CN116490555A - 覆铜箔层叠板及印刷电路板 - Google Patents

覆铜箔层叠板及印刷电路板 Download PDF

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Publication number
CN116490555A
CN116490555A CN202180079958.2A CN202180079958A CN116490555A CN 116490555 A CN116490555 A CN 116490555A CN 202180079958 A CN202180079958 A CN 202180079958A CN 116490555 A CN116490555 A CN 116490555A
Authority
CN
China
Prior art keywords
mass
parts
resin composition
resin
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180079958.2A
Other languages
English (en)
Chinese (zh)
Inventor
山本克哉
长谷部惠一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of CN116490555A publication Critical patent/CN116490555A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202180079958.2A 2020-12-09 2021-11-30 覆铜箔层叠板及印刷电路板 Pending CN116490555A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020204372 2020-12-09
JP2020-204372 2020-12-09
PCT/JP2021/043776 WO2022124130A1 (ja) 2020-12-09 2021-11-30 銅箔張積層板及びプリント配線板

Publications (1)

Publication Number Publication Date
CN116490555A true CN116490555A (zh) 2023-07-25

Family

ID=81973922

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180079958.2A Pending CN116490555A (zh) 2020-12-09 2021-11-30 覆铜箔层叠板及印刷电路板

Country Status (5)

Country Link
JP (1) JPWO2022124130A1 (https=)
KR (1) KR20230115977A (https=)
CN (1) CN116490555A (https=)
TW (1) TW202235267A (https=)
WO (1) WO2022124130A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119592067A (zh) * 2023-09-01 2025-03-11 台光电子材料(昆山)股份有限公司 树脂组合物及其制品
CN119591808A (zh) * 2023-09-01 2025-03-11 台光电子材料(昆山)股份有限公司 树脂组合物及其制品

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150017449A1 (en) * 2012-03-29 2015-01-15 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, resin sheet, and metal foil-clad laminate
JP2018131519A (ja) * 2017-02-15 2018-08-23 三菱瓦斯化学株式会社 樹脂組成物、樹脂シート及びプリント配線板
WO2019021862A1 (ja) * 2017-07-27 2019-01-31 三井金属鉱業株式会社 樹脂組成物、配線板用絶縁層及び積層体
JP2019172803A (ja) * 2018-03-28 2019-10-10 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、プリント配線板、及び樹脂付銅箔の処理方法
JP2020169274A (ja) * 2019-04-03 2020-10-15 日立化成株式会社 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009173765A (ja) * 2008-01-24 2009-08-06 Asahi Kasei E-Materials Corp 難燃性エポキシ樹脂組成物
KR101865649B1 (ko) 2014-12-22 2018-07-04 주식회사 두산 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판
JP6705446B2 (ja) * 2015-04-30 2020-06-03 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP7117498B2 (ja) * 2018-06-26 2022-08-15 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、樹脂シート、樹脂付き金属箔、金属張積層板、及びプリント配線板
JP2020105352A (ja) * 2018-12-27 2020-07-09 日鉄ケミカル＆マテリアル株式会社 硬化性樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150017449A1 (en) * 2012-03-29 2015-01-15 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, resin sheet, and metal foil-clad laminate
JP2018131519A (ja) * 2017-02-15 2018-08-23 三菱瓦斯化学株式会社 樹脂組成物、樹脂シート及びプリント配線板
WO2019021862A1 (ja) * 2017-07-27 2019-01-31 三井金属鉱業株式会社 樹脂組成物、配線板用絶縁層及び積層体
JP2019172803A (ja) * 2018-03-28 2019-10-10 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、プリント配線板、及び樹脂付銅箔の処理方法
JP2020169274A (ja) * 2019-04-03 2020-10-15 日立化成株式会社 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ

Also Published As

Publication number Publication date
JPWO2022124130A1 (https=) 2022-06-16
WO2022124130A1 (ja) 2022-06-16
TW202235267A (zh) 2022-09-16
KR20230115977A (ko) 2023-08-03

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