CN116551098B - Paraxial blue light composite welding equipment and method applied to solder ball spraying welding - Google Patents
Paraxial blue light composite welding equipment and method applied to solder ball spraying welding Download PDFInfo
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- CN116551098B CN116551098B CN202310807286.3A CN202310807286A CN116551098B CN 116551098 B CN116551098 B CN 116551098B CN 202310807286 A CN202310807286 A CN 202310807286A CN 116551098 B CN116551098 B CN 116551098B
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- 238000003466 welding Methods 0.000 title claims abstract description 172
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 87
- 238000005507 spraying Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000002131 composite material Substances 0.000 title claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 41
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 150000001875 compounds Chemical class 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims description 41
- 239000013307 optical fiber Substances 0.000 claims description 30
- 230000003287 optical effect Effects 0.000 claims description 19
- 238000005476 soldering Methods 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 9
- 230000006698 induction Effects 0.000 claims description 6
- 238000012544 monitoring process Methods 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 3
- 230000010354 integration Effects 0.000 abstract description 3
- 238000001444 catalytic combustion detection Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002789 length control Methods 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 241001025261 Neoraja caerulea Species 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000013072 incoming material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a paraxial blue light compound welding device and a paraxial blue light compound welding method applied to solder ball welding, which belong to the technical field of welding and are designed for solving the technical problem of low automation integration level in the prior art, and comprise the following steps: the ball spraying laser mechanism is used for outputting a main shaft laser beam and spraying tin balls, and light spots of the main shaft laser beam act on the tin balls; and the blue light welding head is used for outputting a blue light beam, and a light spot of the blue light beam acts on the product bonding pad. The whole structure is compact in design, small in size and easy to automatically integrate.
Description
Technical Field
The invention belongs to the technical field of welding, and particularly relates to a paraxial blue light compound welding device and method applied to solder ball welding.
Background
At present, the solder ball is welded by mainly using a single laser and a welding head, the welding head is coaxial with a nozzle structurally, the solder ball at the nozzle is heated by laser, the solder ball is sprayed out under the action of nitrogen after being melted, and the welding is completed by utilizing the heat of the solder ball or secondary light following. The welding mode is used for welding the high-heat-dissipation welding pad or the two welding pads with obvious difference in heat dissipation, has the defects of less tin of the welding pad, burn, flying ball and the like, is difficult to debug in a welding process, and has low welding yield. Aiming at a high heat dissipation bonding pad, a heating platform, a heating block or a hot air gun is usually used for preheating, the defects of low heating efficiency and large size are adverse to equipment integration, for example, the application number is 2020113363600, and the application name is a high-frequency focusing induction and laser combined welding head device adopts a mode of preheating a welded area through electromagnetic induction, so that the complexity of equipment is increased; aiming at two objects to be welded with obvious difference in heat dissipation, such as FPC, PCB, pins, PCB and the like, if coaxial lasers are used independently, one side of a bonding pad is burnt, the other side of the bonding pad is less in tin, and therefore unstable welding and difficult debugging are caused. In addition, the problems of pollution, oxidization and the like on the surface of the bonding pad are solved, the defect of welding flying balls is easily caused, the surface of the bonding pad needs to be preheated or cleaned in advance, and the tin bonding capability of the bonding pad is improved. The above is a practical problem encountered in solder ball soldering and new soldering processes are needed for improvement.
Disclosure of Invention
In order to solve the technical problem that excessive soldering tin easily occurs in the prior art, a paraxial blue light compound welding device applied to solder ball welding is provided, comprising:
paraxial blue light composite welding equipment applied to solder ball welding comprises:
the ball spraying laser mechanism is used for outputting a main shaft laser beam and spraying solder balls, and the light spots of the main shaft laser beam act on the solder balls;
the blue light welding head is used for outputting a blue light beam, a light spot of the blue light beam acts on the bonding pad, and an included angle between the main shaft laser beam and the blue light beam is alpha; after the blue light beam acts on the bonding pad, the temperature of the bonding pad is beta; the ratio between alpha and beta is D, and D is more than or equal to 5.0 and more than or equal to 2.4;
and the blue light CCD is used for photographing the surface of the bonding pad.
Alternatively, the spindle laser beam is a semiconductor laser.
Optionally, before welding, the solder pad is preheated by the light spot of the blue light beam, and then the solder ball is melted by the semiconductor laser, so that the part to be welded and the solder pad are welded together in a lap joint mode, and after the solder ball is sprayed, the light spot of the blue light beam participates in a light tracking process, and the solder pad is continuously heated.
Optionally, the laser emission time length control device comprises a laser emission time length control part, wherein the laser emission time length control part is used for controlling the laser emission time lengths of the blue light beam and the main shaft laser beam, the laser emission time length of the blue light beam is A, and the laser emission time length of the main shaft laser beam is B.
Optionally, the time interval between a and B is S, and the ratio between a and S is greater than 1.
Optionally, a charging basket assembly, a blue light welding head adjusting bracket, a blue light welding head, a servo motor, a ball separating cavity assembly and a tin spraying ball welding joint are further arranged, a tin ball can enter a cavity of the tin spraying ball welding joint through the ball separating cavity assembly, and a main shaft laser beam acts on the tin ball when the tin ball enters the cavity; the charging basket assembly is used for storing tin balls; the solder balls can enter the ball separating cavity assembly, and the ball separating cavity assembly comprises a ball separating mechanism and a ball dropping channel of the solder balls and comprises discs; the servo motor is a rotating motor of the solder ball joint, and the rotating motor is connected with a coupler and is used for driving the disc to rotate; the blue light welding head adjusting bracket is used for fixing the blue light welding head and fine adjusting the position of a blue light spot;
the blue light welding head is a welding head of paraxial preheating laser, a blue light spot acts on a bonding pad, and is provided with a coaxial blue light CCD which is connected with the blue light welding head; the blue light CCD is connected with the display, and the display is used for monitoring the welding position in real time, so that the blue light spot position can be conveniently adjusted;
the ball spraying laser mechanism is emitted by a semiconductor laser or an optical fiber laser, and the emitted laser light spots act on the tin balls of the solder joints of the tin spraying balls, and the tin balls are sprayed after being melted;
the blue light welding head adjusting bracket comprises a charging basket mounting plate, an optical fiber amplifier, a correlation optical fiber sensor, an induction piece, a connecting shaft, a blue light welding head and a blue light CCD;
the charging basket mounting plate fixes the blue light welding head adjusting bracket on the tin spraying ball welding head; the optical fiber amplifier is matched with the correlation optical fiber sensor for use and is used for detecting the position change of the sensing piece; the sensing piece is designed with a small hole of 0.4mm, the small hole is aligned with the optical path of the correlation optical fiber sensor, the sensing piece is fixed at one end of the connecting shaft, and the other end of the connecting shaft is fixed on the blue-ray welding head.
Optionally, when the position of the blue light welding head slightly changes, the small hole of the sensing piece is eccentric with the optical path of the correlation optical fiber sensor, the sensing piece partially or completely blocks the optical path, at the moment, the optical signal received by the amplifier is weaker, and when the optical signal is lower than a set threshold value, alarm information is output so as to be used for checking the position of the blue light welding head.
Optionally, an XY fine tuning platform and a blue light connecting plate are arranged in the blue light welding head adjusting bracket, and the movable range of the XY fine tuning platform in the X direction and the Y direction is +/-7 mm; the blue light connecting plate is connected with the blue light welding head and is used for adjusting the angle of the blue light welding head by +/-5 degrees.
Optionally, in the XY fine tuning platform, after adjusting a proper angle and a proper height, fine tuning the X direction and the Y position of the translation stage by using an internal hexagonal wrench, and overlapping or fixing the distance between the blue light spot and the center of the spray ball laser spot, wherein the blue light spot is elliptical, the laser emitting direction of the spray ball laser mechanism is the same as and coaxial with the direction of the spray ball welding joint, and the coaxial spot is circular.
The welding method is carried out by the paraxial blue light compound welding equipment applied to the welding of the solder ball, and comprises the following steps:
s1: the XYZ module of the workbench drives the solder ball joint to move to the position above the bonding pad;
s2: judging whether a solder ball joint is on ball OK or not by a solder joint air pressure sensor, and outputting optical signals to a blue laser and a semiconductor laser after the ball OK is on;
s3: after receiving the laser output signal from the machine, the blue laser starts to emit blue light beam, and the light emitting time is A;
s4: after the semiconductor laser receives the laser signal given by the machine, the semiconductor laser starts to emit semiconductor laser after the delay time C, and the tin ball is ejected, wherein the light emitting time is B;
s5: judging whether the solder ball is sprayed out or not through the air pressure sensor of the welding head after the light emission is finished, and giving a light emission finishing signal to a machine after the solder ball is sprayed out, or giving a ball blocking alarm signal;
s6: after the machine receives the light emitting completion signal, the XYZ module drives the solder ball joint to the next welding spot.
The invention has the beneficial effects that: the application of the paraxial blue light and coaxial laser compound welding mode in the tin spraying ball welding has remarkable effect on improving the production yield and the welding stability. Aiming at a large bonding pad, a bonding pad with fast heat dissipation or a different bonding pad, particularly a bonding pad made of gold-plated and copper materials, the paraxial blue light compound welding mode has great advantages, and the application range of the solder ball is widened. In addition, the whole structure design is compact, the volume is small, and the automatic integration is easy to carry out.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of a blue light welding head adjusting bracket;
FIG. 3 is a schematic diagram of a blue-light coaxial CCD monitoring system;
FIG. 4 is a schematic view of the structure of the XY fine tuning stage at an angle;
FIG. 5 is a schematic view of spot shape;
FIG. 6 is a welding control flow diagram;
FIG. 7 is a schematic diagram of paraxial blue light and semiconductor laser time;
FIGS. 8 and 9 are schematic diagrams of PCB and FPC lap joint;
fig. 10 and 11 are schematic diagrams of conventional PCB and stitch through hole soldering.
Detailed Description
Description of the embodiments referring to fig. 1 to 11 of the drawings, a paraxial blue light composite welding device for solder ball welding is provided, including: the ball spraying laser mechanism 5 is used for outputting a main shaft laser beam and spraying solder balls, and the light spots of the main shaft laser beam act on the solder balls; and the blue welding head 3 is used for outputting a blue light beam, and a light spot of the blue light beam acts on the bonding pad. The spindle laser beam can be a semiconductor laser. Before welding, the welding disc can be preheated through the light spot of the blue light beam, then the solder ball is melted through the semiconductor laser, so that the PCB and the FPC welding disc are welded together in a lap joint mode, and after the solder ball is sprayed, the light spot of the blue light beam participates in a light tracking process, and the FPC welding disc is continuously heated. The ball spraying laser mechanism 5 integrates two functions of output laser and a solder ball, realizes the two functions through one mechanism, can realize the output laser while spraying the solder ball, has compact overall structural design and small volume, and is easy to automatically integrate; the blue light CCD is used for photographing the surface of the bonding pad, judging whether the surface of the bonding pad has pollution, oxidization and the like, and according to the information obtained by photographing the blue light CCD, the light emitting duration of the main shaft laser beam and the blue light beam is adjusted, so that the purposes of saving the light emitting duration and improving the welding effect are achieved. When the semiconductor laser is used alone for solder ball welding, the FPC bonding pad is easy to reduce tin, and the yield is difficult to improve. Different PCB and FPC parameters have larger difference, the welding is difficult to be compatible by using the same parameters, the unstable welding is easy to occur, a paraxial blue light beam is added on the FPC side, and the included angle between the main shaft laser beam and the blue light beam is alpha; after the blue light beam acts on the bonding pad, the temperature of the bonding pad is beta; the ratio between alpha and beta is D, and D is more than or equal to 5.0 and more than or equal to 2.4, for example, the included angle between the blue light beam and the semiconductor laser comprises 30-50 degrees, and the blue light beam can preheat the bonding pad to 120-150 ℃; when the ratio is D, the wettability of the bonding pad can be improved, the solderable window of the bonding pad is increased, for example, when the parameters of the PCB and the FPC are greatly different, good soldering effect can still be realized, and the bonding pad has the advantage of high compatibility; and blue light participates in the light following process after ball spraying, the FPC bonding pad is continuously heated, and the characteristic of high absorptivity of gold-plating materials to blue light is utilized, so that the FPC bonding pad is kept at a higher temperature, and the poor tin content of the FPC bonding pad is reduced.
Referring to fig. 7 of the specification, a is blue laser time, B is semiconductor laser time, and C is semiconductor laser delay time; when C > A, blue light only preheats the bonding pad; when C is less than A, the blue light and the semiconductor laser have overlapped time, and the paraxial blue light laser not only preheats the bonding pad, but also participates in the light following process after ball spraying.
The paraxial blue light beam and semiconductor laser composite welding mode has various laser power and laser time A, B, C, S setting modes and can be flexibly used according to welding requirements.
Referring to fig. 1 of the specification, a paraxial blue light composite welding device applied to solder ball welding is provided, including: the device comprises a charging basket assembly 1, a blue light welding head adjusting bracket 2, a blue light welding head 3, a servo motor 4 and a ball separating cavity assembly 6; the charging basket assembly 1 is used for storing tin balls, and the diameter of the tin balls is more than 0.76 mm; the blue light welding head adjusting bracket 2 is used for fixing a blue light welding head and fine adjusting the blue light spot position; the blue light welding head 3 is a welding head of paraxial preheating laser, a blue light spot acts on a bonding pad, the blue light welding head 3 is provided with a coaxial CCD, a D80 optical fiber interface is adopted, and a 50-200W blue light laser is compatible; the servo motor 4 is a rotating motor of a solder ball joint, and the rotating motor is connected with a coupler to drive a disc in the ball separating cavity assembly 6 to rotate; the laser spot output by the ball spraying laser mechanism 5 acts on the solder ball of the nozzle, the solder ball is melted and then sprayed out, and the ball spraying laser is emitted by a semiconductor laser or an optical fiber laser; the ball separating cavity assembly 6 is a solder ball separating mechanism and a ball dropping channel and comprises a disc, a gasket, an upper cavity, a lower cavity and a nozzle.
Referring to fig. 2 of the specification, in an embodiment, a blue welding head adjusting bracket 2 is fixed on a tin spraying ball welding head, and the blue welding head adjusting bracket 2 comprises a charging bucket mounting plate 2-1, an optical fiber amplifier 2-2, a correlation optical fiber sensor 2-3, a sensing piece 2-4, a connecting shaft 2-5, an XY fine tuning platform 2-6, a blue connecting plate 2-7, a blue welding head 3 and a blue CCD2-8.
Referring to fig. 2 of the drawings, in one embodiment, a bucket mounting plate 2-1 secures the bracket to the solder ball; the optical fiber amplifier 2-2 and the correlation optical fiber sensor 2-3 are matched for use to detect the position change of the sensing piece 2-4; the sensing piece 2-4 is designed with a small hole with the diameter of 0.4mm, the small hole is aligned with the optical path of the correlation optical fiber sensor, the sensing piece 2-4 is fixed on the connecting shaft 2-5, and the other end of the connecting shaft 2-5 is fixed on the blue-ray welding head 3.
In an embodiment, when the position of the blue light welding head 3 slightly changes, the small hole of the sensing piece 2-4 is eccentric with the optical path of the opposite-type optical fiber sensor 2-3, the sensing piece partially or completely blocks the optical path, at the moment, the optical signal received by the amplifier 2-2 is weaker, and when the optical signal is lower than a set threshold value, alarm information is output to prompt a producer to check the position of the blue light welding head 3.
Fig. 6 is a control flow chart of paraxial blue light and semiconductor laser hybrid welding, and the specific steps are as follows:
s1: the XYZ module of the workbench drives the solder ball joint to move to the position above the bonding pad; i.e. the welding head is moved into place;
s2: and judging whether the solder joint of the solder ball is on the ball OK or not by a solder joint air pressure sensor, and outputting optical signals to the blue laser and the semiconductor laser after the ball OK is on. Judging whether the ball feeding is OK or not, if so, judging the ball feeding NG in a specified time, and outputting a ball-free alarm signal;
s3: after receiving the laser signal given by the machine, the blue laser starts to emit blue light, and the blue light time is A;
s4: after receiving the laser signal from the machine, the semiconductor laser starts to output semiconductor laser after the delay time C, namely, ball spraying laser is output, the tin balls are sprayed, and the semiconductor laser time is B;
s5: judging whether the light emission is finished, if so, judging whether the solder ball is sprayed out through a welding head air pressure sensor, after OK, giving a light emission finishing signal to a machine, and giving a ball blocking alarm signal to NG;
s6: after the machine receives the light emitting completion signal, the XYZ module drives the solder ball spraying welding joint to the next welding point; i.e. the welding head is moved into place;
and when the steps S1-S6 are executed, the surface of the bonding pad can be photographed through the blue light CCD, whether the surface of the bonding pad has pollution, oxidization and other problems is judged, and according to the information obtained by photographing the blue light CCD, the light emitting duration of the main shaft laser beam and the blue light beam is adjusted, so that the purposes of saving the light emitting duration and improving the welding effect are achieved.
Referring to fig. 7, fig. 7 is a schematic diagram of paraxial blue light and semiconductor laser time, a is blue light laser time, B is semiconductor laser time, and C is semiconductor laser delay time; when C > A, blue light only preheats the bonding pad; when C is less than A, the blue light and the semiconductor laser have overlapped time, and the paraxial blue light laser has a preheating bonding pad and participates in the light following process after ball spraying. The paraxial blue light and semiconductor laser composite welding mode has various laser power and laser time ABC setting modes and can be flexibly used according to welding requirements; gold plating is carried out on the surfaces of the FPC and the PCB bonding pads, a certain gap is reserved between the FPC bonding pads and the PCB bonding pads, and the tin spreading coverage rate of the FPC bonding pads is required to be 100%; when the semiconductor laser is used alone for ball-spraying welding, the FPC bonding pad is easy to reduce tin, and the yield is difficult to improve; in addition, the PCB and the FPC are supplied by different suppliers, the welding parameters are greatly different, the welding is difficult to be compatible by using the same parameters, and the welding is unstable after mass production; adding paraxial blue light on the FPC side, wherein the blue light forms an included angle of 30-50 degrees with the semiconductor laser, preheating a bonding pad by using the blue light to 120-150 ℃, improving the wettability of the bonding pad, increasing the solderable window of the bonding pad, and improving the compatibility of incoming materials of different suppliers; and blue light participates in the light following process after ball spraying, the FPC bonding pad is continuously heated, and the characteristic of high absorptivity of gold-plating materials to blue light is utilized, so that the FPC bonding pad is kept at a higher temperature, and poor tin of the bonding pad is reduced.
The PCB bonding pad is gold-plated or tin-plated, the copper material of the pin or the surface is gold-plated, the pin dissipates heat quickly, and the Kong Touxi rate is required to be more than 75 percent. Because the stitch dissipates heat faster, usually use the laser to send silk to weld or laser solder paste to weld the craft, when using the semiconductor laser alone to spray the ball to weld, weld unstably, the easy question such as few tin, flying ball, burn and tin penetration bad. In this case, a paraxial blue laser and semiconductor laser compound welding mode can be used, the paraxial blue light preheats pins and bonding pads, the tin bonding capacity of the pins is improved, and poor welding can be effectively reduced. In addition, when the material is copper or gold, the absorptivity of the material to the blue laser is about 60%, the absorptivity of the material to the semiconductor laser is about 3-5%, the blue laser only needs to input smaller power when the temperature is increased to the same temperature, after the paraxial blue laser is increased, the coaxial laser energy is relatively reduced, and the risk of burning surrounding components caused by solder ball welding is effectively reduced.
The two cases are the application of paraxial blue light and semiconductor laser compound welding in tin spraying ball welding, and the welding yield and stability are greatly improved.
As shown in fig. 1, a composite welding structure of coaxial ball spraying laser and paraxial preheating laser is provided, which mainly comprises a charging basket component 1, a blue light adjusting bracket 2, a blue light welding head 3, a servo motor 4 and a ball separating cavity component 6. The charging basket assembly 1 is used for storing tin balls and is commonly applied to batch production of tin balls with the diameter of more than 0.76mm, and theoretically, 8 ten thousand tin balls with the diameter of 1.0mm can be loaded in one charging basket at a time; the blue light adjusting bracket 2 is used for fixing a blue light welding head and finely adjusting the blue light spot position; the blue light welding head 3 is a welding head of paraxial preheating laser, blue light spots act on a welding pad, the welding head is provided with a coaxial CCD, and a D80 optical fiber interface is adopted, so that the blue light welding head is compatible with a currently commonly used 50-200W blue light laser; the servo motor 4 is a rotating motor of a solder ball joint, and the motor is connected with a coupler to drive a disc in the ball separating cavity assembly to rotate; the laser spot emitted by the ball spraying laser mechanism 5 acts on the solder ball of the nozzle, the solder ball is melted and then sprayed, and a semiconductor laser or a fiber laser is generally used for ball spraying laser; the ball separating cavity assembly 6 is a solder ball separating mechanism and a ball dropping channel and comprises a disc, a gasket, an upper/lower cavity, a nozzle and the like;
fig. 2 is a blue light welding head adjusting bracket, which is fixed on a tin spraying ball welding head and mainly comprises a charging bucket mounting plate 2-1, an optical fiber amplifier 2-2, a correlation optical fiber sensor 2-3, a sensing piece 2-4, a connecting shaft 2-5, an XY fine tuning platform 2-6, a blue light connecting plate 2-7, a blue light welding head 3, a blue light CCD2-8 and the like. The bracket is fixed on the solder ball by the charging basket mounting plate 2-1; the optical fiber amplifier 2-2 and the correlation optical fiber sensor 2-3 are matched for use to detect the position change of the sensing piece 2-4; the sensing piece 2-4 is designed with a small hole of 0.4mm, and the small hole is aligned with the optical path of the correlation optical fiber sensor. The induction piece 2-4 is fixed on the connecting shaft 2-5, and the other end of the connecting shaft 2-5 is fixed on the blue light welding head 3. When the position of the blue light welding head 3 slightly changes, the small hole of the sensing piece 2-4 is eccentric with the optical path of the opposite-type optical fiber sensor 2-3, the sensing piece partially or completely blocks the optical path, at the moment, the light signal received by the amplifier 2-2 is weaker, and when the light signal is lower than a set threshold value, alarm information is output to prompt production personnel to check the position of the blue light welding head 3. For example, the XY fine tuning stages 2-6 may employ Sigma brand standard model TASB-402, X-direction and Y-direction movable ranges of + -7 mm; the blue light connecting plate 2-7 is connected with the blue light welding head 3, the angle of the blue light welding head can be adjusted, and the angle range is +/-5 degrees; the blue light welding head 3 is connected with a D80 optical fiber joint of a blue light laser, and focuses divergent light into a welding light spot, and the welding head is integrated with a coaxial CCD; the blue light CCD2-8 is connected with the blue light welding head 3, and after a display is configured, the welding position can be monitored in real time, so that the blue light spot position can be conveniently adjusted;
fig. 3 is a schematic diagram of a blue-light coaxial CCD monitoring system comprising a display 7, a white-light spotlight 8, a blue-light soldering head 3 and blue-light CCDs 2-8. The display 7 is usually an 8-inch or 17-inch display, the position of the cross line can be manually adjusted by the display, and the cross line intersection point is overlapped with the center of the light spot, so that staff can conveniently check whether the position of the blue light spot changes in the production process; the white light spot lamp 8 provides a CCD light source, so that a monitoring picture is clearer; the blue light CCD2-8 video line is connected with the display 7.
Fig. 4 is a schematic diagram of an XY fine tuning platform 2-6, after a mechanism adjusts a proper angle and height, only an inner hexagonal wrench is needed to fine tune the X-direction and Y-direction positions of the translation stage, so that a blue light spot coincides with the center of a laser spot of a ball-spraying laser or the positions of a fixed interval are fixed, as shown in fig. 5, the schematic diagram is a concentric position of a light spot formed by coaxially printing blue light and coaxial laser on photographic paper, the blue light spot is elliptical, and the coaxial light spot is circular. After the blue light spot position is adjusted, the side set screw of the XY fine adjustment platform is locked, and the fine adjustment platform can be fixed.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. Be applied to paraxial blue light compound welding equipment of solder ball welding, characterized by comprising: the ball spraying laser mechanism (5) is used for outputting a main shaft laser beam and spraying solder balls, and the light spots of the main shaft laser beam act on the solder balls; the blue light welding head (3) is used for outputting a blue light beam, a light spot of the blue light beam acts on the bonding pad, and an included angle between the main shaft laser beam and the blue light beam is alpha; after the blue light beam acts on the bonding pad, the temperature of the bonding pad is beta; the ratio between alpha and beta is D, and D is more than or equal to 5.0 and more than or equal to 2.4; a blue light CCD (2-8) for photographing the surface of the bonding pad; the device is also provided with a charging basket assembly (1), a blue light welding head adjusting bracket (2), a blue light welding head (3), a servo motor (4), a ball separating cavity assembly (6) and a tin spraying ball welding joint, wherein a tin ball can enter a cavity of the tin spraying ball welding joint through the ball separating cavity assembly (6), and a main shaft laser beam acts on the tin ball when the tin ball enters the cavity; the charging basket assembly (1) is used for storing tin balls; the solder balls can enter the ball separating cavity assembly (6), and the ball separating cavity assembly (6) is a ball separating mechanism and a ball dropping channel of the solder balls and comprises discs; the servo motor (4) is a rotating motor of the solder ball joint, and the rotating motor is connected with a coupler and is used for driving the disc to rotate; the blue light welding head adjusting bracket (2) is used for fixing a blue light welding head and fine-adjusting the position of a blue light spot; the blue light welding head (3) is a welding head of paraxial preheating laser, a blue light spot acts on a welding pad, the blue light welding head (3) is provided with a coaxial blue light CCD (2-8), and the blue light CCD (2-8) is connected with the blue light welding head (3); the blue light CCD (2-8) is connected with the display (7), and the display (7) is used for monitoring the welding position in real time, so that the blue light spot position can be conveniently adjusted; the ball spraying laser mechanism (5) is emitted by a semiconductor laser or an optical fiber laser, and the emitted laser spots act on the solder balls of the solder ball welding joint, and the solder balls are sprayed after melting; the blue light welding head adjusting bracket (2) comprises a charging bucket mounting plate (2-1), an optical fiber amplifier (2-2), a correlation optical fiber sensor (2-3), an induction piece (2-4), a connecting shaft (2-5), a blue light welding head (3) and a blue light CCD (2-8); the charging basket mounting plate (2-1) is used for fixing the blue light welding head adjusting bracket (2) on the tin spraying ball welding head; the optical fiber amplifier (2-2) and the correlation optical fiber sensor (2-3) are matched for use and are used for detecting the position change of the sensing piece (2-4); the induction piece (2-4) is provided with a small hole with the diameter of 0.4mm, the small hole is aligned with the optical path of the correlation optical fiber sensor (2-3), the induction piece (2-4) is fixed at one end of the connecting shaft (2-5), and the other end of the connecting shaft (2-5) is fixed on the blue light welding head (3).
2. The paraxial blue light composite welding equipment for solder ball welding according to claim 1, wherein the main axis laser beam is a semiconductor laser.
3. The paraxial blue light composite soldering apparatus for solder ball soldering according to claim 2, wherein the solder ball is preheated by the spot of the blue light beam before soldering, and then melted by the semiconductor laser, so that the parts to be soldered and the solder pad are lap-soldered together, and the spot of the blue light beam participates in the follow-up process after solder ball soldering, and continues to heat the solder pad.
4. The paraxial blue light composite welding equipment for solder ball welding according to claim 1, comprising a laser emission duration control part for controlling the laser emission duration of a blue light beam and a main shaft laser beam, wherein the laser emission duration of the blue light beam is a, and the laser emission duration of the main shaft laser beam is B.
5. The paraxial blue composite welding apparatus for solder ball welding according to claim 4, wherein the time interval between a and B is S, and the ratio between a and S is greater than 1.
6. The paraxial blue light composite welding equipment applied to solder ball welding according to claim 1, wherein when the position of the blue light welding head (3) is slightly changed, the small hole of the sensing piece (2-4) is eccentric to the optical path of the opposite-type optical fiber sensor (2-3), the sensing piece partially or completely blocks the optical path, at the moment, the light signal received by the amplifier (2-2) is weaker, and when the light signal is lower than a set threshold value, alarm information is output for checking the position of the blue light welding head (3).
7. The paraxial blue light compound welding equipment applied to solder ball welding according to claim 1, wherein an XY fine adjustment platform (2-6) and a blue light connecting plate (2-7) are arranged in a blue light welding head adjusting bracket (2), and the X-direction and Y-direction movable range of the XY fine adjustment platform (2-6) is +/-7 mm; the blue light connecting plates (2-7) are connected with the blue light welding head (3) and are used for adjusting the angle of the blue light welding head (3) to be +/-5 degrees.
8. The paraxial blue light compound welding equipment applied to solder ball welding according to claim 7, wherein in an XY fine adjustment platform (2-6), after proper angles and heights are adjusted, blue light spots are overlapped with the centers of the laser spots of the solder ball or fixed spacing positions through fine adjustment of X-direction and Y-direction positions of an internal hexagonal wrench, the blue light spots are elliptical, the laser emitting direction of a laser mechanism (5) of the solder ball is the same as the direction of the solder ball joint, and the coaxial spots are circular.
9. A soldering method, the steps of which are performed by the paraxial blue composite soldering apparatus applied to solder ball soldering according to claim 1, comprising:
s1: the XYZ module of the workbench drives the solder ball joint to move to the position above the bonding pad;
s2: judging whether a solder ball joint is on ball OK or not by a solder joint air pressure sensor, and outputting optical signals to a blue laser and a semiconductor laser after the ball OK is on;
s3: after receiving the laser output signal from the machine, the blue laser starts to emit blue light beam, and the light emitting time is A; s4: after the semiconductor laser receives the laser signal given by the machine, the semiconductor laser starts to emit semiconductor laser after the delay time C, and the tin ball is ejected, wherein the light emitting time is B;
s5: judging whether the solder ball is sprayed out or not through the air pressure sensor of the welding head after the light emission is finished, and giving a light emission finishing signal to a machine after the solder ball is sprayed out, or giving a ball blocking alarm signal;
s6: after the machine receives the light emitting completion signal, the XYZ module drives the solder ball joint to the next welding spot.
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