CN116559292A - Preparation method of collinear ultrasonic sensor array based on 3D printing model - Google Patents

Preparation method of collinear ultrasonic sensor array based on 3D printing model Download PDF

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Publication number
CN116559292A
CN116559292A CN202310520535.0A CN202310520535A CN116559292A CN 116559292 A CN116559292 A CN 116559292A CN 202310520535 A CN202310520535 A CN 202310520535A CN 116559292 A CN116559292 A CN 116559292A
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China
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array
piezoelectric
array elements
printing
electrodes
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CN202310520535.0A
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宋寿鹏
丛上清
张云鹏
苗永红
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Jiangsu University
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Jiangsu University
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G01N29/341—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with time characteristics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G01N29/348—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with frequency characteristics, e.g. single frequency signals, chirp signals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Abstract

The invention discloses a preparation method of a collinear ultrasonic sensor array based on a 3D printing model, and belongs to the field of ultrasonic sensor preparation. The invention comprises the following steps: the processing method of the piezoelectric ceramic array, the manufacturing and connecting modes of the signal leads, the 3D printing of the acoustic attenuation material mould, the filling of the piezoelectric ceramic array elements, the 3D printing and the packaging method of the packaging shell. Cutting a piezoelectric ceramic sheet into a plurality of square array elements, and respectively filling the square array elements into a 3D printed acoustic attenuation material mold capable of reducing sound field interference among the array elements; the silver plating electrode comprises a lower electrode and an upper electrode, and the upper and lower parts of the piezoelectric array are sputtered respectively by a magnetron sputtering technology method to form collinear electrodes; the backing material is made of non-conductive material; the matching layer is paved above the piezoelectric array and used for acoustic impedance matching; the wiring port is used for being connected with the signal lead, and the sensor packaging shell is prepared by 3D printing. The invention simplifies the preparation of the traditional large-scale ultrasonic sensor array and reduces the number of array element wires.

Description

Preparation method of collinear ultrasonic sensor array based on 3D printing model
Technical Field
The invention relates to an ultrasonic sensor preparation technology, in particular to a preparation method of a collinear ultrasonic sensor array based on a 3D printing model.
Background
The ultrasonic detection has the advantages of large detection depth, wide range, good directivity, accurate defect positioning, convenient application, low development cost, fast detection speed, convenient field analysis, safe use, no harm to human body and the like. Therefore, the ultrasonic detection method has wide application in various fields such as industrial manufacture, medicine, national defense and the like.
The ultrasonic sensor array is an array structure formed by a plurality of array elements, the array element geometric structures and geometric parameters can be adjusted according to actual demands, and the array structure with different scales is designed. The traditional ultrasonic sensor array adopts a relatively fixed excitation mode, and adopts an integral synchronous excitation mode and a delay excitation mode during excitation, which is unfavorable for adjusting the transmitting aperture, and each array element adopts an independent lead structure, so that the sensor has a complex structure and increases the cost.
Disclosure of Invention
The invention aims to prepare a sensor array, and the excitation and the reception of array elements in different areas in the array can be realized by adopting a line-column collinear structure, such as matching with an addressing excitation technology, so that the detection flexibility is further improved, and the quantization precision of the detection is further improved.
The technical scheme adopted by the invention is as follows: a method of preparing a co-linear ultrasonic sensor array based on a 3D printing model, the sensor comprising: a piezoelectric array 101 made of PZT piezoelectric ceramic material mechanically cut to transmit and receive ultrasonic waves; the matching layer 102 is paved above the piezoelectric array and is used for matching acoustic impedance between the piezoelectric array element and the measured material; backing material 103, which is a non-conductive material, is disposed below the piezoelectric array to absorb ultrasonic waves emitted from the array element in the back direction; the acoustic attenuation material mold 104 is formed by adopting a 3D printing technology, is used for filling the cut array elements, and has the effect of reducing the crosstalk among the piezoelectric array elements; the electrodes are divided into an upper electrode and a lower electrode which are both made of silver materials, the lower electrode 105 is sputtered below the piezoelectric array, and the upper electrode 106 is sputtered above the piezoelectric array to realize electrical connection among array elements; the first lead wire 107 and the second lead wire 108 are copper core signal wires with shielding layers for connection with an ultrasonic sensor excitation circuit; the package housing 109 is prepared using 3D printing techniques to encapsulate the sensor.
The method comprises the following steps:
step 1, selecting a square piezoelectric ceramic plate made of a PZT material, pre-polarizing the piezoelectric ceramic plate, and paving a silver electrode layer;
and 2, cutting the piezoelectric ceramic sheet into a plurality of array elements with the same structure by adopting a mechanical cutting technology according to the PZT piezoelectric ceramic sheet in the step 1, wherein the structure and the geometric parameters of the array elements are determined by design. In the embodiment of the invention, square array elements are adopted, and the array elements in the array have the same row and column number and are N to form N 2 An array of array elements;
step 3, preparing the array element with N by adopting a 3D printing technology according to the cut array element structure and the geometric parameters in the step 2 2 The height of the die is equal to the array height, the holes are arranged in a square structure, the size of the die is equal to that of the independent piezoelectric array elements, and the distance between the holes can be selected according to actual needs;
step 4, placing the cut array elements in the step 2 into a sound attenuation material mold according to the 3D printing and forming mold in the step 3, and bonding the array elements by using glue to ensure that the positions of the array elements in the 3D mold are fixed;
and 5, sputtering silver electrodes above the array by using a magnetron sputtering technology according to the piezoelectric array in the step 4 to form an upper electrode layer, and sputtering silver electrodes below the array to form a lower electrode layer. The upper electrode layer and the lower electrode layer are characterized in that the upper electrode layer and the lower electrode layer are paved on the surface of a 3D printing forming die part for installing array elements, and the integral electrode layers on the upper surface and the lower surface are respectively formed;
step 6, cutting the upper electrode layer into N rows with equal intervals according to the sputtered upper and lower surface electrode layer structure in the step 5 to form an upper electrode, wherein the cutting groove width is equal to the hole spacing of the 3D printing die in the step 3; and (3) cutting the lower electrode layer into N rows with equal intervals to form lower electrodes, wherein the width of the cutting groove is equal to the hole interval of the 3D printing die in the step (3). The array elements in the array form collinear electrodes on the upper surface electrode, collinear electrodes on the lower surface electrode, and the depth of the groove is equal to the thickness of the silver electrode layer;
step 7, preparing a backing material according to the piezoelectric array of the cut electrode in the step 6, wherein the backing material is a non-conductive material, and the size of the backing material can be determined according to the size of the array;
step 8, adhering the piezoelectric array to the backing material by using non-conductive adhesive according to the backing material in step 7;
step 9, preparing a matching layer according to the piezoelectric array of the adhesive backing material in the step 8, wherein the matching layer material can be a conventional ultrasonic sensor matching layer material;
step 10, welding electrode leads, which are 2N copper wires with shielding layers, according to the piezoelectric array in the step 9, so as to realize electrical signal connection of the sensor;
step 11, printing a sensor shell by adopting a 3D printing technology according to the piezoelectric array connected with the electrode leads in the step 10, and placing the piezoelectric array into the shell;
step 12, filling the gaps with sound attenuation materials according to the piezoelectric array placed in the shell in the step 11, so as to reduce mutual interference of piezoelectric array elements;
and 13, covering a top cover of the shell according to the sensor in the step 12, and finishing the preparation.
The beneficial effects of the invention are as follows:
the traditional ultrasonic sensor array adopts a relatively fixed excitation mode, and adopts an integral synchronous excitation mode and a delay excitation mode during excitation, which is unfavorable for adjusting the transmitting aperture, and each array element adopts an independent lead structure, so that the sensor has a complex structure and increases the cost. The sensor array provided by the invention adopts the 3D printing model as the carrier of the array elements, the number of the array elements can be adjusted according to actual needs, the upper and lower surfaces of the sensor array are provided with the collinear row and column electrodes, so that the addressing excitation is convenient, meanwhile, the adjustment of the transmitting aperture and the receiving aperture is easy to realize by matching with different excitation rules, the number of the array element leads is greatly reduced, the anti-interference capacity of the array elements is improved, and a beneficial reference can be provided for the development of the follow-up intelligent ultrasonic sensor.
Drawings
FIG. 1 is a schematic diagram of the front structure of an ultrasonic array sensor according to an embodiment of the present invention;
FIG. 2 is a schematic front cross-sectional view of an ultrasound array sensor in an embodiment of the invention;
FIG. 3 is a schematic diagram of a right side cross-sectional view of an ultrasound array sensor in an embodiment of the invention;
FIG. 4 is a flow chart of a method of manufacturing an ultrasonic array sensor in an embodiment of the invention;
fig. 5 is a schematic process flow diagram of a method for manufacturing an ultrasonic array sensor according to an embodiment of the invention. Fig. 5 (a) is a schematic view of a piezoelectric ceramic wafer to be processed, fig. 5 (b) is a schematic view of a piezoelectric array after mechanical cutting, fig. 5 (c) is a schematic view of a 3D printed acoustic attenuation material mold, fig. 5 (D) is a schematic view of placing the piezoelectric array in the 3D printed acoustic attenuation material mold, fig. 5 (e) is a schematic view of a sputtered lower electrode, fig. 5 (f) is a schematic view of a sputtered upper electrode, fig. 5 (g) is a schematic view of sputtered upper and lower electrodes, fig. 5 (h) is a schematic view of an adhesive backing material, fig. 5 (i) is a schematic view of an adhesive matching layer, fig. 5 (j) is a schematic view of a connection electrode lead, and fig. 5 (k) is a schematic view of a fully assembled sensor.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be further described with reference to the accompanying drawings and examples. The invention takes a two-dimensional area array with the array of 32 multiplied by 32 and the working frequency of the sensor of 1MHz as an example to specifically describe the processing technology of the ultrasonic array sensor probe, and the size and the gap of the array element can be specifically selected according to the needs. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The specific steps for implementing the invention are as follows:
a co-linear ultrasonic sensor array based on a 3D printing model, the structure of which is shown in fig. 1. Fig. 2 and 3 are divided into transverse and longitudinal sectional views of fig. 1, and can show the internal structure of the sensor array and the connection manner of the leads. Comprises a piezoelectric array 101, a matching layer 102, a backing material 103, a die 104 of acoustic attenuation material, a lower electrode 105, an upper electrode 106, a first lead 107, a second lead 108 and a package housing 109.
The preparation process flow chart is shown in fig. 4, and fig. 5 is a schematic diagram of structural change of the sensor array after each process step. The method specifically comprises the following steps:
step 1, selecting a square piezoelectric ceramic plate made of a PZT material, wherein the piezoelectric ceramic plate is polarized and paved with a silver electrode layer, and the side length is 79.5mm and the thickness is 2mm;
step 2, cutting the piezoelectric ceramic plate into 1024 independent piezoelectric array elements by adopting a high-precision mechanical cutting technology by taking a 32×32 array as an example according to the PZT piezoelectric ceramic plate in the step 1;
step 3, preparing an acoustic attenuation material die with 1024 holes in the middle by adopting a 3D printing technology according to the cut array elements in the step 2, wherein the height of the die is 2mm, the side length of each hole is 2mm, and the depth is 2mm;
step 4, placing the cut array elements in the step 2 into an acoustic attenuation material mold according to the 3D printing and forming mold in the step 3;
step 5, sputtering silver electrodes above the array as an upper electrode layer, sputtering silver electrodes below the array in a direction perpendicular to the upper sputtering direction as a lower electrode layer by using a magnetron sputtering technology according to the piezoelectric array in the step 4, wherein the thickness of the silver electrodes is 100 mu m;
step 6, cutting the upper electrode into 32 rows with equal spacing according to the array of sputtered electrodes in the step 5, cutting the lower electrode into 32 columns with equal spacing, wherein the width of the cutting groove is 0.5mm, and the width of each row or each column is equal to the side length of a single piezoelectric array element;
step 7, preparing a backing material according to the piezoelectric array of the cut electrode in the step 6, wherein the backing material is a non-conductive material, the side length is 79.5mm, and the thickness is 10mm;
step 8, adhering the piezoelectric array to the backing material by using non-conductive adhesive according to the backing material in step 7;
step 9, preparing a matching layer according to the piezoelectric array of the adhesive backing material in step 8, wherein the matching layer can be the same as that of a common ultrasonic array sensor;
step 10, welding electrode leads, namely 64 copper wires with shielding layers, according to the piezoelectric array in the step 9, so as to realize connection of a sensor probe and an excitation circuit;
step 11, printing a sensor shell by adopting a 3D printing technology according to the piezoelectric array connected with the electrode leads in the step 10, and placing the piezoelectric array into the shell;
step 12, filling the gaps with sound attenuation materials according to the piezoelectric array placed in the shell in the step 11, so as to reduce mutual interference of piezoelectric array elements;
and 13, covering a top cover of the shell according to the sensor probe in the step 12, and finishing preparation.
The piezoelectric ceramic plate in the step 1 can be replaced by PZT-5H material; the size of the piezoelectric ceramic plate is determined according to the requirement.
And 2, adopting a mechanical cutting technology, wherein the size and the shape of the piezoelectric array elements after cutting are consistent.
In the step 3, a 3D printing technology is adopted to prepare an integral acoustic attenuation material mould, and no bubbles need to be ensured in the acoustic attenuation material so that the service performance of the acoustic attenuation material is not affected.
In step 3, a 3D printing technology is adopted to prepare an integral acoustic attenuation material mould with N 2 And each hole has the same size as the independent piezoelectric array element.
And 4, when the piezoelectric ceramic plate is placed in the acoustic attenuation material die, the flatness of the piezoelectric array element is ensured.
The electrode sputtered in the step 5 is not too thick, and the direction of the upper electrode and the direction of the lower electrode are mutually perpendicular, so that the lower electrode is connected with each row of piezoelectric array elements, and the upper electrode is connected with each row of piezoelectric array elements.
When the sputtered electrode is cut in the step 6, the width of the cutting groove is equal to the interval of each row or each column of piezoelectric array elements, and the acoustic attenuation material printed in the step 3 in a 3D mode cannot be cut;
the backing material in the step 7 is a non-conductive material and can absorb ultrasonic waves emitted downwards by the piezoelectric array elements;
the matching layer material in step 9 may be the same as the matching layer of a commonly used ultrasonic array sensor;
the electrode leads welded in step 10 were 2N in total.
In summary, the technical scheme of the invention comprises a processing method of a piezoelectric ceramic array, a manufacturing and connecting mode of signal leads, 3D printing of an acoustic attenuation material die, filling of piezoelectric ceramic array elements, 3D printing and packaging of a packaging shell. The piezoelectric ceramic plates are cut into a plurality of square array elements, and the square array elements are respectively filled in a 3D printed attenuation material die, and the acoustic attenuation material die has the effect of reducing the acoustic field interference among the array elements. The silver-plated electrode comprises a lower electrode and an upper electrode, and the upper and lower parts of the piezoelectric array are sputtered respectively by a magnetron sputtering technology method to form collinear electrodes for realizing the electrical connection of the piezoelectric array elements in different areas. The backing material is made of non-conductive material, and can absorb the back emitted sound wave of the piezoelectric array, so that the reflection interference of the sound wave is reduced. The matching layer is laid on the piezoelectric array for acoustic impedance matching. The wiring port is used for being connected with a signal lead. The sensor packaging shell is prepared by 3D printing and is used for packaging the sensor. The invention simplifies the preparation method of the traditional large-scale ultrasonic sensor array, and the collinear structure reduces the number of the array element wires. The sensor array in the invention can be manufactured into array structures with different scales according to the needs, and the collinear structure enables the excitation of array elements in the array and the receiving mode of signals to be more flexible, so that the number of signal leads can be effectively reduced, and the sound field mutual interference among the array elements is reduced. The PZT piezoelectric material is adopted, the requirement of transmitting acoustic energy in industrial detection can be met, the sensor array can be used for traditional phased array detection, and can also be used for dividing the functions of array element areas, so that signal excitation is more flexible, and the application range of the ultrasonic sensor is further widened.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.

Claims (9)

1. A co-linear ultrasonic sensor based on a 3D printing model, comprising:
a piezoelectric array (101) which is formed by mechanically cutting a PZT piezoelectric ceramic material into a piezoelectric ceramic sheet for transmitting and receiving ultrasonic waves;
the matching layer (102) is paved above the piezoelectric array and is used for matching acoustic impedance between the piezoelectric array and the measured material;
a backing material (103) which is a non-conductive material and is arranged below the piezoelectric array for absorbing ultrasonic waves emitted by the array elements in the back direction;
the acoustic attenuation material die (104) is formed by adopting a 3D printing technology and is used for filling the cut piezoelectric array elements and has the effect of reducing crosstalk among the piezoelectric array elements;
the electrodes are divided into an upper electrode and a lower electrode which are both made of silver materials, the lower electrode (105) is sputtered below the piezoelectric array, and the upper electrode (106) is sputtered above the piezoelectric array to realize electrical connection among array elements;
the first lead (107) and the second lead (108) are copper core signal wires and are provided with shielding layers for being connected with an ultrasonic sensor excitation circuit;
and the packaging shell (109) is prepared by adopting a 3D printing technology and is used for packaging the sensor.
2. The preparation method of the collinear ultrasonic sensor array based on the 3D printing model is characterized by comprising the following steps of:
step 1, selecting a square piezoelectric ceramic plate made of a PZT material, pre-polarizing the piezoelectric ceramic plate, and paving a silver electrode layer;
step 2, cutting the piezoelectric ceramic sheet into a plurality of array elements with the same structure by adopting a mechanical cutting technology according to the PZT piezoelectric ceramic sheet in the step 1, wherein the structure and the geometric parameters of the array elements are determined by design; when square array elements are adopted, the array elements in the array have the same row and column numbers and are N to form N 2 A planar array formed by array elements;
step 3, preparing the array element with N by adopting a 3D printing technology according to the cut array element structure and the geometric parameters in the step 2 2 The height of the die is equal to the array height, the holes are arranged in a square structure, the size of the die is equal to that of the independent piezoelectric array elements, and the spacing of the holes is selected according to actual needs;
step 4, placing the cut array elements in the step 2 into a sound attenuation material mold according to the 3D printing and forming mold in the step 3, and bonding the array elements by using glue to ensure that the positions of the array elements in the 3D mold are fixed;
step 5, sputtering silver electrodes above the array by using a magnetron sputtering technology according to the piezoelectric array in the step 4 to form an upper electrode layer, sputtering silver electrodes below the array to form a lower electrode layer, and respectively paving the upper electrode layer and the lower electrode layer on the upper surface and the lower surface of the 3D printing forming die part provided with the array element to respectively form an integral electrode layer on the upper surface and the lower surface;
step 6, cutting the upper electrode layer into N rows with equal intervals according to the whole electrode layers on the upper surface and the lower surface in the step 5 to form upper electrodes, wherein the cutting groove width is equal to the hole spacing of the 3D printing die in the step 3; cutting the lower electrode layer into N rows with equal spacing to form lower electrodes, wherein the width of a cutting groove is equal to the hole spacing of the 3D printing die in the step 3, array elements in the array form collinear row electrodes on the upper surface electrodes, collinear column electrodes are formed on the lower surface electrodes, and the depth of the cutting groove is equal to the thickness of the silver electrode layer;
step 7, preparing a backing material according to the piezoelectric array of the cut electrode in the step 6, wherein the backing material is a non-conductive material and can absorb ultrasonic waves emitted downwards by the piezoelectric array element, and the size of the backing material can be determined according to the size of the array;
step 8, adhering the piezoelectric array to the backing material by using non-conductive adhesive according to the backing material in step 7;
step 9, preparing a matching layer according to the piezoelectric array of the adhesive backing material in the step 8, wherein the matching layer is made of a conventional ultrasonic sensor matching layer material, and the matching layer material is the same as that of a common ultrasonic array sensor;
step 10, welding electrode leads according to the piezoelectric array in the step 9, wherein the total number of the electrode leads is 2N, and the electrode leads are copper wires with shielding layers and are used for realizing electric signal connection of the sensor;
step 11, printing a sensor shell by adopting a 3D printing technology according to the piezoelectric array connected with the electrode leads in the step 10, and placing the piezoelectric array into the shell;
step 12, filling the gaps with sound attenuation materials according to the piezoelectric array placed in the shell in the step 11, so as to reduce mutual interference of piezoelectric array elements;
and 13, covering a top cover of the shell according to the sensor in the step 12, and finishing the preparation.
3. The method of claim 2, wherein the piezoelectric ceramic sheet in step 1 is replaceable with PZT-5H material; the size of the piezoelectric ceramic plate is determined according to the requirement.
4. The method of claim 2, wherein the mechanical cutting technique used in step 2 is used to form piezoelectric array elements of uniform size and shape.
5. The method of claim 2, wherein the 3D printing technique is used to produce the integral mold of the sound attenuating material in step 3, wherein no bubbles are present in the sound attenuating material to avoid affecting the performance of the sound attenuating material.
6. The method of claim 2, wherein in step 3, a 3D printing technique is used to produce a monolithic mold of sound attenuating material with N 2 And each hole has the same size as the independent piezoelectric array element.
7. The method of claim 2, wherein the piezoelectric ceramic sheet is placed in the acoustic attenuation material mold in step 4 to ensure the flatness of the piezoelectric array element.
8. The method of claim 2, wherein the sputtered electrodes in step 5 are not too thick, and the sputtered upper electrodes and lower electrodes are oriented perpendicular to each other such that the lower electrodes are connected to each column of piezoelectric array elements and the upper electrodes are connected to each row of piezoelectric array elements.
9. A method according to claim 2, wherein the kerf width is equal to the spacing of each row or column of piezoelectric array elements and the 3D printed sound attenuating material of step 3 cannot be diced when dicing the sputtered electrodes in step 6.
CN202310520535.0A 2023-05-10 2023-05-10 Preparation method of collinear ultrasonic sensor array based on 3D printing model Pending CN116559292A (en)

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Application Number Priority Date Filing Date Title
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CN116559292A true CN116559292A (en) 2023-08-08

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