CN116536731A - 一种含镍钴合金镀层的高耐磨低损耗金刚石线锯及其制备方法 - Google Patents
一种含镍钴合金镀层的高耐磨低损耗金刚石线锯及其制备方法 Download PDFInfo
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 47
- 239000010432 diamond Substances 0.000 title claims abstract description 47
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- 229910000531 Co alloy Inorganic materials 0.000 title claims abstract description 27
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 239000011248 coating agent Substances 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title abstract description 7
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000009713 electroplating Methods 0.000 claims abstract description 12
- 239000000126 substance Substances 0.000 claims abstract description 12
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 11
- 238000005406 washing Methods 0.000 claims description 47
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 38
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 30
- 239000002585 base Substances 0.000 claims description 14
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 10
- 238000005554 pickling Methods 0.000 claims description 10
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- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 9
- 229910001080 W alloy Inorganic materials 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 5
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- 239000002253 acid Substances 0.000 claims description 5
- 239000003513 alkali Substances 0.000 claims description 5
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 5
- 239000004327 boric acid Substances 0.000 claims description 5
- 229910000361 cobalt sulfate Inorganic materials 0.000 claims description 5
- 229940044175 cobalt sulfate Drugs 0.000 claims description 5
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 5
- 239000006210 lotion Substances 0.000 claims description 5
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 5
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 5
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims description 5
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 5
- 239000011780 sodium chloride Substances 0.000 claims description 5
- 235000019795 sodium metasilicate Nutrition 0.000 claims description 5
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 5
- 229910000975 Carbon steel Inorganic materials 0.000 claims description 4
- 239000010962 carbon steel Substances 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 238000007772 electroless plating Methods 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 16
- 238000007596 consolidation process Methods 0.000 abstract description 4
- 230000000704 physical effect Effects 0.000 abstract description 2
- 230000036632 reaction speed Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 64
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- 229910045601 alloy Inorganic materials 0.000 description 12
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- 230000000052 comparative effect Effects 0.000 description 7
- 229910000677 High-carbon steel Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
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- C25D3/00—Electroplating: Baths therefor
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Abstract
本发明公开了一种含镍钴合金镀层的高耐磨低损耗金刚石线锯及其制备方法，包括线锯基体和表面包裹的两层金属镀层，其中所述两层金属镀层的内层为镍磷合金镀层，外层为镍钴合金镀层。镀层结构优化为双层，最外层由纯镍优化为镍钴合金，可以进一步提升强度、镀层硬度，降低应力，达到提高颗粒固结力、降低断线率，降低线耗的目的。制备方法采用化学镀+电镀相结合的工艺，反应速度快，镀层应力小，物理性能好，成品线锯性能优良。
Description
技术领域
本发明涉及金刚石线锯领域，尤其是一种含镍钴合金镀层的高耐磨低损耗金刚石线锯。
背景技术
近年来随着光伏市场的扩张，金刚线产业迅速发展。目前常规金刚线通过在金属基线上镀一层金属镍固结金刚砂。但是在切割过程中，单一镍层存在硬度低易开裂脱落、固结力低、颗粒脱落率高、强度损失高等缺陷，造成切割线耗高、断线率高等问题。
如何解决上述现有金刚线存在的线耗高、断线率高等问题，提高切割效率，降低成本值得研究。
发明内容
发明目的：为了解决现有技术所存在的问题，本发明提供了一种含镍钴合金镀层的高耐磨低损耗金刚石线锯及其制备方法，有效降低金刚线的断线率，线耗以及颗粒脱落率。
技术方案：为达到上述目的，本发明可采用如下技术方案：
一种含镍钴合金镀层的高耐磨低损耗金刚石线锯，包括线锯基体和表面包裹的两层金属镀层，其中所述两层金属镀层的内层为镍磷合金镀层，外层为镍钴合金镀层。
更进一步的，所述线锯基体为金属线，材质为碳钢或钨合金，直径≥20μm，强度≥5000Mpa。
更进一步的，所述镍磷合金镀层中镍含量≥90wt％，磷含量≤10wt％，厚度≤0.5μm；所述镍钴合金镀层中镍含量≥90wt％，钴含量≥5wt％，厚度≥1.8μm。
更进一步的，制成金刚线后镀层硬度≥200HV，镀层应力≤120Mpa。
本发明还公开了一种含镍钴合金镀层的高耐磨低损耗金刚石线锯的制备方法，包括线锯基体前处理、化学镀、电镀上砂以及水洗的步骤。
更进一步的，所述基体前处理具体步骤如下：将碳钢丝或钨合金丝进行碱洗-一次水洗-酸洗-二次水洗。
更进一步的，所述碱洗的洗液配方和参数为：30g/L氢氧化钠，10g/L偏硅酸钠，10g/L氯化钠，碱洗时间为30s，温度为50℃，超声频率为30HZ；所述一次水洗使用pH为6.2-6.5，电导率≤2.5us/cm的纯水；所述酸洗的洗液配方和参数为：25g/L盐酸，酸洗时间为30s，温度为20℃；所述二次水洗使用pH为6.5-6.8，电导率≤2.5us/cm的去离子纯水。
更进一步的，所述化学镀的具体步骤如下：通过化学镀在金属基线表面预镀一层镍磷合金，镀液的配方为：30g/LNiSO4·6H2O，35g/LNaH2PO2·H2O，20g/LNa3C6H5O7·2H2O，PH值为4.0-4.3，温度为85-88℃，采用往复式循环工艺，总时间为90min。
更进一步的，所述电镀上砂的具体步骤如下：在金属线表面沉积金刚砂的同时电镀镍钴合金，镀液成分的配方为：350-400g/L氨基磺酸镍，60-65g/L硫酸镍，80-85g/L硫酸钴，50-55g/L氯化镍，50-55g/L硼酸，电流密度为18-20A/dm2，总时长为60s。
更进一步的，所述水洗的具体步骤为：通过加入氢氧化钠将纯水pH值调整为为7.0～7.3，温度为50℃，超声频率为40Hz，处理时间10s。
有益效果：本发明具有以下优点：
(1)成品线锯破断拉力高，可适应更高的切割张力及切割速度；颗粒固结力高，切割损耗低；
(2)镀层结构优化为双层，最外层由纯镍优化为镍钴合金，可以进一步提升强度、镀层硬度，降低应力，达到提高颗粒固结力、降低断线率，降低线耗的目的。
(3)制备方法采用化学镀+电镀相结合的工艺，反应速度快，镀层应力小，物理性能好，成品线锯性能优良。
附图说明
图1是本发明实施例1含镍钴合金镀层的高耐磨低损耗金刚石线切割后颗粒示意图；
图2是本发明对比例1常规高碳钢丝金刚线切割后颗粒示意图。
具体实施方式
实施例1-3以及对比例1金属基线采用破断拉力6.5N，直径35μm钨合金丝。
实施例1：
(1)基体前处理：将金属基线进行碱洗-一次水洗-酸洗-二次水洗。
所述碱洗的洗液配方和参数为：30g/L氢氧化钠，10g/L偏硅酸钠，10g/L氯化钠，碱洗时间为30s，温度为50℃，超声频率为30HZ；所述一次水洗使用pH为6.2-6.5，电导率≤2.5us/cm的纯水；所述酸洗的洗液配方和参数为：25g/L盐酸，酸洗时间为30s，温度为20℃；所述二次水洗使用pH为6.5-6.8，电导率≤2.5us/cm的去离子纯水。
(2)化学镀：通过化学镀在金属基线表面预镀一层镍磷合金，镀液的配方为：30g/LNiSO4·6H2O，35g/LNaH2PO2·H2O，20g/LNa3C6H5O7·2H2O，PH值为4.0-4.3，温度为85-88℃，采用往复式循环工艺，总时间为90min。
(3)电镀上砂：在金属线表面沉积金刚砂的同时电镀镍钴合金，镀液成分的配方为：350g/L氨基磺酸镍，60g/L硫酸镍，80g/L硫酸钴，50g/L氯化镍，50g/L硼酸，电流密度为18A/dm2，总时长为60s。
(4)水洗的具体步骤为：通过加入氢氧化钠将纯水pH值调整为为7.0～7.3，温度为50℃，超声频率为40Hz，处理时间10s。
制成金刚线的两层金属镀层中，内层为Ni-5P合金层，厚度为0.5μm，外层为Ni-5Co合金层，厚度为2μm，制成金刚线后镀层硬度为220HV，镀层应力为95Mpa，破断拉力为6.9N。
实施例2：
(1)基体前处理：将金属基线进行碱洗-一次水洗-酸洗-二次水洗。
所述碱洗的洗液配方和参数为：30g/L氢氧化钠，10g/L偏硅酸钠，10g/L氯化钠，碱洗时间为30s，温度为50℃，超声频率为30HZ；所述一次水洗使用pH为6.2-6.5，电导率≤2.5us/cm的纯水；所述酸洗的洗液配方和参数为：25g/L盐酸，酸洗时间为30s，温度为20℃；所述二次水洗使用pH为6.5-6.8，电导率≤2.5us/cm的去离子纯水。
(2)化学镀：通过化学镀在金属基线表面预镀一层镍磷合金，镀液的配方为：30g/LNiSO4·6H2O，35g/LNaH2PO2·H2O，20g/LNa3C6H5O7·2H2O，PH值为4.0-4.3，温度为85-88℃，采用往复式循环工艺，总时间为90min。
(3)电镀上砂：在金属线表面沉积金刚砂的同时电镀镍钴合金，镀液成分的配方为：400g/L氨基磺酸镍，65g/L硫酸镍，85g/L硫酸钴，55g/L氯化镍，55g/L硼酸，电流密度为20A/dm2，总时长为60s。
(4)水洗的具体步骤为：通过加入氢氧化钠将纯水pH值调整为为7.0～7.3，温度为50℃，超声频率为40Hz，处理时间10s。
制成金刚线的两层金属镀层中，内层为Ni-5P合金层，厚度为0.5μm，外层为Ni-8Co合金层，厚度为2μm，制成金刚线后镀层硬度为240HV，镀层应力为106Mpa，破断拉力为6.9N。
实施例3：
(1)基体前处理：将金属基线进行碱洗-一次水洗-酸洗-二次水洗。
所述碱洗的洗液配方和参数为：30g/L氢氧化钠，10g/L偏硅酸钠，10g/L氯化钠，碱洗时间为30s，温度为50℃，超声频率为30HZ；所述一次水洗使用pH为6.2-6.5，电导率≤2.5us/cm的纯水；所述酸洗的洗液配方和参数为：25g/L盐酸，酸洗时间为30s，温度为20℃；所述二次水洗使用pH为6.5-6.8，电导率≤2.5us/cm的去离子纯水。
(2)化学镀：通过化学镀在金属基线表面预镀一层镍磷合金，镀液的配方为：30g/LNiSO4·6H2O，35g/LNaH2PO2·H2O，20g/LNa3C6H5O7·2H2O，PH值为4.0-4.3，温度为85-88℃，采用往复式循环工艺，总时间为90min。
(3)电镀上砂：在金属线表面沉积金刚砂的同时电镀镍钴合金，镀液成分的配方为：380g/L氨基磺酸镍，63g/L硫酸镍，83g/L硫酸钴，53g/L氯化镍，53g/L硼酸，电流密度为19A/dm2，总时长为60s。
(4)水洗的具体步骤为：通过加入氢氧化钠将纯水pH值调整为为7.0～7.3，温度为50℃，超声频率为40Hz，处理时间10s。
制成金刚线的两层金属镀层中，内层为Ni-1P合金层，厚度为0.1μm，外层为Ni-10Co合金层，厚度为2.2μm，制成金刚线后镀层硬度为245HV，镀层应力为112Mpa，破断拉力为7.0N。
对比例1：
镀层单层纯镍，厚度为3μm，制成金刚线后镀层硬度为182HV，镀层应力为116Mpa，破断拉力为6.8N。
将实施例1-3以及对比例1分别切割M10尺寸硅片，切割张力设定为4.0N，切割时间分别设定100、120min，切割刀数都为100刀。将切割后的旧线重新测试破断拉力及颗粒数目，与新线样对比颗粒磨损率，结果如表1所示。
表1钨合金丝基线不同实例切割数据对比
由表1可知，以钨合金作基线，本发明所涉金刚石线锯切割后破断力降低在0.2N之内，颗粒磨损率在10％之内，在100、120min切割时间下颗粒磨损率、A品率、断线率及线耗均优于常规纯镍层金刚线。
实施例4-6以及对比例2金属基线采用破断拉力7.0N，直径43μm高碳钢丝。
实施例4：
具体实施方式与实施例1基本相同，不同之处在于金属基线，制成金刚线的两层金属镀层中，内层为Ni-5P合金层，厚度为0.5μm，外层为Ni-5Co合金层，厚度为2μm，制成金刚线后镀层硬度为220HV，镀层应力为98Mpa，破断拉力为7.4N。
实施例5：
具体实施方式与实施例2基本相同，不同之处在于金属基线，制成金刚线的两层金属镀层中，内层为Ni-5P合金层，厚度为0.4μm，外层为Ni-10Co合金层，厚度为2μm，制成金刚线后镀层硬度为232HV，镀层应力为112Mpa，破断拉力为7.4N；
实施例6：
具体实施方式与实施例3基本相同，不同之处在于金属基线，制成金刚线的两层金属镀层中，内层为Ni-1P合金层，厚度为0.1μm，外层为Ni-12Co合金层，厚度为2μm，制成金刚线后镀层硬度为235HV，镀层应力为115Mpa，破断拉力为7.4N；
对比例2：
镀层单层纯镍，厚度为3μm，制成金刚线后镀层硬度为178HV，镀层应力为195Mpa，破断拉力为7.3N。
将实施例4-6以及对比例2分别切割G12尺寸硅片，切割张力设定为4.0N，切割时间分别设定100、120min，切割刀数都为100刀。将切割后的旧线重新测试破断拉力及颗粒数目，与新线样对比颗粒磨损率，结果如表2所示。
表2高碳钢丝基线不同实例切割数据对比
由表2可知，以高碳钢丝作基线，本发明所涉金刚石线锯在100、120min切割时间下颗粒磨损率、A品率、断线率及线耗亦优于常规纯镍层金刚线。请参阅图1-2所示，图2为常规金刚线切割后的颗粒分布形貌，颗粒脱落较为明显，图1为本发明所涉金刚线，切割后颗粒基本无脱落情况。
Claims (10)
1.一种含镍钴合金镀层的高耐磨低损耗金刚石线锯，其特征在于包括线锯基体和表面包裹的两层金属镀层，其中所述两层金属镀层的内层为镍磷合金镀层，外层为镍钴合金镀层。
2.根据权利要求1所述的含镍钴合金镀层的高耐磨低损耗金刚石线锯，其特征在于：所述线锯基体为金属线，材质为碳钢或钨合金，直径≥20μm，强度≥5000Mpa。
3.根据权利要求1所述的含镍钴合金镀层的高耐磨低损耗金刚石线锯，其特征在于：所述镍磷合金镀层中镍含量≥90wt％，磷含量≤10wt％，厚度≤0.5μm；所述镍钴合金镀层中镍含量≥90wt％，钴含量≥5wt％，厚度≥1.8μm。
4.根据权利要求1所述的含镍钴合金镀层的高耐磨低损耗金刚石线锯，其特征在于制成金刚线后镀层硬度≥200HV，镀层应力≤120Mpa。
5.一种权利要求1-4所述的含镍钴合金镀层的高耐磨低损耗金刚石线锯的制备方法，其特征在于包括线锯基体前处理、化学镀、电镀上砂以及水洗的步骤。
6.根据权利要求4所述的含镍钴合金镀层的高耐磨低损耗金刚石线锯的制备方法，其特征在于所述基体前处理具体步骤如下：将碳钢丝或钨合金丝进行碱洗-一次水洗-酸洗-二次水洗。
7.根据权利要求6所述的含镍钴合金镀层的高耐磨低损耗金刚石线锯的制备方法，其特征在于：所述碱洗的洗液配方和参数为：30g/L氢氧化钠，10g/L偏硅酸钠，10g/L氯化钠，碱洗时间为30s，温度为50℃，超声频率为30HZ；所述一次水洗使用pH为6.2-6.5，电导率≤2.5us/cm的纯水；所述酸洗的洗液配方和参数为：25g/L盐酸，酸洗时间为30s，温度为20℃；所述二次水洗使用pH为6.5-6.8，电导率≤2.5us/cm的去离子纯水。
8.根据权利要求4所述的含镍钴合金镀层的高耐磨低损耗金刚石线锯的制备方法，其特征在于所述化学镀的具体步骤如下：通过化学镀在金属基线表面预镀一层镍磷合金，镀液的配方为：30g/LNiSO4·6H2O，35g/LNaH2PO2·H2O，20g/LNa3C6H5O7·2H2O，PH值为4.0-4.3，温度为85-88℃，采用往复式循环工艺，总时间为90min。
9.根据权利要求4所述的含镍钴合金镀层的高耐磨低损耗金刚石线锯的制备方法，其特征在于所述电镀上砂的具体步骤如下：在金属线表面沉积金刚砂的同时电镀镍钴合金，镀液成分的配方为：350-400g/L氨基磺酸镍，60-65g/L硫酸镍，80-85g/L硫酸钴，50-55g/L氯化镍，50-55g/L硼酸，电流密度为18-20A/dm2，总时长为60s。
10.根据权利要求4所述的含镍钴合金镀层的高耐磨低损耗金刚石线锯的制备方法，其特征在于所述水洗的具体步骤为：通过加入氢氧化钠将纯水pH值调整为为7.0～7.3，温度为50℃，超声频率为40Hz，处理时间10s。
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