CN116483764B - Hot plug method of chip test equipment, test equipment and storage medium - Google Patents
Hot plug method of chip test equipment, test equipment and storage medium Download PDFInfo
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- CN116483764B CN116483764B CN202310369824.5A CN202310369824A CN116483764B CN 116483764 B CN116483764 B CN 116483764B CN 202310369824 A CN202310369824 A CN 202310369824A CN 116483764 B CN116483764 B CN 116483764B
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- 239000002184 metal Substances 0.000 claims abstract description 21
- 238000012800 visualization Methods 0.000 claims description 50
- 238000004590 computer program Methods 0.000 claims description 8
- 239000002699 waste material Substances 0.000 abstract description 3
- 230000032683 aging Effects 0.000 description 19
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- 238000003780 insertion Methods 0.000 description 4
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
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Abstract
The embodiment of the invention provides a hot plug method of chip test equipment, test equipment and a storage medium, wherein the method comprises the steps of detecting level change of a first control contact point and/or a second control contact point under the condition that a box door of the test box is opened; and under the condition that the level change detection result of the first control contact point and/or the second control contact point accords with the level change condition, controlling the current of a coil wound on the electromagnet so as to magnetize the electromagnet and attract the metal block of the test board to fix the positions of the control board and the test board, wherein the level change detection result accords with the level change condition to represent that the test board is successfully inserted into the control board in a hot plug mode. In the technical scheme of the embodiment, the successful connection between the test board and the test board of the chip burn-in test equipment can be ensured, so that the problem of time waste of chip test work can be prevented.
Description
Technical Field
Embodiments of the present invention relate to the field of chip testing, but are not limited to, and in particular, to a method for hot plug of a chip testing device, a testing device, and a storage medium.
Background
Hot plug (Hot Swap) refers to the insertion or extraction of a module or a board card into or from a system without affecting the normal operation of the system under the condition of not shutting down the power supply of the system, thereby improving the reliability, the quick maintainability, the redundancy, the timely recovery capability to disasters and the like of the system.
The product based on flash memory can insert the ageing test board with electricity in ageing test process, extract, and need extract and insert and do not influence other normal ageing board work, but because ageing test's environment is sealed firing equipment, be provided with the test interface that corresponds with ageing test board in firing equipment's inside, when needs insert new ageing test board, need the test personnel open firing equipment's door, then insert ageing test board blindly to test interface, then can have interface contact failure or insert the problem that the position is not aimed at, but the test personnel also can not learn the connection condition, thereby lead to after the test time, test result has the error, and the time of wasting the chip test.
Disclosure of Invention
The embodiment of the invention provides a hot plug method of chip testing equipment, testing equipment and a storage medium, which can ensure successful connection of a testing board and a testing board of chip burn-in testing equipment, thereby preventing the problem of time waste of chip testing work.
In order to achieve the above object, the technical solution of the embodiment of the present invention is as follows:
in a first aspect, an embodiment of the present invention provides a method for hot plugging a chip test device, which is applied to a chip burn-in test device, where the chip burn-in test device includes a test box, a test box door disposed on a first side and a control board disposed on a second side, where the control board is disposed inside the test box, and the second side is disposed opposite to the first side, and the control board is used to control a test board to test a chip, and the control board includes a first control contact point, a second control contact point, and at least two electromagnets, and the test board includes a first test contact point, a second test contact point, and a metal block corresponding to the electromagnets, and the method includes:
under the condition that the test box door is opened, carrying out level change detection on the first control contact point and/or the second control contact point;
and under the condition that the level change detection result of the first control contact point and/or the second control contact point accords with the level change condition, controlling the current of a coil wound on the electromagnet so as to magnetize the electromagnet and attract the metal block of the test board to fix the positions of the control board and the test board, wherein the level change detection result accords with the level change condition to represent that the test board is successfully inserted into the control board in a hot plug mode.
In some optional embodiments, under the condition that the test box door is closed, acquiring a temperature setting instruction for adjusting the temperature of the chip burn-in test equipment, adjusting the temperature in the test box body according to the temperature setting instruction, and controlling the test board to test the chip through the control board.
In some alternative embodiments, the first control contact is connected to a pull-up resistor, the first control contact is connected to a controller on the control board, the second control contact is grounded, and the first test contact and the second test contact are electrically connected;
the detecting the level change of the first control contact point and/or the second control contact point includes:
detecting the level change of the first control contact point;
and controlling the current of a coil wound on the electromagnet to magnetize the electromagnet and attract the metal block of the test board so as to fix the positions of the control board and the test board under the condition that the level change detection result of the first control contact point and/or the second control contact point meets the level change condition, wherein the method comprises the following steps:
And under the condition that the level of the first control contact point is changed from a high level to a low level, controlling the current of a coil wound on the electromagnet to magnetize the electromagnet and attract the metal block of the test board so as to fix the positions of the control board and the test board.
In some alternative embodiments, after the testing board is controlled to test the chip by the pins of the control board, the method further includes:
receiving a test completion instruction;
and adjusting the current of a coil wound on the electromagnet according to the test completion instruction so as to eliminate the magnetic force of the electromagnet.
In some optional embodiments, the chip burn-in apparatus further includes a visualization module, where the visualization module is connected to the control board, and after the level change detection is performed on the first control contact point and/or the second control contact point when the test box door is opened, the method further includes:
detecting that the level of the first control contact point is a high level after a preset first time;
detecting a level of the first test contact and a level of the second test contact;
determining contact point information with contact problems according to the level of the first test contact point and the level of the second test contact point;
And generating display information according to the contact point information with the contact problem, and sending the display information to the visualization module so as to control the visualization module to display the contact point with the contact problem as a first control contact point and/or a second control contact point.
In some alternative embodiments, the determining contact point information that there is a contact problem according to the level of the first test contact point and the level of the second test contact point includes:
under the condition that the level of the first test contact point and the level of the second test contact point are both high levels, determining contact point information with a contact problem as the second test contact point;
the generating display information according to the contact point information with the contact problem, and sending the display information to the visualization module, so as to control the visualization module to display the contact point with the contact problem as a first control contact point and/or a second control contact point, including:
and generating first display information according to the contact point information with the contact problem, and sending the first display information to the visualization module so as to control the visualization module to display the contact point with the contact problem as a second control contact point.
In some alternative embodiments, the determining contact point information that there is a contact problem according to the level of the first test contact point and the level of the second test contact point includes:
under the condition that the level of the first test contact point and the level of the second test contact point are both low levels, determining contact point information with contact problems as the first test contact point;
the generating display information according to the contact point information with the contact problem, and sending the display information to the visualization module, so as to control the visualization module to display the contact point with the contact problem as a first control contact point and/or a second control contact point, including:
and generating second display information according to the contact point information with the contact problem, and sending the second display information to the visualization module so as to control the visualization module to display the contact point with the contact problem as a first control contact point.
In some alternative embodiments, the method further comprises;
receiving a test stopping instruction;
adjusting the current of a coil wound on the electromagnet according to the test completion instruction so as to eliminate the magnetic force of the electromagnet;
Unloading the drive of the test board;
and under the condition that the level of the first control contact point is changed from low level to high level, sending an instruction that the test board is pulled out to the visualization module so that the visualization module displays a first image, wherein the first image is used for indicating that the test board is pulled out to a user.
In a second aspect, an embodiment of the present invention further provides a chip burn-in apparatus, a memory, a processor, and a computer program stored in the memory and capable of running on the processor, where the processor implements the method for hot plug of the chip test apparatus according to the first aspect when executing the computer program.
In a third aspect, an embodiment of the present invention further provides a computer storage medium, where a computer program is stored, where the computer program is executed by a processor to implement the steps of the method for hot plug of a chip test device according to the first aspect.
The embodiment of the invention provides a hot plug method of chip testing equipment, testing equipment and a storage medium, wherein the chip aging testing equipment comprises a testing box body, a testing box door arranged on a first side surface of the testing box body and a control board arranged on a second side surface of the testing box body, wherein the control board is arranged in the testing box body, the second side surface is opposite to the first side surface, the control board is used for controlling the testing board to test a chip, the control board comprises a first control contact point, a second control contact point and at least two electromagnets, and the testing board comprises a first testing contact point, a second testing contact point and a metal block corresponding to the electromagnets; the hot plug method of the chip testing equipment applied to the chip burn-in testing equipment comprises the steps of detecting level change of a first control contact point and/or a second control contact point under the condition that a testing box door is opened; and under the condition that the first control contact point and/or the second control contact point meet the level change condition, controlling the current of a coil wound on the electromagnet to magnetize the electromagnet and attract the metal block of the test board so as to fix the positions of the control board and the test board, wherein the level change detection result meets the level change condition to indicate that the test board is successfully inserted into the control board in a hot plug mode. In the technical scheme of the embodiment, when the test board needs to be placed in the test box body, the test box door needs to be opened first, when the test box door is detected to be opened, the level change of the first control contact point and/or the second control contact point on the control board can be detected, the test board is moved towards the inside of the test box body, so that the first test contact point and the second test contact point are close to the first control contact point and the second control contact point, when the level change detection result of the first control contact point and/or the second control contact point is detected to be in accordance with the level change condition, the test board is proved to be successfully inserted into the control board in a hot-plug mode, then, the test board does not need to be moved at this moment, in order to better ensure that the first test contact point and the first control contact point and the second control contact point can be well contacted in a subsequent test process, the current of a coil wound on the electromagnet is controlled, so that the magnetizing capacity of the electromagnet can be improved, the position of the control board and the test board can be effectively sucked, the test board can be fixed, or the test board can be successfully connected with a chip in a test board in a plug-in a test process, the test board can be prevented from being influenced, and the test equipment can be prevented from being successfully connected with the test board, and the test chip can be prevented from being aged.
Drawings
FIG. 1 is a schematic diagram of a system platform architecture for performing a method for hot plug of a chip test device according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a device for burn-in testing a chip according to an embodiment of the present invention;
FIG. 3 is a flowchart of a method for hot plug of a chip test device according to an embodiment of the present invention;
FIG. 4 is a flowchart of a method for hot plug of a chip test device according to another embodiment of the present invention;
fig. 5 is a flowchart of a method for hot plugging of a chip test device according to another embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It should be noted that although functional block division is performed in a device diagram and a logic sequence is shown in a flowchart, in some cases, the steps shown or described may be performed in a different order than the block division in the device, or in the flowchart. The terms first, second and the like in the description, in the claims and in the above-described figures, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.
Hot plug (Hot Swap) refers to the insertion or extraction of a module or a board card into or from a system without affecting the normal operation of the system under the condition of not shutting down the power supply of the system, thereby improving the reliability, the quick maintainability, the redundancy, the timely recovery capability to disasters and the like of the system.
The product based on flash memory can insert the ageing test board with electricity in ageing test process, extract, and need extract and insert and do not influence other normal ageing board work, but because ageing test's environment is sealed firing equipment, be provided with the test interface that corresponds with ageing test board in firing equipment's inside, when needs insert new ageing test board, need the test personnel open firing equipment's door, then insert ageing test board blindly to test interface, then can have interface contact failure or insert the problem that the position is not aimed at, but the test personnel also can not learn the connection condition, thereby lead to after the test time, test result has the error, and the time of wasting the chip test.
In order to solve the above problems, the technical solution of the present embodiment provides a method for hot plugging a chip testing device, a testing device and a storage medium, where the chip burn-in testing device includes a testing box, a testing box door disposed on a first side and a control board disposed on a second side, the control board being disposed inside the testing box, the second side being disposed opposite to the first side, the control board being configured to control the testing board to test a chip, the control board including a first control contact point, a second control contact point and at least two electromagnets, the testing board including a first testing contact point, a second testing contact point and a metal block corresponding to the electromagnets; the hot plug method of the chip testing equipment applied to the chip burn-in testing equipment comprises the steps of detecting level change of a first control contact point and/or a second control contact point under the condition that a testing box door is opened; and under the condition that the first control contact point and/or the second control contact point meet the level change condition, controlling the current of a coil wound on the electromagnet to magnetize the electromagnet and attract the metal block of the test board so as to fix the positions of the control board and the test board, wherein the level change detection result meets the level change condition to indicate that the test board is successfully inserted into the control board in a hot plug mode. In the technical scheme of the embodiment, when the test board needs to be placed in the test box body, the test box door needs to be opened first, when the test box door is detected to be opened, the level change of the first control contact point and/or the second control contact point on the control board can be detected, the test board is moved towards the inside of the test box body, so that the first test contact point and the second test contact point are close to the first control contact point and the second control contact point, when the level change detection result of the first control contact point and/or the second control contact point is detected to be in accordance with the level change condition, the test board is proved to be successfully inserted into the control board in a hot-plug mode, then, the test board does not need to be moved at this moment, in order to better ensure that the first test contact point and the first control contact point and the second control contact point can be well contacted in a subsequent test process, the current of a coil wound on the electromagnet is controlled, so that the magnetizing capacity of the electromagnet can be improved, the position of the control board and the test board can be effectively sucked, the test board can be fixed, or the test board can be successfully connected with a chip in a test board in a plug-in a test process, the test board can be prevented from being influenced, and the test equipment can be prevented from being successfully connected with the test board, and the test chip can be prevented from being aged.
Embodiments of the present invention will be further described below with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a schematic diagram of a system platform architecture for performing a method for hot plug of a chip test device according to an embodiment of the present invention.
In the example of fig. 1, the system platform architecture 100 is provided with a processor 110 and a memory 120, wherein the processor 110 and the memory 120 may be connected by a bus or otherwise, in fig. 1 by way of example.
Memory 120, as a non-transitory computer-readable storage medium, may be used to store non-transitory software programs as well as non-transitory computer-executable programs. In addition, memory 120 may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid state storage device. In some embodiments, memory 120 optionally includes memory remotely located relative to processor 110, which may be connected to the adrenal functional tumor typing positioning apparatus via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
It will be appreciated by those skilled in the art that the system platform architecture 100 may be applied to a 5G communication network system, a mobile communication network system that is evolved later, and the like, and the present embodiment is not limited thereto.
Those skilled in the art will appreciate that the system platform architecture 100 shown in fig. 1 is not limiting of the embodiments of the invention, and may include more or fewer components than shown, or may combine certain components, or a different arrangement of components.
Fig. 2 is a schematic diagram of a chip burn-in apparatus according to an embodiment of the present invention, as shown in fig. 2. The chip burn-in apparatus includes a test case 200, a test case door 210 disposed on a first side of the test case 200, and a control board 220 disposed on a second side of the test case 200, the control board 220 disposed inside the test case 200, the second side disposed opposite to the first side, the control board 220 for controlling a test board 310 to test a chip, the control board 220 including a first control contact point S1, a second control contact point S2, and at least two electromagnets 221, the test board 310 including a first test contact point D1, a second test contact point D2, and a metal block 311 corresponding to the electromagnets 221.
The test box 200 is provided with a detection unit 240 for detecting the opening and closing of the test box door 210, the detection unit 240 is connected with the control board 220, and the control board 220 can detect the opening and closing signal of the test box door 210 according to the received signal representing the opening and closing of the test box door 210 sent by the detection unit 240. It should be noted that the detecting unit 240 may be an infrared sensor, or may be a switch unit, which is not particularly limited in this embodiment.
In some alternative embodiments, first control contact point S1 is connected to pull-up resistor 223, first control contact point S1 is connected to controller 222 on control board 220, second control contact point S2 is grounded, and first test contact point D1 and second test contact point D2 are electrically connected.
It should be noted that, in addition to the first control contact point S1 and the second control contact point S2, other control contact points may be set on the control board 220, and the number of control contact points is not limited.
It should be noted that, in addition to the first test contact point D1 and the second test contact point D2, other test contact points may be disposed on the test board 310, and the number of the test contact points is not limited.
It should be noted that, the test box 200 may prevent a plurality of test boards 310, and when more than two test boards 310 are placed, the data of the test boards 310 and the distance between the two test boards 310 are not limited, and may be set according to practical situations.
It should be noted that, a plurality of chips to be tested may be disposed on one test board 310, and the number of chips to be tested is not limited in this embodiment.
In some alternative embodiments, the control board 220 includes a first control contact point S1, a second control contact point S2, and a third control contact point, the test board 310 includes a first test contact point D1, a second test contact point D2, and a third test contact point, then the first control contact point S1 is connected to the pull-up resistor 223, the first control contact point S1 is connected to the controller 222 on the control board 220, the second control contact point S2 is grounded, the third control contact point is grounded, and the first test contact point D1, the second test contact point D2, and the third test contact point are electrically connected.
In some alternative embodiments, control board 220 includes a first control contact point S1, a second control contact point S2, a third control contact point and a fourth control contact point, test board 310 includes a first test contact point D1, a second test contact point D2, a third test contact point and a fourth test contact point, then first control contact point S1 is connected to pull-up resistor 223, first control contact point S1 is connected to controller 222 on control board 220, second control contact point S2 is grounded, third control contact point is connected to pull-up resistor 223, third control contact point is connected to controller 222 on control board 220, fourth control contact point is grounded, first test contact point D1 and second test contact point D2 are electrically connected, and third test contact point and fourth test contact point are electrically connected.
In some alternative embodiments, the chip burn-in test device further includes a visualization module 230, where the visualization module 230 is connected to the control board 220, and the visualization module 230 may include a screen disposed outside the test box 200 and control buttons disposed beside the screen, or may include a tablet device disposed outside the test box 200, where the visualization module 230 may have a function of outputting images and inputting instructions, and may also have a function of outputting sound, and the structure of the visualization module is not limited specifically and may be set according to actual requirements.
Based on the system platform architecture and the chip burn-in equipment, wherein the system platform architecture can be a controller arranged in the chip burn-in equipment, various embodiments of the method for hot plug of the chip test equipment of the invention are presented below for solving the problems in the embodiments.
As shown in fig. 3, fig. 3 is a flowchart of a method for hot-plugging a chip testing device according to an embodiment of the present invention, where the method for hot-plugging a chip testing device according to an embodiment of the present invention is applied to a chip burn-in testing device, the chip burn-in testing device includes a testing box, a testing box door disposed on a first side and a control board disposed on a second side, the control board being disposed inside the testing box, the second side being opposite to the first side, the control board being configured to control the testing board to test a chip, the control board including a first control contact point, a second control contact point and at least two electromagnets, the testing board including a first testing contact point, a second testing contact point and a metal block corresponding to the electromagnets. The method for hot plug of the chip test device may include, but is not limited to, including step S100 and step S200.
Step S100, in the case that the test box door is opened, level change detection is performed on the first control contact point and/or the second control contact point.
Specifically, when the test board needs to be placed in the test box or taken out from the test box, the test box door needs to be opened first, after the opening of the test box door is detected, the level change of the first control contact point and/or the second control contact point on the control board is detected, whether the contact point between the test board and the control board is in good contact is judged according to the detection result, or whether the test board is inserted into or pulled out is judged according to the detection result.
In some alternative embodiments, when the test board needs to be placed in the test box, the test box door needs to be opened first, when the test box door is detected to be opened, the level change of the first control contact point and/or the second control contact point on the control board can be detected, the test board is moved to the inside of the test box body, so that the first test contact point and the second test contact point are close to the first control contact point and the second control contact point, when the first test contact point contacts the first control contact point, the level of the first control contact point changes, or when the second test contact point contacts the second control contact point, the level of the second control contact point changes.
In some alternative embodiments, when the test is finished, the test board needs to be taken out from the test box, the test box door needs to be opened first, when the test box door is detected to be opened, the level change of the first control contact point and/or the second control contact point on the control board can be detected, the test board can be moved to the outside of the test box, so that the first test contact point, the second test contact point are separated from the first control contact point and the second control contact point, when the first test contact point is separated from the first control contact point, the level of the first control contact point changes, or when the second test contact point is separated from the second control contact point, the level of the second control contact point changes.
And step 200, controlling the current of a coil wound on the electromagnet to magnetize the electromagnet and attract the metal block of the test board so as to fix the positions of the control board and the test board under the condition that the level change detection result of the first control contact point and/or the second control contact point accords with the level change condition, wherein the level change detection result accords with the level change condition to indicate that the test board is successfully inserted into the control board in a hot plug mode.
Specifically, when the level change detection result of the first control contact point and/or the second control contact point accords with the level change condition, and the test board is proved to be successfully inserted into the control board in a hot plug mode, then, the test board is not required to be moved at the moment, in order to better ensure that the first test contact point and the first control contact point, the second control contact point and the second test contact point can be well contacted in a subsequent test process, the current of a coil wound on the electromagnet is controlled, so that the magnetizing capability of the electromagnet is improved, the electromagnet can effectively absorb a metal block of the test board, the positions of the control board and the test board are fixed, the influence of other test boards on the test board in the test process or in the plug-in process can be prevented, the successful connection of the test board and the test board of the chip aging test equipment can be ensured, and the problem of time waste of chip test work can be prevented.
In some alternative embodiments, the method of hot plug of the chip testing device is applied to the chip burn-in testing device, the chip burn-in testing device comprises a testing box body, a testing box door arranged on a first side face of the testing box body and a control board arranged on a second side face of the testing box body, the control board is arranged in the testing box body, the second side face is opposite to the first side face, the control board is used for controlling the testing board to test the chip, the control board comprises a first control contact point, a second control contact point and at least two electromagnets, and the testing board comprises a first testing contact point, a second testing contact point and a metal block corresponding to the electromagnets. When the test board is required to be placed in the test box body, the test box door is required to be opened firstly, when the test box door is detected to be opened, the level change of the first control contact point and/or the second control contact point on the control board can be detected, the test board is moved to the inside of the test box body so that the first test contact point and the second test contact point are close to the first control contact point and the second control contact point, when the level change detection result of the first control contact point and/or the second control contact point is detected to meet the level change condition, the test board is proved to be successfully inserted into the control board in a hot-plug mode, then, the test board is not required to be moved, and in order to better ensure that the first test contact point and the first control contact point and the second test contact point can be well contacted in the subsequent test process, the current of winding coil on the control electro-magnet to improve the magnetization ability of electro-magnet, make the electro-magnet can effectively hold the metal piece of test board, with the position of fixed control panel and test board, can prevent in the test process, perhaps at the influence of plug other test boards to this test board, can ensure the test board and the test board of chip aging test equipment's successful connection, after guaranteeing test board and control panel effective connection, close the test chamber door, then acquire the temperature setting instruction that is used for adjusting chip aging test equipment temperature, adjust the temperature in the test box according to temperature setting instruction, and test the chip through control panel control test board, can prevent the extravagant problem of chip test work's time. After receiving the test completion instruction, the test board is proved to have completed the test task, and the test board can be pulled out of the control board, and then the control board can adjust the current of the coil wound on the electromagnet according to the test completion instruction so as to eliminate the magnetic force of the electromagnet, so that the test board is not influenced by the magnetic force, and a tester can easily and quickly pull out the test board from the control board.
As shown in fig. 4, fig. 4 is a flowchart of a method for hot-plugging a chip test device according to another embodiment of the present invention, where the method for hot-plugging a chip test device according to the embodiment of the present invention is applied to a chip burn-in test device, and on the basis of the chip burn-in test device applied in the embodiment of fig. 3, a first control contact point is connected to a pull-up resistor, the first control contact point is connected to a controller on a control board, a second control contact point is grounded, and the first test contact point and the second test contact point are electrically connected. The method of hot plug of the chip test apparatus may include, but is not limited to, including step S410 and step S420.
In step S410, level change detection is performed on the first control contact point.
Specifically, in the case that the control board is not connected to the test board, the first control contact point is at a high level, the second test contact point is electrically grounded, the level of the second test contact point is always at a low level, and there is no connection between the first control contact point and the second test contact point, then when the control board can be determined to be in good contact with the contact point of the test board by the level change of the first control contact point, the level change detection is performed on the first control contact point to determine whether the level of the first control contact point is at a low level to be at a high level or at a high level to be at a low level when the test box door is opened.
In step S420, in the case that the level of the first control contact point is changed from the high level to the low level, the current of the coil wound on the electromagnet is controlled to magnetize the electromagnet and attract the metal block of the test board, so as to fix the positions of the control board and the test board.
Specifically, in the case that the level of the first control contact point is changed from the high level to the low level, it is indicated that the first control contact point is connected to the second control contact point through a path between the first test contact point and the second test contact point, so as to be influenced by the electrical grounding of the second test contact point, and the first control contact point is changed from the high level to the low level, that is, the first control contact point is in good contact with the first test contact point, and the second control contact point is in good contact with the second test contact point; then at this point in time,
under the condition that the level of the first control contact point is changed from high level to low level, before the test is finished, the test board does not need to be moved, in order to better ensure that the first test contact point and the first control contact point, and the second control contact point and the second test contact point can be well contacted in the subsequent test process, the current of a coil wound on the electromagnet is controlled so as to improve the magnetizing capacity of the electromagnet, so that the electromagnet can effectively absorb a metal block of the test board, the positions of the control board and the test board are fixed, the test board can be prevented from being influenced in the test process, or other test boards are plugged and pulled, and the test board of the chip aging test equipment can be ensured to be successfully connected.
It will be appreciated that in the case where the level of the first control contact point is low, the first control contact point is well contacted with the first test contact point, and the second control contact point is well contacted with the second test contact point, and the test board is horizontally inserted. When the level of the first control contact point is high, the test board is proved to be inserted in a non-horizontal manner, the first control contact point is not well contacted with the first test contact point, and the second control contact point is not well contacted with the second test contact point, or the test board is proved to be pulled out from the control board.
As shown in fig. 5, fig. 5 is a flowchart of a method for hot plug of a chip test device according to another embodiment of the present invention, where the method for hot plug of a chip test device according to the embodiment of the present invention is applied to a chip burn-in test device, and further includes a visualization module connected to a control board on the basis of the chip burn-in test device applied in the embodiment of fig. 4. The method of hot plug of the chip test apparatus may include, but is not limited to, including step S510, step S520, step S530, and step S540.
In step S510, after a preset first time, the level of the first control contact point is detected to be a high level.
Specifically, for the case that the level at the first control contact point is high and the level at the second control contact point is low, the opening of the test box door is detected, which indicates that a tester needs to insert a new test board onto the control board for testing, and if the level at the first control contact point is still high after the preset first time, the problem of poor contact between the test board and the control board is indicated.
In step S520, the level of the first test contact point and the level of the second test contact point are detected.
Specifically, after a preset first time elapses, the level of the first control contact point is detected to be still at a high level, which indicates that the test board and the control board have a problem of poor contact, and the level of the first test contact point and the level of the second test contact point need to be detected.
In step S530, contact point information having a contact problem is determined according to the level of the first test contact point and the level of the second test contact point.
Specifically, after the level of the first test contact point and the level of the second test contact point are detected, contact point information having a contact problem is determined according to the level of the first test contact point and the level of the second test contact point, for example: if the level of the first test contact point and the level of the second test contact point are high, the first test contact point is well contacted with the first control contact point, and the second test contact point is not contacted with the second control contact point or is not well contacted with the second control contact point; also for example: if the level of the first test contact point and the level of the second test contact point are low, the first test contact point is proved to be not contacted with the first control contact point or not contacted well, and the second test contact point is proved to be contacted well with the second control contact point; also for example: if the level of the first test contact point is high and the level of the second test contact point is low, the first test contact point is well contacted with the first control contact point, the second test contact point is well contacted with the second control contact point, and a circuit breaking condition exists between the first test contact point and the second test contact point.
Step S540, display information is generated according to the contact point information with the contact problem, and the display information is sent to the visualization module, so that the visualization module is controlled to display the contact point with the contact problem as the first control contact point and/or the second control contact point.
Specifically, display information is generated according to contact point information with a contact problem, the display information is used for indicating content displayed by the visualization module, and then the display information is sent to the visualization module so as to control the visualization module to display that the contact point with the contact problem is a first control contact point and/or a second control contact point, so that a tester can be effectively informed of the problem existing in the current insertion, the direction of the offset of the test board is changed, the tester can quickly adjust the gesture of the insertion, or the tester can quickly check whether other problems exist in the contact point on the test board.
In some alternative embodiments, in the case that the level of the first test contact point and the level of the second test contact point are both high, determining contact point information having a contact problem as the second test contact point; and generating first display information according to the contact point information with the contact problem, and sending the first display information to the visualization module so as to control the visualization module to display the contact point with the contact problem as a second control contact point. For example: after the visualization module receives the first display information, displaying image content corresponding to the first display information on a screen, wherein the image content can comprise all pins of a control board and a test board, and marking a second control contact point and a second test contact point which are in poor contact with different colors; for example, after the visualization module receives the first display information, image content corresponding to the first display information may be displayed on a screen, where the image content may include all pins of the control board and the test board, and a sign of disconnection is marked on a path between the second control contact point and the second test contact point, where the contact is bad, for example, a path mark X, and the path is changed from a solid line to a dotted line.
In some alternative implementations, under the condition that the level of the first test contact point and the level of the second test contact point are both low, determining that the contact point information with the contact problem is the first test contact point, generating second display information according to the contact point information with the contact problem, and sending the second display information to the visualization module so as to control the visualization module to display the contact point with the contact problem as the first control contact point. For example: after the visualization module receives the second display information, displaying image content corresponding to the second display information on a screen, wherein the image content can comprise all pins of a control board and a test board, and marking a first control contact point and a first test contact point with poor contact by different colors; for example, after the visualization module receives the second display information, image content corresponding to the second display information can be displayed on a screen, wherein the image content can comprise all pins of the control board and the test board, and marks a symbol of disconnection on a path connecting line between a first control contact point and a first test contact point which are bad in contact, for example, marks O on two ends of the path, and for example, the path is changed from a solid line to a broken line and marks X in the middle of the broken line; for another example, after the visualization module receives the second display information, image content corresponding to the second display information may be displayed on the screen, where the image content may include the text information "the first control contact point is not in good contact".
In some alternative embodiments, when the tester needs to stop testing or other problems occur in the test board, the tester can actively input a stop testing instruction, and after the chip burn-in test device receives the stop testing instruction, the current of a coil wound on the electromagnet is adjusted according to the test completion instruction so as to eliminate the magnetic force of the electromagnet and unload the drive of the test board, and then, when the level of the first control contact point is detected to be changed from low level to high level, an instruction that the test board has been pulled out is sent to the visualization module so that the visualization module displays a first image, and the first image is used for indicating that the test board has been pulled out to a user.
In addition, one embodiment of the present invention provides an electronic device including: memory, a processor, and a computer program stored on the memory and executable on the processor.
The processor and the memory may be connected by a bus or other means.
It should be noted that, the computer in this embodiment may be correspondingly configured to include the memory and the processor in the embodiment shown in fig. 1, and may form a part of the system architecture platform in the embodiment shown in fig. 1, where the two are the same inventive concept, so that the two have the same implementation principle and beneficial effects, which are not described in detail herein.
The non-transitory software program and instructions required to implement the method of hot-plugging a chip test device of the above embodiments are stored in the memory, and when executed by the processor, the method of hot-plugging a chip test device of the above embodiments is performed, for example, the method steps S100 to S200 in fig. 3, the method steps S410 to S420 in fig. 4, and the method steps S510 to S540 in fig. 5 described above are performed.
Furthermore, an embodiment of the present invention provides a computer-readable storage medium storing computer-executable instructions for performing a method of hot plug of a chip test device of the controller described above, for example, performing the above-described method steps S100 to S200 in fig. 3, the method steps S410 to S420 in fig. 4, and the method steps S510 to S540 in fig. 5.
Those of ordinary skill in the art will appreciate that all or some of the steps, systems, and methods disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes both volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as known to those skilled in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Furthermore, as is well known to those of ordinary skill in the art, communication media typically include computer readable instructions, data structures, program modules, or other data in a modulated data signal, such as a carrier wave or other transport mechanism, and may include any information delivery media.
While the preferred embodiment of the present invention has been described in detail, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit and scope of the present invention, and these equivalent modifications or substitutions are included in the scope of the present invention as defined in the appended claims.
Claims (8)
1. The utility model provides a chip test equipment hot plug's method, its characterized in that is applied to chip burn-in test equipment, chip burn-in test equipment includes the test box, the test box sets up the test chamber door of first side and the control panel of setting on the second side, the control panel sets up the inside of test box, the second side sets up for first side, the control panel is used for controlling the test panel and tests the chip, the control panel includes first control contact point, second control contact point and at least two electro-magnet, the test panel includes first test contact point, second test contact point and the metal piece that corresponds with the electro-magnet, the method includes:
under the condition that the test box door is opened, carrying out level change detection on the first control contact point and/or the second control contact point;
Controlling the current of a coil wound on the electromagnet under the condition that the level change detection result of the first control contact point and/or the second control contact point accords with the level change condition so as to magnetize the electromagnet and attract the metal block of the test board to fix the positions of the control board and the test board, wherein the level change detection result accords with the level change condition to represent that the test board is successfully inserted into the control board in a hot plug mode;
under the condition that the test box door is closed, acquiring a temperature setting instruction for adjusting the temperature of the chip burn-in test equipment, adjusting the temperature in the test box body according to the temperature setting instruction, and controlling the test board to test the chip through the control board;
the first control contact point is connected with the pull-up resistor, the first control contact point is connected with a controller on the control board, the second control contact point is grounded, and the first test contact point and the second test contact point are electrically connected;
the detecting the level change of the first control contact point and/or the second control contact point includes:
Detecting the level change of the first control contact point;
and controlling the current of a coil wound on the electromagnet to magnetize the electromagnet and attract the metal block of the test board so as to fix the positions of the control board and the test board under the condition that the level change detection result of the first control contact point and/or the second control contact point meets the level change condition, wherein the method comprises the following steps:
and under the condition that the level of the first control contact point is changed from a high level to a low level, controlling the current of a coil wound on the electromagnet to magnetize the electromagnet and attract the metal block of the test board so as to fix the positions of the control board and the test board.
2. The method of claim 1, wherein after the chip is tested by the test board controlled by pins of the control board, the method further comprises:
receiving a test completion instruction;
and adjusting the current of a coil wound on the electromagnet according to the test completion instruction so as to eliminate the magnetic force of the electromagnet.
3. The method of claim 1, wherein the chip burn-in apparatus further comprises a visualization module, the visualization module being connected to the control board, and wherein after the level change detection of the first control contact point and/or the second control contact point is performed with the test box door open, the method further comprises:
Detecting that the level of the first control contact point is a high level after a preset first time;
detecting a level of the first test contact and a level of the second test contact;
determining contact point information with contact problems according to the level of the first test contact point and the level of the second test contact point;
and generating display information according to the contact point information with the contact problem, and sending the display information to the visualization module so as to control the visualization module to display the contact point with the contact problem as a first control contact point and/or a second control contact point.
4. A method according to claim 3, wherein said determining contact point information for which there is a contact problem based on the level of the first test contact point and the level of the second test contact point comprises:
under the condition that the level of the first test contact point and the level of the second test contact point are both high levels, determining contact point information with a contact problem as the second test contact point;
the generating display information according to the contact point information with the contact problem, and sending the display information to the visualization module, so as to control the visualization module to display the contact point with the contact problem as a first control contact point and/or a second control contact point, including:
And generating first display information according to the contact point information with the contact problem, and sending the first display information to the visualization module so as to control the visualization module to display the contact point with the contact problem as a second control contact point.
5. A method according to claim 3, wherein said determining contact point information for which there is a contact problem based on the level of the first test contact point and the level of the second test contact point comprises:
under the condition that the level of the first test contact point and the level of the second test contact point are both low levels, determining contact point information with contact problems as the first test contact point;
the generating display information according to the contact point information with the contact problem, and sending the display information to the visualization module, so as to control the visualization module to display the contact point with the contact problem as a first control contact point and/or a second control contact point, including:
and generating second display information according to the contact point information with the contact problem, and sending the second display information to the visualization module so as to control the visualization module to display the contact point with the contact problem as a first control contact point.
6. A method according to claim 3, wherein the method further comprises;
receiving a test stopping instruction;
adjusting the current of a coil wound on the electromagnet according to the test completion instruction so as to eliminate the magnetic force of the electromagnet;
unloading the drive of the test board;
and under the condition that the level of the first control contact point is changed from low level to high level, sending an instruction that the test board is pulled out to the visualization module so that the visualization module displays a first image, wherein the first image is used for indicating that the test board is pulled out to a user.
7. A chip burn-in apparatus, characterized by a memory, a processor and a computer program stored on the memory and executable on the processor, said processor implementing a method of hot plug of a chip test apparatus according to any one of claims 1 to 6 when said computer program is executed.
8. A computer storage medium having stored thereon a computer program, which when executed by a processor performs the steps of the method of hot plug of a chip test device according to any of claims 1 to 6.
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