CN116586376A - Cleaning device for reducing particles on surface of semiconductor substrate wafer - Google Patents
Cleaning device for reducing particles on surface of semiconductor substrate wafer Download PDFInfo
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- CN116586376A CN116586376A CN202310635663.XA CN202310635663A CN116586376A CN 116586376 A CN116586376 A CN 116586376A CN 202310635663 A CN202310635663 A CN 202310635663A CN 116586376 A CN116586376 A CN 116586376A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 167
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 239000002245 particle Substances 0.000 title claims abstract description 33
- 239000000758 substrate Substances 0.000 title claims abstract description 30
- 230000007246 mechanism Effects 0.000 claims abstract description 30
- 238000007664 blowing Methods 0.000 claims abstract description 24
- 239000000853 adhesive Substances 0.000 claims abstract description 7
- 230000001070 adhesive effect Effects 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 claims description 103
- 239000007788 liquid Substances 0.000 claims description 87
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 79
- 238000005507 spraying Methods 0.000 claims description 27
- 230000005540 biological transmission Effects 0.000 claims description 23
- 238000000227 grinding Methods 0.000 claims description 22
- 238000003860 storage Methods 0.000 claims description 19
- 238000001802 infusion Methods 0.000 claims description 17
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 230000009467 reduction Effects 0.000 claims description 5
- 238000007781 pre-processing Methods 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 claims description 2
- 239000012535 impurity Substances 0.000 abstract description 10
- 239000000428 dust Substances 0.000 abstract description 3
- 238000002203 pretreatment Methods 0.000 abstract 2
- 239000000243 solution Substances 0.000 description 25
- 230000009471 action Effects 0.000 description 6
- 210000000621 bronchi Anatomy 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- B08B5/023—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a cleaning device for reducing particles on the surface of a semiconductor substrate wafer, and relates to the field of wafer cleaning. The device comprises a device main body, wherein a starting motor is arranged on the inner side wall of the device main body, a rotary cleaning mechanism is integrally arranged in a rotary table type, after a wafer is fixed, the surface of the wafer is cleaned in a mutually reversing mode, and a blowing mechanism is arranged; the device is arranged outside the mounting cavity, the surface of the wafer is subjected to pre-treatment of blowing in advance, through the arrangement of the air jet cylinder in the cleaning box, when the cleaning box is driven to clean the wafer by driving the circular table to slowly rotate, the air jet cylinder in the cleaning box is driven by magnetic force to perform pre-treatment of blowing in advance on the wafer, dust on the surface of the wafer and impurities with weaker adhesive force are blown off, the impurities with stronger adhesive force are blown loose, the follow-up cleaning sponge is convenient to scrape and clean, and scratches on the surface of the wafer are effectively avoided.
Description
Technical Field
The invention relates to the field of wafer cleaning, in particular to a cleaning device for reducing particles on the surface of a semiconductor substrate wafer.
Background
Regarding semiconductor wafers, it is first to be understood that the wafer's fabrication materials are primarily composed of silicon, a gray, brittle, tetravalent nonmetallic chemical element, which is also the primary source of most semiconductors and microelectronic chips, and that silicon itself is not very conductive, however, it is necessary to convert silicon to wafers before making semiconductors by adding appropriate dopants to precisely control its resistivity, starting with the growth of a silicon ingot, single crystal silicon is a solid with atoms periodically formed in a three-dimensional spatial pattern throughout the entire material, polycrystalline silicon is a number of small single crystals with different crystal orientations that are individually formed and cannot be used as semiconductor circuits, polycrystalline silicon must be melted into single crystals that can be processed into wafers for use in semiconductor applications.
After the semiconductor wafer is manufactured, the surface of the semiconductor wafer is doped with tiny dust, micro metal elements, organic impurities and the like which are left after the manufacturing, and then the semiconductor wafer needs to be fully cleaned before being used, so that damage to the internal circuit of the wafer in the later stage is avoided, the existing cleaning device usually directly adopts organic water to flush, scrape and clean the surface of the wafer, the impurities with stronger surface adhesion force are not pretreated in advance, so that when the impurities with stronger surface adhesion force are cleaned, larger pushing force is needed, once the pushing force is larger, the impurities possibly leave scratches on the surface of the wafer, damage to the internal circuit of the wafer, influence the use of the wafer, meanwhile, the cleaning liquid needs to be mixed by the aid of the organic water to clean the surface of the wafer, and along with the increase of cleaning time, the use amount of the cleaning liquid needs to be adjusted according to the dirt on the surface of the wafer, the existing cleaning device usually does not have the adjusting and diluting function of the cleaning liquid, the addition amount of the cleaning liquid is usually constant when the wafer is cleaned, the cleaning liquid is added to the later stage, the impurities are easy to leave the crystal liquid in the surface of the wafer when the dirt is less, and the impurities easily leave the residues on the surface of the wafer when the wafer is easy to react, and the residues on the wafer are easy to leave in the surface of the wafer.
How to develop a cleaning device for reducing particles on the surface of a semiconductor substrate wafer to improve these problems is a problem to be solved by those skilled in the art.
Disclosure of Invention
In order to overcome the defects, the invention provides a cleaning device for reducing particles on the surface of a semiconductor substrate wafer, and aims to solve the problem that the use of the wafer is affected due to the lack of blowing pretreatment and automatic adjustment of the use amount of cleaning liquid in the conventional cleaning device.
The invention is realized in the following way:
the cleaning device for reducing particles on the surface of a semiconductor substrate wafer comprises a device main body, wherein a starting motor is arranged on the inner side wall of the device main body;
rotating the cleaning mechanism; the whole is arranged in a turntable type, and after the wafer is fixed, the surface of the wafer is cleaned in a mutually reversing way;
a blowing mechanism; the surface particles are arranged outside the mounting cavity, and the surface of the wafer is subjected to pre-blowing pretreatment in advance, so that the surface particles with weaker adhesive force are blown away;
a liquid sprinkling mechanism; the device is arranged on the side of the blowing mechanism, and after the blowing mechanism is used for blowing and preprocessing the wafer, the sprinkling mechanism can automatically control and adjust the concentration of the cleaning liquid according to the rotating speed of the wafer.
Preferably, the rotation cleaning mechanism comprises a transmission rod arranged at the output end of the starting motor, the transmission rod penetrates to the outside of the device main body, a deceleration grinding wheel is fixedly connected to the outer side wall of the transmission rod, a rotating disc is fixedly connected to the top end of the transmission rod, a wafer is arranged at the upper end of the rotating disc, mounting lugs are fixedly connected to the two sides of the rotating disc, and a trigger magnet is arranged on the mounting lugs.
Through adopting above-mentioned technical scheme, trigger magnetite's setting can make the mechanism of blowing blow downwards through magnetic force.
Preferably, a plurality of elastic rods are fixedly connected to the outer side wall of the device main body, the upper ends of the elastic rods are fixedly connected with a water receiving box, and the bottom of the water receiving box is fixedly connected with a contact grinding wheel corresponding to the speed reducing grinding wheel.
Preferably, the inside wall of device main part rotates and is connected with the dwang, respectively cup jointed rotation gear and drive gear on the lateral wall of device main part and dwang, rotation gear is the meshing setting with the drive gear, the upper end fixedly connected with of dwang drives the round platform, the both sides of driving the round platform are all installed and are provided with clean case.
By adopting the technical scheme, the cleaning box can clean the surface of the wafer.
Preferably, the blowing mechanism comprises a jet cylinder arranged on the inner side wall of the cleaning box, the inner side wall of the jet cylinder is slidably connected with a pushing piston rod, the bottom of the pushing piston rod is fixedly connected with a pushing magnet, and the magnetic pole of the pushing magnet is opposite to that of the triggering magnet.
Preferably, the output end of the air jet cylinder is communicated with an air pipe, one end of the air pipe, which is far away from the air jet cylinder, is fixedly connected to the inner side wall of the cleaning box, a plurality of bronchi are communicated with the inner side wall of the cleaning box, and the bronchi penetrate through the outer part of the cleaning box.
Through adopting above-mentioned technical scheme, the setting of gas-supply pipe can blow downwards.
Preferably, the liquid sprinkling mechanism comprises a water storage tank fixedly connected to the inner side wall of the cleaning tank, a water inlet capable of blocking is formed in the outer side wall of the upper end of the water storage tank, a water delivery thick pipe is arranged at the bottom of the water inlet in a communicating mode, a water delivery pipe is arranged at the bottom of the water delivery thick pipe in a communicating mode, the water delivery pipe is arranged in an inclined mode, a plurality of water delivery branch pipes are arranged on the water delivery pipe in a communicating mode, cleaning sponge is arranged at the bottom of the cleaning tank, and the other end of the water delivery branch pipes are communicated to the inside of the cleaning sponge.
Preferably, the inside wall that drives the round platform is provided with the liquid reserve tank, the top of liquid reserve tank is provided with the filling opening, the inside wall of liquid reserve tank is provided with a plurality of spraying pieces, the inside wall of spraying the piece is provided with the infusion passageway, be provided with on the lateral wall of spraying the piece and gather the liquid board, gather and be provided with on the liquid board and connect the liquid pipe, connect the liquid pipe to run through to the inside of infusion passageway, the inside wall sliding connection of infusion passageway has trigger baffle, trigger baffle's both ends all run through to the outside of infusion passageway.
Preferably, the upper end fixedly connected with reset spring of trigger baffle, the one end fixed connection that reset spring kept away from infusion passageway is on the inside wall of spraying the piece, a plurality of cleaning solution through holes have been seted up to the lower extreme of trigger baffle.
Preferably, the bottom of spraying the piece inside wall is provided with the slide rail, the inside wall sliding connection of slide rail has the impeller, the impeller is located the side of trigger baffle, the afterbody fixedly connected with extension spring of impeller, the other end fixedly connected with of extension spring is on the inside wall of spraying the piece, the watering mouth has been seted up to the tip of infusion passageway, the intercommunication is provided with the cleaning solution conveyer pipe on the watering mouth, the cleaning solution conveyer pipe runs through to the inside of clean case, the other end intercommunication of cleaning solution conveyer pipe is to the inside of water delivery thick pipe.
Through adopting above-mentioned technical scheme, spray the setting of piece, can spray cleaning solution outwards automatically.
The beneficial effects of the invention are as follows:
through the arrangement of the air jet cylinder in the cleaning box, when the round table is driven to slowly rotate to drive the cleaning box to clean the wafer, the air jet cylinder in the cleaning box is driven by magnetic force to pre-treat the wafer by blowing in advance, so that dust on the surface of the wafer and impurities with weak adhesive force are blown off, and the impurities with strong adhesive force are blown loose, thereby facilitating the subsequent scraping and cleaning of the cleaning sponge and effectively avoiding scratches on the surface of the wafer;
when driving the round platform and driving the cleaning box and rotating and making the cleaning sponge clear up the wafer, the liquid reserve tank can outwards throw the cleaning solution, adsorb by the cleaning sponge, make the cleaning effect of cleaning sponge better, along with the growth of cleaning time and the reduction of wafer surface dirt, the speed reduction of driving lever at the cooperation water receiving box, can make the liquid reserve tank reduce the spraying amount of cleaning solution automatically, until stopping spraying the cleaning solution, thereby reach the effect of automatically regulated cleaning solution's spraying amount, the effectual cleaning solution that has avoided uses too much, the condition that leads to the wafer surface to appear crystallization, simultaneously when the liquid reserve tank stops outwards throwing the cleaning solution, the storage water tank can make the cleaning sponge only be stained with water and wash the wafer, clear away the cleaning solution residue on wafer surface, and the air jet cylinder can blow downwards again, weather the wafer surface to a certain extent.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a cleaning apparatus for reducing particles on a surface of a semiconductor substrate wafer according to an embodiment of the present invention;
FIG. 2 is a schematic view showing an internal structure of a cleaning apparatus for reducing particles on a surface of a semiconductor substrate wafer according to an embodiment of the present invention;
fig. 3 is an enlarged view of a in the apparatus main body 1 of fig. 3;
FIG. 4 is a schematic view showing the bottom structure of the water receiving box 106 in a cleaning apparatus for reducing particles on the surface of a semiconductor substrate wafer according to an embodiment of the present invention;
fig. 5 is a schematic view showing an external structure of a driving circular table 202 in a cleaning device for reducing particles on a surface of a semiconductor substrate wafer according to an embodiment of the present invention;
fig. 6 is a schematic view showing an internal structure of a cleaning tank 3 in a cleaning apparatus for reducing particles on a surface of a semiconductor substrate wafer according to an embodiment of the present invention;
fig. 7 is a schematic diagram showing an internal structure of a cleaning tank 3 in a cleaning apparatus for reducing particles on a surface of a semiconductor substrate wafer according to an embodiment of the present invention;
fig. 8 is a schematic view showing an internal structure of the spray member 4 in the cleaning apparatus for reducing particles on the surface of a semiconductor substrate wafer according to the embodiment of the present invention.
In the figure: 1. a device body; 2. a rotating lever; 3. a cleaning tank; 4. a spray member; 101. rotating the disc; 102. mounting the protruding blocks; 103. triggering a magnet; 104. a speed reducing grinding wheel; 105. an elastic rod; 106. a water receiving box; 107. starting a motor; 108. rotating the gear; 109. a transmission rod; 110. a wafer; 111. contacting a grinding wheel; 201. driving a gear; 202. driving the round table; 203. a liquid adding port; 204. a liquid storage tank; 301. pushing the piston rod; 302. pushing the magnet; 303. an air-jet cylinder; 304. a gas pipe; 305. bronchi; 306. cleaning a sponge; 307. a water storage tank; 308. a water inlet; 309. a water delivery thick pipe; 310. a water pipe; 311. a water delivery branch pipe; 312. a cleaning liquid delivery pipe; 401. a liquid sprinkling port; 402. an infusion channel; 403. a return spring; 404. triggering a baffle; 405. a pushing member; 406. a cleaning liquid passing hole; 407. a tension spring; 408. a liquid collecting plate; 409. and a liquid receiving pipe.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, based on the embodiments of the invention, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the invention.
Examples
Referring to fig. 1-2, a cleaning device for reducing particles on the surface of a semiconductor substrate wafer comprises a device main body 1, wherein a rotating rod 2 is rotatably connected to the inner side wall of the device main body 1, a rotating gear 108 and a driving gear 201 are respectively sleeved on the outer side walls of the device main body 1 and the rotating rod 2, the rotating gear 108 and the driving gear 201 are meshed, a driving round table 202 is fixedly connected to the upper end part of the rotating rod 2, cleaning boxes 3 are arranged on two sides of the driving round table 202, and a plurality of elastic rods 105 are fixedly connected to the outer side wall of the device main body 1;
further, the upper end parts of the elastic rods 105 are fixedly connected with a water receiving box 106, the bottom of the water receiving box 106 is fixedly connected with a contact grinding wheel 111 corresponding to the reduction grinding wheel 104, the inner side wall of the device main body 1 is provided with a starting motor 107, a rotary cleaning mechanism is integrally arranged in a turntable type, after the wafer 110 is fixed, the surface of the wafer 110 is cleaned in a mutually reversing way, the rotary cleaning mechanism comprises a transmission rod 109 arranged at the output end of the starting motor 107, the transmission rod 109 penetrates to the outside of the device main body 1, the outer side wall of the transmission rod 109 is fixedly connected with the reduction grinding wheel 104, the top end of the transmission rod 109 is fixedly connected with a rotary disc 101, the upper end of the rotary disc 101 is provided with the wafer 110, both sides of the rotary disc 101 are fixedly connected with mounting lugs 102, and the mounting lugs 102 are provided with trigger magnets 103;
referring to fig. 3-4, a blowing mechanism; the device is arranged outside the mounting cavity, the surface of the wafer 110 is subjected to pre-blowing pretreatment in advance, surface particles with weaker adhesive force are blown away, the blowing mechanism comprises a gas injection cylinder 303 arranged on the inner side wall of the cleaning box 3, the output end of the gas injection cylinder 303 is communicated with a gas pipe 304, one end of the gas pipe 304, which is far away from the gas injection cylinder 303, is fixedly connected to the inner side wall of the cleaning box 3, the inner side wall of the cleaning box 3 is communicated with a plurality of bronchus 305, the bronchus 305 penetrates to the outer part of the cleaning box 3, the inner side wall of the gas injection cylinder 303 is slidably connected with a pushing piston rod 301, the bottom of the pushing piston rod 301 is fixedly connected with a pushing magnet 302, and the magnetic pole of the pushing magnet 302 is opposite to that of the triggering magnet 103;
it should be noted that; as the starting time of the starting motor 107 increases, the transmission rod 109 can synchronously rotate the rotating rod 2 faster through the rotating gear 108 and the driving gear 201, and as the rotating rod 2 and the rotating disc 101 rotate fast mutually, the contact interval between the trigger magnet 103 and the pushing magnet 302 can be increased, and as the pushing piston rod 301 is driven by the gravity of the pushing magnet 302 to fall, the pushing magnet 302 and the trigger magnet 103 are in short contact interval after the pushing piston rod 301 falls from the jet cylinder 303, and the pushing magnet 302 drives the pushing piston rod 301 to push into the jet cylinder 303, so that the jet cylinder 303 cannot jet air outwards due to the short pushing stroke of the pushing piston rod 301,
referring to fig. 5-6, a liquid spraying mechanism; the device is arranged on the side edge of the blowing mechanism, after the blowing mechanism is used for blowing and preprocessing the wafer 110, the sprinkling mechanism can automatically control and adjust the concentration of cleaning liquid according to the rotating speed of the wafer 110, the inner side wall of the round table 202 is driven to be provided with a liquid storage tank 204, the top of the liquid storage tank 204 is provided with a liquid adding port 203, the inner side wall of the liquid storage tank 204 is provided with a plurality of sprinkling pieces 4, the inner side wall of the sprinkling piece 4 is provided with a transfusion channel 402, the bottom of the inner side wall of the sprinkling piece 4 is provided with a sliding rail, and the inner side wall of the sliding rail is in sliding connection with a pushing piece 405;
further, the pushing member 405 is located at the side edge of the trigger baffle 404, the tail of the pushing member 405 is fixedly connected with a tension spring 407, the other end of the tension spring 407 is fixedly connected to the inner side wall of the spraying member 4, the end of the infusion channel 402 is provided with a liquid spraying port 401, the liquid spraying port 401 is communicated with a cleaning liquid conveying pipe 312, the cleaning liquid conveying pipe 312 penetrates into the cleaning box 3, the other end of the cleaning liquid conveying pipe 312 is communicated into the water conveying thick pipe 309, the outer side wall of the spraying member 4 is provided with a liquid collecting plate 408, the liquid collecting plate 408 is provided with a liquid receiving pipe 409, the liquid receiving pipe 409 penetrates into the infusion channel 402, the inner side wall of the infusion channel 402 is slidably connected with the trigger baffle 404, and the upper end of the trigger baffle 404 is fixedly connected with a reset spring 403;
it should be noted that; as the cleaning time increases, dirt on the surface of the wafer 110 will be less and less, and the mixture of water and cleaning solution for cleaning the surface of the wafer 110 will slowly fall into the water receiving box 106 for storage, as the cleaning time increases, the mixture of water and cleaning solution stored in the water receiving box 106 will be more and more, the contact grinding wheel 111 at the bottom of the water receiving box 106 contacts the deceleration grinding wheel 104, at this time, the friction force between the contact grinding wheel 111 and the deceleration grinding wheel contacts the deceleration grinding wheel 104, so that the rotation speed of the transmission rod 109 will be slightly slowed, at this time, the rotation speed of the rotation rod 2 will also be slowed by the action of the rotation gear 108 and the driving gear 201;
referring to fig. 7-8, one end of the return spring 403, which is far away from the infusion channel 402, is fixedly connected to the inner side wall of the spraying member 4, a plurality of cleaning liquid passing holes 406 are formed in the lower end of the trigger baffle 404, both ends of the trigger baffle 404 penetrate through the outer part of the infusion channel 402, the spraying mechanism comprises a water storage tank 307 fixedly connected to the inner side wall of the cleaning tank 3, a water filling port 308 capable of being blocked is formed in the outer side wall of the upper end of the water storage tank 307, a water delivery thick pipe 309 is arranged at the bottom of the water filling port 308 in a communicating manner, a water delivery pipe 310 is arranged at the bottom of the water delivery thick pipe 309 in a communicating manner, a plurality of water delivery branch pipes 311 are arranged at the water delivery pipe 310 in a tilting manner, a cleaning sponge 306 is arranged at the bottom of the cleaning tank 3, and the other end of the water delivery branch pipes 311 are communicated to the inner part of the cleaning sponge 306.
The working principle of the cleaning device for reducing particles on the surface of a semiconductor substrate wafer is as follows:
when the rotary disc type cleaning machine is used, an operator can firstly install a wafer 110 on the rotary disc 101, after the installation is finished, the operator can drive the rotary disc 101 to rotate through the driving rod 109 by the starting motor 107, when the driving rod 109 is driven by the starting motor 107 to rotate, a slow-to-block rotation process exists, and therefore three steps exist in driving the round table 202 and the cleaning box 3 under the driving of the driving rod 109;
a semiconductor substrate wafer surface particle pre-cleaning stage: when the motor 107 is started to drive the transmission rod 109 to slowly rotate, the transmission rod 201 is driven by the rotation gear 108 to drive the transmission gear 201 to enable the rotation rod 2 to slowly rotate, the corresponding rotation rod 2 drives the round table 202 to drive the cleaning box 3 to slowly clean the wafer 110 on the rotating disc 101, the cleaning box 3 and the rotating disc 101 can mutually reversely move under the meshing transmission of the rotation gear 108 and the transmission gear 201, the trigger magnet 103 rotates to the position right below the push magnet 302, the push magnet 302 pushes the push piston rod 301 to squeeze into the jet cylinder 303 through repulsive magnetic force, and the cleaning box 3 and the rotating disc 101 continuously rotate, when the push magnet 302 and the trigger magnet 103 are mutually far away, the piston rod 301 is pushed downwards under the driving of gravity of the push magnet 302, so that the piston rod 301 can be reciprocally moved in the jet cylinder 303 by the magnetic force and the gravity of the push magnet 302, and the cleaning box 3 can be weakly blown out of the cleaning box 3 through a plurality of vertically downward branch air pipes 305, and the cleaning sponge 306 can be matched with the wafer 110 to clean the wafer in advance, and scratches on the surface can be conveniently cleaned, and the scratches on the wafer can be avoided;
and a stage of fully cleaning particles on the surface of the semiconductor substrate wafer: along with the increase of the starting time of the starting motor 107, the transmission rod 109 can synchronously rotate the rotation rod 2 faster through the rotation gear 108 and the driving gear 201, at this time, the spraying piece 4 positioned in the liquid storage tank 204 can rotate the round table 202 equally fast, and the cleaning liquid added into the liquid storage tank 204 through the liquid filling opening 203 can enter the transfusion channel 402 through the liquid receiving pipe 409 under the action of centrifugal force;
at this time, under the action of a larger centrifugal force, the pushing member 405 is made to contact with the lower end of the trigger baffle 404 against the pulling force of the tension spring 407, so that the trigger baffle 404 is slowly pushed up along the contact end of the pushing member 405 until the tail end of the pushing member 405 contacts with the lower end of the trigger baffle 404, at this time, two cleaning liquid passing holes 406 formed in the lower end of the trigger baffle 404 are all pushed into the infusion channel 402, correspondingly, the cleaning liquid in the infusion channel 402 is largely thrown out through the two cleaning liquid passing holes 406 and is conveyed into the water conveying rough pipe 309 through the liquid sprinkling hole 401 and the cleaning liquid conveying pipe 312, and is mixed with water conveyed by the water conveying rough pipe 309, and is conveyed by the branch of the water conveying pipe 310 and the water conveying branch pipe 311, so that the water mixed with more cleaning liquid is absorbed by the cleaning sponge 306, and the cleaning liquid is cleaned on the surface of the wafer 110 through the cleaning sponge 306, so that the cleaning effect of the surface of the wafer 110 is better;
a step of spraying cleaning liquid on the surface particles of the semiconductor substrate wafer in a self-adaptive manner; as the cleaning time increases, dirt on the surface of the wafer 110 will be less and less, the mixture of water and cleaning solution for cleaning the surface of the wafer 110 will slowly fall into the water receiving box 106 for storage, as the cleaning time increases, the mixture of water and cleaning solution stored in the water receiving box 106 will be more and more, at this time, the dead weight of the water receiving box 106 will be greater and greater, when the dead weight of the water receiving box 106 reaches the threshold value, the water receiving box 106 will overcome the elasticity of the elastic rod 105 and slowly decrease until the contact grinding wheel 111 at the bottom of the water receiving box 106 contacts the deceleration grinding wheel 104, at this time, the friction force between the contact grinding wheel 111 and the water receiving box contacts the deceleration grinding wheel 104 will slow the rotation speed of the transmission rod 109 slightly, at this time, the rotation speed of the rotation rod 2 will also slow through the actions of the rotation gear 108 and the driving gear 201;
when the rotary rod 2 drives the round table 202 to rotate slowly, the centrifugal force borne by the pushing member 405 becomes smaller, at this moment, the pushing member 405 is pulled to move to the right by a small distance under the action of the tension spring 407, at this moment, the lower front end of the pushing member 405 contacts the bottom end of the trigger baffle 404, and under the action of the elasticity of the return spring 403, the trigger baffle 404 moves downwards by a small distance, at this moment, the upper and lower cleaning liquid passing holes 406 originally in the transfusion channel 402 are ejected by one, the transfusion channel 402 which is sprayed with liquid outwards through the two cleaning liquid passing holes 406 becomes to spray liquid through one cleaning liquid passing hole 406, at this moment, the cleaning liquid conveyed into the water conveying thick pipe 309 through the cleaning liquid conveying pipe 312 becomes smaller, so that the effect of automatically reducing the use proportion of the cleaning liquid according to the cleaning time is achieved, the phenomenon that too much cleaning liquid is left on the surface of the wafer 110, and the use of the wafer 110 is affected is avoided;
a stage of residual treatment of the cleaning solution on the surface of the semiconductor substrate wafer; the cleaning solution collected in the water receiving box 106 is more and more, this results in the contact between the contact grinding wheel 111 at the bottom of the water receiving box 106 and the deceleration grinding wheel 104 being tighter, at this time, the friction force continues to increase, the rotation speed of the transmission rod 109 and the rotation rod 2 is slower, when the round table 202 is driven to rotate at a very slow speed, at this time, very small centrifugal force is insufficient to overcome the pulling force of the tension spring 407 to throw the pushing member 405, the pushing member 405 drives the trigger baffle 404 to return to the original position, the infusion channel 402 is blocked, the infusion channel 402 is not conveying the cleaning solution outwards through the cleaning solution conveying pipe 312, at this time, the mixing of the cleaning solution is not performed, the liquid water conveying coarse pipe 309 can independently convey liquid water to enable the cleaning sponge 306 to absorb, the cleaning solution remained on the surface of the wafer 110 is cleaned, at this time, the slow rotation speed between the round table 202 and the rotation disc 101 is driven while the cleaning sponge 306 cleans the surface of the wafer 110 through pure water, the magnet 302 and the trigger magnet 103 can be pushed back to the original contact state, the steps are repeated, at the same time, the cleaning sponge 306 is cleaned by the sponge 306, the wafer 110 is blown to clean the wafer 110 is further cleaned through the sponge, the wafer 110 is cleaned, the wafer is cleaned through the wafer after the wafer is cleaned, and the wafer 110 is cleaned, and the wafer is efficiently.
It should be noted that, specific model specifications of the motor need to be determined by selecting a model according to actual specifications of the device, and a specific model selection calculation method adopts the prior art in the field, so detailed description is omitted.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, and various modifications and variations may be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The cleaning device for reducing particles on the surface of a semiconductor substrate wafer is characterized by comprising a device main body (1), wherein a starting motor (107) is arranged on the inner side wall of the device main body (1);
rotating the cleaning mechanism; the whole is arranged in a turntable type, and after the wafer (110) is fixed, the surface of the wafer (110) is cleaned in a mutually reversing way;
a blowing mechanism; the surface of the wafer (110) is subjected to pre-blowing pretreatment in advance outside the mounting cavity, so that surface particles with weaker adhesive force are blown away;
a liquid sprinkling mechanism; the device is arranged on the side of the blowing mechanism, and after the blowing mechanism is used for blowing and preprocessing the wafer (110), the sprinkling mechanism can automatically control and adjust the concentration of the cleaning liquid according to the rotating speed of the wafer (110).
2. The cleaning device for reducing particles on the surface of a semiconductor substrate wafer according to claim 1, wherein the rotary cleaning mechanism comprises a transmission rod (109) arranged at the output end of a starting motor (107), the transmission rod (109) penetrates through the outside of the device main body (1), a reduction grinding wheel (104) is fixedly connected to the outer side wall of the transmission rod (109), a rotary disc (101) is fixedly connected to the top end of the transmission rod (109), a wafer (110) is arranged at the upper end of the rotary disc (101), mounting lugs (102) are fixedly connected to two sides of the rotary disc (101), and a trigger magnet (103) is arranged on the mounting lugs (102).
3. The cleaning device for reducing particles on the surface of a semiconductor substrate wafer according to claim 1, wherein a plurality of elastic rods (105) are fixedly connected to the outer side wall of the device main body (1), water receiving boxes (106) are fixedly connected to the upper ends of the elastic rods (105), and contact grinding wheels (111) corresponding to the speed reducing grinding wheels (104) are fixedly connected to the bottoms of the water receiving boxes (106).
4. The cleaning device for reducing surface particles of semiconductor substrate wafers according to claim 1, wherein the inner side wall of the device main body (1) is rotationally connected with a rotating rod (2), the outer side walls of the device main body (1) and the rotating rod (2) are respectively sleeved with a rotating gear (108) and a driving gear (201), the rotating gear (108) and the driving gear (201) are meshed, the upper end part of the rotating rod (2) is fixedly connected with a driving round table (202), and cleaning boxes (3) are respectively arranged on two sides of the driving round table (202).
5. The cleaning device for reducing particles on the surface of a semiconductor substrate wafer according to claim 1, wherein the blowing mechanism comprises a jet cylinder (303) arranged on the inner side wall of the cleaning box (3), the inner side wall of the jet cylinder (303) is slidably connected with a pushing piston rod (301), the bottom of the pushing piston rod (301) is fixedly connected with a pushing magnet (302), and the magnetic pole of the pushing magnet (302) is opposite to the magnetic pole of the triggering magnet (103).
6. The cleaning device for reducing particles on a surface of a semiconductor substrate wafer according to claim 5, wherein the output end of the air injection cylinder (303) is communicated with an air pipe (304), one end of the air pipe (304) away from the air injection cylinder (303) is fixedly connected to the inner side wall of the cleaning box (3), a plurality of branch pipes (305) are communicated with the inner side wall of the cleaning box (3), and the branch pipes (305) penetrate through the cleaning box (3).
7. The cleaning device for reducing particles on the surface of a semiconductor substrate wafer according to claim 1, wherein the liquid spraying mechanism comprises a water storage tank (307) fixedly connected to the inner side wall of the cleaning tank (3), a water filling port (308) capable of blocking a port is arranged on the outer side wall of the upper end of the water storage tank (307), a water delivery rough pipe (309) is arranged at the bottom of the water filling port (308) in a communicating manner, a water delivery pipe (310) is arranged at the bottom of the water delivery rough pipe (309) in a communicating manner, the water delivery pipe (310) is obliquely arranged, a plurality of water delivery branch pipes (311) are arranged at the water delivery pipe (310) in a communicating manner, a cleaning sponge (306) is arranged at the bottom of the cleaning tank (3), and the other end of the water delivery branch pipe (311) is communicated to the inside of the cleaning sponge (306).
8. The cleaning device for reducing particles on the surface of a semiconductor substrate wafer according to claim 4, wherein the inner side wall of the driving round table (202) is provided with a liquid storage tank (204), the top of the liquid storage tank (204) is provided with a liquid filling opening (203), the inner side wall of the liquid storage tank (204) is provided with a plurality of spraying pieces (4), the inner side wall of the spraying pieces (4) is provided with a liquid collecting plate (408), the outer side wall of the spraying pieces (4) is provided with a liquid collecting pipe (409), the liquid collecting pipe (409) penetrates into the liquid conveying channel (402), the inner side wall of the liquid conveying channel (402) is connected with a trigger baffle (404) in a sliding mode, and two ends of the trigger baffle (404) penetrate out of the liquid conveying channel (402).
9. The cleaning device for reducing particles on the surface of a semiconductor substrate wafer according to claim 8, wherein a reset spring (403) is fixedly connected to the upper end of the trigger baffle (404), one end of the reset spring (403) away from the infusion channel (402) is fixedly connected to the inner side wall of the spraying member (4), and a plurality of cleaning liquid passing holes (406) are formed in the lower end of the trigger baffle (404).
10. The cleaning device for reducing particles on the surface of a semiconductor substrate wafer according to claim 8, wherein a sliding rail is arranged at the bottom of the inner side wall of the spraying member (4), a pushing member (405) is slidably connected to the inner side wall of the sliding rail, the pushing member (405) is located at the side edge of the trigger baffle (404), a tension spring (407) is fixedly connected to the tail of the pushing member (405), the other end of the tension spring (407) is fixedly connected to the inner side wall of the spraying member (4), a liquid spraying opening (401) is formed in the end part of the liquid conveying channel (402), a cleaning liquid conveying pipe (312) is communicated with the liquid spraying opening (401), the cleaning liquid conveying pipe (312) penetrates into the cleaning box (3), and the other end of the cleaning liquid conveying pipe (312) is communicated to the inner part of the water conveying thick pipe (309).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310635663.XA CN116586376A (en) | 2023-06-01 | 2023-06-01 | Cleaning device for reducing particles on surface of semiconductor substrate wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310635663.XA CN116586376A (en) | 2023-06-01 | 2023-06-01 | Cleaning device for reducing particles on surface of semiconductor substrate wafer |
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| CN202310635663.XA Pending CN116586376A (en) | 2023-06-01 | 2023-06-01 | Cleaning device for reducing particles on surface of semiconductor substrate wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118168316A (en) * | 2024-05-13 | 2024-06-11 | 安徽旭腾微电子设备有限公司 | Heating system for double-tube vacuum vertical furnace |
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2023
- 2023-06-01 CN CN202310635663.XA patent/CN116586376A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118168316A (en) * | 2024-05-13 | 2024-06-11 | 安徽旭腾微电子设备有限公司 | Heating system for double-tube vacuum vertical furnace |
| CN118168316B (en) * | 2024-05-13 | 2024-07-19 | 安徽旭腾微电子设备有限公司 | Heating system for double-tube vacuum vertical furnace |
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