CN116564881A - Mounting device for processing semiconductor chip - Google Patents
Mounting device for processing semiconductor chip Download PDFInfo
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- CN116564881A CN116564881A CN202310663101.6A CN202310663101A CN116564881A CN 116564881 A CN116564881 A CN 116564881A CN 202310663101 A CN202310663101 A CN 202310663101A CN 116564881 A CN116564881 A CN 116564881A
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- fixedly connected
- semiconductor chip
- workbench
- mounting device
- upper portion
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 238000012545 processing Methods 0.000 title claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 39
- 238000004140 cleaning Methods 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 59
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000005485 electric heating Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 14
- 239000000428 dust Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 8
- 230000002457 bidirectional effect Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The application relates to the technical field of semiconductor chip production and processing, a mounting device for semiconductor chip processing is disclosed, the mounting device comprises a workbench, the upper portion fixedly connected with L type frame of workstation, the top of L type frame is provided with moving mechanism, the upper portion of workstation is provided with fixture, the left side of workstation is provided with drying mechanism, the right side of workstation is provided with wiper mechanism, fixture includes motor two, the output fixedly connected with two-way threaded rod of motor two, the equal threaded connection in the outside both sides of two-way threaded rod has screw thread piece two. Can play the effect of a centre gripping when processing through fixture to the semiconductor chip, and then play a protection effect when having guaranteed the stability of semiconductor chip in the paster in-process, can realize cleaning up the dust on semiconductor chip surface through wiper mechanism, and then avoided the condition that influences the paster effect at the paster in-process dust too much.
Description
Technical Field
The invention relates to the technical field of semiconductor chip production and processing, in particular to a mounting device for semiconductor chip processing.
Background
The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, and has wide application in radio, television and temperature measurement, for example, a diode is a device made of a semiconductor, the conductivity of the semiconductor refers to a material with controllable conductivity from the insulator to the conductor, the importance of the semiconductor is very huge from the technical or economic development point of view, and most of electronic products, such as core units in computers, mobile phones or digital recorders, are very closely related to the semiconductor.
The chip is a silicon chip containing an integrated circuit, has a small volume, is often a part of a computer or other electronic equipment, belongs to the field of semiconductors, needs to carry out chip mounting on a single chip in the packaging process, then needs a special clamp to clamp and fix the semiconductor chip in the traditional chip mounting, easily causes excessive clamping in the fixing mode, damages the semiconductor chip, and is inconvenient to clean dust on the surface of the semiconductor chip.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a mounting device for processing a semiconductor chip, which solves the problems that the fixing mode is easy to cause excessive clamping, damage is caused to the semiconductor chip, and dust on the surface of the semiconductor chip is inconvenient to clean.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the mounting device for the semiconductor chip processing comprises a workbench, wherein an L-shaped frame is fixedly connected to the upper part of the workbench, a moving mechanism is arranged at the top of the L-shaped frame, a clamping mechanism is arranged at the upper part of the workbench, a drying mechanism is arranged at the left side of the workbench, and a cleaning mechanism is arranged at the right side of the workbench;
the clamping mechanism comprises a motor II, the output end of the motor II is fixedly connected with a bidirectional threaded rod, two threads are respectively arranged on two sides of the outside of the bidirectional threaded rod in a threaded mode, the upper portion of the threaded rod II is fixedly connected with a mounting frame, one side of the mounting frame is fixedly connected with a clamping plate, one side, close to the clamping plate, of the clamping plate is fixedly connected with an anti-slip pad, the rear side of the lower portion of the clamping plate is fixedly connected with a guide block, and the guide block is slidably connected to the outside of the sliding rod.
Preferably, the moving mechanism comprises a first motor, the output end of the first motor is fixedly connected with a screw rod, and the external thread of the screw rod is connected with a first thread block.
Preferably, the drying mechanism comprises a fan, the output fixedly connected with conveyer pipe of fan, the upper end fixedly connected with heating cabinet of conveyer pipe, the interior bottom fixedly connected with filter screen of heating cabinet, the upper portion of filter screen is provided with electric heating wire, the upper portion fixedly connected with tuber pipe of heating cabinet, the upper end fixedly connected with gas collection storehouse of tuber pipe, the right side middle part fixedly connected with communicating pipe in gas collection storehouse, the right-hand member fixedly connected with aviation baffle of communicating pipe, the right side of aviation baffle is provided with evenly distributed's air outlet.
Preferably, the cleaning mechanism comprises a circulating pump, the input end fixedly connected with of circulating pump absorbs water the pipe, the output fixedly connected with outlet pipe of circulating pump, the upper end fixedly connected with of outlet pipe catchments the storehouse, the left side middle part fixedly connected with connecting pipe in water the storehouse, the left end fixedly connected with shunt tubes of connecting pipe, the left side of shunt tubes is provided with evenly distributed's delivery port.
Preferably, a collecting tank is arranged in the middle of the workbench, and a filter plate is arranged in the collecting tank.
Preferably, a placing bin is arranged in the middle of the front side of the workbench, and a water receiving tank is arranged in the placing bin.
Preferably, the second motor is fixedly connected in the placing groove, the placing groove is formed in the front side of the upper portion of the workbench, a cabinet door is arranged on the front side of the placing groove, the sliding rod is fixedly connected in the guiding groove, and the guiding groove is formed in the rear side of the upper portion of the workbench.
Preferably, the baffle is fixedly connected to two sides of the upper portion of the workbench, the left side is fixedly connected with the gas collecting bin on the right side of the baffle, the first support is fixedly connected to the upper and lower parts on the right side of the gas collecting bin, the water collecting bin is fixedly connected to the left side of the baffle on the right side, and the second support is fixedly connected to the upper and lower parts on the left side of the water collecting bin.
Preferably, the circulating pump is fixedly connected in the placing box, and the placing box is fixedly connected at the lower right side of the workbench.
Preferably, the first fixed connection of motor is in the left side middle part of L type frame, first sliding connection of screw thread piece is in the inside of spout, the spout sets up the interior top at L type frame, the lower part fixedly connected with telescopic link of screw thread piece one, the output fixedly connected with mounting panel of telescopic link, the lower part fixedly connected with paster head of mounting panel.
Working principle: when the device is used, the semiconductor chip is firstly placed on the upper part of the workbench, then the motor II is started, the motor II drives the two-way threaded rod connected with the output end to rotate, the two threaded blocks connected with the external threads are driven to move relatively while the two threaded rods rotate, the guide block connected with the clamping plate is driven to slide outside the sliding rod, then the clamping plate drives the connected anti-slip pad to move while moving, so that the semiconductor chip can have a clamping effect during processing, the stability of the semiconductor chip in the process of pasting is ensured, a protection effect is achieved, then the circulating pump is started to pump out water in the water receiving tank through the water suction pipe and convey the water to the water outlet pipe connected with the output end of the circulating pump, and the water in the water outlet pipe is conveyed to the inside of the water collecting bin, and the air is conveyed into the shunt tube through the connecting tube and then sprayed out through the water outlet, so that dust on the surface of the semiconductor chip can be cleaned, the situation that the effect of the chip is affected due to excessive dust in the chip mounting process is avoided, after cleaning, the fan is started to convey external air into the heating box through the conveying tube, then the air is heated through the electric heating wire in the heating box, the heated air is conveyed into the air collecting bin through the air outlet tube and then conveyed into the air deflector through the communicating tube and sprayed out from the air outlet, the cleaned semiconductor chip can be dried, the subsequent chip mounting work is facilitated, the screw rod connected with the output end is driven to rotate through the first motor, the screw rod is driven to move left and right while rotating the screw rod is driven to drive the first screw block connected with external threads, then the first screw thread piece moves and drives the mounting panel that the telescopic link is being connected and move about to drive the paster head and remove, thereby can adjust the paster position of semiconductor core, improved paster efficiency.
The invention provides a mounting device for processing a semiconductor chip. The beneficial effects are as follows:
1. according to the invention, the motor II is started to drive the bidirectional threaded rod connected with the output end to rotate, the bidirectional threaded rod drives the two threaded blocks connected with the external threads to move relatively while rotating, and drives the guide block connected with the clamping plate to slide outside the slide rod, and then the clamping plate drives the connected anti-slip pad to move while moving, so that a clamping effect can be achieved when the semiconductor chip is processed, and a protection effect is achieved while the stability of the semiconductor chip in the process of pasting is ensured.
2. According to the invention, the circulating pump is started, the water in the water receiving tank is pumped out by the circulating pump through the water suction pipe and is conveyed to the water outlet pipe connected with the output end of the circulating pump, the water in the water outlet pipe is conveyed to the inside of the water collecting bin and is conveyed to the shunt pipe through the connecting pipe, and then the water is sprayed out through the water outlet, so that dust on the surface of the semiconductor chip can be cleaned, and the situation that the effect of the chip is influenced due to excessive dust in the chip mounting process is avoided.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a top view of the present invention;
FIG. 3 is an internal structural view of the work table of the present invention;
FIG. 4 is a left side view of the present invention;
FIG. 5 is a schematic diagram of a drying mechanism according to the present invention;
FIG. 6 is an internal construction view of the heating cabinet of the present invention;
FIG. 7 is a schematic view of a cleaning mechanism according to the present invention;
FIG. 8 is a schematic view of a clamping mechanism according to the present invention;
fig. 9 is a schematic diagram of a moving mechanism according to the present invention.
Wherein, 1, a workbench; 2. a cabinet door; 3. an L-shaped frame; 4. a baffle; 5. a moving mechanism; 501. a first motor; 502. a screw; 503. a first thread block; 6. a chute; 7. a telescopic rod; 8. a mounting plate; 9. a patch head; 10. a clamping mechanism; 1001. a second motor; 1002. a two-way threaded rod; 1003. a second thread block; 1004. a mounting frame; 1005. a clamping plate; 1006. an anti-slip pad; 1007. a slide bar; 1008. a guide block; 11. placing a box; 12. a cleaning mechanism; 1201. a circulation pump; 1202. a water suction pipe; 1203. a water outlet pipe; 1204. a water collecting bin; 1205. a connecting pipe; 1206. a shunt; 1207. a water outlet; 13. a drying mechanism; 1301. a blower; 1302. a delivery tube; 1303. a heating box; 1304. an air outlet pipe; 1305. a gas collection bin; 1306. a communicating pipe; 1307. an air deflector; 1308. an air outlet; 1309. a filter screen; 1310. an electric heating wire; 14. a guide groove; 15. a placement groove; 16. a filter plate; 17. a collection tank; 18. placing a bin; 19. a water receiving tank; 20. a first bracket; 21. and a second bracket.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Examples:
referring to fig. 1-9, an embodiment of the invention provides a mounting device for processing semiconductor chips, which comprises a workbench 1, wherein an L-shaped frame 3 is fixedly connected to the upper part of the workbench 1, a moving mechanism 5 is arranged at the top of the L-shaped frame 3, a clamping mechanism 10 is arranged at the upper part of the workbench 1, a drying mechanism 13 is arranged at the left side of the workbench 1, and a cleaning mechanism 12 is arranged at the right side of the workbench 1;
the chip mounting position of the semiconductor chip can be adjusted through the moving mechanism 5, the chip mounting efficiency is improved, the clamping effect of the semiconductor chip during processing can be achieved through the clamping mechanism 10, the protection effect is achieved when the stability of the semiconductor chip in the chip mounting process is guaranteed, the semiconductor chip after cleaning can be dried through the drying mechanism 13, follow-up chip mounting operation is facilitated, dust on the surface of the semiconductor chip can be cleaned through the cleaning mechanism 12, and the situation that the chip mounting effect is affected due to excessive dust in the chip mounting process is avoided.
The fixture 10 includes motor two 1001, and motor two 1001's output fixedly connected with two-way threaded rod 1002, the equal threaded connection of the outside both sides of two-way threaded rod 1002 has screw thread piece two 1003, the upper portion fixedly connected with mounting bracket 1004 of screw thread piece two 1003, one side fixedly connected with splint 1005 of mounting bracket 1004, the looks side fixedly connected with slipmat 1006 that is close to of splint 1005, the lower part rear side fixedly connected with guide block 1008 of splint 1005, guide block 1008 sliding connection is in the outside of slide bar 1007.
Through starting motor two 1001, motor two 1001 drive output two-way threaded rod 1002 that is being connected rotate, two screw thread piece two 1003 relative movement that drive external screw thread connection in the time of the rotation of two-way threaded rod 1002 to drive the guide block 1008 that splint 1005 is being connected and slide in the outside of slide bar 1007, then splint 1005 drive the slipmat 1006 that is being connected in the removal and remove, thereby can play the effect of a centre gripping when processing semiconductor chip, and then play a protective effect when having guaranteed the stability of semiconductor chip in the paster process.
The moving mechanism 5 comprises a first motor 501, the output end of the first motor 501 is fixedly connected with a screw 502, and the external thread of the screw 502 is connected with a first thread block 503.
Through start motor one 501, motor one 501 drives the screw rod 502 that the output is being connected and rotates, and screw rod 502 rotates and drives outside threaded connection's screw thread piece one 503 and move about, then screw thread piece one 503 moves and drives telescopic link 7 connected mounting panel 8 and move about to drive the paster head 9 and remove, thereby can adjust the paster position of semiconductor core, improved paster efficiency.
The drying mechanism 13 comprises a fan 1301, the output end of the fan 1301 is fixedly connected with a conveying pipe 1302, the upper end of the conveying pipe 1302 is fixedly connected with a heating box 1303, the inner bottom of the heating box 1303 is fixedly connected with a filter screen 1309, the upper portion of the filter screen 1309 is provided with an electric heating wire 1310, the upper portion of the heating box 1303 is fixedly connected with an air outlet pipe 1304, the upper end of the air outlet pipe 1304 is fixedly connected with a gas collection bin 1305, the middle part of the right side of the gas collection bin 1305 is fixedly connected with a communicating pipe 1306, the right end of the communicating pipe 1306 is fixedly connected with an air deflector 1307, and the right side of the air deflector 1307 is provided with evenly distributed air outlets 1308.
Through starting fan 1301, fan 1301 carries the inside to the heating cabinet 1303 with outside air through conveyer pipe 1302, then heats through the inside electric heater strip 1310 of heating cabinet 1303, and the inside of gas collection storehouse 1305 is carried through tuber pipe 1304 to the air after the heating, and the inside of rethread communicating pipe 1306 transmission to aviation baffle 1307 to spout in from air outlet 1308, thereby can realize carrying out the processing of drying to the semiconductor chip after wasing, the follow-up paster work of being convenient for.
The cleaning mechanism 12 comprises a circulating pump 1201, wherein the input end of the circulating pump 1201 is fixedly connected with a water suction pipe 1202, the output end of the circulating pump 1201 is fixedly connected with a water outlet pipe 1203, the upper end of the water outlet pipe 1203 is fixedly connected with a water collecting bin 1204, the middle part of the left side of the water collecting bin 1204 is fixedly connected with a connecting pipe 1205, the left end of the connecting pipe 1205 is fixedly connected with a split pipe 1206, and the left side of the split pipe 1206 is provided with evenly distributed water outlets 1207.
By starting the circulating pump 1201, the circulating pump 1201 pumps out water in the water receiving tank 19 through the water suction pipe 1202 and conveys the water to the water outlet pipe 1203 connected with the output end of the circulating pump 1201, and the water in the water outlet pipe 1203 is conveyed to the inside of the water collecting bin 1204 and conveyed to the shunt pipe 1206 through the connecting pipe 1205 and then sprayed out through the water outlet 1207, so that dust on the surface of a semiconductor chip can be cleaned, and the situation that the effect of the chip is affected due to excessive dust in the chip mounting process is avoided.
The middle part of workstation 1 is provided with collecting vat 17, and the inside of collecting vat 17 is provided with filter 16.
By arranging the collecting tank 17 in the middle of the workbench 1 and then installing the filter plate 16 in the collecting tank 17, the cleaned water can be effectively collected.
The middle part of the front side of the workbench 1 is provided with a placing bin 18, and the inside of the placing bin 18 is provided with a water receiving tank 19.
Through placing the water receiving tank 19 in the inside of placing the storehouse 18, can collect the water after the use to the waste of water resource.
The motor two 1001 fixed connection is in the inside of standing groove 15, and the standing groove 15 sets up the upper portion front side at workstation 1, and the front side of standing groove 15 is provided with cabinet door 2, and slide bar 1007 fixed connection is in the inside of guide way 14, and guide way 14 sets up the upper portion rear side at workstation 1.
When the motor two 1001 is fixed inside the placement groove 15, the stability of the motor two 1001 at the time of operation can be improved, and when the slide bar 1007 is fixed inside the guide groove 14, the stability of the slide bar 1007 at the time of use can be improved.
The upper portion both sides of workstation 1 all fixedly connected with baffle 4, the right side fixedly connected with gas collection storehouse 1305 of left side baffle 4, the equal fixedly connected with support one 20 in lower part on the right side of gas collection storehouse 1305, the left side fixedly connected with water collection storehouse 1204 of right side baffle 4, the equal fixedly connected with support two 21 in lower part on the left side of water collection storehouse 1204.
By fixing the sump 1305 to the baffle 4, the stability of the sump 1305 in operation can be improved, and then the sump 1204 can be fixed to the right baffle 4 to improve the stability of the sump 1204 in use.
The circulation pump 1201 is fixedly connected to the inside of the placement tank 11, and the placement tank 11 is fixedly connected to the right lower portion of the table 1.
By fixing the circulation pump 1201 inside the placement tank 11, the circulation pump 1201 can be protected.
The first motor 501 is fixedly connected to the middle of the left side of the L-shaped frame 3, the first thread block 503 is slidably connected to the inside of the sliding groove 6, the sliding groove 6 is arranged at the inner top of the L-shaped frame 3, the lower portion of the first thread block 503 is fixedly connected with the telescopic rod 7, the output end of the telescopic rod 7 is fixedly connected with the mounting plate 8, and the lower portion of the mounting plate 8 is fixedly connected with the patch head 9.
By fixing the first motor 501 at the middle part of the left side of the L-shaped frame 3, the stability of the first motor 501 during operation can be improved; when the first thread block 503 slides in the chute 6, the first thread block 503 can perform the limiting and guiding functions; when the first thread block 503 moves, the mounting plate 8 connected with the telescopic rod 7 is driven to move simultaneously, and the chip mounting head 9 is moved, so that the chip mounting position of the semiconductor chip can be adjusted, and the chip mounting efficiency is improved.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The mounting device for the semiconductor chip processing comprises a workbench (1), and is characterized in that an L-shaped frame (3) is fixedly connected to the upper portion of the workbench (1), a moving mechanism (5) is arranged at the top of the L-shaped frame (3), a clamping mechanism (10) is arranged on the upper portion of the workbench (1), a drying mechanism (13) is arranged on the left side of the workbench (1), and a cleaning mechanism (12) is arranged on the right side of the workbench (1);
clamping mechanism (10) are including motor two (1001), the output fixedly connected with two-way threaded rod (1002) of motor two (1001), the equal threaded connection in outside both sides of two-way threaded rod (1002) has screw thread piece two (1003), the upper portion fixedly connected with mounting bracket (1004) of screw thread piece two (1003), one side fixedly connected with splint (1005) of mounting bracket (1004), be close to one side fixedly connected with slipmat (1006) mutually of splint (1005), lower part rear side fixedly connected with guide block (1008) of splint (1005), guide block (1008) sliding connection is in the outside of slide bar (1007).
2. The mounting device for semiconductor chip processing according to claim 1, wherein the moving mechanism (5) comprises a first motor (501), an output end of the first motor (501) is fixedly connected with a screw (502), and an external thread of the screw (502) is connected with a first thread block (503).
3. The mounting device for semiconductor chip processing according to claim 1, wherein the drying mechanism (13) comprises a fan (1301), an output end of the fan (1301) is fixedly connected with a conveying pipe (1302), an upper end of the conveying pipe (1302) is fixedly connected with a heating box (1303), an inner bottom of the heating box (1303) is fixedly connected with a filter screen (1309), an electric heating wire (1310) is arranged on the upper portion of the filter screen (1309), an air outlet pipe (1304) is fixedly connected with the upper portion of the heating box (1303), an air collecting bin (1305) is fixedly connected with a communicating pipe (1306) at the middle part of the right side of the air collecting bin (1305), an air outlet (1308) uniformly distributed on the right side of the air guiding plate (1307) is fixedly connected with an air guiding plate (1307).
4. The mounting device for semiconductor chip processing according to claim 1, wherein the cleaning mechanism (12) comprises a circulating pump (1201), an input end of the circulating pump (1201) is fixedly connected with a water suction pipe (1202), an output end of the circulating pump (1201) is fixedly connected with a water outlet pipe (1203), an upper end of the water outlet pipe (1203) is fixedly connected with a water collecting bin (1204), a connecting pipe (1205) is fixedly connected with a middle part of the left side of the water collecting bin (1204), a shunt pipe (1206) is fixedly connected with the left end of the connecting pipe (1205), and evenly distributed water outlets (1207) are arranged on the left side of the shunt pipe (1206).
5. The mounting device for semiconductor chip processing according to claim 1, wherein a collecting tank (17) is provided in the middle of the table (1), and a filter plate (16) is provided in the collecting tank (17).
6. The mounting device for semiconductor chip processing according to claim 1, wherein a placement bin (18) is provided in the middle of the front side of the table (1), and a water receiving tank (19) is provided in the placement bin (18).
7. The mounting device for semiconductor chip processing according to claim 1, wherein the motor two (1001) is fixedly connected inside a placing groove (15), the placing groove (15) is arranged on the front side of the upper portion of the workbench (1), a cabinet door (2) is arranged on the front side of the placing groove (15), the sliding rod (1007) is fixedly connected inside a guide groove (14), and the guide groove (14) is arranged on the rear side of the upper portion of the workbench (1).
8. The mounting device for semiconductor chip processing according to claim 1, wherein two sides of an upper portion of the workbench (1) are fixedly connected with a baffle plate (4), a right side of the baffle plate (4) is fixedly connected with a gas collecting bin (1305), an upper right and a lower right side of the gas collecting bin (1305) are fixedly connected with a first bracket (20), a left side of the baffle plate (4) is fixedly connected with a water collecting bin (1204), and an upper left and a lower left side of the water collecting bin (1204) are fixedly connected with a second bracket (21).
9. The mounting apparatus for semiconductor chip processing according to claim 4, wherein the circulation pump (1201) is fixedly connected to the inside of the placement box (11), and the placement box (11) is fixedly connected to the lower right side of the table (1).
10. The mounting device for semiconductor chip processing according to claim 2, wherein the first motor (501) is fixedly connected to the middle part of the left side of the L-shaped frame (3), the first threaded block (503) is slidably connected to the inside of the sliding groove (6), the sliding groove (6) is arranged at the inner top of the L-shaped frame (3), the lower part of the first threaded block (503) is fixedly connected with a telescopic rod (7), the output end of the telescopic rod (7) is fixedly connected with a mounting plate (8), and the lower part of the mounting plate (8) is fixedly connected with a patch head (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310663101.6A CN116564881A (en) | 2023-06-06 | 2023-06-06 | Mounting device for processing semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310663101.6A CN116564881A (en) | 2023-06-06 | 2023-06-06 | Mounting device for processing semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116564881A true CN116564881A (en) | 2023-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310663101.6A Pending CN116564881A (en) | 2023-06-06 | 2023-06-06 | Mounting device for processing semiconductor chip |
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| Country | Link |
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| CN (1) | CN116564881A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117012699A (en) * | 2023-09-26 | 2023-11-07 | 深圳市曜通科技有限公司 | Automatic clamping device for semiconductor parts |
-
2023
- 2023-06-06 CN CN202310663101.6A patent/CN116564881A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117012699A (en) * | 2023-09-26 | 2023-11-07 | 深圳市曜通科技有限公司 | Automatic clamping device for semiconductor parts |
| CN117012699B (en) * | 2023-09-26 | 2024-01-12 | 深圳市曜通科技有限公司 | Automatic clamping device for semiconductor parts |
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