CN116581201B - Photovoltaic module preparation method, solder strip part and photovoltaic module - Google Patents
Photovoltaic module preparation method, solder strip part and photovoltaic module Download PDFInfo
- Publication number
- CN116581201B CN116581201B CN202310847803.XA CN202310847803A CN116581201B CN 116581201 B CN116581201 B CN 116581201B CN 202310847803 A CN202310847803 A CN 202310847803A CN 116581201 B CN116581201 B CN 116581201B
- Authority
- CN
- China
- Prior art keywords
- strip
- flux
- solder
- assembly
- photovoltaic cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 167
- 238000002360 preparation method Methods 0.000 title abstract description 20
- 230000004907 flux Effects 0.000 claims abstract description 182
- 238000003466 welding Methods 0.000 claims abstract description 158
- 238000005476 soldering Methods 0.000 claims abstract description 129
- 238000007747 plating Methods 0.000 claims abstract description 32
- 238000003475 lamination Methods 0.000 claims abstract description 15
- 238000005096 rolling process Methods 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 31
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 239000002313 adhesive film Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000002203 pretreatment Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 15
- 238000009736 wetting Methods 0.000 abstract description 7
- 238000010248 power generation Methods 0.000 abstract description 3
- 229910052718 tin Inorganic materials 0.000 description 14
- 229910052797 bismuth Inorganic materials 0.000 description 9
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000012528 membrane Substances 0.000 description 6
- 239000003292 glue Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000013268 sustained release Methods 0.000 description 1
- 239000012730 sustained-release form Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a photovoltaic module preparation method, a welding strip part and a photovoltaic module, which are applied to the field of photovoltaic power generation and comprise the following steps: the solder strip with the flux disposed therein is rolled to release and adhere at least a portion of the flux to the surface of the solder strip to provide a pre-treated solder strip, the flux disposed in a flux carrying sub-assembly of the solder strip, the solder strip further comprising a solder strip plating sub-assembly and a central conductive strip assembly. Fixing the pretreatment welding strip on the surface of a grid line of a photovoltaic cell to obtain a photovoltaic cell assembly, respectively arranging cover plates on the front light inlet side and the back side of the photovoltaic cell assembly to obtain a photovoltaic assembly to be pressed, and carrying out lamination treatment on the photovoltaic assembly to be pressed to obtain the photovoltaic assembly. According to the invention, the solder strip with the soldering flux arranged inside is rolled so that at least part of the soldering flux migrates to the surface of the solder strip, and then the solder strip is laid on the grid line of the photovoltaic cell, so that the wetting of soldering tin can be increased, the surface oxide can be removed, and the low-temperature welding quality can be improved.
Description
Technical Field
The invention relates to the field of photovoltaic power generation, in particular to a photovoltaic module preparation method, a welding strip part and a photovoltaic module.
Background
Taking the photovoltaic module without the main grid in the prior photovoltaic module as an example, the interconnection technology of the photovoltaic module without the main grid basically uses a low-temperature welding strip to weld with the grating, but when the low-temperature welding strip is used, the content of the metal bismuth is particularly important in the low-temperature heating process. When the content of the metal bismuth is too high and too low, the effective welding of the welding strip cannot be guaranteed, the welding strip cannot be effectively combined with the fine grid, the current collecting capacity is reduced, the power of the assembly is reduced, or the brittleness of the welding strip is increased, and the welding reliability is reduced.
Disclosure of Invention
In view of the above, the invention aims to provide a photovoltaic module preparation method, a solder strip part and a photovoltaic module, which solve the problems that the solder strip and a grid line cannot be effectively welded when the content of metal bismuth is too high and too low in the prior art, and the reliability of low-temperature welding of the solder strip is low.
In order to solve the technical problems, the invention provides a preparation method of a photovoltaic module, which comprises the following steps:
carrying out rolling treatment on a welding strip with soldering flux arranged inside so as to release and attach at least part of the soldering flux to the surface of the welding strip, thereby obtaining a pretreated welding strip; the flux is disposed in a flux carrying sub-component of a solder ribbon, the solder ribbon further comprising a solder ribbon plated sub-component and a central conductive ribbon component;
fixing the pretreatment welding strip on the surface of a grid line of the photovoltaic cell to obtain a photovoltaic cell assembly;
cover plates are respectively arranged on the front light entering side and the back side of the photovoltaic cell assembly to obtain a photovoltaic assembly to be pressed;
laminating the photovoltaic module to be laminated to obtain a photovoltaic module;
the central conductive strap member is disposed in a central location of the solder strap plating sub-member, and the flux carrying sub-member is disposed in the solder strap plating sub-member and outside of the central conductive strap member.
Optionally, the rolling treatment is performed on the solder strip with the flux disposed therein, so that at least part of the flux is released and attached to the surface of the solder strip, and a pretreated solder strip is obtained, which includes:
carrying out rolling treatment on the welding strip so as to release and attach at least part of the soldering flux to the surface of the welding strip, and carving reflective patterns on the surface of the welding strip through the rolling treatment;
and taking the rolled welding strip as the pretreatment welding strip.
Optionally, the fixing the pretreatment solder strip on the surface of the grid line of the photovoltaic cell includes:
and adhering and fixing the pretreatment welding strip on the surface of the grid line of the photovoltaic cell by using a die bonding adhesive or a carrier film.
Optionally, before the front light entering side and the back side of the photovoltaic cell assembly are respectively provided with the cover plates, the method further includes:
a first adhesive film is arranged on the light incident side of the front surface of the photovoltaic cell assembly, and a second adhesive film is arranged on the back side of the photovoltaic cell assembly;
correspondingly, the front light incident side and the back side of the photovoltaic cell assembly are respectively provided with a cover plate, so that the photovoltaic cell assembly is obtained, and the photovoltaic cell assembly comprises:
and a front cover plate is arranged on one side of the first adhesive film, which is opposite to the photovoltaic cell assembly, and a back cover plate is arranged on one side of the second adhesive film, which is opposite to the photovoltaic cell assembly, so that the photovoltaic assembly to be pressed is obtained.
Optionally, rolling the solder strip with the flux disposed therein to obtain a pretreated solder strip, including:
carrying out rolling treatment on the welding strip so as to release and attach the soldering flux in a first preset area in the welding strip to the surface of the welding strip, thereby obtaining the pretreated welding strip;
correspondingly, the laminating treatment is performed on the photovoltaic module to be laminated to obtain the photovoltaic module, which comprises the following steps:
and carrying out lamination treatment on the photovoltaic module to be laminated, releasing the soldering flux in a second preset area in the pretreatment welding strip and attaching the soldering flux to the surface of the pretreatment welding strip, and completing low-temperature welding of the pretreatment welding strip and the grid line to obtain the photovoltaic module.
The invention also provides a welding strip part, which is applied to the preparation method of the photovoltaic module, and comprises the following steps:
a flux carrier sub-assembly, a solder ribbon plating sub-assembly, and a center conductive ribbon assembly;
the central conductive strap member is disposed at a central location of the solder strap plated sub-member;
the flux carrying sub-assembly is disposed in the solder strip plating sub-assembly and the flux carrying sub-assembly is disposed outside of the central conductive strip assembly.
Optionally, the soldering flux bearing sub-component is at least arranged in a first preset area and a second preset area;
the soldering flux bearing sub-component in the first preset area is used for releasing soldering flux during rolling treatment so that the soldering flux is attached to the surface of the welding strip component;
the flux carrying sub-assembly in the second predetermined area is configured to release flux during the lamination process to adhere the flux to the surface of the solder strip assembly.
Optionally, the flux carrier sub-assembly includes a plurality of core tubes disposed within the solder ribbon plating sub-assembly circumferentially along the central conductive ribbon sub-assembly.
Optionally, a plurality of said core tubes are symmetrically disposed along said central conductive strap member.
The invention also provides a photovoltaic module, comprising:
the photovoltaic cell comprises a front cover plate, a photovoltaic cell, a pretreatment welding strip and a back cover plate;
the pretreatment welding strip is obtained by rolling the welding strip part; the soldering flux in the solder strip part is released and attached to the surface of the solder strip part after rolling treatment;
the pretreatment welding strip is fixed on the surface of the grid line of the photovoltaic cell; and the front light incident side and the back side of the photovoltaic cell fixed with the pretreatment welding strip are respectively provided with a cover plate.
It can be seen that the method for manufacturing a photovoltaic module provided by the invention comprises the steps of rolling a solder strip with a soldering flux arranged therein so as to release and attach at least part of the soldering flux to the surface of the solder strip, thereby obtaining a pretreated solder strip, wherein the soldering flux is arranged in a soldering flux bearing sub-component of the solder strip, and the solder strip further comprises a solder strip plating sub-component and a central conductive strip component. Fixing the pretreatment welding strip on the surface of a grid line of a photovoltaic cell to obtain a photovoltaic cell assembly, respectively arranging cover plates on the front light inlet side and the back side of the photovoltaic cell assembly to obtain a photovoltaic assembly to be pressed, and carrying out lamination treatment on the photovoltaic assembly to be pressed to obtain the photovoltaic assembly. The central conductive strap member is disposed in a central location of the solder ribbon plated sub-member, and the flux carrying sub-member is disposed in the solder ribbon plated sub-member and outside of the central conductive strap member. According to the invention, the soldering tape internally provided with the soldering flux is rolled, so that the soldering flux in the soldering tape is released and attached to the surface of the soldering tape, and then the soldering tape is laid on the grid line of the photovoltaic cell, so that the wetting of soldering tin can be increased, the surface oxide can be removed, the soldering quality of the low-temperature soldering tape is improved, and meanwhile, the preparation efficiency of the photovoltaic module is improved.
In addition, the invention also provides a welding strip part and a photovoltaic module, which have the same beneficial effects.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a method for manufacturing a photovoltaic module according to an embodiment of the present invention;
fig. 2 is a flowchart of another method for manufacturing a photovoltaic module according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a rolling structure according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a solder strip component according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a pre-processing solder strip according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a photovoltaic cell module in a photovoltaic module according to an embodiment of the present invention;
in fig. 3 to 6, reference numerals are explained as follows:
1-a photovoltaic cell;
2-pre-treating the welding strip, and 21-pre-treating reflective patterns in the welding strip;
3-grid lines;
10-a flux carrier sub-assembly, 11-a flux carrier sub-assembly that completely releases flux, 12-a flux carrier sub-assembly in a semi-released state, 13-flux that adheres to the surface of the solder strip;
20-solder strip plating of the sub-component;
30-a central conductive strap member;
40-gear transfer teeth;
50-breaking tin teeth.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
At present, the field of solar cells and components, cost reduction and synergy are the main development direction of the industry. In the non-silicon cost, the silver paste material used for battery printing occupies the first place of cost, and in order to further reduce the use amount of silver paste, no main grid photovoltaic component is generated. And interconnection technology of the photovoltaic modules without main grids is the main research direction of the current industry.
However, the existing interconnection technology of the photovoltaic modules without the main grid basically uses a low-temperature welding belt, and the content of the metal bismuth is particularly important in the welding process of low-temperature heating. When the content of the metal bismuth is too high, brittleness of the welding belt becomes large, experiments such as wet freezing at the reliability end of the assembly cannot meet the use requirements, and failure conditions such as tin stacking of the welding belt easily occur in the manufacturing process. However, when the content of the metal bismuth is too low, the solder strip cannot be effectively combined with the fine grid, the current collecting capability is reduced, the power of the assembly is reduced, and the risk in reliability such as thermal cycle is also increased sharply, so that a high-quality low-temperature welding method is needed to be provided, and the welding quality of the solder strip and the grid line in the photovoltaic assembly is improved.
According to the photovoltaic module, the soldering strip with the soldering flux arranged inside is rolled so that the soldering flux in the soldering strip is released and attached to the surface of the soldering strip, and then the soldering strip is laid on the grid line of the photovoltaic cell, so that the wetting of soldering tin can be increased, surface oxides can be removed, the welding quality of the low-temperature soldering strip is improved, meanwhile, the soldering flux is arranged inside the soldering strip, and the soldering flux is released to the surface of the soldering strip through the rolling treatment during welding, so that the preparation efficiency of the photovoltaic module is improved.
Example 1:
referring to fig. 1, fig. 1 is a flowchart of a method for manufacturing a photovoltaic module according to an embodiment of the present invention. The method may include:
s101: carrying out rolling treatment on the welding strip with the soldering flux arranged inside so as to release and attach at least part of the soldering flux to the surface of the welding strip, thereby obtaining a pretreated welding strip; the flux is disposed in a flux carrying sub-assembly of the solder ribbon, which further includes a solder ribbon plated sub-assembly and a central conductive ribbon assembly.
The execution subject of this embodiment is a photovoltaic module manufacturing apparatus. By rolling the solder tape in which the flux is provided, the flux provided in the flux carrier member can be caused to flow out, migrate to the surface of the solder tape, and the solder tape in which the flux is released and attached to the surface is used as a pre-treated solder tape. In this embodiment, a part of the flux in the partial solder strip may be released and attached to the surface of the solder strip as a pretreatment solder strip, or the whole flux in the solder strip may be released and attached to the surface of the solder strip as a pretreatment solder strip. The solder strip in this embodiment includes a flux carrying sub-component, a solder strip plating sub-component, and a central conductive strip component, where the central conductive strip component is disposed at a central location of the solder strip plating sub-component, and the flux carrying sub-component is disposed in the solder strip plating sub-component and outside of the central conductive strip component, and the central conductive strip component and the flux carrying sub-component may co-extend with the solder strip plating sub-component. It should be further noted that, in this embodiment, after the welding strip is welded to the battery grid line, the central conductive strip is electrically connected to the battery grid line, and because copper has good conductivity and low manufacturing cost, this embodiment can set the central conductive strip as a central copper strip, but other conductive materials are covered in this scheme as well.
The rolling of the solder strip in this embodiment may take place in a number of ways, with openings being provided in the surface of the solder strip by sharp cutting tools to facilitate the release of flux from the flux carrier member. The embodiment adopts automation equipment, through setting up at least one gear, and this gear surface includes the broken tin tooth that can puncture cladding sub-assembly and scaling powder carrier sub-assembly in the welding strip of welding strip to and the pressfitting tooth that pressfitting was carried out to the welding strip, it is anticipated that broken tin tooth possesses sharp tooth face, and this broken tin tooth can puncture scaling powder carrier sub-assembly when acting on the welding strip surface, release scaling powder. Referring to fig. 3 specifically, fig. 3 is a schematic structural diagram of a rolling structure according to an embodiment of the present invention. In this embodiment, fig. 3 adopts two gears with tin breaking teeth, and the gears are arranged on two sides of the welding strip, and in fig. 3, the welding strip is clamped between the two gears, and the gears roll the welding strip through rotation, and meanwhile, the welding strip is driven to move, so that automatic rolling treatment can be realized. The soldering flux in this embodiment may include components such as an active agent, a neutralizing sustained-release agent, and a corrosion inhibitor, and may be specifically set according to an actual preparation process. The solder strip plating sub-component can be composed of tin, bismuth, silver and other metals, and the content of bismuth in the solder strip plating sub-component can be between ten percent and thirty percent in order to ensure the welding efficiency and avoid the influence of the too high or the too low of the bismuth on the welding. In order to facilitate the rolling process of the solder ribbon plated sub-assembly while protecting the central conductive ribbon assembly and the flux carrying sub-assembly, the thickness of the solder ribbon plated sub-assembly may be set between 0.08 mm and 0.15 mm.
Further, in order to improve the light absorption efficiency of the photovoltaic module, the rolling treatment is performed on the solder strip provided with the soldering flux, so that at least part of the soldering flux is released and attached to the surface of the solder strip, and the pre-treatment solder strip is obtained, which may include the following steps:
carrying out rolling treatment on the welding strip so as to release and attach at least part of soldering flux to the surface of the welding strip, and engraving reflective patterns on the surface of the welding strip through the rolling treatment;
and taking the rolled welding strip as a pretreatment welding strip.
In this embodiment, the reflection of the light beam irradiated to the surface of the solder strip can be increased by carving the reflective pattern on the surface of the solder strip while releasing the flux by rolling treatment, so that the light beam irradiated to the surface of the solder strip is re-reflected into the photovoltaic cell. In this embodiment, the reflective pattern engraved on the surface of the solder strip may be arbitrarily set, and this embodiment is not limited as long as the light beam irradiated to the solder strip can be reflected and at least partially reflected into the photovoltaic cell. It should be further noted that, in this embodiment, the reflective pattern may be set to be a reflective irregular pattern, so that the light beam irradiating the to-be-welded strip is diffusely reflected, and part of the light beam is reflected to the photovoltaic cell, so as to reduce the complexity of preparing the reflective pattern.
S102: and fixing the pretreatment welding strip on the surface of the grid line of the photovoltaic cell to obtain the photovoltaic cell assembly.
In the embodiment, the pre-treatment welding strip with the soldering flux on the surface is fixed on the surface of the grid line of the photovoltaic cell and is attached to the grid line of the photovoltaic cell, so that the welding strip and the photovoltaic cell are welded in the subsequent process. The present embodiment is not limited to a specific manner of fixing the pretreatment solder strip to the surface of the photovoltaic cell grid line, and may be any manner as long as the pretreatment solder strip and the grid line can be firmly connected. For example, the pre-treatment solder strip may be fixed on the surface of the grid line by using a die bond adhesive, or may be fixed on the surface of the grid line by using other existing or future fixing modes, which is not limited in this embodiment.
Further, in order to improve the flexibility and convenience of fixing the pretreatment solder strip to the grid line, the fixing the pretreatment solder strip on the surface of the grid line of the photovoltaic cell may include:
and adhering and fixing the pretreatment welding strip on the surface of the grid line of the photovoltaic cell by using the die bond adhesive or the carrier film.
It should be noted that, in this embodiment, the pre-treatment welding strip is fixed on the surface of the grid line through the die bond glue or the carrier film, so that the pre-treatment welding strip can be flexibly arranged at any position on the surface of the grid line, and the low-temperature welding efficiency of the pre-treatment welding strip and the grid line is improved. The embodiment is not limited to a specific kind of die bond adhesive, as long as the pre-processing solder strip and the grid line can be fixedly connected. For example, the die bond adhesive may be one of solder paste, conductive adhesive or insulating adhesive, and the type of die bond adhesive may be determined according to the actual soldering process.
S103: and respectively arranging cover plates on the front light incident side and the back side of the photovoltaic cell assembly to obtain the photovoltaic assembly to be pressed.
In the embodiment, the cover plates are respectively arranged on the front light incident side and the back side of the photovoltaic cell assembly with the laid pretreatment welding strips so as to package the photovoltaic cell assembly, and the photovoltaic assembly to be pressed is obtained. In this embodiment, the front light incident side and the back side of the photovoltaic cell assembly are two sides aligned along the photovoltaic cell assembly, where the front light incident side is a side of the photovoltaic cell assembly that absorbs light energy and converts the light energy into electric energy. It should be noted that, if the photovoltaic cell assembly is a bifacial photovoltaic solar panel, that is, two sides of the photovoltaic cell assembly along the alignment can absorb light energy and convert the light energy to generate power, at this time, the photovoltaic cell assembly sets two sides of the photovoltaic solar panel, one side of the two sides can be selected as the front light entering side at will, and the other side of the opposite side is set as the back side, which means that other photovoltaic cell assemblies can also adjust the front light entering side and the back side without being limited to one of the conventional photovoltaic cell assemblies.
Further, in order to improve the connection stability between the photovoltaic cell assembly and the cover plate, before the front light incident side and the back side of the photovoltaic cell assembly are respectively provided with the cover plate, the method may further include:
a first adhesive film is arranged on the light incident side of the front surface of the photovoltaic cell assembly, and a second adhesive film is arranged on the back side of the photovoltaic cell assembly;
correspondingly, the front light entering side and the back side of the photovoltaic cell assembly are respectively provided with a cover plate, so that the photovoltaic cell assembly is obtained, and the method can comprise the following steps:
and a front cover plate is arranged on one side of the first adhesive film, which is back to the photovoltaic cell assembly, and a back cover plate is arranged on one side of the second adhesive film, which is back to the photovoltaic cell assembly, so that the photovoltaic assembly to be pressed is obtained.
It should be noted that, in this embodiment, through setting up first glued membrane and second glued membrane respectively in the front income light side and the dorsal part of photovoltaic cell subassembly to set up the apron respectively in the both sides that first glued membrane and second glued membrane were carried forward to photovoltaic cell subassembly, can be through first glued membrane and second glued membrane with photovoltaic cell subassembly and backplate firm gluing, play the cushioning effect in preparation processes such as follow-up lamination simultaneously, avoid the apron to damage photovoltaic cell subassembly.
S104: and carrying out lamination treatment on the photovoltaic module to be pressed to obtain the photovoltaic module.
In this embodiment, the photovoltaic module to be pressed is laminated, so that the solder strip with the surface migrated from the soldering flux can be more tightly connected in the grid line of the photovoltaic cell, and the low-temperature welding quality of the photovoltaic module is improved.
The photovoltaic module preparation method provided by the embodiment of the invention comprises the steps of rolling a welding strip with soldering flux arranged inside so as to release and attach at least part of the soldering flux to the surface of the welding strip, so as to obtain a pretreated welding strip, wherein the soldering flux is arranged in a soldering flux bearing sub-component of the welding strip, and the welding strip further comprises a welding strip plating sub-component and a central conductive strip component. Fixing the pretreatment welding strip on the surface of a grid line of a photovoltaic cell to obtain a photovoltaic cell assembly, respectively arranging cover plates on the front light inlet side and the back side of the photovoltaic cell assembly to obtain a photovoltaic assembly to be pressed, and carrying out lamination treatment on the photovoltaic assembly to be pressed to obtain the photovoltaic assembly. According to the invention, the soldering tape internally provided with the soldering flux is rolled, so that the soldering flux in the soldering tape is released and attached to the surface of the soldering tape, and then the soldering tape is laid on the grid line of the photovoltaic cell, so that the wetting of soldering tin can be increased, the surface oxide can be removed, the soldering quality of the low-temperature soldering tape is improved, and meanwhile, the preparation efficiency of the photovoltaic module is improved. In addition, by carving reflective patterns on the surface of the welding strip while rolling and processing to release the soldering flux, the reflection of the light beam irradiated on the surface of the welding strip can be increased, so that the light beam irradiated on the surface of the welding strip is reflected into the photovoltaic cell again, and the power generation efficiency of the photovoltaic cell is improved; the pretreatment welding strip is adhered and fixed on the surface of the grid line through the die bond glue or the carrier film, so that the pretreatment welding strip can be flexibly arranged at any position on the surface of the grid line, and the low-temperature welding efficiency of the pretreatment welding strip and the grid line is improved; the photovoltaic cell assembly and the backboard can be firmly glued by utilizing the first glue film and the second glue film, and meanwhile, a buffer effect is achieved in the preparation process of subsequent lamination and the like, so that the photovoltaic cell assembly is prevented from being damaged by the cover plate.
Example 2:
referring to fig. 2, fig. 2 is a flowchart of another method for manufacturing a photovoltaic module according to an embodiment of the present invention. The method may include:
s201: carrying out rolling treatment on the welding strip so as to release and attach the soldering flux in a first preset area in the welding strip to the surface of the welding strip, thereby obtaining a pretreated welding strip; the flux is disposed in a flux carrying sub-assembly of the solder ribbon, which further includes a solder ribbon plated sub-assembly and a central conductive ribbon assembly.
In this embodiment, when the solder strip is rolled, only the flux in the first preset area in the solder strip is released and attached to the surface of the solder strip, that is, only a part of the flux in the solder strip is released and attached to the surface of the solder strip, so as to be used as a pretreatment solder strip, thereby ensuring that the newly released flux can be used for low-temperature welding in the subsequent preparation process. The embodiment is not limited to a specific division manner of the first preset area, as long as the flux can be released to the surface of the solder strip in multiple times.
S202: and fixing the pretreatment welding strip on the surface of the grid line of the photovoltaic cell to obtain the photovoltaic cell assembly.
S203: and respectively arranging cover plates on the front light incident side and the back side of the photovoltaic cell assembly to obtain the photovoltaic assembly to be pressed.
S204: and carrying out lamination treatment on the photovoltaic module to be pressed, releasing the soldering flux in the second preset area in the pretreatment welding strip and attaching the soldering flux to the surface of the pretreatment welding strip, and completing low-temperature welding of the pretreatment welding strip and the grid line to obtain the photovoltaic module.
When the assembly to be pressed is subjected to lamination treatment, the soldering flux in the second preset area in the soldering tape is released and attached to the surface of the pre-treated soldering tape, so that the newly released soldering flux can act on the soldering position of the pre-treated soldering tape and the grid line in the pressing treatment process of low-temperature welding, the quality of low-temperature welding can be improved, and the welding efficiency is improved.
The photovoltaic module preparation method provided by the embodiment of the invention comprises the steps of rolling the welding strip so as to release and attach the soldering flux in a first preset area in the welding strip to the surface of the welding strip, thereby obtaining a pretreated welding strip; the flux is disposed in a flux carrying sub-assembly of the solder ribbon, which further includes a solder ribbon plated sub-assembly and a central conductive ribbon assembly. Fixing a pretreatment welding strip on the surface of a grid line of a photovoltaic cell to obtain a photovoltaic cell assembly, respectively arranging cover plates on the front light incident side and the back side of the photovoltaic cell assembly to obtain a photovoltaic assembly to be pressed, carrying out lamination treatment on the photovoltaic assembly to be pressed, releasing soldering flux in a second preset area in the pretreatment welding strip and attaching the soldering flux to the surface of the pretreatment welding strip, and completing low-temperature welding of the pretreatment welding strip and the grid line to obtain the photovoltaic assembly. According to the photovoltaic module manufacturing method, the welding strip with the soldering flux arranged inside is rolled, so that the soldering flux in the first preset area in the welding strip is migrated to the surface of the welding strip, the welding strip is laid on the grid line of the photovoltaic cell, the wetting of soldering tin can be increased, surface oxides can be removed, the welding quality of the low-temperature welding strip is improved, and when the photovoltaic module to be pressed is subjected to lamination treatment, the soldering flux in the second preset area in the pre-treatment welding strip is released and attached to the surface of the pre-treatment welding strip, the quality of low-temperature welding of the welding strip and the grid line can be improved, and meanwhile the manufacturing efficiency of the photovoltaic module is improved.
The following describes a solder strip component provided by an embodiment of the present invention, where the solder strip component described below is applied to the above-described method for manufacturing a photovoltaic module, and the above-described method for manufacturing a photovoltaic module may be referred to correspondingly with each other.
Example 3:
referring to fig. 4 specifically, fig. 4 is a schematic structural diagram of a solder strip component according to an embodiment of the present invention. The component may include:
a flux carrier sub-assembly 10, a solder ribbon plating sub-assembly 20, and a central conductive ribbon assembly 30;
the central conductive strap member 30 is disposed at a central location of the solder strap plated sub-member 20;
the flux carrying sub-member 10 is disposed in the solder tape plating sub-member 20, and the flux carrying sub-member 10 is disposed outside the center conductive tape member 30.
In this embodiment, the flux carrying sub-assembly 10 is disposed on the outer side of the central conductive tape assembly 30 along the direction of the central conductive tape assembly 30 toward the solder tape plating sub-assembly 20, so that when the solder tape is soldered to the grid line in the photovoltaic cell, the solder tape is rolled and the flux is released to the surface of the solder tape. The present embodiment is not limited to a specific structure in which the flux carrier sub-member 10 is provided in the solder tape plating sub-member 20, as long as the flux can be released to the surface of the solder tape at the time of the rolling process of the solder tape. For example, the flux carrier sub-member 10 may be circumferentially disposed outside the central conductive tape member 30, surrounding all of the central conductive tape member 30; alternatively, the flux carrier sub-member 10 may be circumferentially disposed outside the central conductive tape member 30, surrounding a portion of the central conductive tape member 30; or the flux carrier sub-assembly 10 may also be provided as a discrete plurality of carrier sub-assemblies. The present embodiment is not limited to the specific shape of the flux carrier member 10, as long as the flux can be released at the time of the rolling process. The present embodiment is not limited to the specific shape of the solder ribbon plated sub-member 20, and may be set according to the actual situation of the rolling process. For example, the solder ribbon plating sub-member 20 may be externally provided in a cylindrical shape, i.e., the solder ribbon formed by the flux carrier sub-member 10, the solder ribbon plating sub-member 20, and the central conductive ribbon member 30 may take on a cylindrical shape. It should be further noted that, in the present embodiment, the flux carrying sub-member 10 and the solder ribbon plating sub-member 20 extend in the same direction, and the flux carrying sub-member 10 may be arranged in sections in the extending direction. The central conductive strap member and the flux carrying sub-member may in this embodiment be co-extensive with the solder strap plating sub-member.
Further, in order to improve the stable release of the flux during the rolling process and to improve the tolerance of the flux during storage and use, the flux carrier sub-assembly 10 may include a plurality of core tubes disposed within the solder ribbon plating sub-assembly 20 and circumferentially disposed about the central conductive ribbon sub-assembly 30.
By arranging the flux carrier sub-assembly 10 as a plurality of core tubes arranged along the circumferential direction of the central conductive tape assembly 30, when the flux at a single area fails or is damaged, the flux at other positions is not affected, so that the fault tolerance of welding is improved, and the stable low-temperature welding is ensured. The present embodiment is not limited to a particular number of core tubes in the flux carrier sub-assembly 10. For example, the number of core tubes may be 1, or the number of core tubes may be 2, or the number of core tubes may be 3. The present embodiment is not limited to a specific manner in which the plurality of core tubes are disposed along the circumferential direction of the central conductive tape member 30, as long as they are disposed outside the central conductive tape member 30.
Further, to further improve the quality of the solder strip to photovoltaic cell grid line soldering, a plurality of the core tubes described above may be symmetrically disposed along the central conductive tape member 30.
In this embodiment, the plurality of core tubes are symmetrically arranged along the central conductive tape member 30, so that when the solder tape is rolled, the flux in the solder tape can be ensured to be uniformly released to the surface of the solder tape, the condition that the flux is accumulated on the surface of the solder tape is avoided, and the quality of low-temperature welding is improved.
The solder strip component provided by the embodiment of the invention is applied to the preparation method of the photovoltaic module, and comprises a soldering flux bearing sub-component 10, a solder strip coating sub-component 20 and a central conductive strip component 30, wherein the central conductive strip component 30 is arranged at the central position of the solder strip coating sub-component 20, the soldering flux bearing sub-component 10 is arranged in the solder strip coating sub-component 20, and the soldering flux bearing sub-component 10 is arranged at the outer side of the central conductive strip component 30. According to the invention, the soldering strip with the soldering flux arranged inside is rolled so that the soldering flux in the soldering strip migrates to the surface of the soldering strip, and then the soldering strip is laid on the grid line of the photovoltaic cell, so that the wetting of soldering tin can be increased, the surface oxide can be removed, the soldering quality of the low-temperature soldering strip is improved, and meanwhile, the preparation efficiency of the photovoltaic module is improved. In addition, the invention improves the fault tolerance of welding and ensures the stable low-temperature welding by arranging the soldering flux carrier sub-component 10 into a plurality of core tubes arranged along the circumferential direction of the central conductive belt component 30; by arranging the plurality of core tubes symmetrically along the central conductive tape member 30, it is possible to ensure uniform release of flux in the solder tape to the surface of the solder tape, avoid the occurrence of accumulation of flux on the surface of the solder tape, and improve the quality of low-temperature soldering.
Example 4:
referring to fig. 4 specifically, fig. 4 is a schematic structural diagram of a solder strip component according to an embodiment of the present invention. The component may include:
a flux carrier sub-assembly 10, a solder ribbon plating sub-assembly 20, and a central conductive ribbon assembly 30;
the central conductive strap member 30 is disposed at a central location of the solder strap plated sub-member 20;
the flux carrying sub-member 10 is disposed in the solder tape plating sub-member 20, and the flux carrying sub-member 10 is disposed outside the center conductive tape member 30;
the soldering flux carrying sub-component 10 is at least arranged in a first preset area and a second preset area; the flux carrier sub-member 10 in the first preset area is for releasing flux at the time of the rolling process to adhere the flux to the surface of the solder strip member;
the flux carrier sub-member 10 in the second predetermined area is used to release the flux at the time of lamination process so that the flux adheres to the surface of the solder tape member.
It should be noted that, in the embodiment, during the rolling treatment, the first preset area and the second preset area may release the soldering flux at the same time, but the soldering flux in the first preset area is released completely, and the soldering flux in the second preset area is released partially, referring to fig. 5, fig. 5 is a schematic structural diagram of a pre-treated solder strip provided in the embodiment of the present invention. The flux carrier member 11 in which the flux is completely released is located in a first predetermined area in which the flux is completely released and attached to the surface of the pre-treated solder ribbon, i.e., flux 13 attached to the surface of the solder ribbon in the drawing, and the flux carrier member 12 in a half-released state is located in a second predetermined area in which the flux is partially released. The specific division manner of the first preset area and the second preset area is not limited in this embodiment, as long as the soldering flux can be released step by step. For example, a first predefined region and a second predefined region can be provided in a solder flux carrier sub-component 10, which are separated from one another; alternatively, the flux carrying sub-member 10 may be separately provided in the tape plating sub-member 20, and the area in which part of the flux is carried may be divided into the first preset area, and the remainder may be divided into the second preset area. The present embodiment is not limited to a specific number of dividing the flux carrier sub-assembly 10 into a plurality of regions. For example, 2 or 3.
According to the invention, the soldering strip with the soldering flux arranged inside is rolled so that at least part of the soldering flux is released and attached to the surface of the soldering strip, and then the soldering strip is laid on the grid line of the photovoltaic cell, so that the infiltration of soldering tin can be increased, the surface oxide can be removed, the welding quality of the low-temperature soldering strip is improved, meanwhile, the preparation efficiency of the photovoltaic module is improved, and the soldering flux in the soldering strip part can be released step by arranging the soldering flux bearing sub-part 10 at least in a first preset area and a second preset area, so that the quality of low-temperature welding is improved.
The following describes the photovoltaic module provided by the embodiment of the present invention, and the photovoltaic module described below and the method for preparing the photovoltaic module described above can be referred to correspondingly. The assembly may include:
the photovoltaic cell comprises a front cover plate, a photovoltaic cell, a pretreatment welding strip and a back cover plate;
the pretreatment welding strip is obtained by rolling the welding strip part; the soldering flux in the solder strip part is released and attached to the surface of the solder strip part after rolling treatment;
the pretreatment welding strip is fixed on the surface of the grid line of the photovoltaic cell; the front light incident side and the back side of the photovoltaic cell fixed with the pretreatment welding strip are respectively provided with a cover plate.
According to the invention, the soldering tape with the soldering flux arranged inside is rolled so that the soldering flux in the soldering tape is released and attached to the surface of the soldering tape, then the soldering tape is laid on the grid line of the photovoltaic cell, and the photovoltaic module is obtained by arranging the cover plate on the outer side of the photovoltaic cell on which the soldering tape is laid and laminating the cover plate, so that the wetting of soldering tin and the removal of surface oxides can be increased, the soldering quality of the low-temperature soldering tape is improved, and meanwhile, the preparation efficiency of the photovoltaic module is improved.
In order to facilitate understanding of the present invention, the photovoltaic cell assembly of the present invention may specifically include the following structures. Referring to fig. 6, fig. 6 is a schematic structural diagram of a photovoltaic cell assembly in a photovoltaic module according to an embodiment of the present invention.
Photovoltaic cell 1, pretreatment solder strip 2 and grid line 3;
in this embodiment, the grid line 3 is disposed in the photovoltaic cell 1, and the pretreatment solder strip is laid on the surface of the grid line 3 and may be disposed perpendicularly to the grid line. In this embodiment, the grid lines 3 may be respectively disposed on two sides of the photovoltaic cell 1, and the pretreatment solder strips 2 are respectively required to be laid on the surfaces of the grid lines on two sides of the photovoltaic cell 1.
In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, so that the same or similar parts between the embodiments are referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
Finally, it is further noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The above description is provided for a method for manufacturing a photovoltaic module, a solder strip component, and a photovoltaic module, and specific examples are applied to describe the principles and embodiments of the present invention, and the description of the above examples is only for helping to understand the method and core ideas of the present invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.
Claims (10)
1. A method of manufacturing a photovoltaic module, comprising:
carrying out rolling treatment on a welding strip with soldering flux arranged inside so as to release and attach at least part of the soldering flux to the surface of the welding strip, thereby obtaining a pretreated welding strip; the flux is disposed in a flux carrying sub-component of a solder ribbon, the solder ribbon further comprising a solder ribbon plated sub-component and a central conductive ribbon component;
fixing the pretreatment welding strip on the surface of a grid line of the photovoltaic cell to obtain a photovoltaic cell assembly;
cover plates are respectively arranged on the front light entering side and the back side of the photovoltaic cell assembly to obtain a photovoltaic assembly to be pressed;
laminating the photovoltaic module to be laminated to obtain a photovoltaic module;
the central conductive strap member is disposed in a central location of the solder strap plating sub-member, and the flux carrying sub-member is disposed in the solder strap plating sub-member and outside of the central conductive strap member.
2. The method of manufacturing a photovoltaic module according to claim 1, wherein the rolling process is performed on the solder ribbon having the flux disposed therein to release and adhere at least a part of the flux to the surface of the solder ribbon, thereby obtaining a pre-treated solder ribbon, comprising:
carrying out rolling treatment on the welding strip so as to release and attach at least part of the soldering flux to the surface of the welding strip, and carving reflective patterns on the surface of the welding strip through the rolling treatment;
and taking the rolled welding strip as the pretreatment welding strip.
3. The method of manufacturing a photovoltaic module according to claim 1, wherein the fixing the pre-treatment solder strip on the surface of the grid line of the photovoltaic cell comprises:
and adhering and fixing the pretreatment welding strip on the surface of the grid line of the photovoltaic cell by using a die bonding adhesive or a carrier film.
4. The method for manufacturing a photovoltaic module according to claim 1, wherein before the cover plates are respectively disposed on the front light incident side and the back side of the photovoltaic cell module, the method further comprises:
a first adhesive film is arranged on the light incident side of the front surface of the photovoltaic cell assembly, and a second adhesive film is arranged on the back side of the photovoltaic cell assembly;
correspondingly, the front light incident side and the back side of the photovoltaic cell assembly are respectively provided with a cover plate, so that the photovoltaic cell assembly is obtained, and the photovoltaic cell assembly comprises:
and a front cover plate is arranged on one side of the first adhesive film, which is opposite to the photovoltaic cell assembly, and a back cover plate is arranged on one side of the second adhesive film, which is opposite to the photovoltaic cell assembly, so that the photovoltaic assembly to be pressed is obtained.
5. The method of manufacturing a photovoltaic module according to any one of claims 1 to 4, wherein the rolling process is performed on the solder strip provided with the flux therein to obtain a pre-processed solder strip, comprising:
carrying out rolling treatment on the welding strip so as to release and attach the soldering flux in a first preset area in the welding strip to the surface of the welding strip, thereby obtaining the pretreated welding strip;
correspondingly, the laminating treatment is performed on the photovoltaic module to be laminated to obtain the photovoltaic module, which comprises the following steps:
and carrying out lamination treatment on the photovoltaic module to be laminated, releasing the soldering flux in a second preset area in the pretreatment welding strip and attaching the soldering flux to the surface of the pretreatment welding strip, and completing low-temperature welding of the pretreatment welding strip and the grid line to obtain the photovoltaic module.
6. A solder strip member for use in the method of manufacturing a photovoltaic module according to any one of claims 1 to 5, comprising:
a flux carrier sub-assembly, a solder ribbon plating sub-assembly, and a center conductive ribbon assembly;
the central conductive strap member is disposed at a central location of the solder strap plated sub-member;
the flux carrying sub-assembly is disposed in the solder strip plating sub-assembly and the flux carrying sub-assembly is disposed outside of the central conductive strip assembly.
7. The solder strip member as recited in claim 6, wherein the flux carrier sub-members are disposed in at least a first predetermined area and a second predetermined area;
the soldering flux bearing sub-component in the first preset area is used for releasing soldering flux during rolling treatment so that the soldering flux is attached to the surface of the welding strip component;
the flux carrying sub-assembly in the second predetermined area is configured to release flux during the lamination process to adhere the flux to the surface of the solder strip assembly.
8. The solder ribbon component of claim 6, wherein the flux carrier sub-component comprises a plurality of core tubes disposed within the solder ribbon plating sub-component circumferentially along the central conductive ribbon component.
9. The strap member of claim 8, wherein a plurality of the core tubes are symmetrically disposed along the central conductive strap member.
10. A photovoltaic module, comprising:
the photovoltaic cell comprises a front cover plate, a photovoltaic cell, a pretreatment welding strip and a back cover plate;
the pre-treated solder strip is obtained by rolling the solder strip part according to any one of claims 6 to 9; the soldering flux in the solder strip part is released and attached to the surface of the solder strip part after rolling treatment;
the pretreatment welding strip is fixed on the surface of the grid line of the photovoltaic cell; and the front light incident side and the back side of the photovoltaic cell fixed with the pretreatment welding strip are respectively provided with a cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310847803.XA CN116581201B (en) | 2023-07-12 | 2023-07-12 | Photovoltaic module preparation method, solder strip part and photovoltaic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310847803.XA CN116581201B (en) | 2023-07-12 | 2023-07-12 | Photovoltaic module preparation method, solder strip part and photovoltaic module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116581201A CN116581201A (en) | 2023-08-11 |
| CN116581201B true CN116581201B (en) | 2023-09-29 |
Family
ID=87538175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310847803.XA Active CN116581201B (en) | 2023-07-12 | 2023-07-12 | Photovoltaic module preparation method, solder strip part and photovoltaic module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116581201B (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012128386A1 (en) * | 2011-03-24 | 2012-09-27 | ソニーケミカル＆インフォメーションデバイス株式会社 | Solar cell module, manufacturing method for solar cell module, and conductive adhesive |
| CN202678377U (en) * | 2012-05-25 | 2013-01-16 | 嘉兴优太太阳能有限公司 | Interconnector edge structure for improving welding strength |
| JP2013211469A (en) * | 2012-03-30 | 2013-10-10 | Toppan Printing Co Ltd | Metal foil laminate for solar cell and solar cell module |
| JP2014067999A (en) * | 2012-09-04 | 2014-04-17 | Toyo Aluminium Kk | Ribbon line for solar cell and solar cell module using the same |
| CN107433400A (en) * | 2017-07-28 | 2017-12-05 | 广州汉源新材料股份有限公司 | A kind of preformed solder for including scaling powder and preparation method thereof |
| CN208298850U (en) * | 2018-04-10 | 2018-12-28 | 苏州阿特斯阳光电力科技有限公司 | Photovoltaic welding belt and photovoltaic module |
| KR20190106340A (en) * | 2018-03-08 | 2019-09-18 | 엘지전자 주식회사 | Device and method of coating flux for solar cell panel, and apparatus for attaching interconnector of solar cell panel |
| CN113070604A (en) * | 2021-04-08 | 2021-07-06 | 上杭县紫金佳博电子新材料科技有限公司 | Double-layer solder sheet and preparation process thereof |
| CN114669908A (en) * | 2022-04-01 | 2022-06-28 | 中山翰华锡业有限公司 | High-reliability preformed soldering lug and preparation method thereof |
| CN217316507U (en) * | 2021-12-02 | 2022-08-30 | 同享（苏州）电子材料科技股份有限公司 | Square welding strip |
| CN115763603A (en) * | 2022-12-12 | 2023-03-07 | 浙江晶科能源有限公司 | Photovoltaic module |
-
2023
- 2023-07-12 CN CN202310847803.XA patent/CN116581201B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012128386A1 (en) * | 2011-03-24 | 2012-09-27 | ソニーケミカル＆インフォメーションデバイス株式会社 | Solar cell module, manufacturing method for solar cell module, and conductive adhesive |
| JP2012204528A (en) * | 2011-03-24 | 2012-10-22 | Sony Chemical & Information Device Corp | Solar cell module, manufacturing method of solar cell module, conductive adhesive |
| JP2013211469A (en) * | 2012-03-30 | 2013-10-10 | Toppan Printing Co Ltd | Metal foil laminate for solar cell and solar cell module |
| CN202678377U (en) * | 2012-05-25 | 2013-01-16 | 嘉兴优太太阳能有限公司 | Interconnector edge structure for improving welding strength |
| JP2014067999A (en) * | 2012-09-04 | 2014-04-17 | Toyo Aluminium Kk | Ribbon line for solar cell and solar cell module using the same |
| CN107433400A (en) * | 2017-07-28 | 2017-12-05 | 广州汉源新材料股份有限公司 | A kind of preformed solder for including scaling powder and preparation method thereof |
| KR20190106340A (en) * | 2018-03-08 | 2019-09-18 | 엘지전자 주식회사 | Device and method of coating flux for solar cell panel, and apparatus for attaching interconnector of solar cell panel |
| CN208298850U (en) * | 2018-04-10 | 2018-12-28 | 苏州阿特斯阳光电力科技有限公司 | Photovoltaic welding belt and photovoltaic module |
| CN113070604A (en) * | 2021-04-08 | 2021-07-06 | 上杭县紫金佳博电子新材料科技有限公司 | Double-layer solder sheet and preparation process thereof |
| CN217316507U (en) * | 2021-12-02 | 2022-08-30 | 同享（苏州）电子材料科技股份有限公司 | Square welding strip |
| CN114669908A (en) * | 2022-04-01 | 2022-06-28 | 中山翰华锡业有限公司 | High-reliability preformed soldering lug and preparation method thereof |
| CN115763603A (en) * | 2022-12-12 | 2023-03-07 | 浙江晶科能源有限公司 | Photovoltaic module |
Non-Patent Citations (1)
| Title |
|---|
| 张磊 ; 郎芳 ; .180μm电池焊接工艺及降低碎片率的研究.科技风.2010,(04),1. * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116581201A (en) | 2023-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3614443A1 (en) | Densely-arranged solar cell string and preparation method, and assembly and system thereof | |
| CN210040210U (en) | Main-grid-free double-sided power generation solar cell and module thereof | |
| EP2423970A1 (en) | Solar cell module | |
| WO2012141073A1 (en) | Solar cell module and method for manufacturing same | |
| CN105215497A (en) | Photovoltaic module crystalline silicon battery plate welding procedure | |
| CN214123891U (en) | Multi-main-grid double-sided power generation solar cell and module thereof | |
| CN117525213B (en) | Preparation method of battery piece assembly and battery piece assembly | |
| JPWO2009107804A1 (en) | Solar cell module | |
| CN115241294B (en) | Photovoltaic shingle assembly and preparation method thereof | |
| CN107146826B (en) | Composite welding strip | |
| CN115101600A (en) | Current leading-out structure of HJT battery and preparation method thereof | |
| KR102099246B1 (en) | Crystal system solar battery module and method for manufacturing same | |
| CN213988902U (en) | Novel multi-main-grid double-sided power generation solar cell and module thereof | |
| CN116581201B (en) | Photovoltaic module preparation method, solder strip part and photovoltaic module | |
| CN117238984B (en) | Photovoltaic cell and photovoltaic module | |
| CN214753801U (en) | Series connection structure of heterojunction non-main grid battery piece | |
| CN210837788U (en) | Reflection of light solder strip and photovoltaic module | |
| JP5889738B2 (en) | Solar cell module and manufacturing method thereof | |
| CN205564787U (en) | Electric current extraction device with metal forming and compound conductive strips | |
| CN112186058A (en) | Interconnection piece and solar module | |
| CN111223953A (en) | Reflective welding strip, photovoltaic module and preparation method | |
| TWI705659B (en) | Manufacturing method of solar cell module | |
| CN215342622U (en) | Battery string and photovoltaic module | |
| CN115513323A (en) | Connecting structure and method of solar cell string | |
| CN113725312A (en) | Photovoltaic module and method for producing photovoltaic module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 314400 No. 1 Jisheng Road, Jiaxing City, Zhejiang Province, Jianshan New District, Haining City Patentee after: Zhengtai Xinneng Technology Co.,Ltd. Address before: 314400 No. 1 Jisheng Road, Jiaxing City, Zhejiang Province, Jianshan New District, Haining City Patentee before: Zhengtai Xinneng Technology Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |