CN116589950B - Electric aluminum hot stamping back adhesive and preparation method thereof - Google Patents
Electric aluminum hot stamping back adhesive and preparation method thereof Download PDFInfo
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- CN116589950B CN116589950B CN202310362011.3A CN202310362011A CN116589950B CN 116589950 B CN116589950 B CN 116589950B CN 202310362011 A CN202310362011 A CN 202310362011A CN 116589950 B CN116589950 B CN 116589950B
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- polystyrene particles
- expandable polystyrene
- hot stamping
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- silicon powder
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- 239000000853 adhesive Substances 0.000 title claims abstract description 28
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 title abstract description 11
- 239000002245 particle Substances 0.000 claims abstract description 143
- 229920006248 expandable polystyrene Polymers 0.000 claims abstract description 118
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 46
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 46
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 45
- 239000002904 solvent Substances 0.000 claims abstract description 14
- 239000000945 filler Substances 0.000 claims abstract description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 219
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 84
- 239000011863 silicon-based powder Substances 0.000 claims description 84
- 238000003756 stirring Methods 0.000 claims description 58
- 238000010438 heat treatment Methods 0.000 claims description 29
- 239000000843 powder Substances 0.000 claims description 29
- 238000002156 mixing Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 229910044991 metal oxide Inorganic materials 0.000 claims description 7
- 150000004706 metal oxides Chemical class 0.000 claims description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 3
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- 239000013557 residual solvent Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 238000005520 cutting process Methods 0.000 abstract description 6
- 238000000926 separation method Methods 0.000 abstract description 5
- 230000009471 action Effects 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 27
- 238000007873 sieving Methods 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- 239000004793 Polystyrene Substances 0.000 description 10
- 238000005054 agglomeration Methods 0.000 description 10
- 230000002776 aggregation Effects 0.000 description 10
- 229920002223 polystyrene Polymers 0.000 description 10
- 238000005303 weighing Methods 0.000 description 10
- 239000003292 glue Substances 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 239000010931 gold Substances 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000004040 coloring Methods 0.000 description 4
- 239000004794 expanded polystyrene Substances 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000010023 transfer printing Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000005030 aluminium foil Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides an electrochemical aluminum hot stamping back adhesive, which comprises acrylic resin, expandable polystyrene particles, rosin, filler and solvent, wherein the expandable polystyrene particles are added, and the resin at the edge of a hot stamping pattern is pressed and separated under the action of thermal expansion of the expandable polystyrene particles, so that the separation brings about a pre-cutting effect, thereby reducing the traction effect generated at the edge part in the subsequent cutting process, improving the cutting performance of the electrochemical aluminum hot stamping and improving the edge smoothness of the hot stamping pattern.
Description
Technical Field
The invention relates to the technical field of printing consumables, in particular to an alumite hot stamping back adhesive and a preparation method thereof.
Background
The electric aluminum hot stamping foil is commonly called electric aluminum, is a multi-layer hot stamping material formed by coating paint on a film sheet and overlapping by vacuum evaporation, and can form a printing layer with metallic luster on the surface of a bearing material by adopting the hot stamping material, so that the electric aluminum hot stamping foil is widely applied to high-end packaging materials.
The electrochemical aluminum generally comprises five layers of structures, namely a PET base layer, a release layer, a coloring layer, an aluminized layer and a gum layer, wherein the gum layer generally adopts thermoplastic resin as an adhesive component, when the hot stamping part is heated, the gum melts and is adhered to the hot stamping base material, and the hot stamping part is separated from the PET base layer from the release layer under the action of traction force. However, in the process of separation, the quality of the coloring layer, the aluminized layer and the edge separation performance of the gum layer of the hot stamping part will be directly affected, the influence of the gum layer is a main part, and because the gum layer generally adopts thermoplastic adhesives, the adhesives at the edge part may have microscopic wiredrawing problems in the process of slitting after hot stamping, and the coloring layer and the aluminized layer at the slit edge can be directly pulled to break, so that the problem that saw teeth appear at the edge of the hot stamping pattern or the pattern precision is insufficient appears on the appearance.
Therefore, how to improve the backing adhesive layer and thus improve the smoothness of the hot stamping edge is a technical problem to be solved at present.
Disclosure of Invention
In view of the above, the invention provides an alumite hot stamping back adhesive and a preparation method thereof, which aim to improve the smoothness of the edges of alumite hot stamping patterns.
The technical scheme of the invention is realized as follows: the invention provides an alumite hot stamping back adhesive which is prepared from the following components in parts by weight:
in some embodiments, the raw materials of the alumite hot stamping gum include the following components:
the expandable polystyrene particles are expanded in the hot-pressing transfer printing process, resin colloid nearby the expandable polystyrene particles is extruded in the expansion process, particularly, the expanded polystyrene starts to fill the pattern edge of the hot-pressing transfer printing at the position of the pattern edge of the hot-pressing transfer printing, the expanded polystyrene starts to shrink under the action of the pressure and high temperature of a die, the colloid positioned at the outer side of the pattern edge is extruded in advance to leave the edge of the pattern, at the moment, under the condition that the polystyrene is shrunk under the hot melting of the pattern edge, a weak area is formed on a back adhesive layer of the edge, and after the polystyrene is kept away from the die, a fragile polystyrene edge line is formed by cooling the polystyrene, and under the external acting force, the edge line is easily broken due to stress concentration, so that the problems of saw teeth or flying gold caused by the back adhesive edge wire drawing are effectively avoided.
In some embodiments, the expandable polystyrene particles have an average particle size of 0.01 to 0.3mm.
In some embodiments, the surface of the expandable polystyrene particles is subjected to an inorganic powder coating treatment.
In some embodiments, the method of making expandable polystyrene microparticles comprises: heating the inorganic powder to 85-99 ℃, mixing and stirring the heated inorganic powder and the expandable polystyrene particles to obtain the expandable polystyrene particles with the surfaces coated by the inorganic powder.
In some embodiments, the inorganic powder has an average particle size of 0.1 to 1 μm.
In some embodiments, the inorganic powder is a silicon powder or a metal oxide powder.
In some embodiments, the filler is a silicon powder or a metal oxide powder.
In some embodiments, the metal oxide powder includes: zinc oxide, aluminum oxide, copper oxide, iron oxide, titanium oxide, and the like.
In some embodiments, the solvent is at least one of n-propyl ester, ethyl acetate, and butanone.
In some embodiments, the expandable polystyrene particles have an expansion ratio of 3 to 5 times.
The invention also provides a preparation method of the hot stamping back adhesive for the electrochemical aluminum, which comprises the following steps:
step one, heating part of solvent to 40-50 ℃, adding acrylic resin and rosin into part of solvent, and uniformly mixing;
step two, mixing and stirring the expandable polystyrene particles, the filler and the residual solvent uniformly;
and thirdly, slowly adding the mixture obtained in the second step into the material obtained in the first step under the stirring state, stopping heating, slowly cooling, and uniformly stirring to obtain the alumite hot stamping gum.
Compared with the prior art, the alumite hot stamping back adhesive has the following beneficial effects:
according to the alumite hot stamping back adhesive, the expandable polystyrene particles are added, resin at the edge of a hot stamping pattern is extruded through the expansion effect of the expandable polystyrene particles during hot stamping, so that weak areas with fewer resin and easier cutting are formed, the edge of the pattern is easier to break when traction cutting is performed after hot stamping, the problems of flying gold and saw teeth are effectively reduced, and the smoothness of the edge of the pattern is improved; and then the expandable polystyrene particles are heated continuously to be melted after being expanded, and a brittle polystyrene layer is formed after cooling, so that the expandable polystyrene particles are more easily broken under the stress of slitting, and the problem of flying gold during slitting is further reduced.
Detailed Description
The following description of the embodiments of the present invention will clearly and fully describe the technical aspects of the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
Unless defined otherwise, all technical terms and science used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments of the present invention belong. If the definitions set forth in this section are contrary to or otherwise inconsistent with the definitions set forth in the patents, patent applications, published patent applications and other publications incorporated herein by reference, the definitions set forth in this section are preferentially set forth in the definitions set forth herein.
The invention provides an alumite hot stamping back adhesive, which comprises the following raw materials: the adhesive comprises acrylic resin, expandable polystyrene particles, rosin, filler and solvent, wherein the expandable polystyrene particles are dispersed in a glue solution, after an adhesive layer is formed by spin coating and drying, the expandable polystyrene particles are heated by a hot pressing part of a die, particularly by an edge part, when the expandable polystyrene particles are subjected to thermal transfer printing, so that the expandable polystyrene particles are firstly expanded, the glue layer, an aluminum foil layer adjacent to the glue layer, a coloring layer and a release layer are extruded by the expanded polystyrene particles, the compressive stress generated in the extrusion process is favorable for rapidly cutting off the multi-layer structure of a heated area on one hand, greatly reducing the cohesive force during release separation of the adhesive layer, facilitating separation of the adhesive layer, and on the other hand, the adjacent glue layer is driven to be away from an expansion point in the expansion extrusion process, the expanded polystyrene is gradually melted and contracted in the subsequent heating process, a void area is formed after contraction, the back glue structure strength of the void area is greatly reduced, and the void area is easier to break under the action of the subsequent rolling traction force and adhesion force. Simultaneously under the extrusion effect of inflation, the in-process that adjacent glue film kept away from can form tangential traction force, makes the adjacent aluminium foil layer of glue film atress tear in advance or form stress concentration point, in the later slitting process, the melt thickness polystyrene can cool down and solidify, forms brittle fragile polystyrene, and the brittle polystyrene can not produce the bonding effect to the aluminium foil, therefore the edge after slitting is relatively neat, effectively reduced sawtooth and flying gold problem, and even there is partial convex edge, because the friability of polystyrene, the edge clearance is more easily carried out.
In the above examples, the parts by weight of the raw materials are as follows:
among them, typical but non-limiting parts by weight of the polyacrylic resin are 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, 21 parts, 22 parts, 23 parts, 24 parts, 25 parts, 26 parts, 27 parts, 28 parts, 29 parts, 30 parts.
Typical but non-limiting parts by weight of expandable polystyrene particles are 0.1 parts, 0.2 parts, 0.3 parts.
Typical but non-limiting parts by weight of rosin are 1 part, 2 parts, 3 parts, 4 parts, 5 parts.
Typical, but non-limiting, parts by weight of filler are 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts.
Typical, but non-limiting, parts by weight of solvents are 40 parts, 50 parts, 60 parts, 70 parts, 80 parts.
In some embodiments, the average particle size of the expandable polystyrene particles is 0.01 to 0.3mm, with typical but non-limiting average particle sizes of the expandable polystyrene particles being 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.2mm, 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0.25mm, 0.26mm, 0.27mm, 0.28mm, 0.29mm, 0.3mm.
The average particle size of the expandable polystyrene particles directly influences the uniformity of distribution of the expandable polystyrene particles after vegetation forms back glue, and the uneven distribution of the polystyrene particles possibly cannot be densely filled at the edge of a thermoprint pattern, so that holes are formed at the edge of the pattern after the thermoprint pattern is formed, and spot-type or linear flying gold is caused.
In some embodiments, the surface of the expandable polystyrene particles is subjected to an inorganic powder coating treatment.
The above embodiments are directed to further improving dispersibility of expandable polystyrene particles and also improving storage time of expandable polystyrene in a glue solution, and after inorganic powder is attached to surfaces of expandable polystyrene particles, dispersibility of expandable polystyrene particles can be improved, and since the expandable polystyrene particles have volatile gas components therein, and the expandable polystyrene particles need to store the volatile gas, it is necessary to prevent the expandable polystyrene particles from being dissolved by a solvent, and after the inorganic powder coating treatment, contact area between the expandable polystyrene particles and the solvent is reduced, thereby effectively prolonging storage time thereof.
In some embodiments, the method of making expandable polystyrene microparticles comprises: heating the inorganic powder to 85-99 ℃, mixing and stirring the heated inorganic powder and the expandable polystyrene particles to obtain the expandable polystyrene particles with the surfaces coated by the inorganic powder. Typical but non-limiting temperatures for heating the inorganic powder are 85 ℃, 86 ℃, 87 ℃, 88 ℃, 89 ℃, 90 ℃, 91 ℃, 92 ℃, 93 ℃, 94 ℃, 95 ℃, 96 ℃, 97 ℃, 98 ℃, 99 ℃.
In some embodiments, the inorganic powder has an average particle size of 0.1-1 μm. Typical but non-limiting average particle sizes of the inorganic powders are 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1 μm.
In some embodiments, the inorganic powder is a silicon powder or a metal oxide powder.
In some embodiments, the filler is silicon powder or metal oxide powder.
In some embodiments, the solvent is at least one of n-propyl ester, ethyl acetate, and butanone.
In some embodiments, the expandable polystyrene particles have an expansion ratio of 3 to 5 times.
In another embodiment of the invention, the raw materials are processed to form the alumite hot stamping gum, and the preparation method comprises the following steps:
step one, heating part of solvent to 40-50 ℃, adding acrylic resin and rosin into part of solvent, and uniformly mixing;
step two, mixing and stirring the expandable polystyrene particles, the filler and the residual solvent uniformly;
and thirdly, slowly adding the mixture obtained in the second step into the material obtained in the first step under the stirring state, stopping heating, slowly cooling, and uniformly stirring to obtain the alumite hot stamping gum.
The technical scheme of the hot stamping back adhesive of the invention is further described below by combining specific embodiments:
example 1
An alumite hot stamping back adhesive comprises the following components in parts by weight:
10 parts of acrylic resin, 0.1 part of expandable polystyrene particles, 1 part of rosin, 5 parts of silicon powder and 40 parts of ethyl acetate, wherein the average particle size of the expandable polystyrene particles is 0.01mm, and the expansion ratio is 3 times.
The preparation method comprises the following steps:
weighing 20 parts of ethyl acetate, heating the ethyl acetate to 40 ℃, adding acrylic resin and rosin into the ethyl acetate at 40 ℃, and stirring until the acrylic resin and the rosin are dissolved;
adding expandable polystyrene particles and silicon powder into 20 parts of unheated ethyl acetate, and mixing and stirring until no obvious agglomeration state exists;
slowly adding the ethyl acetate mixed with the expandable polystyrene particles and the silicon powder into the hot ethyl acetate dissolved with the acrylic resin and the rosin, and uniformly stirring to obtain the alumite hot stamping gum.
Example 2
An alumite hot stamping back adhesive comprises the following components in parts by weight:
20 parts of acrylic resin, 0.2 part of expandable polystyrene particles, 3 parts of rosin, 8 parts of silicon powder and 60 parts of ethyl acetate, wherein the average particle size of the expandable polystyrene particles is 0.01mm, the expansion ratio is 4 times, the surfaces of the expandable polystyrene particles are subjected to silicon powder coating treatment, and the average particle size of the silicon powder is 0.1 mu m.
The preparation method comprises the following steps:
heating the silicon powder to 85 ℃, mixing and stirring the heated silicon powder and expandable polystyrene particles, wherein the mass ratio of the silicon powder to the expandable polystyrene particles is 10:1, uniformly stirring, sieving, and sieving to remove the silicon powder, thereby obtaining the coated expandable polystyrene particles.
Weighing 30 parts of ethyl acetate, heating the ethyl acetate to 45 ℃, adding acrylic resin and rosin into the ethyl acetate at 45 ℃, and stirring until the acrylic resin and the rosin are dissolved;
adding expandable polystyrene particles and silicon powder into 30 parts of unheated ethyl acetate, and mixing and stirring until no obvious agglomeration state exists;
slowly adding the ethyl acetate mixed with the expandable polystyrene particles and the silicon powder into the hot ethyl acetate dissolved with the acrylic resin and the rosin, and uniformly stirring to obtain the alumite hot stamping gum.
Example 3
An alumite hot stamping back adhesive comprises the following components in parts by weight:
30 parts of acrylic resin, 0.3 part of expandable polystyrene particles, 5 parts of rosin, 10 parts of silicon powder and 80 parts of ethyl acetate, wherein the average particle size of the expandable polystyrene particles is 0.01mm, the expansion ratio is 5 times, the surfaces of the expandable polystyrene particles are subjected to silicon powder coating treatment, and the average particle size of the silicon powder is 0.1 mu m.
The preparation method comprises the following steps:
heating the silicon powder to 85 ℃, mixing and stirring the heated silicon powder and expandable polystyrene particles, wherein the mass ratio of the silicon powder to the expandable polystyrene particles is 10:1, uniformly stirring, sieving, and sieving to remove the silicon powder, thereby obtaining the coated expandable polystyrene particles.
Weighing 40 parts of ethyl acetate, heating the ethyl acetate to 50 ℃, adding acrylic resin and rosin into the ethyl acetate at 50 ℃, and stirring until the acrylic resin and the rosin are dissolved;
adding expandable polystyrene particles and silicon powder into 40 parts of unheated ethyl acetate, and mixing and stirring until no obvious agglomeration state exists;
slowly adding the ethyl acetate mixed with the expandable polystyrene particles and the silicon powder into the hot ethyl acetate dissolved with the acrylic resin and the rosin, and uniformly stirring to obtain the alumite hot stamping gum.
Example 4
An alumite hot stamping back adhesive comprises the following components in parts by weight:
28 parts of acrylic resin, 0.1 part of expandable polystyrene particles, 5 parts of rosin, 6 parts of silicon powder and 70 parts of ethyl acetate, wherein the average particle size of the expandable polystyrene particles is 0.05mm, the expansion ratio is 3 times, the surfaces of the expandable polystyrene particles are subjected to silicon powder coating treatment, and the average particle size of the silicon powder is 0.2 mu m.
The preparation method comprises the following steps:
heating the silicon powder to 88 ℃, mixing and stirring the heated silicon powder and expandable polystyrene particles, wherein the mass ratio of the silicon powder to the expandable polystyrene particles is 10:1, uniformly stirring, sieving, and sieving to remove the silicon powder, thereby obtaining the coated expandable polystyrene particles.
Weighing 30 parts of ethyl acetate, heating the ethyl acetate to 45 ℃, adding acrylic resin and rosin into the ethyl acetate at 45 ℃, and stirring until the acrylic resin and the rosin are dissolved;
adding expandable polystyrene particles and silicon powder into 40 parts of unheated ethyl acetate, and mixing and stirring until no obvious agglomeration state exists;
slowly adding the ethyl acetate mixed with the expandable polystyrene particles and the silicon powder into the hot ethyl acetate dissolved with the acrylic resin and the rosin, and uniformly stirring to obtain the alumite hot stamping gum.
Example 5
An alumite hot stamping back adhesive comprises the following components in parts by weight:
30 parts of acrylic resin, 0.3 part of expandable polystyrene particles, 5 parts of rosin, 10 parts of silicon powder and 80 parts of ethyl acetate, wherein the average particle size of the expandable polystyrene particles is 0.2mm, the expansion ratio is 3 times, the surfaces of the expandable polystyrene particles are subjected to silicon powder coating treatment, and the average particle size of the silicon powder is 0.5 mu m.
The preparation method comprises the following steps:
heating the silicon powder to 85 ℃, mixing and stirring the heated silicon powder and expandable polystyrene particles, wherein the mass ratio of the silicon powder to the expandable polystyrene particles is 10:1, uniformly stirring, sieving, and sieving to remove the silicon powder, thereby obtaining the coated expandable polystyrene particles.
Weighing 40 parts of ethyl acetate, heating the ethyl acetate to 50 ℃, adding acrylic resin and rosin into the ethyl acetate at 50 ℃, and stirring until the acrylic resin and the rosin are dissolved;
adding expandable polystyrene particles and silicon powder into 40 parts of unheated ethyl acetate, and mixing and stirring until no obvious agglomeration state exists;
slowly adding the ethyl acetate mixed with the expandable polystyrene particles and the silicon powder into the hot ethyl acetate dissolved with the acrylic resin and the rosin, and uniformly stirring to obtain the alumite hot stamping gum.
Example 6
An alumite hot stamping back adhesive comprises the following components in parts by weight:
30 parts of acrylic resin, 0.3 part of expandable polystyrene particles, 5 parts of rosin, 10 parts of silicon powder and 80 parts of ethyl acetate, wherein the average particle size of the expandable polystyrene particles is 0.3mm, the expansion ratio is 3 times, the surfaces of the expandable polystyrene particles are subjected to silicon powder coating treatment, and the average particle size of the silicon powder is 1 mu m.
The preparation method comprises the following steps:
heating the silicon powder to 85 ℃, mixing and stirring the heated silicon powder and expandable polystyrene particles, wherein the mass ratio of the silicon powder to the expandable polystyrene particles is 10:1, uniformly stirring, sieving, and sieving to remove the silicon powder, thereby obtaining the coated expandable polystyrene particles.
Weighing 40 parts of ethyl acetate, heating the ethyl acetate to 50 ℃, adding acrylic resin and rosin into the ethyl acetate at 50 ℃, and stirring until the acrylic resin and the rosin are dissolved;
adding expandable polystyrene particles and silicon powder into 40 parts of unheated ethyl acetate, and mixing and stirring until no obvious agglomeration state exists;
slowly adding the ethyl acetate mixed with the expandable polystyrene particles and the silicon powder into the hot ethyl acetate dissolved with the acrylic resin and the rosin, and uniformly stirring to obtain the alumite hot stamping gum.
Comparative example 1
An alumite hot stamping back adhesive comprises the following components in parts by weight:
10 parts of acrylic resin, 1 part of rosin, 5 parts of silicon powder and 40 parts of ethyl acetate.
The preparation method comprises the following steps:
weighing 20 parts of ethyl acetate, heating the ethyl acetate to 40 ℃, adding acrylic resin and rosin into the ethyl acetate at 40 ℃, and stirring until the acrylic resin and the rosin are dissolved;
adding silicon powder into 20 parts of unheated ethyl acetate, and mixing and stirring until no obvious agglomeration state exists;
slowly adding the ethyl acetate mixed with the silicon powder into hot ethyl acetate dissolved with acrylic resin and rosin, and uniformly stirring to obtain the alumite hot stamping gum.
Comparative example 2
An alumite hot stamping back adhesive comprises the following components in parts by weight:
28 parts of acrylic resin, 0.1 part of expandable polystyrene particles, 5 parts of rosin, 6 parts of silicon powder and 70 parts of ethyl acetate, wherein the average particle size of the expandable polystyrene particles is 0.4mm, the expansion ratio is 3 times, the surfaces of the expandable polystyrene particles are subjected to silicon powder coating treatment, and the average particle size of the silicon powder is 0.2 mu m.
The preparation method comprises the following steps:
heating the silicon powder to 88 ℃, mixing and stirring the heated silicon powder and expandable polystyrene particles, wherein the mass ratio of the silicon powder to the expandable polystyrene particles is 10:1, uniformly stirring, sieving, and sieving to remove the silicon powder, thereby obtaining the coated expandable polystyrene particles.
Weighing 30 parts of ethyl acetate, heating the ethyl acetate to 45 ℃, adding acrylic resin and rosin into the ethyl acetate at 45 ℃, and stirring until the acrylic resin and the rosin are dissolved;
adding expandable polystyrene particles and silicon powder into 40 parts of unheated ethyl acetate, and mixing and stirring until no obvious agglomeration state exists;
slowly adding the ethyl acetate mixed with the expandable polystyrene particles and the silicon powder into the hot ethyl acetate dissolved with the acrylic resin and the rosin, and uniformly stirring to obtain the alumite hot stamping gum.
Comparative example 3
An alumite hot stamping back adhesive comprises the following components in parts by weight:
30 parts of acrylic resin, 0.3 part of expandable polystyrene particles, 5 parts of rosin, 10 parts of silicon powder and 80 parts of ethyl acetate, wherein the average particle size of the expandable polystyrene particles is 0.01mm, the expansion ratio is 3 times, the surfaces of the expandable polystyrene particles are subjected to silicon powder coating treatment, and the average particle size of the silicon powder is 2 mu m.
The preparation method comprises the following steps:
heating the silicon powder to 85 ℃, mixing and stirring the heated silicon powder and expandable polystyrene particles, wherein the mass ratio of the silicon powder to the expandable polystyrene particles is 10:1, uniformly stirring, sieving, and sieving to remove the silicon powder, thereby obtaining the coated expandable polystyrene particles.
Weighing 40 parts of ethyl acetate, heating the ethyl acetate to 50 ℃, adding acrylic resin and rosin into the ethyl acetate at 50 ℃, and stirring until the acrylic resin and the rosin are dissolved;
adding expandable polystyrene particles and silicon powder into 40 parts of unheated ethyl acetate, and mixing and stirring until no obvious agglomeration state exists;
slowly adding the ethyl acetate mixed with the expandable polystyrene particles and the silicon powder into the hot ethyl acetate dissolved with the acrylic resin and the rosin, and uniformly stirring to obtain the alumite hot stamping gum.
Comparative example 4
An alumite hot stamping back adhesive comprises the following components in parts by weight:
28 parts of acrylic resin, 0.1 part of expandable polystyrene particles, 5 parts of rosin, 6 parts of silicon powder and 70 parts of ethyl acetate, wherein the average particle size of the expandable polystyrene particles is 0.05mm, the expansion ratio is 6 times, the surfaces of the expandable polystyrene particles are subjected to silicon powder coating treatment, and the average particle size of the silicon powder is 0.2 mu m.
The preparation method comprises the following steps:
heating the silicon powder to 88 ℃, mixing and stirring the heated silicon powder and expandable polystyrene particles, wherein the mass ratio of the silicon powder to the expandable polystyrene particles is 10:1, uniformly stirring, sieving, and sieving to remove the silicon powder, thereby obtaining the coated expandable polystyrene particles.
Weighing 30 parts of ethyl acetate, heating the ethyl acetate to 45 ℃, adding acrylic resin and rosin into the ethyl acetate at 45 ℃, and stirring until the acrylic resin and the rosin are dissolved;
adding expandable polystyrene particles and silicon powder into 40 parts of unheated ethyl acetate, and mixing and stirring until no obvious agglomeration state exists;
slowly adding the ethyl acetate mixed with the expandable polystyrene particles and the silicon powder into the hot ethyl acetate dissolved with the acrylic resin and the rosin, and uniformly stirring to obtain the alumite hot stamping gum.
Splitting effect experiment:
the back adhesive prepared in the above examples and comparative examples is coated on the surface of aluminized aluminum, and is subjected to hot stamping treatment by adopting a square hot stamping pattern mold with a side length of 10mm, and the flying gold protruding length and width at the edge after hot stamping are counted, and three groups are counted in total, and the average value is calculated, so that the obtained results are shown in the following table:
| grouping | Cumulative length of gold flying area (mm) | Maximum width of flying gold (mm) |
| Example 1 | 0.08 | 0.02 |
| Example 2 | 0.06 | 0.02 |
| Example 3 | 0.09 | 0.02 |
| Example 4 | 0.03 | 0.01 |
| Example 5 | 0.12 | 0.05 |
| Example 6 | 0.25 | 0.11 |
| Comparative example 1 | 1.6 | 0.32 |
| Comparative example 2 | 0.9 | 0.22 |
| Comparative example 3 | 1.1 | 0.28 |
| Comparative example 4 | 0 | - |
The experimental results show that the addition of the expandable polystyrene particles remarkably improves the definition of patterns after thermoprinting and effectively reduces the occurrence of the gold fly situation.
Meanwhile, the appearance and touch of the pattern after the hot stamping are evaluated, and the result is as follows:
| grouping | Appearance of | Tactile sensation |
| Example 1 | Leveling flawless | Smooth and uniform |
| Example 2 | Leveling flawless | Smooth and uniform |
| Example 3 | Leveling flawless | Smooth and uniform |
| Example 4 | Leveling flawless | Smooth and uniform |
| Example 5 | Leveling flawless | Smooth and uniform |
| Example 6 | Leveling flawless | Smooth and uniform |
| Comparative example 1 | Leveling flawless | Smooth and uniform |
| Comparative example 2 | Leveling flawless | Smooth and uniform |
| Comparative example 3 | Leveling flawless | Smooth and uniform |
| Comparative example 4 | Partial gravure printing | Discontinuous state |
As can be seen from the above experimental results, when the expansion ratio of the expandable polystyrene particles is larger, the expandable polystyrene particles can bring better thermoprinting and slitting effects, and uneven pores are likely to appear in the transferred pattern due to the excessive expansion ratio, so that the quality of the transferred pattern is affected.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (8)
1. The alumite hot stamping back adhesive is characterized by comprising the following components in parts by weight:
the average particle diameter of the expandable polystyrene particles is 0.01-0.3mm, and the expansion ratio of the expandable polystyrene particles is 3-5 times.
2. The alumite hot stamping gum according to claim 1, wherein the surface of the expandable polystyrene particles is coated with inorganic powder.
3. The alumite hot stamping gum of claim 2, wherein the preparation method of the expandable polystyrene particles comprises the following steps: heating the inorganic powder to 85-99 ℃, mixing and stirring the heated inorganic powder and the expandable polystyrene particles to obtain the expandable polystyrene particles with the surfaces coated by the inorganic powder.
4. The alumite hot stamping gum according to claim 2, wherein the average particle size of the inorganic powder is 0.1-1 μm.
5. The alumite hot stamping gum of claim 2, wherein the inorganic powder is silicon powder or metal oxide powder.
6. The alumite hot stamping gum of claim 1, wherein the filler is silicon powder or metal oxide powder.
7. The alumite hot stamping gum of claim 1, wherein the solvent is at least one of n-propyl ester, ethyl acetate, and butanone.
8. The method for preparing the alumite hot stamping gum according to any one of claims 1 to 7, characterized by comprising the following steps:
step one, heating part of solvent to 40-50 ℃, adding acrylic resin and rosin into part of solvent, and uniformly mixing;
step two, mixing and stirring the expandable polystyrene particles, the filler and the residual solvent uniformly;
and thirdly, slowly adding the mixture obtained in the second step into the material obtained in the first step under the stirring state, stopping heating, slowly cooling, and uniformly stirring to obtain the alumite hot stamping gum.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160058423A (en) * | 2014-11-17 | 2016-05-25 | 현대이피 주식회사 | manufacturing method of expandable polystyrene having improved insulation property |
| CN205774267U (en) * | 2016-05-27 | 2016-12-07 | 扬州市祥华新材料科技有限公司 | A kind of heat resistant composite film-stuck |
| CN112322092A (en) * | 2020-11-25 | 2021-02-05 | 云南玉溪东魅包装材料有限公司 | Alumite coloring layer coating with high wrapping capacity and preparation method thereof |
| CN112322086A (en) * | 2020-10-09 | 2021-02-05 | 武汉华中科大新材料股份有限公司 | Electrochemical aluminum coating and preparation method thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160058423A (en) * | 2014-11-17 | 2016-05-25 | 현대이피 주식회사 | manufacturing method of expandable polystyrene having improved insulation property |
| CN205774267U (en) * | 2016-05-27 | 2016-12-07 | 扬州市祥华新材料科技有限公司 | A kind of heat resistant composite film-stuck |
| CN112322086A (en) * | 2020-10-09 | 2021-02-05 | 武汉华中科大新材料股份有限公司 | Electrochemical aluminum coating and preparation method thereof |
| CN112322092A (en) * | 2020-11-25 | 2021-02-05 | 云南玉溪东魅包装材料有限公司 | Alumite coloring layer coating with high wrapping capacity and preparation method thereof |
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