CN116525519B - Semiconductor wafer alignment device - Google Patents
Semiconductor wafer alignment device Download PDFInfo
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- CN116525519B CN116525519B CN202310803630.1A CN202310803630A CN116525519B CN 116525519 B CN116525519 B CN 116525519B CN 202310803630 A CN202310803630 A CN 202310803630A CN 116525519 B CN116525519 B CN 116525519B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 235000012431 wafers Nutrition 0.000 claims abstract description 206
- 238000005452 bending Methods 0.000 claims description 19
- 230000006835 compression Effects 0.000 claims description 17
- 238000007906 compression Methods 0.000 claims description 17
- 238000007790 scraping Methods 0.000 claims description 14
- 210000000078 claw Anatomy 0.000 claims description 9
- 230000000670 limiting effect Effects 0.000 claims description 8
- 238000005096 rolling process Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 12
- 230000009471 action Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
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- 238000010586 diagram Methods 0.000 description 1
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- 239000011521 glass Substances 0.000 description 1
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- 238000000926 separation method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/76—Apparatus for connecting with build-up interconnects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/76—Apparatus for connecting with build-up interconnects
- H01L2224/7625—Means for applying energy, e.g. heating means
- H01L2224/763—Means for applying energy, e.g. heating means by means of pressure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/76—Apparatus for connecting with build-up interconnects
- H01L2224/767—Means for aligning
- H01L2224/76703—Mechanical holding means
- H01L2224/76704—Mechanical holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of wafer bonding, in particular to a semiconductor wafer alignment device, which comprises a platform; the four sides of the platform are movably connected with connecting arms; one end of the connecting arm is rotatably connected with a roller, and the roller is positioned in the middle of the platform; when the alignment precision is adjusted when two wafers stacked up and down are bonded, an external driving motor is adopted to drive a second gear to rotate clockwise, the first gear can rotate along with the second gear in the same direction due to the matching of ratchet gears between the first gear and the second gear, at the moment, four connecting arms meshed with the first gear and the second gear respectively can move synchronously, and after the same stroke is synchronously output, the two wafers stacked up and down with dislocation can be driven to be passively adjusted and corrected to the center position, and when the rollers at the end parts of the four connecting arms are propped against the outer walls of the wafers and cannot continue to output, the dislocation of the two wafers is eliminated, and the centers of the two wafers stacked up and down are coaxial with a driving shaft.
Description
Technical Field
The invention belongs to the technical field of wafer bonding, and particularly relates to a semiconductor wafer alignment device.
Background
A wafer refers to a silicon wafer for carrying silicon semiconductor integrated circuits, and is generally a circular structure, and is therefore referred to as a wafer, and may also be referred to as a die.
When wafers are processed, in order to increase the chip space and improve the integration level of the wafers, two wafers which are polished by mirror surfaces and are homogeneous or heterogeneous are tightly combined under the chemical or physical action in a wafer bonding mode, when the wafers are bonded, the wafers are subjected to chemical treatment, covalent bonds exist on the adjacent surfaces of the wafers after the chemical treatment, the combination between the two wafers is tight under the covalent bond combination action, and the bonding cross section of the wafers reaches the specific bonding strength; in order to improve bonding strength of two bonded wafers, when bonding the wafers, alignment accuracy of the two wafers stacked up and down needs to be ensured, in the prior art, as disclosed in the patent number CN115763343a, a wafer alignment device adopts a plurality of telescopic cylinders to drive a push plate, the push plate is used for moving and contacting the wafers, and pushing the two wafers with non-overlapped areas to be aligned in an overlapped manner, and the effect of rolling and guiding the wafers is provided by utilizing rollers at the end parts of the push plate;
however, based on the process requirement of wafer bonding, when the heterogeneous wafers are bonded, due to the fact that the thermal mismatch and the lattice mismatch exist between different wafers, the dislocation exists between the two wafers, the stress exists between the two wafers, and meanwhile, in order to eliminate the stress, the dislocation is necessarily generated between the two wafers, at the moment, the two wafers are only corrected to be aligned by a plurality of pushing plates and rollers, the two wafers cannot be kept in tight contact, the bonding effect of covalent bonds between the two wafers stacked up and down cannot be ensured, and the bonding interface between the two aligned wafers is probably in a separated state and adsorbs foreign impurities due to time difference by simply using additional pressure equipment to squeeze the two aligned wafers, so that the quality of the bonded wafers is affected.
To this end, the present invention provides a semiconductor wafer alignment apparatus.
Disclosure of Invention
In order to overcome the deficiencies of the prior art, at least one technical problem presented in the background art is solved.
The technical scheme adopted for solving the technical problems is as follows: the invention relates to a semiconductor wafer alignment device, which comprises a platform; the four sides of the platform are movably connected with connecting arms; one end of the connecting arm is rotatably connected with a roller, and the roller is positioned in the middle of the platform; the middle part of the platform is also provided with two wafers which are stacked up and down; the roller is attached to the outer wall of the wafer and is circumscribed with the outer wall of the wafer; one side of the connecting arm is inwards bent, and a rack is fixedly connected to the side wall of the connecting arm; the bottom of the platform is rotationally connected with a driving assembly, and the driving assembly comprises a driving shaft and is used for synchronously driving the racks to move.
Preferably, the four connecting arms are arranged and are arranged in a central symmetry manner; one end of one connecting arm is hinged with a bent arm, and one end of the bent arm, which is not connected with the connecting arm, is correspondingly connected with a roller in a rotating way.
Preferably, two bending arms are arranged at the end part of one connecting arm, and the two bending arms are symmetrically arranged; the two bent arms are arranged in an up-down crossing way, and a torsion spring is clamped between the two bent arms; two rollers at the end parts of the two outer walls are attached to the outer walls of the wafer.
Preferably, a limiting groove is formed in the surface of the platform, and the wafer is positioned in the limiting groove; the four sides of the platform are provided with sliding grooves perpendicular to the side edges; the four connecting arms are respectively slid in the sliding grooves at the side edges; the middle part of the platform is rotationally connected with a turntable, and the bottom wall of the wafer is attached to the surface of the turntable through a supporting point; the bottom of the platform is fixedly connected with sliding rails corresponding to the racks, and a plurality of racks are respectively and slidably connected in the sliding rails.
Preferably, the driving assembly further comprises a first gear and a second gear; the second gear is fixedly connected with the driving shaft; the first gear and the second gear are matched with each other through a ratchet gear in a clamping way; a sleeve is fixedly connected to the bottom of the first gear, and the sleeve is in sleeve joint fit with the driving shaft; the outside of the sleeve is clamped and matched with a bevel gear; the first gear and the second gear are respectively meshed with the two racks.
Preferably, the top beam of the second gear is hinged with a pawl, and the bottom of the turntable is provided with a ratchet groove; the pawl is matched with the ratchet groove in a clamping way.
Preferably, a connecting arm is fixedly connected to one side of the top of the platform, and a connecting rod is connected to one end, which is not connected with the platform, of the connecting arm in a penetrating manner; the bottom of the connecting rod is fixedly connected with a connecting plate; the bottom of the connecting plate is fixedly connected with a compression bar; the bottom of the compression bar is rotationally connected with a ball; the ball bearings are connected to the top surface of the wafer in a rolling way; a top plate is fixedly connected to the top of the connecting rod, and a first spring is fixedly connected between the top plate and the connecting arm; the first spring is sleeved on the outer side of the connecting rod.
Preferably, one end, close to the connecting rod, of the connecting plate is fixedly connected with a telescopic cylinder, and the output end of the telescopic cylinder is fixedly connected with a sliding block; the bottom of the sliding block is fixedly connected with a bearing plate; a plastic scraping plate is fixedly connected to the bearing plate; the side edge of the plastic scraping plate is attached to the outer wall of the wafer; a screw rod is fixedly connected to one side of the plastic scraping plate, and the screw rod is in sliding fit with the bearing plate; the screw rod is fixedly connected to the bearing plate through a nut.
Preferably, a fixed plate is fixedly connected to one side of the top of the platform, and a first pulley and a second pulley are connected to the fixed plate in parallel in a rotating manner; a swing arm is hinged on one connecting arm relative to the bent arm; one side of the swing arm is in sliding contact with the first pulley; the top of the swing arm is fixedly connected with a string through a claw nail; the string is wound on the middle part of the connecting rod through the bottom of the second pulley.
Preferably, the four connecting arms are arranged in a crossing way up and down, and the two symmetrical connecting arms are positioned on the same plane; the connecting arm provided with the bent arm is meshed with the rack on one connecting arm symmetrical to the connecting arm with the bent arm; racks on the other two connecting arms are meshed with the second gear.
The beneficial effects of the invention are as follows:
1. according to the semiconductor wafer alignment device, when alignment accuracy is adjusted during bonding of two wafers stacked up and down, an external driving motor is adopted to drive a second gear to rotate clockwise, because of the matching of ratchet gears between a first gear and the second gear, the first gear rotates in the same direction along with the second gear, at the moment, four connecting arms meshed with the first gear and the second gear respectively move synchronously, and because the lengths of the four connecting arms are the same, after the same stroke is synchronously output, the two wafers stacked up and down with dislocation can be driven to be passively adjusted and the central positions of the two wafers can be corrected, and when the rollers at the end parts of the four connecting arms are abutted against the outer walls of the wafers and cannot continue to output, the dislocation of the two wafers is eliminated, and the centers of the two wafers stacked up and down are coaxial with a driving shaft;
2. according to the semiconductor wafer alignment device, the thin rope is fixedly connected to the end part of the swing arm through the claw nails, and the thin rope is connected with the connecting rod through the claw nails after being wound by the second pulleys, so that when the connecting arm moves inwards, the connecting rod is synchronously driven to move downwards, the connecting rod is driven to gradually approach and finally contact with the wafer in the downward moving stage, so that the stress existing between the two wafers stacked up and down is counteracted, the stress between the two wafers stacked up and down is relieved, and on the basis, the offset of the dislocation of the two wafers stacked up and down is relieved, and the stress between the two heterogeneous wafers is counteracted synchronously, so that the alignment precision of the two wafers stacked up and down is improved, the gap is smaller, the covalent bond bonding strength between the two heterogeneous wafers is improved, and the bonding strength is improved when the wafers are bonded;
3. according to the semiconductor wafer alignment device, when the second gear rotates anticlockwise, the first gear is matched with the ratchet gear, so that the second gear is kept relatively static, at the moment, the pawl is matched with the ratchet groove in a clamping way, namely, when the second gear rotates anticlockwise, the turntable is driven to rotate, meanwhile, two opposite connecting arms with the rollers at the end parts are driven to move reversely, the clamping effect on a wafer is cancelled, when dislocation is eliminated on the wafer, the compression bar applies axial force to the wafer, and therefore the wafer is tightly absorbed in the sucker on the turntable, at the moment, after the turntable rotates, the wafer rotates along with the compression bar, only the compression bar is matched with the wafer in a rolling way under the action of the balls, after the plastic scraping plate is driven to be adhered to the outer wall of the wafer, the rotation of the wafer and the turntable can be matched, after heterogenous wafer bonding is realized, the clearance of the overflow material at the middle part of the wafer is improved, and the procedure of removing the overflow material after the wafer bonding is reduced;
drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a perspective view of a first embodiment of the present invention;
fig. 2 is an exploded perspective view of a first embodiment of the present invention;
FIG. 3 is a partial perspective view of a first embodiment of the present invention;
FIG. 4 is a schematic view showing a release state of the connecting arm and the driving assembly according to the first embodiment of the present invention;
FIG. 5 is a schematic view showing a contracted state of the connecting arm and the driving assembly according to the first embodiment of the present invention;
FIG. 6 is a schematic diagram of a driving assembly according to a first embodiment of the present invention;
FIG. 7 is a partial perspective view of a connecting rod, string and swing arm in accordance with an embodiment of the present invention;
FIG. 8 is a partial perspective view of a connecting rod and a compression bar according to a first embodiment of the present invention;
FIG. 9 is a partial perspective view of a connecting arm and a curved arm in accordance with the first embodiment of the present invention;
FIG. 10 is a partial perspective view of a connecting arm and a roller according to the first embodiment of the present invention;
FIG. 11 is a partial perspective view of a second embodiment of the present invention;
in the figure: 1. a platform; 11. a chute; 12. a limiting groove; 13. a turntable; 14. a slide rail; 15. ratchet grooves; 16. a resistance plate; 21. a connecting arm; 22. a baffle; 221. a connecting shaft; 222. a second spring; 23. a roller; 24. swing arms; 25. a rack; 27. bending arms; 28. a torsion spring; 31. a connecting arm; 32. a connecting rod; 33. a compression bar; 34. a ball; 35. a first spring; 36. a connecting plate; 37. a telescopic cylinder; 38. a slide block; 39. a carrying plate; 4. a wafer; 5. a drive shaft; 51. a first gear; 52. a second gear; 53. a pawl; 54. bevel gears; 6. a plastic scraper; 61. a screw rod; 7. a fixing plate; 71. a first pulley; 72. a second pulley; 73. a string.
Detailed Description
The invention is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
Example 1
As shown in fig. 1 to 2, when two heterogeneous wafers 4 are bonded, the axial dislocation of the two wafers 4 stacked up and down can only be adjusted and corrected in the prior art, but the stress between the two heterogeneous wafers 4 cannot be eliminated, and the bonding of covalent bonds cannot be effectively realized, so that the bonding strength of the two wafers 4 is affected; the embodiment of the invention relates to a semiconductor wafer alignment device, which comprises a platform 1; the four sides of the platform 1 are movably connected with connecting arms 21; one end of the connecting arm 21, which faces the center of the platform 1, is rotatably connected with a roller 23; the middle part of the platform 1 is also provided with two wafers 4 which are stacked up and down; the roller 23 is attached to the outer wall of the wafer 4 and is circumscribed with the outer wall of the wafer 4; the four arms 21 are adopted to synchronously move, and the rollers 23 at the end parts of the four arms 21 are attached to the outer wall of the wafer 4 with dislocation, so that the axle centers of the two dislocation wafers 4 are driven to coincide, the axle center dislocation of the two wafers 4 stacked up and down is eliminated, after the four arms 21 with equal length output the same stroke, four points at the end parts of the four arms can surround the track with perfect circle, thereby correcting the dislocation of the two wafers 4 stacked up and down, and eliminating the dislocation of the wafers 4 with different sizes by changing the stroke output by the arms 21; one side of the connecting arm 21 is inwards bent, and the side wall is fixedly connected with a rack 25; the bottom of the platform 1 is rotatably connected with a driving assembly, and the driving assembly comprises a driving shaft 5 for synchronously driving the rack 25 to move; the four connecting arms 21 synchronously move, and on the basis of inwards bending one side of the connecting arms 21 and fixedly connecting racks 25 on the side wall of one bent side, the four racks 25 are simultaneously meshed through a driving assembly, so that the four racks 25 can be synchronously driven to move under the effect of inputting one drive, and the four connecting arms 21 are further driven to synchronously move, thereby achieving the purposes of quickly correcting dislocation of the wafer 4 and eliminating errors generated by a plurality of drives;
as shown in fig. 3 to 6, the driving assembly further includes a first gear 51 and a second gear 52; the second gear 52 is fixedly connected with the driving shaft 5; the first gear 51 and the second gear 52 are matched through the ratchet gear in a clamping way; specifically, the first gear 51 and the second gear 52 drive the two racks 25 to move respectively, and because the first gear 51 and the second gear 52 are engaged with each other through the ratchet gear, for example, in a clockwise rotation direction, when the second gear 52 is driven by the driving shaft 5, the first gear 51 and the second gear 52 are engaged with each other, that is, keep synchronous clockwise rotation, whereas in a counterclockwise rotation direction, when the second gear 52 is rotated through the driving shaft 5, the first gear 51 is kept stationary; based on the above, when the second gear 52 is set to rotate clockwise, the four racks 25 move inwards to drive the four connecting arms 21 to move inwards, so as to achieve the purpose of adjusting and correcting the two wafers 4 stacked up and down; when the second gear 52 rotates anticlockwise, the first gear 51 keeps still due to sliding fit of the ratchet gears, namely, the two racks 25 and the connecting arms 21 meshed with the first gear 51 keep still, the other two racks 25 and the connecting arms 21 meshed with the second gear 52 move reversely, the clamping effect on the two wafers 4 stacked up and down is canceled, and correspondingly, the connecting arms 21 meshed with the first gear 51 are arranged to be the connecting arms 21 with the bent arms 27 and the opposite connecting arms 21, so that when the second gear 52 drives the two connecting arms 21 to move reversely, the stable clamping purpose on the two wafers 4 stacked up and down is realized by utilizing the two bent arms 27 with Y-shaped structures and the opposite group of connecting arms 21; a sleeve is fixedly connected to the bottom of the first gear 51, and the sleeve is in sleeve joint fit with the driving shaft 5; the sleeve is externally clamped and matched with a bevel gear 54; the first gear 51 and the second gear 52 are respectively meshed with the two racks 25; as mentioned above, the first gear 51 and the second gear 52 need to satisfy the effect of synchronous rotation and independent rotation, so the first gear 51 and the second gear 52 should be disposed in a sleeved relationship, and the bevel gear 54 on the bottom sleeve of the first gear 51 can provide independent driving for the first gear 51 to move reversely and drive the arm 21 to move reversely through the rack 25.
As shown in fig. 3 to 5, the four connecting arms 21 are provided, and the four connecting arms 21 are arranged in a central symmetry manner; one end of one connecting arm 21 facing the center of the platform 1 is hinged with a bent arm 27, and the extending end of the bent arm 27 is correspondingly connected with a roller 23 in a rotating way; specifically, four connecting arms 21 are arranged in an annular array, and the four connecting arms 21 can be synchronously driven to move by one driving, wherein one connecting arm 21 is provided with a bent arm 27, and the bent arm 27 is used for bearing the rollers 23 to contact two wafers 4 stacked up and down, different from the rollers 23 singly arranged on the other three connecting arms 21.
As shown in fig. 9 to 10, two bending arms 27 are provided at the end of one connecting arm 21, and the two bending arms 27 are symmetrically arranged; the two bent arms 27 are arranged in a vertically crossed mode, and a torsion spring 28 is clamped between the two bent arms 27; two rollers 23 at the end parts of the two outer walls are attached to the outer wall of the wafer 4; as described above, two bending arms 27 are set, the two bending arms 27 are kept in a small included angle state in the initial stage under the action of the torsion spring 28, when contacting with the wafer 4, because the bending arms are closer to the center of the platform 1, the bending arms are earlier than the other three bending arms 21 and the rollers 23 contact with the wafer 4, and after contacting with the wafer 4, the two bending arms 27 are expanded by the reaction force of the wafer 4 to the rollers 23, the two bending arms 27 after expansion cooperate with the corresponding bending arms 21 to present a Y-shaped structure, the rollers 23 of the two bending arms 27 and the rollers 23 of the opposite other bending arms 21 are arranged in a triangle, so that the adjustment correction and stable clamping effect on the two wafers 4 stacked up and down can be primarily provided, and when the other two bending arms 21 do not exist or are not contacted with the wafer 4, the stable clamping effect can also be provided, and the alignment accuracy of the two wafers 4 stacked up and down is maintained.
As shown in fig. 2, a limiting groove 12 is formed on the surface of the platform 1, and the wafer 4 is positioned in the limiting groove 12; the four sides of the platform 1 are provided with sliding grooves 11 perpendicular to the side edges; the sliding grooves 11 are arranged on four sides of the platform 1 and can be used for the connecting arms 21 to slide, when the connecting arms 21 are driven by the driving component to stretch and change, the connecting arms can slide in the sliding grooves 11, and the sliding grooves 11 have a limiting effect; the four connecting arms 21 slide in the sliding grooves 11 on the sides respectively; the bottom of the platform 1 is fixedly connected with slide rails 14 corresponding to the racks 25, and a plurality of racks 25 are respectively and slidably connected in the slide rails 14; the sliding rail 14 is arranged at the bottom of the platform 1 and can support the rack 25 in the moving process;
as shown in fig. 1 and 8, a connecting arm 31 is fixedly connected to one side of the top of the platform 1, and a connecting rod 32 is connected to one end of the connecting arm 31, which is not connected with the platform 1, in a penetrating manner; the bottom of the connecting rod 32 is fixedly connected with a connecting plate 36; the bottom of the connecting plate 36 is fixedly connected with a compression bar 33; by arranging the compression bar 33, when the adjustment and correction process of the two wafers 4 stacked up and down is completed, axial pressure is applied to the wafers 4, dislocation of the two wafers 4 stacked up and down is eliminated, and meanwhile, stress between the two wafers 4 is also eliminated, so that covalent bond between the two wafers 4 stacked up and down is tightly combined, and bonding strength of the wafers 4 is improved; the bottom of the compression bar 33 is rotatably connected with a ball 34; the ball 34 is connected to the top surface of the wafer 4 in a rolling way; a top plate is fixedly connected to the top of the connecting rod 32, and a first spring 35 is fixedly connected between the top plate and the connecting arm 31; the first spring 35 is sleeved on the outer side of the connecting rod 32, the spring provides tension at the initial stage, so that the connecting rod 32 and the pressing rod 33 at the bottom of the connecting rod are separated from the platform 1, after the wafer 4 is placed in the middle of the platform 1 and is adjusted and corrected by the connecting arm 21 and the roller 23, the pressing rod 33 can apply axial pressure to the wafer 4 to eliminate the stress of the two wafers 4 stacked up and down, then when the pressing rod 33 is contacted with the wafer 4, the balls 34 are contacted with the surface of the wafer 4, and the balls 34 are made of ceramics, so that damage to the surface of the wafer 4 is avoided when the wafer 4 is contacted.
As shown in fig. 7, a fixing plate 7 is fixedly connected to one side of the top of the platform 1, and a first pulley 71 and a second pulley 72 are connected to the fixing plate 7 in parallel rotation; a swing arm 24 is hinged to one of the link arms 21 opposite to the curved arm 27; one side of the swing arm 24 is in sliding contact with the first pulley 71; the top of the swing arm 24 is fixedly connected with a string 73 through a claw nail; the string 73 is wound on the middle part of the connecting rod 32 through the bottom of the second pulley 72; as described above, when the second gear 52 rotates clockwise, the four arms 21 can be synchronously driven to move synchronously, when one of the arms 21 moves inwards, the swing arm 24 hinged to the top of the arm will slide on the first pulley 71, at this time, the string 73 fixedly connected to the top of the swing arm 24 through the claw nail will wind around the second pulley 72 and pull the connecting rod 32 downwards, wherein the other end of the string 73 is fixedly connected to the connecting rod 32 through the claw nail, i.e. when the arm 21 moves inwards, the swing arm 24 slides on the first pulley 71, so that one end of the string 73 fixedly connected to the swing arm 24 rises, and under the transition of the second pulley 72, one end of the string 73 connected to the connecting rod 32 will generate a pull force obliquely downwards, and drive the connecting rod 32 to move downwards, and when the connecting rod 32 moves downwards, the compression rod 33 will be synchronously driven to press downwards, so as to squeeze the two wafers 4 stacked up and down, thereby eliminating the stress between the two wafers 4, and facilitating the covalent bond bonding of the heterogeneous wafers 4.
As shown in fig. 3 to 6, the top of the second gear 52 is hinged with a pawl 53 via a shaft, and the bottom of the turntable 13 is provided with a ratchet groove 15; the pawl 53 is in clamping fit with the ratchet groove 15; the middle part of the platform 1 is rotationally connected with a turntable 13, and the bottom wall of the wafer 4 is attached to the surface of the turntable 13 through a supporting point; the turntable 13 arranged in the middle of the platform 1 can independently support the wafer 4 to rotate, and due to the arrangement of the rollers 23 at the end part of the connecting arm 21, when the wafer 4 is stably clamped, the wafer can also generate relative rotation relationship with a plurality of rollers 23 under the action of the independent turntable 13; the turntable 13 is provided with a sucker, so that the wafer 4 can be tightly adsorbed with the sucker on the turntable 13 when axial pressure is applied to the wafer 4; when the second gear 52 is driven to rotate clockwise by the driving shaft 5, the pawl 53 is in sliding fit with the ratchet groove 15, at this time, the turntable 13 is still and does not rotate, when the second gear 52 is driven to rotate anticlockwise by the driving shaft 5, the pawl 53 is in clamping fit with the ratchet groove 15, at this time, the turntable 13 is driven to rotate by the pawl 53, and the wafer 4 is enabled to rotate under the action of the roller 23 on the bent arm 27 and the roller 23 at the end part of the opposite connecting arm 21 and kept to rotate coaxially with the driving shaft 5.
As shown in fig. 8, one end of the connecting plate 36, which is close to the connecting rod 32, is fixedly connected with a telescopic cylinder 37, and the output end of the telescopic cylinder 37 is fixedly connected with a sliding block 38; the bottom of the sliding block 38 is fixedly connected with a bearing plate 39; the plastic scraping plate 6 is fixedly connected to the bearing plate 39; the side edge of the plastic scraping plate 6 is attached to the outer wall of the wafer 4; when the telescopic cylinder 37 outputs, the sliding block 38 can be driven to move, the sliding block 38, the bearing plate 39 and the plastic scraping plate 6 are far away from the center of the platform 1, namely away from the wafer 4 in the initial stage, when the compression rod 33 moves downwards, the telescopic cylinder 37 can drive the sliding block 38 to move, so that the bearing plate 39 contacts with the outer wall of the adjusted wafer 4, when the second gear 52 rotates anticlockwise, the turntable 13 is driven to rotate, the wafer 4 is driven to rotate, the rotating wafer 4 contacts with the fixed plastic scraping plate 6, the plastic scraping plate 6 contacts with the wafer 4, the outer wall of the wafer 4 is not damaged by scraping, and therefore, overflows generated due to extrusion between heterogeneous wafers 4 can be scraped, wherein when the heterogeneous wafers 4 are bonded, the bonding interface of the heterogeneous wafers 4 possibly fills in an intermediate layer comprising materials such as adhesives and glass glaze; a screw rod 61 is fixedly connected to one side of the plastic scraper 6, and the screw rod 61 is in sliding fit with the bearing plate 39; the screw rod 61 is fixedly connected to the bearing plate 39 through a nut; wherein the plastic scraper 6 is fixedly connected on the bearing plate 39 by a screw rod 61 and a nut.
As shown in fig. 1 and 2, four connecting arms 21 are arranged in a crossing manner, and two symmetrical connecting arms 21 are positioned on the same plane; the rack 25 on one connecting arm 21 with which the connecting arm 21 provided with the bent arm 27 is symmetrical is meshed with the first gear 51; the racks 25 on the other two connecting arms 21 are meshed with the second gear 52; the connecting arms 21 provided with the bent arms 27 are engaged with the first gear 51 at the bottom of the symmetrical connecting arm 21, the racks 25 on the other two connecting arms 21 are engaged with the second gear 52 at the upper part, when the second gear 52 rotates clockwise, the first gear 51 follows to drive the four racks 25 to move, namely, the four connecting arms 21 synchronously shrink inwards, meanwhile, the ratchet grooves 15 are in sliding fit with the pawls 53, and the turntable 13 is stationary, based on the fact that when the second gear 52 rotates anticlockwise, the first gear 51 is stationary, and at the moment, the pawls 53 on the second gear 52 are in clamping fit with the ratchet grooves 15, the turntable 13 can be driven to rotate, namely, the wafers 4 aligned and adsorbed by the suckers can be driven to rotate to contact with the plastic scraping plates 6, overflows on the side walls of the wafers 4 are removed, the bonding completion degree of the wafers 4 is improved, and the machining procedure is reduced.
Example two
As shown in fig. 11, in order to achieve that the plurality of connecting arms 21 are driven to cancel the clamping function of the wafer 4 without external force, in a first embodiment, another embodiment of the present invention is as follows: a baffle plate 16 is fixedly connected to one side of the platform 1 corresponding to the connecting arm 21; a baffle 22 is fixedly connected to one end of the connecting arm 21 opposite to the roller 23; a connecting shaft 221 is fixedly connected to one side of the baffle 22 facing the wafer 4, and the connecting shaft 221 penetrates through the baffle 16; the connecting shaft 221 is sleeved with a second spring 222, and two ends of the second spring 222 are abutted against the inner sides of the baffle plate 16 and the baffle plate 22; the end of the connecting shaft 221 is provided with threads and is matched with the threads of the nut.
Working principle: when bonding heterogeneous wafers 4, due to the problems of thermal mismatch and lattice mismatch between different wafers 4, not only dislocation but also stress exists between the two wafers 4, and meanwhile, in order to eliminate the stress, dislocation is necessarily generated between the two wafers 4, at this time, the two wafers 4 are merely corrected by a plurality of pushing plates and rollers 23 to align, and cannot be kept in tight contact, so that the bonding effect of covalent bonds between the two wafers 4 stacked up and down cannot be ensured, and the bonding interface between the two aligned wafers 4 is probably in a separated state and adsorbs foreign impurities due to time difference by simply using additional pressure equipment to squeeze the two aligned wafers 4, thereby influencing the quality after bonding of the wafers 4;
when the device is used, the device is mainly used for adjusting and correcting heterogeneous wafers 4, so that the alignment accuracy is improved, the bonding quality of the wafers 4 is improved, and meanwhile, in order to eliminate the stress generated during bonding of the heterogeneous wafers 4, the axial connecting rod 32 is used for driving the pressing rod 33 to synchronously press the wafers 4, so that the stress between two wafers 4 stacked up and down is counteracted, the bonding of covalent bonds is tighter during bonding of the two wafers 4, and the bonding strength of the wafers 4 is improved;
when the alignment precision is adjusted during bonding of two wafers 4 stacked up and down, an external driving motor is adopted to drive a second gear 52 to rotate clockwise, the first gear 51 rotates along with the second gear 52 in the same direction due to the matching of ratchet gears between the first gear 51 and the second gear 52, at the moment, four connecting arms 21 respectively meshed with the first gear 51 and the second gear 52 move synchronously, and after the same stroke is synchronously output, the two wafers 4 stacked up and down with dislocation can be driven to be passively adjusted and the central position thereof can be corrected, and when the rollers 23 at the end parts of the four connecting arms 21 are abutted against the outer walls of the wafers 4 and cannot continue to output, the dislocation of the two wafers 4 is eliminated at the moment, and the centers of the two wafers 4 stacked up and down are coaxial with a driving shaft 5;
as described above, when the arm 21 moves inwards, the swing arm 24 is driven to slide on the first pulley 71, and because the end of the swing arm 24 is fixedly connected with the string 73 through the claw nail, and the string 73 is connected with the connecting rod 32 through the claw nail after being wound by the second pulley 72, when the arm 21 moves inwards, the connecting rod 32 is synchronously driven to move downwards, the connecting rod 32 moves downwards, and drives the compression rod 33 to approach gradually and finally contact the wafer 4, so as to counteract the stress existing between the two wafers 4 stacked up and down, so that the stress between the two wafers 4 stacked up and down is eliminated, and based on the stress, the offset of the stress between the two heterogeneous wafers 4 is realized synchronously while the dislocation of the two wafers 4 stacked up and down is eliminated, so that the alignment precision of the two heterogeneous wafers 4 is improved, and meanwhile, the gap is smaller, the bonding strength of covalent bonds between the two heterogeneous wafers 4 is improved, and the bonding strength of the wafers 4 is improved;
in addition, when the second gear 52 rotates anticlockwise, the second gear 52 is kept relatively still due to the matching of the ratchet gears between the first gear 51 and the second gear 52, at this time, the pawl 53 is matched with the ratchet groove 15 in a clamped manner, that is, when the second gear 52 rotates anticlockwise, the turntable 13 is driven to rotate, and meanwhile, the two opposite connecting arms 21 with the rollers 23 at the ends are driven to move reversely, so as to cancel the clamping effect on the wafer 4, and when the dislocation is eliminated on the wafer 4, the compression bar 33 applies an axial force on the wafer 4, so that the wafer 4 is tightly absorbed in the sucker on the turntable 13, at this time, after the turntable 13 rotates, the wafer 4 rotates along with the rotation, and under the action of the ball 34, the compression bar 33 is only matched with the wafer 4 in a rolling manner, after the plastic scraper 6 is driven to be adhered to the outer wall of the wafer 4 through the telescopic cylinder 37, the rotation of the wafer 4 can be matched, after the bonding of the heterogeneous wafer 4 is realized, the wafer 4 is cleaned, the completion of bonding of the wafer 4 is improved, and the process of removing the extra wafer 4 after bonding is cleaned is reduced; when the second gear 52 rotates anticlockwise, only two connecting arms 21 of the roller 23 are separated from the wafer 4 at the end, one end of the remaining two connecting arms 21 is provided with a bent arm 27 and the roller 23, the other end of the remaining two connecting arms 21 is provided with the roller 23, and the three rollers 23 are arranged in a Y-shaped structure, and the stable clamping effect on the wafer 4 for eliminating dislocation and stress can be realized by only relying on the three rollers 23, so that the dislocation of the wafer 4 is reappeared due to the separation of the two connecting arms 21 and the wafer 4 after the second gear 52 rotates anticlockwise, and the device has certain practicability.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. A semiconductor wafer alignment apparatus, characterized in that: comprises a platform (1); four sides of the platform (1) are movably connected with connecting arms (21); one end of the connecting arm (21) is rotatably connected with a roller (23), and the roller (23) is positioned in the middle of the platform (1); the middle part of the platform (1) is also provided with two wafers (4) which are stacked up and down; the roller (23) is attached to the outer wall of the wafer (4) and is circumscribed with the outer wall of the wafer (4); one side of the connecting arm (21) is inwards bent, and a rack (25) is fixedly connected to the side wall of the connecting arm; the bottom of the platform (1) is rotationally connected with a driving assembly, and the driving assembly comprises a driving shaft (5) for synchronously driving the rack (25) to move;
the four connecting arms (21) are arranged, and the four connecting arms (21) are arranged in a central symmetry manner; one end of one connecting arm (21) is hinged with a bent arm (27), and one end of the bent arm (27) which is not connected with the connecting arm (21) is correspondingly connected with a roller (23) in a rotating way;
the two bending arms (27) are arranged at the end part of one connecting arm (21), and the two bending arms (27) are symmetrically arranged; the two bent arms (27) are arranged in an up-down crossing way, and a torsion spring (28) is clamped between the two bent arms (27); two rollers (23) at the end parts of the two outer walls are attached to the outer wall of the wafer (4);
a limiting groove (12) is formed in the surface of the platform (1), and the wafer (4) is positioned in the limiting groove (12); the four sides of the platform (1) are provided with sliding grooves (11) perpendicular to the side edges; the four connecting arms (21) slide in the sliding grooves (11) at the side edges respectively; the middle part of the platform (1) is rotationally connected with a turntable (13), and the bottom wall of the wafer (4) is attached to the surface of the turntable (13) through a supporting point; the bottom of the platform (1) is fixedly connected with sliding rails (14) corresponding to the racks (25), and a plurality of racks (25) are respectively and slidably connected in the sliding rails (14).
2. The semiconductor wafer alignment apparatus of claim 1, wherein: the drive assembly further comprises a first gear (51) and a second gear (52); the second gear (52) is fixedly connected with the driving shaft (5); the first gear (51) and the second gear (52) are matched through the ratchet gear in a clamping way; a sleeve is fixedly connected to the bottom of the first gear (51), and the sleeve is in sleeve joint fit with the driving shaft (5); a bevel gear (54) is clamped and matched outside the sleeve; the first gear (51) and the second gear (52) are respectively meshed with the two racks (25).
3. A semiconductor wafer alignment apparatus according to claim 2, wherein: a pawl (53) is hinged to the top of the second gear (52) through a shaft, and a ratchet groove (15) is formed in the bottom of the rotary disc (13); the pawl (53) is matched with the ratchet groove (15) in a clamping way.
4. A semiconductor wafer alignment apparatus according to claim 3, wherein: a connecting arm (31) is fixedly connected to one side of the top of the platform (1), and a connecting rod (32) is connected to one end, which is not connected with the platform (1), of the connecting arm (31) in a penetrating manner; a connecting plate (36) is fixedly connected to the bottom of the connecting rod (32); a compression bar (33) is fixedly connected to the bottom of the connecting plate (36); the bottom of the compression bar (33) is rotationally connected with a ball (34); the ball (34) is connected to the top surface of the wafer (4) in a rolling way; a top plate is fixedly connected to the top of the connecting rod (32), and a first spring (35) is fixedly connected between the top plate and the connecting arm (31); the first spring (35) is sleeved on the outer side of the connecting rod (32).
5. The semiconductor wafer alignment apparatus of claim 4, wherein: a telescopic cylinder (37) is fixedly connected to one end, close to the connecting rod (32), of the connecting plate (36), and a sliding block (38) is fixedly connected to the output end of the telescopic cylinder (37); the bottom of the sliding block (38) is fixedly connected with a bearing plate (39); a plastic scraping plate (6) is fixedly connected to the bearing plate (39); the side edge of the plastic scraping plate (6) is attached to the outer wall of the wafer (4); a screw rod (61) is fixedly connected to one side of the plastic scraping plate (6), and the screw rod (61) is in sliding fit with the bearing plate (39); the screw rod (61) is fixedly connected to the bearing plate (39) through a nut.
6. The semiconductor wafer alignment apparatus of claim 5, wherein: a fixed plate (7) is fixedly connected to one side of the top of the platform (1), and a first pulley (71) and a second pulley (72) are connected to the fixed plate (7) in parallel rotation; a swing arm (24) is hinged on one connecting arm (21) opposite to the bent arm (27); one side of the swing arm (24) is in sliding contact with the first pulley (71); the top of the swing arm (24) is fixedly connected with a string (73) through a claw nail; the string (73) is wound on the middle part of the connecting rod (32) through the bottom of the second pulley (72).
7. The semiconductor wafer alignment apparatus of claim 6, wherein: the four connecting arms (21) are arranged in a crossing way up and down, and the two symmetrical connecting arms (21) are positioned on the same plane; the connecting arm (21) provided with the bent arm (27) is meshed with the rack (25) on one connecting arm (21) symmetrical to the connecting arm; the racks (25) on the other two connecting arms (21) are meshed with a second gear (52).
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000164677A (en) * | 1998-11-27 | 2000-06-16 | Kiyoshi Takahashi | Wafer-aligning device |
| JP2000174104A (en) * | 1998-12-01 | 2000-06-23 | Koyo Thermo System Kk | Device for aligning notch of semiconductor wafer |
| CN105518844A (en) * | 2013-07-17 | 2016-04-20 | 聚斯微技术平版印刷有限公司 | Apparatus and method for aligning and centering wafers |
| CN215118859U (en) * | 2021-06-20 | 2021-12-10 | 东莞市思榕智能装备有限公司 | Wafer taking device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6270307B1 (en) * | 1999-01-25 | 2001-08-07 | Chartered Semiconductor Manufacturing Company | Method for aligning wafers in a cassette |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000164677A (en) * | 1998-11-27 | 2000-06-16 | Kiyoshi Takahashi | Wafer-aligning device |
| JP2000174104A (en) * | 1998-12-01 | 2000-06-23 | Koyo Thermo System Kk | Device for aligning notch of semiconductor wafer |
| CN105518844A (en) * | 2013-07-17 | 2016-04-20 | 聚斯微技术平版印刷有限公司 | Apparatus and method for aligning and centering wafers |
| CN215118859U (en) * | 2021-06-20 | 2021-12-10 | 东莞市思榕智能装备有限公司 | Wafer taking device |
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