CN116481442A - Method for measuring thickness of warping plate-shaped object based on area array structured light - Google Patents

Method for measuring thickness of warping plate-shaped object based on area array structured light Download PDF

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Publication number
CN116481442A
CN116481442A CN202210036199.8A CN202210036199A CN116481442A CN 116481442 A CN116481442 A CN 116481442A CN 202210036199 A CN202210036199 A CN 202210036199A CN 116481442 A CN116481442 A CN 116481442A
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CN
China
Prior art keywords
camera
lower camera
thickness
point cloud
structured light
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Application number
CN202210036199.8A
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Chinese (zh)
Inventor
王磊
周剑
周坤
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Suzhou Shallow Optical Intelligent Technology Co ltd
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Suzhou Shallow Optical Intelligent Technology Co ltd
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Publication date
Application filed by Suzhou Shallow Optical Intelligent Technology Co ltd filed Critical Suzhou Shallow Optical Intelligent Technology Co ltd
Priority to CN202210036199.8A priority Critical patent/CN116481442A/en
Publication of CN116481442A publication Critical patent/CN116481442A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The invention relates to a method for measuring the thickness of a warping plate-shaped object based on area array structured light, which sequentially comprises the following steps: step 1, placing an object to be measured on optical glass; step 2, ensuring that the object to be measured is in the public view of the upper camera and the lower camera; step 3, fitting the upper camera and the lower camera respectively to obtain the sphere center data of all standard calibration spheres; step 4, calculating the relative coordinate relation of the upper camera and the lower camera; step 5, three-dimensionally reconstructing by the upper camera and the lower camera to obtain point cloud data of two surfaces; step 6, selecting an area on the point cloud data of the upper camera, solving the normal vector of the area, and solving the mapping point cloud of the upper camera and the lower camera in the normal direction; and 7, fitting a plane equation of the mapping point cloud of the lower camera, and obtaining the average distance from the point cloud of the upper camera to the plane equation of the lower camera, namely the thickness. The invention can accurately and efficiently measure the thickness of the warping plate-shaped object, and has simple operation and convenient use.

Description

Method for measuring thickness of warping plate-shaped object based on area array structured light
Technical Field
The invention relates to the technical field of stereoscopic vision detection, in particular to the technical field of size detection of a warping plate-shaped object, and particularly relates to a warping plate-shaped object thickness measuring method based on area array structured light.
Background
There are a large number of warped plate-like objects in industrial products, such as cell phone cooling fins, cell phone chassis, etc. When these objects are subjected to high-precision real-time thickness detection on a production line, due to a certain degree of warpage, it is difficult to find a flat horizontal plane which can be used as a measurement reference, and the actual thickness in the bending direction depends on the calculation result of the local normal vector crossing point cloud. The thickness of the traditional multi-view vision, mechanical height gauge, line scanning, laser measurement mode and the like are difficult to accurately and efficiently measure.
In view of the above-mentioned drawbacks, the present inventors have actively studied and innovated to create a method for measuring the thickness of a warped plate-like object based on planar array structured light, which is more industrially useful.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide a method for measuring the thickness of a warping plate-shaped object based on area array structured light.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the measuring device comprises an upper camera, a glass carrying platform, a machine table and a lower camera, wherein the upper camera is installed at the top position of the machine table through a camera support, the lower camera is installed at the bottom position of the machine table through a camera support, the glass carrying platform is arranged on the machine table between the upper camera and the lower camera, the top of the glass carrying platform is provided with optical glass, and the measuring device comprises the following components in sequence:
step 1, placing an object to be measured on optical glass;
step 2, an upper camera is placed above the measured object, and a lower camera is placed below the measured object, so that the measured object is in a common field of view of the upper camera and the lower camera;
step 3, putting a plurality of standard calibration balls into a public view of an upper camera and a lower camera, and fitting the upper camera and the lower camera respectively to obtain ball center data of all the standard calibration balls;
step 4, calculating the relative coordinate relation of the upper camera and the lower camera, and unifying the coordinates to a coordinate system of the upper camera;
step 5, three-dimensionally reconstructing by the upper camera and the lower camera to obtain point cloud data of two surfaces;
step 6, selecting an area on the point cloud data of the upper camera, solving the normal vector of the area, and solving the mapping point cloud of the upper camera and the lower camera in the normal direction;
and 7, fitting a plane equation of the mapping point cloud of the lower camera, and obtaining the average distance from the point cloud of the upper camera to the plane equation of the lower camera, namely the thickness.
As a further improvement of the present invention, the object to be measured is a warped plate-like object.
As a further improvement of the present invention, the optical glass is an optical glass having a uniform refractive index throughout.
As a further improvement of the present invention, both the upper camera and the lower camera are area array structured light cameras.
As a further improvement of the invention, the number of the standard calibration balls is 1-12.
As a further development of the invention, the number of standard calibration balls is 9.
By means of the scheme, the invention has at least the following advantages:
the method for measuring the thickness of the warping plate-shaped object based on the area array structured light can accurately and efficiently measure the thickness of the warping plate-shaped object, and is simple to operate and convenient to use.
The foregoing description is only an overview of the present invention, and is intended to provide a better understanding of the present invention, as it is embodied in the following description, with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a method for measuring the thickness of a warped plate-like object based on area array structured light;
FIG. 2 is a schematic diagram of the positional relationship between the object to be measured and a standard calibration sphere in the present invention;
fig. 3 is a schematic diagram of mapping point cloud calculation in the present invention.
In the drawings, the meaning of each reference numeral is as follows.
1. Glass carrier for upper camera 2
3. Optical glass for object 4 to be measured
5. Machine 6 camera support
7. Lower camera 8 standard calibration ball
Detailed Description
The following describes in further detail the embodiments of the present invention with reference to the drawings and examples. The following examples are illustrative of the invention and are not intended to limit the scope of the invention.
In order to make the present invention better understood by those skilled in the art, the following description will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present invention.
Examples
As shown in figures 1 to 3 of the drawings,
the measuring device comprises an upper camera 1, a glass carrying platform 2, a machine platform 5 and a lower camera 7, wherein the upper camera 1 is installed at the top position of the machine platform 5 through a camera support 6, the lower camera 7 is installed at the bottom position of the machine platform 5 through the camera support 6, the glass carrying platform 2 is arranged on the machine platform 5 between the upper camera 1 and the lower camera 7, the top of the glass carrying platform 2 is provided with an optical glass 4, and the measuring device comprises the following components in sequence:
step 1, placing an object 3 to be measured on optical glass 4;
step 2, placing an upper camera 1 above the object 3 to be measured, and a lower camera 7 below the object 3 to be measured, wherein the object 3 to be measured is ensured to be in a common field of view of the upper camera 1 and the lower camera 7;
step 3, putting a plurality of standard calibration balls 8 into a public view of an upper camera 1 and a lower camera 7, and fitting the public view with the upper camera 1 and the lower camera 7 respectively to obtain ball center data of all the standard calibration balls 8;
step 4, calculating the relative coordinate relation of the upper camera 1 and the lower camera 7, and unifying the coordinates to the coordinate system of the upper camera 1;
step 5, three-dimensional reconstruction is carried out through the upper camera 1 and the lower camera 7 to obtain point cloud data of two surfaces;
step 6, selecting an area on the point cloud data of the upper camera 1, solving the normal vector of the area, and solving the mapping point cloud of the lower camera 7 in the normal direction;
and 7, fitting a plane equation of the mapping point cloud of the lower camera 7, and obtaining the average distance from the point cloud of the upper camera 1 to the plane equation of the lower camera 7, namely the thickness.
Preferably, the object 3 is a warped plate-like object.
Preferably, the optical glass 4 is an optical glass having a uniform refractive index throughout.
Preferably, the upper camera 1 and the lower camera 7 are both area array structured light cameras.
Preferably, the number of standard calibration balls 8 is 1-12.
Preferably, the number of standard calibration balls 8 is 9.
The method for measuring the thickness of the warping plate-shaped object based on the area array structured light can accurately and efficiently measure the thickness of the warping plate-shaped object, and is simple to operate and convenient to use.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or number of technical features being indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected: can be mechanically or electrically connected: the terms are used herein to denote any order or quantity, unless otherwise specified.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, and it should be noted that it is possible for those skilled in the art to make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims (6)

1. The utility model provides a warp platy object thickness measurement method based on area array structured light, its characterized in that, measuring device includes last camera (1), glass microscope carrier (2), board (5) and lower camera (7), go up camera (1) and install the top position in board (5) through camera support (6), lower camera (7) are installed the bottom position in board (5) through camera support (6), be provided with glass microscope carrier (2) on board (5) between last camera (1) and lower camera (7), the top of glass microscope carrier (2) is provided with optical glass (4), through measuring device's object thickness measurement method includes in proper order:
step 1, placing an object to be measured (3) on optical glass (4);
step 2, an upper camera (1) is placed above the measured object (3), a lower camera (7) is placed below the measured object (3), and the measured object (3) is ensured to be in a common field of view of the upper camera (1) and the lower camera (7);
step 3, putting a plurality of standard calibration balls (8) into a public view of an upper camera (1) and a lower camera (7), and respectively fitting the upper camera (1) and the lower camera (7) to obtain ball center data of all the standard calibration balls (8);
step 4, calculating the relative coordinate relation of the upper camera (1) and the lower camera (7), and unifying the coordinates to a coordinate system of the upper camera (1);
step 5, three-dimensionally reconstructing by an upper camera (1) and a lower camera (7) to obtain point cloud data of two surfaces;
step 6, selecting an area on the point cloud data of the upper camera (1), solving the normal vector of the area, and solving the mapping point cloud with the lower camera (7) in the normal direction;
and 7, fitting a plane equation of the mapping point cloud of the lower camera (7), and obtaining the average distance from the point cloud of the upper camera (1) to the plane equation of the lower camera (7), namely the thickness.
2. A method for measuring the thickness of a warped plate-like object based on area array structured light according to claim 1, wherein the object (3) to be measured is a warped plate-like object.
3. A method for measuring the thickness of a warped plate-like object based on area array structured light as claimed in claim 1, wherein said optical glass (4) is an optical glass having a uniform refractive index throughout.
4. A method for measuring the thickness of a warped plate-like object based on area array structured light as claimed in claim 1, wherein said upper camera (1) and said lower camera (7) are area array structured light cameras.
5. A method for measuring the thickness of a warped plate-like object based on area array structured light as claimed in claim 1, characterized in that the number of standard calibration balls (8) is 1-12.
6. A method for measuring the thickness of a warped plate-like object based on area array structured light as claimed in claim 5, characterized in that the number of standard calibration balls (8) is 9.
CN202210036199.8A 2022-01-13 2022-01-13 Method for measuring thickness of warping plate-shaped object based on area array structured light Pending CN116481442A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210036199.8A CN116481442A (en) 2022-01-13 2022-01-13 Method for measuring thickness of warping plate-shaped object based on area array structured light

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210036199.8A CN116481442A (en) 2022-01-13 2022-01-13 Method for measuring thickness of warping plate-shaped object based on area array structured light

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118009915A (en) * 2024-04-10 2024-05-10 南京派光智慧感知信息技术有限公司 Calibration and verification method for tunnel surrounding rock deformation measurement equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118009915A (en) * 2024-04-10 2024-05-10 南京派光智慧感知信息技术有限公司 Calibration and verification method for tunnel surrounding rock deformation measurement equipment
CN118009915B (en) * 2024-04-10 2024-06-04 南京派光智慧感知信息技术有限公司 Calibration and verification method for tunnel surrounding rock deformation measurement equipment

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