CN116482851A - Hot spot positioning auxiliary device and method - Google Patents

Hot spot positioning auxiliary device and method Download PDF

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Publication number
CN116482851A
CN116482851A CN202310443831.5A CN202310443831A CN116482851A CN 116482851 A CN116482851 A CN 116482851A CN 202310443831 A CN202310443831 A CN 202310443831A CN 116482851 A CN116482851 A CN 116482851A
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lens
chip
hot spot
magnification
imaging information
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朱明兰
田浩然
罗俊一
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GTA Semiconductor Co Ltd
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GTA Semiconductor Co Ltd
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Priority to CN202310443831.5A priority Critical patent/CN116482851A/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/36—Microscopes arranged for photographic purposes or projection purposes or digital imaging or video purposes including associated control and data processing arrangements
    • G02B21/365—Control or image processing arrangements for digital or video microscopes
    • G02B21/367—Control or image processing arrangements for digital or video microscopes providing an output produced by processing a plurality of individual source images, e.g. image tiling, montage, composite images, depth sectioning, image comparison
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/0016—Technical microscopes, e.g. for inspection or measuring in industrial production processes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/002—Scanning microscopes
    • G02B21/0024—Confocal scanning microscopes (CSOMs) or confocal "macroscopes"; Accessories which are not restricted to use with CSOMs, e.g. sample holders
    • G02B21/008—Details of detection or image processing, including general computer control
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/18—Arrangements with more than one light path, e.g. for comparing two specimens

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Abstract

The application provides a hot spot positioning auxiliary device and a hot spot positioning auxiliary method, which are applied to the technical field of chip detection and comprise the following steps: the device comprises a carrier, a first lens, a second lens and a processing unit; the first lens is arranged on one side of the front surface of the carrier, the second lens is arranged on one side of the back surface of the carrier, the carrier is used for bearing a chip to be tested, the first lens is used for collecting front imaging information of the chip to be tested, and the second lens is used for collecting hot spot imaging information of the chip to be tested; and the processing unit is used for superposing the hot spot imaging information on the front imaging information to generate a target image and acquiring the position information of the hot spot after processing the target image. The defect position can be positioned on the premise that the chip is not subjected to destructive processing, and the accuracy and success rate of positioning the chip defects are improved.

Description

Hot spot positioning auxiliary device and method
Technical Field
The application relates to the technical field of chip detection, in particular to a hot spot positioning auxiliary device and a hot spot positioning auxiliary method.
Background
The micro light microscope (Emission Microscopy, EMMI) is used as a tool for fault point location and Spot/Hot Spot (Hot Spot) finding in chip failure analysis. An InGaAs lens with higher sensitivity is generally used to detect signals in the wavelength range 900-1700nm, which is the same as the spectral wavelength of IR (infrared), and can be used to detect photons emitted inside the chip.
Currently, EMMI is widely used to detect Leakage current generated by various device defects, including gate oxide defects (Gate oxide defects), electrostatic discharge Failure (ESD Failure), latch Up (Latch Up), leakage current (Leakage), leakage Junction (Junction Leakage), forward Bias (Forward Bias), and transistors operating in the saturation region. Therefore, the location of the bright spot/hot spot can be found out by the EMMI positioning, so that the defect cause can be known, and the subsequent further failure analysis can be facilitated.
A lens for capturing the hot spot signal is arranged on the front side of the chip, and this detection scheme is called front side micro light microscopy (EMMI). Since the front side of the chip typically has a metal layer (e.g., aluminum) that reflects the hot spot signal (near infrared light), the front side EMMI requires removal of the metal aluminum layer from the front side of the chip, which is a destructive process, such as SiC chips, and after removal of the front side metal aluminum layer, the chip breaks down at high voltages when high voltages are applied to the chip.
Therefore, with the front side EMM, not only the chip needs to be subjected to destructive processing, but also even if the chip is subjected to the aforementioned destructive processing, the failure point of the chip cannot be subjected to positioning analysis.
Disclosure of Invention
In view of this, the embodiments of the present disclosure provide a hotspot locating auxiliary device and method, which form a new back side EMMI scheme, so as to locate the fault point of the chip.
The embodiment of the specification provides the following technical scheme:
the embodiment of the present specification provides a hotspot positioning auxiliary apparatus, including: the device comprises a carrier, a first lens, a second lens and a processing unit;
the first lens is arranged on one side of the front surface of the carrying platform, the second lens is arranged on one side of the back surface of the carrying platform, and the relative positions between the first lens and the second lens are fixedly arranged;
the carrier is used for carrying the chip to be tested and driving the chip to move in a plane so that the chip to be tested is positioned in the fields of view of the first lens and the second lens;
the first lens is used for collecting front imaging information of the chip to be tested, and the second lens is used for collecting hot spot imaging information of the chip to be tested;
and the processing unit is used for superposing the hot spot imaging information on the front imaging information to generate a target image and acquiring the position information of the hot spot after processing the target image.
Optionally, the hotspot positioning device further includes a plurality of calibration pieces, a plurality of calibration patterns are disposed on the calibration pieces, and the calibration patterns on the calibration pieces are used for calibrating the same object image in the field of view before the first lens and the second lens perform imaging.
Optionally, the processing unit is further configured to set a corresponding coordinate point for each pixel point in the fields of view of the first lens and the second lens, and superimpose the hotspot imaging information on the front imaging information to generate a target image based on a first coordinate result of the first lens for the calibration patch in the field of view and a second coordinate result of the second lens for the same calibration patch in the field of view for the calibration patch: if the coordinates in the first coordinate result are coincident with the coordinates in the second coordinate result, the hot spot imaging information is overlapped with the front imaging information; and if the coordinates in the first coordinate result are not coincident with the coordinates in the second coordinate result, recording the coordinate difference data as a displacement compensation amount, and superposing the hot spot imaging information on the corresponding coordinate position on the front imaging information according to the displacement compensation amount.
Optionally, the size of the calibration pattern corresponds to the magnification of the first lens;
and/or the thickness of the calibration sheet corresponds to the thickness of the chip to be tested;
and/or, the calibration sheet is fixedly arranged on the carrying platform.
Optionally, the first lens includes a first high-magnification lens and a first low-magnification lens, the second lens includes a second high-magnification lens and a second low-magnification lens, the magnification of the first high-magnification lens is the same as the magnification of the second high-magnification lens, and the magnification of the first low-magnification lens is the same as the magnification of the second low-magnification lens;
and/or the first lens is an optical lens or an infrared lens, and the second lens is an infrared lens provided with an InGaAs detector.
Optionally, a glass slide is disposed at a position of the carrier for carrying the chip to be tested, and the glass slide is used for carrying the chip to be tested.
Optionally, the hot spot positioning device further comprises a power supply system, wherein the power supply system is used for applying a test voltage to the chip to be tested.
The embodiment of the specification also provides a hotspot positioning method, which comprises the following steps:
collecting first front imaging information of a chip to be tested through a first lens, and collecting first hot spot imaging information of the chip to be tested through a second lens; the chip to be tested is placed on the carrier and moves from the carrier to the visual fields of the first lens and the second lens, the first lens is arranged on one side of the front surface of the carrier, and the second lens is arranged on one side of the back surface of the carrier;
superimposing the first hotspot imaging information to the first frontal imaging information to generate a target image;
and acquiring the position information of the hot spot after processing the target image.
Optionally, before the first lens and the second lens collect, the hotspot positioning method further includes:
moving the calibration sheet into the fields of view of the first lens and the second lens, wherein a plurality of calibration patterns are arranged on the calibration sheet, and the multiplying power of the first lens is the same as that of the second lens;
the focal lengths of the first lens and the second lens are respectively adjusted, so that the first lens collects front images corresponding to the clear calibration patterns, and the second lens collects back images corresponding to the clear calibration patterns;
setting a corresponding coordinate point for each pixel point in the first lens and the second lens vision, judging whether coordinates of calibration patterns respectively positioned in the front image and the back image are coincident, and if the coordinates are not coincident, taking coordinate difference data as displacement compensation quantity, wherein the displacement compensation quantity is used for carrying out displacement compensation when the first hot spot imaging information is overlapped with the first front imaging information.
Optionally, the front image and the back image are obtained based on the fact that the first lens and the second lens are low-magnification lenses; then switching the first lens and the second lens to be high-magnification lenses to obtain the corresponding front image and the corresponding back image;
and judging whether coordinates of calibration patterns respectively positioned in the front image and the back image are overlapped or not based on the front image and the back image obtained under the condition that the first lens and the second lens are high-magnification lenses.
Optionally, after the hotspot imaging information is acquired, the hotspot positioning method further includes:
making a first mark on the front surface of the chip to be tested according to the identification imaging information in the view field of the first lens, wherein the first mark is used for representing the rough position of a hot spot;
collecting second front imaging information of the chip to be tested with the first mark through a first lens, and collecting second hot spot imaging information of the chip to be tested through a second lens;
superposing the second hot spot imaging information on the second front image information to generate a new target image;
the obtaining of the position information of the hot spot after processing the target image comprises the following steps: and obtaining the position information of the hot spot by measuring the distance between the hot spot and the first mark in the new target image.
Optionally, the first lens and the second lens are first based on the first lens and the second lens to obtain the preliminary position information of the hot spot for the low-magnification lens, and then based on the preliminary position information, the first lens and the second lens are switched to be the high-magnification lens to obtain the final position information of the hot spot.
Compared with the prior art, the beneficial effects that above-mentioned at least one technical scheme that this description embodiment adopted can reach include at least: the method and the device can locate the defect position on the premise that the chip is not subjected to destructive processing, and improve the accuracy and success rate of locating the chip defect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a hot spot positioning assistance device according to the present application;
FIG. 2 is a top view of a stage in a hotspot locating assistance apparatus of the present application;
FIG. 3 is a schematic illustration of a calibration sheet calibrating the positions of a first probe and a second probe in a hotspot locating assistance apparatus of the present application;
FIG. 4 is a schematic illustration of an on-chip calibration pattern in a hotspot locating aid of the present application;
FIG. 5 is a schematic calibration diagram of calibration sheets of different thickness in a hotspot locating aid of the present application;
fig. 6 is a schematic flow chart of a hotspot positioning assistance method of the present application.
Fig. 7 is a schematic diagram of a hotspot collected by a second lens in a hotspot locating assistance method of the present application;
FIG. 8 is a schematic diagram of a mark in a top view of a first lens in a hotspot locating assistance method of the present application;
FIG. 9 is a schematic diagram of a hotspot position acquired again by the second lens in the hotspot positioning assistance method of the present application;
fig. 10 is a top view of a hot spot and a mark obtained after stacking in the hot spot positioning assistance method of the present application.
1, a carrying platform; 2. a glass slide; 3. a first lens; 4. a second lens; 5. a calibration sheet; 6. a power supply system; 7. and a motor.
Detailed Description
Embodiments of the present application are described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present application will become apparent to those skilled in the art from the present disclosure, when the following description of the embodiments is taken in conjunction with the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. The present application may be embodied or carried out in other specific embodiments, and the details of the present application may be modified or changed from various points of view and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, apparatus may be implemented and/or methods practiced using any number and aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concepts of the application by way of illustration, and only the components related to the application are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details.
Although micro light microscope (EMMI) is commonly used for the positioning analysis of the fault defect point of the chip, especially front side EMMI, because the front side metal aluminum of the chip reflects the hot spot signal (near infrared light) emitted by the defect point, when implementing the front side EMMI scheme, the front side metal aluminum layer of the chip needs to be removed, and thus, the front side metal aluminum layer of the chip needs to be subjected to destructive processing, and after some chips are subjected to the destructive processing, for example, a power device (such as a SiC device), when the front side metal layer of the chip is removed, the chip breaks down after the high voltage is applied, so that the next hot spot positioning cannot be performed.
Based on this, the embodiment of the present specification proposes a hotspot positioning assistance device: as shown in fig. 1 and 2, includes: a stage 1, a first lens 3, a second lens 4, and a processing unit (not shown in the figure);
the first lens 3 and the second lens 4, the first lens 3 is arranged on the front side of the carrying platform 1, the second lens 4 is arranged on the back side of the carrying platform 1, and the relative positions between the first lens 3 and the second lens 4 are fixedly arranged.
The carrier 1 is used for carrying a chip 8 to be tested and driving the chip 8 to be tested to move in a plane, so that the chip 8 to be tested is located in the fields of view of the first lens 3 and the second lens 4.
Specifically, the first lens 3 and the second lens 4 may be fixedly disposed with respect to the chip 8 to be tested, or the first lens 3 and the second lens 4 may be movably disposed with respect to the chip 8 to be tested.
The first lens 3 is used for collecting front imaging information of the chip 8 to be tested, and the second lens 4 is used for collecting hot spot imaging information of the chip 8 to be tested.
And the processing unit is used for superposing the hot spot imaging information on the front imaging information to generate a target image and acquiring the position information of the hot spot after processing the target image. It should be understood by those skilled in the art that the processing unit may be a separate functional unit, or may be a functional unit integrated into the first lens or the second lens, which is not limited herein.
As shown in fig. 3, after the collection result (i.e., the hot spot imaging information) of the second lens 4 is overlapped with the collection result (i.e., the front imaging information) of the first lens 3, a stacking result is formed, so that the position of the hot spot can be obtained from the stacking result by performing image processing on the stacking result.
Through setting up between the first camera lens 3 and the second camera lens 4 in positioner relatively static, be difficult for producing the error because of relative displacement, positioning accuracy is high, and the hot spot signal position that detects with the second camera lens 4 is superimposed in the top view that first camera lens 3 gathered in addition, and then obtain hot spot position information from the superimposed graph, therefore gather chip information respectively based on two cameras, even if the chip does not do destructive processing, also can fix to the defect point position, consequently very convenient carry out defect point positioning operation to the chip.
The hotspot locating device further comprises a power supply system 6, wherein the power supply system 6 is used for applying a test voltage to the chip 8 to be tested.
Specifically, in fig. 1, G is a gate, S is a source, and D is a drain.
Specifically, the stage 1 is moved in the horizontal plane by driving of the motor 7.
In the embodiment of the application, the chip to be tested can transmit a hot spot signal with a wavelength ranging from visible light to near infrared, such as a silicon carbide chip.
Specifically, a glass slide 2 is disposed at a position of the carrier 1 for carrying the chip 8 to be tested, and the glass slide 2 is used for carrying the chip 8 to be tested.
As shown in fig. 3 and 4, the hot spot positioning device further includes a plurality of calibration pieces 5, the calibration pieces 5 are fixedly disposed on the carrier 1, and the calibration pieces 5 and the chip are located on the same plane. The calibration sheet 5 is provided with a plurality of calibration patterns, and the calibration patterns on the calibration sheet 5 are used for calibrating the same object image in the field of view before the first lens 3 and the second lens 4 image.
Specifically, the calibration patterns are triangular, rectangular, or the like.
The calibration piece 5 calibrates the first lens 3 and the second lens 4, avoids that the hot spot is difficult to mark because of the larger chip area and no reference object, thereby improving the accuracy of the first lens 3 and the second lens 4 to the positioning of the hot spot of the chip.
The processing unit is further configured to set a corresponding coordinate point for each pixel point in the fields of view of the first lens 3 and the second lens 4, and superimpose the hotspot imaging information on the front imaging information to generate a target image based on a first coordinate result of the first lens 3 for the calibration patch 5 in the field of view and a second coordinate result of the second lens 4 for the same calibration patch 5 in the field of view for the calibration pattern:
and if the coordinates in the first coordinate result are coincident with the coordinates in the second coordinate result, overlapping the hot spot imaging information with the front imaging information.
And if the coordinates in the first coordinate result are not coincident with the coordinates in the second coordinate result, recording the coordinate difference data as a displacement compensation amount, and superposing the hot spot imaging information on the corresponding coordinate position on the front imaging information according to the displacement compensation amount. Therefore, the first lens 3 and the second lens 4 are calibrated, the fields of view acquired by the first lens 3 and the second lens 4 are corresponding, and the accuracy of locating the hot spot of the chip 8 to be tested is improved.
Specifically, in the process of detecting the chip 8 to be tested, the magnification of the first lens 3 is the same as the magnification of the second lens 4, and the size of the calibration pattern corresponds to the magnification of the first lens 3 and the second lens 4.
Specifically, during the test, the thickness of the calibration sheet 5 corresponds to the thickness of the chip 8 to be tested. The chip 8 to be tested is in the same plane as the calibration sheet 5.
As shown in fig. 5, when the thickness of the calibration sheet 5 is different, the positions where the first lens 3 and the second lens 4 collect the calibration sheet 5 in the vertical direction are also different. The thickness of the calibration sheet 5 is the same as that of the chip 8 to be tested, so that the influence of the first lens 3 and the second lens 4 on the hot spot detection position deviation due to the different thicknesses of the chips is reduced.
The first lens 3 includes a first high-magnification lens and a first low-magnification lens, and the second lens 4 includes a second high-magnification lens and a second low-magnification lens, the magnification of the first high-magnification lens is the same as that of the second high-magnification lens, and the magnification of the first low-magnification lens is the same as that of the second low-magnification lens.
The first low-magnification lens and the second low-magnification lens are 1X and 5X magnification lenses, and the first high-magnification lens and the second high-magnification lens are 20X and 50X lenses.
The first low-magnification lens and the second low-magnification lens perform preliminary positioning on the hot spot on the chip, determine the approximate hot spot position, the first high-magnification lens and the second high-magnification lens perform accurate positioning on the hot spot on the chip, determine the accurate hot spot position, and improve the positioning speed and accuracy.
Specifically, the first low-magnification lens and the second low-magnification lens have large visual fields, the whole chip can be seen, and the hot spot is probably positioned under the first low-magnification lens and the second low-magnification lens. Because the first low-magnification lens and the second low-magnification lens have lower resolution, the grasped hot spot position and the actual defect position can have a distance deviation of tens of micrometers, and the hot spot position is roughly determined by using the first low-magnification lens and the second low-magnification lens. And then the first high-magnification lens and the second high-magnification lens are moved to the position of the hot spot under the low-magnification lens, the position of the hot spot is accurately determined under the high-magnification lens, the accuracy of the position of the hot spot is improved, and the position error is reduced to about 1 um.
The first lens 3 is an optical lens or an infrared lens, and the second lens 4 is an infrared lens provided with an InGaAs detector.
The embodiment of the present disclosure further provides a hotspot positioning method, as shown in fig. 6, including:
firstly, calibrating object images in the fields of view of a first lens 3 and a second lens 4, selecting corresponding calibration sheets 5 according to the thickness of a chip 8 to be tested, and moving the calibration sheets 5 into the fields of view of the first lens 3 and the second lens 4, wherein a plurality of calibration patterns are arranged on the calibration sheets 5, and the multiplying power of the first lens 3 is the same as that of the second lens 4;
as shown in fig. 7, 8 and 9, the focal lengths of the first lens 3 and the second lens 4 are respectively adjusted, so that the first lens 3 collects front images corresponding to the clear calibration patterns, and the second lens 4 collects back images corresponding to the clear calibration patterns;
firstly, based on the low-magnification lenses of the first lens 3 and the second lens 4, corresponding front images and back images are obtained; then, switching the first lens 3 and the second lens 4 to be high-magnification lenses to obtain corresponding front images and back images;
based on the front image and the back image obtained under the condition that the first lens 3 and the second lens 4 are high-magnification lenses, whether coordinates of the calibration patterns respectively located in the front image and the back image are coincident or not is judged.
Setting a corresponding coordinate point for each pixel point in the visual fields of the first lens 3 and the second lens 4, judging whether the coordinates of the calibration patterns respectively positioned in the front image and the back image are coincident, and if the coordinates are not coincident, taking the coordinate difference data as a displacement compensation amount, wherein the displacement compensation amount is used for carrying out displacement compensation when the first hot spot imaging information is overlapped with the first front imaging information.
The chip 8 to be tested is placed on the carrier 1, and is moved from the carrier 1 into the fields of view of the first lens 3 and the second lens 4, the first lens 3 is disposed on the front side of the carrier 1, and the second lens 4 is disposed on the back side of the carrier 1. The power system 6 is used for applying voltage to the chip to be detected, the first front imaging information of the chip 8 to be tested is collected through the first lens 3, and the first hot spot imaging information of the chip 8 to be tested is collected through the second lens 4.
Step two, as shown in fig. 10, the first hotspot imaging information is superimposed on the first front imaging information to generate a target image;
and thirdly, acquiring the position information of the hot spot after processing the target image.
After the hot spot imaging information is acquired, the hot spot positioning method further comprises the following steps:
under the field of view of the first lens 3, a first mark is made on the front surface of the chip 8 to be tested according to the identification imaging information, and the first mark is used for representing the rough position of the hot spot;
collecting second front imaging information of the chip 8 to be tested with the first mark through the first lens 3, and collecting second hot spot imaging information of the chip 8 to be tested through the second lens 4;
superposing the second hot spot imaging information on the second front image information to generate a new target image;
the obtaining of the position information of the hot spot after processing the target image comprises the following steps: and obtaining the position information of the hot spot by measuring the distance between the hot spot and the first mark in the new target image.
The method comprises the steps of firstly obtaining preliminary position information of a hot spot based on a lens with low magnification of a first lens 3 and a second lens 4, and then obtaining final position information of the hot spot based on the preliminary position information by switching the lens with high magnification of the first lens 3 and the second lens 4.
In this specification, identical and similar parts of the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, the description is relatively simple for the embodiments described later, and reference is made to the description of the foregoing embodiments for relevant points.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present application should be covered in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (12)

1. A hotspot locating device, comprising: the device comprises a carrier, a first lens, a second lens and a processing unit;
the first lens is arranged on one side of the front surface of the carrying platform, the second lens is arranged on one side of the back surface of the carrying platform, and the relative positions between the first lens and the second lens are fixedly arranged;
the carrier is used for carrying the chip to be tested and driving the chip to move in a plane so that the chip to be tested is positioned in the fields of view of the first lens and the second lens;
the first lens is used for collecting front imaging information of the chip to be tested, and the second lens is used for collecting hot spot imaging information of the chip to be tested;
and the processing unit is used for superposing the hot spot imaging information on the front imaging information to generate a target image and acquiring the position information of the hot spot after processing the target image.
2. The hotspot positioning apparatus of claim 1, further comprising a plurality of calibration tiles, wherein the calibration tiles are provided with a plurality of calibration patterns, and wherein the calibration patterns on the calibration tiles are used for calibrating the first lens and the second lens before imaging the same object image in the field of view.
3. The hotspot positioning assistance device according to claim 2, wherein the processing unit is further configured to set a corresponding coordinate point for each pixel point in the fields of view of the first lens and the second lens, and superimpose the hotspot imaging information on the front imaging information to generate a target image based on a first coordinate result of the first lens for the calibration patch in the field of view and a second coordinate result of the second lens for the same calibration patch in the field of view for the calibration patch:
if the coordinates in the first coordinate result are coincident with the coordinates in the second coordinate result, the hot spot imaging information is overlapped with the front imaging information;
and if the coordinates in the first coordinate result are not coincident with the coordinates in the second coordinate result, recording the coordinate difference data as a displacement compensation amount, and superposing the hot spot imaging information on the corresponding coordinate position on the front imaging information according to the displacement compensation amount.
4. The hotspot positioning assistance apparatus of claim 2, wherein the size of the calibration pattern corresponds to a magnification of the first lens;
and/or the thickness of the calibration sheet corresponds to the thickness of the chip to be tested;
and/or, the calibration sheet is fixedly arranged on the carrying platform.
5. The hotspot positioning assistance device according to claim 1, wherein the first lens includes a first high-magnification lens and a first low-magnification lens, the second lens includes a second high-magnification lens and a second low-magnification lens, the magnification of the first high-magnification lens is the same as the magnification of the second high-magnification lens, and the magnification of the first low-magnification lens is the same as the magnification of the second low-magnification lens;
and/or the first lens is an optical lens or an infrared lens, and the second lens is an infrared lens provided with an InGaAs detector.
6. The hot spot positioning auxiliary device according to claim 1, wherein a glass slide is provided at a position for carrying a chip to be tested in the stage, and the glass slide is used for carrying the chip to be tested.
7. The hotspot locating assistance device of claim 1, further comprising a power system for applying a test voltage to a chip to be tested.
8. A method for locating a hotspot, comprising:
collecting first front imaging information of a chip to be tested through a first lens, and collecting first hot spot imaging information of the chip to be tested through a second lens; the chip to be tested is placed on the carrier and moves from the carrier to the visual fields of the first lens and the second lens, the first lens is arranged on one side of the front surface of the carrier, and the second lens is arranged on one side of the back surface of the carrier;
superimposing the first hotspot imaging information to the first frontal imaging information to generate a target image;
and acquiring the position information of the hot spot after processing the target image.
9. The hotspot locating method of claim 8, wherein before the first lens and the second lens are collected, the hotspot locating method further comprises:
moving the calibration sheet into the fields of view of the first lens and the second lens, wherein a plurality of calibration patterns are arranged on the calibration sheet, and the multiplying power of the first lens is the same as that of the second lens;
the focal lengths of the first lens and the second lens are respectively adjusted, so that the first lens collects front images corresponding to the clear calibration patterns, and the second lens collects back images corresponding to the clear calibration patterns;
setting a corresponding coordinate point for each pixel point in the first lens and the second lens vision, judging whether coordinates of calibration patterns respectively positioned in the front image and the back image are coincident, and if the coordinates are not coincident, taking coordinate difference data as displacement compensation quantity, wherein the displacement compensation quantity is used for carrying out displacement compensation when the first hot spot imaging information is overlapped with the first front imaging information.
10. The hotspot positioning method of claim 9, wherein the front image and the back image are obtained based on the first lens and the second lens which are low-magnification lenses; then switching the first lens and the second lens to be high-magnification lenses to obtain the corresponding front image and the corresponding back image;
and judging whether coordinates of calibration patterns respectively positioned in the front image and the back image are overlapped or not based on the front image and the back image obtained under the condition that the first lens and the second lens are high-magnification lenses.
11. The hotspot locating method of claim 8, wherein after the hotspot imaging information is acquired, the hotspot locating method further comprises:
making a first mark on the front surface of the chip to be tested according to the identification imaging information in the view field of the first lens, wherein the first mark is used for representing the rough position of a hot spot;
collecting second front imaging information of the chip to be tested with the first mark through a first lens, and collecting second hot spot imaging information of the chip to be tested through a second lens;
superposing the second hot spot imaging information on the second front image information to generate a new target image;
the obtaining of the position information of the hot spot after processing the target image comprises the following steps: and obtaining the position information of the hot spot by measuring the distance between the hot spot and the first mark in the new target image.
12. The hotspot locating method according to any one of claims 8 to 11, wherein the preliminary location information of the hotspot is obtained based on the first lens and the second lens being lenses with low magnification, and then the final location information of the hotspot is obtained by switching the first lens and the second lens to lenses with high magnification based on the preliminary location information.
CN202310443831.5A 2023-04-23 2023-04-23 Hot spot positioning auxiliary device and method Pending CN116482851A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117890371A (en) * 2024-01-18 2024-04-16 马鞍山芯乔科技有限公司 Method for overlapping wafer appearance detection functional images

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117890371A (en) * 2024-01-18 2024-04-16 马鞍山芯乔科技有限公司 Method for overlapping wafer appearance detection functional images

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