CN116604421B - Thinning machine collision detection method and device and thinning machine - Google Patents

Thinning machine collision detection method and device and thinning machine Download PDF

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Publication number
CN116604421B
CN116604421B CN202310897217.6A CN202310897217A CN116604421B CN 116604421 B CN116604421 B CN 116604421B CN 202310897217 A CN202310897217 A CN 202310897217A CN 116604421 B CN116604421 B CN 116604421B
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China
Prior art keywords
main shaft
turntable
rotation angle
driving motor
rotating speed
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CN202310897217.6A
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Chinese (zh)
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CN116604421A (en
Inventor
任明元
梁春
强彦东
文科
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Suzhou Bohongyuan Equipment Co ltd
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Suzhou Bohongyuan Machinery Manufacturing Co ltd
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Priority to CN202310897217.6A priority Critical patent/CN116604421B/en
Publication of CN116604421A publication Critical patent/CN116604421A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention discloses a thinning machine collision detection method, a device and a thinning machine, comprising the following steps: acquiring an initial preset position of a main shaft based on a corresponding input instruction, and controlling the main shaft to reach the initial preset position; the rotary table is controlled to rotate at least one circle at a first preset rotating speed, and the first preset rotating speed is lower than the normal working rotating speed of the rotary table; acquiring a first rotation angle of the main shaft in real time in the rotating process of the turntable, wherein the first rotation angle is a rotation angle in a static state at the initial preset position relative to the main shaft; and determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the rotation angle of the main shaft in the static state of the initial preset position is 0 degrees and the first rotation angle is not 0 degrees. And whether collision occurs between the grinding wheel below the main shaft and the wafer above the turntable is judged through software control, other equipment is not required to be added, and the measuring precision is high.

Description

Thinning machine collision detection method and device and thinning machine
Technical Field
The invention relates to the technical field of wafer thinning machines, in particular to a thinning machine collision detection method and device and a thinning machine.
Background
The wafer thinning machine has a significant position in the whole semiconductor industry chain, and mainly comprises a main shaft and a rotary table, wherein during processing, a wafer is firstly placed on the rotary table with a sucker, and the sucker adsorbs the wafer; the main shaft is provided with a thinning grinding wheel, the turntable sucks the wafer to rotate, the grinding wheel rotates at a high speed under the drive of the main shaft, and meanwhile, the main shaft grinding wheel slowly descends under the drive of a main shaft feeding motor, and the wafer is thinned while descending until the wafer is thinned to a required thickness.
There is a problem in that grinding wheel replacement occurs during thinning, and the wafer thickness may be inconsistent. After the grinding wheel is replaced, the grinding wheel is thickened, and under the same standby height, the high-speed descending of the highly-rotated grinding wheel can directly collide with the wafer and the turntable, so that the main shaft and the turntable are damaged. When the thickness of the wafer is inconsistent and higher than that of the wafer to be processed, the spindle grinding wheel can also directly collide with the machine after being lowered at a high speed, so that the machine is damaged. Controlling the relative heights of the spindle and wafer is critical to protecting the spindle.
For the above phenomena, in the related art, an in-line thickness gauge is generally introduced to detect the thickness of a wafer, and then the standby height of the spindle is controlled in real time. However, in fact, the thickness gauge is affected by some external factors, the accuracy of the thickness gauge must be guaranteed to be 100%, and the thickness gauge can only detect the thickness of the wafer on the turntable and cannot detect the difference between the stand-by position of the spindle and the height of the wafer. Even if the wafer thickness is accurate, improper spindle standby position setting can result in a striker.
Disclosure of Invention
The invention provides a method and a device for detecting the collision of a thinning machine and the thinning machine, which judge whether collision occurs between a grinding wheel below a main shaft and a wafer above a turntable or not through software control, and can save cost and have high measurement precision without adding other detection equipment.
In a first aspect, an embodiment of the present invention provides a method for detecting a collision of a thinning machine, including:
acquiring an initial preset position of a main shaft based on a corresponding input instruction, and controlling the main shaft to reach the initial preset position;
the rotary table is controlled to rotate at least one circle at a first preset rotating speed, and the first preset rotating speed is lower than the normal working rotating speed of the rotary table;
acquiring a first rotation angle of the main shaft in real time in the rotating process of the turntable, wherein the first rotation angle is a rotation angle in a static state at the initial preset position relative to the main shaft;
and determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the rotation angle of the main shaft in the static state of the initial preset position is 0 degrees and the first rotation angle is not 0 degrees.
Optionally, the acquiring, in real time, the first rotation angle of the spindle includes:
Acquiring a second rotation angle of a first driving motor in real time, wherein the first driving motor is a motor for driving the main shaft to rotate;
and obtaining a difference value between the second rotation angle and the zero position angle of the first driving motor as the first rotation angle, wherein the zero position angle of the first driving motor is the motor angle when the main shaft is positioned at the initial preset position, and the zero position angle and the second rotation angle are read through an encoder in the first driving motor.
Optionally, the method for detecting the collision of the thinning machine further comprises the following steps: and when the first rotation angle is 0 degrees, preliminarily determining that no collision occurs between the grinding wheel below the main shaft and the wafer above the turntable.
Optionally, after preliminarily determining that no collision occurs between the grinding wheel below the spindle and the wafer above the turntable, the method further comprises:
controlling the main shaft to rotate at least one circle at a second preset rotating speed, wherein the second preset rotating speed is lower than the normal working rotating speed of the main shaft;
acquiring torque of a first driving motor in real time, wherein the first driving motor is a motor for driving the main shaft to rotate; the torque of the first drive motor is read by an encoder in the first drive motor;
And when the torque of the first driving motor is larger than the torque when the first driving motor rotates at the second preset rotating speed in an idle mode, determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable.
Optionally, after determining that a collision occurs between the grinding wheel below the spindle and the wafer above the turntable, the method further includes:
and controlling an alarm to alarm, controlling the main shaft and the rotary table to stop rotating, resetting the initial preset position of the main shaft before the main shaft moves to the initial preset position next time, and performing collision detection again.
Optionally, the spindle is an air spindle.
In a second aspect, an embodiment of the present invention further provides a device for detecting a collision of a thinning machine, which is configured to implement the method for detecting a collision of a thinning machine according to the first aspect, including:
the initial preset position control module is used for acquiring an initial preset position of the main shaft based on a corresponding input instruction and controlling the main shaft to reach the initial preset position;
the turntable control module is used for controlling the turntable to rotate at least one circle at a first preset rotating speed, and the first preset rotating speed is lower than the normal working rotating speed of the turntable;
The first rotation angle acquisition module is used for acquiring a first rotation angle of the main shaft in real time in the rotation process of the turntable, wherein the first rotation angle is a rotation angle in a static state at the initial preset position relative to the main shaft;
and the collision determining module is used for determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the first rotation angle is not 0 degrees, and the rotation angle of the main shaft in the static state of the initial preset position is 0 degrees.
In a third aspect, an embodiment of the present invention further provides another method for detecting a collision of a thinning machine, including:
acquiring an initial preset position of a main shaft based on a corresponding input instruction, and controlling the main shaft to reach the initial preset position;
controlling the main shaft to rotate at least one circle at a second preset rotating speed, wherein the second preset rotating speed is lower than the normal working rotating speed of the main shaft;
acquiring a third rotation angle of the turntable in real time in the rotation process of the main shaft, wherein the third rotation angle is a rotation angle in a static state at an initial position relative to the turntable;
when the rotation angle of the turntable in a static state at an initial position is 0 degrees and the third rotation angle is not 0 degrees, determining that the grinding wheel below the main shaft collides with the wafer above the turntable; when the third rotation angle is 0 degrees, preliminarily determining that no collision occurs between the grinding wheel below the main shaft and the wafer above the turntable;
Or in the rotating process of the main shaft, acquiring the torque of a first driving motor for driving the main shaft in real time, determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the torque of the first driving motor is larger than the torque when the first driving motor rotates at the second preset rotating speed in an idle mode, and primarily determining that collision does not occur between the grinding wheel below the main shaft and the wafer above the turntable when the torque of the first driving motor is smaller than or equal to the torque when the first driving motor rotates at the second preset rotating speed in an idle mode.
Optionally, after preliminarily determining that no collision occurs between the grinding wheel below the spindle and the wafer above the turntable, the method further comprises:
controlling the rotary table to rotate at least one circle at a first preset rotating speed, wherein the first preset rotating speed is lower than the normal working rotating speed of the rotary table;
and acquiring the torque of a first driving motor for driving the main shaft in real time, determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the torque of the first driving motor is larger than the torque at the idle rotation at the second preset rotating speed, and determining that no collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the torque of the first driving motor is smaller than or equal to the torque at the idle rotation at the second preset rotating speed.
Optionally, the acquiring, in real time, the third rotation angle of the turntable includes:
acquiring a fourth rotation angle of a second driving motor in real time, wherein the second driving motor is a motor for driving the turntable to rotate;
and obtaining a difference value between the fourth rotation angle and a zero position angle of the second driving motor as the third rotation angle, wherein the zero position angle of the second driving motor is a motor angle when the turntable is positioned at an initial position, and the zero position angle and the fourth rotation angle are read through an encoder in the second driving motor.
In a fourth aspect, an embodiment of the present invention further provides a thinning machine, including: the device comprises a main shaft, a turntable, a first driving motor, a second driving motor, a third driving motor, an alarm and a controller;
the first driving motor is used for driving the main shaft to rotate, the second driving motor is used for driving the rotary table to rotate, the third driving motor is used for driving the first driving motor and the main shaft to move towards the rotary table, the tail end of the main shaft is used for installing a grinding wheel, the surface of the rotary table is used for adsorbing wafers, the controller is respectively and electrically connected with the first driving motor, the second driving motor, the third driving motor and the alarm, and before the thinning machine starts to process the wafers, the controller is used for executing the detection method of the thinning machine collision machine according to any embodiment of the invention.
Optionally, the grinding wheel overlaps with a projection part of the turntable in a direction perpendicular to a central axis of the turntable.
The embodiment of the invention provides a method and a device for detecting collision of a thinning machine and the thinning machine, wherein the control method comprises the following steps: acquiring an initial preset position of a main shaft based on a corresponding input instruction, and controlling the main shaft to reach the initial preset position; the rotary table is controlled to rotate at least one circle at a first preset rotating speed, and the first preset rotating speed is lower than the normal working rotating speed of the rotary table; acquiring a first rotation angle of the main shaft in real time in the rotating process of the turntable, wherein the first rotation angle is a rotation angle in a static state at an initial preset position relative to the main shaft; and determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the first rotation angle is not 0 degrees by taking the rotation angle of the main shaft in the static state of the initial preset position as 0 degrees. According to the embodiment of the invention, whether collision occurs between the grinding wheel below the main shaft and the wafer above the turntable is judged through software control, other detection equipment is not required to be added, the cost can be saved, and the measurement accuracy is high.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the invention or to delineate the scope of the invention. Other features of the present invention will become apparent from the description that follows.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flowchart of a method for detecting a collision of a thinning machine according to an embodiment of the present invention;
FIG. 2 is a flowchart of another method for detecting a collision of a thinning machine according to an embodiment of the present invention;
FIG. 3 is a schematic block diagram of a detecting device for a collision machine of a thinning machine according to an embodiment of the present invention;
FIG. 4 is a schematic block diagram of another detecting device for a thin-film forming machine according to an embodiment of the present invention;
FIG. 5 is a flowchart of another method for detecting a collision of a thinning machine according to an embodiment of the present invention;
FIG. 6 is a flowchart of another method for detecting a collision of a thinning machine according to an embodiment of the present invention;
FIG. 7 is a flowchart of another method for detecting a collision of a thinning machine according to an embodiment of the present invention;
FIG. 8 is a flowchart of another method for detecting a collision of a thinning machine according to an embodiment of the present invention;
FIG. 9 is a flowchart of another method for detecting a collision of a thinning machine according to an embodiment of the present invention;
FIG. 10 is a flowchart of another method for detecting a collision of a thinning machine according to an embodiment of the present invention;
FIG. 11 is a schematic block diagram of another exemplary detection device for a thin-film breaker in accordance with an embodiment of the present invention;
FIG. 12 is a schematic block diagram of another exemplary detection device for a thin film breaker in accordance with an embodiment of the present invention;
fig. 13 is a schematic structural diagram of a thinning machine according to an embodiment of the present invention.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Fig. 1 is a flowchart of a method for detecting a wafer-level thin-film machine collision according to an embodiment of the present invention, where the method may be performed by a thin-film machine collision detection device, and the thin-film machine collision detection device may be implemented in hardware and/or software, and the thin-film machine collision detection device may be configured in a thin-film machine.
As shown in fig. 1, the method specifically includes the following steps:
s110, acquiring an initial preset position of the main shaft based on a corresponding input instruction, and controlling the main shaft to reach the initial preset position.
The initial preset position of the spindle is determined according to the thickness of the wafer to be processed, and the initial preset position is 100-200um higher than the thickness of the wafer to be processed.
S120, controlling the turntable to rotate at least one circle at a first preset rotating speed, wherein the first preset rotating speed is lower than the normal working rotating speed of the turntable.
The first preset rotational speed may be, for example, 1-2r/s.
The control of the turntable to rotate at least one circle at the first preset rotation speed is to prevent the condition of missed inspection caused by uneven wafer surface or wafer placement position.
S130, acquiring a first rotation angle of the main shaft in real time in the rotating process of the turntable, wherein the first rotation angle is a rotation angle in a static state at an initial preset position relative to the main shaft.
And S140, determining that collision occurs between the grinding wheel below the spindle and the wafer above the turntable when the rotation angle of the spindle in the static state at the initial preset position is 0 degrees and the first rotation angle is not 0 degrees.
After the turntable rotates, if the grinding wheel of the main shaft is in contact with the wafer on the turntable, the turntable rotates to drive the main shaft to rotate, so that collision between the grinding wheel below the main shaft and the wafer above the turntable can be determined when the first rotation angle of the main shaft is not 0 degrees.
The technical scheme of the embodiment of the invention firstly obtains the initial preset position of the main shaft based on the corresponding input instruction, and controls the main shaft to reach the initial preset position. Then, the turntable is controlled to rotate at least one circle at a first preset rotating speed, and the first preset rotating speed is lower than the normal working rotating speed of the turntable. And acquiring a first rotation angle of the main shaft in real time in the rotating process of the turntable, wherein the first rotation angle is a rotation angle in a static state at an initial preset position relative to the main shaft. And finally, determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the rotation angle of the main shaft in the static state of the initial preset position is 0 degrees and the first rotation angle is not 0 degrees. Whether collision occurs between the grinding wheel below the main shaft and the wafer above the turntable is judged through software control, the detection step is simple, other detection equipment is not required to be added, the cost can be saved, the measurement accuracy is high, the grinding wheel is in contact with the wafer in the detection process, and the machine can be stopped in time, so that the machine is not damaged further due to the fact that the grinding wheel rotates at a very low speed.
Optionally, on the basis of the foregoing embodiment, acquiring, in real time, the first rotation angle of the spindle includes:
and acquiring a second rotation angle of the first driving motor in real time, wherein the first driving motor is a motor for driving the main shaft to rotate.
And obtaining a difference value between the second rotation angle and a zero angle of the first driving motor as the first rotation angle, wherein the zero angle of the first driving motor is a motor angle when the main shaft is positioned at an initial preset position, and the zero angle and the second rotation angle are read through an encoder in the first driving motor.
When the turntable rotates, if the grinding wheel of the main shaft is contacted with the wafer on the turntable, the turntable rotates to drive the main shaft to rotate, the first driving motor also rotates at the moment, and the encoder in the first driving motor reads the second rotation angle and the zero angle to obtain the first rotation angle of the main shaft, so that whether collision occurs between the grinding wheel below the main shaft and the wafer above the turntable is judged according to the first rotation angle.
In the embodiment of the invention, the difference value between the second rotation angle and the zero angle is read through the encoder in the first driving motor in real time, so that the first rotation angle of the main shaft is obtained, whether collision occurs between the grinding wheel below the main shaft and the wafer above the turntable can be judged without adding other detection equipment, the cost can be saved, and the measuring precision is high.
Fig. 2 is a flowchart of another method for detecting a collision of a thinning machine according to an embodiment of the present invention, optionally, on the basis of the above embodiment, referring to fig. 2, step S130 further includes the following steps:
s141, preliminarily determining that no collision occurs between the grinding wheel below the spindle and the wafer above the turntable when the rotation angle of the spindle in the static state of the initial preset position is 0 degrees and the first rotation angle is 0 degrees.
When the first rotation angle is 0 degrees, the turntable does not drive the grinding wheel to rotate, and the grinding wheel below the main shaft and the wafer above the turntable do not collide. Since the grinding wheel and the wafer are generally overlapped on the projection of the axis, after the wafer above the turntable rotates once, only a part of the grinding wheel passes through, but not all of the grinding wheel, and further, the fact that collision between the grinding wheel below the spindle and the wafer above the turntable does not occur is preliminarily determined.
Optionally, with continued reference to fig. 2 based on the above embodiment, after step S141, the method further includes the following steps:
and S150, controlling the main shaft to rotate at least one circle at a second preset rotating speed, wherein the second preset rotating speed is lower than the normal working rotating speed of the main shaft.
The second preset rotational speed of the spindle may be, for example, 1-2r/s.
The control spindle rotates for one circle at the second preset rotating speed to prevent the condition of missed detection caused by uneven wafer surface or wafer placement position. That is, the wafer is passed through the entirety of the grinding wheel, avoiding missing inspection. At this time, the main shaft and the rotary table are both rotating, and the condition of missed detection is not caused.
S160, acquiring torque of a first driving motor in real time, wherein the first driving motor is a motor for driving a main shaft to rotate; the torque of the first drive motor is read by an encoder in the first drive motor.
And S170, determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the torque of the first driving motor is larger than the torque when the first driving motor rotates at the second preset rotating speed in an idle mode.
It will be appreciated that if the torque of the first drive motor is greater than the torque of the spindle during idle rotation at the second predetermined rotational speed when both the turntable and the spindle are in rotation, indicating contact between the spindle grinding wheel and the wafer on the turntable, it can be determined that a collision between the grinding wheel below the spindle and the wafer above the turntable occurs. The torque can be calculated by the current detected in the encoder, wherein the larger the current is, the larger the torque is. The current of the motor in no-load state can be set as a judgment basis, and when the detected current is larger than the current in no-load state, the collision between the grinding wheel below the spindle and the wafer above the turntable is indicated.
On the basis of the embodiment, if the fact that collision does not occur between the grinding wheel below the main shaft and the wafer above the turntable is preliminarily determined, the main shaft is further controlled to rotate at least one circle at the second preset rotating speed, then the torque of the first driving motor is obtained in real time, whether collision occurs between the grinding wheel below the main shaft and the wafer above the turntable is determined by judging whether the torque of the first driving motor is larger than the torque when the first driving motor rotates at the second preset rotating speed in a no-load mode, and whether collision occurs between the grinding wheel below the main shaft and the wafer above the turntable can be determined without adding other detection equipment, so that cost can be saved, and measurement accuracy can be further improved.
Optionally, with continued reference to fig. 2 based on the above embodiment, after step S140 and step S170, the method further includes the following steps:
s180, controlling an alarm to alarm, controlling the main shaft and the rotary table to stop rotating, resetting the initial preset position of the main shaft before the main shaft moves to the initial preset position next time, and performing collision detection again.
In the embodiment of the invention, after the fact that the grinding wheel below the main shaft collides with the wafer above the turntable is determined, the main shaft and the turntable are controlled to stop rotating, so that damage to equipment can be avoided, the initial preset position of the main shaft is reset before the main shaft moves to the initial preset position next time, collision detection is carried out again, and the probability of collision between the main shaft and the turntable can be reduced.
Optionally, on the basis of the above embodiment, the spindle is an air spindle. Deflection of the spindle is advantageously detected.
Fig. 3 is a schematic block diagram of a detecting device for a collision machine of a thinning machine according to an embodiment of the present invention, for implementing a detecting method for a collision machine of a thinning machine according to any embodiment of the present invention, referring to fig. 3, the device includes: an initial preset position control module 310, a turntable control module 320, a first rotation angle acquisition module 330, and a collision determination module 340.
The initial preset position control module 310 is configured to obtain an initial preset position of the spindle based on a corresponding input instruction, and control the spindle to reach the initial preset position.
The turntable control module 320 is configured to control the turntable to rotate at least one revolution at a first preset rotational speed, where the first preset rotational speed is lower than a normal operating rotational speed of the turntable.
The first rotation angle obtaining module 330 is configured to obtain, in real time, a first rotation angle of the spindle during rotation of the turntable, where the first rotation angle is a rotation angle in a stationary state at an initial preset position relative to the spindle.
The collision determination module 340 is configured to determine that a collision occurs between the grinding wheel below the spindle and the wafer above the turntable when the first rotation angle is not 0 °, and the rotation angle of the spindle in a stationary state at an initial preset position is 0 °.
Fig. 4 is a schematic block diagram of another detecting device for a thin-film forming machine according to an embodiment of the present invention, and optionally, based on the above embodiment, referring to fig. 4, the first rotation angle obtaining module 330 includes: a second rotation angle acquisition unit 331 and a first rotation angle calculation unit 332.
The second rotation angle obtaining unit 331 is configured to obtain a second rotation angle of a first driving motor in real time, where the first driving motor is a motor for driving the spindle to rotate.
The first rotation angle calculating unit 332 is configured to obtain, as the first rotation angle, a difference between the second rotation angle and a zero angle of the first driving motor, where the zero angle of the first driving motor is a motor angle when the spindle is located at an initial preset position, and both the zero angle and the second rotation angle are read by an encoder in the first driving motor.
Optionally, on the basis of the above embodiment, the collision determining module 340 is further configured to preliminarily determine that no collision occurs between the grinding wheel below the spindle and the wafer above the turntable when the first rotation angle is 0 °.
Optionally, with continued reference to fig. 4, the thinning machine-bumping detection device further includes: a spindle control module 350 and a torque acquisition module 360.
The spindle control module 350 is configured to control the spindle to rotate at least one revolution at a second preset rotational speed, where the second preset rotational speed is lower than the normal working rotational speed of the spindle.
The torque obtaining module 360 is configured to obtain, in real time, a torque of a first driving motor, where the first driving motor is a motor that drives the spindle to rotate; the torque of the first drive motor is read by an encoder in the first drive motor.
The collision determination module 340 is further configured to determine that a collision occurs between the grinding wheel below the spindle and the wafer above the turntable when the torque of the first driving motor is greater than the torque when the spindle is idle rotating at the second preset rotational speed.
Optionally, with continued reference to fig. 4, the thinning machine-bumping detection device further includes:
and the alarm control module 370 is used for controlling the alarm to alarm.
The spindle control module 350 and the turntable control module 320 are also used to control the spindle and the turntable to stop rotating after the alarm alarms.
The initial preset position control module 310 is further configured to reset the initial preset position of the spindle and perform collision detection again after the alarm alarms and after the spindle and the turntable stop rotating, before the next spindle moves to the initial preset position.
The detection device for the collision of the thinning machine can execute the detection method for the collision of the thinning machine provided by the embodiment of the application, and has the corresponding functional modules and beneficial effects of the execution method. Technical details not described in detail in the present embodiment may be referred to the method for detecting a collision machine of a thinning machine provided in the above embodiment of the present application. Since the above-described detecting device for a thin-film machine collision according to the above-described embodiment of the present application is a device capable of executing the detecting method for a thin-film machine collision according to the above-described embodiment of the present application, a person skilled in the art will be able to understand the specific implementation of the detecting device for a thin-film machine collision according to the present embodiment and various modifications thereof, so that the detecting method for a thin-film machine collision according to the present application will not be described in detail herein. As long as the person skilled in the art implements the device for detecting the collision machine of the thinning machine in the embodiment of the application, the device is within the scope of protection of the application.
Fig. 5 is a flowchart of another method for detecting a collision of a thinning machine according to an embodiment of the present application, referring to fig. 5, the method includes the following steps:
S410, acquiring an initial preset position of the main shaft based on the corresponding input instruction, and controlling the main shaft to reach the initial preset position.
S420, controlling the main shaft to rotate at least one circle at a second preset rotating speed, wherein the second preset rotating speed is lower than the normal working rotating speed of the main shaft.
S430, acquiring a third rotation angle of the turntable in real time in the rotation process of the main shaft, wherein the third rotation angle is a rotation angle in a static state relative to the turntable at an initial position.
S440, determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the rotation angle of the turntable in the static state at the initial position is 0 degrees and the third rotation angle is not 0 degrees.
S441, the rotation angle of the turntable in the static state of the initial position is 0 degrees, and when the third rotation angle is 0 degrees, the fact that no collision occurs between the grinding wheel below the main shaft and the wafer above the turntable is preliminarily determined.
After the spindle rotates, if the spindle grinding wheel is in contact with the wafer on the turntable, the spindle rotates to drive the turntable to rotate, so that collision between the grinding wheel below the spindle and the wafer above the turntable can be determined when the third rotation angle of the turntable is not 0 degrees.
Fig. 6 is a flowchart of another method for detecting a collision of a thinning machine according to an embodiment of the present invention, optionally, referring to fig. 6, after step S420, the method further includes the following steps:
S431, acquiring torque of a first driving motor for driving the main shaft in real time in the main shaft rotating process.
S442, when the torque of the first driving motor is larger than the torque when the first driving motor rotates at the second preset rotating speed in an idle mode, determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable.
S443, preliminarily determining that no collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the torque of the first driving motor is smaller than or equal to the torque when the first driving motor rotates at the second preset rotating speed in an idle mode.
In the rotation process of the main shaft, the torque of the first driving motor is larger than the torque when the main shaft rotates at the second preset rotating speed in an idle mode, namely that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable, and if the torque of the first driving motor is smaller than or equal to the torque when the main shaft rotates at the second preset rotating speed in an idle mode, namely that collision does not occur between the grinding wheel below the main shaft and the wafer above the turntable.
In the embodiment of the invention, the spindle is controlled to rotate at the first preset speed for one circle, and the third rotation angle of the turntable or the torque of the first driving motor for driving the spindle is acquired in real time in the rotation process of the spindle, so that whether the grinding wheel below the spindle collides with the wafer above the turntable or not can be judged, whether the grinding wheel below the spindle collides with the wafer above the turntable or not can be judged without adding other detection equipment, the cost can be saved, and the measurement precision is high.
Fig. 7 is a flowchart of another method for detecting a collision of a thinning machine according to an embodiment of the present invention, optionally, on the basis of the above embodiment, referring to fig. 7, after step S441, the method further includes the following steps:
s450, controlling the turntable to rotate at least one circle at a first preset rotating speed, wherein the first preset rotating speed is lower than the normal working rotating speed of the turntable.
S460, acquiring the torque of the first driving motor for driving the main shaft in real time.
And S470, determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the torque of the first driving motor is larger than the torque when the first driving motor rotates at the second preset rotating speed in an idle mode.
And S471, when the torque of the first driving motor is smaller than or equal to the torque when the first driving motor rotates at the second preset rotating speed in an idle mode, determining that no collision occurs between the grinding wheel below the main shaft and the wafer above the turntable.
Fig. 8 is a flowchart of another method for detecting a collision of a thinning machine according to an embodiment of the present invention, optionally, on the basis of the above embodiment, referring to fig. 8, after step S443, the method further includes the following steps:
s450, controlling the turntable to rotate at least one circle at a first preset rotating speed, wherein the first preset rotating speed is lower than the normal working rotating speed of the turntable.
S460, acquiring the torque of the first driving motor for driving the main shaft in real time.
And S470, determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the torque of the first driving motor is larger than the torque when the first driving motor rotates at the second preset rotating speed in an idle mode.
And S471, when the torque of the first driving motor is smaller than or equal to the torque when the first driving motor rotates at the second preset rotating speed in an idle mode, determining that no collision occurs between the grinding wheel below the main shaft and the wafer above the turntable.
On the basis of the embodiment, if the fact that collision between the grinding wheel below the main shaft and the wafer above the turntable is not caused is preliminarily determined, the turntable is further controlled to rotate at least one circle at the first preset rotating speed, and whether the torque of the first driving motor is larger than the torque when the turntable rotates at the second preset rotating speed in an idle mode is judged, so that whether collision between the grinding wheel below the main shaft and the wafer above the turntable is caused is judged, whether collision between the grinding wheel below the main shaft and the wafer above the turntable is caused can be judged without adding other detection equipment, cost can be saved, and measurement accuracy can be further improved.
Optionally, on the basis of the foregoing embodiment, obtaining the third rotation angle of the turntable includes: and acquiring a fourth rotation angle of a second driving motor in real time, wherein the second driving motor is a motor for driving the turntable to rotate.
And obtaining a difference value between the fourth rotation angle and a zero position angle of the second driving motor as a third rotation angle, wherein the zero position angle of the second driving motor is a motor angle when the turntable is positioned at the initial position, and the zero position angle and the fourth rotation angle are read through an encoder in the second driving motor.
In the embodiment of the invention, the difference value between the fourth rotation angle and the zero angle is read through the encoder in the second driving motor in real time, so that the third rotation angle of the turntable is obtained, whether collision occurs between the grinding wheel below the main shaft and the wafer above the turntable can be judged without adding other detection equipment, the cost can be saved, and the measurement accuracy is high.
Fig. 9 is a flowchart of another method for detecting a collision of a thinning machine according to an embodiment of the present invention, referring to fig. 9, the method includes the following steps:
s910, acquiring an initial preset position of the main shaft based on the corresponding input instruction, and controlling the main shaft to reach the initial preset position.
S920, controlling the main shaft to rotate at least one circle at a second preset rotating speed, wherein the second preset rotating speed is lower than the normal working rotating speed of the main shaft.
And S931, acquiring a third rotation angle of the turntable in real time in the rotation process of the main shaft, wherein the third rotation angle is a rotation angle in a static state at an initial preset position relative to the turntable.
S941, determining whether the third rotation angle is 0 ° with the rotation angle of the turntable in the stationary state at the initial position being 0 °, if so, executing S950, and if not, executing S951.
S950, preliminarily determining that no collision occurs between the grinding wheel below the spindle and the wafer above the turntable.
S951, determining collision between the grinding wheel below the spindle and the wafer above the turntable.
S961, after S951, controlling an alarm to alarm, controlling the main shaft and the turntable to stop rotating, resetting the initial preset position of the main shaft before the main shaft moves to the initial preset position next time, and detecting collision again.
S960, after S950, controlling the turntable to rotate at least one circle at a first preset rotating speed, wherein the first preset rotating speed is lower than the normal working rotating speed of the main shaft.
S970, acquiring the torque of the first driving motor for driving the main shaft in real time.
S980, judging whether the torque of the first driving motor is larger than the torque at the idle rotation at the second preset rotation speed, if so, executing S951, and if not, executing S990.
S990, determining that no collision occurs between the grinding wheel below the spindle and the wafer above the turntable.
Fig. 10 is a flowchart of another method for detecting a collision of a thinning machine according to an embodiment of the present invention, referring to fig. 10, after step S920, further includes:
S930, acquiring torque of a first driving motor in real time in the rotation process of the main shaft, wherein the first driving motor is a motor for driving the main shaft to rotate.
S940, judging whether the torque of the first driving motor is larger than the torque when the first driving motor rotates at the second preset rotating speed in an idle mode, if so, executing S951, and if not, executing S950.
The embodiment of the invention comprises all the schemes of the embodiment, has the same beneficial effects that whether collision occurs between the grinding wheel below the main shaft and the wafer above the turntable can be judged without adding other detection equipment, so that the collision between the main shaft and the turntable is avoided, the cost can be saved, the measurement precision is high, and the measurement precision is higher on the basis of the embodiment.
Fig. 11 is a schematic block diagram of another detecting device for a thin-film collision machine according to an embodiment of the present invention, and in other embodiments, referring to fig. 11, the device includes: an initial preset position control module 310, a spindle control module 350, a torque acquisition module 360, a collision determination module 340, and a third rotation angle acquisition module 380.
The initial preset position control module 310 is configured to obtain an initial preset position of the spindle based on a corresponding input instruction, and control the spindle to reach the initial preset position.
The spindle control module 350 is configured to control the spindle to rotate at least one revolution at a second preset rotational speed, where the second preset rotational speed is lower than the normal working rotational speed of the spindle.
The third rotation angle obtaining module 380 is configured to obtain, in real time, a third rotation angle of the turntable during rotation of the spindle, where the third rotation angle is a rotation angle in a stationary state relative to the turntable at an initial position.
The collision determining module 340 is configured to determine that a collision occurs between the grinding wheel below the spindle and the wafer above the turntable when the rotation angle of the turntable in the stationary state at the initial position is 0 ° and the third rotation angle is not 0 °; and when the third rotation angle is 0 degrees, preliminarily determining that no collision occurs between the grinding wheel below the spindle and the wafer above the turntable.
The torque acquisition module 360 is configured to acquire torque of the first driving motor driving the spindle in real time during rotation of the spindle.
The collision determination module 340 is further configured to determine that a collision occurs between the grinding wheel below the spindle and the wafer above the turntable when the torque of the first driving motor is greater than the torque when the first driving motor rotates at the second preset rotational speed in an idle mode, and to primarily determine that no collision occurs between the grinding wheel below the spindle and the wafer above the turntable when the torque of the first driving motor is less than or equal to the torque when the first driving motor rotates at the second preset rotational speed in an idle mode.
Fig. 12 is a schematic block diagram of another detecting device for a collision machine of a thinning machine according to an embodiment of the present invention, optionally, referring to fig. 12, on the basis of the foregoing embodiment, the device further includes: turntable control module 320.
The turntable control module 320 controls the turntable to rotate at least one revolution at a first preset rotational speed, which is lower than the normal operating rotational speed of the turntable.
The torque obtaining module 360 is further configured to obtain, in real time, a torque of the first driving motor that drives the spindle, determine that a collision occurs between the grinding wheel below the spindle and the wafer above the turntable when the torque of the first driving motor is greater than the torque when the spindle is idle rotating at the second preset rotational speed, and determine that no collision occurs between the grinding wheel below the spindle and the wafer above the turntable when the torque of the first driving motor is less than or equal to the torque when the spindle is idle rotating at the second preset rotational speed.
Optionally, with continued reference to fig. 12, based on the foregoing embodiment, the third rotation angle obtaining module 380 includes: a fourth rotation angle acquisition unit 381 and a third rotation angle calculation unit 382.
The fourth rotation angle obtaining unit 381 is configured to obtain a fourth rotation angle of a second driving motor in real time, where the second driving motor is a motor for driving the turntable to rotate.
The third rotation angle calculating unit 382 is configured to obtain a difference between the fourth rotation angle and a zero angle of the second driving motor as the third rotation angle, where the zero angle of the second driving motor is a motor angle when the turntable is located at the initial position, and the zero angle and the third rotation angle are all read by an encoder in the second driving motor.
With continued reference to fig. 12, in addition to the above embodiment, the apparatus further includes: and the alarm control module 370 is used for controlling the alarm to alarm.
With continued reference to fig. 12, in addition to the above embodiment, the apparatus further includes: the first rotation angle obtaining module 330, the first rotation angle obtaining module 330 includes: a second rotation angle acquisition unit 331 and a first rotation angle calculation unit 332.
The detecting device for the collision of the thinning machine can execute the detecting method for the collision of the thinning machine provided by any embodiment of the application, and has the corresponding functional modules and beneficial effects of the executing method. Technical details which are not described in detail in the present embodiment can be referred to the detection method of the impact machine of the thinning machine provided in any embodiment of the present application. Since the above-described detecting device for a thin-film machine collision according to the embodiment of the present application is a device capable of executing the detecting method for a thin-film machine collision according to the embodiment of the present application, a person skilled in the art will be able to understand the specific implementation of the detecting device for a thin-film machine collision according to the embodiment of the present application and various modifications thereof, so how to implement the detecting method for a thin-film machine collision according to the embodiment of the present application will not be described in detail herein. As long as the person skilled in the art implements the device for detecting the collision machine of the thinning machine in the embodiment of the application, the device is within the scope of protection of the application.
Fig. 13 is a schematic structural diagram of a thinning machine according to an embodiment of the present invention. As shown in fig. 13, includes: a spindle 1, a turntable 2, a first drive motor 31, a second drive motor 32, a third drive motor 33, an alarm 4 and a controller 5.
The first driving motor 31 is used for driving the spindle 1 to rotate, the second driving motor 32 is used for driving the turntable 2 to rotate, the third driving motor 33 is used for driving the first driving motor 31 and the spindle 1 to move towards the turntable 2, the tail end of the spindle 1 is used for installing the grinding wheel 11, the surface of the turntable 2 is used for adsorbing the wafer 21, the controller 5 is respectively electrically connected with the first driving motor 31, the second driving motor 32, the third driving motor 33 and the alarm 4, and before the wafer 21 is machined by the thinning machine, the controller 5 is used for executing the thinning machine collision machine detection method according to any embodiment of the invention.
Optionally, the grinding wheel 11 overlaps with a projected portion of the turntable 2 in a direction perpendicular to the central axis of the turntable 2.
The final thickness of the thinned wafer is varied from tens to hundreds of micrometers, and the thinning feeding speed is between 0.1um/s and 5 um/s. When the wafer is processed, the main shaft and the rotary table rotate at high speed, and the distance between the main shaft and the rotary table directly determines the thickness reduction of the wafer.
The thinning process is generally divided into a standby height, a P1 height, a P2 height, a P3 height and 4 stages, and the height of the main shaft from the turntable is higher before the process is started. After processing, the spindle is lowered at a relatively high speed of 5mm/s to a standby height, which is typically 100-200um higher than the wafer thickness. Then the P1 is dropped at a speed of 3um/s, the P1 height is basically not contacted with the wafer, the thinning starts at a slower speed (1.2 um/s) after the P2 height is reached, and the thinning starts at a slower speed (0.5 um/s) after the P2 height is reached, the P3 height is further thinned.
The controller 5 in the embodiment of the invention is used for executing the detection method of the collision machine of the thinning machine in any embodiment of the invention, has the same beneficial effects, does not need to add an extra mechanism to detect the height of the grinding wheel, and does not need to add extra equipment cost. All the components are controlled by software, so that the control method is flexible and controllable, and can be flexibly applied to different main shafts and grinding wheels according to different machine types. The damage to equipment caused by careless misoperation of operators is solved. The detection time is short, and the processing beat is not influenced.
With the method in any of the above embodiments, after it is determined that no collision has occurred, normal processing may be performed.
The above embodiments do not limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of the present invention.

Claims (12)

1. The method for detecting the collision of the thinning machine is characterized by comprising the following steps of:
acquiring an initial preset position of a main shaft based on a corresponding input instruction, and controlling the main shaft to reach the initial preset position;
The rotary table is controlled to rotate at least one circle at a first preset rotating speed, and the first preset rotating speed is lower than the normal working rotating speed of the rotary table;
acquiring a first rotation angle of the main shaft in real time in the rotating process of the turntable, wherein the first rotation angle is a rotation angle in a static state at the initial preset position relative to the main shaft;
and determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the rotation angle of the main shaft in the static state of the initial preset position is 0 degrees and the first rotation angle is not 0 degrees.
2. The method of claim 1, wherein the acquiring the first rotation angle of the spindle in real time comprises:
acquiring a second rotation angle of a first driving motor in real time, wherein the first driving motor is a motor for driving the main shaft to rotate;
and obtaining a difference value between the second rotation angle and the zero position angle of the first driving motor as the first rotation angle, wherein the zero position angle of the first driving motor is the motor angle when the main shaft is positioned at the initial preset position, and the zero position angle and the second rotation angle are read through an encoder in the first driving motor.
3. The thinning machine-run-in detection method according to claim 1, further comprising: and when the first rotation angle is 0 degrees, preliminarily determining that no collision occurs between the grinding wheel below the main shaft and the wafer above the turntable.
4. The method of claim 3, further comprising, after initially determining that no collision has occurred between the grinding wheel below the spindle and the wafer above the turntable:
controlling the main shaft to rotate at least one circle at a second preset rotating speed, wherein the second preset rotating speed is lower than the normal working rotating speed of the main shaft;
acquiring torque of a first driving motor in real time, wherein the first driving motor is a motor for driving the main shaft to rotate; the torque of the first drive motor is read by an encoder in the first drive motor;
and when the torque of the first driving motor is larger than the torque when the first driving motor rotates at the second preset rotating speed in an idle mode, determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable.
5. The method according to claim 1 or 4, characterized by further comprising, after determining that collision between the grinding wheel below the spindle and the wafer above the turntable occurs:
And controlling an alarm to alarm, controlling the main shaft and the rotary table to stop rotating, resetting the initial preset position of the main shaft before the main shaft moves to the initial preset position next time, and performing collision detection again.
6. The method of claim 1, wherein the spindle is an air spindle.
7. A thiner-bump detection apparatus, for implementing the thiner-bump detection method according to any one of claims 1 to 6, comprising:
the initial preset position control module is used for acquiring an initial preset position of the main shaft based on a corresponding input instruction and controlling the main shaft to reach the initial preset position;
the turntable control module is used for controlling the turntable to rotate at least one circle at a first preset rotating speed, and the first preset rotating speed is lower than the normal working rotating speed of the turntable;
the first rotation angle acquisition module is used for acquiring a first rotation angle of the main shaft in real time in the rotation process of the turntable, wherein the first rotation angle is a rotation angle in a static state at the initial preset position relative to the main shaft;
and the collision determining module is used for determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the first rotation angle is not 0 degrees, and the rotation angle of the main shaft in the static state of the initial preset position is 0 degrees.
8. The method for detecting the collision of the thinning machine is characterized by comprising the following steps of:
acquiring an initial preset position of a main shaft based on a corresponding input instruction, and controlling the main shaft to reach the initial preset position;
controlling the main shaft to rotate at least one circle at a second preset rotating speed, wherein the second preset rotating speed is lower than the normal working rotating speed of the main shaft;
acquiring a third rotation angle of the turntable in real time in the rotation process of the main shaft, wherein the third rotation angle is a rotation angle in a static state at an initial position relative to the turntable;
when the rotation angle of the turntable in a static state at an initial position is 0 degrees and the third rotation angle is not 0 degrees, determining that the grinding wheel below the main shaft collides with the wafer above the turntable; when the third rotation angle is 0 degrees, preliminarily determining that no collision occurs between the grinding wheel below the main shaft and the wafer above the turntable;
or in the rotating process of the main shaft, acquiring the torque of a first driving motor for driving the main shaft in real time, determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the torque of the first driving motor is larger than the torque when the first driving motor rotates at the second preset rotating speed in an idle mode, and primarily determining that collision does not occur between the grinding wheel below the main shaft and the wafer above the turntable when the torque of the first driving motor is smaller than or equal to the torque when the first driving motor rotates at the second preset rotating speed in an idle mode.
9. The method of claim 8, further comprising, after initially determining that no collision has occurred between the grinding wheel below the spindle and the wafer above the turntable:
controlling the rotary table to rotate at least one circle at a first preset rotating speed, wherein the first preset rotating speed is lower than the normal working rotating speed of the rotary table;
and acquiring the torque of a first driving motor for driving the main shaft in real time, determining that collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the torque of the first driving motor is larger than the torque at the idle rotation at the second preset rotating speed, and determining that no collision occurs between the grinding wheel below the main shaft and the wafer above the turntable when the torque of the first driving motor is smaller than or equal to the torque at the idle rotation at the second preset rotating speed.
10. The thinning machine-hit detection method according to claim 8, wherein the acquiring in real time the third rotation angle of the turntable includes:
acquiring a fourth rotation angle of a second driving motor in real time, wherein the second driving motor is a motor for driving the turntable to rotate;
and obtaining a difference value between the fourth rotation angle and a zero position angle of the second driving motor as the third rotation angle, wherein the zero position angle of the second driving motor is a motor angle when the turntable is positioned at an initial position, and the zero position angle and the fourth rotation angle are read through an encoder in the second driving motor.
11. A thinning machine, comprising: the device comprises a main shaft, a turntable, a first driving motor, a second driving motor, a third driving motor, an alarm and a controller;
the first driving motor is used for driving the main shaft to rotate, the second driving motor is used for driving the rotary table to rotate, the third driving motor is used for driving the first driving motor and the main shaft to move towards the rotary table, the tail end of the main shaft is used for installing a grinding wheel, the surface of the rotary table is used for adsorbing wafers, the controller is respectively and electrically connected with the first driving motor, the second driving motor, the third driving motor and the alarm, and before the thinning machine starts to process the wafers, the controller is used for executing the thinning machine collision detection method according to any one of claims 1-6 and 8-10.
12. The thinning machine of claim 11, wherein the grinding wheel overlaps a projected portion of the turntable in a direction perpendicular to a central axis of the turntable.
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CN115229591A (en) * 2022-08-02 2022-10-25 江苏京创先进电子科技有限公司 Thinning machine and control method thereof
CN218658141U (en) * 2022-12-06 2023-03-21 深圳市长盈精密技术股份有限公司 Wafer thinning machine workbench detecting and repairing system

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