CN116533084A - Monocrystalline silicon grinding device and grinding method - Google Patents
Monocrystalline silicon grinding device and grinding method Download PDFInfo
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- CN116533084A CN116533084A CN202310763547.6A CN202310763547A CN116533084A CN 116533084 A CN116533084 A CN 116533084A CN 202310763547 A CN202310763547 A CN 202310763547A CN 116533084 A CN116533084 A CN 116533084A
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 100
- 238000000227 grinding Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000005484 gravity Effects 0.000 claims abstract description 6
- 238000005498 polishing Methods 0.000 claims description 44
- 238000001179 sorption measurement Methods 0.000 claims description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 244000137852 Petrea volubilis Species 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 5
- 239000010419 fine particle Substances 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 9
- 230000000087 stabilizing effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000000274 adsorptive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention relates to the technical field of monocrystalline silicon grinding, and discloses a monocrystalline silicon grinding device and a grinding method. According to the monocrystalline silicon grinding device and the grinding method, the elastic strength of the spiral spring and the pressure difference between the total gravity of the rotating parts above the monocrystalline silicon piece are controlled, so that the pressure between the monocrystalline silicon piece and the grinding wheel can be effectively controlled, and the abrasive paper and the monocrystalline silicon piece have optimal grinding pressure during grinding by controlling the contact pressure during grinding, so that the quality of the surface of the monocrystalline silicon piece after grinding can be ensured on the premise of ensuring the grinding efficiency.
Description
Technical Field
The invention relates to the technical field of monocrystalline silicon grinding, in particular to a monocrystalline silicon grinding device and a grinding method.
Background
The single crystal silicon rod is produced and then subjected to the working procedures of cutting, external diameter barreling, end face grinding, polishing, slicing, chamfering and the like. Because the slicing has the problems of larger thickness deviation, surface waviness and the like, the slicing needs to be ground and processed to be flattened, the currently used plane grinding device is mainly modified by a vertical milling machine, and a milling cutter is changed into a grinding wheel to grind the plane of a silicon wafer.
In order to solve the above technical problems, chinese patent No. CN108942453B discloses a grinding device for monocrystalline silicon, which mainly comprises a base, the base has: the boosting device is arranged on the right surface of the base and is provided with a stabilizing device, the stabilizing device is arranged in an inner groove of a hydraulic block of the boosting device, and vibration caused by grinding can be reduced through the stabilizing device and the stabilizing device is provided with: the control device is arranged on the outer surface of the sleeve of the stabilizing device, and is used for adjusting and controlling the stabilizing device to improve the stabilizing efficiency. The invention has simple structure, can reduce the time of manual alignment during the grinding of the monocrystalline silicon multi-piece, increase the working efficiency, simultaneously automatically turn over when multi-surface grinding is needed, reduce the manual intervention, increase the precision and reduce the harm of manual contact.
In the actual processing process, the pressure between the monocrystalline silicon piece and the grinding wheel cannot be effectively controlled, and because the structural characteristics of the monocrystalline silicon piece are materials with very low ductility and high brittleness, when the pressure between the monocrystalline silicon piece and the grinding wheel is high, the monocrystalline silicon piece is easy to crack, and when the pressure between the monocrystalline silicon piece and the grinding wheel is low, the processing efficiency is low.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the monocrystalline silicon grinding device and the grinding method, by controlling the elastic strength of the spiral spring and the pressure difference between the total gravity of the rotating part above the polished monocrystalline silicon piece, the pressure between the monocrystalline silicon piece and the grinding wheel can be effectively controlled, and by controlling the contact pressure during polishing, the abrasive paper and the monocrystalline silicon piece can have the optimal polishing pressure during polishing, so that the quality of the surface of the polished monocrystalline silicon piece can be ensured under the premise of ensuring the polishing efficiency, and the technical problems are solved.
In order to achieve the above purpose, the present invention provides the following technical solutions: the monocrystalline silicon grinding device comprises a longitudinal shell, a driving motor, a component mounting cavity, a hexagonal rotating column and a driving motor, wherein the bottom of the longitudinal shell is provided with supporting legs, the driving motor is inversely arranged at the top end of the longitudinal shell, the component mounting cavity is arranged in the longitudinal shell and is provided with an opening at the bottom end, the hexagonal rotating column is positioned in the top area of the component mounting cavity, and the hexagonal rotating column rotates along with the rotor of the driving motor; the internal thread groove is arranged at the bottom end of the component mounting cavity; the telescopic rotary linkage structure is positioned in the central area of the component mounting cavity, can longitudinally move along the component mounting cavity, rotates along with the hexagonal rotary column and is internally provided with a main spiral spring for counteracting the gravity of the component; the rotary positioning structure is partially fixedly arranged at the longitudinal inner wall of the component mounting cavity, and the other part of the rotary positioning structure can be sleeved on the circumferential side surface of the telescopic rotary linkage structure in a relatively rotary manner through a bearing; the elastic rotary polishing structure rotates along with the rotary end at the bottom of the telescopic rotary linkage structure, and sand paper for polishing the surface of the monocrystalline silicon piece is arranged in the elastic rotary polishing structure; and the deformation type adsorption limiting structure is screwed into the internal thread groove, and an arc plate which can relatively deform to cause the change of the accommodating area under the action of corresponding longitudinal force is arranged in the deformation type adsorption limiting structure.
Preferably, the telescopic rotary linkage structure comprises an inner rotary column, the top center of the inner rotary column is provided with a downward recess and an inner hexagonal groove for inserting the hexagonal rotary column, a columnar moving cavity is formed in the inner rotary column, a plurality of annular array type special-shaped limiting sliding grooves are formed in the circumferential surface of the columnar moving cavity, a movable plate capable of axially moving along the inner cylindrical moving cavity is arranged in the columnar moving cavity, a plurality of special-shaped sliding rails which are correspondingly inserted into the special-shaped limiting sliding grooves are arranged on the circumferential surface of the movable plate, a main spiral spring is arranged at the bottom end of the movable plate, and a telescopic rod penetrating through the bottom center structure of the inner rotary column is arranged at the bottom end center of the movable plate.
Preferably, the length of the main spiral spring is smaller than the height of the columnar moving cavity, and the elastic strength in an initial state is smaller than the total weight of the movable plate, the special-shaped sliding rail, the telescopic rod and the elastic rotary polishing structure.
Preferably, the dimension of the cross section of the inner hexagonal groove is consistent with the corresponding dimension of the cross section of the hexagonal rotating column, and the depth of the inner hexagonal groove is larger than the length of the hexagonal rotating column.
Preferably, the rotary positioning structure comprises an annular sleeve and a bottom fixing plate, wherein a part sleeving hole is formed in the center of the annular sleeve, the annular sleeve is rotatably fixed on the periphery of the inner rotary column through a bearing in the part sleeving hole, a top connecting plate is arranged at one side bottom of the annular sleeve, a fixing substrate fixedly arranged on the side face of a part mounting cavity is arranged on one side of the bottom fixing plate, the bottom fixing plate is located under the top connecting plate, an internal threaded hole is formed in the center of the bottom fixing plate, a threaded rod is screwed in the internal threaded hole through threaded fit, a force application plate is arranged at the bottom end of the threaded rod, and the top end of the threaded rod is rotatably arranged inside a bottom surface of the top connecting plate through a bearing.
Preferably, the threaded engagement includes an internal thread structure disposed on an inner wall of the internal threaded hole and an external thread structure on the threaded rod body, and the internal thread structure is engaged with the external thread structure.
Preferably, the elastic rotary polishing structure comprises a rotary plate and a buffer pad, a rod body installation groove for fixedly installing a rod body at the bottom of the telescopic rod is formed in the center of the top end of the rotary plate, an inward concave embedded groove is formed in the position, deviating from the center of the rotary plate, of the bottom of the rotary plate, an annular protruding structure for being fixedly embedded into the inward concave embedded groove is formed in the upper end face of the buffer pad, and a layer of abrasive paper with the bottom surface being a polishing surface is adhered to the bottom surface of the buffer pad.
Preferably, the deformation type adsorption limiting structure comprises a threaded plate body, an external thread tooth capable of being screwed into an internal thread groove is arranged on the circumferential surface of the threaded plate body, a part movable cavity with an opening at the bottom end is arranged in the threaded plate body, a plurality of rubber ring sleeves which are communicated with the upper structure and the top end of the part movable cavity are arranged on the upper end surface of the threaded plate body, a through hole structure is arranged at the center of each rubber ring sleeve, an annular rubber ring is embedded in the periphery of the middle of the part movable cavity of the threaded plate body, an arc-shaped plate is embedded in the inner annular hole part of the annular rubber ring, a hanging rope is embedded in the center of the bottom surface of the arc-shaped plate, and a pull head is arranged at the bottom end of the rope.
Preferably, the arc-shaped plate is a plastic product with high deformation strength.
As a second invention: s1: the threaded rod is rotated according to the thickness of the monocrystalline silicon piece to be ground, so that the pressure when the bottom surface of the abrasive paper is abutted against the upper surface of the monocrystalline silicon piece accords with the optimal pressure during grinding, when the abutting pressure is larger than the optimal pressure, the threaded rod can be rotated, so that the abrasive paper is driven to move upwards for a certain distance, and the abutting pressure at the moment is reduced, otherwise, when the abutting pressure is smaller than the optimal pressure, the threaded rod can be rotated, so that the abrasive paper is driven to move downwards for a certain distance, and the abutting pressure at the moment is increased;
s2: the surface of the monocrystalline silicon piece to be ground is upward, the monocrystalline silicon piece is placed on the upper surface of the threaded plate body in a planar mode, and then the thread rope is pulled downwards until the arc plate is deformed from an upward protruding state to a downward recessed state, so that the surface monocrystalline silicon piece is fixed on the upper surface of the threaded plate body in a planar mode by adsorption;
s3: the top end of the threaded plate body is aligned and inserted into the internal thread groove, and the threaded plate body is rotated in a directional mode, so that the threaded plate body can be screwed into the internal thread groove until the upper end face of the threaded plate body abuts against the top end structure of the internal thread groove;
s4: starting a driving motor, controlling the rotating speed of the driving motor, and driving the abrasive paper to rotate in contact with the upper surface of the monocrystalline silicon piece, wherein fine particles in the abrasive paper can polish the raised part on the surface of the monocrystalline silicon piece while rotating, so that the raised part is polished and eliminated, and the polishing time can be set according to specific conditions;
s5: and the driving motor is closed, the threaded plate body is reversely rotated, the threaded plate body can be screwed out of the internal thread groove, the arc plate is upwards pushed, the arc plate is deformed from a downward concave state to an upward convex state, and the grinded monocrystalline silicon piece can be taken down.
Compared with the prior art, the invention provides a monocrystalline silicon grinding device and a grinding method, which have the following beneficial effects:
the elastic strength of the spiral spring is controlled, and the pressure difference between the elastic strength of the spiral spring and the total gravity of the rotating part above the monocrystalline silicon piece is used for polishing, so that the pressure between the monocrystalline silicon piece and the grinding wheel can be effectively controlled, and the contact pressure during polishing is controlled, so that the abrasive paper and the monocrystalline silicon piece have optimal polishing pressure during polishing, and the quality of the surface of the monocrystalline silicon piece after polishing can be guaranteed on the premise of guaranteeing the polishing efficiency.
Be provided with telescopic rotatory linkage structure, can offset the ascending elasticity that this gross weight produced through main coil spring, only remain the difference between this gross weight and the elasticity, the size of this difference just is the last during polishing, abrasive paper to monocrystalline silicon piece's operating pressure, through the size of controlling this operating pressure, and then make abrasive paper and monocrystalline silicon piece possess the best pressure of polishing when polishing to under the prerequisite of guaranteeing polishing efficiency, can guarantee the quality on monocrystalline silicon piece surface after polishing again.
Be provided with rotary type location structure, because monocrystalline silicon piece thickness can lead to main coil spring extension one end distance to lead to main coil spring's offset dynamics to change, rotatable threaded rod makes it drive abrasive paper upwards to remove certain distance, thereby makes the conflict pressure reduction at this moment, otherwise, when conflict pressure is less than optimum pressure, rotatable threaded rod makes it drive abrasive paper downwards to remove certain distance, thereby makes the conflict pressure increase at this moment, realizes final pressure adjustment.
The elastic rotary polishing structure is arranged, so that the buffer effect can be achieved by the pressure generated when the abrasive paper is abutted against the surface of the monocrystalline silicon piece, soft contact between the abrasive paper and the monocrystalline silicon piece is achieved, the occurrence of the fragile phenomenon caused by overlarge contact pressure of the monocrystalline silicon piece is reduced, and the safety of the monocrystalline silicon piece in grinding is improved.
The deformation type adsorption limiting structure is arranged, the monocrystalline silicon piece is subjected to a positioning function in a working state and is taken down in a non-working state, and because the monocrystalline silicon piece is adsorbed by gas, the gas has certain buffering property, and the arc plate is made of a material with certain deformation capability, the monocrystalline silicon piece can be adsorbed in a certain buffer pressure mode, so that the fixing protection capability of the monocrystalline silicon piece is improved, and the safety of equipment is improved.
Drawings
FIG. 1 is a schematic diagram of the present invention in full section;
FIG. 2 is a perspective view of the present invention;
FIG. 3 is a perspective view of a telescopic rotary linkage according to the present invention;
FIG. 4 is a perspective cross-sectional view of the telescopic rotary linkage of the present invention;
FIG. 5 is a schematic diagram of a rotary positioning structure according to the present invention;
FIG. 6 is a perspective cross-sectional view of a resilient rotary sanding structure in accordance with the present invention;
FIG. 7 is a perspective view of a deformed adsorption limiting structure according to the present invention;
fig. 8 is a perspective cross-sectional view of a deformed adsorption limiting structure in the present invention.
Wherein: 1. a longitudinal housing; 2. a support leg; 3. a driving motor; 4. a hexagonal spin column; 5. a component mounting cavity; 6. an internal thread groove; 7. a telescopic rotary linkage structure; 71. an inner rotating column; 72. an inner hexagonal groove; 73. a columnar moving chamber; 74. special-shaped limiting sliding grooves; 75. a movable plate; 76. a special-shaped sliding rail; 77. a main coil spring; 78. a telescopic rod; 8. a rotary positioning structure; 81. an annular sleeve; 82. a part sleeve hole; 83. a top connection plate; 84. a bottom fixing plate; 85. fixing the substrate; 86. an internal threaded hole; 87. a threaded rod; 88. a force application plate; 9. an elastic rotary polishing structure; 91. a rotating plate; 92. a rod body mounting groove; 93. a concave embedded groove; 94. a cushion pad; 95. an annular projection structure; 96. sand paper; 10. a deformation type adsorption limiting structure; 101. a threaded plate body; 102. a component movable chamber; 103. a rubber ring sleeve; 104. a via structure; 105. an annular rubber ring; 106. an arc-shaped plate; 107. a string; 108. a pull head; 109. and an external thread tooth.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 and 2, a monocrystalline silicon grinding device comprises a longitudinal housing 1 with a supporting leg 2 installed at the bottom, a driving motor 3 inversely installed at the top end of the longitudinal housing 1, and a component installation cavity 5 arranged inside the longitudinal housing 1 and with an opening at the bottom end, wherein monocrystalline silicon wafers can be ground in the component installation cavity 5, scraps generated in the grinding process can be effectively blocked by the longitudinal housing 1, and personnel injury caused by scraps outward injection is prevented.
In order to realize the pluggable linkage, please refer to fig. 1, a hexagonal rotating column 4 is required to be disposed at the top region of the component mounting cavity 5, and rotates with the rotor of the driving motor 3, so that the rotation state of the rotor of the driving motor 3 can be transmitted, and meanwhile, the driven component can not be influenced to move longitudinally along the driven component, thereby realizing the longitudinal adjustment of the driven component, namely, the telescopic rotary linkage structure 7 and the function of driving the driven component to rotate.
In order to realize the threaded connection of the components, referring to fig. 1, an internal thread groove 6 is required to be arranged at the bottom end of the component mounting cavity 5, and the functions of positioning the monocrystalline silicon piece and removing the monocrystalline silicon piece can be realized through the directional rotation deformation adsorption limiting structure 10.
In order to realize elastic interference pressure on the monocrystalline silicon piece, please refer to fig. 1, a telescopic rotary linkage structure 7 is required to be arranged, the telescopic rotary linkage structure is located in the central area of the component mounting cavity 5 and can longitudinally move along the component mounting cavity 5, a main spiral spring 77 for counteracting the gravity of the component is arranged in the telescopic rotary linkage structure along with the rotation of the hexagonal rotary column 4, the pressure on the monocrystalline silicon piece is mainly the total weight of the movable plate 75, the special-shaped sliding rail 76, the telescopic rod 78 and the elastic rotary polishing structure 9, part of the total weight can be counteracted by the upward elasticity generated by the main spiral spring 77, only the difference between the total weight and the elasticity is reserved, the working pressure of the abrasive paper 96 on the monocrystalline silicon piece is controlled by the working pressure when the abrasive paper 1 and the monocrystalline silicon piece are polished, and therefore the quality of the surface of the monocrystalline silicon piece after polishing can be guaranteed on the premise of guaranteeing the polishing efficiency.
With respect to the specific structure of the telescopic rotary linkage 7, please refer to fig. 3 and 4, the telescopic rotary linkage comprises an inner rotary column 71, a downward recess is provided at the center of the top end of the inner rotary column 71 and is used for inserting into an inner hexagonal groove 72 of a hexagonal rotary column 4, in order to realize the movement of the hexagonal rotary column 4 in the inner hexagonal groove 72 and simultaneously transmit the rotation, the size of the cross section of the inner hexagonal groove 72 is required to be consistent with the corresponding size of the cross section of the hexagonal rotary column 4, the depth of the inner hexagonal groove 72 is greater than the length of the hexagonal rotary column 4, a cylindrical moving cavity 73 is provided inside the inner rotary column 71, a plurality of annular array shaped limiting sliding grooves 74 are provided on the circumference of the cylindrical moving cavity 73, a movable plate 75 capable of moving along the axial direction thereof is provided on the circumference of the movable plate 75, a plurality of shaped sliding rails 76 correspondingly inserted into the respective shaped limiting sliding grooves 74 are provided, the main coil spring 77 is installed at the bottom end of the movable plate 75, the telescopic rod 78 penetrating through the bottom center structure of the inner rotation column 71 is installed at the bottom center of the movable plate 75, in order to enable the main coil spring 77 to generate proper pressure on the monocrystalline silicon piece, the length of the main coil spring 77 is required to be smaller than the height of the columnar moving cavity 73, the elastic strength in the initial state is smaller than the total weight force of the movable plate 75, the special-shaped sliding rail 76, the telescopic rod 78 and the elastic rotary polishing structure 9, the inner rotation column 71 can be longitudinally adjusted along the hexagonal rotary column 4 to achieve the change of the space position in operation, and in rotation, the rotation state of the inner rotation column 71 can be transmitted into the telescopic rod 78 due to the effect of the special-shaped limiting sliding groove 74 and the special-shaped sliding rail 76, and further the abrasive paper 96 is driven to rotate to polish the monocrystalline silicon piece, the transmission function of the rotation state is realized.
In order to achieve fine adjustment of the elasticity provided by the main coil spring 77 in the working state, please refer to fig. 1, a rotary positioning structure 8 is required to be provided, a part of the rotary positioning structure is fixedly installed at the longitudinal inner wall of the component installation cavity 5, another part of the rotary positioning structure is sleeved on the circumferential side surface of the telescopic rotary linkage structure 7 in a relatively rotary manner through a bearing, when in the working state, the abrasive paper 96 is abutted against the upper surface of the monocrystalline silicon piece, at this time, the thickness of the monocrystalline silicon piece can cause the main coil spring 77 to stretch by a distance, so that the counteracting force of the main coil spring 77 is changed, the threaded rod 87 can be rotated, the abrasive paper 96 can be driven to move upwards by a certain distance, so that the abutting pressure at this time is reduced, otherwise, the threaded rod 87 can be rotated, so that the abrasive paper 96 can be driven to move downwards by a certain distance, so that the abutting pressure at this time is increased, and final pressure adjustment is achieved.
Referring to fig. 5, referring to the specific structure of the rotary positioning structure 8, the rotary positioning structure comprises an annular sleeve 81 and a bottom fixing plate 84, a part sleeving hole 82 is formed in the center of the annular sleeve 81, the annular sleeve 81 is rotatably fixed on the periphery of the circumferential surface of the inner rotary column 71 through a bearing in the part sleeving hole 82, a top connecting plate 83 is arranged at the bottom of one side of the annular sleeve 81, a fixing base plate 85 fixedly installed on the side surface of the part mounting cavity 5 is arranged at one side of the bottom fixing plate 84, the bottom fixing plate 84 is located under the top connecting plate 83, an internal threaded hole 86 is formed in the center of the bottom fixing plate 84, a threaded rod 87 is screwed into the internal threaded hole 86 through threaded fit, a force application plate 88 is arranged at the bottom end of the threaded rod 87, and has a structure related to the threaded fit, the threaded rod comprises an internal threaded structure arranged on the inner wall of the internal threaded hole 86 and an external threaded rod body 87, the internal threaded structure is matched with the external threaded structure, the top of the threaded rod 87 is rotatably installed in the bottom surface of the top connecting plate 83 through the bearing, and a force application plate 88 is directionally rotated along with the rotation direction of the top connecting plate 83, so that the threaded rod 87 can rotate, and the threaded rod is matched with the threaded rod, and the threaded rod 81 can drive the longitudinal rotary column 71.
In order to realize buffering type conflict polishing, please refer to fig. 1, an elastic rotary polishing structure 9 is required to be arranged, the elastic rotary polishing structure rotates along with the rotary end at the bottom of the telescopic rotary linkage structure 7, sand paper 96 for polishing the surface of a monocrystalline silicon piece is arranged in the elastic rotary linkage structure, fine particles existing at the bottom of the sand paper 96 can finely polish the surface of the monocrystalline silicon piece during rotation, the buffer pad 94 serves as a connecting component, and the buffer effect can be realized by pressure generated when the sand paper 96 is in conflict with the surface of the monocrystalline silicon piece, so that soft contact between the sand paper 96 and the monocrystalline silicon piece is realized, the occurrence of fragile phenomenon caused by overlarge contact pressure of the monocrystalline silicon piece is reduced, and the safety of the monocrystalline silicon piece during grinding is improved.
Referring to fig. 6, the elastic rotary polishing structure 9 includes a rotary plate 91 and a buffer pad 94, a rod body mounting groove 92 for fixedly mounting a rod body at the bottom of the telescopic rod 78 is provided at the center of the top end of the rotary plate 91, an indent embedded groove 93 is provided at the position deviating from the center of the rotary plate 91, an annular protrusion structure 95 for fixedly embedding into the indent embedded groove 93 is provided at the upper end surface of the buffer pad 94, a layer of abrasive paper 96 with a bottom surface being a polishing surface is adhered to the bottom surface of the buffer pad 94, when the abrasive paper 96 contacts the surface of the monocrystalline silicon piece, a pressure is formed between the abrasive paper 96 and the buffer pad 94, the pressure acts on the inside of the buffer pad 94, and the buffer pad 94 can make the pressure have a certain buffering property.
In order to achieve the adsorption fixing effect on the monocrystalline silicon piece, please refer to fig. 1, a deformation adsorption limiting structure 10 is required to be arranged and screwed into the internal thread groove 6, an arc plate 106 capable of relatively deforming to cause the change of the accommodating area under the action of corresponding longitudinal force is arranged inside, when a certain downward pulling force is applied to the arc plate 106, the arc plate 106 is deformed from an upward convex state to a downward concave state, at this time, the volume of a closed area above the arc plate 106 is increased, the internal air pressure is reduced, so that the monocrystalline silicon piece is adsorbed and fixed on the upper surface of the rubber ring sleeve 103, when the arc plate 106 is pushed upwards, the monocrystalline silicon piece can be separated from the upper surface of the rubber ring sleeve 103 in the same way, thereby achieving the positioning function of working state and the removal of non-working state.
Regarding the specific structure of the deformation adsorption limiting structure 10, please refer to fig. 7 and 8, the deformation adsorption limiting structure comprises a threaded plate body 101, an external thread 109 which can be screwed into the internal thread groove 6 is arranged on the circumferential surface of the threaded plate body 101, a part movable cavity 102 with an opening at the bottom end is arranged in the threaded plate body 101, a plurality of rubber ring sleeves 103 which are communicated with the upper structure and the top end of the part movable cavity 102 are arranged on the upper end surface of the threaded plate body 101, a through hole structure 104 is arranged in the center of the rubber ring sleeve 103, an annular rubber ring 105 is embedded in the periphery of the middle of the part movable cavity 102 of the threaded plate body 101, an arc 106 is embedded in the inner annular hole part of the annular rubber ring 105, and in order to enable the arc 106 to have deformation capacity with certain strength, and a certain reset resisting function after the deformation, a plastic product with large deformation strength is required, a hanging wire rope 107 is embedded in the center of the bottom surface of the arc 106, a pull head 108 is arranged at the bottom end of the wire 107, and the threaded plate body 101 is rotated, so that the silicon wafer can be screwed into the internal groove 6, and the silicon wafer can be stably positioned, and the silicon wafer can be stably and the silicon wafer can be removed, and the silicon wafer can be positioned and the silicon wafer can be stably by the silicon wafer can be removed.
When in use, the method comprises the following steps of S1: the threaded rod 87 is rotated according to the thickness of the monocrystalline silicon piece to be ground, so that the pressure when the bottom surface of the abrasive paper 96 is abutted against the upper surface of the monocrystalline silicon piece accords with the optimal pressure during grinding, when the abutting pressure is larger than the optimal pressure, the threaded rod 87 can be rotated, so that the abrasive paper 96 is driven to move upwards for a certain distance, and the abutting pressure at the moment is reduced, otherwise, when the abutting pressure is smaller than the optimal pressure, the threaded rod 87 can be rotated, so that the abrasive paper 96 is driven to move downwards for a certain distance, and the abutting pressure at the moment is increased; s2: the surface of the monocrystalline silicon piece to be ground is upwards, the monocrystalline silicon piece is placed on the upper surface of the threaded plate body 101 in a planar mode, then the thread rope 107 is pulled downwards until the arc plate 106 is deformed from an upwards protruding state to a downwards recessed state, and the surface monocrystalline silicon piece can be fixed on the upper surface of the threaded plate body 101 in an adsorptive mode in a planar mode; s3: the top end of the threaded plate body 101 is aligned and inserted into the inner thread groove 6, and the threaded plate body 101 is rotated in a directional manner, so that the threaded plate body 101 can be screwed into the inner thread groove 6 until the upper end surface of the threaded plate body 101 abuts against the top end structure of the inner thread groove 6; s4: starting the driving motor 3 and controlling the rotation speed of the driving motor 3 so as to drive the abrasive paper 96 to rotate in contact with the upper surface of the monocrystalline silicon piece, and polishing the raised part on the surface of the monocrystalline silicon piece by fine particles in the abrasive paper 96 while rotating, so that the raised part is polished and eliminated, and the grinding time can be set according to specific conditions; s5: the driving motor 3 is turned off, the threaded plate body 101 is reversely rotated, the threaded plate body 101 can be screwed out of the internal thread groove 6, the arc plate 106 is pushed upwards, the arc plate 106 is deformed from a downward concave state to an upward convex state, and the grinded monocrystalline silicon piece can be taken down.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a monocrystalline silicon grinding device, installs vertical shell (1) of landing leg (2) including the bottom, invertedly installs in driving motor (3) on vertical shell (1) top and sets up in inside and bottom open-ended part installation cavity (5) of vertical shell (1), its characterized in that: and also comprises
The hexagonal rotating column (4) is positioned in the top area of the component mounting cavity (5) and rotates along with the rotor of the driving motor (3);
the internal thread groove (6) is arranged at the bottom end of the component mounting cavity (5);
the telescopic rotary linkage structure (7) is positioned in the central area of the component mounting cavity (5) and can longitudinally move along the component mounting cavity (5), rotates along with the hexagonal rotary column (4) and is internally provided with a main spiral spring (77) for counteracting the gravity of the component;
the rotary positioning structure (8) is partially fixedly arranged at the longitudinal inner wall of the component mounting cavity (5), and the other part of the rotary positioning structure is sleeved on the circumferential side surface of the telescopic rotary linkage structure (7) in a relatively rotary manner through a bearing;
the elastic rotary polishing structure (9) rotates along with the rotary end at the bottom of the telescopic rotary linkage structure (7), and sand paper (96) for polishing the surface of the monocrystalline silicon piece is arranged in the elastic rotary polishing structure;
and the deformation type adsorption limiting structure (10) is screwed into the internal thread groove (6), and an arc-shaped plate (106) which can generate relative deformation to cause the change of the accommodating area under the action of corresponding longitudinal force is arranged in the deformation type adsorption limiting structure.
2. A single crystal silicon grinding apparatus according to claim 1, wherein: the telescopic rotary linkage structure (7) comprises an inner rotary column (71), wherein the top center of the inner rotary column (71) is provided with a downward recess and an inner hexagonal groove (72) for being inserted into the hexagonal rotary column (4), a cylindrical moving cavity (73) is formed in the inner rotary column (71), a plurality of annular array type special-shaped limiting sliding grooves (74) are formed in the circumferential surface of the cylindrical moving cavity (73), a movable plate (75) capable of axially moving along the cylindrical moving cavity (73) is arranged in the cylindrical moving cavity, a plurality of special-shaped sliding rails (76) which are correspondingly inserted into the special-shaped limiting sliding grooves (74) are arranged on the circumferential surface of the movable plate (75), a main spiral spring (77) is arranged at the bottom end of the movable plate (75), and a telescopic rod (78) penetrating through the bottom center structure of the inner rotary column (71) is arranged at the bottom center of the movable plate (75).
3. A single crystal silicon grinding apparatus according to claim 2, wherein: the length of the main spiral spring (77) is smaller than the height of the columnar moving cavity (73), and the elastic strength in an initial state is smaller than the total weight of the movable plate (75), the special-shaped sliding rail (76), the telescopic rod (78) and the elastic rotary polishing structure (9).
4. A single crystal silicon grinding apparatus according to claim 3, wherein: the cross section of the inner hexagonal groove (72) is consistent with the corresponding dimension of the cross section of the hexagonal rotary column (4), and the depth of the inner hexagonal groove (72) is larger than the length of the hexagonal rotary column (4).
5. A single crystal silicon grinding apparatus according to claim 1, wherein: the rotary positioning structure (8) comprises an annular sleeve (81) and a bottom fixing plate (84), a part sleeving hole (82) is formed in the center of the annular sleeve (81), the annular sleeve (81) is rotatably fixed to the periphery of the circumferential surface of an inner rotary column (71) through a bearing in the part sleeving hole (82), a top connecting plate (83) is arranged at the bottom of one side of the annular sleeve (81), a fixing base plate (85) fixedly arranged on the side face of a part mounting cavity (5) is arranged at one side of the bottom fixing plate (84), the bottom fixing plate (84) is located under the top connecting plate (83), an inner threaded hole (86) is formed in the center of the bottom fixing plate (84), a threaded rod (87) is screwed in the inner threaded hole (86) through threaded fit, a force application plate (88) is arranged at the bottom of the threaded rod (87), and the top of the threaded rod (87) is rotatably arranged inside a bottom surface of the top connecting plate (83) through the bearing.
6. A single crystal silicon grinding apparatus as defined in claim 5 wherein: the screw thread cooperation is including setting up the internal thread structure on internal thread hole (86) inner wall and the external thread structure on the threaded rod (87) body of rod, and internal thread structure and external thread structure cooperation.
7. A single crystal silicon grinding apparatus according to claim 1, wherein: the elastic rotary polishing structure (9) comprises a rotary plate (91) and a buffer pad (94), a rod body installation groove (92) for fixedly installing a rod body at the bottom of a telescopic rod (78) is formed in the center of the top end of the rotary plate (91), an inward concave embedded groove (93) is formed in the position, deviating from the center of the rotary plate, of the bottom of the rotary plate (91), an annular protruding structure (95) used for being fixedly embedded into the inward concave embedded groove (93) is formed in the upper end face of the buffer pad (94), and a layer of sand paper (96) is adhered to the bottom surface of the buffer pad (94) to form a polishing surface.
8. A single crystal silicon grinding apparatus according to claim 1, wherein: the deformation type adsorption limiting structure (10) comprises a threaded plate body (101), an external thread tooth (109) capable of being screwed into an internal thread groove (6) is arranged on the circumferential surface of the threaded plate body (101), a part movable cavity (102) with an opening at the bottom end is arranged in the threaded plate body (101), a plurality of rubber ring sleeves (103) which are communicated with the upper structure of the threaded plate body (101) and the top end of the part movable cavity (102) are arranged on the upper end surface of the threaded plate body, a through hole structure (104) is arranged in the center of the rubber ring sleeve (103), an annular rubber ring (105) is embedded in the periphery of the middle of the part movable cavity (102), an arc-shaped plate (106) is embedded in the inner annular hole part of the annular rubber ring (105), a hanging rope (107) is embedded in the center of the bottom surface of the arc-shaped plate (106), and a pull head (108) is arranged at the bottom end of the rope (107).
9. The silicon single crystal grinding apparatus according to claim 8, wherein: the arc-shaped plate (106) is a plastic product with high deformation strength.
10. A grinding method of a single crystal silicon grinding apparatus according to any one of claims 1 to 9, characterized in that: the method comprises the following steps:
s1: rotating the threaded rod (87) according to the thickness of the monocrystalline silicon piece to be ground, so that the pressure when the bottom surface of the abrasive paper (96) is abutted against the upper surface of the monocrystalline silicon piece accords with the optimal pressure when grinding, when the abutting pressure is larger than the optimal pressure, the threaded rod (87) can be rotated, so that the abrasive paper (96) is driven to move upwards for a certain distance, and the abutting pressure at the moment is reduced, otherwise, when the abutting pressure is smaller than the optimal pressure, the threaded rod (87) can be rotated, so that the abrasive paper (96) is driven to move downwards for a certain distance, and the abutting pressure at the moment is increased;
s2: the surface of the monocrystalline silicon piece to be ground is upwards, the monocrystalline silicon piece is placed on the upper surface of the threaded plate body (101) in a planar mode, then the thread rope (107) is pulled downwards until the arc-shaped plate (106) is deformed from an upwards protruding state to a downwards recessed state, and the surface monocrystalline silicon piece can be fixed on the upper surface of the threaded plate body (101) in a planar mode by adsorption;
s3: the top end of the threaded plate body (101) is aligned and inserted into the inner threaded groove (6), and the threaded plate body (101) is rotated in a directional mode, so that the threaded plate body (101) can be screwed into the inner threaded groove (6) until the upper end face of the threaded plate body (101) abuts against the top end structure of the inner threaded groove (6);
s4: starting a driving motor (3) and controlling the rotation speed of the driving motor (3) so as to drive the abrasive paper (96) to rotate in contact with the upper surface of the monocrystalline silicon piece, and polishing the raised parts on the surface of the monocrystalline silicon piece by fine particles in the abrasive paper (96) while rotating, so that the raised parts are polished and eliminated, and the polishing time can be set according to specific conditions;
s5: the driving motor (3) is closed, the threaded plate body (101) is reversely rotated, the threaded plate body (101) can be screwed out of the internal thread groove (6), the arc plate (106) is pushed upwards, the arc plate (106) is deformed from a downward concave state to an upward convex state, and the grinded monocrystalline silicon piece can be taken down.
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| CN202310763547.6A CN116533084A (en) | 2023-06-27 | 2023-06-27 | Monocrystalline silicon grinding device and grinding method |
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| CN202310763547.6A CN116533084A (en) | 2023-06-27 | 2023-06-27 | Monocrystalline silicon grinding device and grinding method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117340711A (en) * | 2023-12-04 | 2024-01-05 | 内蒙古兴固科技有限公司 | Monocrystalline silicon piece grinding device and grinding method thereof |
| CN118268945A (en) * | 2024-06-04 | 2024-07-02 | 赛尔科技(如东)有限公司 | Damping mechanism of wafer thinning grinding wheel |
-
2023
- 2023-06-27 CN CN202310763547.6A patent/CN116533084A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117340711A (en) * | 2023-12-04 | 2024-01-05 | 内蒙古兴固科技有限公司 | Monocrystalline silicon piece grinding device and grinding method thereof |
| CN117340711B (en) * | 2023-12-04 | 2024-02-20 | 内蒙古兴固科技有限公司 | Monocrystalline silicon piece grinding device and grinding method thereof |
| CN118268945A (en) * | 2024-06-04 | 2024-07-02 | 赛尔科技(如东)有限公司 | Damping mechanism of wafer thinning grinding wheel |
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