CN116568098A - Display panel and display device - Google Patents

Abstract

The embodiment of the application provides a display panel and display device, wherein, display panel has major structure district, bending zone and binding zone, and bending zone connects between major structure district and binding zone, and display panel includes: a substrate; the first organic packaging layer is arranged on one side of the substrate; the touch control layer is arranged on one side of the first organic packaging layer, which is away from the substrate; the second organic packaging layer is arranged on one side of the touch control layer, which is far away from the substrate, and is provided with a first packaging area and a second packaging area which are connected, the orthographic projection of the first packaging area on the substrate and the orthographic projection of the main body structure area on the substrate are provided with a first overlapping area, and the orthographic projection of the second packaging area on the substrate and the orthographic projection of the bending area on the substrate are provided with a second overlapping area. According to the technical scheme, the process step of coating the protection glue on the bending area by the MDL can be omitted, so that the preparation efficiency of the display panel is improved.

Description

Display panel and display device

Technical Field

The application relates to the technical field of display, in particular to a display panel and a display device.

Background

In the related art, a flexible display panel generally includes a substrate, an encapsulation layer, and a thin film transistor (Thin Film Transistor, TFT) layer between the substrate and the encapsulation layer. In order to reduce the pulling of the TFT layer when the flexible display panel is bent, a layer of protective glue is required to be coated on the bending region of the module line (MDL). However, the application of the protective paste requires a separate process to the MDL, thereby reducing the manufacturing efficiency of the flexible display panel.

Disclosure of Invention

Embodiments of the present application provide a display panel and a display device to solve or alleviate one or more technical problems in the prior art.

As an aspect of an embodiment of the present application, the embodiment of the present application provides a display panel having a main structure region, a bending region, and a binding region, the bending region being connected between the main structure region and the binding region; the display panel includes: a substrate; the first organic packaging layer is arranged on one side of the substrate; the touch control layer is arranged on one side of the first organic packaging layer, which is away from the substrate; the second organic packaging layer is arranged on one side of the touch control layer, which is far away from the substrate, and is provided with a first packaging area and a second packaging area which are connected, the orthographic projection of the first packaging area on the substrate and the orthographic projection of the main body structure area on the substrate are provided with a first overlapping area, and the orthographic projection of the second packaging area on the substrate and the orthographic projection of the bending area on the substrate are provided with a second overlapping area.

In one embodiment, the second organic encapsulation layer further has a third encapsulation region, the second encapsulation region is connected between the first encapsulation region and the third encapsulation region, and an orthographic projection of the third encapsulation region on the substrate and an orthographic projection of the bonding region on the substrate have a third overlapping region.

In one embodiment, the display panel further includes: the first blocking dam is arranged in the binding area, and one end, away from the second packaging area, of the third packaging area is stopped at the first blocking dam.

In one embodiment, the first barrier rib has a size of 25 μm to 45 μm along the arrangement direction of the inflection region and the bonding region.

In one embodiment, the minimum distance between the first barrier dam and the inflection region is 1mm to 2mm along the arrangement direction of the inflection region and the bonding region.

In one embodiment, the plurality of first blocking dams are arranged at intervals in the arrangement direction of the bending region and the binding region.

In one embodiment, the distance between two adjacent first barrier dams is 25 μm to 45 μm.

In one embodiment, the number of first blocking dams is 2 to 4.

In one embodiment, the first barrier rib and the touch layer are made of the same material, and the first barrier rib and the touch layer are formed through one process.

In one embodiment, the second organic encapsulation layer has a maximum thickness of 12 μm to 18 μm in the thickness direction of the substrate.

In one embodiment, the display panel further includes: the driving chip and the second organic packaging layer are arranged on the same side of the substrate, the driving chip is located in the binding area, and the driving chip and the second organic packaging layer are arranged at intervals.

In one embodiment, the body structure region includes a display region and a non-display region located outside the display region, and the display panel further includes: the first inorganic packaging layer is arranged between the substrate and the first organic packaging layer, covers the display area and extends to the non-display area; the second inorganic packaging layer is arranged between the first organic packaging layer and the touch control layer, covers the display area and extends to the non-display area; the second blocking dam and the second inorganic packaging layer are arranged on the same side of the substrate, and the second blocking dam is positioned in a non-display area between the first organic packaging layer and the bending area.

As another aspect of the embodiments of the present application, the embodiments of the present application provide a display device including the display panel of any one of the above embodiments.

According to the technical scheme, the technical step of coating the protection glue on the bending area by the MDL can be omitted, so that the preparation efficiency of the display panel is improved.

The foregoing summary is for the purpose of the specification only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present application will become apparent by reference to the drawings and the following detailed description.

Drawings

In the drawings, the same reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily drawn to scale. It is appreciated that these drawings depict only some embodiments according to the disclosure and are not therefore to be considered limiting of its scope.

Fig. 1 is a schematic view showing a structure of a display panel in the related art;

fig. 2 shows a schematic structural diagram of a display panel according to an embodiment of the present application;

fig. 3 shows a schematic structural view of a display panel according to another embodiment of the present application;

fig. 4 shows a schematic structural view of a display panel according to still another embodiment of the present application.

Reference numerals illustrate:

related technology: 10: a display panel; 11: a substrate; 12: an encapsulation layer; 12a: a first inorganic encapsulation layer; 12b: a second inorganic encapsulation layer; 12c: a first organic encapsulation layer; 12d: a second organic encapsulation layer; 13: a TFT layer; 14: a touch layer; 15: a protective adhesive;

the application comprises the following steps: 100: a display panel; 110: a substrate; 120: a first organic encapsulation layer; 130: a touch layer; 140: a second organic encapsulation layer; 141: a first package region; 142: a second package region; 143: a third package region; 150: a first barrier dam; 160: a first inorganic encapsulation layer; 170: a second inorganic encapsulation layer; 180: a second barrier dam; 190: a TFT layer; 100a: a circular polarizer; 100b: a protective film; 100c: a main body structure region; 100d: a bending region; 100e: binding area.

Detailed Description

Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present application. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.

Fig. 1 is a schematic view showing a structure of a display panel in the related art. As shown in fig. 1, in the related art, a display panel 10, such as an Organic Light-Emitting Diode (OLED) display panel, generally includes a substrate 11, an encapsulation layer 12, and a TFT layer 13 between the substrate 11 and the encapsulation layer 12. The display panel 10 is generally packaged using a flexible thin film packaging technique, i.e., the package layer 12 of the display panel 10 includes a first inorganic package layer 12a, a second inorganic package layer 12b, and a first organic package layer 12c between the first and second inorganic package layers 125a and 12 b. The display panel 10 further includes a touch layer 14, where the touch layer 14 is disposed on a side of the second inorganic encapsulation layer 12b facing away from the substrate 11. However, such display panel 10 has uneven edges and poor appearance of moire.

In order to improve the problem of poor appearance of the display panel, the second organic encapsulation layer 12d is generally disposed on the side of the touch layer 14 facing away from the substrate 11 as a flat layer. The second organic encapsulation layer 12d is cut off before the bending region, and the front projection of the second organic encapsulation layer 12d on the substrate 11 does not overlap with the front projection of the bending region on the substrate 11. In addition, in order to reduce the force applied to the TFT layer 13 when the display panel 10 is bent, a layer of protective paste 15 needs to be applied to the bending region of the MDL so that the TFT layer 13 is located between the protective paste 15 and the substrate 11, thereby protecting the TFT layer 13. The application of the protective paste 15 may cause complicated process steps of the display panel 10, reducing the manufacturing efficiency.

Fig. 2 shows a schematic structural diagram of a display panel according to an embodiment of the present application. As shown in fig. 2, the display panel 100 according to the embodiment of the present application has a body structure region 100c, a bending region 100d, and a binding region 100e, and the bending region 100d is connected between the body structure region 100c and the binding region 100e.

Illustratively, the display panel 100 may be a flexible display panel (e.g., an OLED display panel). The display panel 100 may have a bent state and an unfolded state, and the display panel 100 shown in fig. 2 is in the unfolded state. In a case where the display panel 100 is in a folded state (not shown), the folding region 100d is folded and the binding region 100e is connected to the rear surface of the main structure region 100c through the folding region 100 d. The projection relationship between the film layers described below refers to the projection relationship in the unfolded state of the display panel 100.

The display panel 100 includes a substrate 110, a first organic encapsulation layer 120, a touch layer 130, and a second organic encapsulation layer 140. The first organic encapsulation layer 120 is disposed on one side of the substrate 110. The touch layer 130 is disposed on a side of the first organic encapsulation layer 120 facing away from the substrate 110, and is used for implementing a touch function of the display panel 100. The second organic encapsulation layer 140 is disposed on a side of the touch layer 130 away from the substrate 110, so as to ensure flatness of the display panel 100, and smooth edges of the display panel 100, thereby avoiding poor appearance of the wave marks.

Illustratively, the substrate 110 may be a flexible substrate, so that the display panel 100 has a bendable property, and may be switched from an unfolded state to a bent state. The substrate 110 may have a single-layer structure or a multi-layer structure. In the case that the substrate 110 has a single-layer structure, the substrate 110 may be a Polyimide (PI) layer; in the case where the substrate 110 has a multi-layered structure, the substrate 110 may include a plurality of PI layers, buffer layers, and the like, which are sequentially stacked.

Illustratively, in order to facilitate processing of the desired components for the respective regions of the display panel 100, the respective regions may be previously defined on the substrate 110. For example, the body structure region 100c, the bending region 100d, and the binding region 100e may be divided on the substrate 110, i.e., the body structure region 100c, the bending region 100d, and the binding region 100e may be divided on the display panel 100.

Illustratively, the first organic encapsulation layer 120 and the second organic encapsulation layer 140 may be prepared using an inkjet printing process, or may be formed using a spray coating process. The materials of the first and second organic encapsulation layers 120 and 140 may be one or more combinations of acrylamide, polyacrylate, polycarbonate, polystyrene, and hexamethyldisiloxane, but are not limited thereto.

Illustratively, the material of the touch layer 130 may include transparent conductive oxide (transparent conduct ive oxide, TOC), but is not limited thereto.

The second organic encapsulation layer 140 has a first encapsulation region 141 and a second encapsulation region 142 connected, where the front projection of the first encapsulation region 141 on the substrate 110 and the front projection of the main body structure region 100c on the substrate 110 have a first overlapping region, and the front projection of the second encapsulation region 142 on the substrate 110 and the front projection of the bending region 100d on the substrate 110 have a second overlapping region.

For example, in preparing the display panel 100, the TFT layer 190 may be first formed on one side of the substrate 110, the TFT layer 190 may include a plurality of TFTs, the front projection of the TFT layer 190 on the substrate 110 overlaps with the front projection of the body structure region 100c on the substrate 110 in the unfolded state of the display panel 100, the front projection of the TFT layer 190 on the substrate 110 overlaps with the front projection of the bending region 100d on the substrate 110, and the front projection of the TFT layer 190 on the substrate 110 overlaps with the front projection of the bonding region 100e on the substrate 110. An organic light emitting layer may then be formed on the side of the TFT layer 190 facing away from the substrate 110, the front projection of the organic light emitting layer onto the substrate 110 overlapping the front projection of the body structure region 100c onto the substrate 110. Then, the first organic encapsulation layer 120, the touch layer 130 and the second organic encapsulation layer 140 may be sequentially formed on a side of the organic light emitting layer facing away from the substrate 110, so that the front projection of the first encapsulation area 141 on the substrate 110 and the front projection of the main body structure area 100c on the substrate 110 have a first overlapping area, and the front projection of the second encapsulation area 142 on the substrate 110 and the front projection of the bending area 100d on the substrate 110 have a second overlapping area.

Wherein, a side surface of the first encapsulation region 141 facing away from the substrate 110 may include a plane to ensure flatness of the display panel 100. The second encapsulation region 142 may extend to the bending region 100d, so that a portion of the TFT layer 190 located at the bending region 100d may be located between the second encapsulation region 142 and the substrate 110, thereby enabling the second encapsulation region 142 to play the same role of bending resistance as the protective adhesive in the related art, and reducing the force applied to the TFT layer 190 when the display panel 100 is bent. Alternatively, the second organic encapsulation layer 140 may have characteristics similar to those of the protective adhesive in the related art, for example, a certain flowability and bending resistance.

According to the display panel 100 of the embodiment of the application, the second organic encapsulation layer 140 is disposed on the side of the touch layer 130 away from the substrate 110, and the front projection of the first encapsulation area 141 on the substrate 110 and the front projection of the main structure area 100c on the substrate 110 have a first overlapping area, the front projection of the second encapsulation area 142 on the substrate 110 and the front projection of the bending area 100d on the substrate 110 have a second overlapping area, so that the first encapsulation area 141 can ensure the flatness of the display panel 100, and avoid occurrence of poor wave mark appearance. Meanwhile, the second packaging region 142 can play an effective role in bending resistance, and a process step of coating the bending region with the protective adhesive on the MDL can be omitted, so that the manufacturing efficiency of the display panel 100 is improved.

Fig. 3 illustrates a schematic structure of a display panel 100 according to another embodiment of the present application. In one embodiment, referring to fig. 3 in combination with fig. 2, the second organic encapsulation layer 140 further has a third encapsulation region 143, the second encapsulation region 142 is connected between the first encapsulation region 141 and the third encapsulation region 143, and an orthographic projection of the third encapsulation region 143 on the substrate 110 and an orthographic projection of the bonding region 100e on the substrate 110 have a third overlapping region. Illustratively, the body structure region 100c, the inflection region 100d, and the binding region 100e are arranged in a first direction (e.g., left-right direction in fig. 3), and the first, second, and third encapsulation regions 141, 142, and 143 are also arranged in the first direction. An end (e.g., a right end in fig. 3) of the third encapsulation region 143 facing away from the second encapsulation region 142 may extend to the bonding region 100e, so that the second organic encapsulation layer 140 may completely cover the bending region 100d in the first direction, thereby providing better bending resistance and reducing the force applied to the TFT layer 190 when the display panel 100 is bent.

In one embodiment, referring to fig. 3, the display panel 100 further includes a first blocking dam 150, the first blocking dam 150 is disposed at the bonding area 100e, and an end (e.g., a right end in fig. 3) of the third encapsulation area 143 facing away from the second encapsulation area 142 is stopped by the first blocking dam 150. Therefore, by arranging the first blocking dam 150, the first blocking dam 150 can play an effective stopping role, and the second organic packaging layer 140 is prevented from overflowing the first blocking dam 150, so that water and oxygen are prevented from entering a display area along the second organic packaging layer 140, the water and oxygen invasion path is blocked, the packaging protection of preventing water vapor is realized, and the service life of the display panel 100 can be prolonged.

In one embodiment, the dimension a of the first barrier dam 150 is 25 μm to 45 μm (inclusive) along the arrangement direction (i.e., the first direction) of the inflection region 100d and the bonding region 100e. Specifically, for example, in the case where the size a of the first barrier rib 150 is smaller than 25 μm, the size of the first barrier rib 150 in the first direction is too small, so that the contact area between the first barrier rib 150 and the adjacent film layer (e.g., the TFT layer 190) is too small, the connection reliability is poor, the peeling is easily generated, and the stopping effect on the second organic encapsulation layer 140 is relatively poor. In the case where the size a of the first barrier dam 150 is greater than 45 μm, the size of the first barrier dam 150 in the first direction is excessively large, and the occupied area is excessively large, which is disadvantageous in terms of the spatial layout of the components on the bonding region 100e. Alternatively, the size a of the first barrier dam 150 may be 30 μm, but is not limited thereto.

Therefore, by making the dimension of the first blocking dam 150 in the arrangement direction of the bending region 100d and the binding region 100e be 25 μm-45 μm, on one hand, the connection reliability of the first blocking dam 150 and the adjacent film layer can be ensured, the peeling is avoided, and meanwhile, the second organic encapsulation layer 140 has a better stopping effect; on the other hand, the active area of the first blocking dam 150 is relatively small, thereby facilitating the spatial layout of the components within the bonding region 100e.

In one embodiment, the minimum distance b between the first barrier dam 150 and the inflection zone 100d may be 1mm to 2mm (inclusive) along the arrangement direction of the inflection zone 100d and the bonding zone 100e (i.e., the first direction described above). By such arrangement, while the second organic encapsulation layer 140 can extend to the bonding area 100e to play a role in bending resistance, the occupation area of the third encapsulation area 143 of the second organic encapsulation layer 140 on the bonding area 100e can be prevented from being too large, which is further beneficial to the spatial layout of each component on the bonding area 100e. Illustratively, the minimum distance b between the first barrier dam 150 and the inflection zone 100d may be 1.5mm, but is not limited thereto.

In one embodiment, referring to fig. 2 and 3, the first blocking dam 150 may be a plurality of first blocking dams 150 spaced apart in the arrangement direction (i.e., the first direction) of the bending region 100d and the binding region 100e. In the description of the present application, the meaning of "plurality" is two or more. Illustratively, the number of first barrier dams 150 may be 2-4 (inclusive). For example, in the example of fig. 3, two first blocking dams 150 are shown, both of the first blocking dams 150 are located at the bonding region 100e, and the second organic encapsulation layer 140 stops against the first blocking dam 150 near the bending region 100d among the two first blocking dams 150.

Therefore, by making the first blocking dams 150 be multiple, the multiple first blocking dams 150 can play a more reliable role in stopping, so that the second organic encapsulation layer 140 is effectively prevented from overflowing through the multiple first blocking dams 150, and water and oxygen are prevented from entering the display area along the second organic encapsulation layer 140, and the display effect of the display panel 100 can be improved.

Two first barrier dams 150 are shown in fig. 3 for illustrative purposes, but it will be apparent to one of ordinary skill in the art after reading the teachings of the present application that the teachings apply to other numbers of first barrier dams 150 and remain within the scope of the present application.

In one embodiment, the distance c between two adjacent first barrier dams 150 may be 25 μm to 45 μm (inclusive).

Illustratively, in the case where the number of the first barrier ribs 150 is greater than 2, a plurality of gaps c are provided between the plurality of first barrier ribs 150, and the plurality of gaps c may be equal, in which case the plurality of first barrier ribs 150 are uniformly spaced; alternatively, the plurality of gaps c are all unequal; alternatively, one of the gaps c is equal, and the other of the gaps c is unequal.

Illustratively, the distance c between two adjacent first barrier dams 150 may be equal to the dimension a of the first barrier dams 150 in the arrangement direction of the inflection region 100d and the bonding region 100e, for example, a=c=30 μm.

In this embodiment, by making the distance between two adjacent first barrier dams 150 between 25 μm and 45 μm, the distance between two adjacent first barrier dams 150 is reasonable, and the preparation of a plurality of first barrier dams 150 is more convenient while the overflow of the second organic encapsulation layer 140 is effectively avoided.

In one embodiment, the materials of the first barrier dam 150 and the touch layer 130 may be the same, and the first barrier dam 150 and the touch layer 130 may be formed through one process. The process may include the steps of coating, exposing, developing, etching, stripping, etc. of the photoresist. The "one-time process" refers to forming the first barrier dam 150 and the touch layer 130 in the same process.

Therefore, the first barrier rib 150 and the touch layer 130 are formed through one process, so that the process of the display panel 100 can be simplified, and the manufacturing cost of the mask can be saved, and meanwhile, the manufacturing efficiency of the display panel 100 can be further improved.

In one embodiment, the maximum thickness of the second organic encapsulation layer 140 may be 12 μm to 18 μm (inclusive) along the thickness direction of the substrate 110. In this way, the thickness of the second organic encapsulation layer 140 is reasonable, and the second organic encapsulation layer can buffer and absorb the force applied to the display panel 10 during the bending process while effectively ensuring the flatness of the display panel 100, thereby playing an effective role in protection.

In one embodiment, the display panel 100 further includes a driving chip disposed on the same side of the substrate 110 as the second organic packaging layer 140, the driving chip is located in the bonding area 100e, and the driving chip is disposed at a distance from the second organic packaging layer 140. Illustratively, the display panel 100 may further include a flexible circuit board to which the driving chip is electrically connected. An end (e.g., right end in fig. 3) of the third encapsulation region 143 of the second organic encapsulation layer 140 facing away from the second encapsulation region 142 may be spaced apart from the driving chip.

Therefore, by arranging the driving chip and the second organic packaging layer 140 at intervals, the second organic packaging layer 140 can be cut off before extending to the driving chip, so that insulation between the driving chip and the flexible circuit board caused by covering the driving chip by the second organic packaging layer 140 can be avoided, reliable electrical connection between the driving chip and the flexible circuit board is ensured, and display reliability of the display panel 100 is further ensured.

In one embodiment, and with reference to fig. 3, the body structure region 100c includes a display region and a non-display region disposed at an edge of the display region. The display panel 100 further includes a first inorganic encapsulation layer 160, a second inorganic encapsulation layer 170, and a second barrier dam 180. The first inorganic encapsulation layer 160 is disposed between the substrate 110 and the first organic encapsulation layer 120, and the first inorganic encapsulation layer 160 covers the display area and extends to the non-display area. The second inorganic encapsulation layer 170 is disposed between the first organic encapsulation layer 120 and the touch control layer 130, and the second inorganic encapsulation layer 170 covers the display area and extends to the non-display area. The second barrier rib 180 and the second inorganic encapsulation layer 170 are disposed on the same side of the substrate 110, and the second barrier rib 180 is located in the non-display region between the first organic encapsulation layer 120 and the bending region 100 d. Illustratively, the material of the first and second inorganic encapsulation layers 160 and 170 may be one or more combinations of aluminum oxide, titanium oxide, silicon nitride, silicon oxynitride, and silicon carbonitride, but is not limited thereto.

Thus, by providing the first and second inorganic encapsulation layers 160 and 170 described above, the first and second inorganic encapsulation layers 160 and 170 can function as effective barriers to water and oxygen. Moreover, since the first organic packaging layer 120 is located between the first inorganic packaging layer 160 and the second inorganic packaging layer 170, the inorganic material and the organic material are combined to perform packaging, so that a better packaging effect can be obtained, the first inorganic packaging layer 160 and the second inorganic packaging layer 170 can form a function similar to a retaining wall, and under the condition that the first organic packaging layer 120 adsorbs water and oxygen, the first inorganic packaging layer 160 and the second inorganic packaging layer 170 can block the water and oxygen in the first organic packaging layer 120, so as to form a blocking space trapping the water and oxygen, thereby avoiding water and oxygen diffusion and invasion, further improving the water and oxygen blocking capability of the display panel 100, and prolonging the service life of the display panel 100. By providing the second blocking dam 180 as described above, the second blocking dam 180 can be used to stop the first organic encapsulation layer 120, thereby avoiding the overflow of the first organic encapsulation layer 120.

Fig. 4 shows a schematic structural diagram of a display panel 100 according to still another embodiment of the present application. As shown in fig. 4, the display panel 100 further includes a circular polarizer 100a, and the circular polarizer 100a is disposed on a side of the second organic encapsulation layer 140 facing away from the substrate 110. Thus, the circular polarizer 100a can be used to resist ambient light and reduce interference of the ambient light to the display, so as to ensure the display effect of the display panel 100.

In one embodiment, the display panel 100 further includes a protective film 100b, where the protective film 100b is disposed on a side of the substrate 110 facing away from the second organic encapsulation layer 140, and the front projection of the protective film 100b on the substrate 110 and the front projection of the main structure region 100c on the substrate 110 have a fourth overlapping region, and the front projection of the protective film 100b on the substrate 110 and the front projection of the binding region 100e on the substrate 110 have a fifth overlapping region. Thus, the protective film 100b thus disposed can ensure the flexibility of the display panel 100, so that the display panel 100 is not easily broken, thereby improving the bending reliability of the display panel 100.

The embodiment of the application also provides a display device, which comprises the display panel 100 of any embodiment.

The display device may be a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, or any other product or component with a display function.

Other configurations of the display panel 100 and the display device of the above-described embodiments may be applied to various technical solutions now and in the future known to those skilled in the art, and will not be described in detail herein.

In the description of the present specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the present application. The components and arrangements of specific examples are described above in order to simplify the disclosure of this application. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of various changes or substitutions within the technical scope of the present application, and these should be covered in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (13)

1. The display panel is characterized by comprising a main structure area, a bending area and a binding area, wherein the bending area is connected between the main structure area and the binding area; the display panel includes:

a substrate;

the first organic packaging layer is arranged on one side of the substrate;

the touch control layer is arranged on one side of the first organic packaging layer, which is away from the substrate;

the second organic packaging layer is arranged on one side, away from the substrate, of the touch control layer, the second organic packaging layer is provided with a first packaging area and a second packaging area which are connected, orthographic projection of the first packaging area on the substrate and orthographic projection of the main body structure area on the substrate are provided with a first overlapping area, and orthographic projection of the second packaging area on the substrate and orthographic projection of the bending area on the substrate are provided with a second overlapping area.

2. The display panel of claim 1, wherein the second organic encapsulation layer further has a third encapsulation region, the second encapsulation region being connected between the first encapsulation region and the third encapsulation region, an orthographic projection of the third encapsulation region on the substrate and an orthographic projection of the bonding region on the substrate having a third overlap region.

3. The display panel of claim 2, further comprising:

the first blocking dam is arranged in the binding area, and one end, away from the second packaging area, of the third packaging area is stopped at the first blocking dam.

4. A display panel according to claim 3, wherein the first barrier rib has a size of 25 μm to 45 μm along the arrangement direction of the bending region and the binding region.

5. A display panel according to claim 3, wherein the minimum distance between the first barrier rib and the bending region is 1mm to 2mm in the arrangement direction of the bending region and the binding region.

6. The display panel according to claim 3, wherein the first barrier ribs are provided in plurality, and the plurality of first barrier ribs are disposed at intervals in the arrangement direction of the bending region and the binding region.

7. The display panel according to claim 6, wherein a distance between adjacent two of the first barrier ribs is 25 μm to 45 μm.

8. The display panel of claim 6, wherein the number of the first barrier ribs is 2 to 4.

9. The display panel of claim 3, wherein the first barrier rib and the touch layer are made of the same material, and the first barrier rib and the touch layer are formed by a single process.

10. The display panel according to any one of claims 1 to 9, wherein a maximum thickness of the second organic encapsulation layer is 12 μm to 18 μm in a thickness direction of the substrate.

11. The display panel according to any one of claims 1 to 9, further comprising:

the driving chip and the second organic packaging layer are arranged on the same side of the substrate, the driving chip is located in the binding area, and the driving chip and the second organic packaging layer are arranged at intervals.

12. The display panel of any one of claims 1-9, wherein the body structure region includes a display region and a non-display region located outside the display region, the display panel further comprising:

the first inorganic packaging layer is arranged between the substrate and the first organic packaging layer, and covers the display area and extends to the non-display area;

the second inorganic packaging layer is arranged between the first organic packaging layer and the touch control layer, covers the display area and extends to the non-display area;

the second blocking dam and the second inorganic packaging layer are arranged on the same side of the substrate, and the second blocking dam is positioned in a non-display area between the first organic packaging layer and the bending area.

13. A display device comprising the display panel according to any one of claims 1 to 12.