CN116518760B - Split-flow channel type flat loop heat pipe - Google Patents
Split-flow channel type flat loop heat pipe Download PDFInfo
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- CN116518760B CN116518760B CN202310577753.8A CN202310577753A CN116518760B CN 116518760 B CN116518760 B CN 116518760B CN 202310577753 A CN202310577753 A CN 202310577753A CN 116518760 B CN116518760 B CN 116518760B
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- heat
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- wick
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- 239000007788 liquid Substances 0.000 claims abstract description 73
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims description 9
- 230000008859 change Effects 0.000 claims description 6
- 238000009833 condensation Methods 0.000 claims description 6
- 230000005494 condensation Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 230000009471 action Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000011800 void material Substances 0.000 claims 1
- 238000012546 transfer Methods 0.000 abstract description 14
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000010992 reflux Methods 0.000 description 13
- 230000006872 improvement Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005499 meniscus Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Abstract
The invention provides a split-flow channel type flat loop heat pipe which comprises an evaporator, a steam pipeline, a condenser and a liquid pipeline which are sequentially and circularly connected, wherein the evaporator comprises an upper cover plate, a lower substrate and an intermediate body positioned between the upper cover plate and the lower substrate, the upper cover plate comprises a liquid inlet and a steam outlet, the intermediate body comprises a compensation cavity and a steam cavity, the compensation cavity is communicated with the liquid inlet, the steam cavity is communicated with the steam outlet, a capillary core is arranged in the evaporator and comprises a high-heat-conductivity capillary core and a low-heat-conductivity capillary core, the high-heat-conductivity capillary core is arranged on the lower substrate and is thermally connected with a heat source, and the low-heat-conductivity capillary core is arranged at the upper part of the high-heat-conductivity capillary core and is communicated with the steam cavity. The evaporator designed by the invention can form a plurality of vapor-liquid interfaces at the capillary core with high heat conductivity, greatly increases the liquid sucking capacity of the capillary core, and is beneficial to improving the heat transfer characteristic of the loop heat pipe.
Description
Technical Field
The invention relates to the field of heat exchange, in particular to a split-flow channel type flat loop heat pipe.
Background
The heat pipe technology utilizes the heat transfer theory and the rapid heat transfer property of the phase change medium, and the heat of a heating source is rapidly transferred to the outside of the heat source through the heat pipe, so that the heat conduction capacity of the heat pipe exceeds that of any known metal. Therefore, the heat pipe technology has become a hot spot for many students at home and abroad in recent decades since the advent of the heat pipe technology.
The loop heat pipe is an expansion of the traditional heat pipe technology and is a high-efficiency two-phase heat transfer device. The evaporator and the condenser are connected into a loop through the steam pipeline and the liquid pipeline, and the capillary force provided by the capillary core is only used for driving the circulation of the working medium in the pipe, so that the phase change heat transfer is realized by utilizing the working medium without extra energy consumption. The loop heat pipe has the structural characteristics that: the vapor pipeline and the liquid pipeline are separated, the evaporator and the compensator are integrated, and the vapor pipeline and the liquid pipeline are compact in structure, so that the vapor-liquid carrying resistance is small, the starting is quick and flexible, the vapor-liquid cooling device has the characteristics of good heat transfer capability, convenience in installation, long-distance heat transfer and the like, and is widely applied to various fields of military industry, aerospace, electronic equipment and the like.
The loop heat pipe mainly comprises an evaporator, a capillary core, a compensation cavity, a steam pipeline, a liquid pipeline, a condenser and the like. The working principle of the loop heat pipe is as follows: the heat of the heat source is transferred to the working medium through the heat conduction of the evaporator, the liquid working medium absorbs heat, the temperature rises and phase change occurs, the generated steam evaporates on the outer surface of the capillary core, flows out of the steam channel and enters the steam pipeline, then enters the condenser to be condensed into liquid, the condensed liquid enters the compensation cavity along the liquid pipeline to compensate the capillary core under the pushing of the steam pressure, and the part of reflux liquid is absorbed into the capillary core again through the capillary suction of the capillary core to absorb heat and evaporate, so that the complete circulation process is repeatedly formed. The capillary wick is the core of the evaporator and thus the loop heat pipe, because the driving force of the entire loop is provided entirely by the capillary force of the capillary wick, and the design of the capillary wick or the evaporator determines the overall performance of the loop heat pipe.
The loop heat pipe has the advantages, and is more suitable for application scenes with limited inner space. However, the heat leakage problem exists in the conventional loop heat pipe because the evaporator and the compensation cavity are located on the same substrate, a part of heat is transferred to the compensation cavity along the axial direction, and the reflux liquid flowing through the compensation cavity absorbs the part of heat to evaporate, so that working media cannot be timely supplemented, the circulation process is blocked, the operation is unstable, and even the heat pipe is invalid.
In addition, the vapor-liquid interface formed in the capillary core of the traditional flat loop heat pipe is limited, so that the suction performance of the capillary core is limited, and the heat dissipation performance of the loop heat pipe is greatly reduced; meanwhile, the condensate return channel area of the traditional loop heat pipe is limited, so that the heat transfer performance of the loop heat pipe is reduced.
Disclosure of Invention
Aiming at the problems, the invention provides a design of a split-flow channel type flat loop heat pipe, which not only can effectively prevent the problem of larger heat leakage of an evaporator and a compensation cavity, avoid the problems of circulation interruption and heat pipe failure caused by heat entering the compensation cavity, but also increases the vapor-liquid interface inside a capillary core, strengthens the suction effect of the capillary core on liquid, increases the effective condensation reflux area, and improves the overall heat dissipation capacity and the heat transfer performance of the loop heat pipe.
In order to achieve the above object, the technical scheme of the present invention is as follows:
the utility model provides a dull and stereotyped loop heat pipe of reposition of redundant personnel passageway, includes evaporator, steam line, condenser and the liquid pipeline of circulating connection in proper order, the evaporator includes upper cover plate, lower base member and is located the upper cover plate and the intermediate between the base member down, the upper cover plate includes liquid inlet and steam outlet, and the intermediate includes compensation chamber and steam cavity, compensation chamber and liquid inlet intercommunication, steam cavity and steam outlet intercommunication, set up the capillary core in the evaporator, the capillary core includes high heat conduction capillary core and low heat conduction capillary core, high heat conduction capillary core sets up on the base member down, and is connected with the heat source heat, and low heat conduction capillary core sets up in high heat conduction capillary core upper portion, communicates with the steam cavity.
In one improvement, at least a portion of the low thermal conductivity wick is disposed in a lower portion of the vapor chamber.
In one improvement, the edge of the upper cover plate extends downward to the edge of the lower base body for cladding the intermediate body and the capillary wick between the upper cover plate and the lower base body.
In one improvement, the low thermal conductivity capillary wick and the housing outside the liquid return channel are of a low thermal conductivity material.
A heat exchanging method of split channel type flat loop heat pipe includes heating lower base body by heating element, transferring heat to capillary core with high heat conductivity, absorbing heat by working medium in loop heat pipe to generate phase change and steam, entering steam channel by gap in porous medium, collecting steam cavity, entering steam pipeline by steam outlet, condensing into liquid working medium by condenser, flowing condensate into compensation cavity by vapor pressure along liquid pipeline, and back flowing by liquid back flowing channel.
Compared with the prior art, the invention has the following advantages:
(1) The invention combines the capillary core with high heat conductivity coefficient and the capillary core with low heat conductivity coefficient, wherein the capillary core with high heat conductivity such as foam copper ensures that the heat of the heating element is completely or mostly transferred to the working medium. The upper part adopts a low heat conduction capillary core to prevent liquid condensed and refluxed from being heated and evaporated, thereby preventing reflux.
(2) The capillary core with high heat conductivity coefficient and the capillary core with low heat conductivity coefficient have large heat conductivity coefficient difference so that the heat of the heating element is fully transferred to the working medium. The upper part adopts a low heat conduction capillary core to prevent liquid condensed and refluxed from being heated and evaporated, thereby preventing reflux.
(3) The invention increases the liquid reflux channel, increases the effective condensation reflux area, and improves the whole heat dissipation capacity and heat transfer performance of the loop heat pipe.
(4) Two meniscus interfaces may be formed between each low thermal conductivity wick and the high thermal conductivity wick. Compared with the traditional heat pipe, the vapor-liquid interface is increased, the capillary force of the capillary core is greatly increased, the suction effect of the capillary core on liquid is enhanced, and the heat transfer performance is improved.
(5) Based on the structure, the problems of large heat leakage caused by the fact that the evaporator and the compensation cavity are arranged on the same substrate can be effectively prevented, and meanwhile, the problems of circulation interruption, heat pipe failure and the like caused by the fact that heat axially enters the compensation cavity to evaporate working media are avoided.
Drawings
FIG. 1 is a diagram of the overall system of the loop heat pipe of the present invention.
Fig. 2 is a schematic view of an evaporator of the present invention in a disassembled state.
Fig. 3 is a schematic perspective view of an evaporator intermediate of the present invention.
Fig. 4 is a top view of an evaporator intermediate of the invention.
Fig. 5 is a bottom view of the evaporator intermediate of the invention.
Fig. 6 is a schematic diagram of the operation of the evaporator of the invention.
In the figure:
1. the heat-conducting capillary tube comprises an evaporator, a capillary core, a vapor pipeline, a condenser, a liquid pipeline, a compensation cavity, a vapor channel, a vapor cavity, a vapor outlet, a liquid inlet, a liquid backflow channel, an upper cover plate, a lower base body, a middle body, a high heat-conducting capillary core and a low heat-conducting capillary core.
Detailed Description
The following describes the embodiments of the present invention in detail with reference to the drawings.
Herein, "/" refers to division, "×", "x" refers to multiplication, unless otherwise specified.
As shown in fig. 1-6, a split-flow channel type flat loop heat pipe comprises an evaporator 1, a steam pipeline 3, a condenser 4 and a liquid pipeline 5 which are sequentially and circularly connected, wherein fluid absorbs heat and evaporates in the evaporator 1, then enters the condenser 4 through the steam pipeline 3 to be subjected to exothermic condensation into liquid, and then the liquid enters the evaporator 1 through the liquid pipeline 5, so that a cycle is formed.
As shown in fig. 2, the evaporator 1 includes an upper cover plate 12, a lower base 13, and an intermediate body 14 between the upper cover plate 12 and the lower base 13, the upper cover plate 12 includes a liquid inlet 10 and a vapor outlet 9, and the liquid inlet 10 and the vapor outlet 9 are connected to the liquid pipe 5 and the vapor pipe 3, respectively. The intermediate body 14 comprises a compensating chamber 6 and a vapour chamber 8, the compensating chamber 6 being in communication with the liquid inlet 10 for introducing liquid into the compensating chamber. The steam chamber 8 communicates with a steam outlet 9. The evaporator 1 is internally provided with a capillary core 2, the capillary core 2 comprises a high heat conduction capillary core 21 and a low heat conduction capillary core 22, the high heat conduction capillary core 21 is arranged on the lower substrate 13 and is in thermal connection with a heat source, and the low heat conduction capillary core 22 is arranged on the upper part of the high heat conduction capillary core 21 and is communicated with the steam cavity 8.
The invention combines the capillary core with high heat conductivity coefficient and the capillary core with low heat conductivity coefficient, wherein the capillary core with high heat conductivity such as foam copper ensures that the heat of the heating element is completely or mostly transferred to the working medium. The upper part adopts a low heat conduction capillary core to prevent liquid condensed and refluxed from being heated and evaporated, thereby preventing reflux.
Preferably, the high thermal conductivity wick has a thermal conductivity of 130-800 times that of the low thermal conductivity wick. Preferably 200-500 times.
Preferably, the high thermal conductivity capillary wick has a thermal conductivity of typically between 80 and 400W/(mK), higher than that of conventional metals. The adopted high heat conduction capillary core is preferably porous foam copper metal; and the low heat conductivity capillary core has a heat conductivity coefficient of 0.2-0.3W/(mK), preferably PTFE.
The capillary core with high heat conductivity and the capillary core with low heat conductivity have large heat conductivity difference, so that the heat of the heating element can be fully or mostly transferred to the working medium. The upper part adopts a low heat conduction capillary core to prevent liquid condensed and refluxed from being heated and evaporated, thereby preventing reflux. If the heat conductivity of the high heat conductivity capillary core is too low and the heat conductivity of the low heat conductivity capillary core is too high, and the multiple difference between the two is too small, the technical effect becomes poor, and the heat exchange energy absorption is greatly reduced.
The thickness of the capillary core with two heat conductivity coefficients can be designed according to specific application conditions, the capillary force of the capillary core depends on the mesh number, the porosity and the effective capillary radius, and if the thickness of the capillary core is insufficient, enough capillary force cannot be provided; if the capillary core thickness is too large, the permeability may be lowered. And finally, the working medium liquid returns to the high-heat-conductivity capillary core, so that the capillary force of the high-heat-conductivity capillary core is stronger than that of the low-heat-conductivity capillary core.
The high heat conduction capillary core is arranged on the lower substrate and is in thermal connection with the heat source, and the low heat conduction capillary core is arranged on the upper part of the high heat conduction capillary core and is communicated with the liquid reflux channel. The split flow channel structure is introduced, so that steam and liquid are separated from each other and are not in direct contact with each other, a steam-liquid interface is increased, the capillary force of the capillary core is greatly increased, and the heat transfer characteristic is improved; the effective condensation reflux area is greatly increased, the overall heat dissipation capacity of the loop heat pipe is improved, and the heat transmission performance of the loop heat pipe is improved.
As shown in fig. 3, the invention designs a plurality of liquid return channels 11, namely, the working medium is condensed and then enters the compensation cavity and flows into the evaporator. Each liquid reflux channel is communicated with the low heat conduction capillary core, the low heat conduction capillary core is arranged at the upper part of the high heat conduction capillary core, liquid in the low heat conduction capillary core flows into the high heat conduction capillary core under the action of gravity and capillary force, and two menisci can be formed between each low heat conduction capillary core and the high heat conduction capillary core. Compared with the traditional heat pipe, the vapor-liquid interface is increased, and the capillary force of the capillary core is greatly increased.
In one improvement, at least a portion of the low thermal conductivity wick is disposed in a lower portion of the vapor chamber. The evaporation efficiency can be further improved.
In one improvement, the edge of the upper cover plate extends downward to the edge of the lower base body for cladding the intermediate body and the capillary wick between the upper cover plate and the lower base body. The intermediate is coated in the design, so that the intermediate is better protected and damage is avoided.
In one improvement, the low thermal conductivity capillary wick and the housing outside the liquid return channel are of a low thermal conductivity material. Besides the above functions, the shell also prevents the liquid working medium flowing through the capillary core with low heat conductivity from contacting with steam, and prevents heat leakage, thereby causing heat pipe failure or heat exchange performance reduction of the heat pipe.
As shown in fig. 2, in the evaporator designed in the present application, each low thermal conductivity capillary wick 22 can form two meniscus interfaces at the high thermal conductivity capillary wick 21, while the conventional heat pipe forms only one vapor-liquid interface at the capillary wick. The liquid sucking capacity of the capillary core is greatly increased, and the heat transfer characteristic of the loop heat pipe is improved; meanwhile, the novel heat pipe has the innovative design point that based on the structure, the effective condensation reflux area of the loop heat pipe is greatly increased, the overall heat dissipation capacity of the loop heat pipe is improved, the working cycle is more stable, and the heat transmission performance of the loop heat pipe is improved.
The working process of the heat pipe of the invention is as follows: the lower substrate 13 is heated by a heating element, heat is transferred to the high heat conduction capillary core 21 through heat conduction, the working medium in the loop heat pipe absorbs the heat, phase change occurs and steam is generated, the steam enters the steam channel 7 through a gap in the porous medium and then enters the steam cavity 8 to be collected, the steam enters the steam pipeline 3 through the steam outlet 9 and then enters the condenser 4 to be condensed into liquid working medium, the condensed liquid flows into the compensation cavity 6 along the liquid pipeline 5 under the action of vapor pressure and flows back through the liquid return channel 11, the part of the return liquid is sucked into the low heat conduction capillary core 22 through the capillary force of the capillary core, and then is sucked into the high heat conduction capillary core 21 through the capillary force of the high heat conduction capillary core, a plurality of vapor-liquid interfaces are formed, and the capillary suction force and the heat transfer enhancement capability are increased. The condensate absorbs heat again to evaporate, and the whole working procedure is completed repeatedly.
While the invention has been described in terms of preferred embodiments, the invention is not so limited. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.
Claims (7)
1. The split-flow channel type flat loop heat pipe comprises an evaporator, a steam pipeline, a condenser and a liquid pipeline which are sequentially and circularly connected, and is characterized in that the evaporator comprises an upper cover plate, a lower substrate and an intermediate body positioned between the upper cover plate and the lower substrate, the upper cover plate comprises a liquid inlet and a steam outlet, the intermediate body comprises a compensation cavity and a steam cavity, the compensation cavity is communicated with the liquid inlet, the steam cavity is communicated with the steam outlet, a capillary core is arranged in the evaporator, the capillary core comprises a high heat conduction capillary core and a low heat conduction capillary core, the high heat conduction capillary core is arranged on the lower substrate and is thermally connected with a heat source, the low heat conduction capillary core is arranged at the upper part of the high heat conduction capillary core and is communicated with the steam cavity, and the heat conduction coefficient of the high heat conduction capillary core is 130-800 times that of the low heat conduction capillary core. The heat conductivity coefficient of the high heat conductivity capillary core is 80-400W/(m.K); and the low heat conduction capillary core has a heat conduction coefficient of 0.2-0.3W/(m.K).
2. The split channel flat loop heat pipe of claim 1, wherein at least a portion of the low thermal conductivity wick is disposed in a lower portion of the vapor chamber.
3. The split channel flat loop heat pipe of claim 1, wherein the edge portion of the upper cover plate extends downwardly to the edge portion of the lower base body for wrapping the intermediate body and the wick between the upper cover plate and the lower base body.
4. The split channel flat loop heat pipe as claimed in claim 1 wherein the low thermal conductivity wick and the housing outside the liquid return channel are of a low thermal conductivity material.
5. The split channel flat loop heat pipe of claim 1, wherein the high thermal conductivity wick thermal conductivity is 200-500 times the low thermal conductivity wick thermal conductivity.
6. The split channel flat loop heat pipe as claimed in claim 1, wherein the capillary force of the high thermal conductivity wick is stronger than the capillary force of the low thermal conductivity wick.
7. A method of heat exchange in a split-flow channel flat loop heat pipe as claimed in any one of claims 1 to 6 wherein the lower substrate is heated by a heating element, heat is transferred to a highly thermally conductive wick by conduction, a working medium in the loop heat pipe absorbs the heat to undergo a phase change and generate steam, the steam enters the steam channel through a void in the porous medium and then enters the steam cavity for collection, enters the steam pipeline through the steam outlet and then enters the condenser for condensation into a liquid working medium, condensate flows into the compensation cavity along the liquid pipeline under the action of vapor pressure, and flows back through the liquid return channel, the part of the return liquid is drawn into the low thermally conductive wick by the capillary force of the wick, and is drawn into the high thermally conductive wick by the capillary force of the high thermally conductive wick, and a plurality of vapor-liquid interfaces are formed therein.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410122945.4A CN117760243A (en) | 2023-05-22 | 2023-05-22 | Miniature heat pipe evaporator |
| CN202310577753.8A CN116518760B (en) | 2023-05-22 | 2023-05-22 | Split-flow channel type flat loop heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310577753.8A CN116518760B (en) | 2023-05-22 | 2023-05-22 | Split-flow channel type flat loop heat pipe |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410122945.4A Division CN117760243A (en) | 2023-05-22 | 2023-05-22 | Miniature heat pipe evaporator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116518760A CN116518760A (en) | 2023-08-01 |
| CN116518760B true CN116518760B (en) | 2024-02-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410122945.4A Pending CN117760243A (en) | 2023-05-22 | 2023-05-22 | Miniature heat pipe evaporator |
| CN202310577753.8A Active CN116518760B (en) | 2023-05-22 | 2023-05-22 | Split-flow channel type flat loop heat pipe |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410122945.4A Pending CN117760243A (en) | 2023-05-22 | 2023-05-22 | Miniature heat pipe evaporator |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN117760243A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101900504A (en) * | 2010-08-19 | 2010-12-01 | 中冶南方工程技术有限公司 | Flat type loop heat pipe |
| CN103629963A (en) * | 2013-12-16 | 2014-03-12 | 华北电力大学 | Multi-scale capillary core flat plate loop heat pipe type heat-dissipation device |
| CN107782189A (en) * | 2017-09-27 | 2018-03-09 | 北京空间飞行器总体设计部 | Resistance to malleation, high-power flat evaporator and its processing method and the flat board loop circuit heat pipe based on the evaporator |
| CN114264178A (en) * | 2022-01-17 | 2022-04-01 | 山东大学 | Loop heat pipe capable of automatically adjusting aperture |
| CN114383447A (en) * | 2020-10-22 | 2022-04-22 | 南京中兴软件有限责任公司 | Evaporator and loop heat pipe |
-
2023
- 2023-05-22 CN CN202410122945.4A patent/CN117760243A/en active Pending
- 2023-05-22 CN CN202310577753.8A patent/CN116518760B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101900504A (en) * | 2010-08-19 | 2010-12-01 | 中冶南方工程技术有限公司 | Flat type loop heat pipe |
| CN103629963A (en) * | 2013-12-16 | 2014-03-12 | 华北电力大学 | Multi-scale capillary core flat plate loop heat pipe type heat-dissipation device |
| CN107782189A (en) * | 2017-09-27 | 2018-03-09 | 北京空间飞行器总体设计部 | Resistance to malleation, high-power flat evaporator and its processing method and the flat board loop circuit heat pipe based on the evaporator |
| WO2019061005A1 (en) * | 2017-09-27 | 2019-04-04 | 北京空间飞行器总体设计部 | Great-power flat evaporator resisting against positive pressure, processing method therefor, and flat-plate loop heat pipe based on evaporator |
| CN114383447A (en) * | 2020-10-22 | 2022-04-22 | 南京中兴软件有限责任公司 | Evaporator and loop heat pipe |
| CN114264178A (en) * | 2022-01-17 | 2022-04-01 | 山东大学 | Loop heat pipe capable of automatically adjusting aperture |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117760243A (en) | 2024-03-26 |
| CN116518760A (en) | 2023-08-01 |
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