CN116575096A - Water retaining guide device for copper plating of PCB (printed circuit board) - Google Patents
Water retaining guide device for copper plating of PCB (printed circuit board) Download PDFInfo
- Publication number
- CN116575096A CN116575096A CN202310840290.XA CN202310840290A CN116575096A CN 116575096 A CN116575096 A CN 116575096A CN 202310840290 A CN202310840290 A CN 202310840290A CN 116575096 A CN116575096 A CN 116575096A
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- China
- Prior art keywords
- gear
- copper plating
- circuit board
- guide
- pcb
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 51
- 239000010949 copper Substances 0.000 title claims abstract description 51
- 238000007747 plating Methods 0.000 title claims abstract description 43
- 239000007921 spray Substances 0.000 claims abstract description 31
- 230000005540 biological transmission Effects 0.000 claims description 66
- 239000007788 liquid Substances 0.000 claims description 20
- 239000002390 adhesive tape Substances 0.000 claims description 14
- 230000000670 limiting effect Effects 0.000 claims description 13
- 210000005056 cell body Anatomy 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 abstract description 21
- 230000000694 effects Effects 0.000 abstract description 9
- 238000005452 bending Methods 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a water retaining guide device for copper plating of a PCB (printed Circuit Board), which is used for solving the problem that bending occurs and copper plating effect is affected when the PCB is plated with copper in the prior art. The invention provides a water retaining guide device for copper plating of a PCB, which comprises the following components: the groove body, the guide component and the water retaining component are used for adjusting the limit range according to the size of the circuit board through the guide component, so that the limit effect on the circuit board is ensured, shielding of a spray pipe nozzle is avoided as much as possible, and the copper plating effect of the circuit board is ensured; the water blocking assembly is arranged to synchronously drive the conveying device of the PCB copper plating equipment, so that friction damage between the surface of the circuit board and the two water blocking rollers is prevented, and the copper plating yield of the circuit board is ensured; through the chamfer on two manger plate gyro wheels upper portions, can avoid the circuit board to a great extent when getting into between two manger plate gyro wheels, take place the position interference with manger plate gyro wheel, greatly reduced the circuit board possibility of bending, improved the copper facing security of circuit board.
Description
Technical Field
The invention relates to the technical field of copper plating of PCB boards, in particular to a water retaining guide device for copper plating of a PCB board.
Background
The PCB is also called a printed circuit board, can provide a carrier for electric connection of electronic components, is made of insulating and heat-insulating materials which are not easy to bend, is used as a bottom plate, is attached with a copper film, is etched to generate conductive circuits on the circuit board to conduct various electronic components, and in the manufacturing technology of the printed circuit board, an electroplating copper process is needed, namely, after copper deposition, copper layers on the surface of the PCB and in holes are thickened, so that the etched circuits are good in quality and high in conductivity.
In the copper electroplating process, when the PCB enters each copper plating treatment section, the PCB can swing due to water flow in the treatment groove and water pressure sprayed by the spray pipe, so as to avoid the swing, the prior art multipurpose guide bars limit the PCB, but the guide bars are mainly fixedly arranged and are usually equidistantly corresponding to each position of the PCB, or are only corresponding to the lower part of the PCB, the limiting range can not be adjusted according to the size of the PCB, the upper part of the PCB is impacted by water flow when being limited only to the lower part of the PCB, the swing still can occur, the circuit board is scratched, the guide bars can block the water sprayed onto the PCB by the spray pipe to a certain extent when limiting all positions of the PCB at equal intervals, the copper plating effect of the circuit board is affected, and the guide bars are often damaged and scrapped due to the soaking of liquid medicine and the friction of the PCB, and are fixed in a mounting mode and the whole structure, so that the guide bars are inconvenient to assemble and disassemble and high in maintenance cost.
In addition, when the PCB board is transferred from one copper plating treatment section to another copper plating treatment section, the PCB board is required to be guided, as the size of the guide bar is oversized, and water blocking is required to be carried out when the transition section is guided, so that large-scale channeling of treatment fluid between the grooves is prevented, so that the conventional common liquid blocking wheel is used for carrying out water blocking guiding of the transition section in the prior art, but the conventional two liquid blocking wheels are difficult to realize stable synchronous reverse rotation, the speed change reactivity is poor, friction damage is easily caused to the surface of the circuit board when the rotation speed is required to be adjusted to enable the two liquid blocking wheels to pass through different types of circuit boards, copper plating yield of the circuit board is affected, and the upper part of the circuit board is bent due to the limitation of the position of a clamp when the circuit board passes through the middle of the two liquid blocking wheels, interference is caused when the common liquid blocking wheel is carried out, and the circuit board is bent and even scrapped.
Disclosure of Invention
The invention aims to provide a water retaining guide device for copper plating of a PCB, which prevents the PCB from being bent and ensures the copper plating effect of the PCB.
In order to solve the technical problems, the invention provides a water retaining guide device for copper plating of a PCB, which comprises the following components:
a tank body;
the guide assembly comprises a lifting adjusting group and a guide bar arranged on the lifting adjusting group, and the lifting adjusting group is arranged in the groove body;
the water retaining assembly comprises a reverse rotating group and a water retaining roller wheel arranged on the reverse rotating group, and the reverse rotating group is arranged at the left part of the tank body.
Optionally, install the support around the upper portion of cell body, be provided with eleven spray tubes in the support, eleven in front portion and eleven in rear portion the lower part of spray tube is all fixed to be linked together has the spray tube seat, and it has liquid to flow into in the spray tube seat, and liquid flows into the spray tube blowout through the spray tube seat.
Optionally, the lifting adjustment group comprises a base, guide bar sliding rods, sliding blocks and clamping grooves, wherein the base is fixed on the front portion and the rear portion of the lower portion of the groove body, three guide bar sliding rods are arranged on the upper wall of the base at equal intervals in the left-right direction, the tops of the front three guide bar sliding rods and the rear three guide bar sliding rods are fixedly connected with a front support and a rear support respectively, three sliding blocks are arranged on the guide bar sliding rods in a sliding mode, and three clamping grooves are formed in the rear wall of the sliding blocks and the front wall of the sliding blocks.
Optionally, the lifting adjustment group still includes folding groove, riser, cylinder, link group, gear shaft and folding gear, the folding groove has been seted up at the left portion of base, the right part upper wall of base is fixed with the riser, the cylinder is all installed in the middle part of upper left portion of riser and folding groove, the link group is the same by two length, and the tip rotates the connecting rod of connection and constitutes, left front portion and left rear portion the folding groove all installs three link group with the outer wall of three slider, and two link groups are all installed to the outer wall of right front portion and right rear portion the link group lower part in cell body bottom four corners respectively with the output rotation of four cylinders be connected, the adjacent end of two link groups all is fixed with the gear shaft, the inner outer wall of gear shaft is fixed with folding gear, and adjacent two folding gear meshing transmission.
Optionally, the nine sliding blocks at the front and the rear are divided into six groups according to the upper, middle and lower positions, and three guide bars are arranged at the inner side of each group of sliding blocks.
Optionally, the front and rear nozzles are disposed in front of the front guide bar and behind the rear guide bar, respectively.
Optionally, the conducting bar includes fixture block, sleeve, slip cap core and fixed adhesive tape, the slip is provided with the slip cap core in the sleeve, the outer wall of slip cap core is provided with fixed adhesive tape, telescopic back wall left part, middle part and right part all are fixed with the fixture block, and the fixture block all corresponds draw-in groove sliding connection with the position.
Optionally, a fixing seat is installed on the upper wall of the left rear corner of the tank body, the lifting adjusting group comprises a buffer box, a transmission long rod, a transmission sprocket, a main transmission shaft, a limiting seat, a driving gear, a driven gear, a coaxial lower gear, a coaxial upper gear and a matched gear, the lower part of the left rear corner of the tank body is provided with the limiting seat, the main transmission shaft is rotationally arranged between the fixing seat and the limiting seat, the transmission sprocket is arranged on the upper part of the main transmission shaft, the driving gear is arranged on the lower part of the main transmission shaft, a bridge passing screw is arranged on the front part of the limiting seat, and the driven gear is installed on the upper part of the bridge passing screw;
the left part of the groove body is provided with a buffer box, the front part and the rear part of the buffer box are provided with transmission long rods, the outer walls of the two transmission long rods are respectively fixed with a water retaining roller, and the upper parts of the water retaining rollers are provided with chamfers;
the outer wall of the lower part of the transmission long rod at the rear part is provided with a coaxial lower gear and a coaxial upper gear, the coaxial lower gear is meshed with the driven gear for transmission, and the outer wall of the lower part of the transmission long rod at the front part is provided with a matched gear which is meshed with the coaxial upper gear for transmission.
As described above, the water retaining guide device for PCB copper plating has at least the following beneficial effects:
1. the limiting range is adjusted according to the size of the circuit board through the guide component, so that the limiting effect on the circuit board is ensured, shielding of a spray pipe nozzle is avoided as much as possible, and the copper plating effect of the circuit board is ensured;
2. the guide bar is changed into the splicing structure, so that the guide bar is convenient to assemble and disassemble and convenient to maintain, and each part of the guide bar can be replaced respectively according to the requirements, so that the maintenance cost is reduced;
3. the water retaining assembly is arranged to synchronously drive the conveying device of the PCB copper plating equipment, so that friction damage between the surface of the circuit board and the two water retaining rollers is prevented when different types of circuit boards are guided, and the copper plating yield of the circuit board is ensured;
4. through the chamfer on two manger plate gyro wheels upper portions, can avoid the circuit board to a great extent when getting into between two manger plate gyro wheels, take place the position interference with manger plate gyro wheel, greatly reduced the circuit board possibility of bending, improved the copper facing security of circuit board.
Drawings
Fig. 1 is a perspective view of the southeast view of the overall structure of the present invention.
Fig. 2 is a perspective view of the southeast view of the guide assembly according to the present invention.
Fig. 3 is an enlarged view showing the structure of the area a in fig. 2 according to the present invention.
Fig. 4 is a perspective view of the southeast view of the conducting bar structure of the present invention.
Fig. 5 shows an enlarged view of the right end structure of the guide bar of the present invention.
Fig. 6 is an enlarged view showing the structure of the region C in fig. 4 according to the present invention.
Fig. 7 is an enlarged view showing the structure of the area B in fig. 2 according to the present invention.
Fig. 8 is a schematic view showing a perspective view of a water blocking assembly according to the present invention from a southwest perspective.
Fig. 9 is a perspective view of the southeast view of the water-retaining roller matching structure of the present invention.
Fig. 10 is a perspective view of the southeast view of the water deflector assembly and guide assembly of the present invention.
Description of element reference numerals
1. A tank body; 101. a bracket; 102. a spray pipe; 103. a fixing seat;
2. a guide assembly; 201. a base; 202. a guide bar slide bar; 203. a slide block; 204. a clamping groove; 206. a folding groove; 207. a vertical plate; 208. a cylinder; 209. a linkage; 210. a gear shaft; 211. folding gears;
205. a conducting bar; 2051. a clamping block; 2052. a sleeve; 2053. a sliding sleeve core; 2054. fixing the adhesive tape;
3. a water blocking assembly; 301. a buffer box; 302. a transmission long rod; 303. a water retaining roller; 304. a transfer sprocket; 305. a main drive shaft; 306. a limit seat; 307. a drive gear; 308. a driven gear; 309. a coaxial lower gear; 310. a coaxial upper gear; 311. a mating gear; 312. and a bridge screw.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.
If the background art, because the conducting bar is mostly fixed to be set up, it is common that the equidistance corresponds each position of circuit board, perhaps only corresponds in the lower part of circuit board, can not adjust spacing scope according to the size of circuit board, only when spacing to the lower part of circuit board, the upper portion of circuit board receives the rivers impact, still can take place the swing, causes the circuit board to collide with the fish tail, and the equidistance carries out spacing time to all positions of circuit board, and the conducting bar can carry out certain blocking to the rivers that the spray tube sprayed to the circuit board, influences the copper plating effect of circuit board.
In addition, when the PCB board passes through from traditional two keep off the liquid wheel, because two keep off the liquid wheel and be difficult to realize stable synchronous reverse rotation, and the reactivity of variable speed is poor, when need adjust the rotational speed and make two keep off the circuit board of different grade type before the liquid wheel, cause friction damage to the circuit board surface easily, influence the copper plating yield of circuit board, on the other hand, the circuit board is in the middle of passing through two keep off the liquid wheel, because the restriction of anchor clamps position, the upper portion of circuit board can take place to crooked, can take place to interfere with it when keeping off the liquid wheel through ordinary, causes the circuit board to bend, even scrap.
As shown in fig. 1 to 10, to solve the above problems, the inventor found that by adjusting the corresponding positions of the guide bars on the circuit board, the blocking of water spraying to the spray pipe can be reduced while the circuit boards with different sizes are stably limited, and by arranging a reverse transmission mechanism at the lower part of the roller and forming a chamfer at the upper part of the roller, the circuit board can be ensured to pass through the roller safely and stably and reach the next electroplating treatment section, therefore, the invention provides a water blocking guide device for copper plating of a PCB board, which comprises:
a tank body 1;
the guide assembly 2 comprises a lifting adjusting group and a guide bar 205 arranged on the lifting adjusting group, and the lifting adjusting group is arranged in the groove body 1;
the water retaining assembly 3 comprises a reverse rotating group and a water retaining roller 303 arranged on the reverse rotating group, and the reverse rotating group is arranged at the left part of the tank body 1.
Further, a bracket 101 is installed in front of and behind the upper part of the tank body 1, eleven spray pipes 102 are arranged in the bracket 101, the lower parts of the eleven spray pipes 102 at the front part and the eleven spray pipes 102 at the rear part are fixedly communicated with a spray pipe seat, liquid flows into the spray pipe seat, and the liquid flows into the spray pipe 102 through the spray pipe seat to be sprayed out.
In the use process, the guide interval of the guide assembly 2 is firstly adjusted, so that the guide assembly 2 can be matched with the circuit boards with the next batch size, and meanwhile, the blocking of the spray pipe 102 is avoided as much as possible, and therefore, the circuit boards with different sizes are effectively guided and limited; secondly, according to the type of the batch of circuit boards, the passing rate of the water blocking assembly 3 is correspondingly adjusted, so that the circuit boards can avoid interference of the water blocking assembly 3 and pass safely while ensuring the copper plating rate; when the device is used, the circuit board enters the tank body 1 from right to left, the guide component 2 indirectly receives the treatment liquid sprayed out of the spray pipe 102, after treatment is completed, the conveying device drives the circuit board to move leftwards continuously under the guide of the guide component 2, the circuit board reaches the tank body 1 of the next treatment section through the stable transition of the water retaining component 3, and meanwhile, the treatment liquid in the previous treatment section is isolated as much as possible under the action of the water retaining component 3, so that the amount entering the next tank body 1 is greatly reduced.
Example 1
Referring to fig. 1-3 and 10, to achieve the above and other related objects, the present invention provides a water blocking guide device for copper plating of a PCB board, the guide assembly 2 comprises: the lifting adjusting group comprises a base 201, guide bar slide bars 202, sliding blocks 203, clamping grooves 204, folding grooves 206, vertical plates 207, air cylinders 208, connecting rod groups 209, gear shafts 210 and folding gears 211, wherein the base 201 is fixed on the front and rear parts of the lower part of the groove body 1, three guide bar slide bars 202 are equidistantly arranged on the upper wall of the base 201 in the left-right direction, the tops of the front three guide bar slide bars 202 and the rear three guide bar slide bars 202 are respectively fixed with the front support 101 and the rear support 101, the base 201 and the support 101 respectively provide supporting points for the lower part and the upper part of the guide bar slide bars 202, the positions of the guide bar slide bars 202 are more stable, three sliding blocks 203 are arranged on the guide bar slide bars 202 in a sliding manner, the sliding blocks 203 provide mounting points for the guide bars 205, three clamping grooves 204 are respectively arranged on the rear wall of the front sliding blocks 203 and the front wall of the rear sliding blocks 203, the clamping grooves 204 provide mounting conditions for the guide bars 205, a folding groove 206 is formed in the left part of the base 201, a vertical plate 207 is fixed on the upper wall of the right part of the base 201, an air cylinder 208 is rotatably arranged at the left upper part of the vertical plate 207 and the middle part of the folding groove 206, the folding groove 206 and the vertical plate 207 provide transmission space for transmission of the air cylinder 208 and rotation folding of the connecting rod group 209, the connecting rod group 209 is composed of two connecting rods with the same length and rotationally connected ends, three connecting rod groups 209 are respectively arranged on the folding groove 206 at the left front part and the left rear part and the outer wall of the three sliding blocks 203, two connecting rod groups 209 are respectively arranged on the outer wall of the three sliding blocks 203 at the right front part and the right rear part, the lower parts of the connecting rod groups 209 at the four corners of the bottom of the groove body 1 are respectively rotationally connected with the output ends of the four air cylinders 208, the four air cylinders 208 respectively provide power for folding of the connecting rod groups 209 at the four corners of the bottom of the groove body 1, a gear shaft 210 is respectively fixed at the adjacent ends of the two connecting rod groups 209, a folding gear shaft 211 is fixedly arranged on the inner end outer wall of the gear shaft 210, and two adjacent folding gears 211 are meshed for transmission, and the meshing of the folding gears 211 can drive the connecting rod groups 209 at four corners of the bottom of the tank body 1 to be linked and folded with the connecting rod groups 209 at the upper part.
More perfectly, as shown in fig. 2 and 10, the nine sliding blocks 203 at the front and rear are divided into six groups according to the upper, middle and lower positions, three guide bars 205 are arranged at the inner sides of each group of sliding blocks 203, and the sliding connection of the sliding blocks 203 and the guide bar sliding bars 202 limits the adjusting path of the guide bars 205.
More preferably, as shown in fig. 1, the front and rear nozzles 102 are disposed in front of the front guide bar 205 and behind the rear guide bar 205, respectively, so that the nozzles 102 can spray the treatment liquid onto the circuit board through the guide bar 205.
Specifically, when the circuit boards to be processed in the tank body 1 are different batches and different sizes, the output ends of the starting cylinders 208 stretch and draw the lowest connecting rod groups 209 at the left end and the right end of the two bases 201 to stretch or fold according to the sizes of the circuit boards, so that the gear shafts 210 at the upper ends of the connecting rod groups 209 rotate along with stretching and folding, the folding gears 211 are meshed to drive to provide power for folding the upper connecting rod groups 209, the sliding blocks 203 are pulled to lift on the guide bar sliding bars 202, so that the corresponding positions of the guide bars 205 and the circuit boards are controlled, for example, when the circuit boards in large-size batches are processed, the output ends of the starting cylinders 208 stretch out, the upper, middle and lower guide bars 205 respectively correspond to the top, middle and bottom of the circuit boards, guide the circuit boards are reserved, a large space is reserved between the guide bars 205 and the guide bars 205, and the spray pipes 102 are convenient for directly spraying processing liquid onto the circuit boards, otherwise, when the circuit boards in small-size batches are processed, the output ends of the cylinders 208 can be started to shrink, for example, the copper plating effect of the spray pipes 102 is avoided at the same time, and the limit effect of the spray pipes 102 is guaranteed.
Example 2
Referring to fig. 2, 4-7 and 10, the present invention provides a water blocking guide device for copper plating of a PCB board, wherein a guide bar 205 comprises: the fixture block 2051, the sleeve 2052, the sliding sleeve core 2053 and the fixed adhesive tape 2054, the sliding sleeve core 2053 is arranged in the sleeve 2052 in a sliding manner, the fixed adhesive tape 2054 is made of EPDM rubber, the texture of the fixed adhesive tape 2054 is softer, the circuit board is guided, the surface of the circuit board is not scratched, when the fixed adhesive tape 2054 is damaged and needs to be replaced, the sleeve 2052 loaded with the fixed adhesive tape 2054 is detached from the sliding block 203, the new sliding sleeve core 2053 and the fixed adhesive tape 2054 are replaced, the maintenance can be completed, the operation is simple, the fixture block 2051 is fixed on the left part, the middle part and the right part of the rear wall of the sleeve 2052, the fixture block 2051 is in sliding connection with the clamping groove 204 corresponding to the position, and the guide bar 205 is convenient to be dismounted and mounted on the sliding block 203 through the matching of the fixture block 2051 and the clamping groove 204.
Specifically, during the bar 205 preparation, can be with sliding sleeve core 2053 slidable mounting in sleeve 2052, receive friction and treatment fluid corruption in fixed adhesive tape 2054 to circuit board direction in-process, when taking place the damage deformation, take out the sliding sleeve core 2053 that loads with damaged fixed adhesive tape 2054 from sleeve 2052, reload a new sliding sleeve core 2053 and fixed adhesive tape 2054, can accomplish the maintenance change of bar 205, when bar 205 installs with slider 203, with fixture block 2051 slidable mounting in the draw-in groove 204 of slider 203, can fix bar 205 between three slider 203, change bar 205 into mosaic structure, make bar 205 easy dismounting, the maintenance of being convenient for, each part of bar 205 can be changed respectively as required, the cost of maintenance has been reduced.
Example 3
Referring to fig. 1 and 8-10, the present invention provides a water blocking guiding device for copper plating of a PCB board, wherein a water blocking assembly 3 comprises: the reverse rotating group comprises a buffer box 301, a transmission long rod 302, a transmission chain wheel 304, a main transmission shaft 305, a limit seat 306, a driving gear 307, a driven gear 308, a coaxial lower gear 309, a coaxial upper gear 310 and a matched gear 311, wherein the fixed seat 103 is arranged on the upper wall of the left rear corner of the tank body 1, the limit seat 306 is arranged on the lower part of the left rear corner of the tank body 1, the main transmission shaft 305 is rotatably arranged between the fixed seat 103 and the limit seat 306, the fixed seat 103 and the limit seat 306 respectively limit the top and the bottom of the main transmission shaft 305, the transmission chain wheel 304 is arranged on the upper part of the main transmission shaft 305, the circuit board conveying device synchronously drives the transmission chain wheel 304 to rotate, the main transmission shaft 305 is in linkage rotation, the meshing of the gears is provided with the driving gear 307, the front part of the main transmission shaft 305 is provided with the driving gear 307, the front part of the limit seat 306 is provided with a carrier screw 312, the driven gear 308 is arranged on the upper part of the carrier screw 312, the buffer box 301 is arranged on the left part of the tank body 1, the front part and the rear part of the buffer box 301 is provided with the transmission long rod 302, the transmission chain wheel 304 is respectively limited on the top and the bottom of the main transmission shaft 305, the circuit board conveying device respectively carries out limit on the top and bottom of the main transmission chain wheel 305, the circuit board conveying device synchronously drives the transmission chain wheel 304 to rotate, the main transmission shaft 305 is in linkage rotation, the two coaxial transmission shaft is meshed with the driven gear 310 and the coaxial lower gear 311, the coaxial transmission shaft is meshed with the driven gear 311, the front gear 310 is meshed with the main transmission shaft and the main transmission shaft 310, the main transmission shaft and the main transmission shaft 310 is meshed with the main transmission shaft and the main transmission shaft 310.
Specifically, the transmission steel belt of the copper plating line can drive the transmission chain wheel 304 to rotate, thereby driving the main transmission shaft 305 to rotate, so that the driving gear 307 and the driven gear 308 are meshed to drive, the driven gear 308 is meshed to drive the coaxial lower gear 309 to drive the rear transmission long rod 302 to rotate, the coaxial upper gear 310 and the matched gear 311 are meshed to drive the front transmission long rod 302 to rotate, the coaxial upper gear 310 and the matched gear 311 are the same in size and opposite in rotation direction, the two water retaining rollers 303 can be driven to synchronously and relatively rotate along with the front transmission long rod 302 and the rear transmission long rod 302, the circuit boards are guided, the circuit boards can be conveyed through the middle parts of the two water retaining rollers 303, the transmission speed of the water retaining assembly 3 can be kept synchronous with the speed of the circuit boards transmitted by the transmission device in real time, when the type of the circuit boards is changed, the operation speed of the transmission device is correspondingly changed, friction damage to the surface of the circuit boards and the two water retaining rollers 303 is prevented when the circuit boards of different types are guided, the two copper plating good water retaining rollers 303 can be prevented from entering the circuit boards, the positions of the two copper plating good water retaining rollers 303 can be prevented from being greatly interfered by the two copper plating rollers 303, and the safety of the two copper plating rollers 303 can be greatly prevented from entering the circuit boards.
The above embodiments are merely preferred embodiments for fully explaining the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutions and modifications will occur to those skilled in the art based on the present invention, and are intended to be within the scope of the present invention. The protection scope of the invention is subject to the claims.
Claims (8)
1. Water retaining guiding device for PCB copper plating, which is characterized by comprising:
a tank body (1);
the guide assembly (2) comprises a lifting adjusting group and a guide bar (205) arranged on the lifting adjusting group, and the lifting adjusting group is arranged in the groove body (1);
the water retaining assembly (3) comprises a reverse rotating group and a water retaining roller (303) arranged on the reverse rotating group, and the reverse rotating group is arranged at the left part of the tank body (1).
2. The water deflector guide for copper plating of a PCB board according to claim 1, wherein: the device is characterized in that a bracket (101) is arranged on the front portion and the rear portion of the upper portion of the tank body (1), eleven spray pipes (102) are arranged in the bracket (101), the eleven front portions and eleven rear portions are fixedly communicated with the lower portions of the spray pipes (102), liquid flows into the spray pipe seats, and flows into the spray pipes (102) through the spray pipe seats to be sprayed out.
3. The water deflector guide for copper plating of a PCB board according to claim 1, wherein: the lifting adjusting group comprises a base (201), guide bar sliding rods (202), sliding blocks (203) and clamping grooves (204), wherein the base (201) is fixed on the front portion and the rear portion of the groove body (1), three guide bar sliding rods (202) are arranged on the upper wall of the base (201) at equal intervals in the left-right direction, three guide bar sliding rods (202) and three guide bar sliding rods (202) are arranged on the front portion, the tops of the guide bar sliding rods (202) are fixedly connected with a front support (101) and a rear support (101) respectively, three sliding blocks (203) are arranged on the guide bar sliding rods (202) in a sliding mode, and three clamping grooves (204) are formed in the rear wall of the sliding blocks (203) and the front wall of the sliding blocks (203).
4. The water deflector guide for copper plating of PCB board according to claim 3, wherein: lifting adjustment group still includes folding groove (206), riser (207), cylinder (208), link group (209), gear shaft (210) and folding gear (211), folding groove (206) have been seted up at the left portion of base (201), the right part upper wall of base (201) is fixed with riser (207), upper left portion of riser (207) and the middle part of folding groove (206) all rotate and install cylinder (208), link group (209) are the same by two length, and the tip rotates the connecting rod of connection and constitutes, left front portion and left rear portion folding groove (206) and the outer wall of three slider (203) all install three link group (209), and three of right front portion and right rear portion the outer wall of slider (203) all installs two link group (209), link group (209) lower part in cell body (1) bottom four corners rotates with the output of four cylinders (208) respectively and is connected, and the adjacent end of two link group (209) all is fixed with gear shaft (210), the inner wall (210) of gear shaft (211) is fixed with two adjacent folding gear shafts (211).
5. The water deflector guide for copper plating of PCB board according to claim 3, wherein: the nine sliding blocks (203) at the front part and the rear part are divided into six groups according to the upper, middle and lower positions, and three guide bars (205) are arranged at the inner side of each group of sliding blocks (203).
6. The water deflector guide for copper plating of a PCB board according to claim 2, wherein: the front and rear nozzles (102) are disposed in front of the front guide bar (205) and behind the rear guide bar (205), respectively.
7. The water deflector guide for copper plating of PCB board according to claim 5, wherein: the guide strip (205) comprises a clamping block (2051), a sleeve (2052), a sliding sleeve core (2053) and a fixed adhesive tape (2054), the sliding sleeve core (2053) is arranged in the sleeve (2052), the fixed adhesive tape (2054) is arranged on the outer wall of the sliding sleeve core (2053), the clamping block (2051) is fixed on the left part, the middle part and the right part of the rear wall of the sleeve (2052), and the clamping block (2051) is connected with the clamping groove (204) in a sliding mode.
8. The water deflector guide for copper plating of a PCB board according to claim 1, wherein: the left rear corner upper wall of the groove body (1) is provided with a fixing seat (103), the lifting adjusting group comprises a buffer box (301), a transmission long rod (302), a transmission chain wheel (304), a main transmission shaft (305), a limiting seat (306), a driving gear (307), a driven gear (308), a coaxial lower gear (309), a coaxial upper gear (310) and a matching gear (311), the lower part of the left rear corner of the groove body (1) is provided with the limiting seat (306), the main transmission shaft (305) is rotationally arranged between the fixing seat (103) and the limiting seat (306), the transmission chain wheel (304) is arranged on the upper part of the main transmission shaft (305), the driving gear (307) is arranged on the lower part of the main transmission shaft (305), a gap bridge screw (312) is arranged on the front part of the limiting seat (306), and the driven gear (308) is arranged on the upper part of the gap bridge screw (312);
a buffer box (301) is arranged at the left part of the groove body (1), transmission long rods (302) are arranged in the front part and the rear part of the buffer box (301), water retaining rollers (303) are fixed on the outer walls of the two transmission long rods (302), and chamfers are arranged at the upper parts of the water retaining rollers (303);
the lower outer wall of the transmission long rod (302) at the rear part is provided with a coaxial lower gear (309) and a coaxial upper gear (310), the coaxial lower gear (309) is in meshed transmission with the driven gear (308), the lower outer wall of the transmission long rod (302) at the front part is provided with a matched gear (311), and the matched gear (311) is in meshed transmission with the coaxial upper gear (310).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310840290.XA CN116575096B (en) | 2023-07-11 | 2023-07-11 | Water retaining guide device for copper plating of PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310840290.XA CN116575096B (en) | 2023-07-11 | 2023-07-11 | Water retaining guide device for copper plating of PCB (printed circuit board) |
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| Publication Number | Publication Date |
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| CN116575096A true CN116575096A (en) | 2023-08-11 |
| CN116575096B CN116575096B (en) | 2023-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310840290.XA Active CN116575096B (en) | 2023-07-11 | 2023-07-11 | Water retaining guide device for copper plating of PCB (printed circuit board) |
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| Publication number | Publication date |
|---|---|
| CN116575096B (en) | 2023-12-01 |
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