CN116553063A - Adjustable conveying clamping structure and semiconductor conveying equipment - Google Patents

Adjustable conveying clamping structure and semiconductor conveying equipment Download PDF

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Publication number
CN116553063A
CN116553063A CN202310440503.XA CN202310440503A CN116553063A CN 116553063 A CN116553063 A CN 116553063A CN 202310440503 A CN202310440503 A CN 202310440503A CN 116553063 A CN116553063 A CN 116553063A
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CN
China
Prior art keywords
roller
driving
frame body
shaft roller
adjustable
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Granted
Application number
CN202310440503.XA
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Chinese (zh)
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CN116553063B (en
Inventor
安礼余
王定国
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Yuhongyan Technology Suzhou Co ltd
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Yuhongyan Technology Suzhou Co ltd
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Priority to CN202310440503.XA priority Critical patent/CN116553063B/en
Publication of CN116553063A publication Critical patent/CN116553063A/en
Application granted granted Critical
Publication of CN116553063B publication Critical patent/CN116553063B/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G13/00—Roller-ways
    • B65G13/02—Roller-ways having driven rollers
    • B65G13/06—Roller driving means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G13/00—Roller-ways
    • B65G13/11—Roller frames
    • B65G13/12—Roller frames adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G15/00—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
    • B65G15/30—Belts or like endless load-carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The application provides an adjustable conveying clamping structure and semiconductor conveying equipment, belongs to the technical field of semiconductor conveying. The adjustable transport clamping structure includes a frame portion, a roller clamping portion, and a drive portion. The frame body part comprises a lower frame body, an upper frame body and a lifting adjusting cylinder, wherein the lifting adjusting cylinder is arranged at the upper end part of the lower frame body, and the upper frame body is connected with the lifting end of the lifting adjusting cylinder. According to the semiconductor chip conveying device, the supporting shaft roller, the pressing shaft roller, the first driver and the second driver are matched, the semiconductor chip is conveyed in the clamped state, the semiconductor chip is enabled to be more stable when conveyed, the lifting adjusting cylinder is regulated and controlled to enable the upper frame body and the pressing shaft roller to lift, the distance between the pressing shaft roller and the supporting shaft roller can be changed, and accordingly the pressing shaft roller and the supporting shaft roller are matched to convey semiconductor chips with different thicknesses, and the application range is greatly improved.

Description

Adjustable conveying clamping structure and semiconductor conveying equipment
Technical Field
The application relates to the field of semiconductor conveying, in particular to an adjustable conveying clamping structure and semiconductor conveying equipment.
Background
Generally, a semiconductor chip is a semiconductor device that is manufactured by etching and wiring a semiconductor sheet and can realize a specific function. The manufacturing process of the semiconductor chip comprises a plurality of working procedures, and a conveying device is arranged between two adjacent working procedures and is used for conveying the semiconductor chip from the previous processing station to the next processing station.
The opposite roller type conveying device extrudes and conveys the semiconductor chips by two rotating roller shafts, so that the stability of conveying the semiconductor chips can be improved, but the distance between the two roller shafts is inconvenient to adjust, the semiconductor chips are various in variety and different in thickness, and the inconvenient conveying device is inconvenient to adjust and is poor in universality.
Disclosure of Invention
In order to overcome the defects, the application provides an adjustable conveying clamping structure and semiconductor conveying equipment, and aims to solve the problem that the conveying equipment is poor in universality.
In a first aspect, embodiments of the present application provide an adjustable transport clamping structure including a frame portion, a roller clamping portion, and a drive portion. The frame body part comprises a lower frame body, an upper frame body and a lifting adjusting cylinder, wherein the lifting adjusting cylinder is arranged at the upper end part of the lower frame body, and the upper frame body is connected with the lifting end of the lifting adjusting cylinder; the roller type clamping part comprises a supporting shaft roller and a pressing shaft roller, the supporting shaft roller is rotationally connected with the lower frame body, and the pressing shaft roller is rotationally connected with the upper frame body; the driving part comprises a first driving machine and a second driving machine, the driving end of the first driving machine is in transmission connection with the supporting shaft roller, and the driving end of the second driving machine is in transmission connection with the pressing shaft roller.
In the implementation process, after the semiconductor chip enters the upper part of the supporting shaft roller, the pressing shaft roller can be pressed on the surface of the semiconductor chip, so that the semiconductor chip is clamped, the supporting shaft roller is driven to rotate by the first driver, the pressing shaft roller is driven to rotate by the second driver, the pressing shaft roller rotates along the direction opposite to the direction of the supporting shaft roller, the pressing shaft roller and the supporting shaft roller can convey the semiconductor chip in the clamped state, the semiconductor chip conveying is more stable, the lifting adjusting cylinder is regulated and controlled, the lifting adjusting cylinder can lift the upper frame body and the pressing shaft roller when the lifting adjusting cylinder stretches and stretches, the distance between the pressing shaft roller and the supporting shaft roller can be changed, and therefore the pressing shaft roller and the supporting shaft roller are matched to convey semiconductor chips with different thicknesses, and the application range is greatly improved.
In a specific embodiment, the lower frame body and the upper frame body are rod pieces with rectangular cross sections, and the lifting adjusting cylinders are arranged in a pair of opposite directions.
In the implementation process, the lifting adjusting cylinder is any one of an air cylinder, an electric cylinder and a hydraulic cylinder, and is provided with a plurality of lifting adjusting cylinders, so that the upper frame body can be better supported, and the lifting adjusting cylinders synchronously stretch.
In a specific embodiment, the support shaft roller and the compression shaft roller have the same specification, and the support shaft roller and the compression shaft roller are arranged in a one-to-one correspondence.
In the implementation process, the specifications are the same, and the universality between the supporting shaft roller and the pressing shaft roller is improved.
In a specific embodiment, the supporting shaft rollers and the compacting shaft rollers are respectively arranged at least two at intervals along the length direction of the lower frame body, and the supporting shaft rollers and the compacting shaft rollers are respectively connected through belt pulleys and friction belts in a transmission manner.
In the implementation process, a plurality of supporting shaft rollers and pressing shaft rollers are arranged, so that the conveying of the semiconductor chips is facilitated.
In a specific embodiment, the first drive machine is mounted to a surface of the lower housing and the second drive machine is mounted to a surface of the upper housing.
In the implementation process, the first driving machine is supported by the lower frame body, and the second driving machine is supported by the upper frame body, so that the first driving machine and the second driving machine can be installed more stably.
In a specific embodiment, the first drive machine and the second drive machine are servo motors, and the output shaft of the first drive machine and the output shaft of the second drive machine are rotated in opposite directions.
In the implementation process, the servo motor can control the speed, the position accuracy is very accurate, and the use is facilitated.
In a specific embodiment, the output shaft of the first driver and any one of the supporting shaft rollers are connected with a first driving wheel in a key manner, and the first driving wheels are in driving connection through a first driving belt.
In the implementation process, the first driving wheel is matched with the first driving belt, so that the first driving machine can stably drive the supporting shaft roller to rotate.
In a specific embodiment, the output shaft of the second driver and any one of the compression shaft rollers are connected with a second driving wheel in a key manner, and the second driving wheels are in driving connection through a second driving belt.
In the implementation process, the second driving machine can drive the compression shaft roller to rotate under the cooperation of the second driving wheel and the second driving belt.
In a specific embodiment, the surface of going up the support body is provided with roller type and pushes down the material returning part, roller type pushes down the material returning part and includes compression roller and speed reducer down, arbitrary one compression roller's surface cover is equipped with the arc frame plate, just one side of arc frame plate with go up support body fixed connection, circular frame plate is installed to the opposite side of arc frame plate, just arc frame plate and circular frame plate all with the coaxial setting of compression roller that corresponds, the centre of a circle department of circular frame plate rotates and installs the pivot, the speed reducer install in the surface of circular frame plate, just the output shaft of speed reducer with the pivot transmission is connected, arc spout has been seted up on the surface of circular frame plate, slidable mounting has the slider in the groove of arc spout, lower compression roller fixed connection in the slider, the surface mounting of slider has the slide bar, just the one end of slide bar with pivot fixed connection.
In the implementation process, the speed reducer is used for driving the rotating shaft to rotate, when the rotating shaft rotates, the sliding rod on the surface of the speed reducer drives the sliding piece and the lower pressing roller to move, when the semiconductor chips conveyed by the belt conveyor are defective products, the lower pressing roller moves to the surface of the defective semiconductor chips and presses down the defective semiconductor chips, so that the semiconductor chips cannot move between the supporting shaft roller and the pressing shaft roller, the supporting shaft roller and the pressing shaft roller can not convey the defective semiconductor chips to the next processing station, the defective semiconductor chips can be prevented from being conveyed and processed, the waste of resources is reduced, and after the defective semiconductor chips are pressed down by the lower pressing roller, the defective semiconductor chips incline on the surface of the belt conveyor and slide down to the lower part of the belt conveyor, so that the defective semiconductor chips are removed from the whole production line.
In a specific embodiment, the outer wall of the arc-shaped frame plate is provided with a supporting rod, a visual detection sensor is installed at one end of the supporting rod, a proximity sensor is installed on a rod body of the supporting rod, a connecting rod is installed at one side of the supporting rod, one end of the connecting rod is fixedly connected with the upper frame body, a central control module is installed on the upper end face of the connecting rod, and the speed reducer, the visual detection sensor and the proximity sensor are electrically connected with the central control module.
When the semiconductor chips conveyed by the belt conveyor are detected to be defective, the vision detection sensor transmits signals to the central control module, the central control module decodes and analyzes the signals after receiving the signals, then generates control signals to the proximity sensor, the proximity sensor is started, after the proximity sensor detects the semiconductor chips conveyed by the belt conveyor, the proximity sensor sends feedback signals to the central control module, and the central control module receives the feedback signals and then sends the control signals to the speed reducer, so that the speed reducer is started.
In a specific embodiment, the lower pressing roller and the pressing shaft roller are both positioned on the same side of the circular frame plate, and the speed reducer is positioned on the other side of the circular frame plate.
In the implementation process, the speed reducer is separated from the compression shaft roller, so that the possibility that the speed reducer influences the rotation of the compression shaft roller is reduced.
In a specific embodiment, the sliding piece comprises a sliding block and a limiting block, the sliding block is inserted into the groove of the arc-shaped sliding groove in a sliding mode, two ends of the sliding block are respectively connected with the limiting block and the lower pressing roller, and the limiting block is connected with the sliding rod.
In the implementation process, the sliding rod can drive the limiting block to move, so that the sliding block and the lower pressing roller can be moved, and the arrangement of the arc-shaped sliding groove is more beneficial to the sliding block to move on the surface of the circular frame plate.
In a specific embodiment, a rectifying part is arranged on one side of the arc-shaped frame plate, the rectifying part comprises a corner plate and a rectifying guide block, the corner plate is installed on one side of the arc-shaped frame plate, a waist-shaped hole is formed in the surface of the corner plate, a screw rod is slidably installed in the waist-shaped hole, a nut is sleeved on the rod body thread of the screw rod, the two corresponding nuts are respectively arranged on two sides of the corner plate, the two opposite sides of the nut are respectively clung to the corner plate, the rectifying guide block is installed at the bottom end of the screw rod, a guide rod is installed at the top end of the rectifying guide block, a through groove corresponding to the guide rod is formed in the surface of the corner plate, the top end of the guide rod slides through the groove of the through groove, and a guide inclined plane is arranged on one side of the rectifying guide block.
In the implementation process, when the supporting shaft roller and the compacting shaft roller convey the semiconductor chips, one side of the inclined semiconductor chips can touch the deviation correcting guide block, the movement direction of the semiconductor chips can be changed by the deviation correcting guide block, so that deviation correction is carried out, the semiconductor chips are corrected and then enter the next processing station, and the corrected semiconductor chips are more beneficial to processing;
in addition, two nuts extrude the scute, can fix the screw rod on the surface of scute to fix the guide block that rectifies, and when screwing the nut, two nuts remove to the direction of being in opposite directions, and the nut separates with the scute, after releasing the fixed of screw rod, can slide the screw rod, adjusts the height of the guide block that rectifies of screw rod bottom, can remove the guide block that rectifies to suitable position and use.
In a second aspect, embodiments of the present application further provide a semiconductor conveying apparatus, including the adjustable conveying clamping structure described above, and a belt conveyor connected to the lower frame.
In the above implementation, a belt conveyor is provided for conveying the semiconductor chips.
In a specific embodiment, two belt conveyors are provided, and the two belt conveyors are respectively located at both ends of the lower frame body.
In the above implementation, the two belt conveyors may be connected to a previous processing station and a next processing station, respectively, for processing semiconductor chips.
The beneficial effects are that: the application provides an adjustable conveying clamping structure and semiconductor conveying equipment, through back shaft roller, compress tightly the shaft roller, first driving machine and second driving machine cooperation, carry semiconductor chip under the state of holding, more stable when making semiconductor chip carry, and regulate and control lift adjustment jar makes, can go up support body and compress tightly the shaft roller and go up and down, can change the distance between pressure shaft roller and the back shaft roller, thereby make pressure shaft roller and back shaft roller cooperation carry the semiconductor chip of different thickness, application scope has been improved greatly.
In the production process of the semiconductor chips, defective products can be generated under the influence of production and processing equipment and human factors, and the conveying equipment for the semiconductor chips is inconvenient to reject the defective semiconductor chips, so that the defective semiconductor chips can be transported from a previous processing station to a next processing station for processing, and resources are wasted.
The method comprises the steps that a vision detection sensor performs vision detection on a semiconductor chip conveyed by a belt conveyor, when the semiconductor chip is detected to be a defective product, the vision detection sensor transmits a signal to a central control module, the central control module decodes and analyzes the signal after receiving the signal, then generates a control signal to a proximity sensor, the proximity sensor is started, after the proximity sensor detects the semiconductor chip conveyed by the belt conveyor, the proximity sensor sends a feedback signal to the central control module, and the central control module receives the feedback signal and then sends the control signal to a speed reducer, so that the speed reducer is started;
the speed reducer drives the rotating shaft to rotate, when the rotating shaft rotates, the sliding rod on the surface of the speed reducer drives the sliding piece and the lower pressing roller to move, the lower pressing roller moves to the surface of the defective semiconductor chip conveyed by the belt conveyor and presses down the defective semiconductor chip, so that the semiconductor chip cannot move between the supporting shaft roller and the pressing shaft roller, the supporting shaft roller and the pressing shaft roller can not convey the defective semiconductor chip to the next processing station, the defective semiconductor chip can be prevented from being conveyed and processed, the waste of resources is reduced, and after the lower pressing roller presses down the defective semiconductor chip, the defective semiconductor chip can incline on the surface of the belt conveyor and slide down to the lower part of the belt conveyor, so that the defective semiconductor chip is removed from the whole production line.
When the semiconductor chip is conveyed, the semiconductor chip is easy to incline on the horizontal plane, and the inclined semiconductor chip is not beneficial to the processing after being conveyed to the next processing station.
When the supporting shaft roller and the compacting shaft roller convey the semiconductor chips, one side of the inclined semiconductor chips can touch the deviation correcting guide block, and the movement direction of the semiconductor chips can be changed by the deviation correcting guide block, so that deviation correction is carried out, the semiconductor chips are aligned and then enter the next processing station, and the aligned semiconductor chips are more beneficial to processing.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present application and therefore should not be considered as limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic view of an adjustable transfer clamping structure and a semiconductor conveying device according to an embodiment of the present application;
fig. 2 is a schematic view of a connection structure between a frame portion and a roller-type clamping portion according to an embodiment of the present application;
fig. 3 is a schematic view of a connection structure between a driving portion and a roller-type clamping portion according to an embodiment of the present application;
fig. 4 is a schematic diagram of a connection structure of a roll-type pressing material returning part and a deviation rectifying part according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a circular rack plate according to an embodiment of the present application;
FIG. 6 is a schematic view of a connection structure of a lower press roller and a sliding member according to an embodiment of the present application;
fig. 7 is a schematic view of a connection structure between an arc-shaped frame plate and a deviation rectifying part according to an embodiment of the present application;
fig. 8 is a schematic structural diagram of a deviation rectifying portion according to an embodiment of the present application.
In the figure: 100-frame parts; 110-lower frame body; 120-upper frame body; 130-lifting adjusting cylinder; 200-roller gripping sections; 210-supporting a shaft roller; 220-pressing the shaft roller; 300-a driving part; 310-a first drive; 311-a first driving wheel; 320-a second drive; 321-a second driving wheel; 400-belt conveyor; 500-roller type pressing down the material returning part; 510-pressing down the roller; 520-speed reducer; 530-arc-shaped shelf plates; 540-a circular shelf; 550-rotating shaft; 551-slide bar; 560-arc chute; 570—a slider; 571-a slider; 572-limiting block; 580-struts; 581-visual detection sensor; 582-proximity sensor; 590-connecting rod; 591-a central control module; 600-correcting part; 610-corner plate; 611-through grooves; 620-correcting guide blocks; 630-a waist-shaped hole; 640-screw; 650-nut; 660-guide bar.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
Referring to fig. 1-8, the present application provides an adjustable transport clamping structure comprising a frame portion 100, a roller clamping portion 200, and a drive portion 300.
Wherein, the roller gripping portion 200 and the driving portion 300 are connected to the frame portion 100, and the driving portion 300 is used to drive the roller gripping portion 200.
The frame part 100 comprises a lower frame 110, an upper frame 120 and a lifting adjusting cylinder 130, wherein the lifting adjusting cylinder 130 is arranged at the upper end part of the lower frame 110, and the upper frame 120 is connected with the lifting end of the lifting adjusting cylinder 130;
the roller-type clamping part 200 includes a supporting shaft roller 210 and a compressing shaft roller 220, the supporting shaft roller 210 is rotatably connected to the lower frame 110, and the compressing shaft roller 220 is rotatably connected to the upper frame 120;
the driving part 300 includes a first driving machine 310 and a second driving machine 320, the driving end of the first driving machine 310 is in driving connection with the supporting shaft roller 210, and the driving end of the second driving machine 320 is in driving connection with the compacting shaft roller 220.
In the above implementation process, after the semiconductor chip enters the upper portion of the supporting shaft roller 210, the pressing shaft roller 220 presses the surface of the semiconductor chip, so that the semiconductor chip is clamped, the supporting shaft roller 210 is driven to rotate by the first driving machine 310, the pressing shaft roller 220 is driven by the second driving machine 320, so that the pressing shaft roller 220 rotates along the direction opposite to the direction of the supporting shaft roller 210, the pressing shaft roller 220 and the supporting shaft roller 210 can convey the semiconductor chip in the clamped state, the semiconductor chip conveying process is more stable, the lifting adjusting cylinder 130 is regulated, the lifting adjusting cylinder 130 can lift the upper frame 120 and the pressing shaft roller 220 in the telescopic process, the distance between the pressing shaft roller 220 and the supporting shaft roller 210 can be changed, and the pressing shaft roller 220 and the supporting shaft roller 210 are matched to convey semiconductor chips with different thicknesses, so that the application range is greatly improved.
In a specific embodiment, the lower frame 110 and the upper frame 120 are rods with rectangular cross sections, and the lifting adjusting cylinders 130 are disposed in pairs.
In the above implementation process, the lifting adjusting cylinder 130 is any one of an air cylinder, an electric cylinder and a hydraulic cylinder, and a plurality of lifting adjusting cylinders 130 are arranged, so that the upper frame 120 can be better supported, and the lifting adjusting cylinders 130 can synchronously stretch.
In a specific embodiment, the support shaft roller 210 and the pressing shaft roller 220 have the same specification, and the support shaft roller 210 and the pressing shaft roller 220 are disposed in one-to-one correspondence.
In the above implementation process, the specifications are the same, and the versatility between the support shaft roller 210 and the pressing shaft roller 220 is improved.
In a specific embodiment, at least two support shaft rollers 210 and compression shaft rollers 220 are disposed at intervals along the length direction of the lower frame 110, and the support shaft rollers 210 and the compression shaft rollers 220 are respectively connected by belt pulleys and friction belts in a transmission manner.
In the above implementation process, a plurality of support shaft rollers 210 and pressing shaft rollers 220 are provided, which is beneficial to conveying the semiconductor chips.
In one embodiment, the first driver 310 is mounted to a surface of the lower housing 110 and the second driver 320 is mounted to a surface of the upper housing 120.
In the above-described implementation, the first driving machine 310 is supported by the lower housing 110 and the second driving machine 320 is supported by the upper housing 120, so that the first driving machine 310 and the second driving machine 320 can be installed more stably.
In a specific embodiment, the first drive machine 310 and the second drive machine 320 are each servo motors, and the output shaft of the first drive machine 310 and the output shaft of the second drive machine 320 are rotated in opposite directions.
In the implementation process, the servo motor can control the speed, the position accuracy is very accurate, and the use is facilitated.
In a specific embodiment, the output shaft of the first driver 310 and any one of the support shaft rollers 210 are connected with a first driving wheel 311 in a key manner, and the first driving wheels 311 are connected with each other in a driving manner through a first driving belt.
In the above implementation process, the first driving wheel 311 is matched with the first driving belt, so that the first driving machine 310 can drive the supporting shaft roller 210 to rotate more stably.
In a specific embodiment, the output shaft of the second driver 320 and any one of the compression rollers 220 are connected with a second driving wheel 321 in a key manner, and the second driving wheels 321 are connected in a driving manner through a second driving belt.
In the above implementation process, the second driving machine 320 can drive the pressing shaft roller 220 to rotate under the cooperation of the second driving wheel 321 and the second driving belt.
In the production process of the semiconductor chips, defective products can be generated under the influence of production and processing equipment and human factors, and the conveying equipment for the semiconductor chips is inconvenient to reject the defective semiconductor chips, so that the defective semiconductor chips can be transported from a previous processing station to a next processing station for processing, and resources are wasted.
In a specific embodiment, the surface of the upper frame 120 is provided with a roller type lower pressing material returning part 500, the roller type lower pressing material returning part 500 comprises a lower pressing roller 510 and a speed reducer 520, the surface of any one pressing shaft roller 220 is sleeved with an arc-shaped frame plate 530, one side of the arc-shaped frame plate 530 is fixedly connected with the upper frame 120, the other side of the arc-shaped frame plate 530 is provided with a circular frame plate 540, the arc-shaped frame plate 530 and the circular frame plate 540 are coaxially arranged with the corresponding pressing shaft roller 220, the center of the circular frame plate 540 is rotatably provided with a rotating shaft 550, the speed reducer 520 is arranged on the surface of the circular frame plate 540, an output shaft of the speed reducer 520 is in transmission connection with the rotating shaft 550, an arc-shaped sliding groove 560 is formed in the surface of the circular frame plate 540, a sliding piece 570 is fixedly connected with the lower pressing roller 510, the surface of the sliding piece 570 is provided with a sliding rod 551, and one end of the sliding rod 551 is fixedly connected with the rotating shaft 550.
In the above implementation process, the speed reducer 520 is used to drive the rotation shaft 550 to rotate, when the rotation shaft 550 rotates, the sliding rod 551 on the surface drives the sliding piece 570 and the lower pressing roller 510 to move, when the semiconductor chip conveyed by the belt conveyor 400 is a defective product, the lower pressing roller 510 moves to the surface of the defective semiconductor chip, and presses down the defective semiconductor chip, so that the semiconductor chip cannot move between the supporting shaft roller 210 and the pressing shaft roller 220, the supporting shaft roller 210 and the pressing shaft roller 220 can not convey the defective semiconductor chip to the next processing station, and then the defective semiconductor chip can be prevented from being conveyed and processed, the waste of resources is reduced, and after the defective semiconductor chip is pressed down by the lower pressing roller 510, the defective semiconductor chip can incline on the surface of the belt conveyor 400 and slide down to the lower part of the belt conveyor 400, so that the defective semiconductor chip is removed from the whole production line.
In a specific embodiment, the outer wall of the arc-shaped frame plate 530 is provided with a supporting rod 580, one end of the supporting rod 580 is provided with a visual detection sensor 581, a rod body of the supporting rod 580 is provided with a proximity sensor 582, one side of the supporting rod 580 is provided with a connecting rod 590, one end of the connecting rod 590 is fixedly connected with the upper frame body 120, the upper end surface of the connecting rod 590 is provided with a central control module 591, and the speed reducer 520, the visual detection sensor 581 and the proximity sensor 582 are all electrically connected with the central control module 591.
In the above implementation process, the visual detection sensor 581 may be a 3D visual sensor, with a resolution of 1um-2um, which can be used for on-line detection of the geometry and surface of a diffuse reflection surface such as metal, plastic or ceramic, and is very suitable for automatic on-line detection of the surface of a semiconductor chip, and the central control module 591 is a central control computer.
In a specific implementation, the vision detection sensor 581 performs vision detection on the semiconductor chips conveyed by the belt conveyor 400, when the semiconductor chips are detected to be defective, the vision detection sensor 581 transmits a signal to the central control module 591, the central control module 591 decodes and analyzes the signal after receiving the signal, then generates a control signal to the proximity sensor 582, starts the proximity sensor 582, and after the proximity sensor 582 detects the semiconductor chips conveyed by the belt conveyor 400, the proximity sensor 582 transmits a feedback signal to the central control module 591, and the central control module 591 receives the feedback signal and transmits a control signal to the speed reducer 520, thereby starting the speed reducer 520.
In a specific embodiment, the lower press roller 510 and the pinch roller 220 are both located on the same side of the circular shelf 540, and the speed reducer 520 is located on the other side of the circular shelf 540.
In the above implementation, the speed reducer 520 is separated from the pinch roller 220, and the possibility that the speed reducer 520 affects the rotation of the pinch roller 220 is reduced.
In a specific embodiment, the sliding member 570 includes a sliding block 571 and a limiting block 572, the sliding block 571 is slidably inserted into the groove of the arc chute 560, two ends of the sliding block 571 are respectively connected to the limiting block 572 and the lower pressing roller 510, and the limiting block 572 is connected to the sliding rod 551.
In the above implementation process, the sliding rod 551 may drive the limiting block 572 to move, so as to move the sliding block 571 and the lower pressing roller 510, and the arrangement of the arc chute 560 is more beneficial for the sliding block 571 to move on the surface of the circular frame plate 540.
When the semiconductor chip is conveyed, the semiconductor chip is easy to incline on the horizontal plane, and the inclined semiconductor chip is not beneficial to the processing after being conveyed to the next processing station.
In a specific embodiment, a deviation rectifying portion 600 is disposed on one side of the arc-shaped frame plate 530, the deviation rectifying portion 600 includes a corner plate 610 and a deviation rectifying guide block 620, the corner plate 610 is mounted on one side of the arc-shaped frame plate 530, a waist-shaped hole 630 is formed on the surface of the corner plate 610, a screw 640 is slidably mounted in the waist-shaped hole 630, a nut 650 is sleeved on a rod body thread of the screw 640, the two nuts 650 are disposed in a two-to-two opposite manner, the two corresponding nuts 650 are respectively disposed on two sides of the corner plate 610, opposite sides of the two nuts 650 are respectively attached to the corner plate 610, the deviation rectifying guide block 620 is mounted on the bottom end of the screw 640, a guide rod 660 is mounted on the top end of the deviation rectifying guide block 620, a through groove 611 corresponding to the guide rod 660 is formed on the surface of the corner plate 610, the top end of the guide rod 660 slides through the groove 611, and a guide slope is disposed on one side of the deviation rectifying guide block 620.
In the above implementation process, when the supporting shaft roller 210 and the compacting shaft roller 220 convey the semiconductor chip, one side of the inclined semiconductor chip may touch the deviation correcting guide block 620, and the deviation correcting guide block 620 may change the moving direction of the semiconductor chip, so as to correct the deviation, so that the semiconductor chip is aligned and then enters the next processing station, and the aligned semiconductor chip is more beneficial to processing;
in addition, the two nuts 650 press the corner plate 610, the screw 640 can be fixed on the surface of the corner plate 610, so that the deviation rectifying guide block 620 is fixed, when the nuts 650 are screwed, the two nuts 650 move in opposite directions, the nuts 650 are separated from the corner plate 610, after the fixation of the screw 640 is released, the screw 640 can be slid, the height of the deviation rectifying guide block 620 at the bottom end of the screw 640 is adjusted, and the deviation rectifying guide block 620 can be moved to a proper position for use.
In a second aspect, embodiments of the present application further provide a semiconductor conveying apparatus, including the adjustable conveying clamping structure, a belt conveyor 400, where the belt conveyor 400 is connected to the lower frame 110.
In the above-described implementation, the belt conveyor 400 is provided for conveying the semiconductor chips.
In a specific embodiment, two belt conveyors 400 are provided, and the two belt conveyors 400 are respectively located at both ends of the lower frame 110.
In the above-described implementation, the two belt conveyors 400 may connect a previous processing station and a next processing station for processing semiconductor chips, respectively.
Specifically, when the adjustable conveying and clamping structure and the semiconductor conveying device are used, the lifting and adjusting cylinder 130 is regulated and controlled, the lifting and adjusting cylinder 130 is stretched and contracted, the upper frame 120 and the pressing shaft roller 220 are lifted and lowered, the distance between the pressing shaft roller 220 and the supporting shaft roller 210 is changed, the distance between the pressing shaft roller 220 and the supporting shaft roller 210 is suitable for conveying the semiconductor chips conveyed by the belt, after the semiconductor chips enter the upper part of the supporting shaft roller 210, the pressing shaft roller 220 presses the surfaces of the semiconductor chips, so that the semiconductor chips are clamped, the supporting shaft roller 210 is driven to rotate by the first driving machine 310, the pressing shaft roller 220 is driven to rotate in the direction opposite to the direction of the supporting shaft roller 210, and the pressing shaft roller 220 and the supporting shaft roller 210 can convey the semiconductor chips in a clamped state.
The foregoing is merely exemplary embodiments of the present application and is not intended to limit the scope of the present application, and various modifications and variations may be suggested to one skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

Claims (10)

1. An adjustable transport clamping structure comprising
The lifting device comprises a frame body part (100), wherein the frame body part (100) comprises a lower frame body (110), an upper frame body (120) and a lifting adjusting cylinder (130), the lifting adjusting cylinder (130) is arranged at the upper end part of the lower frame body (110), and the upper frame body (120) is connected to the lifting end of the lifting adjusting cylinder (130);
a roller-type clamping part (200), wherein the roller-type clamping part (200) comprises a supporting shaft roller (210) and a compressing shaft roller (220), the supporting shaft roller (210) is rotatably connected with the lower frame body (110), and the compressing shaft roller (220) is rotatably connected with the upper frame body (120);
the driving part (300) comprises a first driving machine (310) and a second driving machine (320), wherein the driving end of the first driving machine (310) is in transmission connection with the supporting shaft roller (210), and the driving end of the second driving machine (320) is in transmission connection with the pressing shaft roller (220).
2. The adjustable conveying clamping structure according to claim 1, wherein the lower frame body (110) and the upper frame body (120) are rods with rectangular cross sections, and the lifting adjusting cylinders (130) are arranged in pairs.
3. The adjustable conveying clamping structure according to claim 1, wherein the support shaft roller (210) and the pressing shaft roller (220) have the same specification, and the support shaft roller (210) and the pressing shaft roller (220) are arranged in a one-to-one correspondence.
4. The adjustable conveying clamping structure according to claim 1, wherein at least two supporting shaft rollers (210) and at least two pressing shaft rollers (220) are arranged at intervals along the length direction of the lower frame body (110), and the supporting shaft rollers (210) and the pressing shaft rollers (220) are in transmission connection through belt pulleys and friction belts respectively.
5. An adjustable transport gripping structure according to claim 1, characterized in that the first drive machine (310) is mounted to the surface of the lower frame (110) and the second drive machine (320) is mounted to the surface of the upper frame (120).
6. An adjustable transfer gripping structure according to claim 1, characterized in that the first drive machine (310) and the second drive machine (320) are servo motors and that the output shaft of the first drive machine (310) and the output shaft of the second drive machine (320) are rotated in opposite directions.
7. An adjustable conveying clamping structure according to claim 1, characterized in that the output shaft of the first driving machine (310) and any one of the supporting shaft rollers (210) are connected with a first driving wheel (311) in a key manner, and the first driving wheels (311) are connected with each other in a driving manner through a first driving belt.
8. An adjustable conveying clamping structure according to claim 1, characterized in that the output shaft of the second driving machine (320) and any one of the pressing shaft rollers (220) are connected with a second driving wheel (321) in a key manner, and the second driving wheels (321) are connected in a driving manner through a second driving belt.
9. A semiconductor conveying apparatus comprising an adjustable transfer clamping structure according to any one of claims 1-8, a belt conveyor (400), said belt conveyor (400) being connected to said lower frame (110).
10. A semiconductor conveying apparatus according to claim 9, wherein two of said belt conveyors (400) are provided, and two of said belt conveyors (400) are respectively located at both ends of said lower frame body (110).
CN202310440503.XA 2023-04-23 2023-04-23 Adjustable conveying clamping structure and semiconductor conveying equipment Active CN116553063B (en)

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CN217144086U (en) * 2022-04-19 2022-08-09 深圳市满坤电子有限公司 Cutting device for directional conveying in circuit board processing
KR20220002579U (en) * 2021-04-20 2022-10-28 양현정 Transfer driving apparatus for the fuel battery thin plate washing
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101313384A (en) * 2005-11-26 2008-11-26 Acp先进清洁生产有限公司 Apparatus and method for wet-chemical processing of flat, thin substrates in a continuous method
JP2008081216A (en) * 2006-09-26 2008-04-10 Okura Yusoki Co Ltd Roller conveyor
KR20090049213A (en) * 2007-11-13 2009-05-18 (주)세원물산 Belt lean proofread adappliance for belt conveyer device
DE102007061581A1 (en) * 2007-12-18 2009-06-25 Felix Kunze-Concewitz Device for cleaning substrates for microelectronic applications, has cleaning station arranged in rotary and successive manner, where cleaning liquid is subjected to roller pairs
KR20120043372A (en) * 2010-10-26 2012-05-04 한국생산기술연구원 Series chip bonding distance revision device for flexible embedded packaging
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KR20220002579U (en) * 2021-04-20 2022-10-28 양현정 Transfer driving apparatus for the fuel battery thin plate washing
CN216036696U (en) * 2021-10-26 2022-03-15 广东格华新材料科技有限公司 Inferior product removing device for plates
CN217144086U (en) * 2022-04-19 2022-08-09 深圳市满坤电子有限公司 Cutting device for directional conveying in circuit board processing
CN115824962A (en) * 2022-11-15 2023-03-21 彼图科技(青岛)有限公司 Intelligent workstation based on 3d defect detection

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