CN116525515A - Carrier device with circumferential positioning function - Google Patents
Carrier device with circumferential positioning function Download PDFInfo
- Publication number
- CN116525515A CN116525515A CN202310623976.3A CN202310623976A CN116525515A CN 116525515 A CN116525515 A CN 116525515A CN 202310623976 A CN202310623976 A CN 202310623976A CN 116525515 A CN116525515 A CN 116525515A
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- CN
- China
- Prior art keywords
- carrier
- positioning
- guide
- turntable
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 53
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 description 6
- 239000000725 suspension Substances 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a carrier device with circumferential positioning, which belongs to the field of carrier tables for semiconductor wafers, and comprises a carrier base, carrier feet, a carrier upper seat, a carrier main shaft and a wafer carrier disc, and also comprises a circumferential positioning module; wherein, the bottom feet of the carrying platform adopt air floatation bottom feet; the carrier base is floatingly supported by the plurality of carrier feet; the carrier upper seat is arranged on the carrier base; the top of the carrier main shaft is fixedly connected to the middle part of the bottom surface of the wafer carrier disc and is used for driving the wafer carrier disc; the circumference positioning module is arranged between the upper seat of the carrying platform and the wafer carrying disc and is used for positioning the wafer supported by the wafer carrying disc in an air-floating manner from the periphery; positioning stability is easy to guarantee, and overall efficiency is improved.
Description
Technical Field
The invention belongs to the field of objective tables for semiconductor wafers, and particularly relates to a carrier device with circumferential positioning.
Background
The existing wafer carrier is generally in air suction suspension support, the carrier only supports the wafer through air flow, and the circle center of the wafer is not physically positioned relative to the carrier surface, so that the circle center positioning is difficult to guarantee from hardware during measurement or processing, and the problems that the subsequent flow positioning is long in time consumption, stable positioning is difficult to guarantee and the like are caused.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a carrying platform device with circumferential positioning, which can solve the problems.
Design principle: a positioning hardware is arranged between the wafer carrying disc and the base, and wafers which can be automatically opened and closed and are supported from the periphery are abutted and positioned. The design scheme is as follows.
The carrier device comprises a carrier base, carrier feet, a carrier upper seat, a carrier main shaft and a wafer carrier disc, and also comprises a circumferential positioning module; wherein, the bottom feet of the carrying platform adopt air floatation bottom feet; the carrier base is floatingly supported by a plurality of the carrier feet; the carrier upper seat is arranged on the carrier base; the carrier main shaft is vertically arranged in bearing holes formed in the carrier base and the carrier upper seat, and the top of the carrier main shaft is fixedly connected to the middle part of the bottom surface of the wafer carrier disc and used for driving the wafer carrier disc; the circumference positioning module is arranged between the carrier upper seat and the wafer carrier disc and is used for positioning the wafer supported by the wafer carrier disc in an air-floating manner from the periphery.
Further, the carrier main shaft comprises a lifting shaft body, a fixing adapter and an elastic sheet, wherein the inner end of the elastic sheet is fixed to the bottom of the lifting shaft body, and the outer end of the elastic sheet is connected to the bottom of the carrier base through the fixing adapter, so that the elastic support of the bottom of the lifting shaft body is realized.
Further, the wafer carrying disc is provided with a gas blowing hole, a gas suction hole and a positioning slot hole matched with the circumferential positioning module.
Further, the circumferential positioning module comprises a guide mounting plate, a guide sliding block assembly, a positioning turntable, a guide column, a positioning driving motor unit and a positioning transmission belt; the guide sliding block assembly is arranged on the guide mounting plate, and the guide column is vertically arranged on the sliding block; the positioning turntable is arranged above the guide mounting plate, a plurality of guide arc grooves are formed in the positioning turntable and used for guiding the guide columns, and the positioning turntable is driven by the positioning driving motor group and the positioning driving belt to rotate around the axis, so that the peripheral positioning of the wafer on the wafer carrying plate is realized.
Compared with the prior art, the invention has the beneficial effects that: through the circumference positioning module of this application, can follow the periphery quick and carry out the physical location to the wafer, positioning stability easily guarantees, has improved holistic efficiency.
Drawings
FIG. 1 is a schematic view of a stage apparatus according to the present invention;
FIG. 2 is a schematic view of a stage spindle;
FIGS. 3 and 4 are schematic views of part of the structure of the stage device;
fig. 5 is a schematic view of a positioning turntable.
Reference numerals illustrate:
100. a carrier base;
200. a carrier foot;
300. a carrier upper seat;
400. a stage spindle; 410. a lifting shaft body; 420. fixing the adapter; 430. a spring plate;
500. a wafer carrier; 501. positioning the slotted hole;
600. a circumferential positioning module; 610. a guide mounting plate; 620. a guide slide block assembly; 630. positioning a turntable; 631. a guide arc groove; 632. a turntable driving wheel; 640. a guide post; 650. positioning a driving motor unit; 660. and positioning the transmission belt.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-5, the carrier apparatus includes a carrier base 100, a carrier foot 200, a carrier upper base 300, a carrier spindle 400, a wafer carrier plate 500, and a circumferential positioning module 600.
Wherein, the carrier feet 200 are air-floating feet; the stage base 100 is floatingly supported by a plurality of the stage feet 200; the upper stage 300 is disposed on the stage base 100; the carrier spindle 400 is vertically disposed in a bearing hole formed in the carrier base 100 and the carrier upper base 300, and the top of the carrier spindle 400 is fixedly connected to the middle of the bottom surface of the wafer carrier disc 500, for driving the wafer carrier disc 500; the circumferential positioning module 600 is disposed between the stage upper base 300 and the wafer carrier 500, and is used for positioning the wafer supported by the wafer carrier 500 in an air-floating manner from the outer periphery.
Referring to fig. 2, the stage main shaft 400 includes a lifting shaft body 410, a fixing adaptor 420 and a spring plate 430, wherein an inner end of the spring plate 430 is fixed to a bottom of the lifting shaft body 410, and an outer end of the spring plate 430 is connected to a bottom of the stage base 100 through the fixing adaptor 420, so as to elastically support the bottom of the lifting shaft body 410. The lifting shaft body 410 comprises a lifting shaft group, an air sealing ring group, a shaft sleeve and a main shaft end cover, and is used for supporting and lifting and driving the wafer carrier 500.
Wherein, the wafer carrier 500 is provided with a gas blowing hole, a gas suction hole and a positioning slot 501 matched with the circumferential positioning module 600. The wafer is supported in suspension on the wafer carrier plate 500 by a combination of suction and blowing forces. The air supply and air circuit layout is not shown.
Wherein, referring to fig. 3 and 4, the circumferential positioning module 600 includes a guide mounting plate 610, a guide slider assembly 620, a positioning turntable 630, a guide post 640, a positioning drive motor group 650, and a positioning belt 660; the guide slider assembly 620 is mounted on the guide mounting plate 610, and the guide post 640 is vertically mounted on a slider; the positioning turntable 630 is disposed above the guide mounting plate 610, and the positioning turntable 630 is provided with a plurality of guide arc grooves 631 for guiding the guide posts 640, and the positioning turntable 630 is driven by the positioning driving motor unit 650 and the positioning driving belt 660 to rotate around the axis, so as to realize the peripheral positioning of the wafers on the wafer carrier 500.
Further, the guide mounting plate 610 has a ring structure with a notch, the bottom of the guide mounting plate 610 is fixed to the upper carrier 300, and the positioning driving motor unit 650 is disposed at the notch of the guide mounting plate 610; the positioning belt 660 is disposed at the driving wheel of the positioning driving motor unit 650 and inside the circular ring of the guide mounting plate 610.
Further, the plurality of guide sliding block assemblies 620 include sliding rails, sliding blocks and supporting installation seats, and the plurality of sliding blocks are radially and uniformly distributed on the guide installation plate 610; the sliding block is sleeved on the sliding rail in a sliding way; the support mount is fixed to the slider, and is used to support the positioning turntable 630 above and to mount the guide post 640.
Further, the positioning turntable 630 includes a turntable body and a turntable driving wheel 632, the turntable driving wheel 632 is coaxially mounted on the bottom surface of the turntable body, the guiding arc grooves 631 with the same number as the guiding posts 640 are provided on the turntable body located at the periphery of the turntable driving wheel 632, and the positioning driving belt 660 is sleeved on the turntable driving wheel 632 of the positioning turntable 630 and the driving wheel of the positioning driving motor unit 650.
Further, the guide post 640 includes a constant diameter section and a reducing section, the reducing section is detachably mounted to the top of the constant diameter section, the reducing section is sequentially thickened from bottom to top, and the upper portion of the reducing section protrudes from the positioning slot 501 to the upper surface of the wafer carrier 500. In a specific example, the whole reducing section can be made of PEEK plastic, and a flexible layer can be coated on the peripheral surface of the reducing section. To avoid hard contact damage to the wafer.
The circumferential positioning module 600 further includes a displacement sensor, a photoelectric switch, and other sensing components for controlling the sliding distance of the guide slider assembly 620, so as to perform positioning adaptation according to wafers with different specifications. The damping component can be further arranged at the tail end of the stroke, so that hard damage to products is avoided.
Further, not shown, the carrier apparatus further includes a plurality of carrier brake assemblies disposed between the carrier upper base 300 and the outer circumference of the wafer carrier 500 for braking the wafer carrier 500.
Further, not shown, the stage apparatus further comprises a plurality of return fork assemblies disposed between the stage upper base 300 and the wafer carrier plate 500 for passive return reset of the wafer carrier plate 500.
The elastic pieces 430 of the stage main shaft 400 are used for elastically connecting the stage main shaft 400 with the stage base 100 and/or the stage upper base 300, so as to enhance the stability of the stage main shaft 400.
The lifting shaft body 410 includes a hollow shaft body, a step shaft sleeve, an upper sealing ring, a lower sealing ring, a lifting motor, a supporting frame, an upper end cover and a lower end cover, which are not shown in the drawings.
The hollow shaft body and the lifting motor are sleeved in the step shaft sleeve, and the supporting frame is sleeved in the hollow cavities of the hollow shaft body and the lifting motor; the upper sealing ring and the lower sealing ring are sleeved at an upper mounting step and a lower mounting step which are arranged on the step shaft sleeve and are used for supporting and mounting the lifting shaft body; the upper end cover is arranged at the upper end of the hollow shaft body, and the lower end cover is arranged at the lower end of the step shaft sleeve.
The lifting shaft body drives the hollow shaft body to lift in the step shaft sleeve through the lifting motor, so that lifting driving of the driving piece is realized.
The lifting shaft body further comprises a sensor, the sensor is sleeved in the hollow cavity of the supporting frame, and a sensor connecting plate for supporting is arranged at the upper end of the sensor connecting plate.
The lifting shaft body further comprises a group of elastic pad groups arranged at the upper end of the supporting frame and used for elastically supporting the upper end of the supporting frame below the sensor connecting plate.
The lifting shaft body further comprises a motor adapter plate, and the lower end of the hollow shaft body is connected to the upper end of the lifting motor through the motor adapter plate.
The support frame comprises a hollow lower support frame and an upper support frame, wherein the upper end of the lower support frame is connected to the threaded hole at the lower end of the upper support frame through threads; the lower part of the lower support frame is sleeved in the hollow cavity of the lifting motor; the upper end of the upper supporting frame is in threaded connection with the elastic pad group.
The elastic pad group comprises a lower stop ring cap, an elastic adjusting pad and an upper stop cap; the elastic adjusting pad is connected to the upper end of the upper supporting frame through threads; the lower stop ring cap is sleeved to the inner cavity of the upper stop cap, and the elastic adjusting pad is covered in the lower stop ring cap; the top surface of the upper stop cap is abutted to the bottom surface of the sensor connecting plate, and a hole is formed in the middle of the upper stop cap for the sensor to pass through.
The lifting motor comprises a hollow motor stator and a motor rotor, and the outer peripheral surface of the motor stator is sleeved in a rotor ring groove of the motor rotor; the upper end face of the motor rotor is connected with the motor adapter plate.
The lifting shaft body further comprises a throttle, and the throttle is arranged on the step shaft sleeve and corresponds to the throttle hole at the upper sealing ring.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (8)
1. From carrier device of taking circumference location, carrier device includes carrier base (100), carrier footing (200), carrier upper seat (300), carrier main shaft (400) and wafer carrier dish (500), its characterized in that: the stage device further comprises a circumferential positioning module (600);
wherein, the carrier foot (200) adopts an air floatation foot margin; the stage base (100) is floatingly supported by a plurality of the stage feet (200); the carrier upper seat (300) is arranged on the carrier base (100); the carrier main shaft (400) is vertically arranged in bearing holes formed in the carrier base (100) and the carrier upper base (300), and the top of the carrier main shaft (400) is fixedly connected to the middle of the bottom surface of the wafer carrier disc (500) and used for driving the wafer carrier disc (500);
the circumference positioning module (600) is arranged between the carrier upper seat (300) and the wafer carrier plate (500) and is used for positioning the wafer supported by the wafer carrier plate (500) in an air-floating manner from the periphery.
2. The stage device according to claim 1, wherein:
the carrier main shaft (400) comprises a lifting shaft body (410), a fixing adapter (420) and an elastic sheet (430), wherein the inner end of the elastic sheet (430) is fixed to the bottom of the lifting shaft body (410), and the outer end of the elastic sheet (430) is connected to the bottom of the carrier base (100) through the fixing adapter (420), so that the bottom elastic support of the lifting shaft body (410) is realized.
3. The stage device according to claim 1, wherein:
the wafer carrying disc (500) is provided with a blowing hole, a suction hole and a positioning slot (501) which is matched with the circumferential positioning module (600).
4. A stage device according to claim 3, characterized in that:
the circumferential positioning module (600) comprises a guide mounting plate (610), a guide sliding block assembly (620), a positioning turntable (630), a guide column (640), a positioning driving motor unit (650) and a positioning transmission belt (660); the guide slide block assembly (620) is mounted on the guide mounting plate (610) and vertically mounts the guide post (640) on a slide block; the positioning turntable (630) is arranged above the guide mounting plate (610), a plurality of guide arc grooves (631) are formed in the positioning turntable (630) and used for guiding the guide posts (640), and the positioning turntable (630) is driven by the positioning driving motor group (650) and the positioning driving belt (660) to rotate around the axis, so that the peripheral positioning of the wafers on the wafer carrier plate (500) is realized.
5. The stage device according to claim 4, wherein:
the guide mounting plate (610) is of a ring structure with a notch, the bottom of the guide mounting plate (610) is fixed on the upper seat (300) of the carrying platform, and the positioning driving motor unit (650) is arranged at the notch of the guide mounting plate (610); the positioning transmission belt (660) is arranged at the driving wheel of the positioning driving motor unit (650) and inside the circular ring of the guiding mounting plate (610).
6. The stage device according to claim 5, wherein:
the guide slide block assemblies (620) comprise slide rails, slide blocks and support installation seats, and the slide blocks are radially and uniformly distributed on the guide installation plate (610); the sliding block is sleeved on the sliding rail in a sliding way; the support mount is secured to the slider, the support mount being for supporting a positioning turntable (630) above and for mounting the guide post (640).
7. The stage device according to claim 5, wherein:
the positioning turntable (630) comprises a turntable body and a turntable driving wheel (632), the turntable driving wheel (632) is coaxially arranged on the bottom surface of the turntable body, the guide arc grooves (631) with the same number as the guide posts (640) are formed in the turntable body located on the periphery of the turntable driving wheel (632), and the positioning driving belt (660) is sleeved on the turntable driving wheel (632) of the positioning turntable (630) and the driving wheel of the positioning driving motor unit (650).
8. The stage device according to claim 5, wherein:
the guide post (640) comprises an equal-diameter section and a variable-diameter section, the variable-diameter section is detachably mounted to the top of the equal-diameter section, the variable-diameter section is sequentially thickened from bottom to top, and the upper part of the variable-diameter section protrudes from the upper surface of the wafer carrying disc (500) from the positioning slot hole (501).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310623976.3A CN116525515A (en) | 2023-05-30 | 2023-05-30 | Carrier device with circumferential positioning function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310623976.3A CN116525515A (en) | 2023-05-30 | 2023-05-30 | Carrier device with circumferential positioning function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116525515A true CN116525515A (en) | 2023-08-01 |
Family
ID=87394197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310623976.3A Withdrawn CN116525515A (en) | 2023-05-30 | 2023-05-30 | Carrier device with circumferential positioning function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116525515A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1156401A2 (en) * | 2000-05-17 | 2001-11-21 | NexPress Solutions LLC | Apparatus for positioning a cylindrical sleeve on a carrier body |
| TWI520889B (en) * | 2014-11-25 | 2016-02-11 | Chroma Ate Inc | A fast positioning device for electronic components |
| CN113921438A (en) * | 2021-10-18 | 2022-01-11 | 麦斯克电子材料股份有限公司 | Multi-size wafer centering device |
| CN114695227A (en) * | 2022-03-29 | 2022-07-01 | 苏州矽行半导体技术有限公司 | Carrier system and wafer driving method adopting same |
| CN114683223A (en) * | 2022-03-29 | 2022-07-01 | 苏州矽行半导体技术有限公司 | Wafer carrying platform |
| CN114683227A (en) * | 2022-03-29 | 2022-07-01 | 苏州矽行半导体技术有限公司 | Centering fork mechanism and wafer carrying platform |
| CN216883646U (en) * | 2022-01-26 | 2022-07-05 | 昆山联滔电子有限公司 | Circumferential positioning jig |
| CN217280722U (en) * | 2022-05-17 | 2022-08-23 | 深圳市鼎力软件技术有限公司 | Turntable device for various wafers |
| CN217468378U (en) * | 2022-08-18 | 2022-09-20 | 江南大学 | Semiconductor wafer bearing and positioning device |
| CN116038774A (en) * | 2023-03-31 | 2023-05-02 | 无锡卓海科技股份有限公司 | Parallelism adjusting structure and method for wafer carrying platform and mechanical arm |
-
2023
- 2023-05-30 CN CN202310623976.3A patent/CN116525515A/en not_active Withdrawn
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1156401A2 (en) * | 2000-05-17 | 2001-11-21 | NexPress Solutions LLC | Apparatus for positioning a cylindrical sleeve on a carrier body |
| TWI520889B (en) * | 2014-11-25 | 2016-02-11 | Chroma Ate Inc | A fast positioning device for electronic components |
| CN113921438A (en) * | 2021-10-18 | 2022-01-11 | 麦斯克电子材料股份有限公司 | Multi-size wafer centering device |
| CN216883646U (en) * | 2022-01-26 | 2022-07-05 | 昆山联滔电子有限公司 | Circumferential positioning jig |
| CN114695227A (en) * | 2022-03-29 | 2022-07-01 | 苏州矽行半导体技术有限公司 | Carrier system and wafer driving method adopting same |
| CN114683223A (en) * | 2022-03-29 | 2022-07-01 | 苏州矽行半导体技术有限公司 | Wafer carrying platform |
| CN114683227A (en) * | 2022-03-29 | 2022-07-01 | 苏州矽行半导体技术有限公司 | Centering fork mechanism and wafer carrying platform |
| CN217280722U (en) * | 2022-05-17 | 2022-08-23 | 深圳市鼎力软件技术有限公司 | Turntable device for various wafers |
| CN217468378U (en) * | 2022-08-18 | 2022-09-20 | 江南大学 | Semiconductor wafer bearing and positioning device |
| CN116038774A (en) * | 2023-03-31 | 2023-05-02 | 无锡卓海科技股份有限公司 | Parallelism adjusting structure and method for wafer carrying platform and mechanical arm |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20230801 |
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| WW01 | Invention patent application withdrawn after publication |