CN116482815A - ROF board light-carrying module - Google Patents
ROF board light-carrying module Download PDFInfo
- Publication number
- CN116482815A CN116482815A CN202310337741.8A CN202310337741A CN116482815A CN 116482815 A CN116482815 A CN 116482815A CN 202310337741 A CN202310337741 A CN 202310337741A CN 116482815 A CN116482815 A CN 116482815A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- rof
- board
- base
- golden finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 56
- 230000017525 heat dissipation Effects 0.000 claims description 21
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 2
- 238000004891 communication Methods 0.000 abstract description 10
- 238000003780 insertion Methods 0.000 abstract description 2
- 230000037431 insertion Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
- G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4278—Electrical aspects related to pluggable or demountable opto-electronic or electronic elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to the technical field of optical communication and provides an ROF board light-carrying module which comprises a shell formed by buckling a base and an upper cover, and further comprises a circuit board movably arranged in the shell, wherein the moving direction of the circuit board is the direction from the upper cover to the base, a golden finger capable of being inserted into a socket is arranged on the circuit board, and the shell is provided with an opening for the golden finger to extend out of the shell. According to the ROF board light-carrying module, the circuit board is movably arranged in the shell, so that the light module has a golden finger communication function and can avoid the interference of over-positioning caused by the insertion of the golden finger into the socket, and the problem of over-positioning interference during application of the light module is thoroughly solved.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to an ROF board light-carrying module.
Background
The optical communication market not only needs the excellent performance of the optical-on-fiber wireless communication (ROF) board optical module, but also needs more functional integration to expand the application range of the optical-on-fiber wireless communication (ROF) board optical module, so that more markets are obtained. At present, the ROF on-board module has no design for pluggable golden fingers due to the over-positioning interference problem in application, so that the ROF on-board module does not have the pluggable golden finger communication function at the same time.
In addition, the internal signals of the existing optical carrier wireless communication (ROF) board optical carrier module are easy to interfere, so that the electrical performance is not high.
Disclosure of Invention
The invention aims to provide an ROF board light-carrying module which at least can solve part of defects in the prior art.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: the ROF board light-carrying module comprises a shell formed by buckling a base and an upper cover, and further comprises a circuit board movably arranged in the shell, wherein the moving direction of the circuit board is the direction from the upper cover to the base, a golden finger capable of being inserted into a socket is arranged on the circuit board, and the shell is provided with an opening for the golden finger to extend out of the shell.
Further, the base and the upper cover are both provided with limiting surfaces for limiting the movement amount of the circuit board.
Further, the distance between the circuit board and the limiting surface of the upper cover and the distance between the circuit board and the limiting surface of the base are controlled to be between 0.1 and 0.2 mm.
Further, a limiting structure for limiting the displacement of the golden finger on the circuit board in the direction of inserting the golden finger into the socket is arranged on the base.
Further, the heat dissipation structure for dissipating heat of the electronic components on the circuit board is also included.
Further, the heat dissipation structure comprises a heat dissipation pad attached to the circuit board.
Further, the heat dissipation pads are attached to the upper and lower surfaces of the circuit board.
Further, the heat dissipation pad is an elastic pad.
Further, notches are arranged at the two sides of the golden finger corresponding to the positions of the circuit board.
Further, an optical device is also included, and the optical device is connected to the circuit board.
Compared with the prior art, the invention has the beneficial effects that: the ROF board light-carrying module is characterized in that a circuit board is movably arranged in a shell, so that the light module can prevent the interference of over-positioning when a golden finger is inserted into a socket while having the function of golden finger communication, and the problem of over-positioning interference when the light module is applied is thoroughly solved.
Drawings
Fig. 1 is a schematic diagram of an ROF board-mounted optical module according to an embodiment of the present invention;
FIG. 2 is a schematic view of FIG. 1 with the upper cover removed;
fig. 3 is a schematic diagram of a circuit board and an upper cover of a ROF board-mounted optical module according to an embodiment of the present invention;
fig. 4 is a schematic view of a first view angle of an upper cover of an ROF board-mounted optical module according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a second view angle of an upper cover of an ROF board-mounted optical module according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a base of an ROF board-mounted optical module according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a circuit board and a base of an ROF board-mounted optical module according to an embodiment of the present invention;
fig. 8 is a schematic diagram of a circuit board of an ROF board-mounted optical module according to an embodiment of the present invention mated with a base (one of the sides is in a cross-sectional state, and the cross-section is transparent to show a first limit post and a gap);
fig. 9 is a schematic view of a light-carrying module with a ROF board with a housing removed from the first view, provided in an embodiment of the present invention;
fig. 10 is a schematic diagram of a second view angle of a light-carrying module with a housing removed from a ROF board according to an embodiment of the present invention;
fig. 11 is a schematic diagram of a third view angle of a light-carrying module with a ROF board with a housing removed according to an embodiment of the present invention;
in the reference numerals: 1-a base; 10-a first limit column; 11-a third limit column; 12-retaining wall; 120-fixing the position; 13-lightening holes; 14-a first clamping groove; 2-an upper cover; 20-a second limit column; 21-conductive adhesive; 22-a mating groove; 23-a second clamping groove; 3-a circuit board; 30-golden finger; 31-notch; 32-mounting slots; 4-optical devices; 5-optical port; 6-a heat dissipation pad; 7-a radio frequency coaxial cable; 8-gap; 9-tube bundle groove.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 11, an embodiment of the present invention provides an ROF board light-carrying module, which includes a housing formed by buckling a base 1 and an upper cover 2, and is characterized in that: the novel socket is characterized by further comprising a circuit board 3 movably arranged in the shell, the moving direction of the circuit board 3 is the direction from the upper cover 2 to the base 1, the circuit board 3 is provided with a golden finger 30 which can be inserted into the socket, and the shell is provided with an opening for the golden finger 30 to extend out of the shell. In this embodiment, the circuit board 3 is movably disposed in the housing, so that the optical module has the function of communication with the golden finger 30, and meanwhile, the interference of over-positioning caused by inserting the golden finger 30 into the socket can be avoided, thereby thoroughly solving the problem of over-positioning interference during application of the optical module. Specifically, since the margin of movement of the circuit board 3 is left in the housing, even if the circuit board 3 is in a "floating" state, it is possible to avoid interference of over-positioning when the gold finger 30 is inserted into the socket. The "floating" direction is the direction from the upper cover 2 to the base 1, i.e., the up-down direction shown in fig. 1, and the left-right direction cannot be moved, and can be limited by a limiting structure.
Referring to fig. 3 to 8, in a detailed manner of the above "floating", the base 1 and the upper cover 2 each have a limiting surface for limiting the movement of the circuit board 3. The spacing between the circuit board 3 and the limiting surface of the upper cover 2 and the spacing between the circuit board 3 and the limiting surface of the base 1 are controlled to be between 0.1 and 0.2 mm. In this embodiment, the "floating" amount of the circuit board 3 is limited by a limiting surface on both the base 1 and the upper cover 2, specifically on the base 1 on its first limiting post 10 and on the upper cover 2 on its second limiting post 20. The "floating" amount, i.e. the gap 8 designed between the limiting surface and the circuit board 3, is controlled between 0.1 and 0.2mm, preferably 0.15mm. That is, the circuit board 3 has a gap 8 of 0.15mm for moving in the direction of the base 1 or the direction of the upper cover 2, and the size is very small, so that the function implementation of the circuit board 3 in the shell is not affected, the protocol is ensured to be met, a certain amount of floating is provided, and the interference problem of over-positioning is solved.
Referring to fig. 6 to 8, the base 1 is provided with a limiting structure for limiting displacement of the gold finger 30 on the circuit board 3 in the direction of inserting into the socket. In the present embodiment, the limit structure is used to limit the displacement of the circuit board 3 in this direction of insertion into the socket, that is, the movement in the left-right direction as shown in fig. 1. In particular, there are many ways of limiting, and the third limiting post 11 may be used on the base 1 to block the circuit board 3. Preferably, the third limiting post 11 and the first limiting post 10 can cooperate to form a step structure, so that the circuit board 3 can be placed on one hand, and the circuit board 3 can be limited on the other hand.
Referring to fig. 2 and 9, the present optical module further includes a heat dissipation structure for dissipating heat from the electronic components on the circuit board 3. In the present embodiment, some electronic components on the circuit board 3 have large power consumption and large heat generation, so the heat dissipation pad 6 is required to dissipate heat. Specifically, the heat dissipation may be achieved by attaching a heat dissipation pad 6 to a position of the circuit board 3 corresponding to the electronic component that generates heat, and the heat dissipation pad 6 may transfer heat to the housing. Preferably, the heat dissipation pads 6 are attached to the upper and lower surfaces of the circuit board 3, so as to achieve a better heat dissipation effect. The heat dissipation pad 6 is an elastic pad, and the elastic heat dissipation pad 6 is adopted, and the elastic compression amount of the elastic pad is 20% of the thickness of the elastic pad, so that the heat dissipation of the heating electronic components (chips) on the circuit board 3 can be ensured while the circuit board 3 is in a floating state.
Referring to fig. 10 and 11, notches 31 are disposed on two sides of the gold finger 30 corresponding to the position of the circuit board 3. In this embodiment, the circuit board 3 is provided with the notch 31, and the notch 31 has two positions, so that the extending golden finger 30 becomes narrower, so that the golden finger has a certain flexibility, the stress generated by inserting and pulling the golden finger 30 can be further reduced, the safety coefficient of the golden finger is increased, and the reliability of the module is improved.
Referring to fig. 2, 9, 10 and 11, the optical module further includes optical devices 4, where a plurality of optical devices 4 may be designed according to needs, for example, eight optical devices 4 are designed, and eight optical ports 5 corresponding to the optical devices 4 are provided on the housing. Eight rf coaxial cables 7 are also designed to correspond to them. The circuit board 3 and each of the optical devices 4 are placed in the housing; each optical device 4 is connected to the circuit board 3, each optical device 4 is arranged side by side, and two adjacent optical devices 4 are separated by a retaining wall 12. In this embodiment, when there are a plurality of optical devices 4, they are arranged side by side, two adjacent optical devices 4 may be separated by using the retaining wall 12, and the optical devices 4 are separated by the retaining wall 12, so as to reduce internal signal interference and improve electrical performance.
Referring to fig. 10, the circuit board 3 has a mounting groove 32 into which the retaining wall 12 is inserted. In this embodiment, the circuit board 3 has a mounting groove 32 thereon to mate with the retaining wall 12.
Referring to fig. 6 and 7, at least one retaining wall 12 is provided with a fixing portion 120, and the upper cover 2 is fixed on the base 1 by the fixing portion 120. In this embodiment, the retaining wall 12 may be provided with a fixing position 120, so that the upper cover 2 and the base 1 may be conveniently installed and fixed. The fixing locations 120 may be screw holes into which screws may be screwed.
Referring to fig. 3 to 8, the base 1 and the upper cover 2 have a fixing structure for fixing the optical device 4. The fixing structure comprises a first clamping groove 14 arranged on the base 1 and a second clamping groove 23 arranged on the upper cover 2, and the first clamping groove 14 and the second clamping groove 23 are enclosed to form a clamping section capable of clamping the optical device 4. In this embodiment, the optical device 4 may be fixed by a fixing structure, and the fixing manner is a clamping manner. The shape of the first clamping groove 14 and the second clamping groove 23 formed by surrounding is matched with the shape of the optical device 4.
Referring to fig. 5, the upper cover 2 has a mating groove 22 into which each of the retaining walls 12 is engaged. In this embodiment, the retaining wall 12 may be snapped into the corresponding mating groove 22 on the upper cover 2. Preferably, the conductive paste 21 is provided in the fitting groove 22. Therefore, the retaining wall 12 is clamped into the matching groove 22 to press the conductive adhesive 21, so that the electromagnetic shielding efficiency of the module can be improved, and in addition, the purposes of isolating, reducing internal signal interference and improving the electrical performance can be achieved after the retaining wall 12 is contacted with the conductive adhesive 21. Preferably, the conductive adhesive 21 is an elastic conductive adhesive 21.
Referring to fig. 1, 2, 9, 10 and 11, the circuit board 3 is connected with radio frequency coaxial cables 7 corresponding to the optical devices 4 in number and one-to-one. In this embodiment, the radio frequency coaxial cable 7 can output a signal. Preferably, at least one of the base 1 and the upper cover 2 is provided with a bundle groove 9 for the bundle of the rf coaxial cables 7. The tube bundle groove 9 is designed on the base 1 and/or the upper cover 2, which can play a role of binding the radio frequency coaxial cable 7 to a certain extent and prevent the radio frequency coaxial cable 7 from shaking.
Referring to fig. 1, 2 and 7, the housing has the same number of optical ports 5 as the optical devices 4 and corresponds to each other one by one, and each optical device 4 faces the corresponding optical port 5. In this embodiment, the number of the optical ports 5 may be eight, which corresponds to eight optical devices 4 one by one. The light port 5 is arranged on the base 1.
Referring to fig. 6 and 7, the base 1 is provided with a weight-reducing hole 13. In this embodiment, the weight of the optical module can be reduced by digging holes in the edges of the base 1.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a ROF board carries optical module, includes the casing that forms by base and upper cover lock, its characterized in that: the circuit board is movably arranged in the shell, the moving direction of the circuit board is the direction from the upper cover to the base, the circuit board is provided with a golden finger which can be inserted into the socket, and the shell is provided with an opening for the golden finger to extend out of the shell.
2. The ROF on-board optical module of claim 1, wherein: the base and the upper cover are both provided with limiting surfaces for limiting the activity of the circuit board.
3. The ROF on-board optical module of claim 2, wherein: the spacing between the circuit board and the limiting surface of the upper cover and the spacing between the circuit board and the limiting surface of the base are controlled to be between 0.1 and 0.2 mm.
4. The ROF on-board optical module of claim 1, wherein: the base is provided with a limiting structure for limiting the displacement of the golden finger on the circuit board in the direction of inserting the golden finger into the socket.
5. The ROF on-board optical module of claim 1, wherein: the heat dissipation structure is used for dissipating heat of the electronic components on the circuit board.
6. The ROF on-board optical module of claim 5, wherein: the heat dissipation structure comprises a heat dissipation pad attached to the circuit board.
7. The ROF on-board optical module of claim 6, wherein: the upper surface and the lower surface of the circuit board are respectively stuck with the heat dissipation pad.
8. The ROF on-board optical module of claim 5, wherein: the heat dissipation pad is an elastic pad.
9. The ROF on-board optical module of claim 1, wherein: and notches are arranged at the two sides of the golden finger corresponding to the positions of the circuit board.
10. The ROF on-board optical module of claim 1, wherein: the circuit board is characterized by further comprising an optical device, wherein the optical device is connected to the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310337741.8A CN116482815A (en) | 2023-03-31 | 2023-03-31 | ROF board light-carrying module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310337741.8A CN116482815A (en) | 2023-03-31 | 2023-03-31 | ROF board light-carrying module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116482815A true CN116482815A (en) | 2023-07-25 |
Family
ID=87222267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310337741.8A Pending CN116482815A (en) | 2023-03-31 | 2023-03-31 | ROF board light-carrying module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116482815A (en) |
-
2023
- 2023-03-31 CN CN202310337741.8A patent/CN116482815A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI791533B (en) | Transceiver assembly array with fixed heatsink and floating transceivers | |
| US11715922B2 (en) | I/O connector configured for cabled connection to the midboard | |
| US8164922B2 (en) | Heat management in an electronic module | |
| KR100261382B1 (en) | Multigigabit adaptable transceiver module | |
| CN110690616B (en) | Heat sink assembly for electrical connector | |
| US9437949B2 (en) | Electrical cable assembly configured to be mounted onto an array of electrical contacts | |
| US9124025B2 (en) | Connector | |
| US7422471B1 (en) | Electrical connector with heat sink function | |
| TWI833050B (en) | Socket connector and cable assembly for a communication system | |
| CN111478094B (en) | Four-channel small pluggable dual-density transceiver module with radiator | |
| JP2014038772A (en) | Cable connector | |
| CN220023490U (en) | Light-carrying module of light-carrying wireless communication board | |
| US9743556B1 (en) | Electrical connector structure | |
| CN116482815A (en) | ROF board light-carrying module | |
| CN209981646U (en) | Connector and connecting assembly | |
| TWM601476U (en) | Socket connector | |
| US20240039213A1 (en) | Connector and communication device | |
| CN219916003U (en) | Optical module | |
| CN218995730U (en) | Optical module | |
| CN217639659U (en) | Optical module capable of eliminating stress | |
| CN111342251B (en) | Power supply for socket assembly | |
| CN111129874B (en) | Terminal module, electric connector and electric connector assembly | |
| CN111129873B (en) | Grounding terminal assembly, terminal module and electric connector | |
| CN113473701A (en) | Optoelectronic component, network device and method for producing an optoelectronic component | |
| CN116419469A (en) | Single board and photoelectric communication equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |