CN116567958A - Grafting circuit board and grafting method thereof - Google Patents
Grafting circuit board and grafting method thereof Download PDFInfo
- Publication number
- CN116567958A CN116567958A CN202310389167.0A CN202310389167A CN116567958A CN 116567958 A CN116567958 A CN 116567958A CN 202310389167 A CN202310389167 A CN 202310389167A CN 116567958 A CN116567958 A CN 116567958A
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- daughter
- circuit board
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000005520 cutting process Methods 0.000 claims abstract description 42
- 230000000295 complement effect Effects 0.000 claims abstract description 24
- 239000002699 waste material Substances 0.000 claims abstract description 18
- 238000003801 milling Methods 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 6
- 238000003475 lamination Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application provides a circuit board and a grafting method thereof, which are applied to the technical field of circuit board grafting processes. Obtaining a mother board to be grafted and a child board used as grafting; cutting edge positions of the daughter board and the mother board for grafting to make the outline shapes of the edges of the mother board and the daughter board for grafting complementary; and the edges of the daughter board and the mother board corresponding to each other are provided with a gap area; and buckling the edges of the daughter boards to the edges corresponding to the mother boards to obtain the grafted circuit board. The method has the advantages that the size of the product can be better controlled by carrying out a grafting mode of seamless joint and positive and negative buckling on the mother board and the daughter board in the multi-piece of the circuit board with the reflow layer, so that the product has higher combination degree, better interface flatness, no falling risk, no trace in appearance and high grafting concealment; the resource is saved, and the reflow layer multi-chip circuit board with the waste board is utilized.
Description
Technical Field
The invention relates to the technical field of a printed circuit board grafting process, in particular to a grafted circuit board and a grafting method thereof.
Background
At present, along with market competition, more and more electronic factories require production of the on-chip circuit board so as to improve production efficiency and reduce production cost. But single scrapping of the connected circuit boards becomes a difficult problem of a circuit board factory. To solve this problem, PCB board transplanting techniques have been developed.
The existing PCB grafting technology mainly comprises two kinds of seamless grafting and seamed grafting of an outer circuit board. The existing seamless grafting has the problems of too little interface glue, insufficient binding force and too high risk of falling off at the interface. The existing outer circuit board has the problems of poor size control, poor binding force and low interface flatness due to no supporting points for buckling interfaces of the sub-mother boards. And the grafting trace of the grafted outer circuit board is obvious.
Disclosure of Invention
The technical problem that this application mainly solves is to provide a grafting circuit board and grafting method thereof, can effectively solve in the circuit board grafting technology, grafting cohesion is not good enough, interface roughness is not high to the grafting trace of outer circuit board after the grafting can be more obvious problem.
In order to solve the above problems, a first aspect of the present application provides a grafting method of a circuit board, including the following steps:
obtaining a mother board to be grafted and a daughter board used as grafting;
cutting the edge positions of the daughter board and the mother board for grafting so that the outline shapes of the edges of the mother board and the daughter board for grafting are complementary; and the set edges of the daughter board and the mother board are provided with gap areas;
and buckling the edges of the daughter boards to the edges corresponding to the mother board to obtain the grafted circuit board.
Wherein, the circuit board is a reflow layer circuit board.
The cutting processing is performed on edge positions of the daughter board and the mother board for grafting, so that the steps of complementing edge contour shapes of the mother board and the daughter board for grafting specifically comprise:
cutting a first edge of the mother board for grafting with the daughter board based on a set shape, and forming a groove at a set position of the first edge; and
cutting a second edge of the daughter board for grafting based on the set shape, and forming a bridge at a set position of the second edge; the shapes of the first edge and the second edge after cutting are complementary; the groove corresponds to the bridge in position;
the step of buckling the edges of the daughter boards to the edges corresponding to the mother board to obtain the grafted circuit board comprises the following steps:
grafting the corresponding complementary positions of the first edge and the second edge, and connecting the grooves corresponding to the positions with the bridge.
The specific steps of cutting the edge positions of the daughter board and the mother board for grafting so that the outline shapes of the edges of the mother board and the daughter board for grafting are complementary include:
determining a width deviation value of the corresponding positions of the edges of the mother board and the daughter board; the width deviation value is characterized by the diameter of the milling cutter;
and cutting the edge positions of the daughter board and the mother board for grafting according to the width deviation value, so that the outline shapes of the edges of the mother board and the daughter board for grafting are complementary.
The edge width of the mother board is larger than that of the daughter board, and the width deviation value of the corresponding positions of the mother board and the daughter board is 1 unit of milling cutter diameter.
The specific steps of obtaining the mother board to be grafted and the daughter board used as the grafting include:
responding to the number of the waste boards in the circuit board multi-piece structure not exceeding a second set number, cutting the waste boards, and taking the rest normal boards as the mother boards to be grafted;
and in response to the number of the waste boards in the circuit board multi-piece structure exceeding the second set number, cutting out the remaining normal boards in the multi-piece structure of the circuit board, and taking the cut normal boards as the sub-boards used for grafting.
The method for fastening the daughter board to the mother board to obtain the grafted circuit board comprises the following steps:
the daughter board is buckled on the mother board, and the mother board is completely matched with the daughter board in a non-gap area; and filling glue in the gap area to obtain the grafted circuit board.
In order to solve the above-mentioned problem, the second aspect of the present application provides a grafted circuit board, the grafted circuit board specifically includes:
a motherboard and a daughter board; the edges of the daughter boards are buckled on the edges corresponding to the mother board; the edge outline shapes of the mother board and the daughter board for grafting are complementary; and a gap area is arranged at the set edge corresponding to the mother board and the daughter board.
The mother board is used for forming a groove at a set position of a first edge of the daughter board; the daughter board is used for forming a bridge at a set position of the grafted second edge; the shapes of the first edge and the second edge after cutting are complementary; the grooves correspond to the bridge in position, and the grooves corresponding to the bridge in position are connected with each other.
The edge width of the mother board is larger than that of the daughter board, and the width deviation value of the corresponding positions of the mother board and the daughter board is 1 unit of milling cutter diameter.
Wherein, the grafting circuit board still includes: the gap area is positioned at the top end of the groove at the first edge, and symmetrical three points are arranged on two sides without the groove, and the three points are equidistant points.
The beneficial effects of the invention are as follows: different from the condition of the prior art, the application provides a circuit board and a grafting method thereof, which are applied to the technical field of circuit board grafting processes. Obtaining a mother board to be grafted and a child board used as grafting; cutting edge positions of the daughter board and the mother board for grafting to make the outline shapes of the edges of the mother board and the daughter board for grafting complementary; and the edges of the daughter board and the mother board corresponding to each other are provided with a gap area; and buckling the edges of the daughter boards to the edges corresponding to the mother boards to obtain the grafted circuit board. The method has the advantages that the size of the product can be better controlled by carrying out a grafting mode of seamless joint and positive and negative buckling on the mother board and the daughter board in the multi-piece of the circuit board with the reflow layer, so that the product has higher combination degree, better interface flatness, no falling risk, no trace in appearance and high grafting concealment; the resource is saved, and the reflow layer multi-chip circuit board with the waste board is utilized.
Drawings
FIG. 1 is a schematic flow chart of an embodiment of a method for grafting a circuit board according to the present application;
FIG. 2 is a flow chart illustrating the step S102 of FIG. 1 according to an embodiment;
FIG. 3 is a schematic diagram of an embodiment of a grafted circuit board of the present application;
FIG. 4a is a schematic diagram of an embodiment of a motherboard of the present application;
fig. 4b is a schematic structural diagram of an embodiment of the daughter board of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" generally includes at least two, but does not exclude the case of at least one.
It should be understood that the term "and/or" as used herein is merely one relationship describing the association of the associated objects, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
It should be understood that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
In daily circuit board preparation, a situation that individual circuit boards in multiple chips are scrapped is frequently encountered. In particular, if the high-layer board is not laminated to the reflow layer circuit board of the bottom layer and the top layer in the lamination process, the scrapped board is generated, and at the moment, the reflow layer circuit board can be grafted first and then further laminated, so that the scrapped material of the subsequent lamination cannot be wasted. For example, when a circuit board with 16 layers is laminated to 8 layers, a scrapped board is detected, the scrapped board is cut off, the circuit board with 8 layers of reflow layers is grafted, and then the next lamination is carried out. According to the method, the circuit board with the reflow layer is grafted, so that the circuit board with the appearance without marks and the combination with the reflow layer is compact.
Specifically, referring to fig. 1, fig. 1 is a schematic flow chart of a first embodiment of a grafting method of a circuit board in the present application. The method comprises the following steps:
step S101: and obtaining a mother board to be grafted and a daughter board used as grafting.
In this embodiment, whether or not a waste board is present in the multi-piece structure of the reflow layer circuit board is detected.
Cutting the waste boards and taking the rest normal boards as mother boards to be grafted in response to the number of the waste boards in the circuit board multi-piece structure not exceeding a second set number;
and in response to the number of the waste boards in the multi-piece structure of the circuit board exceeding the second set number, cutting the remaining normal boards in the multi-piece structure of the circuit board, and taking the cut normal boards as the grafted sub-boards.
Specifically, the multi-piece structure of the reflow layer circuit board can be 6 pieces, the second set number can be set to 2 pieces, the multi-piece structure can also be an integral structure of connecting 4 pieces and 8 pieces of reflow layer circuit boards, and the number of the specific reflow layer circuit boards can be set according to actual requirements without limitation. The number of layers of the circuit board with the reflow layer can also be set according to the actual setting, and in the lamination process, as long as the inner circuit board without the bottom layer and the top layer are all reflow layer circuit boards, for example, the circuit board with 16 layers in total can be grafted when being laminated to 4 layers, 8 layers, 12 layers and the like.
In other embodiments, when the mother board and the daughter board with grafting are obtained, the second set number is not limited to 2, and can be determined according to the number of circuit boards of the reflow layer in the actual multiple pieces, if the multiple pieces are found to have waste boards in the detection, only the multiple pieces with the small number of waste boards are required to be used as the mother board, and the normal boards in the multiple pieces with the large number of waste boards are required to be used as the daughter boards, so that the maximum utilization rate of materials is ensured.
Step S102: cutting edge positions of the daughter board and the mother board for grafting to make the outline shapes of the edges of the mother board and the daughter board for grafting complementary; and a gap area is arranged at the corresponding set edge of the daughter board and the mother board.
Specifically, referring to fig. 2, fig. 2 is a flowchart of an embodiment of cutting edge positions of the daughter board and the mother board for grafting in step S102. The method comprises the following steps:
step S1021: and cutting the edge positions of the daughter board and the mother board for grafting.
Cutting a first edge of the mother board for grafting with the daughter board based on the set shape, and forming a groove at a set position of the first edge; and
cutting the second edge of the sub-board for grafting based on the set shape, and forming a bridge at the set position of the second edge; the shape of the first edge and the shape of the second edge after cutting are complementary; the groove corresponds to the position of the bridge;
the step of buckling the edges of the daughter boards to the edges corresponding to the mother boards to obtain the grafted circuit board comprises the following steps:
grafting the corresponding complementary positions of the first edge and the second edge, and connecting the grooves corresponding to the positions with the bridge.
Step S1022: the outline shapes of the edges of the mother board and the daughter board for grafting are complementary.
The edge width of the mother board is larger than that of the daughter board, and the width deviation value of the corresponding positions of the mother board and the daughter board is 1 unit of milling cutter diameter.
In this embodiment, the milling cutter has a diameter of 19.5 mils, and the first edge width is increased by 19.5 mils when cutting the master and the second edge width is decreased by 19.5 mils when cutting the daughter board, so that the edge profiles of the master and daughter boards for grafting are complementary.
In other embodiments, the width deviation value of the corresponding positions of the mother board and the daughter board may be set to 1.5 units, 2 units of milling cutter diameter. Specifically, the actual milling cutter diameter, the actual spacing between cell plates, and the desired edge width may be determined without limitation.
Step S103: and buckling the edges of the daughter boards to the edges corresponding to the mother board to obtain the grafted circuit board.
The daughter board is buckled on the mother board, and the mother board and the daughter board are completely matched in a non-gap area; glue is filled in the gap area, and the grafted circuit board is obtained.
The difference is that prior art, this application provides a grafting method of circuit board, and through grafting mother board and grafting daughter board have the seam to add seamlessly to and the grafting mode that positive and negative looks detained for the circuit board grafting of backward flow layer is more firm, obtains the outward appearance seamless, and combines inseparable circuit board.
Referring to fig. 3, fig. 3 is a schematic structural diagram of the grafted circuit board of the present application. The circuit board is obtained by the implementation mode of any grafting method; specifically, the structure may be as follows:
301 is a motherboard; 302 is a daughter board; 303 are gap regions. Motherboard 301 is a multi-piece of the remaining reflow layer circuit board with a gap after the scrapped board is cut off, daughter board 302 is a single reflow layer circuit board, and the edges of daughter board 302 are buckled on the corresponding edges of motherboard 301; wherein, the outline shapes of the edges of the mother board 301 and the daughter board 302 for grafting are complementary; and, a slit region 303 is provided at a set edge corresponding to the mother board 301 and the daughter board 302.
Specifically, the motherboard 301 is used for forming a groove at a set position of a first edge grafted with the daughter board 302; the daughter board 302 is used for forming a bridge at the set position of the grafted second edge; the shape of the first edge and the shape of the second edge after cutting are complementary; the grooves of the first edge correspond to the bridging positions of the second edge, and the grooves corresponding to the positions are mutually connected with the bridging.
The edge width of the mother board 301 is larger than that of the daughter board 302, and the width deviation value of the corresponding positions of the mother board 301 and the daughter board 302 is 1 unit of milling cutter diameter.
The slit region 303 is located at the top end of the groove of the first edge, and two sides without the groove are respectively provided with symmetrical three points, wherein the three points on each side are equidistant points. The slot region 303 is semi-circular in shape and has a 2 unit diameter of milling cutter.
In other embodiments, the shape of the slit region 303 may be set to a different shape, for example, rectangular, circular, etc., and the size may be set to 2.5 units, 3 units, etc., and the diameter is not limited thereto.
The circuit board is obtained by the implementation mode of any grafting method, the reflux layer circuit board after grafting is tightly combined, and the circuit board is further laminated to obtain the complete circuit board without grafting marks in appearance.
In a specific embodiment, please refer to fig. 4a and fig. 4b, fig. 4a is a schematic diagram of the motherboard structure of any step in the above embodiment, and fig. 4b is a schematic diagram of the sub-board structure of any step in the above embodiment.
401 in fig. 4a is a grafting master; 402 is a first edge; 403 is a gap region. The grafting mother board 401 is a PCB multi-piece structure to be grafted after the waste board is cut, and the cutting path is a first edge 402. If the adjacent cell plates in the multiple plate configuration are spaced 60 mils apart, the milling cutter cutting location is set at 30 mils from the scrap plate edge, and the milling cutter itself is 19.5 mils in diameter, then the width offset value is set at 19.5 mils, i.e., the actual first edge 402 is set at 10.5 mils from the scrap plate. Further cutting all the bridge to the waste plate, and arranging a gap area 403 at the top end of the groove corresponding to the bridge; three slit regions 403 are provided on each side of the bridgeless pocket. The slit regions 403 on each side are disposed at equal distances in particular so that the slit regions 403 on both sides are symmetrical. The gap region 403 is a semicircle having a diameter of two milling cutters, i.e., 39 mils, so the furthest distance from the scrap plate at the gap region 403 is 49.5 mils.
In other embodiments, the spacing between adjacent unit plates in the multi-piece structure may be determined according to the actual situation, and the distance between the first edge 402 and the waste plate may be set to be different distances according to the actual situation; the specific cutting tool may be other tools, and the diameter of the tool itself may be determined according to the actual situation, so that the corresponding width deviation value, and the diameter of the gap region 403 may be twice as large as the diameter of the cutting tool, and may be adjusted according to the actual situation, which is not limited herein. Further, the shape of the slit region 403 may be configured to be different according to practical situations, for example, rectangular, circular, etc., which is not limited herein.
404 in fig. 4b is a grafted daughter board; 405 is a second edge; 406 are bridges. The grafted daughter board 404 is a normal unit PCB board cut from the multiple pieces, and the cutting path is a second edge 405. The distance from the edge of the scrap plate to the location where the mill cuts is set to be 30 mils, and the diameter of the mill itself is set to be 19.5 mils, then the width deviation value is set to be 19.5 mils, i.e., the actual second edge 405 is set to be 49.5 mils from the scrap plate.
In other embodiments, the distance between the second edge 405 and the normal board may be set to be different according to the actual situation; the specific cutting tool can also be other tools, and the diameter of the tool can also be determined according to the actual situation, so that the corresponding width deviation value is consistent with the diameter of the cutting tool.
Combining the first edge 402 of the grafting mother board 401 with the second edge 405 of the grafting son board 404 after cutting, wherein the non-seamed area is completely matched without gaps; glue is injected into the gap area 403 to make the grafting mother board 401 and the grafting daughter board 404 combined more tightly.
The reflux layer multi-piece structure grafted by the seamless grafting and the positive and negative buckling modes has higher combination degree and high concealment; the reflow layer multi-piece structure after grafting can be laminated to a complete circuit board comprising a top layer and a bottom layer in the next step, the combination degree of the grafting position is further stabilized through lamination of the reflow layer circuit board after grafting, and the effect of concealment is achieved.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent principle changes made by the specification and the drawings of the present application, or direct or indirect application in other related technical fields, are included in the scope of the patent protection of the present application.
Claims (11)
1. The grafting method of the circuit board is characterized by comprising the following steps of:
obtaining a mother board to be grafted and a daughter board used as grafting;
cutting the edge positions of the daughter board and the mother board for grafting so that the outline shapes of the edges of the mother board and the daughter board for grafting are complementary; and the set edges of the daughter board and the mother board are provided with gap areas;
and buckling the edges of the daughter boards to the edges corresponding to the mother board to obtain the grafted circuit board.
2. The method of grafting a circuit board according to claim 1, wherein the circuit board is a reflow layer circuit board.
3. The grafting method of a circuit board according to claim 1, wherein the step of cutting edge positions of the daughter board and the mother board for grafting so that edge profiles of the mother board and the daughter board for grafting are complementary includes:
cutting a first edge of the mother board for grafting with the daughter board based on a set shape, and forming a groove at a set position of the first edge; and
cutting a second edge of the daughter board for grafting based on the set shape, and forming a bridge at a set position of the second edge; the shapes of the first edge and the second edge after cutting are complementary; the groove corresponds to the bridge in position;
the step of buckling the edges of the daughter boards to the edges corresponding to the mother board to obtain the grafted circuit board comprises the following steps:
grafting the corresponding complementary positions of the first edge and the second edge, and connecting the grooves corresponding to the positions with the bridge.
4. A method of grafting a circuit board according to any one of claims 1 to 3, wherein the step of cutting edge positions of the daughter board and the mother board for grafting so that edge profiles of the mother board and the daughter board for grafting are complementary includes:
determining a width deviation value of the corresponding positions of the edges of the mother board and the daughter board; the width deviation value is characterized by the diameter of the milling cutter;
and cutting the edge positions of the daughter board and the mother board for grafting according to the width deviation value, so that the outline shapes of the edges of the mother board and the daughter board for grafting are complementary.
5. The grafting method of a circuit board according to claim 4, wherein an edge width of the mother board is larger than an edge width of the daughter board, and a width deviation value of a corresponding position of the mother board and the daughter board is 1 unit of a milling cutter diameter.
6. The grafting method of a circuit board according to claim 1, wherein the obtaining a mother board to be grafted and a daughter board used as a graft includes:
responding to the number of the waste boards in the circuit board multi-piece structure not exceeding a second set number, cutting the waste boards, and taking the rest normal boards as the mother boards to be grafted;
and in response to the number of the waste boards in the circuit board multi-piece structure exceeding the second set number, cutting out the remaining normal boards in the multi-piece structure of the circuit board, and taking the cut normal boards as the sub-boards used for grafting.
7. The grafting method of the circuit board according to claim 1, wherein the daughter board is buckled to the mother board to obtain the grafted circuit board, comprising:
the daughter board is buckled on the mother board, and the mother board is completely matched with the daughter board in a non-gap area; and filling glue in the gap area to obtain the grafted circuit board.
8. The grafting circuit board is characterized by comprising a mother board and a daughter board; the edges of the daughter boards are buckled on the edges corresponding to the mother board; the edge outline shapes of the mother board and the daughter board for grafting are complementary; and a gap area is arranged at the set edge corresponding to the mother board and the daughter board.
9. The grafted circuit board of claim 8, wherein the motherboard is configured to form a groove with a set position of the first edge of the daughter board; the daughter board is used for forming a bridge at a set position of the grafted second edge; the shapes of the first edge and the second edge after cutting are complementary; the grooves correspond to the bridge in position, and the grooves corresponding to the bridge in position are connected with each other.
10. The grafted circuit board according to claim 8 or 9, wherein an edge width of the motherboard is larger than an edge width of the daughter board, and a width deviation value of a corresponding position of the motherboard and the daughter board is 1 unit of a milling cutter diameter.
11. The grafted circuit board according to any of the claims 8 to 10, wherein,
the gap area is positioned at the top end of the groove at the first edge, and symmetrical three points are arranged at two sides without the groove, and the three points are equidistant points.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310389167.0A CN116567958A (en) | 2023-04-12 | 2023-04-12 | Grafting circuit board and grafting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310389167.0A CN116567958A (en) | 2023-04-12 | 2023-04-12 | Grafting circuit board and grafting method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116567958A true CN116567958A (en) | 2023-08-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310389167.0A Pending CN116567958A (en) | 2023-04-12 | 2023-04-12 | Grafting circuit board and grafting method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116567958A (en) |
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2023
- 2023-04-12 CN CN202310389167.0A patent/CN116567958A/en active Pending
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