CN116613090A - Temperature control system and adjusting method - Google Patents
Temperature control system and adjusting method Download PDFInfo
- Publication number
- CN116613090A CN116613090A CN202310560280.0A CN202310560280A CN116613090A CN 116613090 A CN116613090 A CN 116613090A CN 202310560280 A CN202310560280 A CN 202310560280A CN 116613090 A CN116613090 A CN 116613090A
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- CN
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- Prior art keywords
- interface
- temperature
- water
- magnetic fluid
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000011553 magnetic fluid Substances 0.000 claims abstract description 63
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 63
- 239000000498 cooling water Substances 0.000 claims abstract description 43
- 238000001816 cooling Methods 0.000 claims abstract description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 29
- 229910052757 nitrogen Inorganic materials 0.000 claims description 15
- 238000010926 purge Methods 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000000151 deposition Methods 0.000 abstract description 9
- 239000007789 gas Substances 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 11
- 230000008021 deposition Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17D—PIPE-LINE SYSTEMS; PIPE-LINES
- F17D1/00—Pipe-line systems
- F17D1/08—Pipe-line systems for liquids or viscous products
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17D—PIPE-LINE SYSTEMS; PIPE-LINES
- F17D3/00—Arrangements for supervising or controlling working operations
- F17D3/01—Arrangements for supervising or controlling working operations for controlling, signalling, or supervising the conveyance of a product
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a temperature control system and an adjusting method, wherein the system comprises magnetic fluid, a flange and a temperature sensor, wherein the magnetic fluid is fixed on the bottom surface of a flange positioned outside a process chamber; the magnetic fluid is positioned in a cooling area formed by the cooling water pipe; the cooling water pipe is communicated with a first water pipe for water inflow and a second water pipe for water return; the cooling water pipe is provided with a thermocouple I and a three-way valve, and the thermocouple I and the three-way valve are used for controlling the on-off of cooling water at the cooling water pipe, and comprise an interface A, an interface B and an interface C, wherein the interface A is connected with a water inlet pipe, the interface B is communicated with a first water pipe, and the interface C is communicated with a second water pipe; the output end of the second water pipe is connected with the water inlet end of the water return pipe; and the heater is used for controlling the temperature of the flange, is fixed on the bottom surface of the flange, and is provided with a second thermocouple. The invention solves the problems of viscosity reduction and magnetic property reduction of the magnetic fluid caused by temperature rise; and the specific area is heated by the bottom flange heater, so that the process gas is prevented from depositing at the bottom of the assembly due to the excessively low temperature.
Description
Technical Field
The invention belongs to the technical field of semiconductor equipment, and particularly relates to a temperature control system and a temperature control method.
Background
The heat treatment equipment is important process treatment equipment in the semiconductor manufacturing process, and the wafer boat rotating and lifting assembly has the function of conveying wafers into a heating furnace for processing.
The magnetic fluid seal is an important structure in the rotation and lifting of the wafer boat, the magnetic fluid has the characteristic of viscosity reduction along with the temperature rise, the viscosity reduction can lead to the magnetic reduction of the magnetic fluid, and the sealing capability and the service life can be reduced. When the temperature is too high, the performance of the magnetic fluid can be completely disabled, and the service life of the equipment is reduced.
Meanwhile, the process gas in the heat treatment equipment needs to work under the condition of a certain temperature, and if the temperature is lower than a certain threshold value, the deposition of the process gas can be generated in the equipment, so that the performance of the equipment and the use of the equipment are affected.
In order to ensure the performance and the service life of the magnetic fluid when the temperature of the working environment is increased and prevent the gas deposition at the bottom of the wafer boat rotating and lifting assembly caused by the too low temperature, a temperature control system suitable for the semiconductor heat treatment equipment is needed.
Disclosure of Invention
The invention aims to provide a temperature control system and an adjusting method, which solve the problems of viscosity reduction and magnetic property reduction of magnetic fluid caused by temperature rise. So that the magnetic fluid seal can still maintain the performance under the high-temperature environment. Improves the sealing performance and the service life of the magnetic fluid seal. And the specific area is heated by the bottom flange heater, so that the process gas is prevented from depositing at the bottom of the assembly due to the excessively low temperature.
A temperature control system, comprising:
the magnetic fluid is fixed on the bottom surface of the flange outside the process chamber; the magnetic fluid is positioned in a cooling area formed by the cooling water pipe; the cooling water pipe is communicated with a first water pipe for water inflow and a second water pipe for water return; a thermocouple I is arranged on the cooling water pipe,
the three-way valve is used for controlling the on-off of cooling water at the cooling water pipe and comprises an interface A, an interface B and an interface C, wherein the interface A is connected with a water inlet pipe, the interface B is communicated with the first water pipe, and the interface C is communicated with a second water pipe; the output end of the second water pipe is connected with the water inlet end of the water return pipe;
the heater is used for controlling the temperature of the flange and is fixed on the bottom surface of the flange, and the second thermocouple is arranged on the flange.
Preferably, a flowmeter is arranged on the first water pipe.
Preferably, a valve and a flow switch are arranged on the second water pipe.
Preferably, a nitrogen purging pipeline is arranged on the bottom surface of the flange, the air inlet end of the nitrogen purging pipeline penetrates through the flange and is positioned on the top surface of the process chamber, and the air outlet end of the nitrogen purging pipeline is introduced into the joint of the magnetic fluid and the flange.
A temperature regulation method comprising the steps of:
when the temperature fed back by the thermocouple I is greater than a threshold value, the state of the three-way valve is switched to a non-electrified state, the interface A is communicated with the interface B, and cooling water passes through the water inlet pipe, passes through the three-way valve, reaches a cold water lack pipe near the magnetic fluid, and is discharged from the water return pipe;
when the temperature of the magnetic fluid fed back by the thermocouple I drops to a threshold value II, an interface A of the three-way valve is communicated with an interface C, and cooling water is discharged from a water return pipe after passing through the three-way valve;
when the temperature fed back by the second thermocouple is lower than the third threshold value, the heater starts to work, the temperature of the bottom rises along with the continuous heating of the heater, and when the temperature rises to the fourth threshold value, the heater stops working.
Compared with the prior art, the invention has the advantages that:
(1) The temperature control of the magnetic fluid is realized by controlling the on-off of the circulating cooling water through the state conversion of a three-way valve.
(2) The flow switch is added to detect the cooling water flow of the whole temperature control system, so that the situation that the viscosity of the magnetic fluid is reduced and even the magnetic fluid is completely disabled when the magnetic fluid is in a high-temperature state for a long time is avoided.
(3) The bottom heater is added, the bottom of the assembly is heated while the magnetic fluid is cooled, and the pollution of process gas deposition to the environment in the furnace caused by cooling of circulating water is avoided.
(4) The nitrogen purging structure is newly added, so that the system can purge dead angles in the rotating structure except for the function of temperature control, and process gas deposition is prevented.
Drawings
FIG. 1 is a state diagram of the cooling of a magnetic fluid;
FIG. 2 is a state diagram of the magnetic fluid not being cooled;
FIG. 3 is a bottom view of the flange;
FIG. 4 is a cross-sectional view of a flange;
fig. 5 is a partial view of fig. 4.
The device comprises a 1-three-way valve, a 2-flowmeter, a 3-thermocouple I, a 4-flow switch, a 5-valve, a 6-magnetic fluid, a 7-nitrogen purging pipeline, an 8-thermocouple II and a 9-heater.
Detailed Description
The temperature control system and regulation method of the present invention will be described in more detail below in conjunction with the schematic drawings, in which preferred embodiments of the present invention are shown, it being understood that one skilled in the art may modify the invention described herein while still achieving the advantageous effects of the invention. Accordingly, the following description is to be construed as broadly known to those skilled in the art and not as limiting the invention.
As shown in fig. 1 to 5, a temperature control system is a temperature control device for a wafer boat rotation lifting assembly in a semiconductor heat treatment apparatus.
Specifically, heat in the surrounding area of the magnetic fluid is taken away through the flow of circulating cold water, so that the temperature control of the working environment of the magnetic fluid is realized. And the state of the three-way valve is converted through temperature feedback of a thermocouple arranged near the magnetic fluid. When the temperature of the magnetic fluid is too high, cold water is introduced for circulation, so that the temperature of the magnetic fluid is reduced, and the sealing performance and the service life of the magnetic fluid are ensured. And stopping the cold water from being introduced when the temperature fed back by the thermocouple is lower than the set threshold value, and completing the work of controlling the temperature of the magnetic fluid.
In the process of cooling down the magnetic fluid, the bottom of the wafer rotating and lifting assembly near the magnetic fluid is cooled down, but the process gas is deposited to cause influence when the magnetic fluid is cooled down, so that a heater is arranged at the bottom of the wafer boat rotating and lifting assembly, and the temperature feedback of a thermocouple arranged near the bottom flange is adopted, when the temperature fed back is lower than a threshold value, the bottom flange heater starts to work, the bottom of the rotating and lifting assembly starts to heat up, and when the temperature rises to another temperature, the bottom flange heater stops working, so that the temperature control work of the bottom of the assembly is realized.
The system specifically comprises: the flange, the cooling water pipe, the three-way valve 1 and the heater 9 are used for realizing temperature control by taking away heat nearby the magnetic fluid 6 by means of circulation of cooling water.
The magnetic fluid 6 is fixed on the bottom surface of the flange outside the process chamber; the magnetic fluid 6 is positioned in a cooling area formed by the cooling water pipe; the cooling water pipe is communicated with a first water pipe for water inflow and a second water pipe for water return; the cooling water pipe is provided with a thermocouple I3. The first water pipe is provided with a flowmeter 2. The second water pipe is provided with a valve 5 and a flow switch 4.
Specifically, the state conversion of the three-way valve 1 is performed through the temperature feedback of the thermocouple I3, so that the on-off of cooling water is controlled, and the cooling of the magnetic fluid is realized. Specifically, the control unit of the temperature control system sets a first threshold value for the temperature of the magnetic fluid 6, when the temperature fed back by the first thermocouple 3 is higher than the first threshold value, the temperature control system is started, cooling water is circularly introduced, and ambient heat is taken away through the flow of cold water, so that the temperature of the magnetic fluid is reduced. And setting a threshold value II, and when the temperature of the magnetic fluid 6 is reduced along with the introduction of the cooling water and is lower than the threshold value, switching the three-way valve to a state, stopping the introduction of the cooling water, and ending the temperature control of the magnetic fluid 6.
The flow switch 4 is mainly used for detecting cooling water flow in the temperature control system, and when the flow switch 4 detects that the water flow of the whole loop meets the requirement, the whole temperature control system normally operates. When the flow switch 4 detects that the flow rate of cooling water in the whole loop is lower than the demand due to leakage of a pipeline or other reasons, an alarm signal can be sent out, and related personnel check and maintain the whole control system, so that when the temperature of the magnetic fluid is too high and cooling is needed, the flow rate of circulating cooling water does not meet the demand, the taken heat is insufficient to reduce the temperature of the magnetic fluid, the magnetic fluid is caused to be continuously in a high-temperature environment, the viscosity and the magnetism are reduced along with the rising of the temperature, the performance and the service life of the magnetic fluid are influenced, and even the performance of the magnetic fluid is completely disabled.
The three-way valve 1 is used for controlling the on-off of cooling water at the cooling water pipe and comprises an interface A, an interface B and an interface C, wherein the interface A is connected with a water inlet pipe, the interface B is communicated with a first water pipe, and the interface C is communicated with a second water pipe; the output end of the second water pipe is connected with the water inlet end of the water return pipe.
And the heater 9 is used for controlling the temperature of the flange, is fixed at the bottom of the flange, and is provided with a second thermocouple 8. Specifically, the temperature feedback of the thermocouple II 8 is used for controlling whether the heater 9 works or not, so that the temperature of the area at the bottom of the assembly is kept in a proper range, and the deposition of process gas is avoided.
Specifically, the control unit of the temperature control system sets a threshold value three for the second thermocouple 8, and when the second thermocouple 8 detects that the temperature of the bottom area of the assembly is lower than the threshold value three due to cooling water circulation, the heater 9 starts to work and heat. And a threshold value IV is set for the second thermocouple 8, and when the feedback temperature of the second thermocouple 8 is lower than the threshold value, the heater 9 stops working. The above process is repeated, thereby achieving temperature control of the entire assembly.
A nitrogen purging pipeline 7 is arranged on the bottom surface of the flange, the air inlet end of the nitrogen purging pipeline penetrates through the flange and is positioned on the top surface in the process chamber, and the air outlet end of the nitrogen purging pipeline is introduced into the joint of the magnetic fluid 6 and the flange. The flow path of the nitrogen purge line 7 is shown in fig. 4 and 5. The effect is to purge the region in fig. 5, because the region has a small space, the process gas can permeate into the region and cannot be discharged during the process, so that deposition is caused, and the process gas can drift out during the next process, thereby affecting the quality of the process. Therefore, nitrogen purging is added, nitrogen is continuously introduced, and the process gas is carried out to prevent deposition.
The working principle of the temperature control system is as follows:
as shown in fig. 1, when the temperature fed back by the thermocouple one 3 is greater than the threshold value, the state of the three-way valve 1 is switched to the non-energized state, the interface a is communicated with the interface B, cooling water passes through the water inlet pipe, passes through the three-way valve 1 and the flowmeter 2, reaches the vicinity of the magnetic fluid 6, takes away ambient heat, reduces the temperature of the magnetic fluid 6, and then reaches the water return pipe through the flow switch 4 and the valve 5 to be discharged. Then this stage is repeated, with cooling water being circulated continuously, continuously reducing the temperature of the magnetic fluid 6.
When the temperature of the magnetic fluid fed back by the thermocouple I3 drops to the threshold II, cooling is not needed, the flow direction of cooling water is as shown in fig. 2, the state of the three-way valve 1 is converted from the communication of the interface A and the interface B to the communication of the interface A and the interface C, and the cooling water does not pass through the flowmeter 2 and is sent to the magnetic fluid 6. After passing through the three-way valve 1, the cooling water is directly led to the flow switch 4 and the valve 5 to reach the water return pipe for discharge.
Meanwhile, the temperature of the bottom of the wafer rotating and lifting assembly is reduced along with the circulation of the cooling water of the magnetic fluid, when the temperature fed back by the thermocouple II 8 is lower than the threshold III, the heater 9 starts to work, the temperature of the bottom is also increased along with the continuous heating of the heater 9, and when the temperature is increased to the threshold IV, the bottom reaches the proper temperature, and the heater 9 stops working. From the prior art, it is known that: the flange and the magnetic fluid are part of the wafer rotating and lifting assembly. The flange is equivalent to a mounting plate at the bottom of the wafer lifting assembly, the thermocouple, the heater and the like are fixed on the flange, and the flange is also provided with a nitrogen channel. The magnetic fluid is a magnetohydrodynamic motor, and provides rotating power for the wafer rotating and lifting assembly.
The temperature of the magnetic fluid is gradually increased due to the lack of circulating cooling water, and when the feedback of the thermocouple I3 reaches the threshold value, the circulation of the flow is restarted, so that the temperature of the whole assembly is controlled in a reasonable interval.
The foregoing is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Any person skilled in the art will make any equivalent substitution or modification to the technical solution and technical content disclosed in the invention without departing from the scope of the technical solution of the invention, and the technical solution of the invention is not departing from the scope of the invention.
Claims (5)
1. A temperature control system, comprising:
the magnetic fluid is fixed on the bottom surface of the flange outside the process chamber; the magnetic fluid is positioned in a cooling area formed by the cooling water pipe; the cooling water pipe is communicated with a first water pipe for water inflow and a second water pipe for water return; a thermocouple I is arranged on the cooling water pipe,
the three-way valve is used for controlling the on-off of cooling water at the cooling water pipe and comprises an interface A, an interface B and an interface C, wherein the interface A is connected with a water inlet pipe, the interface B is communicated with the first water pipe, and the interface C is communicated with a second water pipe; the output end of the second water pipe is connected with the water inlet end of the water return pipe;
the heater is used for controlling the temperature of the flange and is fixed on the bottom surface of the flange, and the second thermocouple is arranged on the flange.
2. The temperature control system of claim 1, wherein a flow meter is disposed on the first water line.
3. The temperature control system of claim 1, wherein a valve and a flow switch are provided on the second water line.
4. The temperature control system of claim 1, wherein a nitrogen purge line is mounted on the bottom surface of the flange, the inlet end of the nitrogen purge line extends through the flange and is positioned on the top surface of the process chamber, and the outlet end of the nitrogen purge line extends into the junction of the magnetic fluid and the flange.
5. A temperature regulation method, characterized by comprising the steps of:
when the temperature fed back by the thermocouple I is greater than a threshold value, the state of the three-way valve is switched to a non-electrified state, the interface A is communicated with the interface B, and cooling water passes through the water inlet pipe, passes through the three-way valve, reaches a cold water lack pipe near the magnetic fluid, and is discharged from the water return pipe;
when the temperature of the magnetic fluid fed back by the thermocouple I drops to a threshold value II, an interface A of the three-way valve is communicated with an interface C, and cooling water is discharged from a water return pipe after passing through the three-way valve;
when the temperature fed back by the second thermocouple is lower than the third threshold value, the heater starts to work, the temperature of the bottom rises along with the continuous heating of the heater, and when the temperature rises to the fourth threshold value, the heater stops working.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310560280.0A CN116613090A (en) | 2023-05-18 | 2023-05-18 | Temperature control system and adjusting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310560280.0A CN116613090A (en) | 2023-05-18 | 2023-05-18 | Temperature control system and adjusting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116613090A true CN116613090A (en) | 2023-08-18 |
Family
ID=87677563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310560280.0A Pending CN116613090A (en) | 2023-05-18 | 2023-05-18 | Temperature control system and adjusting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116613090A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60225424A (en) * | 1984-04-23 | 1985-11-09 | Nissin Electric Co Ltd | Wafer fixing construction |
| US5421892A (en) * | 1992-12-25 | 1995-06-06 | Tokyo Electron Kabushiki Kaisha | Vertical heat treating apparatus |
| KR20060114990A (en) * | 2005-05-03 | 2006-11-08 | 삼성전자주식회사 | Semiconductor manufacturing equipment |
| CN101415976A (en) * | 2006-03-31 | 2009-04-22 | 伊格尔工业股份有限公司 | Device for sealing magnetic fluid |
| CN201297390Y (en) * | 2008-11-11 | 2009-08-26 | 中芯国际集成电路制造(上海)有限公司 | Magneto-fluid cooling structure and corresponding magneto-fluid sealing device |
| CN106653661A (en) * | 2017-02-28 | 2017-05-10 | 北京北方华创微电子装备有限公司 | Process door cooling system and cooling method of thermal processing equipment |
| US20200303223A1 (en) * | 2019-03-18 | 2020-09-24 | Tokyo Electron Limited | Temperature measuring mechanism, temperature measuring method, and stage device |
| CN212842913U (en) * | 2020-08-28 | 2021-03-30 | 重庆雅马拓科技有限公司 | Atmosphere furnace cooling pipeline system |
| CN113707575A (en) * | 2020-05-21 | 2021-11-26 | Asm Ip私人控股有限公司 | Flange and apparatus for processing substrate |
-
2023
- 2023-05-18 CN CN202310560280.0A patent/CN116613090A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60225424A (en) * | 1984-04-23 | 1985-11-09 | Nissin Electric Co Ltd | Wafer fixing construction |
| US5421892A (en) * | 1992-12-25 | 1995-06-06 | Tokyo Electron Kabushiki Kaisha | Vertical heat treating apparatus |
| KR20060114990A (en) * | 2005-05-03 | 2006-11-08 | 삼성전자주식회사 | Semiconductor manufacturing equipment |
| CN101415976A (en) * | 2006-03-31 | 2009-04-22 | 伊格尔工业股份有限公司 | Device for sealing magnetic fluid |
| CN201297390Y (en) * | 2008-11-11 | 2009-08-26 | 中芯国际集成电路制造(上海)有限公司 | Magneto-fluid cooling structure and corresponding magneto-fluid sealing device |
| CN106653661A (en) * | 2017-02-28 | 2017-05-10 | 北京北方华创微电子装备有限公司 | Process door cooling system and cooling method of thermal processing equipment |
| US20200303223A1 (en) * | 2019-03-18 | 2020-09-24 | Tokyo Electron Limited | Temperature measuring mechanism, temperature measuring method, and stage device |
| CN113707575A (en) * | 2020-05-21 | 2021-11-26 | Asm Ip私人控股有限公司 | Flange and apparatus for processing substrate |
| CN212842913U (en) * | 2020-08-28 | 2021-03-30 | 重庆雅马拓科技有限公司 | Atmosphere furnace cooling pipeline system |
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