application.
1. Abrasive composition for fluorophosphate glass
The polishing composition for fluorophosphate glass of the present embodiment (hereinafter, simply referred to as "polishing composition") comprises silica, a water-soluble polymer compound, an acid and/or a salt thereof, and water.
1.1 silica
The silica contained as one component of the polishing composition of the present embodiment may be fumed silica, wet-process silica, colloidal silica, or the like, and particularly preferably colloidal silica. Further, the average particle diameter (D50) of the colloidal silica is preferably in the range of 10nm to 200nm, and more preferably in the range of 20nm to 150 nm.
By setting the average particle diameter (D50) of the colloidal silica to 10nm or more, aggregation of the colloidal silica is less likely to occur, and storage stability can be improved. On the other hand, by setting the average particle diameter (D50) of the colloidal silica to 200nm or less, the polished glass surface can be made smooth, and the occurrence of blurring and damage can be suppressed. The average particle diameter (D50) of the colloidal silica is a value calculated based on analysis by a Transmission Electron Microscope (TEM) (details will be described later).
As the colloidal silica, for example, a colloidal silica having a known shape such as a sphere or a gold candy (a particle shape having a convex portion on the surface) is used, and the colloidal silica is a colloidal silica having primary particles dispersed in water to form a colloidal shape.
The colloidal silica to be used can be produced by a conventionally known production method, and for example, the following methods are known: a water glass method in which an alkali metal silicate such as sodium silicate or potassium silicate is used as a raw material, and the raw material is subjected to a condensation reaction in an aqueous solution to grow particles of colloidal silica; an alkoxysilane method in which tetraalkoxysilane such as tetraethoxysilane is used as a raw material, and the raw material is hydrolyzed in a solvent containing a water-soluble organic solvent such as alcohol by an acid or a base to perform a condensation reaction, thereby growing particles of colloidal silica; or a method of synthesizing colloidal silica by reacting metallic silicon with water in the presence of a base catalyst. In terms of manufacturing cost, the water glass method may be preferably used. The colloidal silica which is a material to be used for the polishing composition for fluorophosphate glass of the present embodiment can be produced by using these synthesis methods or the like as appropriate.
In the polishing composition of the present embodiment, the concentration (content) of the colloidal silica contained in the polishing composition is preferably in the range of 1 to 50% by mass, more preferably in the range of 2 to 45% by mass, from the viewpoint of ensuring a stable dispersion state of the polishing particles and economical efficiency.
By setting the concentration of the colloidal silica to 1 mass% or more, the polishing rate can be increased. On the other hand, the concentration of the colloidal silica is 50 mass% or less, which is advantageous in terms of economy, and there is an advantage that aggregation and gelation are less likely to occur when a polishing agent other than the colloidal silica, other compounding agents, or the like is further added and mixed.
1.2 Water-soluble Polymer Compound
The water-soluble polymer compound contained as a component of the polishing composition of the present embodiment may be a polysaccharide, an acrylic polymer and/or a methacrylic polymer, a polymer having a structural unit derived from an unsaturated amide, or the like, and more preferably a polysaccharide or a polymer having a structural unit derived from an unsaturated amide.
Further, in the polishing composition of the present embodiment, the concentration of the water-soluble polymer compound contained in the polishing composition is preferably in the range of 0.0001 to 10.0% by mass, and more preferably in the range of 0.001 to 5.0% by mass.
The concentration of the water-soluble polymer compound is 0.0001% by mass or more, whereby blurring and damage to the substrate surface after polishing can be suppressed. The concentration of the water-soluble polymer compound is 10.0 mass% or less, which is advantageous not only in terms of economy but also in terms of avoiding an increase in viscosity of the polishing composition for fluorophosphate glass.
Further, as polysaccharides used as the water-soluble polymer compound, alginic acid ester, pectic acid, carboxymethyl cellulose, agar, xanthan gum, chitosan, methyl cellulose, ethyl cellulose, hydroxypropyl cellulose, hydroxyethyl cellulose, and the like can be mentioned.
On the other hand, the polymer having a structural unit derived from an unsaturated amide used as the water-soluble polymer compound is preferably a copolymer containing a structural unit derived from an unsaturated amide and a structural unit derived from a carboxyl group-containing vinyl monomer, and more preferably a copolymer containing a structural unit derived from (meth) acrylamide and/or N-substituted (meth) acrylamide and a structural unit derived from (meth) acrylic acid and/or a salt thereof.
Here, (meth) acrylamide means acrylamide and/or methacrylamide, and (meth) acrylic acid means acrylic acid and/or methacrylic acid. Hereinafter, (methyl) in the present specification means the same as described above.
Further, N-substituted (meth) acrylamides are compounds generally represented by the following formula (1).
CH 2 ＝C(R 1 )-CONR 2 (R 3 )···(1)
Wherein R is 1 Represents a hydrogen atom or a methyl group, R 2 Represents a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms, R 3 Represents a linear or branched alkyl group having 1 to 4 carbon atoms.
R as shown in the above formula (1) 2 Or R is 3 Examples of the straight-chain or branched alkyl group having 1 to 4 carbon atoms include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl and the like; on the other hand, specific examples of the N-substituted (meth) acrylamides include N, N-dimethyl (meth) acrylamide, N-methyl (meth) acrylamide, N-ethyl (meth) acrylamide, N-propyl (meth) acrylamide, N-isopropyl (meth) acrylamide, N-butyl (meth) acrylamide, N-isobutyl (meth) acrylamide, N-sec-butyl (meth) acrylamide, and N-tert-butyl (meth) acrylamide.
Examples of the carboxyl group-containing vinyl monomer include monocarboxylic acids such as (meth) acrylic acid, crotonic acid, and (meth) acrylic acid, dicarboxylic acids such as itaconic acid, maleic acid, and fumaric acid, and alkali metal salts such as sodium salts and potassium salts of these various organic acids, and ammonium salts. Particularly preferably, (meth) acrylic acid or itaconic acid is used.
Further, the proportion of the structural unit derived from the unsaturated amide in the copolymer is preferably 99 in terms of molar ratio: 1 to 10:90, more preferably 98: 2-10: 90.
Further, vinyl monomers other than the above may be suitably used. Examples of the anionic vinyl monomer include organic sulfonic acids such as vinylsulfonic acid, styrenesulfonic acid, and 2-acrylamido-2-methylpropanesulfonic acid, and alkali metal salts such as sodium salts and potassium salts of various organic acids thereof, and ammonium salts thereof.
Further, examples of the nonionic vinyl monomer include carboxyl group-containing vinyl monomers and alkyl esters of the above anionic vinyl monomers, acrylonitrile, styrene, divinylbenzene, vinyl acetate, methyl vinyl ether, and N-vinylpyrrolidone.
In the method for producing the carboxyl group-containing poly (meth) acrylamide obtained by copolymerizing (meth) acrylamide and/or N-substituted (meth) acrylamide, a carboxyl group-containing vinyl monomer and, if necessary, a vinyl monomer other than the above-mentioned ones, a known method may be employed.
In this regard, if an example is described, the above-mentioned various monomers and water are added to a predetermined reaction vessel, a radical polymerization initiator is added thereto, and heating is performed while stirring, whereby the objective carboxyl group-containing poly (meth) acrylamide can be obtained.
In this case, as the radical polymerization initiator, a general radical polymerization initiator such as a persulfate salt such as potassium persulfate or ammonium persulfate, or a redox-type polymerization initiator in the form of a combination of these with a reducing agent such as sodium bisulfite can be used. Further, as the radical polymerization initiator, azo-based initiators may be used. The amount of the radical polymerization initiator used may be in the range of 0.05 to 2 mass% based on the total amount of the vinyl monomers used.
The weight average molecular weight of the polymer having the structural unit derived from the unsaturated amide is usually about 1,000 ～ 10,000,000, preferably 10,000 ～ 5,000,000, and more preferably 100,000 ～ 3,000,000. The weight average molecular weight represents a value measured by standard polystyrene conversion using GPC (gel permeation chromatography).
1.3 acids and/or salts thereof
The acid and/or salt thereof contained as a component of the polishing composition of the present embodiment is an inorganic acid and/or salt thereof, or an organic acid and/or salt thereof. As the acid and/or the salt thereof, an inorganic acid and/or the salt thereof and an organic acid and/or the salt thereof may be used in combination.
Examples of the inorganic acid and/or a salt thereof include sulfuric acid, nitric acid, hydrochloric acid, phosphoric acid, phosphonic acid, phosphinic acid, tripolyphosphoric acid, pyrophosphoric acid, and/or a salt thereof. Further, phosphorus-containing inorganic acids and/or salts thereof can be preferably used, and phosphoric acid, phosphonic acid, phosphinic acid, tripolyphosphoric acid, pyrophosphoric acid and/or salts thereof and the like can be particularly preferably used.
On the other hand, as the organic acid and/or a salt thereof, at least 1 selected from the group consisting of monocarboxylic acid and/or a salt thereof, dicarboxylic acid and/or a salt thereof, tricarboxylic acid and/or a salt thereof, polyaminocarboxylic acid-based compound, and phosphonic acid-based compound may be used. Further preferably, a chelating compound is used.
As the chelating compound, a dicarboxylic acid and/or a salt thereof, a tricarboxylic acid and/or a salt thereof, a polyaminocarboxylic acid compound, a phosphonic acid compound, and the like can be used. As the dicarboxylic acid and/or a salt thereof, malic acid, malonic acid, maleic acid, tartaric acid, and/or a salt thereof, and the like can be used; as the tricarboxylic acid and/or its salt, citric acid and/or its salt and the like can be used.
On the other hand, as the polyaminocarboxylic compounds, ethylenediamine tetraacetic acid, diethylenetriamine pentaacetic acid, triethylenetetramine hexaacetic acid, nitrilotriacetic acid, ammonium salts, amine salts, sodium salts, potassium salts, and the like can be used. Further, as the phosphonic acid compound, diethylenetriamine pentamethylene phosphonic acid, phosphonoglycolic acid, hydroxyethyl dimethylene phosphonic acid, amino trimethylene phosphonic acid, hydroxyethane phosphonic acid, ethylenediamine tetramethylene phosphonic acid, hexamethylenediamine tetramethylene phosphonic acid, and the like, and ammonium salts, amine salts, sodium salts, potassium salts, and the like thereof can be used. Among the above chelating compounds, tricarboxylic acids and/or salts thereof, polyaminocarboxylic acid compounds, and the like can be more preferably used.
The content of the acid and/or the salt thereof in the polishing composition for fluorophosphate glass is preferably 0.01 to 10% by mass, more preferably 0.05 to 8% by mass, from the viewpoint of adjusting the pH (25 ℃) of the polishing composition for fluorophosphate glass to a set value. By setting the polishing rate to 0.01 mass% or more, the polishing rate can be increased. By setting the content to 10 mass% or less, blurring of the surface of the polished base plate can be suppressed.
1.4 Water
The water contained as one component of the polishing composition of the present embodiment is preferably pure water, ultrapure water, distilled water, or the like, as a medium for dispersing the other components of the polishing composition. In order to smoothly disperse other components of the polishing composition, an organic medium such as alcohol may be contained in an appropriate amount.
1.5 physical Properties of abrasive composition
The pH (25 ℃) of the polishing composition of this embodiment is in the range of 1.0 to 9.0, preferably in the range of 2.0 to 8.0. When the pH (25 ℃) is less than 1.0, there is a concern that the surface of the substrate after the polishing step may be blurred; when the pH (25 ℃) exceeds 9.0, the polishing rate may be lowered. Here, the pH (25 ℃) means the pH at 25 ℃.
2. Method for polishing fluorophosphate glass
In the case of polishing a fluorophosphate glass using the polishing composition of the present embodiment, various conventionally known polishing methods can be appropriately selected. For example, a predetermined amount of the abrasive composition is put into a supply container provided in a grinder. The polishing composition is dropped from the supply container through a nozzle and a pipe onto a polishing pad attached to a platen of a polishing machine, and the polishing surface of the object to be polished is polished by rotating the platen at a predetermined rotation speed while pressing the polishing surface of the object to be polished against the polishing pad.
The polishing pad may be a nonwoven fabric, a polyurethane foam, a porous resin, a non-porous resin, or the like, which are commonly used in polishing. Further, in order to promote the supply of the polishing composition to the polishing pad or to cause the polishing composition to stay on the polishing pad in a predetermined amount, various grooves such as a lattice, concentric or spiral groove may be formed in the pad surface of the polishing pad.
Examples
The present application will be further described below based on examples, but the present application is not limited to these examples. In addition, in the present application, various changes and modifications may be made based on the knowledge of those skilled in the art without departing from the gist of the present application, except for the following examples.
Each of examples 1 to 10 and comparative examples 1 to 4 shown below is a result of performing a predetermined polishing test using a polishing slurry composition for polishing (a composition for polishing a fluorophosphate glass) containing the materials and the addition amounts of the fluorophosphate glass described in table 1. Further, the results of the polishing test are shown in table 2.
In tables 1 and 2, "AM" represents acrylamide, "MAA" represents methacrylic acid, "AA" represents acrylic acid, "EDTA2N" represents ethylenediamine tetraacetic acid diammonium, "EDTA 3K" represents ethylenediamine tetraacetic acid tripotassium, and "citric acid 2N" represents citric acid diammonium hydrogen. In addition, MW is an abbreviation for weight average molecular weight.
(1) Synthesis of Water-soluble Polymer Compound
The details of the synthetic procedures of the water-soluble polymer compounds used in examples 1 to 10 and comparative examples 1 to 4 are as follows.
Synthesis example 1
Into a four-necked flask equipped with a thermometer, a reflux condenser and a nitrogen gas inlet tube, 100 parts by mass of acrylamide (95 mol% based on the total molar sum of vinyl monomers), 6.3 parts by mass of methacrylic acid (5 mol%), 5.3 parts by mass of isopropyl alcohol and 400 parts by mass of ion-exchanged water were charged, and nitrogen gas was introduced to remove oxygen in the reaction system. The temperature in the reaction system was adjusted to 40℃and 0.3 parts by mass of ammonium persulfate and 0.2 parts by mass of sodium hydrogensulfite as polymerization initiators were charged with stirring. The start of polymerization was confirmed by heat generation, and after the reaction solution temperature reached 90 ℃, the reaction solution was kept at that temperature for 2 hours. After completion of the polymerization, 5.5 parts by mass of a 48% aqueous sodium hydroxide solution and 11 parts by mass of ion-exchanged water were charged to obtain an aqueous solution of a carboxyl group-containing polyacrylamide having a pH value (25 ℃) of 7.5 and a polymer concentration of 20%. The composition of the obtained water-soluble polymer compound was acrylamide/methacrylic acid=95/5 (mol%), and the weight average molecular weight was 1,400,000.
Synthesis example 2
Into a four-necked flask equipped with a thermometer, a reflux condenser and a nitrogen gas inlet tube, 100 parts by mass of acrylamide (95 mol% based on the total molar sum of vinyl monomers), 5.3 parts by mass of acrylic acid (5 mol%), 5.3 parts by mass of isopropyl alcohol and 400 parts by mass of ion-exchanged water were charged, and nitrogen gas was introduced to remove oxygen in the reaction system. The temperature in the reaction system was adjusted to 40℃and 0.3 parts by mass of ammonium persulfate and 0.2 parts by mass of sodium hydrogensulfite as polymerization initiators were charged with stirring. The start of polymerization was confirmed by heat generation, and after the reaction solution temperature reached 90 ℃, the reaction solution was kept at that temperature for 2 hours. After completion of the polymerization, 5.5 parts by mass of a 48% aqueous sodium hydroxide solution and 11 parts by mass of ion-exchanged water were charged to obtain an aqueous solution of a carboxyl group-containing polyacrylamide having a pH value (25 ℃) of 7.5 and a polymer concentration of 20%. The composition of the obtained water-soluble polymer compound was acrylamide/acrylic acid=95/5 (mol%), and the weight average molecular weight was 900,000.
Synthesis example 3
Acrylic acid was used instead of acrylamide used in the above synthesis example 2 to carry out homopolymerization of acrylic acid. The obtained water-soluble polymer compound was an acrylic acid homopolymer, and the weight average molecular weight was 12,000.
(2) Preparation of abrasive compositions
(abrasive composition of example 1)
Commercial colloidal silica slurry (average particle diameter (D50) =40 nm, silica concentration=40 mass%), the water-soluble polymer compound synthesized in synthesis example 1, and ethylenediamine tetraacetic acid diammonium (EDTA 2N) were diluted with pure water so as to have the concentrations shown in table 1, and the resulting mixture was added and stirred and mixed to homogenize the mixture, and the resulting mixture was used as the polishing composition of example 1 for polishing test.
(abrasive composition of example 2)
The water-soluble polymer compound synthesized in Synthesis example 2 was used in place of the water-soluble polymer compound of Synthesis example 1 used in the preparation of the abrasive composition of example 1. Except for this, the polishing composition of example 2 was used in the polishing test in the same manner as in example 1.
(abrasive composition of example 3)
The water-soluble polymer compound synthesized in Synthesis example 3 was used in place of the water-soluble polymer compound of Synthesis example 1 used in the preparation of the abrasive composition of example 1. Except for this, the polishing composition of example 3 was used in the polishing test in the same manner as in example 1.
(abrasive composition of example 4)
Propylene glycol alginate was used instead of the water-soluble polymer compound of synthesis example 1 used in the preparation of the abrasive composition of example 1. Except for this, the polishing composition of example 4 was used in the polishing test in the same manner as in example 1.
(abrasive composition of example 5)
Instead of the commercial colloidal silica slurry used in the preparation of the abrasive composition of example 1, a colloidal silica slurry having an average particle diameter (D50) =110 nm and a silica concentration=40 mass% (average particle diameter (D50) =40 nm and a silica concentration=40 mass%). Except for this, the polishing composition of example 5 was used in the polishing test in the same manner as in example 1.
(abrasive composition of example 6)
Diammonium hydrogen citrate (citric acid 2N) was used in place of diammonium ethylenediamine tetraacetate (EDTA 2N) used in the preparation of the abrasive composition of example 1. Except for this, the polishing composition of example 6 was used in the polishing test in the same manner as in example 1.
(abrasive composition of example 7)
The concentration of the water-soluble polymer compound used in the preparation of the polishing composition of example 1 was changed to 1.5 mass%. Except for this, the polishing composition of example 7 was used in the polishing test in the same manner as in example 1.
(abrasive composition of example 8)
Phosphoric acid having a concentration (pH (25 ℃) of 1.4 as described in Table 1 was used in place of diammonium ethylenediamine tetraacetate (EDTA 2N) used in the preparation of the abrasive composition of example 1. Except for this, the polishing composition of example 8 was used in the polishing test in the same manner as in example 1.
(abrasive composition of example 9)
The concentration of ethylenediamine tetraacetic acid diammonium (EDTA 2N) used in the preparation of the abrasive composition of example 1 was changed to the concentration described in table 1 (concentration at pH (25 ℃) of 8.5). Except for this, the polishing composition of example 9 was used in the polishing test in the same manner as in example 1.
(abrasive composition of example 10)
The concentration of phosphoric acid used in the preparation of the abrasive composition of example 8 was changed to the concentration shown in Table 1 (concentration at pH (25 ℃ C.) of 2.5). Except for this, the polishing composition of example 10 was used in the polishing test in the same manner as in example 8.
(abrasive composition of comparative example 1)
Commercially available cerium oxide slurries (average particle diameter=300 nm, solid concentration=20% by mass) were diluted with pure water to prepare the concentrations shown in table 1, and the obtained products were used as polishing compositions of comparative example 1 for polishing experiments.
(abrasive composition of comparative example 2)
Commercial colloidal silica slurries (average particle diameter (D50) =40 nm, silica concentration=40% by mass) and ethylenediamine tetraacetic acid diammonium (EDTA 2N) were diluted with pure water so as to have the concentrations shown in table 1, added thereto, stirred and mixed to homogenize the resulting slurry, and the resulting slurry was used as an abrasive composition of comparative example 2 for an abrasion test.
(abrasive composition of comparative example 3)
The phosphoric acid used in the preparation of the polishing composition of example 8 was replaced with sulfuric acid to have the concentration shown in Table 1 (concentration at pH (25 ℃ C.) of 0.5). Except for this, the polishing composition of comparative example 3 was used in the polishing test in the same manner as in example 8.
(polishing composition of comparative example 4)
The diammonium ethylenediamine tetraacetate (EDTA 2N) used in the preparation of the polishing composition of example 9 was replaced with tripotassium ethylenediamine tetraacetate (EDTA 3K) to give the concentrations (pH (25 ℃) of 9.5 described in table 1. Except for this, the polishing composition of comparative example 4 was used in the polishing test in the same manner as in example 9.
TABLE 1
TABLE 2
(particle size of colloidal silica)
The particle diameter (Heywood diameter) of the colloidal silica was measured as Heywood diameter (projected area equivalent circle diameter) by taking a photograph of a field of View at a magnification of 10 ten thousand times using a Transmission Electron Microscope (TEM) (manufactured by japan electronics, JEM2000FX (200 kV)) and analyzing the photograph using analysis software (manufactured by Mountech, mac-View ver 4.0). The average particle size of the colloidal silica was about 2000 particles of the colloidal silica analyzed by the above method, and the average particle size (D50) of 50% of the cumulative particle size distribution (cumulative volume basis) from the small particle size side was calculated by using the above analysis software (Mac-View ver 4.0).
(grinding conditions)
Polishing tests using a polishing apparatus were performed on the polishing compositions of examples 1 to 10 and comparative examples 1 to 4. The grinding conditions used for the grinding test are as follows.
Grinding machine: double-sided grinder (SPEED FAM 6B-5P-II)
A substrate: fluorophosphate glass substrate x 3 sheet
(76 mm. Times.76 mm square, 0.9mm thickness)
Polishing pad: 2900W (suede leather with XY groove)
Platform rotational speed: 50rpm
Processing pressure: 63g/cm 2
The processing time is as follows: 20min
The amount of the abrasive composition supplied: 200ml/min (circulation mode)
(method for measuring polishing Rate)
The thickness of the substrate before the start of polishing and the thickness of the substrate after polishing were measured using a micrometer (measurement accuracy: 1 μm, manufactured by Mitutoyo Co., ltd.), whereby the polishing rate (μm/min) was measured. In the polishing compositions of examples and comparative examples, 3 substrates to be polished were polished simultaneously, and the polishing rate was described as an average value of the 3 substrates.
(method for evaluating the surface of a polished substrate for blurring)
The surface of the polished substrate was irradiated with LIGHT of a spotlight (ECO LIGHT 3 kaleidos manufactured by yota corporation) and visually judged by reflection observation based on the following evaluation conditions. The determination means an overall determination of 3 substrates polished simultaneously.
Fuzzy evaluation condition
And (2) the following steps: no ambiguity
Delta: with a part of blurring
X: with blurring over the whole surface
(method for evaluating damage to a substrate surface after polishing)
Damage to the surface of the polished substrate was evaluated by using an ultra-fine defect high-speed visual macro inspection apparatus (Wacom Manufacturing co., ltd., W-SCOPE WUV). In the concave defect generated on the substrate surface, the length ratio shows "5 or more: defects having a ratio of 1' and a width of 5 μm or more were regarded as lesions. The determination means an average value of 6 surfaces per 1 surface based on 3 substrates polished simultaneously.
Evaluation condition of damage to substrate surface
And (2) the following steps: no damage (0/substrate per 1 side)
Delta: slightly damaged (1-4/substrate per 1 side)
X: with multiple lesions (more than 5 per substrate per 1 side)
(consider
The polishing composition using the colloidal silica abrasive particles of comparative example 2 had slightly improved blurring of the substrate surface (fluorophosphate glass surface) after polishing, but had a low polishing rate and no improvement in damage to the substrate surface, as compared with the polishing composition using the cerium oxide abrasive particles of comparative example 1. On the other hand, in example 1 in which a water-soluble polymer compound was added to the polishing composition of comparative example 2, the polishing rate was increased, the blurring was improved, and the damage was also improved, as compared with comparative example 2. That is, by adding a water-soluble polymer compound to the polishing composition, improvement of blurring and improvement of damage can be confirmed.
The polishing compositions of examples 2 to 4 are examples in which the types of the water-soluble polymer compounds were changed as compared with the preparation of the polishing composition of example 1. The abrasive composition of example 5 is an example in which colloidal silica abrasive grains having a different average particle diameter (D50) are used as compared with the preparation of the abrasive composition of example 1. On the other hand, the abrasive composition of example 6 is an example in which the acid and/or the salt thereof is changed from EDTA2N to citric acid 2N in the preparation of the abrasive composition of example 1.
The polishing composition of example 7 was an example in which the amount of the water-soluble polymer compound added was changed as compared with the preparation of the polishing composition of example 1.
As is clear from the comparison of the polishing compositions of examples 8 and 10 with the polishing composition of comparative example 3, the blurring and damage of the surface of the fluorophosphate glass after polishing can be improved by setting the pH (25 ℃) of the polishing composition to 1.0 or more.
Further, as is clear from the comparison of the polishing composition of example 9 with the polishing composition of comparative example 4, the blurring and damage of the substrate surface after polishing can be improved by setting the pH (25 ℃) of the polishing composition to 9.0 or less.
As described above, it was found that polishing of the fluorophosphate glass by using the polishing composition of the present application can confirm an improvement in polishing rate and suppress occurrence of blurring and damage on the surface of the polished fluorophosphate glass.
Industrial applicability
The polishing composition (polishing composition for fluorophosphate glass) of the present application can be suitably used for polishing lenses for digital cameras or fluorophosphate glasses used in camera sections built in smart phones.
Claims (10)
1. An abrasive composition for fluorophosphate glass, which comprises silica, a water-soluble polymer compound, an acid and/or a salt thereof, and water,
the pH at 25℃is in the range of 1.0 to 9.0.
2. The polishing composition for fluorophosphate glass according to claim 1, wherein said silica is colloidal silica having an average particle diameter D50 in the range of 10nm to 200 nm.
3. The polishing slurry composition for fluorophosphate glass according to claim 1 or 2, wherein the water-soluble polymer compound is a polysaccharide and/or a polymer having a structural unit derived from an unsaturated amide.
4. The polishing composition for fluorophosphate glass according to any one of claims 1 to 3, wherein the acid and/or salt thereof is an inorganic acid and/or salt thereof.
5. The polishing composition for fluorophosphate glass according to any one of claims 1 to 3, wherein the acid and/or salt thereof is an organic acid and/or salt thereof.
6. The polishing composition for fluorophosphate glass according to claim 3, wherein the polymer having a structural unit derived from an unsaturated amide is a copolymer containing a structural unit derived from (meth) acrylamide and/or N-substituted (meth) acrylamide and a structural unit derived from (meth) acrylic acid and/or a salt thereof.
7. The polishing composition for fluorophosphate glass according to claim 4, wherein said inorganic acid and/or salt thereof is a phosphorus-containing inorganic acid and/or salt thereof.
8. The polishing slurry composition for fluorophosphate glass according to claim 5, wherein said organic acid and/or salt thereof is a chelating compound.
9. The polishing composition for fluorophosphate glass according to claim 8, wherein said chelating compound is at least 1 selected from the group consisting of a dicarboxylic acid and/or a salt thereof, a tricarboxylic acid and/or a salt thereof, a polyaminocarboxylic acid-based compound, and a phosphonic acid-based compound.
10. A polishing method using the polishing composition for fluorophosphate glass, characterized in that the polishing composition for fluorophosphate glass according to any one of claims 1 to 9 is used to polish fluorophosphate glass.
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| JP2020-210465 | 2020-12-18 | ||
| JP2020210465A JP2022097085A (en) | 2020-12-18 | 2020-12-18 | Polishing agent composition for fluorophosphate glasses, and polishing method using polishing agent composition for fluorophosphate glasses |
| PCT/JP2021/040427 WO2022130813A1 (en) | 2020-12-18 | 2021-11-02 | Polishing agent composition for fluorophosphate glasses, and polishing method using polishing agent composition for fluorophosphate glasses |
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| CN (1) | CN116615306A (en) |
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| JP2005213091A (en) * | 2004-01-29 | 2005-08-11 | Hoya Corp | Method for manufacturing glass optical element |
| KR20180095846A (en) * | 2015-12-16 | 2018-08-28 | 로디아 오퍼레이션스 | Method for polishing a phosphate glass or fluorophosphate glass substrate |
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