CN116543950B - Yellow light slurry, preparation method thereof and application of yellow light slurry in heterojunction solar cell - Google Patents
Yellow light slurry, preparation method thereof and application of yellow light slurry in heterojunction solar cell Download PDFInfo
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- CN116543950B CN116543950B CN202310798890.4A CN202310798890A CN116543950B CN 116543950 B CN116543950 B CN 116543950B CN 202310798890 A CN202310798890 A CN 202310798890A CN 116543950 B CN116543950 B CN 116543950B
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- Prior art keywords
- methacrylate
- acrylate
- monomer
- yellow light
- additive
- Prior art date
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- 239000002002 slurry Substances 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000000654 additive Substances 0.000 claims abstract description 43
- 230000000996 additive effect Effects 0.000 claims abstract description 34
- 239000011342 resin composition Substances 0.000 claims abstract description 30
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000002904 solvent Substances 0.000 claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000178 monomer Substances 0.000 claims description 66
- 239000003795 chemical substances by application Substances 0.000 claims description 42
- 239000002202 Polyethylene glycol Substances 0.000 claims description 22
- 229920001223 polyethylene glycol Polymers 0.000 claims description 22
- 150000003254 radicals Chemical class 0.000 claims description 19
- -1 polysiloxane Polymers 0.000 claims description 17
- 239000003999 initiator Substances 0.000 claims description 16
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 15
- 125000004386 diacrylate group Chemical group 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 13
- 230000002378 acidificating effect Effects 0.000 claims description 12
- 239000012986 chain transfer agent Substances 0.000 claims description 12
- 239000011259 mixed solution Substances 0.000 claims description 12
- 239000001301 oxygen Substances 0.000 claims description 12
- 229910052760 oxygen Inorganic materials 0.000 claims description 12
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 11
- 239000013530 defoamer Substances 0.000 claims description 11
- 239000006254 rheological additive Substances 0.000 claims description 11
- JZEXORLUKMQOFA-UHFFFAOYSA-N 2-(1-ethoxyethyl)-2-(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCOC(C)C(CO)(CO)CO JZEXORLUKMQOFA-UHFFFAOYSA-N 0.000 claims description 9
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 9
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 claims description 7
- 229910021485 fumed silica Inorganic materials 0.000 claims description 7
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 claims description 7
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 claims description 7
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 claims description 6
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims description 6
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 6
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
- ZOKCNEIWFQCSCM-UHFFFAOYSA-N (2-methyl-4-phenylpent-4-en-2-yl)benzene Chemical compound C=1C=CC=CC=1C(C)(C)CC(=C)C1=CC=CC=C1 ZOKCNEIWFQCSCM-UHFFFAOYSA-N 0.000 claims description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- KHAYCTOSKLIHEP-UHFFFAOYSA-N docosyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCOC(=O)C=C KHAYCTOSKLIHEP-UHFFFAOYSA-N 0.000 claims description 5
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 claims description 5
- ZHUWXKIPGGZNJW-UHFFFAOYSA-N 6-methylheptyl 3-sulfanylpropanoate Chemical compound CC(C)CCCCCOC(=O)CCS ZHUWXKIPGGZNJW-UHFFFAOYSA-N 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 4
- 239000002250 absorbent Substances 0.000 claims description 4
- 230000002745 absorbent Effects 0.000 claims description 4
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 claims description 4
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 claims description 4
- GDESWOTWNNGOMW-UHFFFAOYSA-N resorcinol monobenzoate Chemical compound OC1=CC=CC(OC(=O)C=2C=CC=CC=2)=C1 GDESWOTWNNGOMW-UHFFFAOYSA-N 0.000 claims description 4
- JJSLGZBYVGRBSV-UHFFFAOYSA-N (9-ethylcarbazol-1-yl)-phenylmethanone Chemical compound C(C1=CC=CC=C1)(=O)C1=CC=CC=2C3=CC=CC=C3N(C12)CC JJSLGZBYVGRBSV-UHFFFAOYSA-N 0.000 claims description 3
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 claims description 3
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 claims description 3
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-Tetramethylpiperidine Substances CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 claims description 3
- NDRPHZPVTSFYLH-UHFFFAOYSA-N 2,4,6-tris(2-butoxyphenyl)-1,3,5-triazine Chemical compound C(CCC)OC1=C(C=CC=C1)C1=NC(=NC(=N1)C1=C(C=CC=C1)OCCCC)C1=C(C=CC=C1)OCCCC NDRPHZPVTSFYLH-UHFFFAOYSA-N 0.000 claims description 3
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 claims description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 3
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 claims description 3
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 claims description 3
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 claims description 3
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 claims description 3
- UWDMKTDPDJCJOP-UHFFFAOYSA-N 4-hydroxy-2,2,6,6-tetramethylpiperidin-1-ium-4-carboxylate Chemical compound CC1(C)CC(O)(C(O)=O)CC(C)(C)N1 UWDMKTDPDJCJOP-UHFFFAOYSA-N 0.000 claims description 3
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000001856 Ethyl cellulose Substances 0.000 claims description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000004280 Sodium formate Substances 0.000 claims description 3
- 239000007983 Tris buffer Substances 0.000 claims description 3
- LOCXTTRLSIDGPS-FVDSYPCUSA-N [(z)-[1-oxo-1-(4-phenylsulfanylphenyl)octan-2-ylidene]amino] benzoate Chemical compound C=1C=C(SC=2C=CC=CC=2)C=CC=1C(=O)C(/CCCCCC)=N\OC(=O)C1=CC=CC=C1 LOCXTTRLSIDGPS-FVDSYPCUSA-N 0.000 claims description 3
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 claims description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 3
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 3
- QYMFNZIUDRQRSA-UHFFFAOYSA-N dimethyl butanedioate;dimethyl hexanedioate;dimethyl pentanedioate Chemical compound COC(=O)CCC(=O)OC.COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC QYMFNZIUDRQRSA-UHFFFAOYSA-N 0.000 claims description 3
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 claims description 3
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 claims description 3
- ZWEDFBKLJILTMC-UHFFFAOYSA-N ethyl 4,4,4-trifluoro-3-hydroxybutanoate Chemical compound CCOC(=O)CC(O)C(F)(F)F ZWEDFBKLJILTMC-UHFFFAOYSA-N 0.000 claims description 3
- 229920001249 ethyl cellulose Polymers 0.000 claims description 3
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 3
- ZYMKZMDQUPCXRP-UHFFFAOYSA-N fluoro prop-2-enoate Chemical compound FOC(=O)C=C ZYMKZMDQUPCXRP-UHFFFAOYSA-N 0.000 claims description 3
- ZNAOFAIBVOMLPV-UHFFFAOYSA-N hexadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C(C)=C ZNAOFAIBVOMLPV-UHFFFAOYSA-N 0.000 claims description 3
- PZDUWXKXFAIFOR-UHFFFAOYSA-N hexadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C=C PZDUWXKXFAIFOR-UHFFFAOYSA-N 0.000 claims description 3
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 claims description 3
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 claims description 3
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 claims description 3
- 229920003063 hydroxymethyl cellulose Polymers 0.000 claims description 3
- 229940031574 hydroxymethyl cellulose Drugs 0.000 claims description 3
- CFBXDFZIDLWOSO-UHFFFAOYSA-N icosyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCCOC(=O)C(C)=C CFBXDFZIDLWOSO-UHFFFAOYSA-N 0.000 claims description 3
- DOULWWSSZVEPIN-UHFFFAOYSA-N isoproturon-monodemethyl Chemical compound CNC(=O)NC1=CC=C(C(C)C)C=C1 DOULWWSSZVEPIN-UHFFFAOYSA-N 0.000 claims description 3
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- QJAOYSPHSNGHNC-UHFFFAOYSA-N octadecane-1-thiol Chemical compound CCCCCCCCCCCCCCCCCCS QJAOYSPHSNGHNC-UHFFFAOYSA-N 0.000 claims description 3
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 claims description 3
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 claims description 3
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 3
- YOTGRUGZMVCBLS-UHFFFAOYSA-N pentadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCOC(=O)C(C)=C YOTGRUGZMVCBLS-UHFFFAOYSA-N 0.000 claims description 3
- GOZDOXXUTWHSKU-UHFFFAOYSA-N pentadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCOC(=O)C=C GOZDOXXUTWHSKU-UHFFFAOYSA-N 0.000 claims description 3
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 claims description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 3
- 229950000688 phenothiazine Drugs 0.000 claims description 3
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 claims description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 claims description 3
- 235000019254 sodium formate Nutrition 0.000 claims description 3
- KEROTHRUZYBWCY-UHFFFAOYSA-N tridecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C(C)=C KEROTHRUZYBWCY-UHFFFAOYSA-N 0.000 claims description 3
- XOALFFJGWSCQEO-UHFFFAOYSA-N tridecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C=C XOALFFJGWSCQEO-UHFFFAOYSA-N 0.000 claims description 3
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 claims description 3
- KRLHYNPADOCLAJ-UHFFFAOYSA-N undecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCOC(=O)C(C)=C KRLHYNPADOCLAJ-UHFFFAOYSA-N 0.000 claims description 3
- RRLMGCBZYFFRED-UHFFFAOYSA-N undecyl prop-2-enoate Chemical compound CCCCCCCCCCCOC(=O)C=C RRLMGCBZYFFRED-UHFFFAOYSA-N 0.000 claims description 3
- CMVNWVONJDMTSH-UHFFFAOYSA-N 7-bromo-2-methyl-1h-quinazolin-4-one Chemical compound C1=CC(Br)=CC2=NC(C)=NC(O)=C21 CMVNWVONJDMTSH-UHFFFAOYSA-N 0.000 claims description 2
- SEEVRZDUPHZSOX-UHFFFAOYSA-N [1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino] acetate Chemical compound C=1C=C2N(CC)C3=CC=C(C(C)=NOC(C)=O)C=C3C2=CC=1C(=O)C1=CC=CC=C1C SEEVRZDUPHZSOX-UHFFFAOYSA-N 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims description 2
- 239000000440 bentonite Substances 0.000 claims description 2
- 229910000278 bentonite Inorganic materials 0.000 claims description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 2
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 33
- 239000002184 metal Substances 0.000 abstract description 33
- 239000000843 powder Substances 0.000 abstract description 32
- 238000000034 method Methods 0.000 abstract description 14
- 229910052709 silver Inorganic materials 0.000 abstract description 13
- 239000004332 silver Substances 0.000 abstract description 13
- 238000006243 chemical reaction Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 238000009713 electroplating Methods 0.000 abstract description 4
- 230000008719 thickening Effects 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 abstract description 3
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 238000000518 rheometry Methods 0.000 description 6
- 239000006096 absorbing agent Substances 0.000 description 5
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- 239000011521 glass Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
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- 239000010408 film Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- SEEVRZDUPHZSOX-WPWMEQJKSA-N [(e)-1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino] acetate Chemical compound C=1C=C2N(CC)C3=CC=C(C(\C)=N\OC(C)=O)C=C3C2=CC=1C(=O)C1=CC=CC=C1C SEEVRZDUPHZSOX-WPWMEQJKSA-N 0.000 description 1
- LOCXTTRLSIDGPS-UHFFFAOYSA-N [[1-oxo-1-(4-phenylsulfanylphenyl)octan-2-ylidene]amino] benzoate Chemical compound C=1C=C(SC=2C=CC=CC=2)C=CC=1C(=O)C(CCCCCC)=NOC(=O)C1=CC=CC=C1 LOCXTTRLSIDGPS-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- BOXSCYUXSBYGRD-UHFFFAOYSA-N cyclopenta-1,3-diene;iron(3+) Chemical compound [Fe+3].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 BOXSCYUXSBYGRD-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- OCDWICPYKQMQSQ-UHFFFAOYSA-N docosyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCOC(=O)C(C)=C OCDWICPYKQMQSQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- NGYRYRBDIPYKTL-UHFFFAOYSA-N icosyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCCOC(=O)C=C NGYRYRBDIPYKTL-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
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- 235000012222 talc Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
Abstract
The application discloses yellow light slurry, a preparation method thereof and application thereof in heterojunction solar cells, belonging to the technical field of electronic slurry, wherein the yellow light slurry comprises the following components in percentage by weight: 75-90% of metal powder, 2-10% of solvent, 0.5-5% of additive and 8-24% of photosensitive resin composition; the metal powder comprises the following components in percentage by weight: 60-95% of metal powder with an average particle size of 0.2-0.5 mu m, 5-40% of metal powder with an average particle size of 0.5-1 mu m; the metal powder comprises at least one of silver powder, silver palladium powder, silver coated copper powder, aluminum powder and nickel powder. The yellow light paste can replace the traditional ITO+silver fine grid structure, replace the traditional PVD+photoresist+electroplating thickening process or the direct silver fine grid electrode printing process, realize the better balance of the HIT heterojunction solar cell in the light shielding degree and the resistivity, and obtain higher conversion efficiency.
Description
Technical Field
The application relates to the technical field of electronic paste and solar cells, in particular to yellow light paste, a preparation method thereof and application thereof in heterojunction solar cells.
Background
A typical heterojunction solar cell is a HIT (HeterojunctionwithIntrinsic Thin-layer) cell and is structurally characterized in that the front side and the back side of single crystal silicon (c-Si) are respectively an intrinsic amorphous silicon (i-a-Si: H) thin layer and a p+ or n+ heavily doped amorphous silicon layer, and transparent electrodes and collector electrodes are prepared outside the amorphous silicon (a-Si: H) on two sides to form the heterojunction solar cell with a symmetrical structure.
The HIT battery has high efficiency, and one of the important reasons is that the HIT battery has a unique and high-quality intrinsic amorphous silicon thin layer, can obviously passivate interface state defects, reduces minority carrier recombination, and improves open-circuit voltage and battery performance.
The high-efficiency solar cell needs to have a good surface electrode conductive film, as shown in fig. 1, and the good surface electrode conductive film needs to have good conductivity and sunlight transmission capability at the same time, however, practical research application finds that the two are always mutually restricted. ITO thin films are generally prepared by magnetron sputtering, with the resistivity of ITO being approximately 8X 10 -4 About Ω·cm, and the light transmittance is 90%. In addition, indium, which is a rare metal, is required for ITO, and in recent years, the price of indium has increased due to the large amount of ITO used.
In addition, since the resistivity of ITO is still much higher than that of simple metal (the resistivity of simple silver is 2X 10 < -6 > omega cm), the sheet resistance is higher to 5-10 ohm/square, and therefore, a silver fine grid line is also printed on the ITO coating layer as an electron collecting electrode. The width of the current precise printing of the HIT silver grid line is about 40-60 um/silver, and because silver is not transparent, a large number of silver grid lines also cause the increase of shading area and the reduction of photoelectric conversion efficiency. For the HIT cell of 9bb 166 size (9 main grid, 166mm size), the shading area of 90 fine grids reached more than 6%, and the effect on the efficiency of the solar cell was very large.
Researchers use electroplated copper to replace ITO coating, but PVD, electroplating thickening and etching processes are needed, and the problems of long process, low yield, high cost, high environmental protection pressure and the like are solved.
Disclosure of Invention
The application aims to overcome the defects of the prior art and provide a yellow light slurry, a preparation method thereof and application thereof in heterojunction solar cells.
In order to achieve the above purpose, the technical scheme adopted by the application is as follows:
a yellow light slurry, comprising the following components in percentage by weight: 65-90% of metal powder, 2-10% of solvent, 0.5-5% of additive and 8-34% of photosensitive resin composition;
the metal powder comprises the following components in percentage by weight: 60-95% of metal powder with an average particle size of 0.2-0.5 mu m, 5-40% of metal powder with an average particle size of 0.5-1 mu m;
the metal powder comprises at least one of silver powder, silver palladium powder, silver coated copper powder, aluminum powder and nickel powder.
As a preferred embodiment of the present application, the additives include leveling agents, defoamers, rheology aids, flexibilizers, photoinitiators, uv absorbers, chain transfer agents, free radical control agents;
the weight ratio of the leveling agent, the defoamer, the rheological additive, the flexible additive, the photoinitiator, the ultraviolet absorber, the chain transfer agent and the free radical control agent is (0.2-1): (0.2-1): (0.2-1): (0.2 to 0.8): (0.2 to 0.8): (0.2 to 0.8): (0.2 to 0.8): (0.2 to 0.8).
As a preferred embodiment of the present application, the leveling agent comprises at least one of modified polyether siloxane, acrylate polymer, fluoropolyether siloxane, fluoroacrylate polymer; and/or
The defoamer comprises at least one of dimethyl silane and polysiloxane; and/or
The rheological additive comprises at least one of fumed silica, polyamide wax, polydimethyl silicone oil, organic bentonite, talcum powder, ethyl cellulose and hydroxymethyl cellulose; and/or
The ultraviolet absorbent is at least one selected from 2- (2 ' -hydroxy-5 ' -methylphenyl) benzotriazole, 2, 4-dihydroxybenzophenone, 2- (2 ' -hydroxy-3 ',5' -di-tert-phenyl) -5-chlorobenzotriazole, resorcinol monobenzoate, 2' -thiobis (4-tert-octylphenol oxy) nickel, tris (1, 2, 6-pentamethylpiperidyl) phosphite, 2,4, 6-tris (2 ' -n-butoxyphenyl) -1,3, 5-triazine, 4-benzoyloxy-2, 6-tetramethylpiperidine and hexamethylphosphoric triamide.
As a preferred embodiment of the present application, the flexible additive comprises at least one of 3 (ethoxy) trimethylolpropane triacrylate, 9 (ethoxy) trimethylolpropane triacrylate, 15 (ethoxy) trimethylolpropane triacrylate, polyethylene glycol (200) diacrylate, polyethylene glycol (400) diacrylate, polyethylene glycol (600) diacrylate, polyethylene glycol (1500) diacrylate, epsilon-caprolactone modified bis-pentaerythritol hexaacrylate, lauryl methacrylate, stearyl methacrylate; and/or
The photoinitiator comprises at least one of eta 6-isopropylbenzene ferrocene hexafluorophosphate, 1- [4- (phenylthio) phenyl ] -1, 2-octane dione 2- (O-benzoyl oxime), 1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl ] ethanone 1- (O-acetyl oxime), 3- (1-acetoxyimino) ethyl-6- [4- (2-acetoxyethyl dioxothio) -2-methyl ] benzoyl-9-ethylcarbazole; and/or
The chain transfer agent comprises at least one of isooctyl 3-mercaptopropionate, 2, 4-diphenyl-4-methyl-1-pentene, octadecyl mercaptan, isopropanol and sodium formate; and/or
The free radical control agent comprises at least one of p-hydroxyanisole, hydroquinone, phenothiazine, pentaerythritol tetra (3-mercaptopropionate), bis (2, 6-tetramethyl-4-piperidyl) sebacate nitroxide free radical and 4-hydroxy-2, 6-tetramethyl piperidine-1-oxyl free radical.
As a preferred embodiment of the present application, the photosensitive resin composition includes an acidic monomer, a high oxygen content monomer, a backbone monomer, a curing monomer, and an initiator;
the weight ratio of the acidic monomer to the high-oxygen content monomer to the skeleton monomer to the curing monomer to the initiator is (5-10): (5-30): (10-15): (5-25): (0.2 to 5).
As a preferred embodiment of the present application, the acidic monomer includes at least one of acrylic acid, methacrylic acid, glycolic acid; and/or
The high-oxygen-content monomer comprises at least one of polyethylene glycol acrylate, polyethylene glycol methacrylate, ethylene glycol methacrylate and polypropylene glycol methacrylate; and/or
The backbone monomers include at least one of styrene, methyl methacrylate, methyl acrylate, ethyl methacrylate, ethyl acrylate, propyl methacrylate, propyl acrylate, n-butyl methacrylate, n-butyl acrylate, isobutyl methacrylate, isobutyl acrylate, pentyl acrylate, n-hexyl methacrylate, n-hexyl acrylate, n-heptyl methacrylate, n-heptyl acrylate, n-octyl methacrylate, n-octyl acrylate, undecyl methacrylate, undecyl acrylate, tridecyl methacrylate, tridecyl acrylate, pentadecyl methacrylate, pentadecyl acrylate, cetyl methacrylate, cetyl acrylate, stearyl methacrylate, stearyl acrylate, eicosyl methacrylate, behenyl acrylate, behenyl methacrylate, and behenyl acrylate.
As a preferred embodiment of the present application, the curing monomer includes at least one of ethyl 2-isocyanate, triglycidyl methacrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, hydroxyethyl acrylate, hydroxypropyl acrylate; and/or
The initiator comprises at least one of azobisethylnitrile, azobisisoheptonitrile and dimethyl azobisisobutyrate.
As a preferred embodiment of the present application, the solvent includes at least one of ethylene glycol monobutyl ether, propylene glycol monomethyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, ethylene glycol methyl ether acetate, propylene glycol methyl ether acetate, and mixed dibasic acid dibasic ester.
The application also provides a preparation method of the yellow light slurry, which comprises the following steps:
uniformly mixing the photosensitive resin composition, the additive and the solvent to obtain a mixed solution, uniformly mixing the mixed solution and the metal powder, and carrying out three-roller grinding and refining to obtain yellow light slurry.
The application also provides application of the yellow light slurry in preparation of heterojunction solar cells.
The application has the beneficial effects that: (1) The yellow light slurry metal grid can replace the traditional ITO+silver fine grid structure and replace the traditional PVD+photoresist+electroplating thickening process, so that better balance of the HIT heterojunction solar cell in light shading degree and resistivity is realized, and higher conversion efficiency is obtained.
Drawings
Fig. 1 is a heterojunction solar cell comprising an ITO thin film as mentioned in the background art.
Fig. 2 is a heterojunction solar cell (double-sided fine grid) prepared from the yellow light paste of the present application.
Fig. 3 is a heterojunction solar cell (single-sided fine grid) prepared from the yellow slurry of the present application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions in the embodiments of the present application will be clearly and completely described below, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be understood that, in various embodiments of the present application, the sequence number of each process does not mean that the sequence of execution is sequential, and some or all of the steps may be executed in parallel or sequentially, where the execution sequence of each process should be determined by its functions and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.
The weights of the relevant components mentioned in the description of the embodiments of the present application may refer not only to the specific contents of the components, but also to the proportional relationship between the weights of the components, so long as the contents of the relevant components in the description of the embodiments of the present application are scaled up or down within the scope of the disclosure of the embodiments of the present application. Specifically, the mass described in the specification of the embodiment of the application can be mass units known in the chemical industry field such as mu g, mg, g, kg.
In the present application, the specific dispersing and stirring treatment method is not particularly limited.
The reagents or apparatus used in the present application are conventional products commercially available without the manufacturer's knowledge.
The embodiment of the application provides yellow light slurry, which comprises the following components in percentage by weight: 65-90% of metal powder, 2-10% of solvent, 0.5-5% of additive and 8-34% of photosensitive resin composition;
the metal powder comprises the following components in percentage by weight: 60-95% of metal powder with an average particle size of 0.2-0.5 mu m, 5-40% of metal powder with an average particle size of 0.5-1 mu m;
the metal powder comprises at least one of silver powder, silver palladium powder, silver coated copper powder, aluminum powder and nickel powder.
The yellow light slurry provided by the application can replace the traditional ITO+silver fine grid structure and replace the traditional PVD+etching+electroplating thickening process, so that the better balance of the shading degree and the resistivity of the HIT heterojunction solar cell is realized, and the higher conversion efficiency is obtained.
In one embodiment, the additives include leveling agents, defoamers, rheology aids, flexibility additives, photoinitiators, uv absorbers, chain transfer agents, free radical control agents;
the weight ratio of the leveling agent, the defoamer, the rheological additive, the flexible additive, the photoinitiator, the ultraviolet absorber, the chain transfer agent and the free radical control agent is (0.2-1): (0.2-1): (0.2-1): (0.2 to 0.8): (0.2 to 0.8): (0.2 to 0.8): (0.2 to 0.8): (0.2 to 0.8).
The specific additive can effectively improve the light transmittance and the conductivity, and effectively improve the stability of the whole formula and the curing strength of the system.
In one embodiment, the leveling agent comprises at least one of a modified polyether siloxane, an acrylate polymer, a fluoropolyether siloxane, and a fluoroacrylate polymer.
In one embodiment, the defoamer comprises at least one of dimethylsilane and polysiloxane.
In one embodiment, the rheology aid comprises at least one of fumed silica, polyamide wax, polydimethyl silicone oil, organobentonite, talc, ethylcellulose, hydroxymethyl cellulose.
In one embodiment, the ultraviolet absorber is selected from at least one of 2- (2 ' -hydroxy-5 ' -methylphenyl) benzotriazole, 2, 4-dihydroxybenzophenone, 2- (2 ' -hydroxy-3 ',5' -di-tert-phenyl) -5-chlorobenzotriazole, resorcinol monobenzoate, 2' -thiobis (4-tert-octylphenoloxy) nickel, tris (1, 2, 6-pentamethylpiperidinyl) phosphite, 2,4, 6-tris (2 ' n-butoxyphenyl) -1,3, 5-triazine, 4-benzoyloxy-2, 6-tetramethylpiperidine, hexamethylphosphoric triamide.
In one embodiment, the flexible additive comprises at least one of 3 (ethoxy) trimethylolpropane triacrylate, 9 (ethoxy) trimethylolpropane triacrylate, 15 (ethoxy) trimethylolpropane triacrylate, polyethylene glycol (200) diacrylate, polyethylene glycol (400) diacrylate, polyethylene glycol (600) diacrylate, polyethylene glycol (1500) diacrylate, epsilon-caprolactone modified di-pentaerythritol hexaacrylate, lauryl methacrylate, stearyl methacrylate.
In one embodiment, the photoinitiator comprises at least one of η6-isopropylbenzene ferrocene hexafluorophosphate, 1- [4- (phenylthio) phenyl ] -1, 2-octanedione 2- (O-benzoyl oxime), 1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl ] ethanone 1- (O-acetyl oxime), 3- (1-acetoxyimino) ethyl-6- [4- (2-acetoxyethyldioxothio) -2-methyl ] benzoyl-9-ethylcarbazole.
In one embodiment, the chain transfer agent comprises at least one of isooctyl 3-mercaptopropionate, 2, 4-diphenyl-4-methyl-1-pentene, octadecyl mercaptan, isopropyl alcohol, sodium formate.
In one embodiment, the radical control agent comprises at least one of para-hydroxyanisole, hydroquinone, phenothiazine, pentaerythritol tetrakis (3-mercaptopropionate), bis (2, 6-tetramethyl-4-piperidinyl) sebacate nitroxide, 4-hydroxy-2, 6-tetramethylpiperidin-1-oxyl radical.
In one embodiment, the photosensitive resin composition includes an acidic monomer, a high oxygen content monomer, a backbone monomer, a curing monomer, and an initiator;
the weight ratio of the acidic monomer to the high-oxygen content monomer to the skeleton monomer to the curing monomer to the initiator is (5-10): (5-30): (10-15): (5-25): (0.2 to 5).
The application adds acid monomer and solidifying monomer based on the existing photosensitive resin composition, effectively improves the strength of the whole system, improves the adhesive strength, and further improves the dispersion property of metal powder.
In one embodiment, the acidic monomer includes at least one of acrylic acid, methacrylic acid, glycolic acid.
In one embodiment, the high oxygen content monomer comprises at least one of polyethylene glycol acrylate, polyethylene glycol methacrylate, ethylene glycol methacrylate, polypropylene glycol methacrylate.
In one embodiment, the backbone monomer comprises at least one of styrene, methyl methacrylate, methyl acrylate, ethyl methacrylate, ethyl acrylate, propyl methacrylate, propyl acrylate, n-butyl methacrylate, n-butyl acrylate, isobutyl methacrylate, isobutyl acrylate, pentyl acrylate, n-hexyl methacrylate, n-hexyl acrylate, n-heptyl methacrylate, n-heptyl acrylate, n-octyl methacrylate, n-octyl acrylate, undecyl methacrylate, undecyl acrylate, tridecyl methacrylate, tridecyl acrylate, pentadecyl methacrylate, pentadecyl acrylate, cetyl methacrylate, cetyl acrylate, stearyl methacrylate, stearyl acrylate, eicosyl methacrylate, eicosyl acrylate, docosyl methacrylate, docosyl acrylate.
In one embodiment, the curing monomer includes at least one of 2-isocyanatoethyl methacrylate, triglycidyl methacrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, hydroxyethyl acrylate, and hydroxypropyl acrylate.
In one embodiment, the initiator comprises at least one of azobisisobutyronitrile, azobisisoheptonitrile, dimethyl azobisisobutyrate.
In one embodiment, the solvent comprises at least one of ethylene glycol monobutyl ether, propylene glycol monomethyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, ethylene glycol methyl ether acetate, propylene glycol methyl ether acetate, and mixed dibasic acid dibasic ester.
In the present application, the method for preparing the photosensitive resin composition and the additive is not limited, and those skilled in the art know how to prepare them into the photosensitive resin composition and the additive based on the present application.
Illustratively, the method for preparing the additive comprises the following steps:
adding the flexible additive, the photoinitiator, the chain transfer agent and the free radical control agent into a glass reaction kettle with a reflux condenser, introducing argon for protection and stirring at 85 ℃, stirring for 4 hours at 85 ℃ for reaction, adding the flatting agent, the defoamer, the rheological additive and the ultraviolet absorbent, and stirring uniformly to obtain the additive.
Illustratively, the method for preparing the photosensitive resin composition comprises the following steps:
adding an acidic monomer, a high-oxygen-content monomer, a framework monomer, a curing monomer and an initiator into a glass reaction kettle with a reflux condenser, introducing argon for protection and stirring at 85 ℃, and stirring at 85 ℃ for 4 hours for reaction to obtain the photosensitive resin composition.
An embodiment of the present application provides a method for preparing yellow light paste, comprising the steps of:
uniformly mixing the photosensitive resin composition, the additive and the solvent to obtain a mixed solution, uniformly mixing the mixed solution and the metal powder, and carrying out three-roller grinding and refining to obtain yellow light slurry.
An embodiment of the application provides an application of yellow light slurry in preparing heterojunction solar cells.
The following examples are provided to facilitate an understanding of the present application. These examples are not provided to limit the scope of the claims.
Example 1
A yellow light slurry, comprising the following components in percentage by weight: 80% of metal powder, 6% of solvent, 3.5% of additive and 10.5% of photosensitive resin composition;
the metal powder comprises the following components in percentage by weight: 80% of silver powder with an average particle size of 0.4 μm and 20% of silver powder with an average particle size of 0.8 μm.
The additive comprises a leveling agent (TEGO 270 leveling agent), a defoaming agent (dimethyl silane), a rheological additive (fumed silica), a flexible additive (epsilon-caprolactone modified di-pentaerythritol hexaacrylate), a photoinitiator (eta 6-isopropylbenzene ferrocenium hexafluorophosphate), an ultraviolet absorbent (2- (2 '-hydroxy-5' -methylphenyl) benzotriazole), a chain transfer agent (3-mercaptopropionic acid isooctyl ester) and a free radical control agent (p-hydroxyanisole); the weight ratio of the leveling agent, the defoamer, the rheological additive, the flexible additive, the photoinitiator, the ultraviolet absorber, the chain transfer agent and the free radical control agent is 0.5:0.5:0.5:0.4:0.4:0.4:0.4:0.4.
the photosensitive resin composition includes an acid monomer (methacrylic acid), a high oxygen content monomer (polyethylene glycol methacrylate), a backbone monomer (methyl methacrylate), a curing monomer (triglycidyl methacrylate), and an initiator (azobisisobutyronitrile); the weight ratio of the acidic monomer to the high-oxygen content monomer to the skeleton monomer to the curing monomer to the initiator is 8:20:12:15:4.
the solvent comprises ethylene glycol monobutyl ether and propylene glycol monomethyl ether; the weight ratio of the ethylene glycol monobutyl ether to the propylene glycol monomethyl ether is 2:1.
The preparation method of the yellow light slurry comprises the following steps:
uniformly mixing the photosensitive resin composition, the additive and the solvent to obtain a mixed solution, uniformly mixing the mixed solution and the metal powder, and grinding to obtain yellow light slurry.
Example 2
A yellow light slurry, comprising the following components in percentage by weight: 76% of metal powder, 5% of solvent, 4% of additive and 15% of photosensitive resin composition;
the metal powder comprises the following components in percentage by weight: 75% of silver powder having an average particle diameter of 0.4. Mu.m, and 25% of silver powder having an average particle diameter of 0.8. Mu.m.
The additives comprise leveling agents (TEGO 270 leveling agents), defoamers (dimethyl silane), rheology aids (fumed silica), flexible additives (polyethylene glycol (400) diacrylate), photoinitiators (eta 6-isopropylbenzene ferrocene hexafluorophosphate), ultraviolet absorbers (2- (2 '-hydroxy-5' -methylphenyl) benzotriazole), chain transfer agents (2, 4-diphenyl-4-methyl-1-pentene), free radical control agents (p-hydroxyanisole); the weight ratio of the leveling agent, the defoamer, the rheological additive, the flexible additive, the photoinitiator, the ultraviolet absorber, the chain transfer agent and the free radical control agent is 0.5:0.5:0.5:0.5:0.5:0.5:0.5:0.5.
the photosensitive resin composition includes an acid monomer (acrylic acid), a high oxygen content monomer (polyethylene glycol methacrylate), a backbone monomer (propyl methacrylate), a curing monomer (triglycidyl methacrylate), and an initiator (azobisisobutyronitrile); the weight ratio of the acidic monomer to the high-oxygen content monomer to the skeleton monomer to the curing monomer to the initiator is 8:20:12:15:4.
the solvent comprises ethylene glycol monobutyl ether and propylene glycol monomethyl ether; the weight ratio of the ethylene glycol monobutyl ether to the propylene glycol monomethyl ether is 2:1.
The preparation method of the yellow light slurry comprises the following steps:
uniformly mixing the photosensitive resin composition, the additive and the solvent to obtain a mixed solution, uniformly mixing the mixed solution and the metal powder, and grinding to obtain yellow light slurry.
Example 3
A yellow light slurry, comprising the following components in percentage by weight: 80% of metal powder, 10% of solvent, 2% of additive and 8% of photosensitive resin composition;
the metal powder comprises the following components in percentage by weight: 85% of silver powder with an average particle size of 0.4 μm and 15% of silver powder with an average particle size of 0.8 μm.
The additives comprise leveling agents (TEGO 270 leveling agents), defoamers (dimethyl silane), rheology aids (fumed silica), flexible additives (stearyl methacrylate), photoinitiators (1- [4- (phenylsulfanyl) phenyl ] -1, 2-octanedione 2- (O-benzoyl oxime)), ultraviolet absorbers (resorcinol monobenzoate), chain transfer agents (2, 4-diphenyl-4-methyl-1-pentene), free radical control agents (p-hydroxyanisole); the weight ratio of the leveling agent, the defoamer, the rheological additive, the flexible additive, the photoinitiator, the ultraviolet absorber, the chain transfer agent and the free radical control agent is 0.5:0.5:0.5:0.5:0.5:0.5:0.5:0.5.
the photosensitive resin composition includes an acid monomer (acrylic acid), a high oxygen content monomer (polyethylene glycol methacrylate), a backbone monomer (propyl methacrylate), a curing monomer (triglycidyl methacrylate), and an initiator (azobisisobutyronitrile); the weight ratio of the acidic monomer to the high-oxygen content monomer to the skeleton monomer to the curing monomer to the initiator is 8:20:12:15:4.
the solvent comprises ethylene glycol monobutyl ether and propylene glycol monomethyl ether; the weight ratio of the ethylene glycol monobutyl ether to the propylene glycol monomethyl ether is 2:1.
The preparation method of the yellow light slurry comprises the following steps:
uniformly mixing the photosensitive resin composition, the additive and the solvent to obtain a mixed solution, uniformly mixing the mixed solution and the metal powder, and grinding to obtain yellow light slurry.
Comparative example 1
Comparative example 1 differs from example 1 in that the additives are different and all others are the same.
A yellow light slurry, comprising the following components in percentage by weight: 80% of metal powder, 6% of solvent, 3.5% of additive and 10.5% of photosensitive resin composition.
The additives of this comparative example included leveling agents (TEGO 270 leveling agent), defoamers (dimethylsilane), rheology aids (fumed silica), UV absorbers (2- (2 '-hydroxy-5' -methylphenyl) benzotriazole); the weight ratio of the leveling agent to the defoamer to the rheological auxiliary agent to the ultraviolet absorber is 0.5:0.5:0.5:0.4.
comparative example 2
Comparative example 2 is different from example 1 in that the photosensitive resin composition of the present application was the photosensitive resin composition of example 1 of patent CN109143780a, and all other things were the same.
A yellow light slurry, comprising the following components in percentage by weight: 80% of metal powder, 6% of solvent, 3.5% of additive and 10.5% of photosensitive resin composition.
The photosensitive resin composition of this comparative example was prepared as follows: ultrasonic dissolution and mixing were performed on [1‑ hydroxy ≡ # x2011;2 ≡ # x2011; -. Propylene glycol methyl ether (70 g) is added into a glass reaction kettle with a reflux condenser, argon is introduced at 85 ℃ for protection stirring, the mixture is gradually added into the glass reaction kettle by a dropping funnel in a dropwise manner, the temperature is kept at 85 ℃, and stirring is carried out for 4 hours for reaction, so that the photosensitive resin composition is obtained.
Test case
When the yellow light paste of the present application was screen-coated, a double-sided fine grid cell as shown in fig. 2 was formed, and when single-sided coating was performed, a single-sided fine grid cell as shown in fig. 3 was formed,
the yellow pastes of examples 1 to 3 and comparative examples 1 to 2 were screen-coated on the solar cell shown in fig. 2, dried at 90 c, exposed to 100-400mj energy using Mask exposure Mask of a grid pattern, developed with a weak alkaline aqueous solution, and then cured at 180 c, and the resistivity and transmittance are shown in table 1.
The yellow light slurry metal grid can remarkably improve light transmittance and has excellent conductivity.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present application and not for limiting the scope of the present application, and although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present application without departing from the spirit and scope of the technical solution of the present application.
Claims (7)
1. The application of the yellow light slurry in the preparation of heterojunction solar cells is characterized in that the yellow light slurry is prepared from the following components in percentage by weight: 65-90% of silver powder, 2-10% of solvent, 0.5-5% of additive and 8-34% of photosensitive resin composition;
the silver powder comprises the following components in percentage by weight: 60-95% of silver powder with an average particle size of 0.2-0.5 mu m, 5-40% of silver powder with an average particle size of 0.5-1 mu m;
the additive comprises a leveling agent, a defoaming agent, a rheological additive, a flexible additive, a photoinitiator, an ultraviolet absorber, a chain transfer agent and a free radical control agent;
the weight ratio of the leveling agent, the defoamer, the rheological additive, the flexible additive, the photoinitiator, the ultraviolet absorber, the chain transfer agent and the free radical control agent is (0.2-1): (0.2-1): (0.2-1): (0.2 to 0.8): (0.2 to 0.8): (0.2 to 0.8): (0.2 to 0.8): (0.2 to 0.8);
the photosensitive resin composition comprises an acid monomer, a high-oxygen-content monomer, a skeleton monomer, a curing monomer and an initiator; the weight ratio of the acidic monomer to the high-oxygen content monomer to the skeleton monomer to the curing monomer to the initiator is (5-10): (5-30): (10-15): (5-25): (0.2 to 5).
2. The use according to claim 1, wherein the leveling agent comprises at least one of a modified polyether siloxane, an acrylate polymer, a fluoropolyether siloxane, a fluoroacrylate polymer; and/or
The defoamer comprises at least one of dimethyl silane and polysiloxane; and/or
The rheological additive comprises at least one of fumed silica, polyamide wax, polydimethyl silicone oil, organic bentonite, talcum powder, ethyl cellulose and hydroxymethyl cellulose; and/or
The ultraviolet absorbent is at least one selected from 2- (2 ' -hydroxy-5 ' -methylphenyl) benzotriazole, 2, 4-dihydroxybenzophenone, 2- (2 ' -hydroxy-3 ',5' -di-tert-phenyl) -5-chlorobenzotriazole, resorcinol monobenzoate, 2' -thiobis (4-tert-octylphenol oxy) nickel, tris (1, 2, 6-pentamethylpiperidyl) phosphite, 2,4, 6-tris (2 ' -n-butoxyphenyl) -1,3, 5-triazine, 4-benzoyloxy-2, 6-tetramethylpiperidine and hexamethylphosphoric triamide.
3. The use according to claim 1, wherein the flexible additive comprises at least one of 3 (ethoxy) trimethylolpropane triacrylate, 9 (ethoxy) trimethylolpropane triacrylate, 15 (ethoxy) trimethylolpropane triacrylate, polyethylene glycol (200) diacrylate, polyethylene glycol (400) diacrylate, polyethylene glycol (600) diacrylate, polyethylene glycol (1500) diacrylate, epsilon-caprolactone modified dipentaerythritol hexaacrylate, lauryl methacrylate, stearyl methacrylate; and/or
The photoinitiator comprises at least one of eta 6-isopropylbenzene ferrocene hexafluorophosphate, 1- [4- (phenylthio) phenyl ] -1, 2-octane dione 2- (O-benzoyl oxime), 1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl ] ethanone 1- (O-acetyl oxime), 3- (1-acetoxyimino) ethyl-6- [4- (2-acetoxyethyl dioxothio) -2-methyl ] benzoyl-9-ethylcarbazole; and/or
The chain transfer agent comprises at least one of isooctyl 3-mercaptopropionate, 2, 4-diphenyl-4-methyl-1-pentene, octadecyl mercaptan, isopropanol and sodium formate; and/or
The free radical control agent comprises at least one of p-hydroxyanisole, hydroquinone, phenothiazine, pentaerythritol tetra (3-mercaptopropionate), bis (2, 6-tetramethyl-4-piperidyl) sebacate nitroxide free radical and 4-hydroxy-2, 6-tetramethyl piperidine-1-oxyl free radical.
4. The use according to claim 1, wherein the acidic monomers comprise at least one of acrylic acid, methacrylic acid, glycolic acid; and/or
The high-oxygen-content monomer comprises at least one of polyethylene glycol acrylate, polyethylene glycol methacrylate, ethylene glycol methacrylate and polypropylene glycol methacrylate; and/or
The backbone monomers include at least one of styrene, methyl methacrylate, methyl acrylate, ethyl methacrylate, ethyl acrylate, propyl methacrylate, propyl acrylate, n-butyl methacrylate, n-butyl acrylate, isobutyl methacrylate, isobutyl acrylate, pentyl acrylate, n-hexyl methacrylate, n-hexyl acrylate, n-heptyl methacrylate, n-heptyl acrylate, n-octyl methacrylate, n-octyl acrylate, undecyl methacrylate, undecyl acrylate, tridecyl methacrylate, tridecyl acrylate, pentadecyl methacrylate, pentadecyl acrylate, cetyl methacrylate, cetyl acrylate, stearyl methacrylate, stearyl acrylate, eicosyl methacrylate, behenyl acrylate, behenyl methacrylate, and behenyl acrylate.
5. The use according to claim 1, wherein the curing monomer comprises at least one of 2-isocyanatoethyl methacrylate, triglycidyl methacrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, hydroxyethyl acrylate, hydroxypropyl acrylate; and/or
The initiator comprises at least one of azobisethylnitrile, azobisisoheptonitrile and dimethyl azobisisobutyrate.
6. The use according to claim 1, wherein the solvent comprises at least one of ethylene glycol monobutyl ether, propylene glycol monomethyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, ethylene glycol methyl ether acetate, propylene glycol methyl ether acetate, mixed dibasic acid dibasic ester.
7. The use according to claim 1, characterized in that the preparation method of the yellow light paste comprises the following steps:
uniformly mixing the photosensitive resin composition, the additive and the solvent to obtain a mixed solution, uniformly mixing the mixed solution and silver powder, and carrying out three-roller grinding refinement to obtain yellow light slurry.
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106803441A (en) * | 2015-10-26 | 2017-06-06 | 康准电子科技(昆山)有限公司 | Silicon solar cell back electrode silver paste and preparation method thereof |
CN110335700A (en) * | 2019-06-28 | 2019-10-15 | 乾宇电子材料(苏州)有限公司 | High temperature sintering type yellow light electrocondution slurry, conducting wire and preparation method |
CN111929989A (en) * | 2020-08-28 | 2020-11-13 | 乾宇电子材料(深圳)有限公司 | Photosensitive resin composition, preparation method thereof, photosensitive organic carrier and yellow light paste |
CN112951479A (en) * | 2021-02-07 | 2021-06-11 | 北京中科纳通电子技术有限公司 | Conductive silver paste for filter and preparation method thereof |
CN113903496A (en) * | 2021-10-29 | 2022-01-07 | 江苏正能电子科技有限公司 | Busbar repair type silver paste suitable for PERC and preparation method thereof |
CN115206584A (en) * | 2021-03-27 | 2022-10-18 | 广东金乌新材料科技有限公司 | Low-cost silver-coated copper slurry for solar heterojunction battery and preparation method thereof |
CN115331866A (en) * | 2022-08-17 | 2022-11-11 | 江苏正能电子科技有限公司 | Low-temperature curing conductive silver paste based on capillary suspension theory and preparation method thereof |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011013927A2 (en) * | 2009-07-28 | 2011-02-03 | 주식회사 동진쎄미켐 | Thermosetting electrode paste fireable at a low temperature |
-
2023
- 2023-07-03 CN CN202310798890.4A patent/CN116543950B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106803441A (en) * | 2015-10-26 | 2017-06-06 | 康准电子科技(昆山)有限公司 | Silicon solar cell back electrode silver paste and preparation method thereof |
CN110335700A (en) * | 2019-06-28 | 2019-10-15 | 乾宇电子材料(苏州)有限公司 | High temperature sintering type yellow light electrocondution slurry, conducting wire and preparation method |
CN111929989A (en) * | 2020-08-28 | 2020-11-13 | 乾宇电子材料(深圳)有限公司 | Photosensitive resin composition, preparation method thereof, photosensitive organic carrier and yellow light paste |
CN112951479A (en) * | 2021-02-07 | 2021-06-11 | 北京中科纳通电子技术有限公司 | Conductive silver paste for filter and preparation method thereof |
CN115206584A (en) * | 2021-03-27 | 2022-10-18 | 广东金乌新材料科技有限公司 | Low-cost silver-coated copper slurry for solar heterojunction battery and preparation method thereof |
CN113903496A (en) * | 2021-10-29 | 2022-01-07 | 江苏正能电子科技有限公司 | Busbar repair type silver paste suitable for PERC and preparation method thereof |
CN115331866A (en) * | 2022-08-17 | 2022-11-11 | 江苏正能电子科技有限公司 | Low-temperature curing conductive silver paste based on capillary suspension theory and preparation method thereof |
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