CN116547867A

CN116547867A - Antenna

Info

Publication number: CN116547867A
Application number: CN202180076753.9A
Authority: CN
Inventors: 曾根孝之; 原文平
Original assignee: Yokowo Co Ltd
Current assignee: Yokowo Co Ltd
Priority date: 2020-11-16
Filing date: 2021-11-15
Publication date: 2023-08-04
Also published as: CN116508207A

Abstract

The influence on the characteristics of other antennas can be suppressed. An antenna is provided with: a 1 st vibrator having a plurality of parallel resonant portions that resonate in a 1 st frequency band and a 1 st connection portion that connects adjacent parallel resonant portions among the plurality of parallel resonant portions to each other; and a 2 nd oscillator connected to the 1 st oscillator, wherein the 1 st oscillator and the 2 nd oscillator handle radio waves of a 2 nd frequency band different from the 1 st frequency band.

Description

Antenna module

Technical Field

The field of the disclosed subject matter relates to device packages. In particular, the field of the disclosed subject matter relates to antenna modules, and further relates to antenna modules for millimeter Wave (mm-Wave) applications.

Background

Fifth generation (5G) cellular networks (commonly referred to as 5G NR) are expected to include frequencies in the range of 24.25GHz to 86GHz to be used for mobile devices. For ease of reference, signals transmitted in this range will be referred to as millimeter waves (mm-Wave). It should be appreciated that 5Gmm-Wave can cover frequencies from 30GHz to 300 GHz. Frequency segmentation within mm-Wave frequencies may be handled by a separate Radio Frequency Integrated Circuit (RFIC) and one or more associated antenna modules. Packaging strategies for mm-Wave applications have several problems (not exhaustive):

● The size of the package is specified by the size of the antenna in relation to frequency. The antenna size may be much larger than the RFIC.

● Low temperature co-fired ceramic (LTCC) packages have good electrical properties but are also more expensive than other package options.

● For an on-chip Antenna (AOC) package, the antenna is limited to within the size of the chip, which may limit performance or increase cost if the chip size is increased to accommodate the antenna.

● For fan-out wafer level packages (FOWLP), the antenna modules are aperture or proximity fed, which may limit performance, e.g., with respect to probe feed packages.

● For a Package On Package (POP), the antenna and the chip package are connected using solder balls. Solder balls used to attach packages are co-located (isopic) in size so they limit the spacing between packages. Additionally, large solder balls also have large insertion loss (about 1 dB).

● The use of Flip Chip Ball Grid Array (FCBGA) construction uses a number of additional build layers to achieve the symmetrical structure and required spacing (about 400 μm) between the antenna and ground layers. In order to make the spacing between the antenna and the ground plane larger (about 1mm or more than 1 mm), packages of this type require a large number of build-up layers, which adds cost and manufacturing complexity.

Conventional antenna module structures have thick substrates, low design flexibility, poor design rules, and large form factors, which are various drawbacks for use in mobile devices. Conventional designs are also inflexible in that each new design requires a new die chase. Additionally, conventional designs use high cost low dielectric constant (Dk) materials. In addition, conventional designs using modified semi-additive process (mSAP) substrate technology increase fabrication costs, space, and floor space.

Accordingly, there is a need for systems, devices, and methods that overcome the drawbacks of conventional methods, including the methods, systems, and devices provided herein.

Disclosure of Invention

This summary identifies features of some example aspects and is not an exclusive or exhaustive description of the disclosed subject matter. Whether a feature or aspect is included in or omitted from this summary is not intended to indicate the relative importance of such feature. Additional features and aspects are described, and will become apparent to those skilled in the art upon reading the following detailed description and viewing the accompanying drawings that form a part hereof.

According to various aspects disclosed herein, at least one aspect includes an apparatus comprising a first antenna substrate comprising one or more antennas. The apparatus also includes a metallization structure. The apparatus also includes a first spacer disposed between the first antenna substrate and the metallization structure configured to maintain a constant distance between the first antenna substrate and the metallization structure. The device also includes a first plurality of conductive elements disposed within the first spacer configured to electrically couple the first antenna substrate to the metallization structure. The device further includes wherein the first spacer is configured to surround all of the conductive elements, is electrically coupled to the first antenna substrate, and is configured to form an air gap between the first antenna substrate and the metallization structure. The apparatus further includes wherein the first plurality of conductive elements are separated by air in the air gap.

According to various aspects disclosed herein, at least one aspect includes a method of making an apparatus, including forming a metallization structure. The method of fabrication further includes forming a first spacer on the metallization structure, wherein the first spacer is configured to maintain a constant distance between the first antenna substrate and the metallization structure. The method of fabrication further includes forming a first plurality of conductive elements disposed within the first spacer configured to electrically couple the first antenna substrate to the metallization structure. The method of fabrication further includes attaching a first antenna substrate including one or more antennas to the first spacer and the first plurality of conductive elements. The method of fabrication further includes wherein the first spacer surrounds all of the conductive elements, is electrically coupled to the first antenna substrate, and forms an air gap between the first antenna substrate and the metallization structure. The method of making further includes wherein the first plurality of conductive elements are separated by air in the air gap.

Other features and advantages associated with the devices and methods disclosed herein will be apparent to those skilled in the art based on the drawings and the detailed description.

Drawings

The drawings are presented to aid in describing examples of one or more aspects of the disclosed subject matter and are provided merely for illustration of examples and not limitation thereof.

Fig. 1A illustrates a partial side view of an antenna module in accordance with at least one aspect of the present disclosure.

Fig. 1B illustrates a top view of the antenna module of fig. 1A in accordance with at least one aspect of the present disclosure.

Fig. 1C illustrates a cross-sectional view of an antenna module at line A-A in fig. 1A in accordance with at least one aspect of the present disclosure.

Fig. 1D illustrates a portion of an antenna module with an additional post (post) in accordance with at least one aspect of the present disclosure.

Fig. 2A illustrates a partial side view of an antenna module in accordance with at least one aspect of the present disclosure.

Fig. 2B illustrates a top view of the antenna module of fig. 2A in accordance with at least one aspect of the present disclosure.

Fig. 2C illustrates a cross-sectional view of an antenna module at line A-A in fig. 2A in accordance with at least one aspect of the present disclosure.

Fig. 3A illustrates a partial side view of an antenna module in accordance with at least one aspect of the present disclosure.

Fig. 3B illustrates a top view of the antenna module of fig. 3A in accordance with at least one aspect of the present disclosure.

Fig. 4A illustrates a partial side view of an antenna module in accordance with at least one aspect of the present disclosure.

Fig. 4B illustrates a top view of the antenna module of fig. 4A in accordance with at least one aspect of the present disclosure.

Fig. 5A-5H illustrate different stages of an example process of fabricating an antenna module in accordance with at least one aspect of the present disclosure.

Fig. 6 illustrates a flow chart of a method for manufacturing an antenna module in accordance with at least one aspect of the present disclosure.

Fig. 7 illustrates a mobile device in accordance with at least one aspect of the present disclosure.

Fig. 8 illustrates various electronic devices that may be integrated with any of the foregoing antenna modules in accordance with at least one aspect of the present disclosure.

In accordance with common practice, the features depicted by the drawings may not be drawn to scale. Accordingly, the dimensions of the depicted features may be arbitrarily expanded or reduced for clarity. According to convention, some of the figures are simplified for clarity. Accordingly, the drawings may not depict all of the components of a particular apparatus or method. Furthermore, like reference numerals refer to like features throughout the specification and drawings.

Detailed Description

Various aspects of the disclosure are provided in the following description and related drawings for specific examples of the disclosed subject matter. Alternate aspects may be devised without departing from the scope of the disclosed subject matter.

The word "exemplary" is used herein to mean "serving as an example, instance, or illustration. Any aspect described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. Likewise, the term "aspects" does not mean that all aspects of the disclosed subject matter include the discussed feature, advantage, or mode of operation.

The terminology used herein is for the purpose of describing particular examples only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," and/or "including," when used herein, specify the presence of stated features, integers, processes, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, processes, operations, elements, components, and/or groups thereof.

The various aspects disclosed herein allow for various improvements to conventional designs, such as faster manufacturing and assembly times and reduced complexity due to partial molding. Further, overall materials and manufacturing costs are reduced. The various aspects disclosed herein also provide better shielding for active components and metallization layers, such as Redistribution (RDL) layers and the like. The overall thickness of the module is also reduced, which is a positive feature in smart phones and other mobile devices. Various aspects are disclosed including an air cavity in an antenna layer that improves loss, efficiency, frequency bandwidth, and manufacturing tolerances. Further, the extra substrate layer is eliminated in the antenna section used for conventional design to meet the symmetrical stack.

Fig. 1A illustrates a partial side view of an antenna module 100 according to some examples of the present disclosure. As shown in fig. 1A, the antenna module 100 may include an antenna substrate 110, a metallization structure 130 (e.g., RDL), which may include a plurality of metal layers separated by insulating layers, wherein a portion of the metal layers are coupled to adjacent metal layers by vias. The antenna substrate 110 may be formed of any organic dielectric material, such as Bismaleimide Triazine (BT) or epoxy glass (FR-4). However, it will be appreciated that the antenna substrate 110 is not limited to these examples. The spacer 120 is disposed between the antenna substrate 110 and the metallization structure 130. The spacer 120 is configured to maintain a constant distance 125 between the antenna substrate 110 and the metallization structure 130. In alternative aspects, the spacers 120 may be formed of a non-conductive material. However, in alternative aspects, the spacer 120 may be formed of a conductive material, such as a Al, cu, ag, au coated surface, and the surface may be coated by sputtering, plating, spraying, or any other coating technique. In some aspects, the spacer 120 may electrically couple the antenna substrate 110 to ground. A plurality of conductive elements 122 are disposed within the spacer 120. Conductive element 122 (e.g., a post, rod, etc.) is configured to electrically couple antenna substrate 110 to metallization structure 130, and in some aspects may be directly coupled to antennas 112, 114, 116, and 118, as illustrated. The conductive element 122 may be formed of any highly conductive material, such as copper (Cu), aluminum (Al), silver (Ag), gold (Au), or other conductive material, alloy, or combinations thereof. The plurality of conductive elements 122 are separated by air in the air gap 121, the air gap 121 being formed by air trapped within the spacer 120. The spacers may be formed by printing, lamination, and/or photolithographic processes. It will be appreciated that these techniques allow for the establishment of a precise height of the spacers 120, which in turn allows for precise control of the constant distance 125. It will be appreciated that the shape and height of the spacers 120 may be controlled by a printing process or dispensing process (dispensing process). It will be appreciated that the air trapped in the air gap 121 has a Dk of 1.0, which when combined with the constant distance 125, allows for precise tuning of the antenna module 100.

The antenna module 100 of fig. 1A may also include at least one electrical component coupled to the metallization structure 130. For example, as illustrated, the at least one electrical component may include one or more passive components 142 and 148, a Radio Frequency Integrated Circuit (RFIC) die 144; a Power Amplifier (PA) die 146; and a power supply component 150 (e.g., a Power Management Integrated Circuit (PMIC), etc.); each electrically coupled to the metallization structure 130 on a side opposite the antenna substrate 110. Each of these electrical components (e.g., passive components 142 and 148, RFIC die 144, PA die 146, power supply component 150) are shown encapsulated in a molding compound 160. In other aspects, the molding compound may be omitted. Further, an electromagnetic interference (EMI) shield 165 is provided that at least partially encloses the molding compound 160 and components encapsulated in the molding compound 160 (e.g., passive components 142 and 148, RFIC die 144, PA die 146, power supply component 150) and the metallization structure 130. In other aspects, the EMI shield may be omitted. In some aspects, the EMI shield 165 may be coupled to the spacer 120 (e.g., when formed of a conductive material), and both may be coupled to ground. A connection pad 170 may also be provided that is electrically coupled to the metallization structure 130 on the same side as the antenna substrate 110.

Fig. 1B illustrates a top view of an antenna module 100 according to some examples of the present disclosure. As discussed above, the antenna module 100 includes an antenna substrate 110 and a metallization structure 130 (note: a top passivation/insulating layer is illustrated). Antennas 112, 114, 116, and 118 may be formed as patch antennas or any suitable antenna type. Additionally, antennas 112, 114, 116, and 118 may be formed as part of an antenna array, such as a 4 by x array, where x may be any integer greater than zero. Antennas 112, 114, 116, and 118 may be formed of any highly conductive material, such as copper (Cu), aluminum (Al), silver (Ag), gold (Au), or other conductive materials, alloys, or combinations thereof. Further, as illustrated in the top view, the connection pads 170 may be formed as a plurality of pads or any suitable configuration for coupling to external devices, components, circuits, etc. It will be appreciated that the foregoing illustrations are provided merely to assist in explaining the various aspects disclosed, and should not be construed as limiting the various aspects disclosed. For example, although not explicitly illustrated, the antennas may be more or less than 4, and may be configured in an interleaved or other non-linear configuration. Likewise, the connection pads may have more pads, fewer pads, or the pads may be arranged in a different configuration (e.g., more or less than two rows, non-linearities, etc.) than illustrated.

Fig. 1C illustrates a cross-sectional view of an antenna module 100 at line A-A in fig. 1A, according to some examples of the present disclosure. As discussed above, the antenna module 100 includes an antenna substrate 110, a metallization structure 130 (note: top passivation/insulation layer is illustrated), and a connection pad 170. The spacer 120 encloses all conductive elements 122 coupled to the antenna substrate 110 (not visible). The spacer 120 completely encloses the conductive elements 122 forming the air gap, and the conductive elements 122 are separated from each other by air trapped in the air gap. In some aspects, the spacer 120 may be a continuous sidewall of constant height that forms a closed loop and defines an open space therein. Additionally, it will be appreciated that there will be at least one conductive element per antenna based on the number of frequency bands and polarizations covered, and that there may be multiple conductive elements per antenna (e.g., 4 as illustrated). In some aspects, one conductive element may be used for one polarization and one band configuration. For dual polarized, dual band configuration, 4 elements may be used. In other aspects, as illustrated in fig. 1D, conductive posts may be provided in the middle of the patch to improve performance. According to some aspects of the present disclosure, antennas 112, 114, 116, and 118 may be formed as patch antennas that include conductive posts 113, 115, 117, and 119, respectively. The conductive pillars 113, 115, 117, and 119 may be formed of any highly conductive material, such as copper (Cu), aluminum (Al), silver (Ag), gold (Au), or other conductive material, alloy, or combinations thereof. It will be appreciated that the foregoing illustrations are provided merely to assist in explaining the various aspects disclosed, and should not be construed as limiting the various aspects disclosed. For example, although not explicitly illustrated, there may be more or less than 4 conductive elements per antenna, as discussed above. Further, the spacers 120 are not limited to the illustrated generally rectangular shape, but rather the spacers 120 may take any shape that may encompass the conductive elements 122.

Fig. 2A illustrates a partial side view of an antenna module 200 according to some examples of the present disclosure. As shown in fig. 2A, the antenna module 200 may include a plurality of antenna substrates 210, a metallization structure 230, and the metallization structure 230 may include a plurality of metal layers separated by insulating layers, wherein portions of the metal layers are coupled to adjacent metal layers by vias. A plurality of spacers 220 are disposed between the plurality of antenna substrates 210 and the metallization structure 230. The plurality of spacers 220 are each configured to maintain a constant distance between each antenna substrate 210 of the plurality of antenna substrates 210 and the metallization structure 230. In some aspects, the plurality of spacers 220 may each be configured to maintain the same constant distance, and in other aspects, at least one of the plurality of spacers 220 may be configured to maintain a different constant distance from at least one other of the plurality of spacers. In some aspects, the plurality of spacers 220 may be formed of a non-conductive material. However, in alternative aspects, the plurality of spacers 220 may be formed of a conductive material and may be used to electrically couple the plurality of antenna substrates 210 to ground. Further, in some aspects, the plurality of spacers 220 may include at least one spacer formed of a conductive material and at least one spacer formed of a non-conductive material. Conductive elements 222, 224, 226, and 228 (e.g., posts, rods, etc.) are configured to electrically couple each antenna substrate 210 of the plurality of antenna substrates 210 to the metallization structure 130, and in some aspects, may be directly coupled to antennas in each of the antenna substrates. For example, the plurality of spacers 220 may include a first spacer 221, a second spacer 223, a third spacer 225, and a fourth spacer 227. The plurality of conductive elements may include a first set of conductive elements 222, a second set of conductive elements 224, a third set of conductive elements 226, and a fourth set of conductive elements 228, wherein individual conductive elements in each set of conductive elements 222, 224, 226, and 228 are separated by air in an air gap formed by air trapped within associated ones of the plurality of spacers 220 (e.g., 221, 223, 225, and 227). Each set of conductive elements 222, 224, 226, and 228 may include one or more conductive elements. The plurality of spacers 220 may be formed by printing, lamination, and/or photolithographic processing. It will be appreciated that these techniques allow for the establishment of a precise height of the plurality of spacers 220, which in turn allows for precise control of a constant distance between the plurality of antenna substrates 210 and the metallization structure 230. For example, the first spacer 221 establishes a first constant distance between the first antenna substrate 211 and the metallization structure 230. The second spacer 223 establishes a second constant distance between the second antenna substrate 213 and the metallization structure 230. The third spacer 225 establishes a third constant distance between the third antenna substrate 215 and the metallization structure 230. The fourth spacer 227 establishes a fourth constant distance between the fourth antenna substrate 217 and the metallization structure 230. In some aspects, the first constant distance, the second constant distance, the third constant distance, and the fourth constant distance may all be the same. In other aspects, at least one of the first constant distance, the second constant distance, the third constant distance, and the fourth constant distance may be different from at least another one of the constant distances.

The antenna module 200 of fig. 2A may also include at least one electrical component coupled to the metallization structure 230. For example, as illustrated, the at least one electrical component may include one or more passive components 242 and 248, a Radio Frequency Integrated Circuit (RFIC) die 244; a Power Amplifier (PA) die 246; and a power supply component 250 (e.g., a Power Management Integrated Circuit (PMIC), etc.); each electrically coupled to the metallization structure 230 on a side opposite the plurality of antenna substrates 210. Each of these electrical components (e.g., passive components 242 and 248, RFIC die 244, PA die 246, power supply component 250) are encapsulated in a molding compound 260. Furthermore, an electromagnetic interference (EMI) shield 265 is provided, the EMI shield 265 at least partially surrounding the molding compound 260 and components (e.g., passive components 242 and 248, RFIC die 244, PA die 246, power supply component 250) and metallization structure 230 encapsulated in the molding compound 260. In other aspects, the molding compound 260 and/or the EMI shield 265 may be omitted. In some aspects, the EMI shield 265 may be coupled to at least one of the plurality of spacers 220 (e.g., when formed of a conductive material), and both may be coupled to ground. Connection pads 270 may also be provided, the connection pads 270 being electrically coupled to the metallization structure 130 on the same side as the plurality of antenna substrates 210.

Fig. 2B illustrates a top view of an antenna module 200 according to some examples of the present disclosure. As discussed above, the antenna module 200 includes a plurality of antenna substrates 210 and metallization structures 230 (note: top passivation/insulation layers are illustrated). Each antenna substrate 210 of the plurality of antenna substrates 210 may include one or more antennas. For example, each of the antenna substrates 211, 213, 215, and 217 may each include an antenna 212, 214, 216, and 218, respectively. Antennas 212, 214, 216, and 218 may be formed as patch antennas or any suitable antenna type. Additionally, antennas 212, 214, 216, and 218 may be formed as part of an antenna array, such as a 4 by x array, where x may be any integer greater than or equal to 1. Antennas 212, 214, 216, and 218 may be formed of any highly conductive material, such as copper (Cu), aluminum (Al), silver (Ag), gold (Au), or other conductive materials, alloys, or combinations thereof. Further, as illustrated in the top view, the connection pads 270 may be formed as a plurality of pads or any suitable configuration for coupling to external devices, components, circuitry, etc. It will be appreciated that the foregoing illustrations are provided merely to assist in explaining the various aspects disclosed, and should not be construed as limiting the various aspects disclosed. For example, although not explicitly illustrated, there may be more or less than four antenna substrates, and each antenna substrate may have more than one antenna. The antenna substrate and/or the antennas may be configured in a staggered or other non-linear configuration. Likewise, the connection pads may have more pads, fewer pads, or the pads may be arranged in a different configuration (e.g., more or less than two rows, non-linearities, etc.) than that illustrated.

Fig. 2C illustrates a cross-sectional view of the antenna module 200 at line A-A in fig. 2A, according to some examples of the present disclosure. As discussed above, the antenna module 200 includes a metallization structure 230 (note: top passivation/insulating layer is illustrated) and connection pads 270. A plurality of spacers 220 surrounds each of the associated sets of conductive elements coupled to an associated plurality of antenna substrates (not shown). For example, the first spacer 221 surrounds the first set of conductive elements 222. The second spacer 223 surrounds the second set of conductive elements 224. Third spacer 225 surrounds third set of conductive elements 226. Fourth spacer 227 surrounds fourth set 224 of conductive elements. The individual conductive elements in each conductive element set 222, 224, 226, and 228 are separated by air in an air gap formed by air trapped within the associated spacer 221, 223, 225, and 227, respectively, of the plurality of spacers 220. Additionally, it will be appreciated that there will be at least one conductive element per antenna based on the number of frequency bands and polarizations covered, and that there may be multiple conductive elements per antenna (e.g., 4 as illustrated). It will be appreciated that the foregoing illustrations are provided merely to assist in explaining the various aspects disclosed, and should not be construed as limiting the various aspects disclosed. For example, although not explicitly illustrated, there may be more or less than 4 conductive elements per antenna. Further, the plurality of spacers may each have the same or different shapes, and the plurality of spacers are not limited to the illustrated substantially rectangular shape.

Fig. 3A illustrates a partial side view of an antenna module 300 in accordance with at least one aspect of the present disclosure. As shown in fig. 3A, the antenna module 300 may include a plurality of antenna substrates 311, 313, and 315, a metallization structure 330, and the metallization structure 330 may include a plurality of metal layers separated by insulating layers, wherein portions of the metal layers are coupled to adjacent metal layers by vias. The first spacer 321 is disposed between the first antenna substrate 311 and the metallization structure 330. The first spacer 321 is configured to maintain a first constant distance between the first antenna substrate 311 and the metallization structure 330. In some aspects, the first spacer 321 may be formed of a non-conductive material. However, in alternative aspects, the first spacer 321 may be formed of a conductive material and may be used to electrically couple the first antenna substrate 311 to ground. A first plurality of conductive elements 322 is disposed within the first spacer 321. A first plurality of conductive elements 322 (e.g., posts, rods, etc.) is configured to electrically couple the first antenna substrate 311 to the metallization structure 330. The first plurality of conductive elements 322 may also include one or more through conductive elements configured to electrically couple signals passing through the first antenna substrate 311 (e.g., from a higher row substrate) to the metallization structure 330.

The second antenna substrate 313 may include one or more antennas. The second spacer 323 is disposed between the second antenna substrate 313 and the first antenna substrate 311. The second spacer 323 is configured to maintain a second constant distance between the second antenna substrate 313 and the first antenna substrate 311. The second spacer 323 is configured to enclose all of the second plurality of conductive elements 324 electrically coupled to the second antenna substrate 313. A second plurality of conductive elements 324 is disposed within the second spacer 323. The second plurality of conductive elements 324 electrically couple the second antenna substrate 313 to the first antenna substrate 311. Further, it will be appreciated that at least some of the second plurality of conductive elements 324 electrically couple the second antenna substrate 313 to the metallization structure 330 through the first antenna module 311 and one or more of the first plurality of conductive elements 322. Further, the second plurality of conductive elements 324 may also include one or more through conductive elements.

The third antenna substrate 315 may include one or more antennas. The third spacer 325 is disposed between the third antenna substrate 315 and the second antenna substrate 313. The third spacer 325 is configured to maintain a third constant distance between the third antenna substrate 315 and the second antenna substrate 313. The third spacer 323 is configured to surround all of the third plurality of conductive elements 326 electrically coupled to the third antenna substrate 315. The third plurality of conductive elements 326 electrically couple the third antenna substrate 315 to the second antenna substrate 313. Further, it will be appreciated that at least some of the third plurality of conductive elements 326 electrically couple the third antenna substrate 315 to the metallization structure 330 through one or more of the second antenna module 311 and the second plurality of conductive elements 324, which then pass through the first antenna module 311, and one or more of the first plurality of conductive elements 322 electrically couple to the metallization structure 330.

In some aspects, the first spacer 321, the second spacer 323, and the third spacer 325 may each be configured to maintain the same constant distance. In other aspects, at least one of the first spacer 321, the second spacer 323, and the third spacer 325 may be configured to maintain a different constant distance from at least one other spacer. In some aspects, the first spacer 321, the second spacer 323, and/or the third spacer 325 may be formed of a non-conductive material. However, in alternative aspects, the first spacer 321, the second spacer 323, and/or the third spacer 325 may be formed of a conductive material, and may be used to electrically couple one or more of the antenna substrates 311, 313, and 315 to ground. Further, in some aspects, the spacers 321, 323, and 325 may include at least one spacer formed of a conductive material and at least one spacer formed of a non-conductive material. The spacers 321, 323, and 325 may be formed by printing, laminating, and/or photolithographic processes. Conductive elements 322, 324, and 326 (e.g., posts, rods, etc.) are configured to electrically couple each of antenna substrates 311, 313, and 315, respectively, to metallization structure 330. Each of the plurality of conductive elements 322, 324, and 326 may include at least one set of conductive elements for each antenna (not shown) in an antenna substrate (e.g., first antenna substrate 311). Further, some of the plurality of conductive elements (e.g., 322 and 324) may include at least one set of through conductive elements for each antenna (not shown) in any subsequent antenna substrate through which signals pass. For example, for each antenna in the second antenna substrate 313 and for each antenna in the third antenna substrate 315, the first plurality of conductive elements will have at least one set of through conductive elements, as these substrates all have a connection through the first antenna substrate 311 to the metallization structure 330. Thus, if each antenna substrate 311, 313, and 315 has 4 antennas, at least 8 sets of through conductive elements will be included in the first plurality of conductive elements 322 and at least 4 sets of conductive elements are coupled to 4 antennas in the first antenna substrate. Further, at least 4 sets of through conductive elements will be included in the second plurality of conductive elements 324, and at least 4 sets of conductive elements are coupled to 4 antennas in the second antenna substrate 313. Finally, the third plurality of conductive elements 326 would include at least 4 sets of conductive elements coupled to 4 antennas in the third antenna substrate 315. It will be appreciated that each set of conductive elements may have one or more conductive elements. Each of the plurality of conductive elements 322, 324, and 326 is air-separated in an air gap formed by air trapped within spacers 321, 323, and 327, respectively. It will be appreciated that the spacers 321, 323 and 327 allow for establishing a precise height, which in turn allows for precise control of a constant distance between the antenna substrates 311, 313 and 315 and the metallization structure 330.

The antenna module 300 of fig. 3A may also include at least one electrical component coupled to the metallization structure 330. For example, as illustrated, the at least one electrical component may include one or more passive components 342 and 348, a Radio Frequency Integrated Circuit (RFIC) die 344; a Power Amplifier (PA) die 346; and a power supply component 350 (e.g., a Power Management Integrated Circuit (PMIC), etc.); each electrically coupled to the metallization structure 330 on a side opposite the plurality of antenna substrates 310. Each of these electrical components (e.g., passive components 342 and 348, RFIC die 344, PA die 346, power supply component 350) are encapsulated in a molding compound 360. Furthermore, an electromagnetic interference (EMI) shield 365 is provided, the EMI shield 365 at least partially surrounding the molding compound 360 and components (e.g., passive components 342 and 348, RFIC die 344, PA die 346, power supply component 350) and metallization structure 330 encapsulated in the molding compound 360. In some aspects, the molding compound 360 and/or the EMI shield 365 may be omitted. In some aspects, the EMI shield 365 may be electrically coupled to at least one of the spacers 321, 323, and/or 325 (e.g., when formed of a conductive material), and may also be coupled to ground. Connection pads 370 may also be provided that are electrically coupled to the metallization structure 330 on the same side as the antenna substrates 311, 313, and 315. It will be appreciated that multiple stacks of antenna substrates allow more air cavities to be created and the antennas to be configured to various frequency ranges.

Fig. 3B illustrates a top view of an antenna module 300 in accordance with at least one aspect of the present disclosure. As discussed above, the antenna module 300 includes a plurality of antenna substrates including a third antenna substrate 315, which is the topmost antenna substrate and is visible in a top view. The antenna module 300 includes a metallization structure 330 (note: a top passivation/insulating layer is illustrated). The third antenna substrate 315 may include one or more antennas. For example, the third antenna substrate 315 may include antennas 312, 314, 316, and 318. Antennas 312, 314, 316, and 318 may be formed as patch antennas or any suitable antenna type. Additionally, antennas 312, 314, 316, and 318 may be formed as part of an antenna array, such as a 4 by x array, where x may be any integer greater than or equal to 1. Antennas 312, 314, 316, and 318 may be formed of any highly conductive material, such as copper (Cu), aluminum (Al), silver (Ag), gold (Au), or other conductive materials, alloys, or combinations thereof. Further, as illustrated in the top view, the connection pads 370 may be formed as a plurality of pads or any suitable configuration for coupling to external devices, components, circuitry, etc. It will be appreciated that the foregoing illustrations are provided merely to assist in explaining the various aspects disclosed, and should not be construed as limiting the various aspects disclosed. For example, although not explicitly illustrated, there may be more or less than 4 antennas per antenna substrate. The antenna substrate and/or the antennas may be configured in a staggered or other non-linear configuration. Likewise, the connection pads may have more pads, fewer pads, or the pads may be arranged in a different configuration (e.g., more or less than two rows, non-linearities, etc.) than illustrated.

Fig. 4A illustrates a partial side view of an antenna module 400 in accordance with at least one aspect of the present disclosure. As shown in fig. 4A, the antenna module 400 may include a metallization structure 430, which metallization structure 430 may include a plurality of metal layers separated by insulating layers, wherein portions of the metal layers are coupled to adjacent metal layers by vias. The antenna module 400 also includes a plurality of antenna substrates 410, and the antenna substrates 410 may be arranged in one or more rows 480 and one or more columns 490. In the illustrated configuration, three rows 480 and four columns are provided to form a three row by four column grouping of antenna substrates 410. In the following description, since many individual elements have been previously discussed (e.g., antenna substrate, spacer, conductive element, etc.), details of each of these elements are not provided herein. For example, the first antenna substrate 411, the second antenna substrate 413, and the third antenna substrate 415 are arranged in a single column (similar to that described with respect to fig. 3A). The first antenna substrate 411 is located in a first row 481, the second antenna substrate 413 is located in a second row 481, and the third antenna substrate 415 is located in a third row 483. The first row 481 is located between the second row 482 and the metallization structure 430, and the second row 482 is located between the third row 483 and the first column 481. A plurality of additional antenna substrates 410 are provided, each additional antenna substrate including one or more antennas (not shown). Further, each additional antenna substrate has an associated spacer 422 and one or more associated conductive elements 422. Each associated spacer 422 is disposed below an associated antenna substrate 410, and each conductive element 422 of the one or more associated conductive elements 422 is disposed within each associated spacer 422. One or more associated conductive elements 422 are configured to electrically couple each of the additional antenna substrates 410 to another antenna substrate 410 or the metallization structure 430. A plurality of additional antenna substrates 410 and associated spacers 420 and one or more associated conductive elements 422 are arranged in one or more additional columns or rows. As illustrated, the plurality of additional antenna substrates 410 and associated spacers 420 and the one or more associated conductive elements 422 are arranged in three additional columns 492, 493, and 494 (except column 491 which contains first antenna substrate 411, second antenna substrate 413, and third antenna substrate 415). Each of the additional columns 492, 493, and 494 has an antenna substrate 410 in each of the first, second, and third rows 481, 483 to form a three by four column grouping of antenna substrates 410.

If the antenna substrates are located in the first row 481, a plurality of spacers 420 may be disposed below the plurality of antenna substrates 410 to maintain a constant distance between each antenna substrate or metallization structure 430. In some aspects, the plurality of spacers 420 may each be configured to maintain the same constant distance. In other aspects, at least one of the plurality of spacers 420 may be configured to maintain a different constant distance from at least one other of the plurality of spacers 420. For example, the first spacer 421 may be disposed between the first antenna substrate 411 and the metallization structure 430 in the first row 481. The second spacers 423 may be disposed between the second antenna substrate 413 located in the second row 482 and the first antenna substrate 411 located in the first row 481. The third spacer 425 may be disposed between the third antenna substrate 415 in the third row 483 and the second antenna substrate 413 in the second row 482. Each spacer 420 (e.g., 421, 423, and 425) is configured to maintain a constant distance between the associated substrate (e.g., 411, 413, and 415) and the lower row antenna substrate (e.g., 411 and 413) or metallization structure 430 if the antenna substrate (e.g., 411) is located in the first row 481. In some aspects, one or more spacers 420 may be formed of a non-conductive material. Further, one or more spacers 420 may be formed of a conductive material and may be used to electrically couple an associated antenna substrate to ground. Each spacer 420 has a plurality of conductive elements 422, the conductive elements 422 being disposed within each spacer 420. The conductive element 422 may be a conductive post, a conductive rod, or the like. The conductive elements 422 may also include one or more through conductive elements configured to electrically couple signals from the upper row substrate (e.g., 413 and 415) through the lower row antenna substrate (e.g., 411) to the metallization structure 430. Further, each conductive element 422 of the plurality of conductive elements 422 may include at least one set of through conductive elements for each antenna (not shown) in any subsequent antenna substrate of the substrate through which signals pass, as previously discussed.

The antenna module 400 of fig. 4A may also include at least one electrical component coupled to the metallization structure 430. For example, as illustrated, the at least one electrical component may include one or more passive components 442 and 448, a Radio Frequency Integrated Circuit (RFIC) die 444; a Power Amplifier (PA) die 446; and a power supply component 450 (e.g., a Power Management Integrated Circuit (PMIC), etc.); each electrically coupled to the metallization structure 430 on a side opposite the plurality of antenna substrates 410. Each of these electrical components (e.g., passive components 442 and 448, RFIC die 444, PA die 446, power supply component 450) are encapsulated in a molding compound 460. Furthermore, an electromagnetic interference (EMI) shield 465 is provided, the EMI shield 465 at least partially surrounding the molding compound 460 and components (e.g., passive components 442 and 448, RFIC die 444, PA die 446, power supply component 450) and metallization structure 430 encapsulated in the molding compound 460. In other aspects, the molding compound 460 and/or the EMI shield 465 may be omitted. In some aspects, EMI shield 465 may be electrically coupled to at least one of spacers 421, 423, and/or 425 (e.g., when formed of a conductive material), and may also be coupled to ground. Connection pads 470 may also be provided that are electrically coupled to the metallization structure 430 on the same side as the antenna substrates 411, 413, and 415.

Fig. 4B illustrates a top view of an antenna module 400 in accordance with at least one aspect of the present disclosure. As discussed above, the antenna module 400 includes a plurality of antenna substrates 410, the plurality of antenna substrates 410 including a third row 483 of antenna substrates 410, the third row 483 being a top row of antenna substrates 410 and being visible in a top view. Metallization structure 430 is illustrated (top layer is visible). The antenna substrate 410 may include one or more antennas. For example, each antenna substrate 410 in third row 483 of antenna substrates 410 in columns 491, 492, 493, and 494 may include one antenna, i.e., antenna 412, antenna 414, antenna 416, and antenna 418, respectively. Antennas 412, 414, 416, and 418 may be formed as patch antennas or any suitable antenna type. Antennas 412, 414, 416, and 418 may be formed of any highly conductive material, such as copper (Cu), aluminum (Al), silver (Ag), gold (Au), or other conductive materials, alloys, or combinations thereof. Further, as illustrated in the top view, the connection pads 470 may be formed as a plurality of pads or any suitable configuration for coupling to external devices, components, circuitry, etc. It will be appreciated that the foregoing illustrations are provided merely to assist in explaining the various aspects disclosed, and should not be construed as limiting the various aspects disclosed. For example, although not explicitly illustrated, there may be more or less than 1 antenna per antenna substrate. The antenna substrates and/or antennas may be configured in an interleaved or other non-linear configuration, and each column (e.g., 491, 492, 493, and 494) may not have antenna substrates in all rows.

To fully illustrate the various aspects of the disclosure, a method of fabrication is presented. Other fabrication methods are possible and only the fabrication methods discussed are presented to aid in understanding the concepts disclosed herein and are not intended to limit the various aspects disclosed or claimed.

Fig. 5A illustrates a portion of a fabrication process of an antenna module according to some examples of the present disclosure. As shown in fig. 5A, the process may begin with an adhesive layer 502 (which may be tape, coating, etc.) being applied to a carrier 501 to facilitate fabrication.

Fig. 5B illustrates yet another portion of a fabrication process of an antenna module 500 according to some examples of the present disclosure. The process may continue with at least one electrical component attached to the adhesive layer 502. For example, as illustrated, the at least one electrical component may include one or more passive components 542 and 548, a Radio Frequency Integrated Circuit (RFIC) die 544; a Power Amplifier (PA) die 546; and a power supply component 550 (e.g., a Power Management Integrated Circuit (PMIC), etc.). Passive components 542 and 548, RFIC die 544, PA die 546, power supply component 550 may be placed in specific locations for future processing. It will be appreciated that the functionality of each of the illustrated electrical components (e.g., passive components 542 and 548, RFIC die 544, PA die 546, power supply component 550) may be integrated into one or more combined components or may be further divided among multiple components. Accordingly, it will be understood that the foregoing illustrated aspects are provided as examples only and should not be used to limit the disclosed aspects to the illustrated components or arrangements.

Fig. 5C illustrates yet another portion of a fabrication process of an antenna module 500 according to some examples of the present disclosure. This process may continue with carrier 501 having adhesive layer 502 with at least one electrical component (e.g., passive components 542 and 548, RFIC die 544, PA die 546, and power supply component 550) attached. During this portion of the manufacturing process, passive components 542 and 548, RFIC die 544, PA die 546, and power supply component 550 are encapsulated in a molding compound 560 to provide support and insulation for the electrical components.

Fig. 5D illustrates yet another portion of a fabrication process of an antenna module 500 according to some examples of the present disclosure. The process may continue with the carrier having the adhesive layer removed. The metallization structure 530 is built up as a series of insulating and metal layers, with vias connecting the various metal layers to form conductive paths for coupling to passive components 542 and 548, RFIC die 544, PA die 546, and power supply component 550. The insulating layer of metallization structure 530 may be an interlayer dielectric (ILD) layer. The insulating layer may be formed of Polyimide (PI), benzocyclobutene (BCB), polybenzoxazole (PBO), acrylic, epoxy, and/or any other suitable material. These materials are provided as illustrative, non-limiting examples. In some embodiments, different insulating layers may be formed of different materials. The metal layer and the vias may be formed of any highly conductive material, such as copper (Cu), aluminum (Al), silver (Ag), gold (Au), or other conductive materials, alloys, or combinations thereof.

Fig. 5E illustrates yet another portion of a fabrication process of an antenna module 500 according to some examples of the present disclosure. This process may continue with the metallization structure 530 being formed and coupled to the passive components 542 and 548, the RFIC die 544, the PA die 546, and the power supply component 550, with the passive components 542 and 548, the RFIC die 544, the PA die 546, and the power supply component 550 encapsulated in the molding compound 560. During this portion of the fabrication process, spacers 520 are formed on metallization structure 530. In some aspects, the spacers 520 may be formed by printing continuous sidewalls of constant height that form a loop such that an open space is defined therein. The spacers 520 may be formed by a printing, laminating, or photolithography process. These processes allow the spacers 520 to be formed to a precise height, which allows a precise air gap to be formed under the antenna substrate.

Fig. 5F illustrates yet another portion of a fabrication process of an antenna module 500 according to some examples of the present disclosure. The process may continue with spacers 520 formed on metallization structure 530. The metallization structure 530 is electrically coupled to passive components 542 and 548, an RFIC die 544, a PA die 546, and a power supply component 550, which are encapsulated in a molding compound 560. During this portion of the manufacturing process, a plurality of conductive elements 522 are formed. A plurality of conductive elements 522 are disposed within the spacer 520. The conductive elements 522 may be formed as posts, rods, or the like by sputtering, photolithography, or any suitable process. In some aspects, the pre-fabricated pillars may be used or formed by Cu pillar plating. In some aspects, the photolithographic process may include patterning a seed layer deposited by sputtering, electroplating, or paste filling. The conductive elements will be placed in specific locations to be in a position to electrically couple the antenna substrate (not shown) to the metallization structure 530. The conductive element 522 may be formed of any highly conductive material, such as copper (Cu), aluminum (Al), silver (Ag), gold (Au), or other conductive material, alloy, or combinations thereof.

Fig. 5G illustrates yet another portion of a fabrication process of an antenna module 500 according to some examples of the present disclosure. This process may continue with a plurality of conductive elements 522 formed within the spacer 520. Spacers 520 may be formed on metallization structure 530. The metallization structure 530 is electrically coupled to passive components 542 and 548, an RFIC die 544, a PA die 546, and a power supply component 550, which are encapsulated in a molding compound 560. During this portion of the manufacturing process, the plurality of conductive elements 522 and spacers 520 are planarized and lowered to a specified height. For example, using a back grinding process, the heights of the plurality of conductive elements 522 and spacers 520 may be precisely set, which in turn sets the air gap. Likewise, a back grinding process may be used to ensure a flat surface on the top, exposed portions of the plurality of conductive elements 522 and spacers 520 to facilitate coupling to an antenna substrate (not shown).

Fig. 5H illustrates yet another portion of a fabrication process of an antenna module 500 according to some examples of the present disclosure. This process may continue with a plurality of conductive elements 522 formed within the spacer 520. Both the spacer 520 and the plurality of conductive elements 522 are grounded to a specified height. Spacers 520 may be formed on metallization structure 530. The metallization structure 530 is electrically coupled to passive components 542 and 548, an RFIC die 544, a PA die 546, and a power supply component 550, which are encapsulated in a molding compound 560. During this portion of the fabrication process, the antenna substrate 510 may be coupled to a plurality of conductive elements 522 and spacers 520. Additionally, an EMI shield may be formed over at least a portion of the mold 560 and metallization structure 530. Finally, contact pads may be formed on the metallization structure 530 to allow coupling to external circuits, components, devices, etc.

According to various aspects disclosed herein, at least one aspect includes a device (e.g., an antenna module (e.g., 100, 200, 300, 400, and 500) alone or integrated into another device), comprising: a first antenna substrate (e.g., 110, 210, 310, 311 410, 411, 510, etc.) comprising one or more antennas (e.g., 112, 114, 116, 118, 212, 214, 216, 218, etc.). The apparatus also includes metallization structures (e.g., 130, 230, 330, 430, and 530). The apparatus also includes a first spacer (e.g., 120, 220, 221, 320, 321, 420, 421, 520, etc.) disposed between the first antenna substrate and the metallization structure and configured to maintain a constant distance between the first antenna substrate and the metallization structure. The device also includes a first plurality of conductive elements (e.g., 122, 222, 322, 422, 522, etc.) disposed within the first spacer and configured to electrically couple the first antenna substrate to the metallization structure. The first spacer is configured to surround all of the conductive elements, is electrically coupled to the first antenna substrate, and is configured to form an air gap between the first antenna substrate and the metallization structure, wherein the first plurality of conductive elements are separated by air in the air gap.

As will be appreciated from the disclosure herein, various technical advantages are provided by the various aspects disclosed. In at least some aspects, the spacer that completely surrounds the plurality of electrical contacts provides a precisely positioned height and forms an air gap under the antenna substrate, which provides a Dk of 1.0 and improves loss, efficiency, and frequency bandwidth. Furthermore, the spacers formed directly on the metallization structure provide faster manufacturing and assembly times, eliminate complexity of partial molding, and reduce overall material and manufacturing costs, including eliminating additional substrate layers in the antenna portion, which are typically used to meet symmetrical stacks. The metallization structure (e.g., RDL layer) provides a thinner structure and improved design rules for the antenna module.

In other aspects, by positioning passive and active components (e.g., RFICs, PAs, etc.) on the side of the metallization structure opposite the antenna module, the overall thickness may be reduced. Furthermore, the antenna module is a fully functional device, since it comprises an RFIC, a PA, a power supply and passive components, compared to conventional solutions which may only comprise an antenna module and some passive components. The optional EMI shield allows for improved shielding in the antenna module (e.g., active and passive components are shielded and portions of the metallization structure are also shielded) compared to conventionally designed partial shield structures. In other aspects, an antenna module including multiple antenna substrates allows each antenna substrate and/or antenna to be configured for a different frequency. Additionally, by locating the connection pads on top of the metallization structure (as opposed to the active component), a more compact connection interface is provided, which is an improvement over conventional Ball Grid Array (BGA) balls connected to a Printed Circuit Board (PCB).

Other technical advantages will be recognized from the various aspects disclosed herein, and these technical advantages are provided as examples only and should not be construed as limiting any of the various aspects disclosed herein.

As will be appreciated from the foregoing, there are various methods for making devices that include the antenna modules disclosed herein. Fig. 6 illustrates a flow chart of a method 600 for fabricating an antenna module in accordance with at least one aspect of the disclosure. In block 610, the fabrication process may include forming a metallization structure. In block 620, the fabrication process may further include forming a first spacer on the metallization structure, wherein the first spacer is configured to maintain a constant distance between the first antenna substrate and the metallization structure. In block 630, the fabrication process may further include forming a first plurality of conductive elements disposed within the first spacer and configured to electrically couple the first antenna substrate to the metallization structure. In block 640, the fabrication process may further include attaching a first antenna substrate including one or more antennas to the first spacer and the first plurality of conductive elements, wherein the first spacer is configured to enclose all of the conductive elements, is electrically coupled to the first antenna substrate, and is configured to form an air gap between the first antenna substrate and the metallization structure, and wherein the first plurality of conductive elements are separated by air in the air gap. It will be appreciated from the foregoing disclosure that additional processes for making the various aspects disclosed herein will be apparent to those skilled in the art and that the literal reproduction of the processes discussed above will not be provided or illustrated in the included drawings.

Fig. 7 illustrates a mobile device according to some examples of the present disclosure. Referring now to fig. 7, a block diagram of a mobile device configured in accordance with exemplary aspects is depicted and generally designated mobile device 700. In some aspects, the mobile device 700 may be configured as a wireless communication device. As shown, mobile device 700 includes a processor 701. The processor 701 may be communicatively coupled to the memory 732 via a link, which may be a die-to-die or chip-to-chip link. The mobile device 700 also includes a display 728 and a display controller 726, the display controller 726 being coupled to the processor 701 and the display 728.

In the illustrated aspect, fig. 7 includes an encoder/decoder (codec) 734 (e.g., audio and/or voice codec) coupled to the processor 701; a speaker 736 and a microphone 738 coupled to the codec 734; and a wireless circuit 740 (which may include a modem, RF circuitry, filters, and one or more antenna modules, as disclosed herein) coupled to the processor 701.

In a particular aspect, where one or more of the above blocks are present, the processor 701, the display controller 726, the memory 732, the codec 734, and the wireless circuit 740 may be included in a system-in-package or system-on-chip device 722. Input device 730 (e.g., a physical or virtual keyboard), power supply 744 (e.g., a battery), display 728, input device 730, speaker 736, microphone 738, wireless antenna 742, and power supply 744 can be external to system-on-chip device 722 and can be coupled to components of system-on-chip device 722 such as an interface or controller.

It should be noted that although fig. 7 depicts a mobile device, the processor 701 and memory 732 may also be integrated into a set top box, a music player, a video player, an entertainment unit, a navigation device, a Personal Digital Assistant (PDA), a fixed location data unit, a computer, a laptop computer, a tablet computer, a communications device, a mobile phone, an internet of things (IoT) device, a wireless device in a vehicle, or other similar device.

Fig. 8 illustrates various devices that may be integrated with any of the foregoing antenna modules according to various examples of the present disclosure. For example, mobile phone device 802, laptop computer device 804, and fixed location terminal device 806 may each be generally considered User Equipment (UE) and may include antenna 800 as described herein. The antenna module 800 may be included in any of the devices described herein, for example. The devices 802, 804, 806 illustrated in fig. 8 are provided as examples only. Other devices may also feature antenna module 800, including but not limited to a set of devices (e.g., electronic devices) including mobile devices, hand-held Personal Communication Systems (PCS) units, portable data units such as personal digital assistants, global Positioning System (GPS) enabled devices, navigation devices, set top boxes, music players, video players, entertainment units, fixed location data units such as meter reading devices, communication devices, smart phones, tablet computers, wearable devices, servers, routers, electronic devices implemented in motor vehicles (e.g., autonomous vehicles), internet of things (IoT) devices, or any other device having wireless communication capabilities, or any combination thereof.

The foregoing disclosed devices and functionality may be designed and configured as computer files (e.g., RTL, GDSII, GERBER, etc.) stored on a computer readable medium. Some or all of such files may be provided to a production handler based on such file production equipment. The resulting product may include a semiconductor wafer that is then diced into semiconductor dies and packaged into antenna modules. The antenna module may then be used in the various devices described herein.

It will be appreciated that various aspects disclosed herein may be described as functionally equivalent to structures, materials, and/or devices described and/or recognized by those skilled in the art. For example, in one aspect, an apparatus may include means for performing the various functionalities discussed above. It will be appreciated that the foregoing aspects are provided merely as examples, and that the various aspects claimed are not limited to the specific references and/or illustrations cited as examples.

One or more of the components, processes, features, and/or functions illustrated in fig. 1-8 may be rearranged and/or combined into a single component, process, feature, or function, or incorporated into several components, processes, or functions. Additional elements, components, processes, and/or functions may also be added without departing from the disclosure. It should also be noted that the corresponding descriptions in fig. 1-8 and this disclosure are not limited to die and/or ICs. In some embodiments, fig. 1-8 and their corresponding descriptions may be used to fabricate, create, provide, and/or produce integrated devices. In some embodiments, the device may include a die, an integrated device, a die package, an Integrated Circuit (IC), a device package, an Integrated Circuit (IC) package, a wafer, a semiconductor device, a package on package (PoP) device, and/or an interposer.

As used herein, the terms "user equipment" (or "UE"), "user equipment," "user terminal," "client device," "communication device," "wireless communication device," "handheld device," "mobile terminal," "mobile station," "handset," "access terminal," "subscriber device," "subscriber terminal," "subscriber station," "terminal," and variations thereof may refer interchangeably to any suitable mobile or stationary device that may receive wireless communication and/or navigation signals. These terms include, but are not limited to, music players, video players, entertainment units, navigation devices, communications devices, smart phones, personal digital assistants, fixed location terminals, tablet computers, wearable devices, laptop computers, servers, automotive devices in motor vehicles, and/or other types of portable electronic devices that are typically carried by humans and/or have communications capabilities (e.g., wireless, cellular, infrared, short range radio, etc.). These terms are also intended to encompass a device that communicates with another device that may receive wireless communications and/or navigation signals, such as via a short-range wireless, infrared, wired connection, or other connection, regardless of whether satellite signal reception, assistance data reception, and/or location-related processing occurs at the device or other devices. In addition, these terms are intended to include all devices capable of communicating with a core network via a Radio Access Network (RAN), including wireless and wireline communication devices, and through the core network, UEs may connect to external networks such as the internet, as well as other UEs.

Wireless communication between electronic devices may be based on different technologies such as Code Division Multiple Access (CDMA), W-CDMA, time Division Multiple Access (TDMA), frequency Division Multiple Access (FDMA), orthogonal Frequency Division Multiplexing (OFDM), global system for mobile communications (GSM), 3GPP Long Term Evolution (LTE), 5G new radio, bluetooth (BT), bluetooth Low Energy (BLE), IEEE 802.11 (WiFi), and IEEE 802.15.4 (Zigbee/Thread), or other protocols that may be used in a wireless communication network or data communication network. Bluetooth low energy (also known as bluetooth LE, BLE, and smart bluetooth) is a wireless personal area network technology designed and marketed by the bluetooth special interest group that aims to provide significantly reduced power consumption and cost while maintaining a similar communication range. BLE was incorporated into the master bluetooth standard in 2010, with bluetooth core specification version 4.0 and updated in bluetooth 5.

It should be noted that the terms "connected," "coupled," or any variant thereof refer to any direct or indirect connection or coupling between elements and may encompass the existence of intermediate elements between two elements that are "connected" or "coupled" together via intermediate elements, unless the connection is explicitly disclosed as a direct connection.

Any reference herein to elements using names such as "first," "second," etc. does not limit the number and/or order of such elements. Rather, these designations are used as a convenient method of distinguishing between two or more elements and/or instances of elements. Moreover, unless explicitly stated otherwise, a set of elements may comprise one or more elements.

Those of skill in the art would understand that information and signals may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

Nothing set forth or graphically depicted in this application is intended to dedicate any components, acts, features, benefits, advantages, or equivalents to the public regardless of whether such components, acts, features, benefits, advantages, or equivalents are recited in the claims.

Furthermore, those of skill in the art will appreciate that the various illustrative logical blocks, modules, circuits, and algorithm acts described in connection with the examples disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and actions have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

Although some aspects have been described in connection with apparatus, it is to be understood that these aspects also constitute descriptions of corresponding methods, and thus blocks or components of apparatus should also be understood as corresponding method acts or features of method acts. Similarly, aspects described in connection with or as method acts also constitute descriptions of corresponding blocks or details or features of corresponding devices. Some or all of the method acts may be performed by (or using) hardware devices, such as, for example, microprocessors, programmable computers, or electronic circuits. In some examples, some or more of the most important method acts may be performed by such an apparatus.

In the detailed description above, it can be seen that the different features are grouped together in an example. This method of disclosure is not to be interpreted as reflecting an intention that the claimed examples are intended to have more features than are expressly recited in each claim. Rather, aspects of the disclosure can include fewer than all of the features of a single example disclosed. Accordingly, the following claims are to be regarded as being incorporated into the description, with each claim standing on its own as a separate example. Although each claim itself may be regarded as a separate example, it should be noted that although a dependent claim may refer to a specific combination with one of the other claims in the claims. However, other examples may also cover or include combinations of the subject matter of the dependent claims with any other dependent claims, or combinations of any feature with other dependent and independent claims. Such combinations are presented herein unless explicitly expressed or it can be readily inferred that the particular combination is not intended (e.g., contradictory aspects, such as defining features as insulators and conductors). Furthermore, the features of the claims are also intended to be included in any other independent claim even if said claim is not directly dependent on the independent claim.

In the detailed description above, it can be seen that the different features are grouped together in an example. This manner of disclosure should not be understood as an example clause is intended to have more features than are expressly recited in each clause. Rather, aspects of the disclosure can include less than all of the features of a single disclosed example clause. Accordingly, the following clauses should be considered as being incorporated into the description, each of which may itself be considered a separate example. Although each subordinate clause may refer to a particular combination of one of the other clauses in the clauses, the aspect(s) of the subordinate clause is not limited to the particular combination. It will be appreciated that other example clauses may also include combinations of subject matter of subordinate clause(s) with any other subordinate clause or independent clause or combinations of any feature with other subordinate and independent clauses. Various aspects disclosed herein expressly include such combinations unless expressly stated or it can be readily inferred that a particular combination is not intended (e.g., contradictory aspects such as defining elements as insulators and conductors). Furthermore, aspects of the clause are also intended to be included in any other independent clause, even if the clause is not directly subordinate to the independent clause.

The implementation examples are described in the following numbered clauses:

in clause 1, an apparatus comprises: a first antenna substrate comprising one or more antennas; a metallization structure; a first spacer disposed between the first antenna substrate and the metallization structure configured to maintain a constant distance between the first antenna substrate and the metallization structure; and a first plurality of conductive elements disposed within the first spacer configured to electrically couple the first antenna substrate to the metallization structure, wherein the first spacer is configured to enclose all of the conductive elements, is electrically coupled to the first antenna substrate, and is configured to form an air gap between the first antenna substrate and the metallization structure, and wherein the first plurality of conductive elements are separated by air in the air gap.

In further clause 2, which may be combined with clause 1, the plurality of connection pads are electrically coupled to the metallization structure and are located on a first side of the metallization structure that is on the same side as the first antenna substrate.

In a further clause 3, which may be combined with clause 2, the at least one electrical component is electrically coupled to the metallization structure on a second side opposite the first antenna substrate.

In a further clause 4, which may be combined with clause 3, the at least one electrical component comprises a Radio Frequency Integrated Circuit (RFIC); a power amplifier and power supply assembly electrically coupled to the metallization structure; and one or more passive components each electrically coupled to the metallization structure on a side opposite the first antenna substrate.

In a further clause 5, which may be combined with any of clauses 3-4, at least one electrical component is encapsulated in a molding compound.

In a further clause 6, which may be combined with clause 5, an electromagnetic interference (EMI) shield is configured to at least partially enclose the molding compound and the metallization structure.

In a further clause 7, which may be combined with clause 6, the EMI shield is electrically coupled to the first spacer and ground.

In a further clause 8, which may be combined with any of clauses 1-7, the first spacer is formed of a conductive material.

In a further clause 9, which may be combined with clause 8, the first spacer is coupled to ground.

In a further clause 10, which may be combined with any of clauses 1-9, there is at least one conductive element per antenna.

In a further clause 11, which may be combined with clause 10, there are at least 4 conductive elements per antenna.

In a further clause 12, which may be combined with any of clauses 1-11, the first plurality of conductive elements are posts or rods.

In a further clause 13, which may be combined with any of clauses 1-12, the first plurality of conductive elements is copper (Cu), aluminum (Al), silver (Ag), gold (Au), or a combination thereof.

In a further clause 14, which may be combined with any of clauses 1 to 13, a plurality of additional antenna substrates including one or more antennas; a plurality of additional spacers, wherein each additional spacer is disposed between one of the plurality of additional antenna substrates and the metallization structure and is configured to maintain an associated constant distance between the one of the plurality of additional antenna substrates and the metallization structure; and a plurality of additional conductive elements, wherein at least one conductive element of the plurality of additional conductive elements is disposed within each additional spacer and is configured to electrically couple each of the additional antenna substrates to the metallization structure.

In a further clause 15, which may be combined with clause 14, the at least one spacer is formed of a conductive material.

In a further clause 16, which may be combined with clause 15, the at least one spacer is coupled to ground.

In a further clause 17, which may be combined with any of clauses 14-16, each spacer is configured to maintain the same constant distance.

In a further clause 18, which may be combined with any of clauses 14-17, the at least one spacer is configured to maintain a different constant distance from the at least one other spacer.

In a further clause 19, which may be combined with any of clauses 14-18, there is at least one conductive element for each antenna.

In a further clause 20, which may be combined with any of clauses 14-19, there are at least 4 conductive elements per antenna.

In a further clause 21 that may be combined with any of clauses 14-20, the plurality of additional antenna substrates includes three additional antenna substrates arranged linearly, and each antenna substrate is adjacent to at least one other antenna substrate.

In a further clause 22, which may be combined with any of clauses 14-21, the plurality of additional conductive elements are posts or rods.

In a further clause 23, which may be combined with any of clauses 1-22, the second antenna substrate, comprising one or more antennas; a second spacer, wherein the second spacer is disposed between the second antenna substrate and the first antenna substrate and is configured to maintain a second constant distance between the second antenna substrate and the first antenna substrate; and a second plurality of conductive elements disposed within the second spacer configured to electrically couple the second antenna substrate to the first antenna substrate.

In a further clause 24, which may be combined with clause 23, the third antenna substrate comprises one or more antennas; a third spacer, wherein the third spacer is disposed between the third antenna substrate and the second antenna substrate and is configured to maintain a third constant distance between the third antenna substrate and the second antenna substrate; and a third plurality of conductive elements disposed within the third spacer configured to electrically couple the third antenna substrate to the second antenna substrate.

In a further clause 25, which may be combined with clause 24, the first plurality of conductive elements includes at least one set of conductive elements for each of the one or more antennas in the first antenna substrate.

In a further clause 26, which may be combined with clause 25, the first plurality of conductive elements includes at least one set of through conductive elements for each antenna in the second antenna substrate and in the third antenna substrate.

In a further clause 27, which may be combined with clause 26, each set of conductive elements includes one or more conductive elements.

In a further clause 28, which may be combined with any of clauses 26-27, the second plurality of conductive elements includes at least one set of conductive elements for each of the one or more antennas in the second antenna substrate.

In a further clause 29, which may be combined with clause 28, the second plurality of conductive elements includes at least one set of through conductive elements for each antenna in the third antenna substrate.

In a further clause 30, which may be combined with clause 29, the third plurality of conductive elements includes at least one set of conductive elements for each of the one or more antennas in the third antenna substrate.

In a further clause 31, which may be combined with any of clauses 24-30, the first antenna substrate, the second antenna substrate, and the third antenna substrate are located in a single column.

In a further clause 32, which may be combined with clause 31, the first antenna substrate is located in a first row, the second antenna substrate is located in a second row, and the third antenna substrate is located in a third row, and wherein the first row is located between the second row and the metallization structure, and the second row is located between the third row and the first row.

In a further clause 33, which may be combined with clause 32, a plurality of additional antenna substrates, each including one or more antennas, and each additional antenna substrate having an associated spacer and one or more associated conductive elements; each associated spacer is disposed below an associated antenna substrate; and each of the one or more associated conductive elements is disposed within each associated spacer and is configured to electrically couple each of the additional antenna substrates to another antenna substrate or the metallization structure.

In a further clause 34, which may be combined with clause 33, the plurality of additional antenna substrates and associated spacers and one or more associated conductive elements are arranged in one or more additional columns or additional rows.

In a further clause 35, which may be combined with clause 34, the plurality of additional antenna substrates and associated spacers and one or more associated conductive elements are arranged in three additional columns, each having an antenna substrate in each of the first, second, and third rows, to form a three row by four column grouping of antenna substrates.

In a further clause 36, which may be combined with any of clauses 1 to 35, the metallization structure comprises: a plurality of metal layers; a plurality of insulating layers, wherein at least one insulating layer is disposed between adjacent metal layers; and a plurality of vias, wherein the plurality of vias are used to electrically couple at least portions of the different metal layers.

In a further clause 37, which may be combined with clause 36, the plurality of insulating layers is at least one of Polyimide (PI), benzocyclobutene (BCB), polybenzoxazole (PBO), acrylic or epoxy materials.

In a further clause 38, which may be combined with any of clauses 36-37, the plurality of metal layers and vias may be formed of at least one of copper (Cu), aluminum (Al), silver (Ag), gold (Au), or a combination thereof.

In a further clause 39, which may be combined with any of clauses 1-38, the device is an antenna module.

In a further clause 40 that may be combined with any of clauses 1-39, the apparatus is selected from the group consisting of: music players, video players, entertainment units, navigation devices, communications devices, mobile phones, smart phones, personal digital assistants, fixed location terminals, tablet computers, wearable devices, internet of things (IoT) devices, laptop computers, servers, and devices in motor vehicles.

In clause 41, a method of making an apparatus comprises: forming a metallization structure; forming a first spacer on the metallization structure, wherein the first spacer is configured to maintain a constant distance between the first antenna substrate and the metallization structure; forming a first plurality of conductive elements disposed within the first spacer, the first plurality of conductive elements configured to electrically couple the first antenna substrate to the metallization structure; and attaching a first antenna substrate comprising one or more antennas to the first spacer and the first plurality of conductive elements, wherein the first spacer surrounds all of the conductive elements, is electrically coupled to the first antenna substrate, and forms an air gap between the first antenna substrate and the metallization structure, and wherein the first plurality of conductive elements are separated by air in the air gap.

In a further clause 42, which may be combined with clause 41, the method includes forming a plurality of connection pads electrically coupled to the metallization structure and located on a first side of the metallization structure that is on the same side as the first antenna substrate.

In a further clause 43, which may be combined with clause 42, the method includes forming at least one electrical component that is electrically coupled to the metallization structure on a second side opposite the first antenna substrate.

In a further clause 44, which may be combined with clause 43, the at least one electrical component comprises a Radio Frequency Integrated Circuit (RFIC); a power amplifier and power supply assembly electrically coupled to the metallization structure; and one or more passive components each electrically coupled to the metallization structure on a side opposite the first antenna substrate.

In a further clause 45, which may be combined with any of clauses 43-44, the method includes encapsulating at least one electrical component in a molding compound.

In a further clause 46, which may be combined with clause 45, the method includes forming an electromagnetic interference (EMI) shield configured to at least partially enclose the molding compound and the metallization structure.

In a further clause 47, which may be combined with clause 46, the method includes electrically coupling the EMI shield to the first spacer and to ground.

In a further clause 48, which may be combined with any of clauses 41-47, the method includes grinding the first spacer and the first plurality of conductive elements prior to attaching the first antenna substrate.

In a further clause 49 that may be combined with any of clauses 41 to 48, the method includes forming a plurality of additional spacers, wherein each additional spacer is disposed between one of the plurality of additional antenna substrates and the metallization structure and is configured to maintain an associated constant distance between the one of the plurality of additional antenna substrates and the metallization structure; and forming a plurality of additional conductive elements, wherein at least one conductive element of the plurality of additional conductive elements is disposed within each additional spacer and is configured to electrically couple each of the additional antenna substrates to the metallization structure; and attaching a plurality of additional antenna substrates including one or more antennas to the plurality of additional spacers and the plurality of additional conductive elements.

In a further clause 50, which may be combined with clause 49, the plurality of additional antenna substrates includes three additional antenna substrates arranged linearly, and each antenna substrate is adjacent to at least one other antenna substrate.

Furthermore, it should be noted that the methods, systems, and apparatus disclosed in the description or claims may be implemented by a device comprising components for performing the respective actions and/or functionalities of the disclosed methods.

Further, in some examples, a single action may be subdivided into or contain multiple sub-actions. Such sub-actions may be contained within and be part of the disclosure of a single action.

While the foregoing disclosure shows illustrative examples of the disclosure, it should be noted that various changes and modifications could be made herein without departing from the scope of the disclosure as defined by the appended claims. The functions and/or actions of the method claims in accordance with the examples of this disclosure described herein need not be performed in any particular order. Additionally, well-known elements will not be described in detail or may be omitted so as not to obscure the relevant details of the aspects and examples disclosed herein. Furthermore, although elements of the disclosure may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.

Claims

1. An apparatus, comprising:

a first antenna substrate comprising one or more antennas;

a metallization structure;

a first spacer disposed between the first antenna substrate and the metallization structure configured to maintain a constant distance between the first antenna substrate and the metallization structure; and

a first plurality of conductive elements disposed within the first spacer configured to electrically couple the first antenna substrate to the metallization structure,

wherein the first spacer is configured to surround all of the conductive elements, is electrically coupled to the first antenna substrate, and is configured to form an air gap between the first antenna substrate and the metallization structure, and

wherein the first plurality of conductive elements are separated by air in the air gap.

2. The apparatus of claim 1, further comprising a plurality of connection pads, wherein the plurality of connection pads are electrically coupled to the metallization structure and are located on a first side of the metallization structure that is on a same side as the first antenna substrate.

3. The apparatus of claim 2, further comprising at least one electrical component electrically coupled to the metallization structure on a second side opposite the first antenna substrate.

4. The apparatus of claim 3, wherein the at least one electrical component comprises a Radio Frequency Integrated Circuit (RFIC); a power amplifier and power supply assembly electrically coupled to the metallization structure; and one or more passive components, each of the one or more passive components being electrically coupled to the metallization structure on a side opposite the first antenna substrate.

5. The apparatus of claim 3, wherein the at least one electrical component is encapsulated in a molding compound.

6. The apparatus of claim 5, further comprising:

an electromagnetic interference (EMI) shield configured to at least partially enclose the molding compound and the metallization structure.

7. The apparatus of claim 6, wherein the EMI shield is electrically coupled to the first spacer and ground.

8. The apparatus of claim 1, wherein the first spacer is formed of a conductive material.

9. The apparatus of claim 8, wherein the first spacer is coupled to ground.

10. The apparatus of claim 1, wherein there is at least one conductive element per antenna.

11. The apparatus of claim 10, wherein there are at least 4 conductive elements per antenna.

12. The apparatus of claim 1, wherein the first plurality of conductive elements are posts or rods.

13. The apparatus of claim 1, wherein the first plurality of conductive elements are copper (Cu), aluminum (Al), silver (Ag), gold (Au), or a combination thereof.

14. The apparatus of claim 1, further comprising:

a plurality of additional antenna substrates including one or more antennas;

a plurality of additional spacers, wherein each additional spacer is disposed between one of the plurality of additional antenna substrates and the metallization structure and is configured to maintain an associated constant distance between the one of the plurality of additional antenna substrates and the metallization structure; and

a plurality of additional conductive elements, wherein at least one conductive element of the plurality of additional conductive elements is disposed within each additional spacer and is configured to electrically couple each additional antenna substrate of the additional antenna substrates to the metallization structure.

15. The apparatus of claim 14, wherein the at least one spacer is formed of a conductive material.

16. The apparatus of claim 15, wherein the at least one spacer is coupled to ground.

17. The apparatus of claim 14, wherein each spacer is configured to maintain the same constant distance.

18. The apparatus of claim 14, wherein at least one spacer is configured to maintain a different constant distance from at least one other spacer.

19. The apparatus of claim 14, wherein there is at least one conductive element per antenna.

20. The apparatus of claim 14, wherein there are at least 4 conductive elements per antenna.

21. The apparatus of claim 14, wherein the plurality of additional antenna substrates comprises three additional antenna substrates arranged linearly, and wherein each antenna substrate is adjacent to at least one other antenna substrate.

22. The apparatus of claim 14, wherein the plurality of additional conductive elements are posts or rods.

23. The apparatus of claim 1, further comprising:

a second antenna substrate comprising one or more antennas;

a second spacer, wherein the second spacer is disposed between the second antenna substrate and the first antenna substrate and is configured to maintain a second constant distance between the second antenna substrate and the first antenna substrate; and

A second plurality of conductive elements disposed within the second spacer configured to electrically couple the second antenna substrate to the first antenna substrate,

wherein the second spacer is configured to surround all of the second plurality of conductive elements, is electrically coupled to the second antenna substrate, and is configured to form a second air gap between the second antenna substrate and the first antenna substrate.

24. The apparatus of claim 23, further comprising:

a third antenna substrate comprising one or more antennas;

a third spacer, wherein the third spacer is disposed between the third antenna substrate and the second antenna substrate and is configured to maintain a third constant distance between the third antenna substrate and the second antenna substrate; and

a third plurality of conductive elements disposed within the third spacer configured to electrically couple the third antenna substrate to the second antenna substrate,

wherein the third spacer is configured to surround all of the third plurality of conductive elements, is electrically coupled to the third antenna substrate, and is configured to form a third air gap between the third antenna substrate and the second antenna substrate.

25. The apparatus of claim 24, wherein the first plurality of conductive elements comprises at least one set of conductive elements for each of the one or more antennas in the first antenna substrate.

26. The apparatus of claim 25, wherein the first plurality of conductive elements comprises at least one set of through conductive elements for each antenna in the second antenna substrate and in the third antenna substrate.

27. The apparatus of claim 26, wherein each set of conductive elements comprises one or more conductive elements.

28. The apparatus of claim 26, wherein the second plurality of conductive elements comprises at least one set of conductive elements for each of the one or more antennas in the second antenna substrate.

29. The apparatus of claim 28, wherein the second plurality of conductive elements comprises at least one set of through conductive elements for each antenna in the third antenna substrate.

30. The apparatus of claim 29, wherein the third plurality of conductive elements comprises at least one set of conductive elements for each of the one or more antennas in the third antenna substrate.

31. The apparatus of claim 24, wherein the first antenna substrate, the second antenna substrate, and the third antenna substrate are located in a single column.

32. The apparatus of claim 31, wherein the first antenna substrate is in a first row, the second antenna substrate is in a second row, and the third antenna substrate is in a third row, and

wherein the first row is located between the second row and the metallization structure and the second row is located between the third row and the first row.

33. The apparatus of claim 32, further comprising:

a plurality of additional antenna substrates, each including one or more antennas, and each additional antenna substrate having an associated spacer and one or more associated conductive elements;

wherein each associated spacer is disposed below an associated said antenna substrate; and is also provided with

Wherein each conductive element of the one or more associated conductive elements is disposed within each associated spacer and is configured to electrically couple each of the additional antenna substrates to another antenna substrate or the metallization structure.

34. The apparatus of claim 33, wherein the plurality of additional antenna substrates and associated spacers and one or more associated conductive elements are arranged in one or more additional columns or additional rows.

35. The apparatus of claim 34, wherein the plurality of additional antenna substrates and associated spacers and one or more associated conductive elements are arranged in three additional columns each having an antenna substrate in each of the first, second, and third rows to form a three row by four column grouping of antenna substrates.

36. The apparatus of claim 1, wherein the metallization structure comprises:

a plurality of metal layers;

a plurality of insulating layers, wherein at least one insulating layer is disposed between adjacent metal layers; and

a plurality of vias, wherein the plurality of vias are used to electrically couple at least portions of the different metal layers.

37. The apparatus of claim 36, wherein the plurality of insulating layers are at least one of Polyimide (PI), benzocyclobutene (BCB), polybenzoxazole (PBO), acrylic, or epoxy materials.

38. The device of claim 36, wherein the plurality of metal layers and vias may be formed of at least one of copper (Cu), aluminum (Al), silver (Ag), gold (Au), or a combination thereof.

39. The apparatus of claim 1, wherein the apparatus is an antenna module.

40. The apparatus of claim 1, wherein the apparatus is selected from the group consisting of: music players, video players, entertainment units, navigation devices, communications devices, mobile phones, smart phones, personal digital assistants, fixed location terminals, tablet computers, wearable devices, internet of things (IoT) devices, laptop computers, servers, and devices in motor vehicles.

41. A method of making a device, comprising:

forming a metallization structure;

forming a first spacer on the metallization structure, wherein the first spacer is configured to maintain a constant distance between a first antenna substrate and the metallization structure;

forming a first plurality of conductive elements disposed within the first spacer, the first plurality of conductive elements configured to electrically couple the first antenna substrate to the metallization structure; and

attaching the first antenna substrate comprising one or more antennas to the first spacer and the first plurality of conductive elements,

Wherein the first spacer surrounds all of the conductive elements, is electrically coupled to the first antenna substrate, and forms an air gap between the first antenna substrate and the metallization structure, and

42. The method of claim 41, further comprising:

a plurality of connection pads are formed, the plurality of connection pads being electrically coupled to the metallization structure and located on a first side of the metallization structure, the first side of the metallization structure being on a same side as the first antenna substrate.

43. The method of claim 42, further comprising

At least one electrical component is formed that is electrically coupled to the metallization structure at a second side opposite the first antenna substrate.

44. The method of claim 43, wherein the at least one electrical component comprises: a Radio Frequency Integrated Circuit (RFIC); a power amplifier and power supply assembly electrically coupled to the metallization structure; and one or more passive components, each of the one or more passive components being electrically coupled to the metallization structure on a side opposite the first antenna substrate.

45. The method of claim 43, further comprising:

the at least one electrical component is encapsulated in a molding compound.

46. The method of claim 45, further comprising:

an electromagnetic interference (EMI) shield is formed, the EMI shield configured to at least partially enclose the molding compound and the metallization structure.

47. The method of claim 46, further comprising:

the EMI shield is electrically coupled to the first spacer and ground.

48. The method of claim 41, further comprising:

the first spacer and the first plurality of conductive elements are ground prior to attaching the first antenna substrate.

49. The method of claim 41, further comprising:

forming a plurality of additional spacers, wherein each additional spacer is disposed between one of a plurality of additional antenna substrates and the metallization structure and is configured to maintain an associated constant distance between the one of the plurality of additional antenna substrates and the metallization structure; and

forming a plurality of additional conductive elements, wherein at least one conductive element of the plurality of additional conductive elements is disposed within each additional spacer and is configured to electrically couple each additional antenna substrate of the additional antenna substrates to the metallization structure; and

The plurality of additional antenna substrates including one or more antennas are attached to the plurality of additional spacers and the plurality of additional conductive elements.

50. The method of claim 49, wherein the plurality of additional antenna substrates comprises three additional antenna substrates arranged linearly, and wherein each antenna substrate is adjacent to at least one other antenna substrate.