CN116494402A - Wafer circular cutting method and system - Google Patents
Wafer circular cutting method and system Download PDFInfo
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- CN116494402A CN116494402A CN202310761289.8A CN202310761289A CN116494402A CN 116494402 A CN116494402 A CN 116494402A CN 202310761289 A CN202310761289 A CN 202310761289A CN 116494402 A CN116494402 A CN 116494402A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 221
- 238000000034 method Methods 0.000 title claims abstract description 46
- 230000003287 optical effect Effects 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000009466 transformation Effects 0.000 description 3
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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Abstract
The invention relates to the field of semiconductor device processing, and particularly discloses a wafer circular cutting method and a system, wherein the wafer circular cutting method comprises the following steps: s1, determining whether a wafer on a cutting table has a cutting channel or not through image recognition; s2, when no cutting channel is determined on the wafer, controlling the cutting device to start cutting from a cutting start point; s3, when determining that a cutting channel exists on the wafer, determining the stop position of the cutting channel through image recognition; s4, controlling the cutting device to continue cutting from the stop position of the cutting path. When the circular cutting machine is restarted to continue circular cutting, the method of the invention firstly determines whether the wafer has cutting channels, normally cuts when the wafer does not have cutting channels, finds the stop position of the cutting channels when the wafer has cutting channels and continues cutting from the stop position, thus effectively avoiding the problem of cutting again at the cut point positions, and being beneficial to improving the safety and the cutting quality of cutting.
Description
Technical Field
The invention relates to the field of semiconductor device processing, in particular to a wafer circular cutting method and a wafer circular cutting system.
Background
In the process of processing the tai drum wafer, the tai drum ring needs to be subjected to ring cutting and ring removal.
In the case of performing ring cutting of a tai drum ring using a ring cutting machine, the prior art generally employs interpolation to determine a cutting path. In the annular cutting process, abnormal emergency stop of equipment can occur, and the annular cutting operation of the annular cutting machine can be interrupted due to the alarm conditions of water pressure, air pressure and the like. At this time, the cutting data cannot be memorized due to interpolation, and the subsequent ring cutting machine must be restarted for ring cutting.
When re-circular cutting is performed, certain flash is generated on the edge of the cut channel for the cut part, and the safety of the blade is adversely affected; meanwhile, the situation that the front cutting channel and the rear cutting channel are not overlapped is likely to occur, so that the circular cutting quality is reduced.
Disclosure of Invention
The present invention is directed to a method and a system for ring cutting a wafer, which solve the above-mentioned problems in the prior art.
The aim of the invention is achieved by the following technical scheme:
the wafer circular cutting method comprises the following steps:
s1, determining whether a wafer on a cutting table has a cutting channel or not through image recognition;
s2, when no cutting channel is determined on the wafer, controlling the cutting device to start cutting from a cutting start point;
s3, when determining that a cutting channel exists on the wafer, determining the stop position of the cutting channel through image recognition;
s4, controlling the cutting device to continue cutting from the stop position of the cutting path.
Preferably, in the wafer circular cutting method, a light source that moves synchronously with the image acquisition device used for image recognition is arranged below the image acquisition device.
Preferably, in the wafer ring cutting method, in the step S1, a cutting point location is determined according to a result of the four-point alignment method, so that an optical axis of a lens of the image capturing device is moved to a predetermined point location among the cutting point locations to perform image capturing, and whether a cutting path exists is determined through image recognition.
Preferably, in the wafer circular cutting method, in the step S3, an optical axis of a lens of the image capturing device is moved to a set of capturing points to capture an image, and a stop position of the dicing street is determined through image recognition, where the set of capturing points is a plurality of predetermined dicing points.
Preferably, in the wafer ring cutting method, in S3, an acquisition point to which the optical axis of the lens of the image acquisition device moves every time is determined according to a bisection method.
The wafer circular cutting method comprises the following steps:
s10, manually input cutting information is obtained, wherein the cutting information is information of whether a wafer on a cutting table has a cutting channel or not;
s20, when the acquired cutting information is determined to be that no cutting channel exists on the wafer, controlling a cutting device to start cutting from a cutting start point;
s30, when the acquired cutting information is determined to be that the cutting channel exists on the wafer, determining the stop position of the cutting channel of the wafer on the cutting table through image recognition;
s40, controlling the cutting device to continue cutting from the stop position of the cutting path.
Preferably, in the wafer circular cutting method, a light source that moves synchronously with the image acquisition device used for image recognition is arranged below the image acquisition device.
Preferably, in the wafer circular cutting method, in S30, an optical axis of a lens of the image capturing device is moved to a set of capturing points to capture an image, and a stop position of the dicing street is determined through image recognition, where the set of capturing points is a plurality of predetermined dicing points.
Preferably, in the wafer ring cutting method, in S30, an acquisition point to which the optical axis of the lens of the image acquisition device moves every time is determined according to a bisection method.
A wafer ring cutting system comprising:
the dicing channel identification unit is used for determining whether the wafer on the dicing table has dicing channels or not according to dicing information input by a user or determining whether the wafer on the dicing table has dicing channels or not through image identification;
the normal cutting unit is used for controlling the cutting device to start cutting from a cutting start point when no cutting channel is determined on the wafer;
a stop position determining unit for determining a stop position of a dicing lane through image recognition when determining that the dicing lane is on the wafer;
and the continuous cutting unit is used for controlling the cutting device to continuously cut from the stop position of the cutting path.
The technical scheme of the invention has the advantages that:
when the circular cutting machine is restarted to continue circular cutting, whether a cutting channel exists on the wafer or not is firstly determined, when the cutting channel does not exist, normal cutting is performed, and when the cutting channel exists, the stopping position of the cutting channel is found and the cutting is continued from the stopping position, so that the problem of cutting again at the cut point position is effectively avoided, and the safety and the cutting quality of the cutting are improved.
The method provided by the invention adopts a dichotomy to identify the stop position of the cutting path, so that the identification efficiency can be effectively improved, and the cutting efficiency is further improved.
The invention can acquire the information of whether the wafer has the cutting path or not by adopting two modes of automatic identification and manual input, and has flexible application and convenient use.
Drawings
FIG. 1 is a schematic flow chart of a first embodiment of the method of the present invention;
FIG. 2 is a schematic diagram of a method of the present invention employing dichotomy to determine the stopping position of small semicircular scribe lines on a wafer, only a portion of the wafer being shown;
FIG. 3 is a schematic illustration of the method of the present invention employing dichotomy to determine the stopping position of a large semicircular scribe line on a wafer, only a portion of the wafer being shown;
FIG. 4 is a schematic view of the stopping position of the dicing street of the invention;
fig. 5 is a schematic flow chart of a second embodiment of the method of the present invention.
Detailed Description
The objects, advantages and features of the present invention are illustrated and explained by the following non-limiting description of preferred embodiments. These embodiments are only typical examples of the technical scheme of the invention, and all technical schemes formed by adopting equivalent substitution or equivalent transformation fall within the scope of the invention.
In the description of the embodiments, it should be noted that the positional or positional relationship indicated by the terms such as "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in the specific orientation, and thus are not to be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Example 1
The wafer ring cutting method disclosed by the invention is described below with reference to the accompanying drawings, and is based on the structure and method disclosed in the grant publication No. CN 114311346B. On the basis, a light source (not shown in the figure) which moves synchronously with the image acquisition device is arranged below the image acquisition device, the light source can be a known annular light source and is arranged coaxially with a lens of the image acquisition device, and the light source emits light to a wafer on a cutting table, so that an image of the top surface of the wafer 100 acquired by the image acquisition device is clearer and more recognizable, and the cutting lane 110 and the stop position 111 thereof can be determined more accurately through visual identification.
As shown in fig. 1, the wafer ring cutting method comprises the following steps:
s1, determining whether a wafer 100 on a cutting table has a cutting channel 110 or not through image recognition;
s2, when the fact that the cutting channel 110 is not formed on the wafer 100 is determined, controlling the cutting device to start cutting from a cutting start point;
s3, when the dicing street 110 is determined to be on the wafer 100, determining the stop position 111 of the dicing street 110 through image recognition;
s4, controlling the cutting device to continue cutting from the stop position 111 of the cutting path 110.
In the step S1, whether the wafer 100 is aligned is determined by a four-point alignment method, which may be a method disclosed in the prior patent with the grant publication number CN114311346B, CN 114628299B. The center coordinates and the radius of the wafer 100 on the cutting table can be determined by the four-point alignment method, the cutting point location can be determined by combining interpolation calculation, and the control device can control the cutting device to cut on the wafer 100 according to the cutting point location, so that the required circular cutting channel 110 can be obtained.
When the cutting path 110 is identified, the optical axis of the lens of the image acquisition device is moved to a predetermined point position among the cutting points to perform image acquisition, and whether the cutting path 110 exists is determined through image identification, and a specific technology for determining whether the cutting path exists on the image through image identification is a known technology and is not described herein. When an image is acquired, a light source below the image acquisition device is started.
The predetermined points may be, for example, a cutting start point and a predetermined number of cutting points downstream of the cutting start point, and the predetermined number may be, for example, 1 to 5, so that it is possible to quickly and accurately determine whether the dicing street 110 is present. Of course, the predetermined point may be other points, which are not limited herein.
In S3, the optical axis of the lens of the image capturing device is moved to a set of capturing points, which are a plurality of predetermined cutting points, to capture an image and determine the stop position 111 of the cutting track 110 through image recognition. When an image is acquired, a light source below the image acquisition device is started.
In one embodiment, the acquisition point to which the optical axis of the lens of the image acquisition device moves each time may be determined according to a dichotomy. Specifically, as shown in fig. 2 and fig. 3, the optical axis of the image acquisition device may be moved to a first acquisition point position P2 (the first acquisition point position P2 and the cutting start point position P1 are located at two ends of the same diameter) opposite to the cutting start point position P1 for image acquisition, then moved to a second acquisition point position P3 for image acquisition, then moved to a third acquisition point position P4 for image acquisition, and then moved to acquisition point positions such as a fourth acquisition point position P5 and a fifth acquisition point position P6 for image acquisition. The principle of the bipartite method is followed until the stop position 111 of the cutting track 110 is found on the image acquired at a certain acquisition point.
In another embodiment, the optical axis of the image capturing device may sequentially move from a cutting start point in the cutting points to a cutting end point (the cutting end point coincides with or is close to the cutting start point) in the cutting points. In determining whether the image acquired at each acquisition point has a satisfactory stop position 111, this can be accomplished using known image contrast methods.
As shown in fig. 4, the shape of the stop position 111 of the cutting track 110 is approximately triangular, so that an image of the stop position 111 in the middle area of the image can be used as a template image, then the image collected at each collection point is compared with the template image to determine the similarity of the images, and when the similarity of the image collected at a certain collection point and the template image reaches a preset value, it is determined that the stop position 111 meeting the requirement is found. At this time, when the image acquisition is acquired, the coordinates of the acquisition point where the optical axis of the lens is located are taken as the coordinates of the stop position 111.
In S4, the cutting parameters for continuing cutting may be determined according to the determined coordinates of the stop position of the cutting lane, and the cutting device may be controlled to continue cutting according to the corresponding cutting parameters.
Example 2
In the above embodiment, the automatic recognition mode is used to determine whether the dicing street 110 is located on the wafer 100, and this embodiment provides another wafer dicing method, in which the information about whether the dicing street 110 is located on the wafer 100 is manually input, and the information may be input through a control interface and/or input through voice to a control device of the dicing machine.
As shown in fig. 5, the wafer dicing method specifically includes the following steps:
s10, manually input cutting information is acquired, wherein the cutting information is information about whether a cutting channel 110 exists on a wafer 100 on a cutting table or not;
s20, when the acquired cutting information is determined to be that the cutting channel 110 is not formed on the wafer 100, controlling the cutting device to start cutting from a cutting start point;
s30, when the acquired cutting information is determined to be that the cutting channel 110 is arranged on the wafer 100, determining the stop position 111 of the cutting channel 110 of the wafer 100 on the cutting table through image recognition;
s40, controlling the cutting device to continue cutting from the stop position 111 of the cutting path 110.
In S30, the optical axis of the lens of the image capturing device is moved to a set of capturing points, which are a plurality of predetermined cutting points, to capture an image and determine the stop position 111 of the cutting track 110 through image recognition.
In an embodiment, the image capturing device may sequentially move from a cutting start point in the cutting points to a cutting end point in the cutting points, and the specific principle and process are the same as those described in the above embodiment 1, and are not described herein.
In another embodiment, the acquisition point to which the optical axis of the lens of the image acquisition device moves every time is determined according to the dichotomy, and the corresponding principle is the same as that of the embodiment 1 in which the dichotomy is used to control the movement of the image acquisition device, which is not described herein.
Example 3
The embodiment discloses a wafer ring cutting system, which comprises:
a dicing street recognition unit for determining whether the wafer 100 on the dicing table has dicing street 110 or whether the wafer 100 on the dicing table has dicing street 110 by image recognition according to dicing information input by a user;
a normal dicing unit for controlling the dicing apparatus to perform dicing from a dicing start point when it is determined that the dicing street 110 is not present on the wafer 100;
a stop position determining unit for determining a stop position 111 of the dicing street 110 by image recognition when determining that the dicing street 110 is present on the wafer 100;
and a continuous cutting unit for controlling the cutting device to continue cutting from the stop position 111 of the cutting path 110.
The invention has various embodiments, and all technical schemes formed by equivalent transformation or equivalent transformation fall within the protection scope of the invention.
Claims (10)
1. The wafer circular cutting method is characterized by comprising the following steps of:
s1, determining whether a wafer on a cutting table has a cutting channel or not through image recognition;
s2, when no cutting channel is determined on the wafer, controlling the cutting device to start cutting from a cutting start point;
s3, when determining that a cutting channel exists on the wafer, determining the stop position of the cutting channel through image recognition;
s4, controlling the cutting device to continue cutting from the stop position of the cutting path.
2. The method of claim 1, wherein a light source that moves synchronously with the image acquisition device used for image recognition is disposed below the image acquisition device.
3. The wafer dicing method according to claim 2, wherein: in the step S1, a cutting point location is determined according to the result of the four-point alignment method, so that the optical axis of the lens of the image acquisition device is moved to a predetermined point location among the cutting point locations for image acquisition, and whether a cutting path exists or not is determined through image recognition.
4. A method of ring cutting a wafer according to any one of claims 1-3, wherein: in the step S3, the optical axis of the lens of the image acquisition device is moved to a group of acquisition points to acquire an image, and the stop position of the cutting track is determined through image recognition, wherein the group of acquisition points are a plurality of predetermined cutting points.
5. The method for ring cutting a wafer according to claim 4, wherein: in the step S3, the acquisition point position to which the optical axis of the lens of the image acquisition device moves every time is determined according to a dichotomy.
6. The wafer circular cutting method is characterized by comprising the following steps of:
s10, manually input cutting information is obtained, wherein the cutting information is information of whether a wafer on a cutting table has a cutting channel or not;
s20, when the acquired cutting information is determined to be that no cutting channel exists on the wafer, controlling a cutting device to start cutting from a cutting start point;
s30, when the acquired cutting information is determined to be that the cutting channel exists on the wafer, determining the stop position of the cutting channel of the wafer on the cutting table through image recognition;
s40, controlling the cutting device to continue cutting from the stop position of the cutting path.
7. The method of claim 6, wherein a light source that moves synchronously with the image acquisition device is disposed below the image acquisition device used for image recognition.
8. The wafer dicing method according to claim 7, wherein: in S30, the optical axis of the lens of the image acquisition device is moved to a group of acquisition points, which are a plurality of predetermined cutting points, to acquire an image and determine the stop position of the cutting track through image recognition.
9. The wafer dicing method according to claim 7, wherein: in S30, an acquisition point position to which the optical axis of the lens of the image acquisition device moves every time is determined according to the dichotomy.
10. The wafer circular cutting system is characterized by comprising:
the dicing channel identification unit is used for determining whether the wafer on the dicing table has dicing channels or not according to dicing information input by a user or determining whether the wafer on the dicing table has dicing channels or not through image identification;
the normal cutting unit is used for controlling the cutting device to start cutting from a cutting start point when no cutting channel is determined on the wafer;
a stop position determining unit for determining a stop position of a dicing lane through image recognition when determining that the dicing lane is on the wafer;
and the continuous cutting unit is used for controlling the cutting device to continuously cut from the stop position of the cutting path.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310761289.8A CN116494402B (en) | 2023-06-27 | 2023-06-27 | Wafer circular cutting method and system |
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| CN202310761289.8A CN116494402B (en) | 2023-06-27 | 2023-06-27 | Wafer circular cutting method and system |
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| CN116494402B CN116494402B (en) | 2024-02-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116674101A (en) * | 2023-08-03 | 2023-09-01 | 江苏京创先进电子科技有限公司 | Wafer circular cutting method, system and equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116674101A (en) * | 2023-08-03 | 2023-09-01 | 江苏京创先进电子科技有限公司 | Wafer circular cutting method, system and equipment |
| CN116674101B (en) * | 2023-08-03 | 2023-11-03 | 江苏京创先进电子科技有限公司 | Wafer circular cutting method, system and equipment |
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