CN116507095A - Loop heat pipe radiating element, device and electronic equipment - Google Patents

Abstract

The invention discloses a loop heat pipe radiating element, a device and electronic equipment, wherein the element comprises: the liquid storage cavity is configured to contain liquid working medium and can be communicated with a condensation channel of the condenser; the evaporation cavities are connected with each other through a gas-liquid separation wall, and each evaporation cavity can be communicated with the condensation channel; and after the liquid working medium in the evaporation cavity absorbs heat from the heat source and is vaporized into gas, the gas can flow into the condensation channel for condensation. According to the invention, the plurality of evaporation cavities can share the working medium of the same liquid storage cavity, so that automatic proportioning and use can be realized according to different heating time and heating value of a plurality of heat sources, the heat dissipation of the plurality of heat sources can be satisfied, and the heat dissipation effect is improved; therefore, the invention can solve the problem that the heat dissipation effect of the existing loop heat pipe heat dissipation device is poor for multi-heat source products.

Description

Loop heat pipe radiating element, device and electronic equipment

Technical Field

The present invention relates to the field of heat dissipation technologies, and more particularly, to a loop heat pipe heat dissipation element, a loop heat pipe heat dissipation device including the loop heat pipe heat dissipation element, and an electronic device including the loop heat pipe heat dissipation device.

Background

The current loop heat pipe heat dissipation device generally consists of an evaporation cavity, a liquid storage cavity, a condensation cavity and an annular pipeline. The working principle is that when the heat source works, heat generated by the heat source is transferred to the evaporation cavity, liquid medium absorbs the heat in the evaporation cavity to generate phase change evaporation, generated vapor enters the condensation cavity through the annular pipeline, the vapor is cooled and condensed into liquid, the liquid flows back to the liquid storage cavity along the annular pipeline, and the liquid in the liquid storage cavity flows back to the evaporation cavity, so that the complete heat exchange cycle of liquid-gas-liquid is completed.

In the process of implementing the present invention, the inventor finds that at least the following problems exist in the prior art:

the existing loop heat pipe heat dissipation device mainly dissipates heat aiming at a single heat source, and when the product close to multiple heat sources is faced, even if a larger evaporation cavity is arranged, the heat dissipation at the heat source is affected due to uneven local heating, so that the heat dissipation effect is poor.

In summary, how to effectively solve the problem that the heat dissipation effect of the existing loop heat pipe heat dissipation device is not good for multi-heat source products is a urgent need of those skilled in the art.

Disclosure of Invention

In view of the above, a first object of the present invention is to provide a loop heat pipe heat dissipation device, which can solve the problem of poor heat dissipation effect of the conventional loop heat pipe heat dissipation device for multi-heat source products, and a second object of the present invention is to provide a loop heat pipe heat dissipation device comprising the loop heat pipe heat dissipation device, and a third object of the present invention is to provide an electronic device comprising the loop heat pipe heat dissipation device.

In order to achieve the first object, the present invention provides the following technical solutions:

a loop heat pipe heat sink comprising:

the liquid storage cavity is configured to contain liquid working medium and can be used for being communicated with a condensation channel of a condenser so as to guide the liquid working medium into the condensation channel;

the evaporation cavities are connected with the liquid storage cavities through gas-liquid separation walls so as to introduce the liquid working medium from the liquid storage cavities, and the evaporation cavities can be also used for communicating with the condensation channels;

wherein: when the liquid working medium in the evaporation cavity absorbs heat from a heat source and is vaporized into gas, the gas can flow into the condensation channel for condensation.

In the above loop heat pipe heat dissipation element, when the loop heat pipe heat dissipation element is used, the loop heat pipe heat dissipation element is applied to a product with a plurality of heat sources at proper distances, at the moment, a plurality of evaporation cavities around the liquid storage cavity are respectively in heat conduction contact with the corresponding heat sources, and the liquid storage cavity is positioned among the plurality of evaporation cavities, namely among the plurality of heat sources, so as to simultaneously supply liquid working media for the plurality of evaporation cavities. The evaporation cavity absorbs heat of the heat source, liquid in the evaporation cavity absorbs heat to evaporate, gas generated by evaporation enters the condensation channel to be cooled to form liquid, and then the liquid flows back to the liquid storage cavity to realize circulation. In the loop heat pipe radiating element, a plurality of evaporating cavities can be arranged around the liquid storage cavity, so that the evaporating cavities can share liquid working medium in the same liquid storage cavity, automatic and better proportioning can be carried out according to different heating time and heating quantity of a plurality of heat sources, if one heat source radiates too much heat, more liquid can be led in the evaporating cavity corresponding to the heat source from the liquid storage cavity, thereby meeting the heat radiation of a plurality of heat sources and improving the heat radiation effect. In summary, the loop heat pipe heat dissipation element can improve the problem that the existing loop heat pipe heat dissipation device has poor heat dissipation effect for multi-heat source products.

In some embodiments, the evaporation cavity is provided with a capillary structure integrally sintered and formed with the gas-liquid separation wall.

In some embodiments, the wicking structure is disposed below the gas-liquid separation wall.

In some embodiments, the device comprises a groove-shaped piece and a cover piece covering the notch of the groove-shaped piece, wherein a groove cavity of the groove-shaped piece is divided into the evaporation cavity and the liquid storage cavity by at least one sintered gas-liquid separation wall.

In some embodiments, a post is disposed within each of the evaporation chamber and the liquid storage chamber for connection to the cover.

In order to achieve the second object, the present invention provides the following technical solutions:

the loop heat pipe radiating device comprises a condenser and any loop heat pipe radiating element, wherein the condenser is provided with a condensing channel;

wherein:

the condensation channels comprise a first condensation channel and a second condensation channel which are communicated, the first condensation channel is communicated with a liquid storage cavity of the loop heat pipe radiating element, the second condensation channel is communicated with an evaporation cavity of the loop heat pipe radiating element, and at least two evaporation cavities are respectively communicated with different second condensation channels. The loop heat pipe radiating element has the technical effects, so the loop heat pipe radiating device with the loop heat pipe radiating element has the corresponding technical effects.

In some embodiments, the liquid storage cavity has a width smaller than a width of the evaporation cavity in an extending direction of the gas-liquid separation wall of the loop heat pipe heat dissipation element.

In some embodiments, a plurality of the evaporation chambers are disposed around the liquid storage chamber; or alternatively

The evaporation cavities and the liquid storage cavities are alternately arranged, and the evaporation cavities in the middle are connected with the liquid storage cavities on two sides through gas-liquid separation walls.

In some embodiments, the second condensation channel, which is connected to the evaporation chamber at the middle part, is split at the middle part of the condensation path to be respectively guided to the liquid storage chambers at two sides.

In some embodiments, at least one of the plurality of evaporation cavities is a first evaporation cavity, another is a second evaporation cavity with a distribution area smaller than that of the first evaporation cavity, and the cooling path of the condensation channel communicated with the first evaporation cavity is shorter than that of the condensation channel communicated with the second evaporation cavity.

In order to achieve the third objective, the present invention further provides an electronic device, which includes a plurality of heat sources, and further includes any one of the loop heat pipe heat dissipation devices, wherein each evaporation cavity of the loop heat pipe heat dissipation device is respectively abutted against each heat source, and a liquid storage cavity of the loop heat pipe heat dissipation device is located between adjacent heat sources. Because the loop heat pipe heat dissipation device has the technical effects, the electronic equipment with the loop heat pipe heat dissipation device should also have the corresponding technical effects.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a heat dissipation device for loop heat pipes in an open state of a cover according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a loop heat pipe heat dissipating device with multiple liquid storage cavities according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a loop heat pipe heat dissipating device with evaporation chambers disposed on three sides of a liquid storage chamber according to an embodiment of the present invention.

The figures are marked as follows:

the device comprises an evaporation cavity 1, a liquid storage cavity 2, a condenser 3, a condensation channel 4, a gas-liquid separation wall 5, a groove-shaped piece 6 and a cover piece 7.

Detailed Description

With the vigorous development of the electronic heat dissipation industry, the iteration update of electronic products is carried out, the power and the heat flux density of a chip are continuously increased, the heat-relieving power of a single heat pipe is difficult to be improved, more heat pipes are required to be added for relieving heat, so that the weight of the heat radiator is increased, the cost is increased, and the layout is difficult; the system internal layout is also becoming more complex, the distance between the chip and the fan increases, resulting in a long-distance heat transfer of the heat pipe and a deterioration in heat transfer efficiency. Aiming at the problems of the traditional heat pipe module, the loop heat pipe has the advantages of extremely high heat transfer performance, excellent isothermal property and long-distance heat transfer, is well utilized in the heat dissipation scenes, and is suitable for scenes with high power and chip layout and long distance between fans. With the development of the electronic industry, a host has a plurality of heat sources inside, and a loop heat pipe for heat dissipation of multiple heat sources necessarily has a trend.

However, the current loop heat pipe heat dissipation device generally consists of an evaporation cavity, a liquid storage cavity, a condensation cavity and an annular pipeline. The working principle is that when the heat source works, heat generated by the heat source is transferred to the evaporation cavity, liquid medium absorbs the heat in the evaporation cavity to generate phase change evaporation, generated vapor enters the condensation cavity through the annular pipeline, the vapor is cooled and condensed into liquid, the liquid flows back to the liquid storage cavity along the annular pipeline, and the liquid in the liquid storage cavity flows back to the evaporation cavity, so that the complete heat exchange cycle of liquid-gas-liquid is completed.

The long-term practice of the inventor finds that the current loop heat pipe heat dissipation device mainly dissipates heat for a single heat source, and when the product close to multiple heat sources is faced, even if a larger evaporation cavity is arranged, the heat dissipation at the heat sources is affected due to uneven local heating, and the heat dissipation effect is poor. And correspondingly arranging a plurality of loop heat pipe radiating devices increases the cost.

In summary, how to effectively solve the problem of poor heat dissipation effect of the multi-heat source product is a problem that needs to be solved by those skilled in the art.

In order to improve the above problems, the present invention provides a loop heat pipe heat dissipation element, a device and an electronic apparatus. The invention is described below in connection with specific embodiments.

The embodiment of the invention discloses a loop heat pipe heat dissipation device which can solve the problem that the existing loop heat pipe heat dissipation device is poor in heat dissipation effect for multi-heat source products.

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Referring to fig. 1-3, fig. 1 is a schematic structural diagram of a heat dissipation device for loop heat pipes in an open state of a cover according to an embodiment of the present invention; fig. 2 is a schematic structural diagram of a loop heat pipe heat dissipating device with multiple liquid storage cavities according to an embodiment of the present invention; fig. 3 is a schematic structural diagram of a loop heat pipe heat dissipating device with evaporation chambers disposed on three sides of a liquid storage chamber according to an embodiment of the present invention.

In one embodiment, the present embodiment provides a loop heat pipe heat dissipation device for use with various heat dissipation devices as needed. Specifically, the loop heat pipe heat dissipation device comprises a condenser 3 and a loop heat pipe heat dissipation element, wherein the loop heat pipe heat dissipation element comprises an evaporation cavity 1 and a liquid storage cavity 2, namely the loop heat pipe heat dissipation device mainly comprises the evaporation cavity 1, the liquid storage cavity 2 and the condenser 3.

In the loop heat pipe heat dissipation device provided in this embodiment, the condenser 3 is provided with the condensation channel 4, and the loop heat pipe heat dissipation element includes the evaporation cavity 1 and the liquid storage cavity 2, that is, the loop heat pipe heat dissipation element is provided with the evaporation cavity 1 and the liquid storage cavity 2 respectively, and the condensation channel 4 is communicated with the liquid storage cavity 2 and the evaporation cavity 1 respectively. Specifically, the condensation channel 4 includes a first condensation channel and a second condensation channel that are communicated, the first condensation channel is communicated with the liquid storage cavity 2, and the second condensation channel is communicated with the evaporation cavity 1.

The liquid storage cavity 2 is connected with a plurality of evaporation cavities 1, namely the loop heat pipe radiating element is provided with a plurality of evaporation cavities 1, and the liquid storage cavities 2 are respectively connected with each evaporation cavity 1 through a gas-liquid separation wall 5. That is, the plurality of evaporation chambers 1 can all introduce liquid (i.e. liquid working medium) from the liquid storage chamber 2, the liquid enters the evaporation chambers 1, absorbs heat and evaporates to generate gas, the gas flows out from the gas outlet of the evaporation chambers 1 and then enters the condensation channel 4 of the condenser 3, and the heat is dissipated in the condenser 3, condensed and converted (i.e. condensed and liquefied) into liquid, and then flows back to the liquid storage chamber 2 to form circulation. It will be understood that, referring to fig. 1-3, the plurality of evaporation chambers 1 refers to two or more evaporation chambers 1, that is, the loop heat pipe heat dissipation device provided by the embodiment of the invention is at least provided with two evaporation chambers 1.

The gas-liquid separation wall 5 is located between the evaporation cavity 1 and the liquid storage cavity 2 to perform gas-liquid separation, so that liquid can enter the evaporation cavity 1 from the liquid storage cavity 2, and gas cannot flow into the liquid storage cavity 2 from the evaporation cavity 1, so that gas-liquid mixing is not easy to form in the liquid storage cavity 2, and liquid backflow capacity is not easy to influence. The main structure of the gas-liquid separation wall 5 is a capillary structure, which is transversely blocked in a channel between the evaporation cavity 1 and the liquid storage cavity 2, and can enable liquid to flow due to capillary suction.

The liquid storage cavity 2 can store (accommodate) liquid, i.e. the liquid can be led in from the condensation channel 4 of the condenser 3 for collection and storage, i.e. the liquid storage cavity 2 is configured to accommodate liquid working medium. The evaporation chamber 1 is generally of a layered structure, the heated side (or the heat absorbing side) has a layer of capillary structure, and the capillary structure of the evaporation chamber 1 introduces liquid from the liquid storage chamber 2 through the capillary structure of the gas-liquid separation wall 5. The other side of the evaporating cavity 1 is a cavity, so that the evaporated gas can flow conveniently, and then intensively flows out from the air outlet to enter the condensing channel 4 of the condenser 3. It will be appreciated that in other embodiments, the evaporation chamber 1 may be entirely filled with capillary structure, may be partially hollow, partially have capillary structure, or may be hollow without capillary structure.

The air outlets of the evaporation chambers 1 are respectively communicated with the inlets of the corresponding second condensation channels of the corresponding condensers 3, so that the heat dissipation of the evaporation chambers 1 through the second condensation channels of the condensers 3 is realized, namely, the loop heat pipe heat dissipation device provided by the embodiment of the invention is provided with a plurality of second condensation channels so as to respectively correspond to the air outlets of different evaporation chambers 1. Specifically, the condenser 3 is provided with a first condensation channel and a second condensation channel, at least two evaporation cavities 1 respectively dissipate heat through different second condensation channels 4, and the heat dissipation can be performed through different second condensation channels of the same condenser 3, or through different condensers 3, and then through the second condensation channels of different condensation channels 4, and specific corresponding selection can be performed as required.

While the first condensation channel outlet of the condensation channel 4 is in communication with the liquid storage chamber 2. It should be noted that, because of the loop arrangement, for the evaporating chamber 1 that obtains the liquid working medium (i.e., the liquid phase change working medium) from a certain liquid storage chamber 2, the second condensing channel that is in communication with the condensing channel 4 of the evaporating chamber 1 is at least in direct or indirect communication with the liquid storage chamber 2, thereby completing the cycle. In general, for a loop heat pipe radiator provided with only a single liquid storage chamber 2, then the outlet of each first condensation channel is connected to open the liquid storage chamber 2. If a plurality of liquid storage cavities 2 are provided, then the evaporating cavity 1 for obtaining the liquid working medium from a certain liquid storage cavity 2 needs to be led back to the liquid storage cavity 2 through the corresponding first condensation channel.

It should be noted that, the liquid storage cavity 2 is connected between the plurality of evaporation cavities 1, so that the plurality of evaporation cavities 1 can share the liquid in one liquid storage cavity 2, and the size and shape of the liquid storage cavity 2 can be correspondingly set according to actual needs without too much limitation. The different evaporation chambers 1 need to correspond to different heat sources or correspond to different parts of one heat source, so that the position relationship between the different evaporation chambers 1 is generally limited by the installation positions of the heat sources, and therefore, the distance between the liquid storage chambers 2 corresponding to the gas-liquid separation walls 5 of the different evaporation chambers 1 can be limited by the installation objects, if the two heat sources are far away, the required liquid storage chambers 2 can be relatively large, and if the liquid storage chambers 2 are too large or cannot control the volume, the scheme is uncomfortable. For a plurality of relatively close heat sources, for example, two heat sources of a GPU (graphics processor) and a CPU (graphics processor) on an electronic device have a stable positional relationship, then the size of the liquid storage chamber 2 may be in a relatively proper state; for example, a plurality of memory modules generally have a stable position relationship, and the distance between the memory modules is generally relatively close.

It can be appreciated that the loop heat pipe heat dissipation element provided in this embodiment includes:

a liquid storage cavity 2, wherein the liquid storage cavity 2 is configured to accommodate liquid working medium, and the liquid storage cavity 2 can be used for communicating with a condensation channel 4 of the condenser 3 so as to introduce the liquid working medium from the condensation channel 4;

the evaporation cavities 1, at least one liquid storage cavity 2 and a plurality of evaporation cavities 1 are connected through a gas-liquid separation wall 5 so as to introduce liquid working media from the liquid storage cavities 2, and the evaporation cavities 1 can also be used for being communicated with a condensation channel 4;

wherein: after the liquid working medium in the evaporation cavity 1 absorbs heat from a heat source and is vaporized into gas, the gas can flow into the condensation channel 4 for condensation;

further, the condensation channel 4 comprises a first condensation channel and a second condensation channel which are communicated, wherein the first condensation channel can be used for being communicated with the liquid storage cavity 2, the second condensation channel can be used for being communicated with the evaporation cavities 1, and at least two evaporation cavities 1 can be respectively communicated with different second condensation channels; at least one of the first condensation channel and the second condensation channel can be used for heat dissipation, and the second condensation channel can be used for heat dissipation in general, but the first condensation channel is not required to be used for heat dissipation in general.

So set up, evaporation chamber 1 can follow liquid storage chamber 2 leading-in liquid working medium, and after the heat transfer of heat source was to evaporation chamber 1, liquid working medium in the evaporation chamber 1 absorbed the heat, can take place phase transition evaporation, and liquid working medium evaporates and produces gas, and the gas that evaporates into gas after the liquid working medium absorbed the heat promptly, and the gas that produces gets into condensing channel 4, and gas can release heat, then the condensation liquefaction becomes liquid, and liquid flows back to liquid storage chamber 2 through condensing channel 4 again, can realize the heat transfer circulation.

In the above-mentioned loop heat pipe heat dissipation element, when being applied to a product with a plurality of heat sources at a proper distance, the plurality of evaporation chambers 1 around the liquid storage chamber 2 are in heat conduction contact with the corresponding heat sources, respectively, and the liquid storage chamber 2 is located between the plurality of evaporation chambers 1, i.e. between the plurality of heat sources, so as to supply liquid working medium to the plurality of evaporation chambers 1 at the same time. The evaporation cavity absorbs heat of a heat source, liquid in the evaporation cavity absorbs heat to evaporate, gas generated by evaporation enters the condensation channel 4 to be cooled to form liquid, and then the liquid flows back to the liquid storage cavity 2 to realize circulation. In the loop heat pipe radiating element, the plurality of evaporating cavities 1 can be arranged around the liquid storage cavity 2, so that the plurality of evaporating cavities 1 can share the liquid working medium in the same liquid storage cavity 2, and the liquid storage cavity can be automatically and better proportioned according to the heating time and the heating quantity of a plurality of heat sources, if one heat source radiates too much heat, more liquid can be led in from the liquid storage cavity 2 by the evaporating cavity 1 corresponding to the heat source, so that the radiating requirement of the plurality of heat sources can be met, and the radiating effect is improved. Meanwhile, as different evaporating cavities 1 are connected with different second condensing channels, the evaporating cavities 1 with different heating capacities can be effectively prevented from being affected by each other in pressure, and further, distinguishing heat dissipation is avoided, and the heat dissipation effect is better. In summary, the heat dissipation element of the loop heat pipe can effectively solve the problem that the heat dissipation effect of the conventional heat dissipation device of the loop heat pipe is poor for multi-heat source products.

It can be understood that the loop heat pipe heat dissipation device provided in this embodiment includes a condenser 3 and a loop heat pipe heat dissipation element as described in any one of the above, where the condenser 3 is provided with a condensation channel 4;

wherein:

the condensation channel 4 comprises a first condensation channel and a second condensation channel which are communicated, the first condensation channel is communicated with the liquid storage cavity 2 of the loop heat pipe radiating element, the second condensation channel is communicated with the evaporation cavity 1 of the loop heat pipe radiating element, and at least two evaporation cavities 1 are respectively communicated with different second condensation channels. The loop heat pipe radiating element has the technical effects, so the loop heat pipe radiating device with the loop heat pipe radiating element has the corresponding technical effects.

In some embodiments, the capillary structure in the evaporation cavity 1 and the gas-liquid separation wall 5 may be integrally sintered and formed, where the gas-liquid separation wall 5 is also generally a capillary structure, so as to facilitate manufacturing. And the capillary structure in the evaporation cavity 1 is arranged below the gas-liquid separation wall 5, so that the non-heated side of the evaporation cavity 1 has enough cavities to conveniently contain the gas generated by evaporation. The heated side of the evaporation chamber 1 may be laid flat with a capillary structure, or may be partially laid flat with the capillary structure. Specifically, it can be set as required.

In some embodiments, the evaporation cavity 1 and the liquid storage cavity 2 can be arranged according to the needs. Such as where the evaporation chamber 1 and the liquid storage chamber 2 are respectively located in the housing chambers of two independent housings, and a passage is provided between the two independent housings for accommodating the gas-liquid separation wall 5, wherein the passage may be a pipe, and the passage cross section may be square, circular, irregular, or the like.

In some embodiments, for convenience, the above structure is provided, and the tank member 6 and the cover member 7 covering the notch of the tank member 6 are further included, where the tank cavity of the tank member 6 is partitioned into the evaporation cavity 1 and the liquid storage cavity 2 by at least one sinter-molded gas-liquid separation wall 5. The specific arrangement mode can be as follows: the trough-shaped piece 6 can be separated into an evaporation cavity 1 and a liquid storage cavity 2 which are arranged left and right through a gas-liquid separation wall 5; the groove-shaped piece 6 can be separated into a left evaporation cavity 1, a middle liquid storage cavity 2 and a right evaporation cavity 1 through two gas-liquid separation walls 5 which are arranged in parallel left and right; the tank cavity of the tank-shaped piece 6 can be L-shaped, cross-shaped, T-shaped and the like, so that the liquid storage cavity 2 can be centrally arranged, and the gas-liquid separation walls 5 are arranged on the corresponding side surfaces of the liquid storage cavity 2, so that the end part positions form the evaporation cavity 1.

It should be noted that, where the cover 7 covers the notch of the groove-shaped member 6, the cover 7 may be made as a plate, cover the notch, or be embedded into the notch. The cover member 7 may be concave, and the cavity formed by the concave is correspondingly separated into the evaporation cavity 1 and the liquid storage cavity 2 by the gas-liquid separation wall 5.

In some embodiments, the evaporation chamber 1 and the liquid storage chamber 2 may be larger than the external air pressure in some application states and smaller than the external air pressure in some application states because the internal air pressure may be greatly different in different temperature stages. Specifically, the evaporation chamber 1 and the liquid storage chamber 2 can be provided with upright posts therein so as to be connected to the cover member 7 and supported in the tank chamber.

In some embodiments, as described above, at least two of the evaporation chambers 1 respectively dissipate heat through different second condensation channels of the condensation channels 4 of the condenser 3, that is, at least two of the evaporation chambers 1 respectively dissipate heat through different second condensation channels of the same condenser 3, and/or the second condensation channels of the condensation channels 4 corresponding to at least two of the evaporation chambers 1 respectively correspond to different condensers 3. In one embodiment, it is possible to have a different second condensation channel in which two evaporation chambers 1 communicate with the same condenser 3, while there is a different condenser 3 in which two evaporation chambers 1 communicate.

In some embodiments, the width of the liquid storage cavity 2 may be smaller than the width of the evaporation cavity 1 in the extending direction of the gas-liquid separation wall 5 of the loop heat pipe heat dissipation element, so that the liquid storage cavity 2 may be more elongated to be able to accommodate more modules with larger heat source intervals.

In some embodiments, a plurality of evaporation chambers 1 may be provided around the liquid storage chamber 2.

In some embodiments, a plurality of evaporation cavities 1 and a plurality of liquid storage cavities 2 may be arranged at intervals, and at this time, the evaporation cavities 1 located in the middle and the liquid storage cavities 2 on two sides may be connected through a gas-liquid separation wall 5. At this time, the two sides of each liquid storage cavity 2 are provided with evaporation cavities 1, the evaporation cavity 1 positioned in the middle is connected with the liquid storage cavities 2, and the evaporation cavity 1 positioned outside is provided with the liquid storage cavities 2 on only one side. Of course, the two sides of each evaporating cavity 1 are provided with liquid storage cavities 2, and only one side of the liquid storage cavity 2 positioned at the edge is connected with the evaporating cavity 1.

As shown in fig. 2, three evaporation chambers 1 and two liquid storage chambers 2 are arranged at intervals, of course, four, five, six or more evaporation chambers 1 may be arranged, and the number of the corresponding liquid storage chambers 2 may be one, one or the same as that of the evaporation chambers 1 and arranged at intervals.

The evaporation cavity 1 in the middle is communicated with the liquid storage cavities 2 on two sides through the gas-liquid separation wall 5. While the gas formed in relation to the evaporation chamber 1 in the middle: in one embodiment, the liquid can be split to flow into different condensation channels 4 respectively, and then be led into the liquid storage cavities 2 on two sides respectively through different first condensation channels; in another embodiment, the liquid can be liquefied into liquid through the second condensation channel and then is further separated into liquid storage cavities 2 on two sides; in yet another embodiment, the second condensation channels that are communicated with the evaporation chamber 1 in the middle part may be split in the middle part of the condensation path, that is, after the first stage of second condensation channels is first cooled, liquefaction is allowed, but at least not completely liquefied, and then split so as to flow into different first condensation channels respectively to flow into the liquid storage chambers 2 on two sides, specifically, as shown in fig. 2, the second condensation channels that are communicated with the evaporation chamber 1 in the middle part penetrate from one side of the heat dissipation body of the condenser 3, penetrate from the other side, then separate so as to flow into two different first condensation channels respectively, and the two first condensation channels penetrate through the heat dissipation body of the condenser 3 again, and then are respectively communicated into the liquid storage chambers 2 on two sides of the middle evaporation chamber 1.

In some embodiments, as shown in fig. 1, only two evaporation chambers 1 are provided, the middle parts of the two evaporation chambers 1 are provided with liquid storage chambers 2, one side of the two evaporation chambers 1 is provided with a condenser 3, the two evaporation chambers 1 are respectively communicated with a second condensation channel, and after the two second condensation channels pass through the main body of the condenser 3 in a reciprocating manner, the two second condensation channels flow into the liquid storage chambers 2 after converging at a position close to the liquid storage chambers 2. Of course, in other embodiments, the two second condensation channels may not merge, but flow to the same liquid storage chamber 2.

In some embodiments, when there are multiple evaporation chambers 1, there will be a distribution area of part of the evaporation chambers 1 that is smaller than the distribution area of other evaporation chambers 1 to accommodate smaller area heat sources. Specifically, at least one of the plurality of evaporation chambers 1 may be a first evaporation chamber, and the other may be a second evaporation chamber having a smaller distribution area than the first evaporation chamber, and the second condensation passage cooling path through which the first evaporation chamber communicates may be shorter than the second condensation passage cooling path through which the second evaporation chamber communicates.

As shown in fig. 3, a first evaporation chamber with a larger area is arranged on the left side and the right side of the liquid storage chamber 2, and a second evaporation chamber with a smaller area is arranged below the liquid storage chamber 2, wherein a second condensation channel communicated with the second evaporation chamber 1 penetrates into the condenser 3 main body from one side of the condenser 3 main body far away from the liquid storage chamber 2, and then penetrates out from one side close to the liquid storage chamber 2 so as to be communicated with the liquid storage chamber 2. And a second condensation channel, in which the first evaporation chamber 1 is communicated, penetrates into the condenser 3 main body from the side of the condenser 3 main body close to the liquid storage chamber 2, and penetrates into the condenser 3 main body again after penetrating out from the side far from the liquid storage chamber 2, and then penetrates out of the condenser 3 main body from the side close to the liquid storage chamber 2, whereby it can be seen that the cooling path of the condensation channel 4 communicating with the first evaporation chamber 1 is shorter than that of the condensation channel 4 of the second evaporation chamber 1.

Based on the loop heat pipe radiating element provided in the above embodiment and the loop heat pipe radiating device including the loop heat pipe radiating element provided in the above embodiment, the invention also provides an electronic device, which includes a plurality of heat sources, the electronic device further includes any one of the loop heat pipe radiating devices in the above embodiment, each evaporation cavity of the loop heat pipe radiating device is respectively abutted against each heat source, and a liquid storage cavity of the loop heat pipe radiating device is located between adjacent heat sources. The electronic device adopts the loop heat pipe heat dissipation device in the above embodiment, so the beneficial effects of the electronic device are as follows.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (11)

1. A loop heat pipe heat sink comprising:

a liquid storage cavity (2), wherein the liquid storage cavity (2) is configured to contain liquid working medium, and the liquid storage cavity (2) can be used for communicating with a condensation channel of a condenser so as to introduce the liquid working medium from the condensation channel;

the evaporation cavities (1) are connected with each other through gas-liquid separation walls (5) between at least one liquid storage cavity (2) and a plurality of evaporation cavities (1) so as to introduce the liquid working medium from the liquid storage cavities (2), and the evaporation cavities (1) can be also used for being communicated with the condensation channels;

wherein: when the liquid working medium in the evaporation cavity (1) absorbs heat from a heat source and is vaporized into gas, the gas can flow into the condensation channel for condensation.

2. The loop heat pipe radiating element according to claim 1, characterized in that the evaporating cavity (1) is internally provided with a capillary structure which is integrally sintered and molded with the gas-liquid separating wall (5).

3. Loop heat pipe heat sink element according to claim 2, characterized in that the capillary structure is arranged lower than the gas-liquid separation wall (5).

4. The loop heat pipe heat dissipation element according to claim 2, characterized by comprising a trough member (6) and a cover member (7) covering the trough opening of the trough member (6), wherein the trough cavity of the trough member (6) is divided into the evaporation cavity (1) and the liquid storage cavity (2) by at least one sinter-formed gas-liquid separation wall (5).

5. The loop heat pipe heat sink according to claim 4, wherein the evaporation chamber (1) and the liquid storage chamber (2) are each provided with a pillar.

6. A loop heat pipe heat sink, characterized by comprising a condenser (3) and a loop heat pipe heat sink element according to any one of claims 1-5, the condenser (3) being provided with a condensation channel (4);

wherein:

the condensation channels (4) comprise a first condensation channel and a second condensation channel which are communicated, the first condensation channel is communicated with the liquid storage cavity (2) of the loop heat pipe radiating element, the second condensation channel is communicated with the evaporation cavity (1) of the loop heat pipe radiating element, and at least two evaporation cavities (1) are respectively communicated with different second condensation channels.

7. The loop heat pipe heat sink according to claim 6, wherein the width of the liquid storage chamber (2) is smaller than the width of the evaporation chamber (1) in the extending direction of the gas-liquid separation wall (5) of the loop heat pipe heat sink.

8. Loop heat pipe heat sink according to any of claims 6-7, characterized in that a plurality of said evaporation chambers (1) are arranged around said reservoir chamber (2); or alternatively

The evaporation cavities (1) and the liquid storage cavities (2) are alternately arranged, and the evaporation cavities (1) in the middle are connected with the liquid storage cavities (2) on two sides through gas-liquid separation walls (5).

9. The heat pipe heat sink according to claim 8, wherein the second condensation channel communicating with the evaporation chamber (1) located at the middle part is split at the middle part of the condensation path to be respectively guided into the liquid storage chambers (2) at both sides.

10. The loop heat pipe heat sink according to any one of claims 6-7, wherein at least one of the plurality of evaporation chambers (1) is a first evaporation chamber, the other is a second evaporation chamber having a distribution area smaller than that of the first evaporation chamber, and the cooling path of the condensation channel (4) through which the first evaporation chamber communicates is shorter than the cooling path of the condensation channel (4) through which the second evaporation chamber communicates.

11. An electronic device comprising a plurality of heat sources, and further comprising a loop heat pipe heat dissipation device as claimed in any one of claims 6-10, wherein each evaporation chamber (1) of the loop heat pipe heat dissipation device is respectively abutted against each heat source, and a liquid storage chamber (2) of the loop heat pipe heat dissipation device is located between adjacent heat sources.