CN116504677A - Semiconductor high-speed rotary cleaning and spin-drying mechanism - Google Patents

Semiconductor high-speed rotary cleaning and spin-drying mechanism Download PDF

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Publication number
CN116504677A
CN116504677A CN202310500299.6A CN202310500299A CN116504677A CN 116504677 A CN116504677 A CN 116504677A CN 202310500299 A CN202310500299 A CN 202310500299A CN 116504677 A CN116504677 A CN 116504677A
Authority
CN
China
Prior art keywords
fixed
brace table
connecting axle
carousel
vertical axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310500299.6A
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Chinese (zh)
Inventor
陈宏�
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shengda Semiconductor Equipment Jiangsu Co ltd
Original Assignee
Shengda Semiconductor Equipment Jiangsu Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shengda Semiconductor Equipment Jiangsu Co ltd filed Critical Shengda Semiconductor Equipment Jiangsu Co ltd
Priority to CN202310500299.6A priority Critical patent/CN116504677A/en
Publication of CN116504677A publication Critical patent/CN116504677A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Abstract

The application discloses semiconductor high-speed rotatory washing mechanism that spin-dries, including the brace table, the brace table top is equipped with the carousel, brace table below lift is connected with the crane, the bottom surface of carousel is fixed with the vertical axis, the bottom of vertical axis runs through brace table and crane rotation and is connected, be equipped with drive vertical axis pivoted actuating mechanism on the crane, be equipped with the cylindricality cavity in the vertical axis, rotate in the cylindricality cavity and be connected with the connecting axle, be equipped with the runner in the connecting axle, the top of connecting axle runs through the carousel and extends to the carousel top, the top of connecting axle is fixed with the shower nozzle with runner top intercommunication, be fixed with the casing that surrounds the carousel on the brace table, the intercommunication has a plurality of tuber pipes on the casing. The mechanism realizes bottom water outlet through structural cooperation, so that the double-sided cleaning of the semiconductor can be realized at one time, the cleaning efficiency is improved, and the air pipe is arranged on the shell, so that the thrown-out impurities can be directly sucked and removed, secondary pollution damage to the semiconductor caused by impurity rebound is avoided, and the product quality and the cleaning and spin-drying effect are improved.

Description

Semiconductor high-speed rotary cleaning and spin-drying mechanism
Technical Field
The application relates to the field of semiconductor production, in particular to a semiconductor high-speed rotary cleaning and spin-drying mechanism.
Background
In the production process of the semiconductor, the surface of the semiconductor needs to be cleaned by utilizing cleaning liquid, the semiconductor is usually placed on a rotating disc, the rotating disc rotates through liquid spraying above, the cleaning liquid is thrown out after passing through the surface of the semiconductor, the cleaning and spin-drying are realized, and the reverse surface cleaning is performed after one surface is cleaned and spin-dried, so that the efficiency is low; in addition, in order to avoid splashing of the cleaning liquid, the shell is used for covering the rotating disc, but some impurities exist on the surface of the semiconductor, which are thrown out through rotation and then collide with the inner wall of the shell to rebound to the cleaned semiconductor, so that secondary pollution and damage of the semiconductor are easily caused, and the cleaning effect and the product quality are affected.
Disclosure of Invention
The invention aims to provide a semiconductor high-speed rotary cleaning and spin-drying mechanism, which overcomes the defects in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the embodiment of the application discloses semiconductor high-speed rotatory washing mechanism that spin-dries, including the brace table, the brace table top is equipped with the carousel, the brace table below is equipped with the crane, the crane passes through elevating gear and is connected with the brace table lift, the bottom surface center of carousel is fixed with the vertical axis, the bottom of vertical axis runs through the brace table and extends to the brace table below and the crane is rotated and is connected, be fixed with driving motor on the crane, driving motor's the fixed cover of output is equipped with first synchronizing wheel, fixed cover is equipped with the second synchronizing wheel on the vertical axis of brace table below, around being equipped with the hold-in range between first synchronizing wheel and the second synchronizing wheel, be equipped with the cylindricality cavity in the vertical axis, the cylindricality cavity runs through the upper and lower both ends of vertical axis, be equipped with the connecting axle in the cylindricality cavity, the fixed cover is equipped with a plurality of bearings on the connecting axle, the outer wall of bearing and the inner wall fixed connection of cylindricality cavity, the upper and lower both ends of runner run through the connecting axle, the top of connecting axle runs through to the carousel top of rotating disk to the top of connecting axle and the top of the shell and the top of the spout, the top of the spout is connected with the tuber pipe is fixed with the top and the shell and the top of the tuber pipe is fixed with the top of the shell, the top is connected with the tuber pipe and the top of the shell is surrounded with the top and is fixed.
Preferably, in the above-mentioned semiconductor high-speed rotation cleaning and spin-drying mechanism, the air pipes are four, and the four air pipes are arranged in a ring shape at equal intervals.
Preferably, in the above semiconductor high-speed rotation cleaning and spin-drying mechanism, a plurality of positioning blocks are fixed on the upper end surface of the turntable.
Preferably, in the above-mentioned semiconductor high-speed rotation washs mechanism that spin-dries, elevating gear includes the electric jar, erects rail, connecting plate and a pair of extension board, a pair of extension board symmetry sets up in the both sides of crane and with brace table fixed connection, terminal surface fixed connection that connecting plate and a pair of extension board are in opposite directions, erect the rail fixed setting between a pair of extension board, the crane is connected with erectting rail lift, the electric jar is vertical to be fixed on the connecting plate, the output and the crane fixed connection of electric jar, electric jar drive crane is along erectting rail and slide from top to bottom.
Preferably, in the above-mentioned semiconductor high-speed rotation cleaning and spin-drying mechanism, the vertical rails are provided with a pair, and the vertical rails are fixed on the connecting plate.
Preferably, in the above-mentioned semiconductor high-speed rotation cleaning and spin-drying mechanism, the cylindrical cavity, the connecting shaft and the vertical shaft are all coaxially arranged with the turntable.
Compared with the prior art, the invention has the advantages that:
the mechanism is characterized in that a hollow vertical shaft is arranged, a connecting shaft with a flow channel is rotationally connected to the vertical shaft, so that in the rotating process of the vertical shaft driving turntable, the connecting shaft is rotationally connected with the vertical shaft through a bearing, namely, the connecting shaft can not rotate, cleaning liquid is injected into the bottom of the flow channel through an external liquid supply mechanism and sprayed out from a spray head, the liquid is discharged from the lower side of a semiconductor, the liquid is matched with the liquid discharged from the top of the prior art, the front and the back of the semiconductor can be cleaned on both sides at one time, the cleaning efficiency is improved, an air pipe is arranged on a shell, the thrown impurity can be directly sucked and removed, secondary pollution damage to the semiconductor caused by impurity rebound is avoided, and the product quality and the cleaning and spin-drying effect are improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some of the embodiments described in the present application, and that no inventive effort is made to obtain other drawings from these drawings by a person of ordinary skill in the art.
FIG. 1 is a perspective view of a semiconductor spin-drying mechanism according to an embodiment of the present invention;
fig. 2 is a schematic diagram showing a cross-sectional front view of a semiconductor high-speed spin-drying mechanism according to an embodiment of the present invention.
Detailed Description
The following detailed description of the technical solutions according to the embodiments of the present invention will be given with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-2, the semiconductor high-speed rotary cleaning and spin-drying mechanism in this embodiment comprises a supporting table 1, a turntable 2 is arranged above the supporting table 1, a lifting frame 3 is arranged below the supporting table 1, the lifting frame 3 is in lifting connection with the supporting table 1 through a lifting device 4, a vertical shaft 5 is fixed at the center of the bottom surface of the turntable 2, the bottom end of the vertical shaft 5 penetrates through the supporting table 1 and extends to the lower part of the supporting table 1 to be in rotary connection with the lifting frame 3, a driving motor 6 is fixed on the lifting frame 3, a first synchronous wheel 7 is fixedly sleeved at the output end of the driving motor 6, a second synchronous wheel 18 is fixedly sleeved on the vertical shaft 5 below the supporting table 1, a synchronous belt 8 is wound between the first synchronous wheel 6 and the second synchronous wheel 18, a cylindrical cavity 9 is arranged in the vertical shaft 5, the upper and lower both ends of vertical axis 5 are run through to cylindricality cavity 9, be equipped with connecting axle 10 in the cylindricality cavity 9, fixed cover is equipped with a plurality of bearings 11 on the connecting axle 10, the outer wall of bearing 11 and the inner wall fixed connection of cylindricality cavity 9, be equipped with runner 12 in the connecting axle 10, runner 12 runs through the upper and lower both ends of connecting axle 10, carousel 2 extends to carousel 2 top is run through on the top of connecting axle 10, the top of connecting axle 10 is fixed with the shower nozzle 13 with runner 12 top intercommunication, be fixed with the casing 14 that surrounds carousel 2 on supporting bench 1, casing 14 is equipped with a plurality of tuber pipes 15 outward, the one end and the casing 14 intercommunication of tuber pipe 15, the one end and the induced draft mechanism (not shown in the figure) of tuber pipe 15 not with the casing 14 intercommunication are connected.
Further, the number of the air pipes 15 is four, and the four air pipes 15 are arranged in an annular equal space.
Further, a plurality of positioning blocks 16 are fixed on the upper end face of the turntable 2.
Further, the lifting device 4 comprises an electric cylinder 401, a vertical rail 402, a connecting plate 403 and a pair of support plates 404, the pair of support plates 404 are symmetrically arranged on two sides of the lifting frame 3 and fixedly connected with the supporting table 1, the connecting plate 403 is fixedly connected with opposite end faces of the pair of support plates 404, the vertical rail 402 is fixedly arranged between the pair of support plates 404, the lifting frame 3 is in lifting connection with the vertical rail 402, the electric cylinder 401 is vertically fixed on the connecting plate 403, the output end of the electric cylinder 401 is fixedly connected with the lifting frame 3, and the electric cylinder 403 drives the lifting frame 3 to slide up and down along the vertical rail 402.
Further, a pair of vertical rails 402 is provided, and the vertical rails 402 are fixed to the connection plate 403.
Further, the cylindrical cavity 9, the connecting shaft 10 and the vertical shaft 5 are all coaxially arranged with the turntable 2.
Further, the bottom end of the flow channel 12 is connected with a liquid supply mechanism 17.
In this technical scheme, induced draft mechanism and feed liquid mechanism are prior art, this mechanism is through setting up hollow vertical axle and be connected with the connecting axle that has the runner in the vertical axle internal rotation, with this is at the rotatory in-process of vertical axle drive carousel, the connecting axle is owing to pass through the bearing rotation with the vertical axle and be connected, the connecting axle can not rotate promptly, the runner bottom is through outside feed liquid mechanism injection washing liquid from shower nozzle blowout, realize the semiconductor below and go out liquid, it can once only carry out two-sided washing to go out the semiconductor positive and negative with the cooperation of prior art's top play liquid, improve cleaning efficiency, and set up the tuber pipe on the casing, can directly inhale the impurity that throws away, avoid impurity bounce to cause secondary pollution to damage to semiconductor, improve product quality and cleaning spin-drying effect.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
The foregoing is merely exemplary of the application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the application and are intended to be comprehended within the scope of the application.

Claims (6)

1. The utility model provides a semiconductor high-speed rotation washs spin-drying mechanism which characterized in that: including the brace table, the brace table top is equipped with the carousel, the brace table below is equipped with the crane, the crane passes through elevating gear and brace table lift and is connected, the bottom surface center of carousel is fixed with the vertical axis, the bottom of vertical axis runs through the brace table and extends to the brace table below and rotate with the crane and be connected, be fixed with driving motor on the crane, driving motor's the fixed cover in output is equipped with first synchronizing wheel, fixed cover is equipped with the second synchronizing wheel on the vertical axis of brace table below, around being equipped with the hold-in range between first synchronizing wheel and the second synchronizing wheel, be equipped with the cylindricality cavity in the vertical axis, the cylindricality cavity runs through the upper and lower both ends of vertical axis, be equipped with the connecting axle in the cylindricality cavity, fixed cover is equipped with a plurality of bearings on the connecting axle, the inner wall fixed connection of bearing and cylindricality cavity, be equipped with the runner in the connecting axle, the top of connecting axle runs through both ends about the connecting axle extends to the carousel top, the top of connecting axle is fixed with the hold-in range with the runner, the top of connecting axle is fixed with the runner and the top is equipped with the shower nozzle with the casing and the one end of the shower nozzle, the shower nozzle is connected with the tuber pipe.
2. The semiconductor high-speed spin-drying mechanism according to claim 1, wherein: the number of the air pipes is four, and the four air pipes are arranged in an annular mode at equal intervals.
3. The semiconductor high-speed spin-drying mechanism according to claim 1, wherein: the upper end face of the turntable is fixed with a plurality of positioning blocks.
4. The semiconductor high-speed spin-drying mechanism according to claim 1, wherein: the lifting device comprises an electric cylinder, a vertical rail, a connecting plate and a pair of support plates, wherein the support plates are symmetrically arranged on two sides of the lifting frame and fixedly connected with a supporting table, the connecting plate is fixedly connected with the opposite end faces of the pair of support plates, the vertical rail is fixedly arranged between the pair of support plates, the lifting frame is connected with the vertical rail in a lifting manner, the electric cylinder is vertically fixed on the connecting plate, the output end of the electric cylinder is fixedly connected with the lifting frame, and the electric cylinder drives the lifting frame to slide up and down along the vertical rail.
5. The semiconductor high-speed spin-drying mechanism according to claim 4, wherein: the vertical rails are provided with a pair, and are fixed on the connecting plate.
6. The semiconductor high-speed spin-drying mechanism according to claim 1, wherein: the cylindrical cavity, the connecting shaft and the vertical shaft are all coaxially arranged with the turntable.
CN202310500299.6A 2023-05-06 2023-05-06 Semiconductor high-speed rotary cleaning and spin-drying mechanism Pending CN116504677A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310500299.6A CN116504677A (en) 2023-05-06 2023-05-06 Semiconductor high-speed rotary cleaning and spin-drying mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310500299.6A CN116504677A (en) 2023-05-06 2023-05-06 Semiconductor high-speed rotary cleaning and spin-drying mechanism

Publications (1)

Publication Number Publication Date
CN116504677A true CN116504677A (en) 2023-07-28

Family

ID=87329988

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310500299.6A Pending CN116504677A (en) 2023-05-06 2023-05-06 Semiconductor high-speed rotary cleaning and spin-drying mechanism

Country Status (1)

Country Link
CN (1) CN116504677A (en)

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